SN74AUP2G00 www.ti.com SCES752C–SEPTEMBER2009–REVISEDMAY2010 LOW-POWER DUAL 2-INPUT POSITIVE-NAND GATE CheckforSamples:SN74AUP2G00 FEATURES 1 • AvailableintheTexasInstrumentsNanoStar™ • Optimizedfor3.3-VOperation Package • 3.6-VI/OToleranttoSupportMixed-Mode • LowStatic-PowerConsumption SignalOperation (ICC=0.9mAMaximum) • tpd=5.9nsMaximumat3.3V • LowDynamic-PowerConsumption • SuitableforPoint-to-PointApplications (C =4.3pFTypat3.3V) pd • Latch-UpPerformanceExceeds100mAPer • LowInputCapacitance(Ci=1.5pFTypical) JESD78,ClassII • LowNoise–OvershootandUndershoot • ESDPerformanceTestedPerJESD22 <10%ofV CC – 2000-VHuman-BodyModel • IoffSupportsPartial-Power-DownMode (A114-B,ClassII) Operation – 1000-VCharged-DeviceModel(C101) • WideOperatingV Rangeof0.8Vto3.6V CC DCU PACKAGE DQE PACKAGE RSE PACKAGE YFP PACKAGE (TOPVIEW) (TOPVIEW) (TOPVIEW) (TOPVIEW) 1A 1 8 VCC 1A 1 8 VCC VCC 1A A1 18 A2 VCC 21YB 32 76 12YB 21YB 32 76 12BY 1Y 1 8 7 1A 21YB CB11 3276 CB22 12BY GND 4 5 2A GND D1 45 D2 2A GND 4 5 2A 2B 2 6 1B 2A 3 4 5 2Y GND Seemechanicaldrawingsfordimensions. DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V range CC of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity(seetheverylowundershootandovershootcharacteristicsshowninFigure2). Static-Power Consumption Dynamic-Power Consumption Switching Characteristics (µA) (pF) at 25 MHz(A) 100% 100% 3.5 3.0 80% 80% 2.5 60% 3.3-V 60% 3.3-V e (V) 2.0 Input Output Logic(A) Logic(A) g 1.5 40% 40% a olt 1.0 V 20% 20% 0.5 AAUUPP AAUUPP 0.0 0% 0% -0.5 (A)Single, dual, and triple gates 0 5 10 15 20 25 30 35 40 45 Time (ns) (A)SN74AUP2Gxx data at C = 15 pF. L Figure1.AUP–TheLowest-PowerFamily Figure2.ExcellentSignalIntegrity 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2009–2010,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74AUP2G00 SCES752C–SEPTEMBER2009–REVISEDMAY2010 www.ti.com TheSN74AUP2G00performstheBooleanfunctionY=A•BorY=A+Binpositivelogic. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, off off preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown. ORDERINGINFORMATION T PACKAGE(1) (2) ORDERABLEPARTNUMBER TOP-SIDEMARKING(3) A NanoStar™ –WCSP(DSBGA) Reelof3000 SN74AUP2G00YFPR ___HA_ 0.23-mmLargeBump–YFP(Pb-free) –40°Cto85°C uQFN–DQE Reelof5000 SN74AUP2G00DQER PN QFN–RSE Reelof5000 SN74AUP2G00RSER PN SSOP–DCU Reelof3000 SN74AUP2G00DCUR H00_ (1) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. (2) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (3) DCU:Theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatesthewaferfab/assemblysite. YFP:Theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing charactertodesignatethewaferfab/assemblysite.Pin1identifierindicatessolder-bumpcomposition(1=SnPb,•=Pb-free). FUNCTIONTABLE INPUTS OUTPUT A B Y L L H L X H X L H H H L LOGICDIAGRAM(POSITIVELOGIC) 1 1A 7 2 1Y 1B 5 2A 3 6 2Y 2B PinnumbershownareforDCUandDQEpackages. 2 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 www.ti.com SCES752C–SEPTEMBER2009–REVISEDMAY2010 ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 4.6 V CC V Inputvoltagerange(2) –0.5 4.6 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 4.6 V O V Outputvoltagerangeinthehighorlowstate(2) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±20 mA O ContinuouscurrentthroughV orGND ±50 mA CC DCUpackage 220 DQEpackage 261 q Packagethermalimpedance(3) °C/W JA RSEpackage 253 YFPpackage 132 T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 SCES752C–SEPTEMBER2009–REVISEDMAY2010 www.ti.com RECOMMENDED OPERATING CONDITIONS(1) MIN MAX UNIT V Supplyvoltage 0.8 3.6 V CC V =0.8V V CC CC V =1.1Vto1.95V 0.65×V CC CC V High-levelinputvoltage V IH V =2.3Vto2.7V 1.6 CC V =3Vto3.6V 2 CC V =0.8V 0 CC V =1.1Vto1.95V 0.35×V CC CC V Low-levelinputvoltage V IL V =2.3Vto2.7V 0.7 CC V =3Vto3.6V 0.9 CC V Inputvoltage 0 3.6 V I V Outputvoltage 0 V V O CC V =0.8V –20 mA CC V =1.1V –1.1 CC V =1.4V –1.7 CC I High-leveloutputcurrent OH V =1.65 –1.9 mA CC V =2.3V –3.1 CC V =3V –4 CC V =0.8V 20 mA CC V =1.1V 1.1 CC V =1.4V 1.7 CC I Low-leveloutputcurrent OL V =1.65V 1.9 mA CC V =2.3V 3.1 CC V =3V 4 CC Δt/Δv Inputtransitionriseorfallrate V =0.8Vto3.6V 200 ns/V CC T Operatingfree-airtemperature –40 85 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.SeetheTIapplicationreportImplications CC ofSloworFloatingCMOSInputs,literaturenumberSCBA004. 4 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 www.ti.com SCES752C–SEPTEMBER2009–REVISEDMAY2010 ELECTRICAL CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) T =25°C T =–40°Cto85°C A A PARAMETER TESTCONDITIONS V UNIT CC MIN TYP MAX MIN MAX I =–20mA 0.8Vto3.6V V –0.1 V –0.1 OH CC CC I =–1.1mA 1.1V 0.75×V 0.7×V OH CC CC I =–1.7mA 1.4V 1.11 1.03 OH I =–1.9mA 1.65V 1.32 1.3 OH V V OH I =–2.3mA 2.05 1.97 OH 2.3V I =–3.1mA 1.9 1.85 OH I =–2.7mA 2.72 2.67 OH 3V I =–4mA 2.6 2.55 OH I =20mA 0.8Vto3.6V 0.1 0.1 OL I =1.1mA 1.1V 0.3×V 0.3×V OL CC CC I =1.7mA 1.4V 0.31 0.37 OL I =1.9mA 1.65V 0.31 0.35 OL V V OL I =2.3mA 0.31 0.33 OL 2.3V I =3.1mA 0.44 0.45 OL I =2.7mA 0.31 0.33 OL 3V I =4mA 0.44 0.45 OL I AorBinput V =GNDto3.6V 0Vto3.6V 0.1 0.5 mA I I I V orV =0Vto3.6V 0V 0.2 0.6 mA off I O ΔI V orV =0Vto3.6V 0Vto0.2V 0.2 0.6 mA off I O V =GNDor(V to3.6V), I I CC 0.8Vto3.6V 0.5 0.9 mA CC I =0 O V =V –0.6V(1), ΔI I CC 3.3V 40 50 mA CC I =0 O 0V 1.5 C V =V orGND pF i I CC 3.6V 1.5 C V =GND 0V 3 pF o O (1) OneinputatV –0.6V,otherinputatV orGND CC CC SWITCHING CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange,C =5pF(unlessotherwisenoted)(seeFigure3andFigure4) L FROM TO TA=25°C TA=–40°Cto85°C PARAMETER V UNIT (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX 0.8V 19.8 1.2V±0.1V 2.6 7.8 18.8 2.1 19.8 1.5V±0.1V 1.4 5.4 11.8 0.9 13.9 t AorB Y ns pd 1.8V±0.15V 1 4.3 9 0.5 11.1 2.5V±0.2V 1 3 5.9 0.5 7.8 3.3V±0.3V 1 2.4 4.9 0.5 5.9 Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 SCES752C–SEPTEMBER2009–REVISEDMAY2010 www.ti.com SWITCHING CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange,C =10pF(unlessotherwisenoted)(seeFigure3andFigure4) L FROM TO TA=25°C TA=–40°Cto85°C PARAMETER V UNIT (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX 0.8V 23.1 1.2V±0.1V 1.5 8.9 21.1 1 22 1.5V±0.1V 1 6.3 13.2 0.5 15.1 t AorB Y ns pd 1.8V±0.15V 1 5 10.1 0.5 12.2 2.5V±0.2V 1 3.6 7.4 0.5 9 3.3V±0.3V 1 2.9 5.2 0.5 6.5 SWITCHING CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange,C =15pF(unlessotherwisenoted)(seeFigure3andFigure4) L FROM TO TA=25°C TA=–40°Cto85°C PARAMETER V UNIT (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX 0.8V 24.7 1.2V±0.1V 3.6 9.8 21.7 3.1 22.7 1.5V±0.1V 2.3 4.6 14 1.8 15.7 t AorB Y ns pd 1.8V±0.15V 1.6 5.5 10.6 1.1 12.6 2.5V±0.2V 1 4 7 0.5 8.9 3.3V±0.3V 1 3.3 5.6 0.5 6.9 SWITCHING CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange,C =30pF(unlessotherwisenoted)(seeFigure3andFigure4) L FROM TO TA=25°C TA=–40°Cto85°C PARAMETER V UNIT (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX 0.8V 31.8 1.2V±0.1V 4.9 12.6 26.3 4.4 27 1.5V±0.1V 3.4 9 16.6 2.9 18.3 t AorB Y ns pd 1.8V±0.15V 2.5 7.3 12.9 2 14.8 2.5V±0.2V 1.8 5.4 8.8 1.3 10.5 3.3V±0.3V 1.5 4.5 6.7 1 8.2 OPERATING CHARACTERISTICS T =25°C A TEST PARAMETER V TYP UNIT CONDITIONS CC 0.8V 4 1.2V±0.1V 4 1.5V±0.1V 4 C Powerdissipationcapacitance f=10MHz pF pd 1.8V±0.15V 4 2.5V±0.2V 4.1 3.3V±0.3V 4.3 6 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 www.ti.com SCES752C–SEPTEMBER2009–REVISEDMAY2010 PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output UnderTest CL 1 MΩ (see Note A) LOAD CIRCUIT VCC= 0.8V VC±C0=. 11V.2V VC±C0=. 11V.5V VC±C0=.1 15.V8V VC±C0=. 22V.5V VC±C0=. 33V.3V CL 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF VM VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VI VCC VCC VCC VCC VCC VCC tw VCC Input VCC/2 VCC/2 VI 0V Input VM VM 0V VOLTAGEWAVEFORMS PULSE DURATION tPLH tPHL Output VM VM VOH VCC VOL Timing Input VCC/2 0V tPHL tPLH VOH tsu th Output VM VM VCC VOL Data Input VCC/2 VCC/2 0V VOLTAGEWAVEFORMS PROPAGATION DELAYTIMES VOLTAGEWAVEFORMS INVERTING AND NONINVERTING OUTPUTS SETUP AND HOLDTIMES A. C includesprobeandjigcapacitance. L B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutput control.Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbythe outputcontrol. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, for O propagationdelayst/t =3ns,forsetupandholdtimesandpulsewidtht/t =1.2ns. r f r f D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement. E. t andt arethesameast . PLH PHL pd F. Allparametersandwaveformsarenotapplicabletoalldevices. Figure3. LoadCircuitandVoltageWaveforms Copyright©2009–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):SN74AUP2G00

SN74AUP2G00 SCES752C–SEPTEMBER2009–REVISEDMAY2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2xVCC 5 kΩ S1 From Output UnderTest GND TEST S1 CL 5 kΩ tPLZ/tPZL 2xVCC (see Note A) tPHZ/tPZH GND LOAD CIRCUIT VCC= 0.8V VC±C0=. 11V.2V VC±C0=. 11V.5V VC±C0=.1 15.V8V VC±C0=. 22V.5V VC±C0=. 33V.3V CL 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF 5,10,15,30 pF VM VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VI VCC VCC VCC VCC VCC VCC V∆ 0.1V 0.1V 0.1V 0.15V 0.15V 0.3V VCC Output Control VCC/2 VCC/2 0V tPZL tPLZ Output Waveform 1 VCC S1 at 2xVCC VCC/2 VOL+V∆ (see Note B) VOL tPZH tPHZ Output WSa1v eafto GrmN D2 VCC/2 VOH-V∆ VOH ≈0V (see Note B) VOLTAGEWAVEFORMS ENABLE AND DISABLETIMES LOW- AND HIGH-LEVEL ENABLING A. C includesprobeandjigcapacitance. L B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutput control.Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbythe outputcontrol. C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤10MHz,Z =50Ω,t/t =3ns. O r f D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement. E. t andt arethesameast . PLZ PHZ dis F. t andt arethesameast . PLH PHL pd G. Allparametersandwaveformsarenotapplicabletoalldevices. Figure4. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©2009–2010,TexasInstrumentsIncorporated ProductFolderLink(s):SN74AUP2G00

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74AUP2G00DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 H00R & no Sb/Br) SN74AUP2G00DQER ACTIVE X2SON DQE 8 5000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 PN & no Sb/Br) SN74AUP2G00RSER ACTIVE UQFN RSE 8 5000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 85 PN & no Sb/Br) SN74AUP2G00YFPR ACTIVE DSBGA YFP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 HAN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74AUP2G00 : •Automotive: SN74AUP2G00-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AUP2G00DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74AUP2G00DQER X2SON DQE 8 5000 180.0 8.4 1.2 1.6 0.55 4.0 8.0 Q1 SN74AUP2G00RSER UQFN RSE 8 5000 180.0 8.4 1.7 1.7 0.7 4.0 8.0 Q2 SN74AUP2G00YFPR DSBGA YFP 8 3000 178.0 9.2 0.9 1.75 0.6 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AUP2G00DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74AUP2G00DQER X2SON DQE 8 5000 202.0 201.0 28.0 SN74AUP2G00RSER UQFN RSE 8 5000 202.0 201.0 28.0 SN74AUP2G00YFPR DSBGA YFP 8 3000 220.0 220.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE YFP0008 DSBGA - 0.5 mm max height SCALE 10.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D 0.30 0.25 C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.13 SYMM D C SYMM 1.2 D: Max = 1.59 mm, Min = 1.53 mm TYP B E: Max = 0.79 mm, Min = 0.73 mm 0.4 TYP A 8X 0.25 1 2 0.21 0.015 C A B 0.4 TYP 4225242/A 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YFP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP 8X ( 0.23) 1 2 A (0.4) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 50X 0.05 MAX 0.05 MIN METAL UNDER ( 0.23) SOLDER MASK METAL EXPOSED ( 0.23) SOLDER MASK EXPOSED METAL SOLDER MASK OPENING METAL OPENING SOLDER MASK NON-SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4225242/A 08/2019 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YFP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP 8X ( 0.25) (R0.05) TYP 1 2 A (0.4) TYP B SYMM METAL TYP C D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE: 50X 4225242/A 08/2019 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

PACKAGE OUTLINE RSE0008A UQFN - 0.6 mm max height SCALE 7.000 PLASTIC QUAD FLATPACK - NO LEAD 1.55 B 1.45 A PIN 1 INDEX AREA 1.55 1.45 0.6 C 0.5 SEATING PLANE 0.05 0.00 0.05 C 0.35 2X 0.25 0.4 6X 0.3 0.1 C A B (0.12) 0.05 C 2X 0.45 TYP 0.35 4 3 5 2X SYMM 1 0.25 2X 0.15 7 1 0.1 C A B 4X 0.5 0.05 C 8 0.3 SYMM 4X 0.2 0.1 C A B PIN 1 ID 0.05 C (45 X 0.1) 4220323/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT RSE0008A UQFN - 0.6 mm max height PLASTIC QUAD FLATPACK - NO LEAD SYMM (R0.05) TYP 2X (0.6) 8 6X (0.55) 1 7 4X (0.25) SYMM (1.3) 2X 4X (0.5) (0.2) 5 3 4 2X (0.3) (1.35) LAND PATTERN EXAMPLE SCALE:30X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING SOLDER MASK METAL OPENING UNDER SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4220323/B 03/2018 NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN RSE0008A UQFN - 0.6 mm max height PLASTIC QUAD FLATPACK - NO LEAD SYMM (R0.05) TYP 2X (0.6) 8 6X (0.55) 1 7 4X (0.25) SYMM (1.3) 4X (0.5) 2X (0.2) 5 3 4 2X (0.3) (1.35) SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICKNESS SCALE: 30X 4220323/B 03/2018 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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