Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 SNx4HC14 Hex Schmitt-Trigger Inverters 1 Features 3 Description • WideOperatingVoltageRangeof2Vto6V The SNx4HC14 are Schmitt-trigger devices that 1 contain six independent inverters. They perform the • OutputsCanDriveUpto10LSTTLLoads BooleanfunctionY= Ainpositivelogic. • LowPowerConsumption,20-μAMaxI CC • Typicalt =11ns DeviceInformation(1) pd • ±4-mAOutputDriveat5V PARTNUMBER PACKAGE BODYSIZE(NOM) • LowInputCurrentof1 μAMax SNJ54HC14J CDIP(14) 7.62mmx19.94mm SNJ54HC14W CFP(14) 7.11mmx9.11mm • OnProductsComplianttoMIL-PRF-38535, AllParametersAreTestedUnlessOtherwise SNJ54HC14FK LCCC(20) 8.89mmx8.89mm Noted.OnAllOtherProducts,Production SN74HC14D SOIC(14) 6.00mmx8.65mm ProcessingDoesNotNecessarilyIncludeTesting SN74HC14DB SSOP(14) 367.00mmx367.00mm ofAllParameters. SN74HC14N PDIP(14) 7.94mmx10.35mm SN74HC14NS SO(14) 7.80mmx10.20mm 2 Applications SN74HC14PW TSSOP(14) 6.40mmx5.00mm • MicrowaveOven (1) For all available packages, see the orderable addendum at • Mice theendofthedatasheet. • Printers • ACInverterDrives • UPS • ACServoDrives • OtherMotorDrives LogicDiagram(PositiveLogic) A Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8.3 FeatureDescription...................................................8 2 Applications........................................................... 1 8.4 DeviceFunctionalModes..........................................8 3 Description............................................................. 1 9 ApplicationandImplementation.......................... 9 4 RevisionHistory..................................................... 2 9.1 ApplicationInformation..............................................9 9.2 TypicalApplication....................................................9 5 PinConfigurationandFunctions......................... 3 10 PowerSupplyRecommendations..................... 10 6 Specifications......................................................... 4 11 Layout................................................................... 11 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 11.1 LayoutGuidelines.................................................11 6.3 RecommendedOperatingConditions.......................4 11.2 LayoutExample....................................................11 6.4 ThermalInformation..................................................4 12 DeviceandDocumentationSupport................. 12 6.5 ElectricalCharacteristics...........................................5 12.1 DocumentationSupport........................................12 6.6 SwitchingCharacteristics..........................................5 12.2 RelatedLinks........................................................12 6.7 OperatingCharacteristics..........................................5 12.3 ReceivingNotificationofDocumentationUpdates12 6.8 TypicalCharacteristics..............................................6 12.4 CommunityResources..........................................12 7 ParameterMeasurementInformation..................7 12.5 Trademarks...........................................................12 12.6 ElectrostaticDischargeCaution............................12 8 DetailedDescription.............................................. 8 12.7 Glossary................................................................12 8.1 Overview...................................................................8 13 Mechanical,Packaging,andOrderable 8.2 FunctionalBlockDiagram.........................................8 Information........................................................... 12 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionI(February2016)toRevisionJ Page • Changed"Y=A"to"Y=A"throughout................................................................................................................................ 1 • AddedTheSNx4HC14toDescriptionsection....................................................................................................................... 1 • DeletedDeviceComparisonTablesection............................................................................................................................ 1 • AddedReceivingNotificationofDocumentationUpdatessection....................................................................................... 12 ChangesfromRevisionH(September2015)toRevisionI Page • ChangedpartnumberfromSN54HC08toSN54HC14inSwitchingCharacteristicstable.................................................... 5 • ChangedpartnumberfromSN74HC08toSN74HC14inSwitchingCharacteristicstable.................................................... 5 ChangesfromRevisionG(January2014)toRevisionH Page • AddedApplications................................................................................................................................................................. 1 • AddedMilitaryDisclaimertoFeatureslist.............................................................................................................................. 1 • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 ChangesfromRevisionF(December2010)toRevisionG Page • UpdateddocumenttonewTIdatasheetformat-nospecificationchanges......................................................................... 1 2 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 www.ti.com SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 5 Pin Configuration and Functions SN54HC14JorWPackage SN74HC14D,DB,N,NS,orPWPackage SN54HC14FKPackage 14-PinCDIP,CFP,SOIC,SSOP,PDIP,SO,orTSSOP 20-PinLCCC TopView TopView C Y A C CA 1A 1 14 VCC 1 1 N V 6 1Y 2 13 6A 3 2 1 20 19 2A 3 12 6Y 2A 4 18 6Y 2Y 4 11 5A NC 5 17 NC 3A 5 10 5Y 2Y 6 16 5A 3Y 6 9 4A NC 7 15 NC GND 7 8 4Y 3A 8 14 5Y 9 10 1112 13 YD CY A 3N N4 4 G PinFunctions PIN CDIP,CFP, SOIC,SSOP, I/O DESCRIPTION NAME LCCC PDIP,SO, TSSOP 1A 1 2 I Channel1input 1Y 2 3 O Channel1output 2A 3 4 I Channel2input 2Y 4 6 O Channel2output 3A 5 8 I Channel3input 3Y 6 9 O Channel3output GND 7 10 — Ground 4Y 8 12 O Channel4output 4A 9 13 I Channel4input 5Y 10 14 O Channel5output 5A 11 16 I Channel5input 6Y 12 18 O Channel6output 6A 13 19 I Channel6input V 14 20 — Powersupply CC 1 5 7 NC(1) — — Nointernalconnection 11 15 17 (1) NC–Nointernalconnection Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC I Inputclampcurrent(2) V <0orV >V ±20 mA IK I I CC I Outputclampcurrent(2) V <0 ±20 mA OK O I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthroughV orGND ±50 mA CC T Junctiontemperature 150 j °C T Storagetemperature –65 150 stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions Seenote(1). SN54HC14 SN74HC14 UNIT MIN NOM MAX MIN NOM MAX V Supplyvoltage 2 5 6 2 5 6 V CC V Inputvoltage 0 V 0 V V I CC CC V Outputvoltage 0 V 0 V V O CC CC T Operatingfree-airtemperature –55 125 –40 85 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.SeeImplicationsofSloworFloating CC CMOSInputs,SCBA004. 6.4 Thermal Information SNx4HC14 THERMALMETRIC(1) D(SOIC) DB(SSOP) N(PDIP) NS(SO) PW(TSSOP) UNIT 14PINS 14PINS 14PINS 14PINS 14PINS R Junction-to-ambientthermalresistance 86 96 80 76 113 °C/W θJA (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 4 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 www.ti.com SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 6.5 Electrical Characteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted) TA=25°C SN54HC14 SN74HC14 PARAMETER TESTCONDITIONS VCC UNIT MIN TYP MAX MIN MAX MIN MAX 2V 0.7 1.2 1.5 0.7 1.5 0.7 1.5 VT+ 4.5V 1.55 2.5 3.15 1.55 3.15 1.55 3.15 V 6V 2.1 3.3 4.2 2.1 4.2 2.1 4.2 2V 0.3 0.6 1 0.3 1 0.3 1 VT− 4.5V 0.9 1.6 2.45 0.9 2.45 0.9 2.45 V 6V 1.2 2 3.2 1.2 3.2 1.2 3.2 2V 0.2 0.6 1.2 0.2 1.2 0.2 1.2 VT+−VT− 4.5V 0.4 0.9 2.1 0.4 2.1 0.4 2.1 V 6V 0.5 1.3 2.5 0.5 2.5 0.5 2.5 2V 1.9 1.998 1.9 1.9 IOH=–20μA 4.5V 4.4 4.499 4.4 4.4 VOH VI=VIHorVIL 6V 5.9 5.999 5.9 5.9 V IOH=–4mA 4.5V 3.98 4.3 3.7 3.84 IOH=–5.2mA 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL=20μA 4.5V 0.001 0.1 0.1 0.1 VOL VI=VIHorVIL 6V 0.001 0.1 0.1 0.1 V IOL=4mA 4.5V 0.17 0.26 0.4 0.33 IOL=5.2mA 6V 0.15 0.26 0.4 0.33 II VI=VCCor0 6V ±0.1 ±100 ±1000 ±1000 nA ICC VI=VCCor0, IO=0 6V 2 40 20 μA Ci 2Vto6V 3 10 10 10 pF 6.6 Switching Characteristics overoperatingfree-airtemperaturerange,C =50pF(unlessotherwisenoted)(seeFigure3) L FROM TO TA=25°C SN54HC14 SN74HC14 PARAMETER V UNIT (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX MIN MAX 2V 55 125 190 155 t A Y 4.5V 12 25 38 31 ns pd 6V 11 21 22 26 2V 38 75 110 95 t Y 4.5V 8 15 22 19 ns t 6V 6 13 19 16 6.7 Operating Characteristics T =25°C A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitanceperinverter Noload 20 pF pd Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 6.8 Typical Characteristics 14.5 70 60 14 50 13.5 s) s) 40 n n D ( 13 D ( P P 30 T T 12.5 20 12 10 11.5 0 -100 -50 0 50 100 150 0 2 4 6 8 Temperature D001 VCC D002 Figure1.TPDvsTemperatureat4.5V,25°C Figure2.TPDvsV at25°C CC 6 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 www.ti.com SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 7 Parameter Measurement Information From Output Test Input VCC 50% 50% Under Test Point 0 V CL= 50 pF (see NoteA) tPLH tPHL LOAD CIRCUIT In-Phase 50% 90% 90% 50% VOH Output 10% 10% VOL tr tf 90% 90% VCC tPHL tPLH Input 105%0% 501%0% 0 V Out-of-OPuhtapsuet 90% 501%0% 105%0% 90% VOH tr tf tf tr VOL VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS INPUT RISEAND FALLTIMES PROPAGATION DELAYAND OUTPUT TRANSITION TIMES Figure3. LoadCircuitandVoltageWaveforms Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 8 Detailed Description 8.1 Overview These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A in positivelogic. Schmitt-trigger inputs are designed to provide a minimum separation between positive and negative switching thresholds. This allows for noisy or slow inputs that would cause problems such as oscillation or excessive currentdrawwithnormalCMOSinputs. 8.2 Functional Block Diagram A Y Figure4. LogicDiagram(PositiveLogic) 8.3 Feature Description The wide operating range of the device allows it to be used in a variety of systems that use different logic levels. The outputs can drive up to 10 LSTTL loads each. The device has very low power consumption, with 20-μA Max I . Typical propagation delay is also low at 11 ns. The balanced drive outputs can source or sink 4 mA at 5-V CC V .Theinputleakagecurrentis1 μAMax. CC 8.4 Device Functional Modes Table1liststhefunctionalmodesoftheSNx4HC14. Table1.FunctionTable(EachInverter) INPUTS OUTPUT A Y H L L H 8 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 www.ti.com SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The SNx4HC14 are Schmitt-trigger input CMOS devices that can be used for a multitude of inverting buffer type functions. The application shown in Figure 5 takes advantage of the Schmitt-trigger inputs to produce a delay for alogicoutput. 9.2 Typical Application R 1A 1Y 1 2A 2Y INPUT OUTPUT C 1 Figure5. SimplifiedApplicationSchematic 9.2.1 DesignRequirements This device uses CMOS technology. Take care to avoid bus contention because it can drive currents that would exceed maximum limits. Parallel output drive can create fast edges into light loads so consider routing and load conditionstopreventringing. 9.2.2 DetailedDesignProcedure This circuit is designed around an RC network that produces a slow input to the second inverter. The RC time constant,τ,iscalculatedfrom: τ=R×C Thedelaytimeforthiscircuitisbetween1.2τ and0.42τ.Thedelayisconsistentforeachdevice,butbecausethe switching threshold is only guaranteed between a minimum and maximum value, the output pulse length varies betweenthedevices.ThesevalueswerecalculatedbyusingtheminimumandmaximumguaranteedV values. T+ TheresistorvalueshouldbechosensuchthatthemaximumcurrentfromandtotheSNx4HC14is4mA. • Recommendedinputconditions: – Schmitt-triggerinputsallowforslowinputs. – Specifiedhighandlowlevels.See(V andV )inRecommendedOperatingConditions. IH IL • Recommendedoutputconditions: – Loadcurrentsshouldnotexceed4mAperoutput. Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com Typical Application (continued) 9.2.3 ApplicationCurve 5.0 4.5 4.0 3.5 V) 3.0 ge ( 2.5 VT+ Typical a + olt VT V 2.0 1.5 Max Delay Time = 1.202 V 1.0 C Min Delay Time = 0.422 V OUT 0.5 0.0 t0 t0 + 2(cid:3) t0 + 22(cid:3) t0 + 32(cid:3) t0 + 42(cid:3) t0 + 52(cid:3) Time Figure6. IdealCapacitorVoltageandOutputVoltageWithPositiveSwitchingThresholdRange Representation 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each V terminal should have a good bypass capacitor to prevent power CC disturbance. For devices with a single supply, TI recommends a 0.1-µF capacitor. If there are multiple VCC terminals, then TI recommends a 0.01-µF or 0.022-µF capacitor for each power terminal. Multiple bypass capacitors can be paralleled to reject different frequencies of noise. Frequencies of 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close as possible to the power terminal forbestresults. 10 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 www.ti.com SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices, inputs should never float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only three of the four buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V whichever makes more sense or is more convenient. Floating outputs is generally acceptable, unless the CC partisatransceiver. 11.2 Layout Example Figure7. LayoutRecommendation Copyright©1982–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54HC14 SN74HC14

SN54HC14,SN74HC14 SCLS085J–DECEMBER1982–REVISEDOCTOBER2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: ImplicationsofSloworFloatingCMOSInputs,SCBA004 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54HC05 Clickhere Clickhere Clickhere Clickhere Clickhere SN74HC05 Clickhere Clickhere Clickhere Clickhere Clickhere 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.6 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 12 SubmitDocumentationFeedback Copyright©1982–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC14 SN74HC14

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-8409101VCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8409101VC A SNV54HC14J 5962-8409101VDA ACTIVE CFP W 14 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8409101VD A SNV54HC14W 84091012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84091012A SNJ54HC 14FK 8409101CA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 8409101CA SNJ54HC14J 8409101DA ACTIVE CFP W 14 1 TBD Call TI N / A for Pkg Type -55 to 125 8409101DA SNJ54HC14W JM38510/65702BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65702BCA JM38510/65702BDA ACTIVE CFP W 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65702BDA M38510/65702BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65702BCA M38510/65702BDA ACTIVE CFP W 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/ 65702BDA SN54HC14J ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54HC14J SN74HC14D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DE4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DG4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DRE4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74HC14DRG3 ACTIVE SOIC D 14 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DT ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14DTG4 ACTIVE SOIC D 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14N ACTIVE PDIP N 14 25 Green (RoHS NIPDAU | SN N / A for Pkg Type -40 to 85 SN74HC14N & no Sb/Br) SN74HC14NE4 ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 SN74HC14N & no Sb/Br) SN74HC14NSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14NSRE4 ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWT ACTIVE TSSOP PW 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SN74HC14PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HC14 & no Sb/Br) SNJ54HC14FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84091012A SNJ54HC 14FK SNJ54HC14J ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 8409101CA Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SNJ54HC14J SNJ54HC14W ACTIVE CFP W 14 1 TBD Call TI N / A for Pkg Type -55 to 125 8409101DA SNJ54HC14W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC14, SN54HC14-SP, SN74HC14 : Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 •Catalog: SN74HC14, SN54HC14 •Automotive: SN74HC14-Q1, SN74HC14-Q1 •Military: SN54HC14 •Space: SN54HC14-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.1 8.0 16.0 Q1 SN74HC14DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.1 8.0 16.0 Q1 SN74HC14DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC14PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC14PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74HC14DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC14DR SOIC D 14 2500 364.0 364.0 27.0 SN74HC14DRG3 SOIC D 14 2500 364.0 364.0 27.0 SN74HC14DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC14DT SOIC D 14 250 210.0 185.0 35.0 SN74HC14PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC14PWR TSSOP PW 14 2000 364.0 364.0 27.0 SN74HC14PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC14PWT TSSOP PW 14 250 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID A 4X .005 MIN (OPTIONAL) [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 14X .045-.065 [0.36-0.66] [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 7 8 B .245-.283 .2 MAX TYP .13 MIN TYP [6.22-7.19] [5.08] [3.3] SEATING PLANE C .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 14X .008-.014 TYP [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL B SEE DETAIL A 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX (.063) [0.05] [1.6] METAL ALL AROUND ( .063) SOLDER MASK [1.6] OPENING METAL .002 MAX SOLDER MASK (R.002 ) TYP [0.05] OPENING [0.05] ALL AROUND DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com

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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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