SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O–MARCH1994–REVISEDFEBRUARY2005 FEATURES • Latch-UpPerformanceExceeds250mAPer • OperatesFrom1.65Vto3.6V JESD17 • InputsAcceptVoltagesto5.5V • ESDProtectionExceedsJESD22 • Maxt of6.2ns – 2000-VHuman-BodyModel(A114-A) pd • TypicalV (OutputGroundBounce) – 200-VMachineModel(A115-A) OLP <0.8VatV =3.3V,T =25(cid:176) C – 1000-VCharged-DeviceModel(C101) CC A • TypicalV (OutputV Undershoot) OHV OH >2VatV =3.3V,T =25(cid:176) C CC A D, DB, DGV, NS, OR PW PACKAGE RGY PACKAGE (TOP VIEW) (TOP VIEW) C 1G 1 16 VCC 1G VC 1A 2 15 2G 1 16 1B 3 14 2A 1A 2 15 2G 1Y0 4 13 2B 1B 3 14 2A 1Y1 5 12 2Y0 1Y0 4 13 2B 1Y2 6 11 2Y1 1Y1 5 12 2Y0 1Y3 7 10 2Y2 1Y2 6 11 2Y1 GND 8 9 2Y3 1Y3 7 10 2Y2 8 9 D 3 N Y G 2 DESCRIPTION/ORDERING INFORMATION Thisdual2-lineto4-linedecoder/demultiplexerisdesignedfor1.65-Vto3.6-VV operation. CC The device comprises two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. This decoder/demultiplexer features fully buffered inputs,eachofwhichrepresentsonlyonenormalizedloadtoitsdrivingcircuit. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in amixed3.3-V/5-Vsystemenvironment. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING A QFN–RGY Reelof1000 SN74LVC139ARGYR LC139A Tubeof40 SN74LVC139AD SOIC–D Reelof2500 SN74LVC139ADR LVC139A Reelof250 SN74LVC139ADT SOP–NS Reelof2000 SN74LVC139ANSR LVC139A SSOP–DB Reelof2000 SN74LVC139ADBR LC139A –40(cid:176) Cto85(cid:176) C Tubeof90 SN74LVC139APW TSSOP–PW Reelof2000 SN74LVC139APWR LC139A Reelof250 SN74LVC139APWT TVSOP–DGV Reelof2000 SN74LVC139ADGVR LC139A VFBGA–GQN SN74LVC139AGQNR Reelof1000 LC139A VFBGA–ZQN(Pb-free) SN74LVC139AZQNR (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1994–2005,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O–MARCH1994–REVISEDFEBRUARY2005 GQN OR ZQN PACKAGE TERMINALASSIGNMENTS (TOP VIEW) 1 2 3 4 1 2 3 4 A 1A 1G V 2G CC A B 1B NC(1) NC(1) 2A B C 1Y1 1Y0 2Y0 2B C D 1Y2 NC(1) NC(1) 2Y1 D E GND 1Y3 2Y3 2Y2 E (1) NC-Nointernalconnection FUNCTIONTABLE (EACHDECODER/DEMULTIPLEXER) INPUTS OUTPUTS SELECT G B A Y3 Y2 Y1 Y0 L L L H H H L L L H H H L H L H L H L H H L H H L H H H H X X H H H H LOGICDIAGRAM(POSITIVELOGIC) 4 1Y0 1 1G 5 1Y1 6 1Y2 2 1A Select 7 Inputs 3 1Y3 1B Data Outputs 12 2Y0 15 2G 11 2Y1 10 2Y2 14 2A Select 9 Inputs 13 2Y3 2B Pin numbers shown are for the D, DB, DGV, NS, PW, and RGY packages. 2

SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O–MARCH1994–REVISEDFEBRUARY2005 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Outputvoltagerange(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent – 50 mA O ContinuouscurrentthroughV orGND – 100 mA CC Dpackage(4) 73 DBpackage(4) 82 DGVpackage(4) 120 q Packagethermalimpedance GQN/ZQNpackage(4) 78 (cid:176) C/W JA NSpackage(4) 64 PWpackage(4) 108 RGYpackage(5) 39 T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputnegative-voltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThevalueofV isprovidedintherecommendedoperatingconditionstable. CC (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. (5) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-5. Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 3.6 V Supplyvoltage V CC Dataretentiononly 1.5 V =1.65Vto1.95V 0.65· V CC CC V High-levelinputvoltage V =2.3Vto2.7V 1.7 V IH CC V =2.7Vto3.6V 2 CC V =1.65Vto1.95V 0.35· V CC CC V Low-levelinputvoltage V =2.3Vto2.7V 0.7 V IL CC V =2.7Vto3.6V 0.8 CC V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC V =1.65V –4 CC V =2.3V –8 CC I High-leveloutputcurrent mA OH V =2.7V –12 CC V =3V –24 CC V =1.65V 4 CC V =2.3V 8 CC I Low-leveloutputcurrent mA OL V =2.7V 12 CC V =3V 24 CC D t/D v Inputtransitionriseorfallrate 10 ns/V T Operatingfree-airtemperature –40 85 (cid:176) C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 3

SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O–MARCH1994–REVISEDFEBRUARY2005 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC I =–100m A 1.65Vto3.6V V –0.2 OH CC I =–4mA 1.65V 1.2 OH I =–8mA 2.3V 1.7 OH V V OH 2.7V 2.2 I =–12mA OH 3V 2.4 I =–24mA 3V 2.2 OH I =100m A 1.65Vto3.6V 0.2 OL I =4mA 1.65V 0.45 OL V I =8mA 2.3V 0.7 V OL OL I =12mA 2.7V 0.4 OL I =24mA 3V 0.55 OL I Allinputs V =5.5VorGND 3.6V – 5 m A I I I V =V orGND, I =0 3.6V 10 m A CC I CC O D I OneinputatV –0.6V, OtherinputsatV orGND 2.7Vto3.6V 500 m A CC CC CC C V =V orGND 3.3V 5 pF i I CC (1) AlltypicalvaluesareatV =3.3V,T =25(cid:176) C. CC A Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) V =1.8V V =2.5V V =3.3V PARAMETER FROM TO C– C0.15V C–C0.2V VCC=2.7V C–C0.3V UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX AorB 1 20.6 1 9.3 1 7.3 1 6.2 t Y ns pd G 1 19.5 1 7.2 1 5.2 1 4.7 t 1 ns sk(o) Operating Characteristics T =25(cid:176) C A TEST VCC=1.8V VCC=2.5V VCC=3.3V PARAMETER UNIT CONDITIONS TYP TYP TYP C Powerdissipationcapacitance f=10MHz 28.5 29.5 30.5 pF pd 4

SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O–MARCH1994–REVISEDFEBRUARY2005 PARAMETER MEASUREMENT INFORMATION VLOAD From Output RL S1 Open TEST S1 Under Test GND tPLH/tPHL Open (see Note CAL) RL tPLZ/tPZL VLOAD tPHZ/tPZH GND LOAD CIRCUIT INPUTS VCC VI tr/tf VM VLOAD CL RL VD 1.8 V ± 0.15 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V 2.7 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V 3.3 V ± 0.3 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V VI Timing Input VM 0 V tw VI tsu th VI Input VM VM Data Input VM VM 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES VI VI Output Input VM VM Control VM VM 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 VLOAD/2 Output VM VM VOL (Ss1e ea tN VoLteO ABD) VM VOL + VD VOL tPHL tPLH tPZH tPHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH − VD VOH VOL (see Note B) ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure1.LoadCircuitandVoltageWaveforms 5

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LVC139AD ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LVC139A & no Sb/Br) SN74LVC139ADBR ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139ADR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LVC139A & no Sb/Br) SN74LVC139ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LVC139A & no Sb/Br) SN74LVC139ADT ACTIVE SOIC D 16 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LVC139A & no Sb/Br) SN74LVC139ANSR ACTIVE SO NS 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LVC139A & no Sb/Br) SN74LVC139APW ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139APWR ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139APWT ACTIVE TSSOP PW 16 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LC139A & no Sb/Br) SN74LVC139ARGYR ACTIVE VQFN RGY 16 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 LC139A & no Sb/Br) SN74LVC139AZQNR LIFEBUY BGA ZQN 20 1000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 LC139A MICROSTAR & no Sb/Br) JUNIOR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC139A : •Automotive: SN74LVC139A-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC139ADGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74LVC139ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LVC139ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LVC139APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC139APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC139APWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC139APWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC139ARGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 SN74LVC139AZQNR BGAMI ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 CROSTA RJUNI OR PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC139ADGVR TVSOP DGV 16 2000 367.0 367.0 35.0 SN74LVC139ADR SOIC D 16 2500 333.2 345.9 28.6 SN74LVC139ANSR SO NS 16 2000 367.0 367.0 38.0 SN74LVC139APWR TSSOP PW 16 2000 364.0 364.0 27.0 SN74LVC139APWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74LVC139APWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 SN74LVC139APWT TSSOP PW 16 250 367.0 367.0 35.0 SN74LVC139ARGYR VQFN RGY 16 3000 367.0 367.0 35.0 SN74LVC139AZQNR BGAMICROSTAR ZQN 20 1000 350.0 350.0 43.0 JUNIOR PackMaterials-Page2

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PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.55 4.9 NOTE 3 8 9 0.30 B 4.5 16X 0.19 1.2 MAX 4.3 0.1 C A B NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0.75 0.50 0 -8 DETA 20AIL A TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com

EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL UNDER SOLDER MASK OPENING METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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