Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 SNx4HC05 Hex Inverters With Open-Drain Outputs 1 Features 3 Description • WideOperatingVoltageRangeof2Vto6V The SNx4HC05 devices contain six independent 1 inverters. They perform the Boolean function Y = A in • OutputscanDriveupto10LSTTLLoads positive logic. The open-drain outputs require pullup • Low-PowerConsumption,20-μAMaximumICC resistors to perform correctly. They may be • Typicalt =8ns connected to other open-drain outputs to implement pd active-low wired-OR or active-high wired-AND • ±4-mAOutputDriveat5V functions. • LowInputCurrentof1-μAMaximum DeviceInformation(1) 2 Applications PARTNUMBER PACKAGE BODYSIZE(NOM) • Mice PDIP(14) 19.30mm×6.40mm • Printers SOIC(14) 8.65mm×3.91mm SN74HC05 • ACInverterDrives SOP(14) 10.30mm×5.30mm • UPS TSSOP(14) 5.00mm×4.40mm • ACServoDrives (1) For all available packages, see the orderable addendum at theendofthedatasheet. • OtherMotorDrives space space space LogicDiagram(PositiveLogic) A Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8.2 FunctionalBlockDiagram.........................................7 2 Applications........................................................... 1 8.3 FeatureDescription...................................................7 3 Description............................................................. 1 8.4 DeviceFunctionalModes..........................................7 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation.......................... 8 9.1 ApplicationInformation..............................................8 5 PinConfigurationandFunctions......................... 3 9.2 TypicalApplication ...................................................8 6 Specifications......................................................... 4 10 PowerSupplyRecommendations....................... 9 6.1 AbsoluteMaximumRatings......................................4 11 Layout..................................................................... 9 6.2 ESDRatings..............................................................4 6.3 RecommendedOperatingConditions.......................4 11.1 LayoutGuidelines...................................................9 6.4 ThermalInformation..................................................5 11.2 LayoutExample......................................................9 6.5 ElectricalCharacteristics...........................................5 12 DeviceandDocumentationSupport................. 10 6.6 SwitchingCharacteristics..........................................5 12.1 DocumentationSupport........................................10 6.7 OperatingCharacteristics..........................................5 12.2 RelatedLinks........................................................10 6.8 TypicalCharacteristics..............................................6 12.3 Trademarks...........................................................10 7 ParameterMeasurementInformation..................6 12.4 ElectrostaticDischargeCaution............................10 12.5 Glossary................................................................10 8 DetailedDescription.............................................. 7 13 Mechanical,Packaging,andOrderable 8.1 Overview...................................................................7 Information........................................................... 10 4 Revision History ChangesfromRevisionD(August2003)toRevisionE Page • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 2 SubmitDocumentationFeedback Copyright©2015,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 www.ti.com SCLS080E–FEBRUARY2015–REVISEDMARCH2015 5 Pin Configuration and Functions SN74HC05:D,N,NS,orPWPackage,14-PinSOIC,PDIP,SOP, orTSSOP SN54HC05:FKPackage SN54HC05:JorWPackage,19-PinCDIPorCFP 20-PinLCCC (TopView) (TopView) C Y A C CA 1A 1 14 VCC 1 1 N V 6 1Y 2 13 6A 3 2 1 20 19 2A 3 12 6Y 2A 4 18 6Y 2Y 4 11 5A NC 5 17 NC 3A 5 10 5Y 2Y 6 16 5A 3Y 6 9 4A NC 7 15 NC GND 7 8 4Y 3A 8 14 5Y 9 10 1112 13 YD CY A 3N N4 4 G NC–Nointernalconnection PinFunctions PIN I/O DESCRIPTION NAME NO. LCCCNO. 1A 1 2 I Input1 1Y 2 3 O Output1 2A 3 4 I Input2 2Y 4 6 O Output2 3A 5 8 I Input3 3Y 6 9 O Output3 GND 7 10 – Groundpin 4A 9 13 I Input4 4Y 8 12 O Output4 5A 11 16 I Input5 5Y 10 14 O Output5 6A 13 19 I Input6 6Y 12 18 O Output6 1,5,7,11, NC – – Noconnect 15,17 V 14 20 – Powerpin CC Copyright©2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted) (1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC I Inputclampcurrent,V <0orV >V (2) –20 20 mA IK I I CC I Outputclampcurrent,V <0orV >V (2) –20 20 mA OK O O CC I Continuousoutputcurrent,V =0toV –25 25 mA O O CC ContinuouscurrentthroughV orGND –50 50 mA CC T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings VALUE UNIT V Electrostatic Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±1000 V (ESD) discharge (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions See (1) MIN NOM MAX UNIT V Supplyvoltage 2 5 6 V CC V =2V 1.5 CC V High-levelinputvoltage V =4.5V 3.15 V IH CC V =6V 4.2 CC V =2V 0.5 CC V Low-levelinputvoltage V =4.5V 1.35 V IL CC V =6V 1.8 CC V Inputvoltage 0 V V I CC V Outputvoltage 0 V V O CC V =2V 1000 CC Δt/Δv Inputtransitionriseorfalltime V =4.5V 500 ns CC V =6V 400 CC SN54HC05 –55 125 T Operatingfree-airtemperature °C A SN74HC05 –40 125 (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,SCBA004. 4 SubmitDocumentationFeedback Copyright©2015,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 www.ti.com SCLS080E–FEBRUARY2015–REVISEDMARCH2015 6.4 Thermal Information SN74HC05 THERMALMETRIC(1) D(SOIC) N(PDIP) NS(SOP) PW(TSSOP) UNIT 14PINS 14PINS 14PINS 14PINS R Junction-to-ambientthermalresistance 89.1 85.9 86.4 117.1 θJA R Junction-to-case(top)thermalresistance 50.6 43.8 42.4 46.1 θJC(top) R Junction-to-boardthermalresistance 43.3 44.6 45.1 58.7 °C/W θJB ψ Junction-to-topcharacterizationparameter 16.3 12 11.8 4.8 JT ψ Junction-to-boardcharacterizationparameter 43 44.2 44.7 58.1 JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 6.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) SN74HC05 SN74HC05 PARAMETER TESTCONDITIONS VCC TA=25°C SN54HC05 –40°Cto85°C –40°Cto125°C UNIT MIN TYP MAX MIN MAX MIN MAX MIN MAX IOH VI=VIHorVIL,VO=VCC 6V 0.01 0.5 10 5 5 µA 2V 0.002 0.1 0.1 0.1 0.1 IOL=20µA 4.5V 0.001 0.1 0.1 0.1 0.1 VOL VVIIL=VIHor 6V 0.001 0.1 0.1 0.1 0.1 V IOL=4mA 4.5V 0.17 0.26 0.4 0.33 0.33 IOL=5.2mA 6V 0.15 0.26 0.4 0.33 0.33 II VI=VCCor0 6V ±0.1 ±100 ±1000 ±1000 ±1000 nA ICC VI=VCCor0,IO=0 6V 2 40 20 20 µA Ci 2to6V 3 10 10 10 10 pF 6.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =50pF(unlessotherwisenoted)(seeFigure3) L SN74HC05 SN74HC05 PARAMETER FROM TO VCC TA=25°C SN54HC05 –40°Cto85°C –40°Cto125°C UNIT (INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX MIN MAX 2V 60 115 175 145 160 tPLH A Y 4.5V 13 23 35 29 31 6V 10 20 30 25 28 2V 45 85 130 105 120 tPHL A Y 4.5V 9 17 26 21 23 ns 6V 8 14 22 18 21 2V 38 75 110 95 110 tf Y 4.5V 8 15 22 19 22 6V 6 13 19 16 19 6.7 Operating Characteristics T =25°C A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitanceperinverter Noload 20 pF pd Copyright©2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 www.ti.com 6.8 Typical Characteristics 14.5 70 60 14 50 13.5 s) s) 40 n n D ( 13 D ( P P 30 T T 12.5 20 12 10 11.5 0 -100 -50 0 50 100 150 0 2 4 6 8 Temperature D001 VCC D002 Figure1.TPDvs.Temperatureat4.5V,25°C Figure2.TPDvs.V at25°C CC 7 Parameter Measurement Information VCC RL=1kΩ FromOutput Test VCC Input 50% 50% UnderTest Point 0V CL=50pF (seeNoteA) tPLH tPHL In-Phase VOH 90% Output 50% LOADCIRCUIT 10% 10%VOL tf VCC tPHL tPLH Input 105%0% 90% 90% 501%0% Out-of-Phase 90% 50% VOH 0V Output 10% 10% tr tf tf VOL VOLTAGEWAVEFORM VOLTAGEWAVEFORMS INPUTRISEANDFALLTIMES PROPAGATIONDELAYANDOUTPUTTRANSITIONTIMES A. C includesprobeandtest-fixturecapacitance. L B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having thefollowingcharacteristics:PRR≤1MHz,Z =50Ω,t =6ns,t =6ns. O r f C. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. Figure3. LoadCircuitandVoltageWaveforms 6 SubmitDocumentationFeedback Copyright©2015,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 www.ti.com SCLS080E–FEBRUARY2015–REVISEDMARCH2015 8 Detailed Description 8.1 Overview The SNx4HC05 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.Theopen-drainoutputsrequirepullupresistorstoperformcorrectly.Theymaybeconnectedtootheropen- drainoutputstoimplementactive-lowwired-ORoractive-highwired-ANDfunctions. 8.2 Functional Block Diagram A Y Figure4. LogicDiagram(PositiveLogic) 8.3 Feature Description The device’s wide operating range allows it to be used in a variety of systems that use different logic levels. The strong current-sinking outputs allow the device to drive medium loads without significant increases in output voltage. In addition, the low power consumption makes this device a good choice for portable and battery power- sensitiveapplications. 8.4 Device Functional Modes Table1.FunctionTable (EachInverter) INPUTA OUTPUTY H L L H Copyright©2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The SN74HC05 device is a low drive open-drain CMOS device that can be used for a multitude of buffer type functions. The open-drain output can be pulled to any voltage between GND and V making them Ideal for CC downtranslation. 9.2 Typical Application Buffer Function Basic LED Driver VPU VPU Wired OR uC or Logic uC or Logic uC or Logic HC05 HC05 uC or Logic HC05 Figure5. SimplifiedApplicationSchematic 9.2.1 DesignRequirements This device uses CMOS technology and is open-drain so it has low-output drive only. Take care to avoid bus contention because it can drive currents that would exceed maximum limits. Parallel output drive can create fast edgesintolightloadssoconsiderroutingandloadconditionstopreventringing. 9.2.2 DetailedDesignProcedure • Recommendedinputconditions: – Risetimeandfalltimespecssee(Δt/ΔV)inRecommendedOperatingConditions. – Specifiedhighandlowlevels.See(V andV )inRecommendedOperatingConditions. IH IL • Recommendedoutputconditions: – Loadcurrentsshouldnotexceed25mAperoutputand50mAtotalforthepart. 8 SubmitDocumentationFeedback Copyright©2015,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 www.ti.com SCLS080E–FEBRUARY2015–REVISEDMARCH2015 Typical Application (continued) 9.2.3 ApplicationCurve 2 1.5 V) ( 1 VIL 0.5 0 0 1 2 3 4 5 6 7 VCC(V) D001 Figure6. MaxV vs.V Level IL CC 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each V terminal should have a good bypass capacitor to prevent power CC disturbance. For devices with a single supply, TI recommends a 0.1-µF capacitor. If there are multiple VCC terminals, then TI recommends a 0.01-µF or 0.022-µF capacitor for each power terminal. Multiple bypass capacitors can be paralleled to reject different frequencies of noise. Frequencies of 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close as possible to the power terminal forbestresults. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices, inputs should never float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only three of the four buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V whichever makes more sense or is more convenient. Floating outputs is generally acceptable, unless the CC partisatransceiver. 11.2 Layout Example Figure7. LayoutRecommendation Copyright©2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54HC05 SN74HC05

SN54HC05,SN74HC05 SCLS080E–FEBRUARY2015–REVISEDMARCH2015 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: ImplicationsofSloworFloatingCMOSInputs,SCBA004 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54HC05 Clickhere Clickhere Clickhere Clickhere Clickhere SN74HC05 Clickhere Clickhere Clickhere Clickhere Clickhere 12.3 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 12.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 10 SubmitDocumentationFeedback Copyright©2015,TexasInstrumentsIncorporated ProductFolderLinks:SN54HC05 SN74HC05

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-88718012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 88718012A SNJ54HC 05FK 5962-8871801CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8871801CA SNJ54HC05J SN54HC05J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC05J SN74HC05D ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05DE4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05DR ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05DRG4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05DT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05DTG4 ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05N ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 125 SN74HC05N & no Sb/Br) SN74HC05NE4 ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 125 SN74HC05N & no Sb/Br) SN74HC05NSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05NSRE4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) SN74HC05PWT ACTIVE TSSOP PW 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC05 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SNJ54HC05FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 88718012A SNJ54HC 05FK SNJ54HC05J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8871801CA SNJ54HC05J (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 OTHER QUALIFIED VERSIONS OF SN54HC05, SN74HC05 : •Catalog: SN74HC05 •Military: SN54HC05 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 27-Dec-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74HC05DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC05DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.1 8.0 16.0 Q1 SN74HC05DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC05DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC05DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC05DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC05NSR SO NS 14 2000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1 SN74HC05PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC05PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC05PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC05PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 27-Dec-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74HC05DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC05DR SOIC D 14 2500 364.0 364.0 27.0 SN74HC05DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC05DRG4 SOIC D 14 2500 367.0 367.0 38.0 SN74HC05DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC05DT SOIC D 14 250 210.0 185.0 35.0 SN74HC05NSR SO NS 14 2000 367.0 367.0 38.0 SN74HC05PWR TSSOP PW 14 2000 364.0 364.0 27.0 SN74HC05PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC05PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC05PWT TSSOP PW 14 250 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID A 4X .005 MIN (OPTIONAL) [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 14X .045-.065 [0.36-0.66] [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 7 8 B .245-.283 .2 MAX TYP .13 MIN TYP [6.22-7.19] [5.08] [3.3] SEATING PLANE C .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 14X .008-.014 TYP [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL B SEE DETAIL A 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX (.063) [0.05] [1.6] METAL ALL AROUND ( .063) SOLDER MASK [1.6] OPENING METAL .002 MAX SOLDER MASK (R.002 ) TYP [0.05] OPENING [0.05] ALL AROUND DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com

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