SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D–APRIL1999–REVISEDJULY2004 FEATURES • –24-mA OutputDriveat3.3V • Operatesfrom1.65Vto3.6V • Latch-UpPerformanceExceeds250mAPer • Maxt of3.4nsat3.3V JESD17 pd DGV, DW, NS, OR PW PACKAGE RGY PACKAGE (TOP VIEW) (TOP VIEW) R C DIR 1 20 VCC DI VC A1 2 19 OE 1 20 A2 3 18 B1 A1 2 19 OE A3 4 17 B2 A2 3 18 B1 A4 5 16 B3 A3 4 17 B2 A5 6 15 B4 A4 5 16 B3 A6 7 14 B5 A5 6 15 B4 A7 8 13 B6 A6 7 14 B5 A8 9 12 B7 A7 8 13 B6 GND 10 11 B8 A8 9 12 B7 10 11 D 8 N B G DESCRIPTION/ORDERING INFORMATION Thisoctalbustransceiverisdesignedfor1.65-Vto3.6-VV operation. CC The SN74ALVC245 is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectivelyisolated. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING A QFN-RGY Tapeandreel SN74ALVC245RGYR VA245 Tube SN74ALVC245DW SOIC-DW ALVC245 Tapeandreel SN74ALVC245DWR -40(cid:176)C to85(cid:176)C SOP-NS Tapeandreel SN74ALVC245NSR ALVC245 Tube SN74ALVC245PW TSSOP-PW VA245 Tapeandreel SN74ALVC245PWR TVSOP-DGV Tapeandreel SN74ALVC245DGVR VA245 (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1999–2004,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D–APRIL1999–REVISEDJULY2004 FUNCTIONTABLE INPUTS OPERATION OE DIR L L BdatatoAbus L H AdatatoBbus H X Isolation LOGICDIAGRAM(POSITIVELOGIC) 1 DIR 19 OE 2 A1 18 B1 To Seven Other Channels ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange -0.5 4.6 V CC ExceptI/Oports(2) -0.5 4.6 V Inputvoltagerange V I I/Oports(2)(3) -0.5 V +0.5 CC V Outputvoltagerange(2)(3) -0.5 V +0.5 V O CC I Inputclampcurrent V <0 -50 mA IK I I Outputclampcurrent V <0 -50 mA OK O I Continuousoutputcurrent –50 mA O ContinuouscurrentthroughV orGND –100 mA CC DGVpackage(4) 92 DWpackage(4) 58 q Packagethermalimpedance NSpackage(4) 60 (cid:176)C/W JA PWpackage(4) 83 RGYpackage(5) 37 T Storagetemperaturerange -65 150 (cid:176)C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) Thisvalueislimitedto4.6V,maximum. (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. (5) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-5. 2

SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D–APRIL1999–REVISEDJULY2004 RECOMMENDED OPERATING CONDITIONS(1) MIN MAX UNIT V Supplyvoltage 1.65 3.6 V CC V =1.65Vto1.95V 0.65· V CC CC V High-levelinputvoltage V =2.3Vto2.7V 1.7 V IH CC V =2.7Vto3.6V 2 CC V =1.65Vto1.95V 0.35· V CC CC V Low-levelinputvoltage V =2.3Vto2.7V 0.7 V IL CC V =2.7Vto3.6V 0.8 CC V Inputvoltage 0 V V I CC V Outputvoltage 0 V V O CC V =1.65V -4 CC V =2.3V -12 CC I High-leveloutputcurrent mA OH V =2.7V -12 CC V =3V -24 CC V =1.65V 4 CC V =2.3V 12 CC I Low-leveloutputcurrent mA OL V =2.7V 12 CC V =3V 24 CC Dt/Dv Inputtransitionriseorfallrate 10 ns/V T Operatingfree-airtemperature -40 85 (cid:176)C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 3

SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D–APRIL1999–REVISEDJULY2004 ELECTRICAL CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC I =-100mA 1.65Vto3.6V V -0.2 OH CC I =-4mA 1.65V 1.2 OH I =-6mA 2.3V 2 OH V 2.3V 1.7 V OH I =-12mA 2.7V 2.2 OH 3V 2.4 I =-24mA 3V 2 OH I =100mA 1.65Vto3.6V 0.2 OL I =4mA 1.65V 0.45 OL I =6mA 2.3V 0.4 OL V V OL 2.3V 0.7 I =12mA OL 2.7V 0.4 I =24mA 3V 0.55 OL I V =V orGND 3.6V –5 mA I I CC I (2) V =V orGND 3.6V –10 mA OZ O CC I V =V orGND,I =0 3.6V 10 mA CC I CC O DI OneinputatV -0.6V,OtherinputsatV orGND 3Vto3.6V 750 mA CC CC CC C Controlinputs V =V orGND 3.3V 4.5 pF i I CC C AorBports V =V orGND 3.3V 11.5 pF io O CC (1) AlltypicalvaluesareatV =3.3V,T =25(cid:176)C. CC A (2) ForI/Oports,theparameterI includestheinputleakagecurrent. OZ SWITCHING CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) V =1.8V V =2.5V V =3.3V PARAMETER FROM TO C– C0.15V C–C0.2V VCC=2.7V C–C0.3V UNIT (INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX t AorB BorA 1.5 6 1 3.5 3.6 1.3 3.4 ns pd t OE AorB 3.4 8.6 2 6 6.3 1.6 5.5 ns en t OE AorB 2.7 8 1 4.8 5.3 1.7 5.5 ns dis OPERATING CHARACTERISTICS T =25(cid:176)C A V =1.8V V =2.5V V =3.3V CC CC CC PARAMETER TESTCONDITIONS UNIT TYP TYP TYP Powerdissipation Outputsenabled 25 27 30 C C =0pF,f=10MHz pF pd capacitancepertransceiver Outputsdisabled L 0 0 0 4

SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D–APRIL1999–REVISEDJULY2004 PARAMETER MEASUREMENT INFORMATION VLOAD From Output RL S1 Open TEST S1 Under Test GND tpd Open (see Note CAL) RL ttPPHLZZ//ttPPZZLH VGLNOADD LOAD CIRCUIT INPUT VCC VM VLOAD CL RL VD VI tr/tf 1.8 V ± 0.15 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V 2.7 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V 3.3 V ± 0.3 V 2.7 V ≤2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V tw VI Timing VI Input VM VM Input VM 0 V 0 V VOLTAGE WAVEFORMS PULSE DURATION tsu th IDnpautat VM VM VI COounttpruotl VI 0 V (low-level VM VM enabling) 0 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES tPZL tPLZ Output VI Waveform 1 VLOAD/2 Input VM VM S1 at VLOAD VM VOL + VD 0 V (see Note B) VOL tPLH tPHL tPZH tPHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH − VD VOH VOL (see Note B) 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure1.LoadCircuitandVoltageWaveforms 5

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74ALVC245DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 VA245 & no Sb/Br) SN74ALVC245DW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC245 & no Sb/Br) SN74ALVC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC245 & no Sb/Br) SN74ALVC245NSR ACTIVE SO NS 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC245 & no Sb/Br) SN74ALVC245PW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 VA245 & no Sb/Br) SN74ALVC245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 VA245 & no Sb/Br) SN74ALVC245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 VA245 & no Sb/Br) SN74ALVC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 VA245 & no Sb/Br) SN74ALVC245RGYR ACTIVE VQFN RGY 20 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 VA245 & no Sb/Br) SN74ALVC245RGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 VA245 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74ALVC245DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74ALVC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74ALVC245NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74ALVC245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74ALVC245RGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74ALVC245DGVR TVSOP DGV 20 2000 367.0 367.0 35.0 SN74ALVC245DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74ALVC245NSR SO NS 20 2000 367.0 367.0 45.0 SN74ALVC245PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74ALVC245RGYR VQFN RGY 20 3000 367.0 367.0 35.0 PackMaterials-Page2

MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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GENERIC PACKAGE VIEW RGY 20 VQFN - 1 mm max height 3.5 x 4.5, 0.5 mm pitch PLASTIC QUAD FGLATPACK - NO LEAD This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4225264/A www.ti.com

PACKAGE OUTLINE RGY0020A VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD A 3.65 B 3.35 PIN 1 INDEX AREA 4.65 4.35 1.0 0.8 C SEATING PLANE 0.05 0.00 0.08 C 2.05 0.1 2X 1.5 (0.2) TYP 10 11 EXPOSED THERMAL PAD 9 12 14X 0.5 2X SYMM 21 3.05 0.1 3.5 2 19 0.30 PIN 1 ID 1 20 20X 0.18 SYMM 0.1 C A B 0.5 0.05 20X 0.3 4225320/A 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RGY0020A VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD (2.05) SYMM 1 20 20X (0.6) 2 19 20X (0.24) (1.275) (4.3) SYMM 21 (3.05) 14X (0.5) (0.775) 9 12 (R0.05) TYP ( 0.2) TYP VIA 10 11 (0.75) TYP (3.3) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING EXPOSED METAL SOLDER MASK EXPOSED METAL UNDER OPENING METAL SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4225320/A 09/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RGY0020A VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD SYMM 4X (0.92) 1 20 (R0.05) TYP 20X (0.6) 2 19 20X (0.24) 4X (1.33) 21 SYMM (4.3) (0.77) 14X (0.5) (0.56) 9 12 METAL TYP 10 11 (0.75) TYP (3.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 21 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4225320/A 09/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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