Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 SNx4AHCT244 Octal Buffers/Drivers With 3-State Outputs 1 Features 3 Description • InputsAreTTL-VoltageCompatible These octal buffers/drivers are designed specifically 1 to improve both the performance and density of • Latch-UpPerformanceExceeds250mA 3-state memory-address drivers, clock drivers, and PerJESD17 bus-orientedreceiversandtransmitters. • OnProductsComplianttoMIL-PRF-38535, AllParametersAreTestedUnlessOtherwise DeviceInformation(1) Noted.OnAllOtherProducts,Production PARTNUMBER PACKAGE BODYSIZE(NOM) ProcessingDoesNotNecessarilyIncludeTesting PDIP(20) 25.40mmx6.35mm ofAllParameters. SOP(20) 12.60mmx5.30mm SNx4AHCT244 SSOP(20) 7.50mmx5.30mm 2 Applications TVSOP(20) 5.00mmx4.40mm • NetworkSwitches TSSOP(20) 6.50mmx4.40mm • PowerInfrastructures (1) For all available packages, see the orderable addendum at theendofthedatasheet. • PCsandNotebooks • WearableHealthandFitnessDevices • TestsandMeasurements 4 Simplified Schematic 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9.1 Overview...................................................................8 2 Applications........................................................... 1 9.2 FunctionalBlockDiagram.........................................8 3 Description............................................................. 1 9.3 FeatureDescription...................................................8 9.4 DeviceFunctionalModes..........................................8 4 SimplifiedSchematic............................................. 1 10 ApplicationandImplementation.......................... 9 5 RevisionHistory..................................................... 2 10.1 ApplicationInformation............................................9 6 PinConfigurationandFunctions......................... 3 10.2 TypicalApplication .................................................9 7 Specifications......................................................... 4 11 PowerSupplyRecommendations..................... 10 7.1 AbsoluteMaximumRatings......................................4 12 Layout................................................................... 10 7.2 HandlingRatings.......................................................4 12.1 LayoutGuidelines.................................................10 7.3 RecommendedOperatingConditions.......................4 12.2 LayoutExample....................................................10 7.4 ThermalInformation..................................................4 13 DeviceandDocumentationSupport................. 11 7.5 ElectricalCharacteristics...........................................5 7.6 SwitchingCharacteristics..........................................5 13.1 RelatedLinks........................................................11 7.7 NoiseCharacteristics................................................5 13.2 Trademarks...........................................................11 7.8 OperatingCharacteristics..........................................6 13.3 ElectrostaticDischargeCaution............................11 7.9 TypicalCharacteristics..............................................6 13.4 Glossary................................................................11 8 ParameterMeasurementInformation..................7 14 Mechanical,Packaging,andOrderable Information........................................................... 11 9 DetailedDescription.............................................. 8 5 Revision History ChangesfromRevisionL(July2003)toRevisionM Page • UpdateddocumenttonewTIdatasheetformat.................................................................................................................... 1 • RemovedOrderingInformationtable..................................................................................................................................... 1 • AddedMilitaryDisclaimertoFeaturesList ............................................................................................................................ 1 • AddedHandlingRatingstable. .............................................................................................................................................. 4 • ChangedMAXoperatingtemperaturefrom85°Cto125°CinRecommendedOperatingConditionstable..........................4 • AddedThermalInformationtable. ......................................................................................................................................... 4 • AddedTypicalCharacteristicssection................................................................................................................................... 6 • AddedDetailedDescriptionsection....................................................................................................................................... 8 • AddedApplicationandImplementationsection. ................................................................................................................... 9 • AddedLayoutsection. ......................................................................................................................................................... 10 2 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 www.ti.com SCLS228M–OCTOBER1995–REVISEDJULY2014 6 Pin Configuration and Functions SN54AHCT244...JORWPACKAGE SN74AHCT244...DB,DGV,DW,N,NS,ORPWPACKAGE (TOPVIEW) 1OE 1 20 VCC 1A1 2 19 2OE 2Y4 3 18 1Y1 1A2 4 17 2A4 2Y3 5 16 1Y2 1A3 6 15 2A3 2Y2 7 14 1Y3 1A4 8 13 2A2 2Y1 9 12 1Y4 GND 10 11 2A1 SN54AHCT244...FKPACKAGE (TOPVIEW) 41E CE YAO CO 211V 2 3 2 1 2019 1A2 4 18 1Y1 2Y3 5 17 2A4 1A3 6 16 1Y2 2Y2 7 15 2A3 1A4 8 14 1Y3 9 10111213 1D142 YNAYA 2G212 PinFunctions PIN I/O DESCRIPTION NO. NAME 1 1OE I OutputEnable1 2 1A1 I Input1A1 3 2Y4 O Input2Y4 4 1A2 I Input1A2 5 2Y3 O Input2Y3 6 1A3 I Input1A3 7 2Y2 O Input2Y2 8 1A4 I Input1A4 9 2Y1 O Input2Y1 10 GND – GroundPin 11 2A1 I Output2A1 12 1Y4 O Output1Y4 13 2A2 I Output2A2 14 1Y3 O Output1Y3 15 2A3 I Output2A3 16 1Y2 O Output1Y2 17 2A4 I Output2A4 18 1Y1 O Output1Y1 19 2OE I OutputEnable2 20 VCC – PowerPin Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 7 V CC V Inputvoltagerange(2) –0.5 7 V I V Outputvoltagerange(2) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –20 mA IK I I Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthroughV orGND ±75 mA CC (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –65 150 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all pins(1) 0 2000 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecification JESD22-C101,allpins(2) 0 2000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions(1) SN54AHCT244 SN74AHCT244 UNIT MIN MAX MIN MAX V Supplyvoltage 4.5 5.5 4.5 5.5 V CC V High-levelinputvoltage 2 2 V IH V Low-levelinputvoltage 0.8 0.8 V IL V Inputvoltage 0 5.5 0 5.5 V I V Outputvoltage 0 V 0 V V O CC CC I High-leveloutputcurrent –8 –8 mA OH I Low-leveloutputcurrent 8 8 mA OL T Operatingfree-airtemperature –55 125 –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs(SCBA004). 7.4 Thermal Information SN74AHCT244 THERMALMETRIC(1) DB DGV DW N NS PW UNIT 20PINS 20PINS 20PINS 20PINS 20PINS 20PINS RθJA Junction-to-ambientthermalresistance 99.9 119.2 83.0 54.9 80.4 105.4 RθJC(top) Junction-to-case(top)thermalresistance 61.7 34.5 48.9 41.7 46.9 39.5 RθJB Junction-to-boardthermalresistance 55.2 60.7 50.5 35.8 47.9 56.4 °C/W ψJT Junction-to-topcharacterizationparameter 22.6 1.2 21.1 27.9 19.9 3.1 ψJB Junction-to-boardcharacterizationparameter 54.8 60.0 50.1 35.7 47.5 55.8 (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 4 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 www.ti.com SCLS228M–OCTOBER1995–REVISEDJULY2014 7.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) T =25°C SN54AHCT244 SN74AHCT244 A PARAMETER TESTCONDITIONS V UNIT CC MIN TYP MAX MIN MAX MIN MAX I =–50µA 4.4 4.5 4.4 4.4 OH V 4.5V V OH I =–8mA 3.94 3.8 3.8 OH I =50µA 0.1 0.1 0.1 OL V 4.5V V OL I =8mA 0.36 0.44 0.44 OL V =V orGND ±0.2 I O CC 5.5V ±2.5 ±2.5 µA OZ 5 I V =5.5VorGND 0Vto ±0.1 ±1(1) ±1 µA I I 5.5V V =V or I =0 I I CC O 5.5V 4 40 40 µA CC GND, Oneinputat3.4V, ∆I (2) OtherinputsatV or 5.5V 1.35 1.5 1.5 mA CC CC GND C V =V orGND 5V 2.5 10 10 pF i I CC C V =V orGND 5V 3 pF o O CC (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontestedatV =0V. CC (2) ThisistheincreaseinsupplycurrentforeachinputatoneofthespecifiedTTLvoltagelevels,ratherthan0VorV . CC 7.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V±0.5V(unlessotherwisenoted)(seeFigure2) CC FROM TO LOAD TA=25°C SN54AHCT244 SN74AHCT244 PARAMETER UNIT (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX t 5.4(1) 7.4(1) 1(1) 8.5(1) 1 8.5 PLH A Y C =15pF ns t L 5.4(1) 7.4(1) 1(1) 8.5(1) 1 8.5 PHL t 7.7(1) 10.4(1) 1(1) 12(1) 1 12 PZH OE Y C =15pF ns t L 7.7(1) 10.4(1) 1(1) 12(1) 1 12 PZL t 5(1) 9.4(1) 1(1) 10(1) 1 10 PHZ OE Y C =15pF ns t L 5(1) 9.4(1) 1(1) 10(1) 1 10 PLZ t 5.9 8.4 1 9.5 1 9.5 PLH A Y C =50pF ns L t 5.9 8.4 1 9.5 1 9.5 PHL t 8.2 11.4 1 13 1 13 PZH OE Y C =50pF ns L t 8.2 11.4 1 13 1 13 PZL t 8.8 11.4 1 13 1 13 PHZ OE Y C =50pF ns L t 8.8 11.4 1 13 1 13 PLZ t C =50pF 1(2) 1 ns sk(o) L (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. (2) OnproductscomplianttoMIL-PRF-38535,thisparameterdoesnotapply. 7.7 Noise Characteristics(1) V =5V,C =50pF,T =25°C CC L A SN74AHCT244 PARAMETER UNIT MIN TYP MAX V Quietoutput,minimumdynamicV 4.1 V OH(V) OH V High-leveldynamicinputvoltage 2 V IH(D) V Low-leveldynamicinputvoltage 0.8 V IL(D) (1) Characteristicsareforsurface-mountpackagesonly. Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 www.ti.com 7.8 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload, f=1MHz 8.2 pF pd 7.9 Typical Characteristics 7 TPD in ns 6 5 s) 4 n D ( P 3 T 2 1 0 -100 -50 0 50 100 150 Temperature (°C) D001 Figure1.TPDvsTemperature,15pFLoad 6 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 www.ti.com SCLS228M–OCTOBER1995–REVISEDJULY2014 8 Parameter Measurement Information VCC FromOutput Test FromOutput RL=1kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (seeNoteA) (seeNoteA) tPHZ/tPZH GND OpenDrain VCC LOADCIRCUITFOR LOADCIRCUITFOR TOTEM-POLEOUTPUTS 3-STATEANDOPEN-DRAINOUTPUTS 3V TimingInput 1.5V tw 0V th 3V tsu 3V Input 1.5V 1.5V DataInput 1.5V 1.5V 0V 0V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPANDHOLDTIMES 3V 3V Output Input 1.5V 1.5V 1.5V 1.5V Control 0V 0V tPLH tPHL tPZL tPLZ Output VOH Waveform1 ≈VCC InO-Puhtapsuet 50%VCC 50%VCC S1atVCC 50%VCC VOL+0.3V VOL (seeNoteB) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50%VCC 50%VCVVCOOHL (WseSae1veNaftooGtremNBD2) 50%VCC VOH–0.3VV≈0OVH VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEANDDISABLETIMES INVERTINGANDNONINVERTINGOUTPUTS LOW-ANDHIGH-LEVELENABLING NOTES: A. CLincludesprobeandjigcapacitance. B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislowexceptwhendisabledbytheoutputcontrol. Waveform2isforanoutputwithinternalconditionssuchthattheoutputishighexceptwhendisabledbytheoutputcontrol. C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics: PRR≤1MHz,ZO=50Ω,tr≤3ns,tf≤3ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. Allparametersandwaveformsarenotapplicabletoalldevices. Figure2. LoadCircuitandVoltageWaveforms Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 www.ti.com 9 Detailed Description 9.1 Overview The SNx4AHCT244 devices are organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs.WhenOEislow,thedevicepassesdatafromtheAinputstotheYoutputs.When OEishigh,theoutputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current- sinkingcapabilityofthedriver. 9.2 Functional Block Diagram 1 DIR 19 OE 2 A1 18 B1 To Seven Other Channels 9.3 Feature Description • V isoptimizedat5V CC • Allowsupvoltagetranslationfrom3.3Vto5V – InputsAcceptV levelsof2V IH • Slowedgeratesminimizeoutputringing • InputsareTTL-Voltagecompatible 9.4 Device Functional Modes Table1.FunctionTable (Each4-BitBuffer/Driver) INPUTS OUTPUT OE A Y L H H L L L H X Z 8 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 www.ti.com SCLS228M–OCTOBER1995–REVISEDJULY2014 10 Application and Implementation 10.1 Application Information The SN74AHCT244 is a low-drive CMOS device that can be used for a multitude of bus interface type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on the outputs. The input switching levels have been lowered to accommodate TTL inputs of 0.8-V V and 2-V V . This feature makes it ideal for translating up from 3.3 V to 5 V. Figure 3 shows this type of IL IH translation. 10.2 Typical Application Regulated 3.3 V 5-VRegulated OE VCC 5-V Sub-system A1 Y1 µC µµCC SSyysstteemm LLooggiicc SSyysstteemm LLooggiicc LEDs A4 Y4 GND Figure3. SpecificApplicationSchematic 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloadssoroutingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. RecommendedInputconditions – Risetimeandfalltimespecs.See(Δt/ΔV)intheRecommendedOperatingConditionstable. – Specifiedhighandlowlevels.See(V andV )intheRecommendedOperatingConditions table. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV CC 2. Recommendoutputconditions – Loadcurrentsshouldnotexceed25mAontheoutputand50mAtotalforthepart – OutputsshouldnotbepulledaboveV CC Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 SCLS228M–OCTOBER1995–REVISEDJULY2014 www.ti.com Typical Application (continued) 10.2.3 ApplicationCurves Output Input Figure4.ApplicationCurve 11 Power Supply Recommendations The power supply can be any voltage between the Min and Max supply voltage rating located in the RecommendedOperatingConditionstable. Each V pin should have a good bypass capacitor to prevent power disturbance. For devices with a single CC supply, 0.1 μF is recommended; if there are multiple V pins, then 0.01 μF or 0.022 μF is recommended for CC each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and a 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 12 Layout 12.1 Layout Guidelines Whenusingmultiple-bitlogicdevices,inputsshouldneverfloat. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Figure 5 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V , whichever makes more sense or is more convenient. It is generally acceptable to float outputs, CC unlessthepartisatransceiver.Ifthetransceiverhasanoutputenablepin,itwilldisabletheoutputsectionofthe partwhenasserted.ThiswillnotdisabletheinputsectionoftheI/Os,sotheycannotfloatwhendisabled. 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure5. LayoutDiagram 10 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHCT244 SN74AHCT244

SN54AHCT244,SN74AHCT244 www.ti.com SCLS228M–OCTOBER1995–REVISEDJULY2014 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54AHCT244 Clickhere Clickhere Clickhere Clickhere Clickhere SN74AHCT244 Clickhere Clickhere Clickhere Clickhere Clickhere 13.2 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 13.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54AHCT244 SN74AHCT244

PACKAGE OPTION ADDENDUM www.ti.com 28-Jul-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) 5962-9678301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9678301Q2A SNJ54AHCT 244FK 5962-9678301QRA ACTIVE CDIP J 20 1 TBD SNPB N / A for Pkg Type -55 to 125 5962-9678301QR A SNJ54AHCT244J 5962-9678301QSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9678301QS A SNJ54AHCT244W SN74AHCT244DBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244DW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AHCT244 & no Sb/Br) SN74AHCT244DWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AHCT244 & no Sb/Br) SN74AHCT244N ACTIVE PDIP N 20 20 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 SN74AHCT244N (RoHS) SN74AHCT244NSR ACTIVE SO NS 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AHCT244 & no Sb/Br) SN74AHCT244PW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) SN74AHCT244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 HB244 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 28-Jul-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) Ball material (3) (4/5) (6) SNJ54AHCT244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9678301Q2A SNJ54AHCT 244FK SNJ54AHCT244J ACTIVE CDIP J 20 1 TBD SNPB N / A for Pkg Type -55 to 125 5962-9678301QR A SNJ54AHCT244J SNJ54AHCT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9678301QS A SNJ54AHCT244W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 28-Jul-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHCT244, SN74AHCT244 : •Catalog: SN74AHCT244 •Automotive: SN74AHCT244-Q1, SN74AHCT244-Q1 •Enhanced Product: SN74AHCT244-EP, SN74AHCT244-EP •Military: SN54AHCT244 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications •Military - QML certified for Military and Defense Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AHCT244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74AHCT244DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHCT244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74AHCT244NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74AHCT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 SN74AHCT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74AHCT244PWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AHCT244DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74AHCT244DGVR TVSOP DGV 20 2000 367.0 367.0 35.0 SN74AHCT244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74AHCT244NSR SO NS 20 2000 367.0 367.0 45.0 SN74AHCT244PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74AHCT244PWR TSSOP PW 20 2000 364.0 364.0 27.0 SN74AHCT244PWRG4 TSSOP PW 20 2000 367.0 367.0 38.0 PackMaterials-Page2

None

PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

None

None

MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

None

None

None

PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

None

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated