Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 SN74LVC16244A 16-Bit Buffer/Driver With 3-State Outputs 1 Features 2 Applications • MemberoftheTexasInstruments • Servers 1 Widebus™Family • PCsandNotebooks • OperatesFrom1.65Vto3.6V • NetworkSwitches • InputsAcceptVoltagesto5.5V • WirelessandTelecomInfrastructures • Maxtpdof4.1nsat3.3V • TVSet-topBoxes • TypicalVOLP (OutputGroundBounce) • ElectronicPointsofSale <0.8VatV =3.3V,T =25°C CC A • TypicalV (OutputV Undershoot) 3 Description OHV OH >2VatV =3.3V,T =25°C This 16-bit buffer/driver is designed for 1.65-V to CC A • IoffSupportsLiveInsertion,Partial-Power-Down 3.6-V VCC operation. The SN74LVC16244A device can be used as four 4-bit buffers, two 8-bit buffers, or Mode,andBack-DriveProtection one16-bitbuffer. • SupportsMixed-ModeSignalOperationonAll Ports(5-VInput/OutputVoltageWith DeviceInformation(1) 3.3-VV ) CC PARTNUMBER PACKAGE BODYSIZE(NOM) • Latch-UpPerformanceExceeds250mAPer TSSOP(48) 12.50mm×6.10mm JESD17 SN74LVC16244A TVSOP(48) 9.70mm×4.40mm • ESDProtectionExceedsJESD22 SSOP(48) 15.88mm×7.49mm – 2000-VHuman-BodyModel(A114-A) (1) For all available packages, see the orderable addendum at – 1000-VCharged-DeviceModel(C101) theendofthedatasheet. 4 Simplified Schematic 1 25 1OE 3OE 47 2 36 13 1A1 1Y1 3A1 3Y1 46 3 35 14 1A2 1Y2 3A2 3Y2 44 5 33 16 1A3 1Y3 3A3 3Y3 43 6 32 17 1A4 1Y4 3A4 3Y4 48 24 2OE 4OE 41 8 30 19 2A1 2Y1 4A1 4Y1 40 9 29 20 2A2 2Y2 4A2 4Y2 38 11 27 22 2A3 2Y3 4A3 4Y3 37 12 26 23 2A4 2Y4 4A4 4Y4 Pin numbers shown are for the DGG, DGV, and DL packages. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9 DetailedDescription............................................ 11 2 Applications........................................................... 1 9.1 Overview.................................................................11 3 Description............................................................. 1 9.2 FunctionalBlockDiagram.......................................11 4 SimplifiedSchematic............................................. 1 9.3 FeatureDescription.................................................11 9.4 DeviceFunctionalModes........................................11 5 RevisionHistory..................................................... 2 10 ApplicationandImplementation........................ 12 6 PinConfigurationandFunctions......................... 3 10.1 ApplicationInformation..........................................12 7 Specifications......................................................... 6 10.2 TypicalApplication ...............................................12 7.1 AbsoluteMaximumRatings .....................................6 11 PowerSupplyRecommendations..................... 13 7.2 HandlingRatings.......................................................6 12 Layout................................................................... 13 7.3 RecommendedOperatingConditions......................7 7.4 ThermalInformation..................................................7 12.1 LayoutGuidelines.................................................13 7.5 ElectricalCharacteristics—DCLimitChanges.........8 12.2 LayoutExample....................................................13 7.6 SwitchingCharacteristics,–40°Cto85°C.................9 13 DeviceandDocumentationSupport................. 14 7.7 SwitchingCharacteristics,–40°Cto125°C...............9 13.1 Trademarks...........................................................14 7.8 OperatingCharacteristics..........................................9 13.2 ElectrostaticDischargeCaution............................14 7.9 TypicalCharacteristics..............................................9 13.3 Glossary................................................................14 8 ParameterMeasurementInformation................10 14 Mechanical,Packaging,andOrderable Information........................................................... 14 5 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionB(April2009)toRevisionC Page • UpdateddocumenttonewTIdatasheetformat.................................................................................................................... 1 • DeletedOrderingInformationtable........................................................................................................................................ 1 • UpdatedI Featurebullet...................................................................................................................................................... 1 off • AddedApplications................................................................................................................................................................. 1 • AddedDeviceInformationtable............................................................................................................................................. 1 • AddedHandlingRatingstable................................................................................................................................................ 6 • ChangedMAXoperatingfree-airtemperaturefrom85°Cto125°C....................................................................................... 7 • AddedThermalInformationtable........................................................................................................................................... 7 • Added–40°CTO125°CtemperaturerangetoElectricalCharacteristicstable..................................................................... 8 • AddedSwitchingCharacteristicstablefor–40°CTO125°Ctemperaturerange................................................................... 9 • AddedTypicalCharacteristics................................................................................................................................................ 9 2 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 6 Pin Configuration and Functions DGG, DGV, OR DL PACKAGE (TOP VIEW) 1OE 1 48 2OE 1Y1 2 47 1A1 1Y2 3 46 1A2 GND 4 45 GND 1Y3 5 44 1A3 1Y4 6 43 1A4 V 7 42 V CC CC 2Y1 8 41 2A1 2Y2 9 40 2A2 GND 10 39 GND 2Y3 11 38 2A3 2Y4 12 37 2A4 3Y1 13 36 3A1 3Y2 14 35 3A2 GND 15 34 GND 3Y3 16 33 3A3 3Y4 17 32 3A4 VCC 18 31 VCC 4Y1 19 30 4A1 4Y2 20 29 4A2 GND 21 28 GND 4Y3 22 27 4A3 4Y4 23 26 4A4 4OE 24 25 3OE PinFunctions PIN I/O DESCRIPTION NO. NAME 1 1OE I Outputenable1 2 1Y1 O 1Y1Output 3 1Y2 O 1Y2Output 4 GND — Groundpin 5 1Y3 O 1Y3Output 6 1Y4 O 1Y4Output 7 VCC — Powerpin 8 2Y1 O 2Y1Output 9 2Y2 O 2Y2Output 10 GND — Groundpin 11 2Y3 O 2Y3Output 12 2Y4 O 2Y4Output 13 3Y1 O 3Y1Output 14 3Y2 O 3Y2Output 15 GND — Groundpin 16 3Y3 O 3Y3Output 17 3Y4 O 3Y4Output 18 VCC — Powerpin Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com PinFunctions(continued) PIN I/O DESCRIPTION NO. NAME 19 4Y1 O 4Y1Output 20 4Y2 O 4Y2Output 21 GND — Groundpin 22 4Y3 O 4Y3Output 23 4Y4 O 4Y4Output 24 4OE I Outputenable4 25 3OE I Outputenable3 26 4A4 I 4A4Input 27 4A3 I 4A3Input 28 GND — Groundpin 29 4A2 I 4A2Input 30 4A1 I 4A1Input 31 VCC — Powerpin 32 3A4 I 3A4Input 33 3A3 I 3A3Input 34 GND — Groundpin 35 3A2 I 3A2Input 36 3A1 I 3A1Input 37 2A4 I 2A4Input 38 2A3 I 2A3Input 39 GND — Groundpin 40 2A2 I 2A2Input 41 2A1 I 2A1Input 42 VCC — Powerpin 43 1A4 I 1A4Input 44 1A3 I 1A3Input 45 GND — Groundpin 46 1A2 I 1A2Input 47 1A1 I 1A1Input 48 2OE I Outputenable2 4 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K Table1.PinAssignments(1) (56-BallGQLorZQLPackage) 1 2 3 4 5 6 A 1OE NC NC NC NC 2OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 V V 1A3 1A4 CC CC D 2Y2 2Y1 GND GND 2A1 2A2 E 2Y4 2Y3 2A3 2A4 F 3Y1 3Y2 3A2 3A1 G 3Y3 3Y4 GND GND 3A4 3A3 H 4Y1 4Y2 V V 4A2 4A1 CC CC J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE (1) NC–Nointernalconnection GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J Table2.PinAssignments(1) (54-BallGRDorZRDPackage) 1 2 3 4 5 6 A 1Y1 NC 1OE 2OE NC 1A1 B 1Y3 1Y2 NC NC 1A2 1A3 C 2Y1 1Y4 V V 1A4 2A1 CC CC D 2Y3 2Y2 GND GND 2A2 2A3 E 3Y1 2Y4 GND GND 2A4 3A1 F 3Y3 3Y2 GND GND 3A2 3A3 G 4Y1 3Y4 V V 3A4 4A1 CC CC H 4Y3 4Y2 NC NC 4A2 4A3 J 4Y4 NC 4OE 3OE NC 4A4 (1) NC–Nointernalconnection Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 6.5 V O V Voltagerangeappliedtoanyoutputinthehighorlowstate(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±50 mA O ContinuouscurrentthrougheachV orGND ±100 mA CC (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThevalueofV isprovidedintheRecommendedOperatingConditionstable. CC 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –65 150 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all pins(1) 0 2000 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecification JESD22-C101,allpins(2) 0 1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT Operating 1.65 3.6 V Supplyvoltage V CC Dataretentiononly 1.5 V =1.65Vto1.95V 0.65×V CC CC V High-levelinputvoltage V =2.3Vto2.7V 1.7 V IH CC V =2.7Vto3.6V 2 CC V =1.65Vto1.95V 0.35×V CC CC V Low-levelinputvoltage V =2.3Vto2.7V 0.7 V IL CC V =2.7Vto3.6V 0.8 CC V Inputvoltage 0 5.5 V I Highorlowstate 0 V CC V Outputvoltage V O 3-state 0 5.5 V =1.65V –4 CC V =2.3V –8 CC I High-leveloutputcurrent mA OH V =2.7V –12 CC V =3V –24 CC V =1.65V 4 CC V =2.3V 8 CC I Low-leveloutputcurrent mA OL V =2.7V 12 CC V =3V 24 CC Δt/Δv Inputtransitionriseorfallrate 10 ns/V T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 7.4 Thermal Information DGG DGV DL THERMALMETRIC(1) UNIT 48PINS 48PINS 48PINS R Junction-to-ambientthermalresistance 64.3 78.4 68.4 θJA R Junction-to-case(top)thermalresistance 17.6 30.7 34.7 θJC(top) R Junction-to-boardthermalresistance 31.5 41.8 41.0 θJB °C/W ψ Junction-to-topcharacterizationparameter 1.1 3.8 12.3 JT ψ Junction-to-boardcharacterizationparameter 31.2 41.3 40.4 JB R Junction-to-case(bottom)thermalresistance n/a n/a n/a θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com 7.5 Electrical Characteristics—DC Limit Changes overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) –40°CTO85°C –40°CTO125°C PARAMETER TESTCONDITIONS V UNIT CC MIN TYP(1) MAX MIN TYP(1) MAX 1.65Vto I =–100μA V –0.2 V –0.2 OH 3.6V CC CC I =–4mA 1.65V 1.2 1.2 OH VOH IOH=–8mA 2.3V 1.7 1.7 V 2.7V 2.2 2.2 I =–12mA OH 3V 2.4 2.4 I =–24mA 3V 2.2 2.2 OH 1.65Vto I =100μA 0.2 0.2 OL 3.6V I =4mA 1.65V 0.45 0.45 OL V V OL I =8mA 2.3V 0.7 0.7 OL I =12mA 2.7V 0.4 0.4 OL I =24mA 3V 0.55 0.55 OL I V =0to5.5V 3.6V ±5 ±5 μA I I I V orV =5.5V 0 ±10 ±20 μA off I O I V =0to5.5V 3.6V ±10 ±10 μA OZ O V =V orGND 20 20 I CC I I =0 3.6V μA CC 3.6V≤V ≤5.5V(2) O 20 20 I OneinputatV –0.6V, 2.7Vto ΔI CC 500 500 μA CC OtherinputsatV orGND 3.6V CC C V =V orGND 3.3V 5.5 pF i I CC C V =V orGND 3.3V 6 pF o O CC (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A (2) Thisappliesinthedisabledstateonly. 8 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 7.6 Switching Characteristics, –40°C to 85°C overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure3) –40°CTO85°C FROM TO V =1.8V V =2.5V V =3.3V PARAMETER CC CC V =2.7V CC UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V CC ±0.3V MIN MAX MIN MAX MIN MAX MIN MAX t A Y 1.5 6.6 1 3.9 1 4.7 1.1 4.1 ns pd t OE Y 1.5 7.5 1 4.7 1 5.8 1.0 4.6 ns en t OE Y 1.5 10.3 1 5.3 1 6.2 1.8 5.8 ns dis t 1 ns sk(o) 7.7 Switching Characteristics, –40°C to 125°C overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure3) –40°CTO125°C FROM TO V =1.8V V =2.5V V =3.3V PARAMETER CC CC V =2.7V CC UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V CC ±0.3V MIN MAX MIN MAX MIN MAX MIN MAX t A Y 1.5 7.1 1 4.4 1 5.2 1.1 4.6 ns pd t OE Y 1.5 8.0 1 6.0 1 6.3 1.0 5.1 ns en t OE Y 1.5 10.8 1 5.7 1 6.7 1.8 6.3 ns dis t 1.5 ns sk(o) 7.8 Operating Characteristics T =25°C A TEST VCC=1.8V VCC=2.5V VCC=3.3V PARAMETER UNIT CONDITIONS TYP TYP TYP Powerdissipationcapacitance Outputsenabled 33 35 39 C f=10MHz pF pd perbuffer/driver Outputsdisabled 2 3 4 7.9 Typical Characteristics 4 4 TPD in ns 3.5 3.5 3 3 2.5 2.5 s s n n D - 2 D - 2 P P T T 1.5 1.5 1 1 0.5 0.5 TPD in ns 0 0 0 1 2 3 4 -100 -50 0 50 100 150 VCC - V D001 Temperature (qC) D002 Figure1.TPDAcrossV at25°C Figure2.TPDAcrossTemperatureat3.3V CC Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com 8 Parameter Measurement Information VLOAD From Output RL S1 Open TEST S1 Under Test GND tPLH/tPHL Open (see Note CAL) RL tPLZ/tPZL VLOAD tPHZ/tPZH GND LOAD CIRCUIT INPUTS VCC VI tr/tf VM VLOAD CL RL VD 1.8 V ± 0.15 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V 2.7 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V 3.3 V ± 0.3 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V VI Timing Input VM 0 V tw VI tsu th VI Input VM VM Data Input VM VM 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES VI VI Output Input VM VM Control VM VM 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 VLOAD/2 Output VM VM VOL (Ss1e ea tN VoLteO ABD) VM VOL + VD VOL tPHL tPLH tPZH tPHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH − VD VOH VOL (see Note B) ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure3. LoadCircuitandVoltageWaveforms 10 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 9 Detailed Description 9.1 Overview This 16-bit buffer/driver is designed for 1.65-V to 3.6-V V operation. The SN74LVC16244A device is designed CC specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus- oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.Itprovidestrueoutputsandsymmetricalactive-lowoutput-enable(OE)inputs. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in amixed3.3-V/5-Vsystemenvironment. 9.2 Functional Block Diagram 1 25 1OE 3OE 47 2 36 13 1A1 1Y1 3A1 3Y1 46 3 35 14 1A2 1Y2 3A2 3Y2 44 5 33 16 1A3 1Y3 3A3 3Y3 43 6 32 17 1A4 1Y4 3A4 3Y4 48 24 2OE 4OE 41 8 30 19 2A1 2Y1 4A1 4Y1 40 9 29 20 2A2 2Y2 4A2 4Y2 38 11 27 22 2A3 2Y3 4A3 4Y3 37 12 26 23 2A4 2Y4 4A4 4Y4 Pin numbers shown are for the DGG, DGV, and DL packages. 9.3 Feature Description • Wideoperatingvoltagerange – Operatesfrom1.65Vto3.6V • Allowsdownvoltagetranslation – Inputsacceptvoltagesto5.5V • I feature off – AllowsvoltagesontheinputsandoutputswhenV is0V CC 9.4 Device Functional Modes Table3.FunctionTable (Each4-bitBuffer) INPUTS OUTPUT OE A Y L H H L L L H X Z Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com 10 Application and Implementation 10.1 Application Information The SN74LVC16244A device is a 16-bit buffer/driver. This device can be used as four 4-bit, two 8-bit, or one 16- bit buffer. It allows data transmission from the A bus to the Y bus with 4 separate enable pins that control 4 bits each. The output-enable (OE) input can be used to disable sections of the device so that the buses are effectively isolated. The device has 5.5 V tolerant inputs at any valid V which allows it to be used in multi- CC powersystemsandcanbeusedfordowntranslation. 10.2 Typical Application Regulated 3.6 V OE Vcc 1A1 1Y1 uC System Logic uC or 1A4 1Y4 LEDs System Logic GND Figure4. TypicalApplicationDiagram 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloads;therefore,routingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. RecommendedInputConditions – Risetimeandfalltimespecs:See(Δt/ΔV)intheRecommendedOperatingConditionstable. – Specifiedhighandlowlevels:See(V andV )intheRecommendedOperatingConditions table. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV . CC 2. RecommendOutputConditions – Loadcurrentsshouldnotexceed25mAperoutputand50mAtotalforthepart. – OutputsshouldnotbepulledaboveV . CC 12 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

SN74LVC16244A www.ti.com SCAS699C–AUGUST2003–REVISEDJUNE2014 Typical Application (continued) 10.2.3 ApplicationCurves 300 250 200 A m - C 150 C I 100 50 ICC 1.8 V ICC 2.5 V ICC 3.3 V 0 0 10 20 30 40 50 60 Frequency - MHz D003 Figure5.I vsFrequency CC 11 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the RecommendedOperatingConditionstable. Each V pin should have a good bypass capacitor to prevent power disturbance. For devices with a single CC supply, 0.1 μf is recommended; if there are multiple V pins, then 0.01 μf or 0.022 μf is recommended for each CC power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and a 1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 12 Layout 12.1 Layout Guidelines Whenusingmultiple-bitlogicdevices,inputsshouldneverfloat. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Figure 6 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V , whichever makes more sense or is more convenient. It is generally acceptable to float outputs, CC unlessthepartisatransceiver.Ifthetransceiverhasanoutputenablepin,itwilldisabletheoutputsectionofthe partwhenasserted.ThiswillnotdisabletheinputsectionoftheI/Os,sotheycannotfloatwhendisabled. 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure6. LayoutDiagram Copyright©2003–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN74LVC16244A

SN74LVC16244A SCAS699C–AUGUST2003–REVISEDJUNE2014 www.ti.com 13 Device and Documentation Support 13.1 Trademarks WidebusisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 13.2 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.3 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronymsanddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 14 SubmitDocumentationFeedback Copyright©2003–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC16244A

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74LVC16244ADGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244ADGG ACTIVE TSSOP DGG 48 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244ADGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LD244A & no Sb/Br) SN74LVC16244ADL ACTIVE SSOP DL 48 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244ADLR ACTIVE SSOP DL 48 1000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC16244A & no Sb/Br) SN74LVC16244AZQLR ACTIVE BGA ZQL 56 1000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 LD244A MICROSTAR & no Sb/Br) JUNIOR SN74LVC16244AZRDR ACTIVE BGA ZRD 54 1000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 LD244A MICROSTAR & no Sb/Br) JUNIOR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC16244A : •Automotive: SN74LVC16244A-Q1 •Enhanced Product: SN74LVC16244A-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC16244ADGGR TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 SN74LVC16244ADGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 SN74LVC16244ADLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 SN74LVC16244AZQLR BGAMI ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 CROSTA RJUNI OR SN74LVC16244AZRDR BGAMI ZRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 CROSTA RJUNI OR PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC16244ADGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74LVC16244ADGVR TVSOP DGV 48 2000 367.0 367.0 38.0 SN74LVC16244ADLR SSOP DL 48 1000 367.0 367.0 55.0 SN74LVC16244AZQLR BGAMICROSTAR ZQL 56 1000 350.0 350.0 43.0 JUNIOR SN74LVC16244AZRDR BGAMICROSTAR ZRD 54 1000 350.0 350.0 43.0 JUNIOR PackMaterials-Page2

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MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PACKAGE OUTLINE ZQL0056A JRBGA - 1 mm max height SCALE 2.100 PLASTIC BALL GRID ARRAY 4.6 B A 4.4 BALL A1 CORNER 7.1 6.9 1 MAX C SEATING PLANE 0.35 0.15 TYP BALL TYP 0.1 C 3.25 TYP SYMM (0.625) TYP K J (0.575) TYP H G 5.85 F SYMM TYP E D C 0.45 56X NOTE 3 0.35 B 0.15 C B A 0.08 C A 0.65 TYP 1 2 3 4 5 6 BALL A1 CORNER 0.65 TYP 4219711/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. No metal in this area, indicates orientation. www.ti.com

EXAMPLE BOARD LAYOUT ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 56X ( 0.33) 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK 0.05 MAX 0.05 MIN METAL UNDER OPENING SOLDER MASK EXPOSED METAL ( 0.33) ( 0.33) METAL EXPOSED METAL SOLDER MASK OPENING NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219711/B 01/2017 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com

EXAMPLE STENCIL DESIGN ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY 56X ( 0.33) (0.65) TYP 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4219711/B 01/2017 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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