Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 SNx4HC273 Octal D-Type Flip-Flops With Clear 1 Features 3 Description • WideOperatingVoltageRangeof2Vto6V The SNx4HC273 devices are positive-edge-triggered 1 D-type flip-flops with a direct active low clear (CLR) • OutputsCanDriveUpto10LSTTLLoads input. • LowPowerConsumption,80-µAMaximumI CC Information at the data (D) inputs meeting the setup • Typicalt =12ns pd time requirements is transferred to the Q outputs on • ±4-mAOutputDriveat5V the positive-going edge of the clock (CLK) pulse. • LowInputCurrentof1-µAMaximum Clock triggering occurs at a particular voltage level and is not related directly to the transition time of the • ContainEightFlip-FlopsWithSingle-RailOutputs positive-going pulse. When CLK is at either the high • DirectClearInput orlowlevel,theDinputhasnoeffectattheoutput. • IndividualDataInputtoEachFlip-Flop DeviceInformation(1) • OnProductsComplianttoMIL-PRF-38535, AllParametersAreTestedUnlessOtherwise PARTNUMBER PACKAGE(PINS) BODYSIZE(NOM) Noted.OnAllOtherProducts,Production SN54HC273J CDIP(20) 24.20mm×6.92mm ProcessingDoesNotNecessarilyIncludeTesting SN54HC273W CFP(20) 13.09mm×6.92mm ofAllParameters. SN54HC273FK LCCC(20) 8.89mm×8.89mm SN74HC273D SOIC(20) 12.80mm×7.50mm 2 Applications SN74HC273DB SSOP(20) 7.20mm×5.30mm • BufferorStorageRegisters SN74HC273NS SO(20) 12.60mm×5.30mm • ShiftRegisters SN74HC273N PDIP(20) 24.33mm×6.35mm • PatternGenerators SN74HC273PW TSSOP(20) 6.50mm×4.40mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. LogicDiagram,EachFlip-Flop(PositiveLogic) C C D TG TG Q C C C C TG CLK(I) C TG C C C R Copyright © 2016,Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8 DetailedDescription............................................ 11 2 Applications........................................................... 1 8.1 Overview.................................................................11 3 Description............................................................. 1 8.2 FunctionalBlockDiagram.......................................11 4 RevisionHistory..................................................... 2 8.3 FeatureDescription.................................................11 8.4 DeviceFunctionalModes........................................11 5 PinConfigurationandFunctions......................... 3 9 ApplicationandImplementation........................ 12 6 Specifications......................................................... 4 9.1 ApplicationInformation............................................12 6.1 AbsoluteMaximumRatings......................................4 9.2 TypicalApplication .................................................12 6.2 ESDRatings–SN74HC273.....................................4 10 PowerSupplyRecommendations..................... 13 6.3 RecommendedOperatingConditions.......................4 6.4 ThermalInformation..................................................5 11 Layout................................................................... 13 6.5 ElectricalCharacteristics...........................................5 11.1 LayoutGuidelines.................................................13 6.6 ElectricalCharacteristics–SN54HC273..................5 11.2 LayoutExample....................................................13 6.7 ElectricalCharacteristics–SN74HC273..................6 12 DeviceandDocumentationSupport................. 14 6.8 TimingRequirements................................................6 12.1 DocumentationSupport........................................14 6.9 TimingRequirements–SN54HC273........................7 12.2 RelatedLinks........................................................14 6.10 TimingRequirements–SN74HC273......................7 12.3 ReceivingNotificationofDocumentationUpdates14 6.11 SwitchingCharacteristics........................................8 12.4 CommunityResources..........................................14 6.12 SwitchingCharacteristics–SN54HC273................8 12.5 Trademarks...........................................................14 6.13 SwitchingCharacteristics–SN74HC273................8 12.6 ElectrostaticDischargeCaution............................14 6.14 OperatingCharacteristics........................................9 12.7 Glossary................................................................14 6.15 TypicalCharacteristics............................................9 13 Mechanical,Packaging,andOrderable 7 ParameterMeasurementInformation................10 Information........................................................... 14 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionD(August2003)toRevisionE Page • AddedDeviceInformationtable,ESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes, ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Deviceand DocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection....................................... 1 • RemovedOrderingInformationtable,seePOAattheendofthedatasheet........................................................................ 1 • AddedMilitaryDisclaimertoFeatures.................................................................................................................................... 1 • ChangedR forDBpackagefrom70°C/W:to90.3°C/W................................................................................................... 5 θJA • ChangedR forDWpackagefrom58°C/W:to77.4°C/W.................................................................................................. 5 θJA • ChangedR forNpackagefrom69°C/W:to45.1°C/W...................................................................................................... 5 θJA • ChangedR forNSpackagefrom60°C/W:to72.6°C/W................................................................................................... 5 θJA • ChangedR forPWpackagefrom83°C/W:to98.3°C/W.................................................................................................. 5 θJA 2 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 5 Pin Configuration and Functions J,W,DB,DWN,NS,orPWPackage CDIP,CFP,SSOP,SOIC,SO,PDIP,orTSSOP FKPackage TopView 20-PinLCCC TopView R C D Q L C Q 1 1 C V 8 CLR 1 20 VCC 1Q 2 19 8Q 3 2 1 0 9 1D 3 18 8D 2 1 2D 4 18 8D 2D 4 17 7D 2Q 5 17 7D 2Q 5 16 7Q 3Q 6 16 7Q 3Q 6 15 6Q 3D 7 15 6Q 3D 7 14 6D 4D 8 14 6D 4D 8 13 5D 0 1 2 3 4Q 9 12 5Q 9 1 1 1 1 GND 10 11 CLK Not to scale Q D K Q D 4 GN CL 5 5 Not to scale PinFunctions PIN I/O DESCRIPTION NO. NAME 1 CLR I Activelowclearinput 2 1Q O Output1 3 1D I Input1 4 2D I Input2 5 2Q O Output2 6 3Q O Output3 7 3D I Input3 8 4D I Input4 9 4Q O Output4 10 GND — Ground 11 CLK I Clockinput 12 5Q O Output5 13 5D I Input5 14 6D I Input6 15 6Q O Output6 16 7Q O Output7 17 7D I Input7 18 8D I Input8 19 8Q O Output8 20 V — Power CC Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC I Inputclampcurrent(2) V <0orV >V ±20 mA IK I I CC I Outputclampcurrent(2) V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthroughV orGND ±50 mA CC T Junctiontemperature 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings – SN74HC273 VALUE UNIT Electrostatic Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V V (ESD) discharge Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan500-VHBMispossiblewiththenecessaryprecautions. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan250-VCDMispossiblewiththenecessaryprecautions. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN NOM MAX UNIT V Supplyvoltage 2 5 6 V CC V =2V 1.5 CC V High-levelinputvoltage V =4.5V 3.15 V IH CC V =6V 4.2 CC V =2V 0.5 CC V Low-levelinputvoltage V =4.5V 1.35 V IL CC V =6V 1.8 CC V Inputvoltage 0 V V I CC V Outputvoltage 0 V V O CC V =2V 1000 CC ∆t/∆v Inputtransitionriseandfalltime V =4.5V 500 ns CC V =6V 400 CC SN54HC273 –55 125 T Operatingfree-airtemperature °C A SN74HC273 –40 85 (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs. 4 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 6.4 Thermal Information SN74HC273 DB DW N NS PW THERMALMETRIC(1) UNIT (SSOP) (SOIC) (PDIP) (SO) (TSSOP) 20PINS 20PINS 20PINS 20PINS 20PINS R Junction-to-ambientthermalresistance(2) 90.3 77.4 45.1 72.6 98.3 °C/W θJA R Junction-to-case(top)thermalresistance 51.7 42.8 31.1 38.9 33.3 °C/W θJC(top) R Junction-to-boardthermalresistance 45.5 45.2 26 40.1 49.3 °C/W θJB ψ Junction-to-topcharacterizationparameter 17.7 16.7 16.6 15.7 2 °C/W JT ψ Junction-to-boardcharacterizationparameter 45.1 44.7 25.9 39.7 48.7 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seeSemiconductorandICPackageThermalMetrics. (2) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 6.5 Electrical Characteristics T =25°C(unlessotherwisenoted) A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VCC=2V 1.9 1.998 IOH=–20µA VCC=4.5V 4.4 4.499 VOH VI=VIHorVIL VCC=6V 5.9 5.999 V IOH=–4mA,VCC=4.5V 3.98 4.3 IOH=–5.2mA,VCC=6V 5.48 5.8 VCC=2V 0.002 0.1 IOL=20µA VCC=4.5V 0.001 0.1 VOL VI=VIHorVIL VCC=6V 0.001 0.1 V IOL=4mA,VCC=4.5V 0.17 0.26 IOL=5.2mA,VCC=6V 0.15 0.26 II VI=VCCor0,VCC=6V ±0.1 ±100 nA ICC VI=VCCor0,IO=0,VCC=6V 8 µA Ci VCC=2Vto6V 3 10 pF 6.6 Electrical Characteristics – SN54HC273 overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VCC=2V 1.9 IOH=–20µA VCC=4.5V 4.4 VOH VI=VIHorVIL VCC=6V 5.9 V IOH=–4mA,VCC=4.5V 3.7 IOH=–5.2mA,VCC=6V 5.2 VCC=2V 0.1 IOL=20µA VCC=4.5V 0.1 VOL VI=VIHorVIL VCC=6V 0.1 V IOL=4mA,VCC=4.5V 0.4 IOL=5.2mA,VCC=V 0.4 II VI=VCCor0,VCC=6V ±1000 nA ICC VI=VCCor0,IO=0,VCC=6V 160 µA Ci VCC=2Vto6V 10 pF Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 6.7 Electrical Characteristics – SN74HC273 overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT VCC=2V 1.9 IOH=–20µA VCC=4.5V 4.4 VOH VI=VIHorVIL VCC=6V 5.9 V IOH=–4mA,VCC=4.5V 3.84 IOH=–5.2mA,VCC=6V 5.34 VCC=2V 0.1 IOL=20µA VCC=4.5V 0.1 VOL VI=VIHorVIL VCC=6V 0.1 V IOL=4mA,VCC=4.5V 0.33 IOL=5.2mA,VCC=6V 0.33 II VI=VCCor0,VCC=6V ±1000 nA ICC VI=VCCor0,IO=0,VCC=6V 80 µA Ci VCC=2Vto6V 10 pF 6.8 Timing Requirements T =25°C(unlessotherwisenoted) A MIN MAX UNIT V =2V 5 CC f Clockfrequency V =4.5V 27 MHz clock CC V =6V 32 CC V =2V 80 CC CLRlow V =4.5V 16 CC V =6V 14 CC t Pulseduration ns w V =2V 80 CC CLKhighorlow V =4.5V 16 CC V =6V 14 CC V =2V 100 CC Data V =4.5V 20 CC V =6V 17 CC t SetuptimebeforeCLK↑ ns su V =2V 100 CC CLRinactive V =4.5V 20 CC V =6V 17 CC V =2V 0 CC t Holdtime,dataafterCLK↑ V =4.5V 0 ns h CC V =6V 0 CC 6 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 6.9 Timing Requirements – SN54HC273 overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V =2V 4 CC f Clockfrequency V =4.5V 18 MHz clock CC V =6V 21 CC V =2V 120 CC CLRlow V =4.5V 24 CC V =6V 20 CC t Pulseduration ns w V =2V 120 CC CLKhighorlow V =4.5V 24 CC V =6V 20 CC V =2V 150 CC Data V =4.5V 30 CC V =6V 25 CC t SetuptimebeforeCLK↑ ns su V =2V 150 CC CLRinactive V =4.5V 30 CC V =6V 25 CC V =2V 0 CC t Holdtime,dataafterCLK↑ V =4.5V 0 ns h CC V =6V 0 CC 6.10 Timing Requirements – SN74HC273 overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V =2V 4 CC f Clockfrequency V =4.5V 21 MHz clock CC V =6V 25 CC V =2V 100 CC CLRlow V =4.5V 20 CC V =6V 17 CC t Pulseduration ns w V =2V 100 CC CLKhighorlow V =4.5V 20 CC V =6V 17 CC V =2V 125 CC Data V =4.5V 25 CC V =6V 21 CC t SetuptimebeforeCLK↑ ns su V =2V 125 CC CLRinactive V =4.5V 25 CC V =6V 21 CC V =2V 0 CC t Holdtime,dataafterCLK↑ V =4.5V 0 ns h CC V =6V 0 CC Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 6.11 Switching Characteristics T =25°CandC =50pF(unlessotherwisenoted;seeFigure2) A L PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V =2V 5 11 CC f V =4.5V 27 50 MHz max CC V =6V 32 60 CC V =2V 55 160 CC t FromCLR(input)toany(output) V =4.5V 15 32 ns PHL CC V =6V 12 27 CC V =2V 56 160 CC t FromCLK(input)toany(output) V =4.5V 15 32 ns pd CC V =6V 13 27 CC V =2V 38 75 CC t Toany(output) V =4.5V 8 15 ns t CC V =6V 6 13 CC 6.12 Switching Characteristics – SN54HC273 overrecommendedoperatingfree-airtemperaturerange,C =50pF(unlessotherwisenoted;seeFigure2) L PARAMETER TESTCONDITIONS MIN MAX UNIT V =2V 4 CC f V =4.5V 18 MHz max CC V =6V 21 CC V =2V 240 CC t FromCLR(input)toany(output) V =4.5V 48 ns PHL CC V =6V 41 CC V =2V 240 CC t FromCLK(input)toany(output) V =4.5V 48 ns pd CC V =6V 41 CC V =2V 110 CC t Toany(output) V =4.5V 22 ns t CC V =6V 19 CC 6.13 Switching Characteristics – SN74HC273 overrecommendedoperatingfree-airtemperaturerange,C =50pF(unlessotherwisenoted;seeFigure2) L PARAMETER TESTCONDITIONS MIN MAX UNIT V =2V 4 CC f V =4.5V 21 MHz max CC V =6V 25 CC V =2V 200 CC t FromCLR(input)toany(output) V =4.5V 40 ns PHL CC V =6V 34 CC V =2V 200 CC t FromCLK(input)toany(output) V =4.5V 40 ns pd CC V =6V 34 CC V =2V 95 CC t Toany(output) V =4.5V 19 ns t CC V =6V 16 CC 8 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 6.14 Operating Characteristics T =25°C A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitanceperflip-flop Noload 35 pF pd 6.15 Typical Characteristics 200 160 120 tpd(max)(ns) Ta =25o C 80 CL = 50pF CLK to Q/Q 30 20 0 2 4 5 6 Vcc Figure1.Maxt vsV pd CC Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 7 Parameter Measurement Information VCC High-Level 50% 50% Pulse FromOutput Test 0V UnderTest Point tw CL=50pF VCC (seeNoteA) Low-Level 50% 50% Pulse 0V LOADCIRCUIT VOLTAGEWAVEFORMS PULSEDURATIONS VCC Input 50% 50% 0V tPLH tPHL ReferIennpcuet 50% VCC InO-Puhtapsuet 105%0% 90% 90% 501%0% VOH 0V VOL tsu th tr tf tPHL tPLH Data VCC VOH Input 50% 90% 90% 50% Out-of-Phase 90% 50% 50% 90% 10% 10% 0V Output 10% 10% VOL tr tf tf tr VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS SETUPANDHOLDANDINPUTRISEANDFALLTIMES PROPAGATIONDELAYANDOUTPUTTRANSITIONTIMES NOTES: A. CLincludesprobeandtest-fixturecapacitance. B. Phaserelationshipsbetweenwaveformswerechosenarbitrarily.Allinputpulsesaresuppliedbygeneratorshavingthefollowing characteristics:PRR≤1MHz,ZO=50Ω,tr=6ns,tf=6ns. C. Forclockinputs,fmaxismeasuredwhentheinputdutycycleis50%. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. tPLHandtPHLarethesameastpd. Figure2. LoadCircuitandVoltageWaveforms 10 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 8 Detailed Description 8.1 Overview The SNx4HC273 contains eight flip-flops with single-rail outputs with individual data input to each flip-flop. The outputscandriveupto10LSTTLloads.Thedevicehasdirectactivelowclearinput. 8.2 Functional Block Diagram 1D 2D 3D 4D 5D 6D 7D 8D 3 4 7 8 13 14 17 18 11 CLK 1D 1D 1D 1D 1D 1D 1D 1D C1 C1 C1 C1 C1 C1 C1 C1 R R R R R R R R 1 CLR 2 5 6 9 12 15 16 19 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q Copyright © 2016,Texas Instruments Incorporated 8.3 Feature Description TheSNx4HC273haslowpowerconsumptionwithamaximum of80µA. CC Thetypicalt fortheSNx4HC273is12nsandtheoutputdriveis ±4mAat5V. pd TheSNx4HC273alsohasverylowinputcurrent,withthemaximumsetat1 µA. 8.4 Device Functional Modes Table1liststhefunctionalmodesoftheSNx4HC273. Table1.FunctionTable(EachFlip-Flop) INPUTS OUTPUT CLR CLK D Q L X X L H ↑ H H H ↑ L L H L X Q 0 Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The SNx4HC273 is octal D Flip flop with active low clear input. It has low input current and low power consumption.TheDflip-flopcanbeusedasaToggleflipflopusinganXORgateattheinput.Theoutputtoggles fromthepreviousstatewhenevertheTinputishigh. 9.2 Typical Application D Q T CLR CLK Copyright © 2016, Texas Instruments Incorporated 9.2.1 DesignRequirements ThisSNx4Hc273deviceusesCMOStechnologyandhasbalancedoutputdrive. 9.2.2 DetailedDesignProcedure 1. Recommendedinputconditions: – Risetimeandfalltimespecifications:see(Δt/ΔV)inRecommendedOperatingConditions. – Specifiedhighandlowlevels:see(V andV )inRecommendedOperatingConditions. IH IL – InputsarenotovervoltagetolerantandmustnotbeaboveanyvalidV asperRecommendedOperating CC Conditions. 2. Absolutemaximumoutputconditions: – Continuos output currents must not exceed (I max) per output and must not exceed total current O (continuous current through V or GND) for the part. These limits are located in the Absolute Maximum CC Ratings. – OutputsmustnotbepulledaboveV . CC 12 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 www.ti.com SCLS136E–DECEMBER1982–REVISEDJULY2016 Typical Application (continued) 9.2.3 ApplicationCurve 80 70 60 t(max)(ns) t 50 Ta =25o C CL = 50pF Q/Q 20 10 0 2 4 5 6 Vcc Figure3. MaxTransitionTimevsV CC 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in RecommendedOperatingConditions. EachV pinmusthaveagoodbypasscapacitortopreventpowerdisturbance.Fordeviceswithasinglesupply, CC TI recommends a 0.1-µF capacitor. If there are multiple V pins, TI recommends a 0.01-µF or 0.022-µF CC capacitorforeachpowerpin.Itisoktoparallelmultiplebypasscapacitorstorejectdifferentfrequenciesofnoise. 0.1-µF and 1-µF capacitors are commonly used in parallel. The bypass capacitor must be installed as close to thepowerpinaspossibleforbestresults. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices inputs must not ever float. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified below are the rules that must be observedunderallcircumstances: • All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. • Thelogiclevelthatmustbeappliedtoanyparticularunusedinputdependsonthefunctionofthedevice. • GenerallytheyaretiedtoGNDorV whichevermakemoresenseorismoreconvenient. CC 11.2 Layout Example VCC Input Unused Input Output Unused Input Output Input Figure4. SNx4HC273Layout Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN54HC273 SN74HC273

SN54HC273,SN74HC273 SCLS136E–DECEMBER1982–REVISEDJULY2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: ImplicationsofSloworFloatingCMOSInputs 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54HC273 Clickhere Clickhere Clickhere Clickhere Clickhere SN74HC273 Clickhere Clickhere Clickhere Clickhere Clickhere 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.6 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowserbasedversionsofthisdatasheet,refertothelefthandnavigation. 14 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC273 SN74HC273

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-8409901VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409901VR A SNV54HC273J 5962-8409901VSA ACTIVE CFP W 20 25 TBD A42 N / A for Pkg Type -55 to 125 5962-8409901VS A SNV54HC273W 84099012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84099012A SNJ54HC 273FK 8409901RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8409901RA SNJ54HC273J 8409901SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8409901SA SNJ54HC273W JM38510/65601BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65601BRA JM38510/65601BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65601BSA M38510/65601BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65601BRA M38510/65601BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65601BSA SN54HC273J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC273J SN74HC273DBR ACTIVE SSOP DB 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273DW ACTIVE SOIC DW 20 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273DWR ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273N ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC273N (RoHS) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74HC273NE4 ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC273N (RoHS) SN74HC273NSR ACTIVE SO NS 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273PW ACTIVE TSSOP PW 20 70 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273PWR ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SN74HC273PWT ACTIVE TSSOP PW 20 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC273 & no Sb/Br) SNJ54HC273FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84099012A SNJ54HC 273FK SNJ54HC273J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8409901RA SNJ54HC273J SNJ54HC273W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8409901SA SNJ54HC273W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC273, SN54HC273-SP, SN74HC273 : •Catalog: SN74HC273, SN54HC273 •Automotive: SN74HC273-Q1, SN74HC273-Q1 •Military: SN54HC273 •Space: SN54HC273-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74HC273DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HC273DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74HC273DWRG4 SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74HC273NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74HC273PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74HC273DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74HC273DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74HC273DWRG4 SOIC DW 20 2000 367.0 367.0 45.0 SN74HC273NSR SO NS 20 2000 367.0 367.0 45.0 SN74HC273PWT TSSOP PW 20 250 367.0 367.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DB0020A TSSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/A 12/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A TSSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/A 12/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A TSSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/A 12/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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