SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 FEATURES DCT OR DCU PACKAGE • AvailableintheTexasInstruments (TOP VIEW) NanoFree™Package • Operatesat0.8Vto2.7V 1A 1 8 VCC • Sub-1-VOperable 1B 2 7 1C • Maxt of0.5nsat1.8V 2C 3 6 2B pd GND 4 5 2A • LowPowerConsumption,10m Aat2.7V • HighOn-OffOutputVoltageRatio • HighDegreeofLinearity YZP PACKAGE • Latch-UpPerformanceExceeds100mAPer (BOTTOM VIEW) JESD78,ClassII GND 4 5 2A • ESDPerformanceTestedPerJESD22 2C 3 6 2B – 2000-VHuman-BodyModel 1B 2 7 1C (A114-B,ClassII) 1A 1 8 VCC – 200-VMachineModel(A115-A) – 1000-VCharged-DeviceModel(C101) DESCRIPTION/ORDERING INFORMATION This dual analog switch is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.1-V to 2.7-V V CC CC operation. The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V (peak)tobetransmittedineitherdirection. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digitalanddigital-to-analogconversionsystems. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING(2) A NanoFree™–WCSP(DSBGA) Reelof3000 SN74AUC2G66YZPR ___U6_ 0.23-mmLargeBump–YZP(Pb-free) –40(cid:176) Cto85(cid:176) C SSOP–DCT Reelof3000 SN74AUC2G66DCTR U66___ VSSOP–DCU Reelof3000 SN74AUC2G66DCUR U66_ (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. (2) DCT:Theactualtop-sidemarkinghasthreeadditionalcharactersthatdesignatetheyear,month,andassembly/testsite. DCU:Theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite. YZP:Theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing charactertodesignatetheassembly/testsite.Pin1identifierindicatessolder-bumpcomposition(1=SnPb,•=Pb-free). FUNCTIONTABLE CONTROL INPUT SWITCH (C) L OFF H ON Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. NanoFreeisatrademarkofTexasInstruments. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2003–2007,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 LOGICDIAGRAM(POSITIVELOGIC) 1 2 A B 4 C Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange(2) –0.5 3.6 V CC V Inputvoltagerange(2)(3) –0.5 3.6 V I V SwitchI/Ovoltagerange (2)(3) –0.5 V +0.5 V I/O CC I Controlinputclampcurrent V <0 –50 mA IK I I I/Oportdiodecurrent V <0orV >V – 50 mA IOK I/O I/O CC I On-stateswitchcurrent V =0toV – 50 mA T I/O CC ContinuouscurrentthroughV orGND – 100 mA CC DCTpackage 220 q Packagethermalimpedance(4) DCUpackage 227 (cid:176) C/W JA YZPpackage 102 T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Allvoltagesarewithrespecttogroundunlessotherwisespecified. (3) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 2 SubmitDocumentationFeedback

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 Recommended Operating Conditions(1) MIN MAX UNIT V Supplyvoltage 0.8 2.7 V CC V =0.8V V CC CC V High-levelinputvoltage V =1.1Vto1.95V 0.65· V V IH CC CC V =2.3Vto2.7V 1.7 CC V =0.8V 0 CC V Low-levelinputvoltage V =1.1Vto1.95V 0.35· V V IL CC CC V =2.3Vto2.7V 0.7 CC V I/Oportvoltage 0 V V I/O CC V Controlinputvoltage 0 3.6 V I V =0.8Vto1.65V(2) 20 CC D t/D v Inputtransitionriseorfallrate V =1.65Vto2.3V(3) 20 ns/V CC V =2.3Vto2.7V(3) 20 CC T Operatingfree-airtemperature –40 85 (cid:176) C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. (2) ThedatawastakenatC =15pF,R =2kW (seeFigure1). L L (3) ThedatawastakenatC =30pF,R =500W (seeFigure1). L L Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC 1.1V 17 40 r On-stateswitchresistance VVI==VVCCorGND, IS=4mA 1.65V 7 20 W on C IH (seeFigure1andFigure2) I =8mA 2.3V 4 15 S 1.1V 131 180 r Peakonresistance VVI==VVCCtoGND, IS=4mA 1.65V 32 80 W on(p) C IH (seeFigure1andFigure2) I =8mA 2.3V 15 20 S 1.1V 3 D r Donif-fsetraetnecreesoifstance VVI==VVCCtoGND, IS=4mA 1.65V 1 W on C IH betweenswitches (seeFigure1andFigure2) I =8mA 2.3V 1 S V =V andV =GND,or – 1 I CC O I Off-stateswitchleakagecurrent V =GNDandV =V , 2.7V m A S(off) VI =V (seeFigOure3C)C – 0.1(2) C IL I On-stateswitchleakagecurrent VI=VCCorGND,VC=VIH,VO=Open 2.7V – 1 m A S(on) (seeFigure4) – 0.1(2) I Controlinputcurrent V =V orGND 0to2.7V ±5 m A I I CC I Supplycurrent V =V orGND, I =0 0.8Vto2.7V 10 m A CC I CC O C Controlinputcapacitance 2.5V 2.5 pF ic C Switchinput/outputcapacitance 2.5V 3 pF io(off) C Switchinput/outputcapacitance 2.5V 7 pF io(on) (1) t =25(cid:176) C a (2) ThedatawastakenatC =15pF,R =2kW (seeFigure1). L L SubmitDocumentationFeedback 3

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =15pF(unlessotherwisenoted)(seeFigure5) L V =1.2V V =1.5V V =1.8V V =2.5V PARAMETER FROM TO VCC=0.8V C±C0.1V C±C0.1V C±C0.15V C±C0.2V UNIT (INPUT) (OUTPUT) TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX t (1) AorB BorA 1 0.6 0.5 0.5 0.4 ns pd t C AorB 5 0.5 3 0.5 2.1 0.5 0.9 1.6 0.5 1.4 ns en t C AorB 5.3 0.5 4 0.5 3 0.5 2.6 3.3 0.5 2.7 ns dis (1) ThepropagationdelayisthecalculatedRCtimeconstantofthetypicalon-stateresistanceoftheswitchandthespecifiedload capacitancewhendrivenbyanidealvoltagesource(zerooutputimpedance). Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =30pF(unlessotherwisenoted)(seeFigure5) L V =1.8V V =2.5V CC CC PARAMETER FROM TO – 0.15V – 0.2V UNIT (INPUT) (OUTPUT) MIN TYP MAX MIN MAX t (1) AorB BorA 0.7 0.7 ns pd t C AorB 0.5 1.6 2.7 0.5 2.3 ns en t C AorB 0.5 2.7 3.4 0.5 2 ns dis (1) ThepropagationdelayisthecalculatedRCtimeconstantofthetypicalon-stateresistanceoftheswitchandthespecifiedload capacitancewhendrivenbyanidealvoltagesource(zerooutputimpedance). Analog Switch Characteristics T =25(cid:176) C A FROM TO PARAMETER TESTCONDITIONS V TYP UNIT (INPUT) (OUTPUT) CC 0.8V 101 C =50pF,R =600W , 1.1V 150 L L f =sinewave 1.4V 175 in (seeFigure6) 1.65V 250 Frequencyresponse 2.3V 400 AorB BorA MHz (switchON) 0.8V 450 C =5pF,R =50W , 1.1V >500 L L f =sinewave 1.4V >500 in (seeFigure6) 1.65V >500 2.3V >500 0.8V –60 C =50pF,R =600W , 1.1V –60 L L f =1MHz(sinewave) 1.4V –60 in (seeFigure7) 1.65V –60 Crosstalk 2.3V –60 AorB BorA dB (betweenswitches) 0.8V –65 C =5pF,R =50W , 1.1V –65 L L f =1MHz(sinewave) 1.4V –65 in (seeFigure7) 1.65V –65 2.3V –65 4 SubmitDocumentationFeedback

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 Analog Switch Characteristics (continued) T =25(cid:176) C A FROM TO PARAMETER TESTCONDITIONS V TYP UNIT (INPUT) (OUTPUT) CC 0.8V 9 Crosstalk C =50pF,R =600W , 1.1V 14 L L (controlinputtosignal C AorB f =1MHz(squarewave) 1.4V 15 mV in output) (seeFigure8) 1.65V 16 2.3V 20 0.8V –50 C =50pF,R =600W , 1.1V –50 L L f =1MHz(sinewave) 1.4V –50 in (seeFigure9) 1.65V –50 Feedthroughattenuation 2.3V –50 AorB BorA dB (switchOFF) 0.8V –60 C =5pF,R =50W , 1.1V –60 L L f =1MHz(sinewave) 1.4V –60 in (seeFigure9) 1.65V –60 2.3V –60 0.8V 7 C =50pF,R =10kW , 1.1V 0.256 L L AorB BorA f =1kHz(sinewave) 1.4V 0.04 in (seeFigure10) 1.65V 0.03 2.3V 0.01 Sine-wavedistortion % 0.8V 3.7 C =50pF,R =10kW , 1.1V 0.4 L L AorB BorA f =10kHz(sinewave) 1.4V 0.04 in (seeFigure10) 1.65V 0.02 2.3V 0.02 Operating Characteristics T =25(cid:176) C A TEST VCC=0.8V VCC=1.2V VCC=1.5V VCC=1.8V VCC=2.5V PARAMETER UNIT CONDITIONS TYP TYP TYP TYP TYP Powerdissipation C f=10MHz 2.5 2.5 2.5 2.5 2.5 pF pd capacitance SubmitDocumentationFeedback 5

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VCC VCC A or B B or A VI = VCC or GND VO C VIH VC (ON) GND IS V (cid:1)V V ron(cid:2) I I O (cid:1) S VI – VO Figure1.On-StateResistanceTestCircuit 120 100 VCC = 1.1 V 80 60 40 VCC = 1.65 V 20 VCC = 2.3 V 0 0 1 2 3 Figure2.Typicalr asaFunctionofVoltage(V)forV =0toV on I I CC 6 SubmitDocumentationFeedback

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VCC VCC A or B B or A VI A VO C VIL VC (OFF) GND Condition 1: VI = GND, VO = VCC Condition 2: VI = VCC, VO = GND Figure3.Off-StateSwitchLeakage-CurrentTestCircuit VCC VCC A or B B or A VI = VCC or GND A VO VO = Open C VIH VC (ON) GND Figure4.On-StateLeakage-CurrentTestCircuit SubmitDocumentationFeedback 7

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VLOAD From Output RL S1 Open TEST S1 Under Test GND tPLH/tPHL Open (see Note CAL) RL tPLZ/tPZL VLOAD tPHZ/tPZH GND LOAD CIRCUIT INPUTS VCC VI tr/tf VM VLOAD CL RL VD 0.8 V VCC ≤2 ns VCC/2 2 × VCC 15 pF 2 kW 0.1 V 1.2 V ± 0.1 V VCC ≤2 ns VCC/2 2 × VCC 15 pF 2 kW 0.1 V 1.5 V ± 0.1 V VCC ≤2 ns VCC/2 2 × VCC 15 pF 2 kW 0.1 V 1.8 V ± 0.15 V VCC ≤2 ns VCC/2 2 × VCC 15 pF 2 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 15 pF 2 kW 0.15 V 1.8 V ± 0.15 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V VI Timing Input VM 0 V tw VI tsu th VI Input VM VM Data Input VM VM 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES VI VI Output Input VM VM Control VM VM 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 VLOAD/2 Output VM VM VOL (Ss1e ea tN VoLteO ABD) VM VOL + VD VOL tPHL tPLH tPZH tPHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH − VD VOH VOL (see Note B) ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W , slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure5.LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VCC VCC 0.1 m F A or B B or A VO fin 50 W VIH VCC RL CL (ON) GND VCC/2 RL/CL: 600 W / 50 pF RL/CL: 50 W / 5 pF Figure6.FrequencyResponse(SwitchON) VCC VCC 0.1 m F 1A or 1B 1B or 1A VO1 Rin 600 W C RL CL fin 50 W VIH VC 600 W 50 pF (On) VCC/2 2A or 2B 2B or 2A VO2 R60in0 W VIL VCC R60L0 W C50L pF (Off) GND VCC/2 20log10(VO2/VI1) or 20log10(VO1/VI2) Figure7.Crosstalk(BetweenSwitches) SubmitDocumentationFeedback 9

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VCC VCC Rin 600 W A or B B or A VCC/2 VO C RL CL 600 W 50 pF VC GND 50 W VCC/2 Figure8.Crosstalk(ControlInput–SwitchOutput) VCC VCC 0.1 m F A or B B or A VO fin 50 W RL VIL VCC RL CL (OFF) GND VCC/2 VCC/2 RL/CL: 600 W / 50 pF RL/CL: 50 W / 5 pF Figure9.Feedthrough,SwitchOff 10 SubmitDocumentationFeedback

SN74AUC2G66 DUAL BILATERAL ANALOG SWITCH www.ti.com SCES507A–NOVEMBER2003–REVISEDJANUARY2007 PARAMETER MEASUREMENT INFORMATION VCC VCC 10 m F 10 m F A or B B or A VO C RL CL fin 600 W VIH VC 10 kW 50 pF (ON) GND VCC/2 VCC = 0.8 V, VI = 0.7 VP-P VCC = 1.1 V, VI = 1 VP-P VCC = 1.4 V, VI = 1.2 VP-P VCC = 1.65 V, VI = 1.4 VP-P VCC = 2.3 V, VI = 2 VP-P Figure10.Sine-WaveDistortion SubmitDocumentationFeedback 11

PACKAGE OPTION ADDENDUM www.ti.com 20-Jun-2017 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74AUC2G66DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 U66 & no Sb/Br) (R ~ Z) SN74AUC2G66DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (66 ~ U66Q ~ U66R) & no Sb/Br) (UR ~ UZ) SN74AUC2G66DCURE4 ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 U66R & no Sb/Br) SN74AUC2G66DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 U66R & no Sb/Br) SN74AUC2G66YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 U6N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 20-Jun-2017 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AUC2G66DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3 SN74AUC2G66DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74AUC2G66DCUR VSSOP DCU 8 3000 180.0 9.0 2.05 3.3 1.0 4.0 8.0 Q3 SN74AUC2G66DCURG4 VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74AUC2G66YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AUC2G66DCTR SM8 DCT 8 3000 182.0 182.0 20.0 SN74AUC2G66DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74AUC2G66DCUR VSSOP DCU 8 3000 182.0 182.0 20.0 SN74AUC2G66DCURG4 VSSOP DCU 8 3000 202.0 201.0 28.0 SN74AUC2G66YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 PackMaterials-Page2

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MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,65 0,13 M 0,15 8 5 0,15 NOM 2,90 4,25 ÇÇÇÇÇ 2,70 3,75 ÇÇÇÇÇ ÇÇÇÇÇ Gage Plane ÇÇÇÇÇ PIN 1 INDEX AREA 0,25 1 4 0°– 8° 3,15 0,60 2,75 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 4188781/C 09/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion D. Falls within JEDEC MO-187 variation DA. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OUTLINE YZP0008 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP D C SYMM 1.5 D: Max = 1.918 mm, Min =1 .858 mm TYP B E: Max = 0.918 mm, Min =0 .858 mm 0.5 TYP A 0.25 8X 1 2 0.21 0.015 C A B SYMM 4223082/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.23) 1 2 A (0.5) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE SCALE:40X SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23) OPENING SOLDER MASK OPENING ( 0.23) METAL METAL UNDER SOLDER MASK NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4223082/A 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM C METAL TYP D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4223082/A 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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