Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 SNx4HC573A Octal Transparent D-Type Latches With 3-State Outputs 1 Features 3 Description • WideOperatingVoltageRangefrom2Vto6V The SNx4HC573A devices are octal transparent 1 D-type latches that feature 3-state outputs designed • High-Current3-StateOutputsDriveBusLines specifically for driving highly capacitive or relatively Directlyupto15LSTTLLoads low-impedance loads. They are particularly suitable • LowPowerConsumption:80-µAMaximumI for implementing buffer registers, I/O ports, CC • Typicalt =21ns bidirectionalbusdrivers,andworkingregisters. pd • ±6-mAOutputDriveat5V While the latch-enable (LE) input is high, the Q outputs respond to the data (D) inputs. When LE is • LowInputCurrent:1µA(Maximum) low, the outputs are latched to retain the data that • Bus-StructuredPinout wassetup. 2 Applications DeviceInformation(1) • BufferRegisters PARTNUMBER PACKAGE BODYSIZE(NOM) • BidirectionalBusDrivers SN54HC573AJ CDIP(20) 26.92mm×6.92mm • WorkingRegisters SN54HC573AW CFP(20) 13.72mm×6.92mm SN54HC573AFK LCCC(20) 8.89mm×8.89mm SN74HC573AN PDIP(20) 25.40mm×6.35mm SN74HC573ADW SOIC(20) 12.80mm×7.50mm SN74HC573ADB SSOP(20) 7.20mm×5.30mm SN74HC573APW TSSOP(20) 5.00mm×4.40mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. LogicDiagram(PositiveLogic) 1 OE 11 LE C1 19 2 1Q 1D 1D To Seven Other Channels Copyright © 2016,Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA. On products compliant to MIL-PRF-38535, all parameters are testedunlessotherwisenoted.Onallotherproducts,production processingdoesnotnecessarilyincludetestingofallparameters.

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8.3 FeatureDescription.................................................10 2 Applications........................................................... 1 8.4 DeviceFunctionalModes........................................10 3 Description............................................................. 1 9 ApplicationandImplementation........................ 11 4 RevisionHistory..................................................... 2 9.1 ApplicationInformation............................................11 9.2 TypicalApplication..................................................11 5 PinConfigurationandFunctions......................... 3 10 PowerSupplyRecommendations..................... 12 6 Specifications......................................................... 4 11 Layout................................................................... 12 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 11.1 LayoutGuidelines.................................................12 6.3 RecommendedOperatingConditions.......................4 11.2 LayoutExample....................................................12 6.4 ThermalInformation..................................................5 12 DeviceandDocumentationSupport................. 13 6.5 ElectricalCharacteristics...........................................5 12.1 DocumentationSupport........................................13 6.6 TimingRequirements................................................6 12.2 RelatedLinks........................................................13 6.7 SwitchingCharacteristics..........................................6 12.3 ReceivingNotificationofDocumentationUpdates13 6.8 TypicalCharacteristics..............................................8 12.4 CommunityResources..........................................13 7 ParameterMeasurementInformation..................9 12.5 Trademarks...........................................................13 12.6 ElectrostaticDischargeCaution............................13 8 DetailedDescription............................................ 10 12.7 Glossary................................................................13 8.1 Overview.................................................................10 13 Mechanical,Packaging,andOrderable 8.2 FunctionalBlockDiagram.......................................10 Information........................................................... 13 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(September2003)toRevisionF Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 • DeletedOrderingInformationtable;seePOAattheendofthedatasheet........................................................................... 1 • ChangedPackagethermalimpedance,R ,valuesfrom70to92.5(DB),from58to78.3(DW),from69to49.1 θJA (N),andfrom83to101.1(PW).............................................................................................................................................. 5 2 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 5 Pin Configuration and Functions DB,DW,J,N,PW,orWPackages FKPackage 20-PinSSOP,SOIC,CDIP,PDIP,TSSOP,orCFP 20-PinLCCC TopView TopView C OE 1 20 VCC 2D 1D OE VC 1Q 1D 2 19 1Q 2D 3 18 2Q 3 2 1 0 9 2 1 3D 4 17 3Q 3D 4 18 2Q 4D 5 16 4Q 4D 5 17 3Q 5D 6 15 5Q 5D 6 16 4Q 6D 7 14 6Q 7D 8 13 7Q 6D 7 15 5Q 8D 9 12 8Q 7D 8 14 6Q GND 10 11 LE 0 1 2 3 9 1 1 1 1 Not to scale Not to scale D D E Q Q 8 N L 8 7 G PinFunctions PIN I/O DESCRIPTION NO. NAME 1 OE I Outputenable 2 1D I 1Dinput 3 2D I 2Dinput 4 3D I 3Dinput 5 4D I 4Dinput 6 5D I 5Dinput 7 6D I 6Dinput 8 7D I 7Dinput 9 8D I 8Dinput 10 GND — Ground 11 LE I Latchenableinput 12 8Q O 8Qoutput 13 7Q O 7Qoutput 14 6Q O 6Qoutput 15 5Q O 5Qoutput 16 4Q O 4Qoutput 17 3Q O 3Qoutput 18 2Q O 2Qoutput 19 1Q O 1Qoutput 20 V — Powerpin CC Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC I Inputclampcurrent(2) V <0orV >V ±20 mA IK I I CC I Outputclampcurrent(2) V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±35 mA O O CC ContinuouscurrentthroughV orGND ±70 mA CC T Junctiontemperature 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±3500 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN NOM MAX UNIT V Supplyvoltage 2 5 6 V CC V =2V 1.5 CC V High-levelinputvoltage V =4.5V 3.15 V IH CC V =6V 4.2 CC V =2V 0.5 CC V Low-levelinputvoltage V =4.5V 1.35 V IL CC V =6V 1.8 CC V Inputvoltage 0 V V I CC V Outputvoltage 0 V V O CC V =2V 1000 CC t Inputtransition(riseandfall)time V =4.5V 500 ns t CC V =6V 400 CC SN54HC573A –55 125 T Operatingfree-airtemperature °C A SN74HC573A –40 85 (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.SeetheImplicationsofSloworFloating CC CMOSInputsapplicationreport(SCBA004). 4 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 6.4 Thermal Information SN74HC573A THERMALMETRIC(1) DB DW N PW UNIT (SSOP) (SOIC) (PDIP) (TSSOP) 20PINS 20PINS 20PINS 20PINS R Junction-to-ambientthermalresistance 92.5 78.3 49.1 101.1 °C/W θJA R Junction-to-case(top)thermalresistance 53.9 42.8 35.9 35.9 °C/W θJC(top) R Junction-to-boardthermalresistance 47.6 46.2 30 52 °C/W θJB ψ Junction-to-topcharacterizationparameter 19.5 18 22.4 2.4 °C/W JT ψ Junction-to-boardcharacterizationparameter 47.2 45.7 29.9 51.5 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6.5 Electrical Characteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V =2V 1.9 1.998 CC I =–20µA V =4.5V 4.4 4.499 OH CC V =6V 5.9 5.999 CC T =25°C 3.98 4.3 A V V =V orV I =–6mA,V =4.5V SN54HC573A 3.7 V OH I IH IL OH CC SN74HC573A 3.84 T =25°C 5.48 5.8 A I =–7.8mA,V =6V SN54HC573A 5.2 OH CC SN74HC573A 5.34 V =2V 0.002 0.1 CC I =20µA V =4.5V 0.001 0.1 OL CC V =6V 0.001 0.1 CC T =25°C 0.17 0.26 A V V =V orV I =6mA,V =4.5V SN54HC573A 0.4 V OL I IH IL OL CC SN74HC573A 0.33 T =25°C 0.15 0.26 A I =7.8mA,V =6V SN54HC573A 0.4 OL CC SN74HC573A 0.33 T =25°C ±0.1 ±100 A I V =V or0,V =6V nA I I CC CC SNx4HC573A ±1000 T =25°C ±0.01 ±0.5 A I V =V or0,V =6V SN54HC573A ±10 µA OZ O CC CC SN74HC573A ±5 T =25°C 8 A I V =V or0,I =0,V =6V SN54HC573A 160 µA CC I CC O CC SN74HC573A 80 C V =2Vto6V 3 10 pF i CC Powerdissipation C capacitance T =25°C,noload 50 pF pd A perlatch Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 6.6 Timing Requirements overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT T =25°C 80 A V =2V SN54HC573A 120 CC SN74HC573A 100 T =25°C 16 A t Pulseduration,LEhigh V =4.5V SN54HC573A 24 ns w CC SN74HC573A 20 T =25°C 14 A V =6V SN54HC573A 20 CC SN74HC573A 17 T =25°C 50 A V =2V SN54HC573A 75 CC SN74HC573A 63 T =25°C 10 A t Setuptime,databeforeLE↓ V =4.5V SN54HC573A 15 ns su CC SN74HC573A 13 T =25°C 9 A V =6V SN54HC573A 13 CC SN74HC573A 11 T =25°C 20 A V =2V CC SNx4HC573A 24 t Holdtime,dataafterLE↓ ns h V =4.5V 5 CC V =6V 5 CC 6.7 Switching Characteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted;seeFigure2) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT T =25°C 77 175 A V =2V SN54HC573A 265 CC SN74HC573A 220 T =25°C 26 35 A C =50pF,fromD(input) L V =4.5V SN54HC573A 53 toQ(output) CC SN74HC573A 44 T =25°C 23 30 A V =6V SN54HC573A 45 CC SN74HC573A 38 t ns pd T =25°C 87 175 A V =2V SN54HC573A 265 CC SN74HC573A 220 T =25°C 27 35 A C =50pF,fromLE(input) L V =4.5V SN54HC573A 53 toanyQ(output) CC SN74HC573A 44 T =25°C 23 30 A V =6V SN54HC573A 45 CC SN74HC573A 38 6 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 Switching Characteristics (continued) overoperatingfree-airtemperaturerange(unlessotherwisenoted;seeFigure2) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT T =25°C 68 150 A V =2V SN54HC573A 225 CC SN74HC573A 190 T =25°C 24 30 A C =50pF,fromOE(input) t L V =4.5V SN54HC573A 45 ns en toanyQ(output) CC SN74HC573A 38 T =25°C 21 26 A V =6V SN54HC573A 38 CC SN74HC573A 32 T =25°C 47 150 A V =2V SN54HC573A 225 CC SN74HC573A 190 T =25°C 23 30 A C =50pF,fromOE(input) t L V =4.5V SN54HC573A 45 ns dis toanyQ(output) CC SN74HC573A 38 T =25°C 21 26 A V =6V SN54HC573A 38 CC SN74HC573A 32 T =25°C 28 60 A V =2V SN54HC573A 90 CC SN74HC573A 75 T =25°C 8 12 A t C =50pFtoanyQ(output) V =4.5V SN54HC573A 18 ns t L CC SN74HC573A 15 T =25°C 6 10 A V =6V SN54HC573A 15 CC SN74HC573A 13 T =25°C 95 200 A V =2V SN54HC573A 300 CC SN74HC573A 250 T =25°C 33 40 A C =150pF,fromD(input) L V =4.5V SN54HC573A 60 toQ(output) CC SN74HC573A 50 T =25°C 21 34 A V =6V SN54HC573A 51 CC SN74HC573A 43 t ns pd T =25°C 103 225 A V =2V SN54HC573A 335 CC SN74HC573A 285 T =25°C 33 45 A C =150pF,fromLE(input)to L V =4.5V SN54HC573A 67 anyQ(output) CC SN74HC573A 57 T =25°C 29 40 A V =6V SN54HC573A 60 CC SN74HC573A 50 Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com Switching Characteristics (continued) overoperatingfree-airtemperaturerange(unlessotherwisenoted;seeFigure2) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT T =25°C 85 200 A V =2V SN54HC573A 300 CC SN74HC573A 250 T =25°C 29 40 A C =150pF,fromOE(input) t L V =4.5V SN54HC573A 60 ns en toanyQ(output) CC SN74HC573A 50 T =25°C 26 34 A V =6V SN54HC573A 51 CC SN74HC573A 43 T =25°C 60 210 A V =2V SN54HC573A 315 CC SN74HC573A 265 T =25°C 17 42 A t C =150pFtoanyQ(output) V =4.5V SN54HC573A 63 ns t L CC SN74HC573A 53 T =25°C 14 36 A V =6V SN54HC573A 53 CC SN74HC573A 45 6.8 Typical Characteristics 250 CL 50pF 225 CL 150pF 200 175 s) x(n 150 a M D 125 P T 100 75 50 25 2 2.5 3 3.5 4 4.5 5 5.5 6 Vcc D001 Figure1.MaximumPropagationDelayCurves 8 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 7 Parameter Measurement Information VCC PARAMETER RL CL S1 S2 S1 tPZH 50 pF Open Closed Test ten 1 kΩ or From Output Point RL tPZL 150 pF Closed Open UnderTest tPHZ Open Closed CL tdis 1 kΩ 50 pF (see NoteA) S2 tPLZ Closed Open 50 pF tpdor tt −− or Open Open 150 pF LOAD CIRCUIT VCC Reference 50% Input High-Level VCC 0 V 50% 50% Pulse tsu th 0 V tw Data 90% 90% VCC 50% 50% VCC Input 10% 10% 0 V Low-Level 50% 50% Pulse tr tf 0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATIONS SETUPANDHOLDANDINPUTRISEANDFALLTIMES VCC Output Input 50% 50% Control VCC 0 V (Low-Level 50% 50% tPLH tPHL Enabling) 0 V In-Phase VOH tPZL tPLZ Output 50% 90% 90% 50% Output ≈VCC ≈VCC 10% 10%VOL Waveform 1 50% tr tf (See Note B) 10% VOL tPHL tPLH VOH tPZH tPHZ 90% 90% Out-of- 50% 50% Output VOH Phase 10% 10% VOL Waveform 2 50% 90% Output tf tr (See Note B) ≈0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATION DELAYAND OUTPUT TRANSITION TIMES ENABLEANDDISABLETIMESFOR3-STATEOUTPUTS A. C includesprobeandtest-fixturecapacitance. L B. Waveform1 is for an outputwith internalconditions such that theoutputis lowexceptwhendisabledby theoutput control.Waveform2isforanoutputwithinternalconditionssuchthattheoutputishighexceptwhendisabledbythe outputcontrol. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having thefollowingcharacteristics:PRR≤1MHz,Z =50Ω,t =6ns,t =6ns. O r f D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. t andt arethesameast . PLZ PHZ dis F. t andt arethesameast . PZL PZH en G. t andt arethesameast . PLH PHL pd Figure2. LoadCircuitandVoltageWaveforms Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 8 Detailed Description 8.1 Overview The SNx4HC573A devices are octal transparent D-type latches that feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state andincreaseddriveprovidethecapabilitytodrivebuslineswithoutinterfaceorpullupcomponents. To ensure the high-impedance state during power up or power down, OE must be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered whiletheoutputsareinthehigh-impedancestate. 8.2 Functional Block Diagram 1 OE 11 LE C1 19 2 1Q 1D 1D To Seven Other Channels Copyright © 2016,Texas Instruments Incorporated Figure3. LogicDiagram(PositiveLogic) 8.3 Feature Description The SNx4HC573A is a high current 3-state output device which can drive bus lines directly or up to 15 LSTTL loads. It has low power consumption up to 80-µA maximum I . The high speed CMOS family has typical CC propagation delay of 21 ns with ±6-mA output drive at 5 V. The input leakage current is a very low 1-µA (maximum). 8.4 Device Functional Modes Table1liststhefunctionalmodesoftheSNx4HC573A. Table1.FunctionTable(EachLatch) INPUTS OUTPUT OE LE D Q L H H H L H L L L L X Q 0 H X X Hi-Z 10 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information To ensure the high-impedance state during power up or power down, OE must be tied to V through a pullup CC resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The SNx4HC573A latches can be used to store 8 bits of data. Figure 4 showsatypicalapplication.Alowtriggereventlatchestheoutputtopreservetheeventforprocessinglater.With latchinputhigh,thisactsasabufferwhichfollowsthelivedataattheDinputwhenoutputenablepinheldislow. 9.2 Typical Application Run/Trigger LE Enable OE Q Output Live Data D Copyright © 2016, Texas Instruments Incorporated Figure4. TypicalApplicationSchematic 9.2.1 DesignRequirements The SNx4HC573A device uses CMOS technology and has balanced output drive (±7.8-mA). Take care to avoid buscontention,becauseitcandrivecurrentsthatwouldexceedmaximumlimits. 9.2.2 DetailedDesignProcedure Design requirements must adhere to the Recommended Operating Conditions and must never exceed the AbsoluteMaximumRatings. The inputs must have a ramp time less than input transition time mentioned in the Recommended Operating Conditions. Slow inputs can cause oscillations at the output, false triggering, and increased current consumption. TIrecommendsaSchmitttriggerdevicelikeSN74HC14whichcantolerateslowersignals. The inputs and outputs must never exceed V to not forward bias the internal ESD diodes. The maximum CC frequencysupportedbythisdeviceis28MHz. Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com Typical Application (continued) 9.2.3 ApplicationCurve 100 CL 50pF 90 CL 150pF 80 s) 70 n yp ( 60 tD TP 50 40 30 20 2 2.5 3 3.5 4 4.5 5 5.5 6 Vcc D001 Figure5.TypicalPropagationDelayCurves 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions table. The total current through Ground or V must not exceed ±70 mA as CC perAbsoluteMaximumRatingstable. EachV pinmusthaveagoodbypasscapacitortopreventpowerdisturbance.Fordeviceswithasinglesupply, CC TI recommends 0.1-µF capacitor; if there are multiple V pins, then TI recommends 0.01-µF or 0.022-µF CC capacitor for each power pin. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise. A 0.1-µF and 1-µF capacitor are commonly used in parallel. The bypass capacitor must be installed as closetothepowerpinaspossibleforbestresults. 11 Layout 11.1 Layout Guidelines Whenusingmultiple-bitlogicdevices,inputsmustneverfloat. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input and the gate are used, or only 3 of the 4 buffer gates are used. Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Figure 6 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, they are tied to GND or V , whichever makes more sense or is more convenient. It is acceptable to float outputs, unless the part is a CC transceiver. If the transceiver has an output enable pin, it disables the output section of the part when asserted. ThisdoesnotdisabletheinputsectionoftheI/Os,sotheycannotfloatwhendisabled. 11.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure6. LayoutDiagram 12 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC573A SN74HC573A

SN54HC573A,SN74HC573A www.ti.com SCLS147F–DECEMBER1982–REVISEDOCTOBER2016 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: ImplicationsofSloworFloatingCMOSInputs (SCBA004) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54HC573A Clickhere Clickhere Clickhere Clickhere Clickhere SN74HC573A Clickhere Clickhere Clickhere Clickhere Clickhere 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.6 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN54HC573A SN74HC573A

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-8512801VRA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8512801VR A SNV54HC573AJ 85128012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85128012A SNJ54HC 573AFK 8512801RA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8512801RA SNJ54HC573AJ 8512801SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8512801SA SNJ54HC573AW JM38510/65406BRA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65406BRA M38510/65406BRA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65406BRA SN54HC573AJ ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54HC573AJ SN74HC573ADBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573ADW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573ADWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573AN ACTIVE PDIP N 20 20 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 SN74HC573AN (RoHS) SN74HC573ANE4 ACTIVE PDIP N 20 20 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 SN74HC573AN (RoHS) SN74HC573APWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) SN74HC573APWT ACTIVE TSSOP PW 20 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC573A & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SNJ54HC573AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85128012A SNJ54HC 573AFK SNJ54HC573AJ ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8512801RA SNJ54HC573AJ SNJ54HC573AW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8512801SA SNJ54HC573AW (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 OTHER QUALIFIED VERSIONS OF SN54HC573A, SN54HC573A-SP, SN74HC573A : •Catalog: SN74HC573A, SN54HC573A •Automotive: SN74HC573A-Q1, SN74HC573A-Q1 •Military: SN54HC573A •Space: SN54HC573A-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74HC573ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HC573ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74HC573APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 SN74HC573APWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74HC573ADBR SSOP DB 20 2000 367.0 367.0 38.0 SN74HC573ADWR SOIC DW 20 2000 367.0 367.0 45.0 SN74HC573APWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74HC573APWT TSSOP PW 20 250 367.0 367.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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