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PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 76002012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76002012A SNJ54LS 157FK 7600201EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7600201EA SNJ54LS157J 7600201FA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7600201FA SNJ54LS157W 76033012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76033012A SNJ54LS 158FK 7603301EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7603301EA SNJ54LS158J JM38510/07903BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 07903BEA JM38510/07903BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 07903BFA JM38510/30903B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30903B2A JM38510/30903BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 30903BEA JM38510/30903BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 30903BFA M38510/07903BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 07903BEA M38510/07903BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 07903BFA M38510/30903B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30903B2A M38510/30903BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 30903BEA M38510/30903BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 30903BFA SN54157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54157J Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN54LS157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54LS157J SN54LS158J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54LS158J SN54S157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54S157J SN74LS157D ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 & no Sb/Br) SN74LS157DE4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 & no Sb/Br) SN74LS157DR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 & no Sb/Br) SN74LS157DRE4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 & no Sb/Br) SN74LS157N ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 SN74LS157N & no Sb/Br) SN74LS157NE4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 SN74LS157N & no Sb/Br) SN74LS157NSR ACTIVE SO NS 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 74LS157 & no Sb/Br) SN74LS158D ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 & no Sb/Br) SN74LS158DE4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 & no Sb/Br) SN74LS158DR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 & no Sb/Br) SN74LS158N ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 SN74LS158N & no Sb/Br) SN74LS158NSR ACTIVE SO NS 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 74LS158 & no Sb/Br) SNJ54157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54157J SNJ54157W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54157W SNJ54LS157FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76002012A SNJ54LS 157FK Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SNJ54LS157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7600201EA SNJ54LS157J SNJ54LS157W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7600201FA SNJ54LS157W SNJ54LS158FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76033012A SNJ54LS 158FK SNJ54LS158J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7603301EA SNJ54LS158J SNJ54S157FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 157FK SNJ54S157J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54S157J SNJ54S157W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54S157W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS157, SN54LS158, SN74LS157, SN74LS158 : •Catalog: SN74LS157, SN74LS158 •Military: SN54LS157, SN54LS158 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LS157DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS158DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS158NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LS157DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS158DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS158NSR SO NS 16 2000 367.0 367.0 38.0 PackMaterials-Page2

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