Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 SNx4AHC244 Octal Buffers/Drivers With 3-State Outputs 1 Features 3 Description • OperatingRange2-Vto5.5-VV These octal buffers and drivers are designed 1 CC specificallytoimprovetheperformanceanddensityof • Latch-UpPerformanceExceeds250mAPer 3-state memory-address drivers, clock drivers, and JESD17 bus-orientedreceiversandtransmitters. • OnProductsComplianttoMIL-PRF-38535, AllParametersAreTestedUnlessOtherwise DeviceInformation(1) Noted.OnAllOtherProducts,Production PARTNUMBER PACKAGE BODYSIZE(NOM) ProcessingDoesNotNecessarilyIncludeTesting SSOP(20) 7.20mm×5.30mm ofAllParameters. SOIC(20) 12.80mm×7.50mm SNx4AHC244 PDIP(20) 24.33mm×6.35mm 2 Applications TSSOP(20) 12.60mm×5.30mm • NetworkSwitches VQFN(20) 4.50mm×3.50mm • PowerInfrastructures (1) For all available packages, see the orderable addendum at • PCsandNotebooks theendofthedatasheet. • WearableHealthandFitnessDevices • TestsandMeasurements 4 Simplified Schematic 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9 DetailedDescription.............................................. 9 2 Applications........................................................... 1 9.1 Overview...................................................................9 3 Description............................................................. 1 9.2 FunctionalBlockDiagram.........................................9 4 SimplifiedSchematic............................................. 1 9.3 FeatureDescription...................................................9 9.4 DeviceFunctionalModes..........................................9 5 RevisionHistory..................................................... 2 10 ApplicationandImplementation........................ 10 6 PinConfigurationandFunctions......................... 3 10.1 ApplicationInformation..........................................10 7 Specifications......................................................... 4 10.2 TypicalApplication ...............................................10 7.1 AbsoluteMaximumRatings......................................4 11 PowerSupplyRecommendations..................... 11 7.2 HandlingRatings.......................................................4 12 Layout................................................................... 11 7.3 RecommendedOperatingConditions.......................4 7.4 ThermalInformation..................................................5 12.1 LayoutGuidelines.................................................11 7.5 ElectricalCharacteristics...........................................5 12.2 LayoutExample....................................................11 7.6 SwitchingCharacteristics..........................................6 13 DeviceandDocumentationSupport................. 12 7.7 SwitchingCharacteristics..........................................6 13.1 RelatedLinks........................................................12 7.8 NoiseCharacteristics................................................7 13.2 Trademarks...........................................................12 7.9 OperatingCharacteristics..........................................7 13.3 ElectrostaticDischargeCaution............................12 7.10 TypicalCharacteristics............................................7 13.4 Glossary................................................................12 8 ParameterMeasurementInformation..................8 14 Mechanical,Packaging,andOrderable Information........................................................... 12 5 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionJ(July2003)toRevisionK Page • UpdateddocumenttonewTIdatasheetformat.................................................................................................................... 1 • RemovedOrderingInformationtable..................................................................................................................................... 1 • AddedMilitaryDisclaimertoFeatureslist. ............................................................................................................................ 1 • AddedApplications. ............................................................................................................................................................... 1 • AddedPinFunctionstable...................................................................................................................................................... 3 • AddedHandlingRatingstable................................................................................................................................................ 4 • ChangedMAXambienttemperatureinRecommendedOperatingConditionstable. ........................................................... 4 • AddedThermalInformationtable........................................................................................................................................... 5 • AddedTypicalCharacteristics. .............................................................................................................................................. 7 2 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 www.ti.com SCLS226K–OCTOBER1995–REVISEDJULY2014 6 Pin Configuration and Functions SN54AHC244...JORWPACKAGE SN54AHC244...FKPACKAGE SN74AHC244...DB,DGV,DW,N,NS,ORPWPACKAGE (TOPVIEW) (TOPVIEW) 4 1 E CE Y A O CO 2 1 1V 2 1OE 1 20 VCC 1A1 2 19 2OE 3 2 1 20 19 1A2 4 18 1Y1 2Y4 3 18 1Y1 2Y3 5 17 2A4 1A2 4 17 2A4 1A3 6 16 1Y2 2Y3 5 16 1Y2 2Y2 7 15 2A3 1A3 6 15 2A3 1A4 8 14 1Y3 2Y2 7 14 1Y3 9 10 11 12 13 1A4 8 13 2A2 2Y1 9 12 1Y4 Y1 ND A1Y4 A2 GND 10 11 2A1 2 G 21 2 PinFunctions PIN I/O DESCRIPTION NO. NAME 1 1OE I OutputEnable1 2 1A1 I 1A1Input 3 2Y4 O 2Y4Output 4 1A2 I 1A2Input 5 2Y3 O 2Y3Output 6 1A3 I 1A3Input 7 2Y2 O 2Y2Output 8 1A4 I 1A4Input 9 2Y1 O 2Y1Output 10 GND — Groundpin 11 2A1 I 2A1Input 12 1Y4 O 1Y4Output 13 2A2 I 2A2Input 14 1Y3 O 1Y3Output 15 2A3 I 2A3Input 16 1Y2 O 1Y2Output 17 2A4 I 2A4Input 18 1Y1 O 1Y1Output 19 2OE I OutputEnable2 20 VCC — PowerPin Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltagerange –0.5 7 V CC V Inputvoltagerange(2) –0.5 7 V I V Outputvoltagerange(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –20 mA IK I I Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthrougheachV orGND ±50 mA CC (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –65 150 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all pins(1) 0 1500 V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecification JESD22-C101,allpins(2) 0 2000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) SN54AHC244 SN74AHC244 UNIT MIN MAX MIN MAX V Supplyvoltage 2 5.5 2 5.5 V CC V =2V 1.5 1.5 CC V High-levelinputvoltage V =3V 2.1 2.1 V IH CC V =5.5V 3.85 3.85 CC V =2V 0.5 0.5 CC V Lowlevelinputvoltage V =3V 0.9 0.9 V IL CC V =5.5V 1.65 1.65 CC V Inputvoltage 0 5.5 0 5.5 V I V Outputvoltage 0 V 0 V V O CC CC V =2V –50 –50 µA CC I High-leveloutputcurrent V =3.3V±0.3V –4 –4 OH CC mA V =5V±0.5V –8 –8 CC V =2V 50 50 µA CC I Lowleveloutputcurrent V =3.3V±0.3V 4 4 OL CC mA V =5V±0.5V 8 8 CC V =3.3V±0.3V 100 100 CC Δt/Δv Inputtransitionriseorfallrate ns/V V =5V±0.5V 20 20 CC T Operatingfree-airtemperature –55 125 –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 4 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 www.ti.com SCLS226K–OCTOBER1995–REVISEDJULY2014 7.4 Thermal Information SN74AHCT244 THERMALMETRIC(1) DB DGV DW N NS PW UNIT 20PINS 20PINS 20PINS 20PINS 20PINS 20PINS R Junction-to-ambientthermalresistance 99.9 119.2 83.0 54.9 80.4 105.4 θJA R Junction-to-case(top)thermalresistance 61.7 34.5 48.9 41.7 46.9 39.5 θJC(top) R Junction-to-boardthermalresistance 55.2 60.7 50.5 35.8 47.9 56.4 θJB °C/W ψ Junction-to-topcharacterizationparameter 22.6 1.2 21.1 27.9 19.9 3.1 JT ψ Junction-to-boardcharacterizationparameter 54.8 60.0 50.1 35.7 47.5 55.8 JB R Junction-to-case(bottom)thermalresistance n/a n/a n/a n/a n/a n/a θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 7.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) T =25°C SN54AHC244 SN74AHC244 A PARAMETER TESTCONDITIONS V UNIT CC MIN TYP MAX MIN MAX MIN MAX 2V 1.9 2 1.9 1.9 I =–50µA 3V 2.9 3 2.9 2.9 OH V 4.5V 4.4 4.5 4.4 4.4 V OH I =–4mA 3V 2.58 2.48 2.48 OH I =–8mA 4.5V 3.94 3.8 3.8 OH 2V 0.1 0.1 0.1 I =50µA 3V 0.1 0.1 0.1 OL V 4.5V 0.1 0.1 0.1 V OL I =4mA 3V 0.36 0.5 0.44 OL I =8mA 4.5V 0.36 0.5 0.44 OL I V =5.5VorGND 0Vto5.5 ±0.1 ±1(1) ±1 µA I I V V =V orGND, I O CC 5.5V ±0.25 ±2.5 ±2.5 µA OZ V (OE)=V orV I IL IH I V =V orGND, I =0 5.5V 4 40 40 µA CC I CC O C V =V orGND 5V 2 10 10 pF i I CC C V =V orGND 5V 3.5 pF o O CC (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontestedatV =0V. CC Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com 7.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =3.3V±0.3V(unlessotherwisenoted)(seeFigure3) CC FROM TO LOAD TA=25°C SN54AHC244 SN74AHC244 PARAMETER UNIT (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX t 5.8(1) 8.4(1) 1(1) 10(1) 1 10 PLH A Y C =15pF ns t L 5.8(1) 8.4(1) 1(1) 10(1) 1 10 PHL t 6.6(1) 10.6(1) 1(1) 12.5(1) 1 12.5 PZH OE Y C =15pF ns t L 6.6(1) 10.6(1) 1(1) 12.5(1) 1 12.5 PZL t 5(1) 9.7(1) 1(1) 11(1) 1 11 PHZ OE Y C =15pF ns t L 5(1) 9.7(1) 1(1) 11(1) 1 11 PLZ t 8.3 11.9 1 13.5 1 13.5 PLH A Y C =50pF ns L t 8.3 11.9 1 13.5 1 13.5 PHL t 9.1 14.1 1 16 1 16 PZH OE Y C =50pF ns L t 9.1 14.1 1 16 1 16 PZL t 10.3 14 1 16 1 16 PHZ OE Y C =50pF ns L t 10.3 14 1 16 1 16 PLZ t C =50pF 1.5(2) 1.5 ns sk(o) L (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. (2) OnproductscomplianttoMIL-PRF-38535,thisparameterdoesnotapply. 7.7 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V±0.5V(unlessotherwisenoted)(seeFigure3) CC TO T =25°C SN54AHC244 SN74AHC244 FROM LOAD A PARAMETER (OUTPU UNIT (INPUT) T) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX t 3.9(1) 5.5(1) 1(1) 6.5(1) 1 6.5 PLH A Y C =15pF ns t L 3.9(1) 5.5(1) 1(1) 6.5(1) 1 6.5 PHL t 4.7(1) 7.3(1) 1(1) 8.5(1) 1 8.5 PZH OE Y C =15pF ns t L 4.7(1) 7.3(1) 1(1) 8.5(1) 1 8.5 PZL t 5(1) 7.2(1) 1(1) 8.5(1) 1 8.5 PHZ OE Y C =15pF ns t L 5(1) 7.2(1) 1(1) 8.5(1) 1 8.5 PLZ t 5.4 7.5 1 8.5 1 8.5 PLH A Y C =50pF ns L t 5.4 7.5 1 8.5 1 8.5 PHL t 6.2 9.3 1 10.5 1 10.5 PZH OE Y C =50pF ns L t 6.2 9.3 1 10.5 1 10.5 PZL t 6.7 9.2 1 10.5 1 10.5 PHZ OE Y C =50pF ns L t 6.7 9.2 1 10.5 1 10.5 PLZ t C =50pF 1(2) 1 ns sk(o) L (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. (2) OnproductscomplianttoMIL-PRF-38535,thisparameterdoesnotapply. 6 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 www.ti.com SCLS226K–OCTOBER1995–REVISEDJULY2014 7.8 Noise Characteristics V =5V,C =50pF,T =25°C(See(1)) CC L A SN74AHC244 PARAMETER UNIT MIN TYP MAX V Quietoutput,maximumdynamicV 0.5 V OL(P) OL V Quietoutput,minimumdynamicV –0.2 V OL(V) OL V Quietoutput,minimumdynamicV 4.8 V OH(V) OH V High-leveldynamicinputvoltage 3.5 V IH(D) V Low-leveldynamicinputvoltage 1.5 V IL(D) (1) Characteristicsareforsurface-mountpackagesonly. 7.9 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload, f=1MHz 8.6 pF pd 7.10 Typical Characteristics 7 8 TPD in ns 6 7 6 5 5 s) 4 s) n n D ( D ( 4 P 3 P T T 3 2 2 1 1 TPD in ns 0 0 -100 -50 0 50 100 150 0 1 2 3 4 5 6 Temperature (qC) D001 VCC (V) D002 Figure1.TPDvsTemperature Figure2.TPDvsV CC Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com 8 Parameter Measurement Information From Output Test From Output RL= 1 kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (see NoteA) (see NoteA) tPHZ/tPZH GND Open Drain VCC LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATEAND OPEN-DRAIN OUTPUTS VCC Timing Input 50% VCC tw th 0 V VCC tsu VCC Input 50% VCC 50% VCC Data Input 50% VCC 50% VCC 0 V 0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPAND HOLD TIMES VCC Output VCC Input 50% VCC 50% VCC Control 50% VCC 50% VCC 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 ≈VCC InO-Puhtapsuet 50%VCC 50% VCC S1 at VCC 50% VCC VOL+0.3V VOL (see Note B) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50% VCC 50% VCVVCOOHL (WseSae1v eNaftoo GtremN BD2) 50% VCC VOH−0.3V V≈0O HV VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. CLincludes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤1 MHz, ZO= 50Ω, tr≤3ns,tf≤3 ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. Allparametersandwaveformsarenotapplicabletoalldevices. Figure3. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 www.ti.com SCLS226K–OCTOBER1995–REVISEDJULY2014 9 Detailed Description 9.1 Overview The SNx4AHC244 devices are organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs.WhenOEislow,thedevicepassesdatafromtheAinputstotheYoutputs.When OEishigh,theoutputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup resistor; the minimum value of the resistor is determined by the current- CC sinkingcapabilityofthedriver. 9.2 Functional Block Diagram 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 Figure4. LogicDiagram(PositiveLogic) 9.3 Feature Description • V isoptimizedat5V CC • Allowsdownvoltagetranslation – InputsacceptV levelsof5.5V IH • Slowedgeratesminimizeoutputringing 9.4 Device Functional Modes Table1.FunctionTable (Each4-BitBuffer/Driver) INPUTS OUTPUT OE A Y L H H L L L H X Z Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com 10 Application and Implementation 10.1 Application Information TheSNx4AHC244isalowdriveCMOSdevicethatcanbeusedforamultitudeofbusinterfacetypeapplications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on theoutputs.Theinputscanexceptvoltagesto5.5VatanyvalidV makingitidealfordowntranslation. CC 10.2 Typical Application Regulated 5 V OE VCC A1 Y1 µµCC µµCC or SSyysstteemm LLooggiicc SSyysstteemm LLooggiicc LEDs A4 Y4 GND Figure5. TypicalApplicationDiagram 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloadssoroutingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure • Recommendedinputconditions – Specifiedhighandlowlevels.See(V andV )inRecommendedOperatingConditions. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV CC • Recommendoutputconditions – Loadcurrentsshouldnotexceed25mAperoutputand50mAtotalforthepart – OutputsshouldnotbepulledaboveV CC 10 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 www.ti.com SCLS226K–OCTOBER1995–REVISEDJULY2014 Typical Application (continued) 10.2.3 ApplicationCurves AC HC AHC Figure6.SwitchingCharacteristicsComparison 11 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the RecommendedOperatingConditionstable. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 μf is recommended; if there are multiple VCC pins, then 0.01 μf or 0.022 μf is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and a 1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 12 Layout 12.1 Layout Guidelines Whenusingmultiple-bitlogicdevices,inputsshouldneverfloat. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputsofatriple-inputANDgateareusedoronly3ofthe4buffergatesareused.Suchinputpinsshouldnot be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Figure 7 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V , whichever makes more sense or is more convenient. It is CC generally acceptable to float outputs, unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the output section of the part when asserted. This will not disable the input section of the I/Os,sotheycannotfloatwhendisabled. 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure7. LayoutDiagram Copyright©1995–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54AHC244 SN74AHC244

SN54AHC244,SN74AHC244 SCLS226K–OCTOBER1995–REVISEDJULY2014 www.ti.com 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54AHC244 Clickhere Clickhere Clickhere Clickhere Clickhere SN74AHC244 Clickhere Clickhere Clickhere Clickhere Clickhere 13.2 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 13.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 12 SubmitDocumentationFeedback Copyright©1995–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN54AHC244 SN74AHC244

PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2019 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-9678201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9678201Q2A SNJ54AHC 244FK 5962-9678201QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201QR A SNJ54AHC244J 5962-9678201QSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201QS A SNJ54AHC244W 5962-9678201VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201VR A SNV54AHC244J 5962-9678201VSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201VS A SNV54AHC244W SN74AHC244DBR ACTIVE SSOP DB 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244DW ACTIVE SOIC DW 20 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC244 & no Sb/Br) SN74AHC244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC244 & no Sb/Br) SN74AHC244DWR ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC244 & no Sb/Br) SN74AHC244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC244 & no Sb/Br) SN74AHC244N ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 125 SN74AHC244N (RoHS) SN74AHC244NSR ACTIVE SO NS 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC244 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2019 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74AHC244PW ACTIVE TSSOP PW 20 70 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HA244 & no Sb/Br) SN74AHC244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SN74AHC244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA244 & no Sb/Br) SNJ54AHC244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9678201Q2A SNJ54AHC 244FK SNJ54AHC244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201QR A SNJ54AHC244J SNJ54AHC244W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9678201QS A SNJ54AHC244W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2019 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHC244, SN54AHC244-SP, SN74AHC244 : •Catalog: SN74AHC244, SN54AHC244 •Automotive: SN74AHC244-Q1, SN74AHC244-Q1 •Enhanced Product: SN74AHC244-EP, SN74AHC244-EP •Military: SN54AHC244 •Space: SN54AHC244-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AHC244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74AHC244DGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHC244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74AHC244NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74AHC244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AHC244DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74AHC244DGVR TVSOP DGV 20 2000 367.0 367.0 35.0 SN74AHC244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74AHC244NSR SO NS 20 2000 367.0 367.0 45.0 SN74AHC244PWR TSSOP PW 20 2000 364.0 364.0 27.0 PackMaterials-Page2

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MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OUTLINE DB0020A TSSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/A 12/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A TSSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/A 12/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A TSSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/A 12/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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