(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:1)(cid:8)(cid:8)(cid:9)(cid:10) (cid:11)(cid:12)(cid:13)(cid:14) (cid:15)(cid:16)(cid:7) (cid:6)(cid:12)(cid:1) (cid:1)(cid:17)(cid:18)(cid:7)(cid:5)(cid:19) (cid:17)(cid:18)(cid:7)(cid:19) (cid:1)(cid:5)(cid:19)(cid:20)(cid:7)(cid:7)(cid:21)(cid:22) (cid:11)(cid:18)(cid:20)(cid:11)(cid:16) (cid:5)(cid:14)(cid:13)(cid:23)(cid:24)(cid:18)(cid:2)(cid:25) SCDS029I − JANUARY 1996 − REVISED JANUARY 2004 (cid:1) 5-Ω Switch Connection Between Two Ports D OR PW PACKAGE (cid:1) (TOP VIEW) TTL-Compatible Input Levels description/ordering information 1OE 1 8 VCC 1A 2 7 2OE The SN74CBTS3306 features independent line 1B 3 6 2B switches with Schottky diodes on the I/Os to GND 4 5 2A clamp undershoot. Each switch is disabled when the associated output-enable (OE) input is high. ORDERING INFORMATION ORDERABLE TOP-SIDE TA PACKAGE† PART NUMBER MARKING Tube SN74CBTS3306D SSOOIICC −− DD CCRR330066 Tape and reel SN74CBTS3306DR −−4400°°CC ttoo 8855°°CC Tube SN74CBTS3306PW TTSSSSOOPP −− PPWW CCRR330066 Tape and reel SN74CBTS3306PWR †Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each bus switch) INPUT FUNCTION OE L A port = B port H Disconnect logic diagram (positive logic) 2 3 1A 1B 1 1OE 5 6 2A 2B 7 2OE Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. (cid:24)(cid:26)(cid:20)(cid:11)(cid:12)(cid:5)(cid:7)(cid:18)(cid:20)(cid:2) (cid:11)(cid:13)(cid:7)(cid:13) (cid:27)(cid:28)(cid:29)(cid:30)(cid:31)!"#(cid:27)(cid:30)(cid:28) (cid:27)$ %&(cid:31)(cid:31)’(cid:28)# "$ (cid:30)(cid:29) (&)*(cid:27)%"#(cid:27)(cid:30)(cid:28) +"#’, Copyright  2004, Texas Instruments Incorporated (cid:24)(cid:31)(cid:30)+&%#$ %(cid:30)(cid:28)(cid:29)(cid:30)(cid:31)! #(cid:30) $(’%(cid:27)(cid:29)(cid:27)%"#(cid:27)(cid:30)(cid:28)$ (’(cid:31) #-’ #’(cid:31)!$ (cid:30)(cid:29) (cid:7)’."$ (cid:18)(cid:28)$#(cid:31)&!’(cid:28)#$ $#"(cid:28)+"(cid:31)+ /"(cid:31)(cid:31)"(cid:28)#0, (cid:24)(cid:31)(cid:30)+&%#(cid:27)(cid:30)(cid:28) ((cid:31)(cid:30)%’$$(cid:27)(cid:28)1 +(cid:30)’$ (cid:28)(cid:30)# (cid:28)’%’$$"(cid:31)(cid:27)*0 (cid:27)(cid:28)%*&+’ #’$#(cid:27)(cid:28)1 (cid:30)(cid:29) "** ("(cid:31)"!’#’(cid:31)$, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:1)(cid:8)(cid:8)(cid:9)(cid:10) (cid:11)(cid:12)(cid:13)(cid:14) (cid:15)(cid:16)(cid:7) (cid:6)(cid:12)(cid:1) (cid:1)(cid:17)(cid:18)(cid:7)(cid:5)(cid:19) (cid:17)(cid:18)(cid:7)(cid:19) (cid:1)(cid:5)(cid:19)(cid:20)(cid:7)(cid:7)(cid:21)(cid:22) (cid:11)(cid:18)(cid:20)(cid:11)(cid:16) (cid:5)(cid:14)(cid:13)(cid:23)(cid:24)(cid:18)(cid:2)(cid:25) SCDS029I − JANUARY 1996 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V CC Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V I Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W JA PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C stg †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4 5.5 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature −40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP‡ MAX UNIT A or B inputs −0.7 VVIIKK VVCCCC == 44..55 VV,, IIII == −−1188 mmAA VV Control inputs −1.2 IIL VCC = 5.5 V, VI = GND −1 IIII µAA IIH VCC = 5.5 V, VI = 5.5 V 150 ICC VCC = 5.5 V, IO = 0, VI = VCC or GND 3 µA ∆ICC§ Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA Ci Control inputs VI = 3 V or 0 5 pF Cio(OFF) VO = 3 V or 0, OE = VCC 6 pF VCC = 4 V, TYP at VCC = 4 V VI = 2.4 V, II = 15 mA 14 20 rroonn¶¶ II = 64 mA 5 7 ΩΩ VVII == 00 VVCCCC == 44..55 VV II = 30 mA 5 7 VI = 2.4 V, II = 15 mA 10 15 ‡All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. §This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. ¶Measured by the voltage drop between the A and B pin at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) pins. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:1)(cid:8)(cid:8)(cid:9)(cid:10) (cid:11)(cid:12)(cid:13)(cid:14) (cid:15)(cid:16)(cid:7) (cid:6)(cid:12)(cid:1) (cid:1)(cid:17)(cid:18)(cid:7)(cid:5)(cid:19) (cid:17)(cid:18)(cid:7)(cid:19) (cid:1)(cid:5)(cid:19)(cid:20)(cid:7)(cid:7)(cid:21)(cid:22) (cid:11)(cid:18)(cid:20)(cid:11)(cid:16) (cid:5)(cid:14)(cid:13)(cid:23)(cid:24)(cid:18)(cid:2)(cid:25) SCDS029I − JANUARY 1996 − REVISED JANUARY 2004 switching characteristics over recommended operating free-air temperature range, C = 50 pF L (unless otherwise noted) (see Figure 1) VCC = 5 V PPAARRAAMMEETTEERR FROM TO VCC = 4 V ± 0.5 V UUNNIITT ((IINNPPUUTT)) ((OOUUTTPPUUTT)) MIN MAX MIN MAX tpd† A or B B or A 0.35 0.25 ns ten OE A or B 5.6 1.8 5 ns tdis OE A or B 4.6 1 4.3 ns †The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). PARAMETER MEASUREMENT INFORMATION 7 V TEST S1 500 Ω S1 Open tpd Open From Output tPLZ/tPZL 7 V Under Test GND tPHZ/tPZH 0pen CL = 50 pF (see Note A) 500 Ω 3 V Output 1.5 V 1.5 V LOAD CIRCUIT Control 0 V tPZL tPLZ Output 3.5 V 3 V Waveform 1 Input 1.5 V 1.5 V S1 at 7 V 1.5 V VOL + 0.3 V 0 V (see Note B) VOL tPLH tPHL tPZH tPHZ Output VOH VOH Waveform 2 VOH − 0.3 V 1.5 V Output 1.5 V 1.5 V S1 at Open VOL (see Note B) 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74CBTS3306D ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 CR306 & no Sb/Br) SN74CBTS3306DR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 CR306 & no Sb/Br) SN74CBTS3306PW ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 CR306 & no Sb/Br) SN74CBTS3306PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 CR306 & no Sb/Br) SN74CBTS3306PWR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 CR306 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 21-Aug-2015 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74CBTS3306DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN74CBTS3306PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 21-Aug-2015 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74CBTS3306DR SOIC D 8 2500 340.5 338.1 20.6 SN74CBTS3306PWR TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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