ICGOO在线商城 > 集成电路(IC) > 逻辑 - 信号开关,多路复用器,解码器 > SN74CBT16233DL
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SN74CBT16233DL产品简介:
ICGOO电子元器件商城为您提供SN74CBT16233DL由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 SN74CBT16233DL价格参考¥5.42-¥6.04。Texas InstrumentsSN74CBT16233DL封装/规格:逻辑 - 信号开关,多路复用器,解码器, Multiplexer/Demultiplexer 16 x 1:2 56-SSOP。您可以下载SN74CBT16233DL参考资料、Datasheet数据手册功能说明书,资料中有SN74CBT16233DL 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC 1-OF-2 FET MUX/DEMUX 56-SSOP多路器开关 IC 16-Bit 1-of-2 FET |
产品分类 | |
品牌 | Texas Instruments |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 开关 IC,多路器开关 IC,Texas Instruments SN74CBT16233DL74CBT |
数据手册 | |
产品型号 | SN74CBT16233DL |
产品种类 | 多路器开关 IC |
传播延迟时间 | 0.25 ns |
供应商器件封装 | 56-SSOP |
其它名称 | 296-6398-5 |
包装 | 管件 |
单位重量 | 694.800 mg |
商标 | Texas Instruments |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
导通电阻—最大值 | 7 Ohms |
封装 | Tube |
封装/外壳 | 56-BSSOP(0.295",7.50mm 宽) |
封装/箱体 | SSOP-56 |
工作温度 | -40°C ~ 85°C |
工作电源电压 | 4.75 V to 5.25 V |
工作电源电流 | 3 uA |
工厂包装数量 | 20 |
带宽 | 200 MHz |
开关数量 | 2 |
开关配置 | 2 x 8 x SPDT (2 x 8 x 1:2) |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
标准包装 | 20 |
独立电路 | 2 |
电压-电源 | 4.75 V ~ 5.25 V |
电压源 | 单电源 |
电流-输出高,低 | - |
电路 | 8 x 1:2 |
类型 | FET 多路复用器/多路分解器 |
系列 | SN74CBT16233 |
通道数量 | 8 Channel |
SN74CBT16233 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 (cid:0) Member of the Texas Instruments DGG, DGV, OR DL PACKAGE Widebus Family (TOP VIEW) (cid:0) 5-Ω Switch Connection Between Two Ports 1A 1 56 1B1 (cid:0) TTL-Compatible Input Levels 2B1 2 55 1B2 2B2 3 54 2A description 3A 4 53 3B1 The SN74CBT16233 is a 16-bit 1-of-2 FET 4B1 5 52 3B2 multiplexer/demultiplexer used in applications in 4B2 6 51 4A which two separate data paths must be 5A 7 50 5B1 multiplexed onto, or demultiplexed from, a single 6B1 8 49 5B2 path. This device can be used for memory 6B2 9 48 6A interleaving, where two different banks of memory 7A 10 47 7B1 need to be addressed simultaneously. The device 8B1 11 46 7B2 can be used as two 8-bit to 16-bit multiplexers or 8B2 12 45 8A as one 16-bit to 32-bit multiplexer. GND 13 44 GND VCC 14 43 VCC Two select (SEL1 and SEL2) inputs control the 9A 15 42 9B1 data flow. When the TEST inputs are asserted, the 10B1 16 41 9B2 A port is connected to both the B1 and the B2 10B2 17 40 10A ports. SEL1, SEL2, and the TEST inputs can be 11A 18 39 11B1 driven with a 5-V CMOS, a 5-V TTL, or a 12B1 19 38 11B2 low-voltage TTL driver. 12B2 20 37 12A This device is designed so it does not have 13A 21 36 13B1 through current when switching directions. 14B1 22 35 13B2 14B2 23 34 14A 15A 24 33 15B1 16B1 25 32 15B2 16B2 26 31 16A TEST1 27 30 SEL1 TEST2 28 29 SEL2 ORDERING INFORMATION ORDERABLE TOP-SIDE TA PACKAGE† PART NUMBER MARKING Tube SN74CBT16233DL SSSSOOPP – DDLL CCBBTT1166223333 Tape and reel SN74CBT16233DLR –4400°°CC ttoo 8855°°CC TSSOP – DGG Tape and reel SN74CBT16233DGGR CBT16233 TVSOP – DGV Tape and reel SN74CBT16233DGVR CY233 †Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright 2001, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1
SN74CBT16233 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 FUNCTION TABLE (each multiplexer/demultiplexer) INPUTS FFUUNNCCTTIIOONN SEL TEST L L A = B1 H L A = B2 X H A = B1 and A = B2 logic diagram (positive logic) 1 56 15 42 1A 1B1 9A 9B1 55 41 1B2 9B2 45 11 31 25 8A 8B1 16A 16B1 12 26 8B2 16B2 30 29 SEL1 SEL2 27 28 TEST1 TEST2 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V CC Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V + 0.5 V I CC Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W JA DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C stg †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT16233 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4.75 5.25 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature –40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT VIK VCC = 4.75 V, II = –18 mA –1.2 V VCC = 0, VI = 5.25 V 10 µA IIII VCC = 5.25 V, VI = 5.25 V or GND ±1 µA ICC VCC = 5.25 V, IO = 0, VI = VCC or GND 3 µA ∆ICC‡ Control inputs VCC = 5.25 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA Ci Control inputs VI = 3 V or 0 4.5 pF Cio(OFF) VO = 3 V or 0 4 pF II = 64 mA 5 7 ron§§ VCC = 4.75 V VVII == 00 II = 30 mA 5 7 Ω VI = 2.4 V, II = 15 mA 7 12 †All typical values are at VCC = 5 V, TA = 25°C. ‡This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. §Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range, C = 50 pF L (unless otherwise noted) (see Figure 1) FROM TO PPAARRAAMMEETTEERR MMIINN MMAAXX UUNNIITT (INPUT) (OUTPUT) tpd¶ A or B B or A 0.25 ns tpd SEL A 1.6 5.3 ns ten TEST or SEL B 1.3 5.2 ns tdis TEST or SEL B 1 5.3 ns ¶The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
SN74CBT16233 16-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER SCDS010K – MAY 1995 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7 V TEST S1 500 Ω S1 Open tpd Open From Output tPLZ/tPZL 7 V Under Test GND tPHZ/tPZH Open CL = 50 pF 500 Ω (see Note A) 3 V Output 1.5 V 1.5 V LOAD CIRCUIT Control 0 V tPZL tPLZ Output 3.5 V 3 V Waveform 1 Input 1.5 V 1.5 V S1 at 7 V 1.5 V VOL + 0.3 V 0 V (see Note B) VOL tPZH tPHZ tPLH tPHL Output VOH VOH Waveform 2 VOH – 0.3 V Output 1.5 V 1.5 V S1 at Open 1.5 V VOL (see Note B) 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty 74CBT16233DGGRE4 ACTIVE TSSOP DGG 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74CBT16233DGGRG4 ACTIVE TSSOP DGG 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74CBT16233DGVRE4 ACTIVE TVSOP DGV 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) 74CBT16233DGVRG4 ACTIVE TVSOP DGV 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DGGR ACTIVE TSSOP DGG 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DGVR ACTIVE TVSOP DGV 56 2000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DL ACTIVE SSOP DL 56 20 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DLG4 ACTIVE SSOP DL 56 20 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DLR ACTIVE SSOP DL 56 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) SN74CBT16233DLRG4 ACTIVE SSOP DL 56 1000 Green(RoHS& CUNIPDAU Level-1-260C-UNLIM noSb/Br) (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI toCustomeronanannualbasis. Addendum-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0(mm) B0(mm) K0(mm) P1 W Pin1 Type Drawing Diameter Width (mm) (mm) Quadrant (mm) W1(mm) SN74CBT16233DGGR TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 SN74CBT16233DGVR TVSOP DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1 SN74CBT16233DLR SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 PackMaterials-Page1
PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74CBT16233DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74CBT16233DGVR TVSOP DGV 56 2000 346.0 346.0 41.0 SN74CBT16233DLR SSOP DL 56 1000 346.0 346.0 49.0 PackMaterials-Page2
MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.005 (0,13) M 0.008 (0,203) 48 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 24 0°–(cid:1)8° 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.004 (0,10) 0.110 (2,79) MAX 0.008 (0,20) MIN PINS ** 28 48 56 DIM 0.380 0.630 0.730 A MAX (9,65) (16,00) (18,54) 0.370 0.620 0.720 A MIN (9,40) (15,75) (18,29) 4040048/E 12/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO-118 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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