SN74LVC1G386 www.ti.com SCES439E–APRIL2003–REVISEDDECEMBER2013 Single 3-Input Positive-XOR Gate CheckforSamples:SN74LVC1G386 FEATURES DESCRIPTION 1 • AvailableintheTexasInstruments The SN74LVC1G386 device performs the Boolean 2 functionY=A ×B ×Cinpositivelogic. NanoStar™andNanoFree™ Packages NanoStar™ and NanoFree™ package technology is • Supports5-VV Operation a major breakthrough in IC packaging concepts, CC usingthedieasthepackage. • InputsAcceptVoltagesto5.5V • SupportsDownTranslationtoV This device is fully specified for partial-power-down CC applications using I . The I circuitry disables the • I SupportsLiveInsertion,Partial-Power- off off off outputs, preventing damaging current backflow DownMode,Back-DriveProtection throughthedevicewhenitispowereddown. • Latch-UpPerformanceExceeds100mA PerJESD78,ClassII • ESDProtectionExceedsJESD22 – 2000-VHuman-BodyModel(A114-A) – 200-VMachineModel(A115-A) – 1000-VCharged-DeviceModel(C101) DBV PACKAGE DCK PACKAGE YZPPACKAGE (TOPVIEW) (TOPVIEW) (BOTTOM VIEW) A 1 6 C B 34 Y A 1 6 C GND 25 VCC GND 2 5 V CC A 16 C GND 2 5 V CC B 3 4 Y B 3 4 Y DRYPACKAGE DSF PACKAGE (TOPVIEW) (TOPVIEW) A 1 6 C A 1 6 C GND 2 5 VCC GNDB 32 45 VYCC B 3 4 Y See mechanical drawings for dimensions. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. NanoStar,NanoFreearetrademarksofTexasInstruments. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2003–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74LVC1G386 SCES439E–APRIL2003–REVISEDDECEMBER2013 www.ti.com Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. FunctionTable INPUTS OUTPUT A B C Y L L L L L L H H L H L H L H H L H L L H H L H L H H L L H H H H LogicDiagram(PositiveLogic) A B Y C Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 6.5 V O V Voltagerangeappliedtoanyoutputinthehighorlowstate(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±50 mA O ContinuouscurrentthroughV orGND ±100 mA CC DBVpackage 165 θ Packagethermalimpedance(4) DCKpackage 259 °C/W JA YEPorYZPpackage 123 T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThevalueofV isprovidedintherecommendedoperatingconditionstable. CC (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 2 SubmitDocumentationFeedback Copyright©2003–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 www.ti.com SCES439E–APRIL2003–REVISEDDECEMBER2013 Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 5.5 V Supplyvoltage V CC Dataretentiononly 1.5 V =1.65Vto1.95V 0.65×V CC CC V =2.3Vto2.7V 1.7 CC V High-levelinputvoltage V IH V =3Vto3.6V 2 CC V =4.5Vto5.5V 0.7×V CC CC V =1.65Vto1.95V 0.35×V CC CC V =2.3Vto2.7V 0.7 CC V Low-levelinputvoltage V IL V =3Vto3.6V 0.8 CC V =4.5Vto5.5V 0.3×V CC CC V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC V =1.65V –4 CC V =2.3V –8 CC I High-leveloutputcurrent –16 mA OH V =3V CC –24 V =4.5V –32 CC V =1.65V 4 CC V =2.3V 8 CC I Low-leveloutputcurrent 16 mA OL V =3V CC 24 V =4.5V 32 CC V =1.8V±0.15V,2.5V±0.2V 20 CC Δt/Δv Inputtransitionriseorfallrate V =3.3V±0.3V 10 ns/V CC V =5V±0.5V 5 CC T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. Copyright©2003–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 SCES439E–APRIL2003–REVISEDDECEMBER2013 www.ti.com Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) –40°Cto85°C –40°Cto125°C PARAMETER TESTCONDITIONS VCC MIN TYP(1) MAX MIN TYP(1) MAX UNIT 1.65Vto IOH=–100µA 5.5V VCC–0.1 VCC–0.1 IOH=–4mA 1.65V 1.2 1.2 VOH IOH=–8mA 2.3V 1.9 1.9 V IOH=–16mA 2.4 2.4 3V IOH=–24mA 2.3 2.3 IOH=–32mA 4.5V 3.8 3.8 1.65Vto IOL=100µA 5.5V 0.1 0.1 IOL=4mA 1.65V 0.45 0.45 VOL IOL=8mA 2.3V 0.3 0.3 V IOL=16mA 0.4 0.4 3V IOL=24mA 0.55 0.55 IOL=32mA 4.5V 0.55 0.55 II Allinputs VI=5.5VorGND 0to5.5V ±5 ±5 µA Ioff VIorVO=5.5V 0 ±10 ±10 µA 1.65Vto ICC VI=5.5VorGND,IO=0 5.5V 10 10 µA ΔICC OOntheerinipnuptuatstaVtCVCCC–o0r.6GNVD, 3Vto5.5V 500 500 µA Ci VI=VCCorGND 3.3V 3.5 pF (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A 4 SubmitDocumentationFeedback Copyright©2003–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 www.ti.com SCES439E–APRIL2003–REVISEDDECEMBER2013 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =15pF(unlessotherwisenoted)(seeFigure1) L –40°Cto85°C PARAMETER FROM TO VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd A,B,orC Y 3 9.4 1.3 5 0.8 4.5 0.5 3.5 ns Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =30pFor50pF(unlessotherwisenoted)(seeFigure2) L –40°Cto85°C PARAMETER FROM TO VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd A,B,orC Y 3.5 12 1.8 5.5 1.3 5 1 4 ns Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =30pFor50pF(unlessotherwisenoted)(seeFigure2) L –40°Cto125°C PARAMETER FROM TO VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd A,B,orC Y 3.5 14.8 1.8 7.2 1.3 6.4 1 5.1 ns Operating Characteristics T =25°C A V =1.8V V =2.5V V =3.3V V =5V CC CC CC CC PARAMETER TESTCONDITIONS UNIT TYP TYP TYP TYP C Powerdissipationcapacitance f=10MHz 17.5 18 19 22 pF pd Copyright©2003–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 SCES439E–APRIL2003–REVISEDDECEMBER2013 www.ti.com Parameter Measurement Information V LOAD R S1 Open From Output L TEST S1 UnderTest GND t (see Notes E and F) V C PZL LOAD (see Note A)L RL tPLZ(see Notes E and G) VLOAD t /t V PHZ PZH LOAD LOAD CIRCUIT INPUTS V V V C R V CC V t/t M LOAD L L ∆ I r f 1.8V±0.15V V ≤2 ns V /2 2 ×V 15 pF 1 MΩ 0.15V CC CC CC 2.5V±0.2V V ≤2 ns V /2 2 ×V 15 pF 1 MΩ 0.15V CC CC CC 3.3V±0.3V 3V ≤2.5 ns 1.5V 6V 15 pF 1 MΩ 0.3V 5V±0.5V V ≤2.5 ns V /2 2 ×V 15 pF 1 MΩ 0.3V CC CC CC V I Timing Input V M 0V t W VI tsu th V Input V V I M M Data Input V V M M 0V 0V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSE DURATION SETUP AND HOLDTIMES Input VM VM VI COounttpruotl VM VM VI 0V 0V t t t t PLH PHL PZL PLZ V Output V /2 Output VM VM OH WaSv1e afotrVm 1 VM V +V LOAD VOL (see NoteL OBAD) OL ∆ VOL t t PHL PLH t t PZH PHZ Output VM VM VVOOHL (WseSae1v eNaOftoo uGtretmpN Bu D2t) VM VOH–V∆ ≈V0OHV VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATION DELAYTIMES ENABLE AND DISABLETIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators have the following characteristics:PRR≤10 MHz, Z = 50Ω. O D. The outputs are measured one at a time, with one transition per measurement. E. Because this device has open-drain outputs, t and t are the same as t . PLZ PZL PD F. t is measured atV . PZL M G.t is measured atV +V. PLZ OL ∆ H. All parameters and waveforms are not applicable to all devices. Figure1. LoadCircuitandVoltageWaveforms 6 SubmitDocumentationFeedback Copyright©2003–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 www.ti.com SCES439E–APRIL2003–REVISEDDECEMBER2013 Parameter Measurement Information V LOAD R S1 Open From Output L TEST S1 Under Test GND t /t Open C PLH PHL (see NoteA)L RL tPLZ/tPZL VLOAD t /t GND PHZ PZH LOAD CIRCUIT INPUTS V V V C R V CC V t/t M LOAD L L D I r f 1.8 V±0.15 V V £2 ns V /2 2 ×V 30 pF 1 kW 0.15 V CC CC CC 2.5 V±0.2 V V £2 ns V /2 2 ×V 30 pF 500W 0.15 V CC CC CC 3.3 V±0.3 V 3 V £2.5 ns 1.5 V 6 V 50 pF 500W 0.3 V 5 V±0.5 V V £2.5 ns V /2 2 ×V 50 pF 500W 0.3 V CC CC CC V I Timing Input V M 0 V t W VI tsu th V Input V V I M M Data Input V V M M 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUPAND HOLD TIMES Input VM VM VI COounttpruotl VM VM VI 0 V 0 V t t t t PLH PHL PZL PLZ V Output V /2 Output VM VM OH WSav1e afot rVm 1 VM V + V LOAD VOL (see NoteL OBAD) OL D VOL t t PHL PLH t t PZH PHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH–VD VOH VOL (see Note B) »0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR£10 MHz, Z = 50W. O D. The outputs are measured one at a time, with one transition per measurement. E. t and t are the same as t . PLZ PHZ dis F. t and t are the same as t . PZL PZH en G.t and t are the same as t . PLH PHL pd H. All parameters and waveforms are not applicable to all devices. Figure2. LoadCircuitandVoltageWaveforms Copyright©2003–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74LVC1G386

SN74LVC1G386 SCES439E–APRIL2003–REVISEDDECEMBER2013 www.ti.com REVISION HISTORY ChangesfromRevisionD(July2006)toRevisionE Page • UpdateddocumenttonewTIdatasheetformat. ................................................................................................................. 1 • UpdatedFeatures. ................................................................................................................................................................ 1 • AddedESDwarning. ............................................................................................................................................................ 2 • Updatedoperatingtemperaturerange.................................................................................................................................. 3 8 SubmitDocumentationFeedback Copyright©2003–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G386

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74LVC1G386DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C8R & no Sb/Br) SN74LVC1G386DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 CC6R & no Sb/Br) SN74LVC1G386DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C8J, C8R) & no Sb/Br) SN74LVC1G386DRYR ACTIVE SON DRY 6 5000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C8 & no Sb/Br) SN74LVC1G386DSFR ACTIVE SON DSF 6 5000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C8 & no Sb/Br) SN74LVC1G386YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 C8N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 21-Feb-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) 74LVC1G386DCKRG4 SC70 DCK 6 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 SN74LVC1G386DBVR SOT-23 DBV 6 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G386DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74LVC1G386DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1 SN74LVC1G386DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 SN74LVC1G386YZPR DSBGA YZP 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 21-Feb-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) 74LVC1G386DCKRG4 SC70 DCK 6 3000 183.0 183.0 20.0 SN74LVC1G386DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0 SN74LVC1G386DCKR SC70 DCK 6 3000 180.0 180.0 18.0 SN74LVC1G386DRYR SON DRY 6 5000 184.0 184.0 19.0 SN74LVC1G386DSFR SON DSF 6 5000 184.0 184.0 19.0 SN74LVC1G386YZPR DSBGA YZP 6 3000 220.0 220.0 35.0 PackMaterials-Page2

GENERIC PACKAGE VIEW DRY 6 USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4207181/G

PACKAGE OUTLINE DRY0006A USON - 0.6 mm max height SCALE 8.500 PLASTIC SMALL OUTLINE - NO LEAD B 1.05 A 0.95 PIN 1 INDEX AREA 1.5 1.4 0.6 MAX C SEATING PLANE 0.05 0.00 0.08 C 3X 0.6 SYMM (0.127) TYP (0.05) TYP 3 4 4X 0.5 SYMM 2X 1 6 1 0.25 6X 0.15 0.4 0.3 0.1 C A B 0.05 C PIN 1 ID (OPTIONAL) 0.35 5X 0.25 4222894/A 01/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) LAND PATTERN EXAMPLE 1:1 RATIO WITH PKG SOLDER PADS EXPOSED METAL SHOWN SCALE:40X 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND EXPOSED EXPOSED METAL METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS 4222894/A 01/2018 NOTES: (continued) 3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) SOLDER PASTE EXAMPLE BASED ON 0.075 - 0.1 mm THICK STENCIL SCALE:40X 4222894/A 01/2018 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE YZP0006 DSBGA - 0.5 mm max height SCALE 9.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D 0.5 MAX C SEATING PLANE 0.19 BALL TYP 0.05 C 0.15 0.5 TYP C SYMM 1 D: Max = 1.418 mm, Min =1 .358 mm B TYP 0.5 E: Max = 0.918 mm, Min =0 .858 mm TYP A 0.25 1 2 6X 0.21 SYMM 0.015 C A B 4219524/A 06/2014 NOTES: NanoFree Is a trademark of Texas Instruments. 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. NanoFreeTM package configuration. www.ti.com

EXAMPLE BOARD LAYOUT YZP0006 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 6X ( 0.225) 1 2 A (0.5) TYP B SYMM C SYMM LAND PATTERN EXAMPLE SCALE:40X ( 0.225) 0.05 MAX 0.05 MIN METAL METAL UNDER MASK SOLDER MASK ( 0.225) OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219524/A 06/2014 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). www.ti.com

EXAMPLE STENCIL DESIGN YZP0006 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 6X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM METAL TYP C SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4219524/A 06/2014 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

PACKAGE OUTLINE DSF0006A X2SON - 0.4 mm max height SCALE 10.000 PLASTIC SMALL OUTLINE - NO LEAD 1.05 B A 0.95 PIN 1 INDEX AREA 1.05 0.95 0.4 MAX C SEATING PLANE 0.05 C (0.11) TYP SYMM 0.05 0.00 3 4 2X SYMM 0.7 4X 0.35 6 1 0.22 6X 0.12 (0.1) PIN 1 ID 0.45 0.07 C B A 6X 0.35 0.05 C 4220597/A 06/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MO-287, variation X2AAF. www.ti.com

EXAMPLE BOARD LAYOUT DSF0006A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.6) (R0.05) TYP 1 6X (0.17) 6 SYMM 4X (0.35) 4 3 SYMM (0.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:40X 0.07 MIN 0.07 MAX EXPOSED METAL ALL AROUND ALL AROUND EXPOSED METAL SOLDER MASK SOLDER MASK METAL METAL UNDER OPENING OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220597/A 06/2017 NOTES: (continued) 4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DSF0006A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.6) (R0.05) TYP 1 6X (0.17) 6 SYMM 4X (0.35) 4 3 SYMM (0.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:40X 4220597/A 06/2017 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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