Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 SN74AHCT16245 16-Bit Bus Transceivers With 3-State Outputs 1 Features 3 Description • MembersofTexasInstruments’ The SN74AHCT16245 device is a 16-bit (dual-octal) 1 noninverting 3-state transceiver designed for Widebus™Family synchronous two-way communication between data • InputsareTTL-VoltageCompatible buses. • DistributedV andGNDPinsMinimize CC High-SpeedSwitchingNoise DeviceInformation(1) • Flow-ThroughArchitectureOptimizesPCBLayout PARTNUMBER PACKAGE BODYSIZE(NOM) • Latch-UpPerformanceExceeds250mA TVSOP(48) 9.70mm×4.40mm PerJESD17 SN74AHCT16245 SSOP(48) 15.80mm×7.50mm TSSOP(48) 12.50mm×6.10mm 2 Applications (1) For all available packages, see the orderable addendum at • TelecomandWirelessInfrastructures theendofthedatasheet. • ElectronicPointsofSale • PrintersandOtherPeripherals • MotorDrives • HealthandFitness 4 Simplified Schematic 1OE G3 1DIR 3EN1[BA] 3EN2[AB] 2OE G6 2DIR 6EN4[BA] 6EN5[AB] 1A1 1 1B1 2 1A2 1B2 1A3 1B3 1A4 1B4 1A5 1B5 1A6 1B6 1A7 1B7 1A8 1B8 2A1 4 2B1 5 2A2 2B2 2A3 2B3 2A4 2B4 2A5 2B5 2A6 2B6 2A7 2B7 2A8 2B8 †ThissymbolisinaccordancewithANSI/IEEEStd91-1984andIECPublication617-12. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9 DetailedDescription.............................................. 9 2 Applications........................................................... 1 9.1 Overview...................................................................9 3 Description............................................................. 1 9.2 FunctionalBlockDiagrams.......................................9 4 SimplifiedSchematic............................................. 1 9.3 FeatureDescription.................................................10 9.4 DeviceFunctionalModes........................................10 5 RevisionHistory..................................................... 2 10 ApplicationandImplementation........................ 11 6 PinConfigurationandFunctions......................... 3 10.1 ApplicationInformation..........................................11 7 Specifications......................................................... 5 10.2 TypicalApplication ...............................................11 7.1 AbsoluteMaximumRatings......................................5 11 PowerSupplyRecommendations..................... 12 7.2 HandlingRatings.......................................................5 12 Layout................................................................... 12 7.3 RecommendedOperatingConditions.......................5 7.4 ThermalInformation..................................................6 12.1 LayoutGuidelines.................................................12 7.5 ElectricalCharacteristics...........................................6 12.2 LayoutExample....................................................12 7.6 SwitchingCharacteristics..........................................7 13 DeviceandDocumentationSupport................. 13 7.7 NoiseCharacteristics................................................7 13.1 Trademarks...........................................................13 7.8 OperatingCharacteristics..........................................7 13.2 ElectrostaticDischargeCaution............................13 7.9 TypicalCharacteristics..............................................7 13.3 Glossary................................................................13 8 ParameterMeasurementInformation..................8 14 Mechanical,Packaging,andOrderable Information........................................................... 13 5 Revision History ChangesfromRevisionJ(October2000)toRevisionK Page • UpdateddocumenttonewTIdatasheetformat.................................................................................................................... 1 • DeletedOrderingInformationtable........................................................................................................................................ 1 • DeletedSN54AHCT16245devicefromdatasheet................................................................................................................ 1 • AddedApplications................................................................................................................................................................. 1 • AddedPinFunctionstable...................................................................................................................................................... 3 • AddedHandlingRatingstable................................................................................................................................................ 5 • ChangedMAXoperatingtemperatureto125°CinRecommendedOperatingConditionstable. ......................................... 5 • AddedThermalInformationtable........................................................................................................................................... 6 • Added–40°Cto125°CrangeforSN74AHCT16245inElectricalCharacteristicstable........................................................ 6 • AddedT =–40°Cto125°CforSN74AHCT16245intheSwitchingCharacteristicstable.................................................... 7 A • AddedTypicalCharacteristics................................................................................................................................................ 7 • AddedDetailedDescriptionsection........................................................................................................................................ 9 • AddedApplicationandImplementationsection.................................................................................................................... 11 • AddedPowerSupplyRecommendationsandLayoutsections............................................................................................ 12 2 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 6 Pin Configuration and Functions SN74AHCT16245...DGG,DGV,ORDLPACKAGE (TOPVIEW) 1DIR 1 48 1OE 1B1 2 47 1A1 1B2 3 46 1A2 GND 4 45 GND 1B3 5 44 1A3 1B4 6 43 1A4 VCC 7 42 VCC 1B5 8 41 1A5 1B6 9 40 1A6 GND 10 39 GND 1B7 11 38 1A7 1B8 12 37 1A8 2B1 13 36 2A1 2B2 14 35 2A2 GND 15 34 GND 2B3 16 33 2A3 2B4 17 32 2A4 VCC 18 31 VCC 2B5 19 30 2A5 2B6 20 29 2A6 GND 21 28 GND 2B7 22 27 2A7 2B8 23 26 2A8 2DIR 24 25 2OE PinFunctions PIN I/O DESCRIPTION NO. NAME 1 1DIR I Directionpin1 2 1B1 I/O 1B1inputoroutput 3 1B2 I/O 1B2inputoroutput 4 GND — Groundpin 5 1B3 I/O 1B3inputoroutput 6 1B4 I/O 1B4inputoroutput 7 V — Powerpin CC 8 1B5 I/O 1B5inputoroutput 9 1B6 I/O 1B6inputoroutput 10 GND — Groundpin 11 1B7 I/O 1B7inputoroutput 12 1B8 I/O 1B8inputoroutput 13 2B1 I/O 2B1inputoroutput 14 2B2 I/O 2B2inputoroutput 15 GND — Groundpin 16 2B3 I/O 2B3inputoroutput 17 2B4 I/O 2B4inputoroutput 18 V — Powerpin CC Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com PinFunctions(continued) PIN I/O DESCRIPTION NO. NAME 19 2B5 I/O 2B5inputoroutput 20 2B6 I/O 2B6inputoroutput 21 GND — Groundpin 22 2B7 I/O 2B7inputoroutput 23 2B8 I/O 2B8inputoroutput 24 2DIR — Directionpin2 25 2OE I OutputEnable2 26 2A8 I/O 2A8inputoroutput 27 2A7 I/O 2A7inputoroutput 28 GND — Groundpin 29 2A6 I/O 2A6inputoroutput 30 2A5 I/O 2A5inputoroutput 31 V — Powerpin CC 32 2A4 I/O 2A4inputoroutput 33 2A3 I/O 2A3inputoroutput 34 GND — Groundpin 35 2A2 I/O 2A2inputoroutput 36 2A1 I/O 2A1inputoroutput 37 1A8 I/O 1A8inputoroutput 38 1A7 I/O 1A7inputoroutput 39 GND — Groundpin 40 1A6 I/O 1A6inputoroutput 41 1A5 I/O 1A5inputoroutput 42 V — Powerpin CC 43 1A4 I/O 1A4inputoroutput 44 1A3 I/O 1A3inputoroutput 45 GND — Groundpin 46 1A2 I/O 1A2inputoroutput 47 1A1 I/O 1A1inputoroutput 48 1OE I OutputEnable1 4 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltagerange –0.5 7 V CC V ControlInputs Inputvoltagerange(2) –0.5 7 V I V I/O Outputvoltagerange(2) –0.5 V +0.5 V O CC I ControlInputs Inputclampcurrent V <0 –20 mA IK I I I/O Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthroughV orGND ±75 mA CC (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –65 150 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all pins(1) 0 1500 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecification JESD22-C101,allpins(2) 0 2000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) SN74AHCT16245 UNIT MIN MAX V Supplyvoltage 4.5 5.5 V CC V High-levelinputvoltage 2 V IH V Low-levelinputvoltage 0.8 V IL V Inputvoltage 0 5.5 V I V Input/Outputvoltage,AorBpins 0 V V IO CC I High-leveloutputcurrent –8 mA OH I Low-leveloutputcurrent 8 mA OL Δt/Δv Inputtransitionriseorfallrate 20 ns/V T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIApplicationReport, CC ImplicationsofSloworFloatingCMOSInputs(SCBA004). Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com 7.4 Thermal Information SN74AHCT16245 THERMALMETRIC(1) DGG DGV DL UNIT 48PINS R Junction-to-ambientthermalresistance 68.1 79.3 61.0 θJA R Junction-to-case(top)thermalresistance 22.6 31.3 30.8 θJC(top) R Junction-to-boardthermalresistance 35.0 42.3 32.8 θJB °C/W ψ Junction-to-topcharacterizationparameter 1.3 2.4 8.4 JT ψ Junction-to-boardcharacterizationparameter 34.7 41.8 32.5 JB R Junction-to-case(bottom)thermalresistance n/a n/a n/a θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport(SPRA953). 7.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) –40°Cto125°C PARAMETER TESTCONDITIONS VCC TA=25°C SN74AHCT16245 SN74AHCT16245 UNIT MIN TYP MAX MIN MAX MIN MAX IOH=–50µA 4.4 4.5 4.4 4.4 VOH 4.5V V IOH=–8mA 3.94 3.8 3.8 IOL=50µA 0.1 0.1 0.1 VOL 4.5V V IOL=8mA 0.36 0.44 0.44 0Vto II OEorDIR VI=VCCorGND 5.5V ±0.1 ±1 ±1 µA IOZ(1) AInpourtBs VO=VCCorGND ±0.25 ±2.5 ±2.5 µA ICC VI=VCCorGND,IO=0 5.5V 4 40 40 µA ΔICC(2) OOntheerinipnuptuatsta3t.4VCVC,orGND 5.5V 1.35 1.5 1.5 mA Ci OEorDIR VI=VCCorGND 5V 2.5 10 10 10 pF AorB Cio Inputs 5V 4 pF (1) ForI/Oports,theparameterI includestheinputleakagecurrent. OZ (2) ThisistheincreaseinsupplycurrentforeachinputatoneofthespecifiedTTLvoltagelevels,ratherthan0VorV . CC 6 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 7.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V±0.5V(unlessotherwisenoted)(seeFigure2) CC PARAMETER FROM TO LOAD TA=25°C SN74AHCT16245 TASN=7–44A0H°CCTto16122455°C UNIT (INPUT) (OUTPUT) CAPACITANCE TYP MAX MIN MAX MIN MAX tPLH 4.5(1) 8.5(1) 1 9.5 1 11 tPHL AorB BorA CL=15pF 4.5(1) 8.5(1) 1 9.5 1 11 ns tPZH 8.9(1) 13(1) 1 14 1 15 tPZL OE AorB CL=15pF 8.9(1) 13(1) 1 14 1 15 ns tPHZ 9.2(1) 14(1) 1 15 1 15.7 tPLZ OE AorB CL=15pF 9.2(1) 14(1) 1 15 1 15.7 ns tPLH 7 9.5 1 10.5 1 12 AorB BorA CL=50pF ns tPHL 5.3 9.5 1 10.5 1 12 tPZH 8.3 14 1 15 1 16 OE AorB CL=50pF ns tPZL 8.3 14 1 15 1 16 tPHZ 8 14 1 15 1 15.7 OE AorB CL=50pF ns tPLZ 8 14 1 15 1 15.7 tsk(o) CL=50pF 1(2) 1 1 ns (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. (2) OnproductscomplianttoMIL-PRF-38535,thisparameterdoesnotapply. 7.7 Noise Characteristics V =5V,C =50pF,T =25°C(1) CC L A SN74AHCT16245 PARAMETER UNIT MIN TYP MAX V Quietoutput,maximumdynamicV 0.6 0.8 V OL(P) OL V Quietoutput,minimumdynamicV –0.6 –0.8 V OL(V) OL V Quietoutput,minimumdynamicV 4.8 V OH(V) OH V High-leveldynamicinputvoltage 2 V IH(D) V Low-leveldynamicinputvoltage 0.8 V IL(D) (1) Characteristicsareforsurface-mountpackagesonly. 7.8 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload, f=1MHz 17 pF pd 7.9 Typical Characteristics 6 5 4 ns) D ( 3 P T 2 1 TPD in ns 0 -100 -50 0 50 100 150 Temperature (qC) D001 Figure1.TPDvsTemperature Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com 8 Parameter Measurement Information VCC FromOutput Test FromOutput RL=1kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (seeNoteA) (seeNoteA) tPHZ/tPZH GND OpenDrain VCC LOADCIRCUITFOR LOADCIRCUITFOR TOTEM-POLEOUTPUTS 3-STATEANDOPEN-DRAINOUTPUTS 3V TimingInput 1.5V tw 0V th 3V tsu 3V Input 1.5V 1.5V DataInput 1.5V 1.5V 0V 0V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPANDHOLDTIMES 3V 3V Output Input 1.5V 1.5V 1.5V 1.5V Control 0V 0V tPLH tPHL tPZL tPLZ Output VOH Waveform1 ≈VCC InO-Puhtapsuet 50%VCC 50%VCC S1atVCC 50%VCC VOL+0.3V VOL (seeNoteB) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50%VCC 50%VCVVCOOHL (WseSae1veNaftooGtremNBD2) 50%VCC VOH–0.3VV≈0OVH VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEANDDISABLETIMES INVERTINGANDNONINVERTINGOUTPUTS LOW-ANDHIGH-LEVELENABLING NOTES: A. CLincludesprobeandjigcapacitance. B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislowexceptwhendisabledbytheoutputcontrol. Waveform2isforanoutputwithinternalconditionssuchthattheoutputishighexceptwhendisabledbytheoutputcontrol. C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics: PRR≤1MHz,ZO=50Ω,tr≤3ns,tf≤3ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. Figure2. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 9 Detailed Description 9.1 Overview The SN74AHCT16245 device is a 16-bit (dual-octal) noninverting 3-state transceiver designed for synchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. This device can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input.Theoutput-enable(OE)inputcanbeusedtodisablethedevicesothatthebusesareeffectivelyisolated. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. 9.2 Functional Block Diagrams 1OE G3 1DIR 3EN1[BA] 3EN2[AB] 2OE G6 2DIR 6EN4[BA] 6EN5[AB] 1A1 1 1B1 2 1A2 1B2 1A3 1B3 1A4 1B4 1A5 1B5 1A6 1B6 1A7 1B7 1A8 1B8 2A1 4 2B1 5 2A2 2B2 2A3 2B3 2A4 2B4 2A5 2B5 2A6 2B6 2A7 2B7 2A8 2B8 A. †ThissymbolisinaccordancewithANSI/IEEEStd91-1984andIECPublication617-12. Figure3. LogicSymbol Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com Functional Block Diagrams (continued) 1DIR 2DIR 1OE 2OE 1A1 2A1 1B1 2B1 ToSevenOtherChannels ToSevenOtherChannels Figure4. LogicDiagram(PositiveLogic) 9.3 Feature Description • TTLinputs – Loweredswitchingthresholdallowsuptranslation3.3Vto5V • Slowedgesreduceoutputringing 9.4 Device Functional Modes Table1.FunctionTable (Each8-bitTransceiver) INPUTS OPERATION OE DIR L L BdatatoAbus L H AdatatoBbus H X Isolation 10 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 10 Application and Implementation 10.1 Application Information The SN74AHCT16245 is a low-drive CMOS device that can be used for a multitude of bus interface type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on the outputs. The input switching levels have been lowered to accommodate TTL inputs of 0.8-V V and2-VV .Thisfeaturemakesthedeviceidealfortranslatingupfrom3.3Vto5V.Figure6 showsthistype IL IH oftranslation. 10.2 Typical Application Regulated 5 V to 3.3 V Regulated 3.3 V Regulated 5 V OE VCC OE VCC DIR DIR A1 B1 A1 B1 µC syµsCte omr boothaerrds A8 B8 syµsCte omr boothaerrds LsEysDtoser m oor t bhRoeearlradyss A8 B8 LEDosr oµorCt hReerlays GND GND system boards Figure5. TypicalApplicationDiagram 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloads;therefore,routingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. RecommendedInputConditions: – Forrisetimeandfalltimespecifications,see Δt/ΔVintheRecommendedOperatingConditions table. – Forspecifiedhighandlowlevels,seeV andV intheRecommendedOperatingConditions table. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV . CC 2. RecommendOutputConditions: – Loadcurrentsshouldnotexceed25mAperoutputand75mAtotalforthepart. – OutputsshouldnotbepulledaboveV . CC Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 SCLS335K–MARCH1996–REVISEDOCTOBER2014 www.ti.com Typical Application (continued) 10.2.3 ApplicationCurves Output Voltage )vid /V Input Voltage 1( egatloV Time (5 ns/div), VCC= 5 V Figure6.UpTranslation 11 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the RecommendedOperatingConditionstable. Each V pin should have a good bypass capacitor to prevent power disturbance. For devices with a single CC supply, 0.1 μF is recommended and if there are multiple V pins than 0.01 μF or 0.022 μF is recommended for CC each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the undefinedvoltagesattheoutsideconnectionsresultinundefinedoperationalstates. Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V , whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a CC transceiver. 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure7. LayoutDiagram 12 SubmitDocumentationFeedback Copyright©1996–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT16245

SN74AHCT16245 www.ti.com SCLS335K–MARCH1996–REVISEDOCTOBER2014 13 Device and Documentation Support 13.1 Trademarks WidebusisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 13.2 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.3 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1996–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN74AHCT16245

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74AHCT16245DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT16245 & no Sb/Br) 74AHCT16245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT16245 & no Sb/Br) SN74AHCT16245DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT16245 & no Sb/Br) SN74AHCT16245DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HF245 & no Sb/Br) SN74AHCT16245DL ACTIVE SSOP DL 48 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT16245 & no Sb/Br) SN74AHCT16245DLR ACTIVE SSOP DL 48 1000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHCT16245 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AHCT16245DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 SN74AHCT16245DGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 SN74AHCT16245DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AHCT16245DGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74AHCT16245DGVR TVSOP DGV 48 2000 367.0 367.0 38.0 SN74AHCT16245DLR SSOP DL 48 1000 367.0 367.0 55.0 PackMaterials-Page2

MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,50 0,08 M 0,17 48 25 6,20 8,30 6,00 7,90 0,15 NOM Gage Plane 0,25 1 24 0°–8° A 0,75 0,50 Seating Plane 0,15 1,20 MAX 0,10 0,05 PINS ** 48 56 64 DIM A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 4040078/F 12/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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