Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 SN74AHC1G125 Single Bus Buffer Gate With 3-State Output 1 Features 3 Description • OperatingRangeof2Vto5.5V The SN74AHC1G125 device is a single bus buffer 1 gate/line driver with 3-state output. The output is • Maxt of6nsat5V pd disabled when the output-enable (OE) input is high. • LowPowerConsumption,10-µAMaxICC When OE is low, true data is passed from the A input • ±8-mAOutputDriveat5V totheYoutput. 2 Applications DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) • Projectors SOT-23(5) 2.90mmx1.60mm • TVs SN74AHC1G125 SC-70(5) 2.00mmx1.30mm • Servers SOT-553(5) 1.65mmx1.20mm • MotorControls:ACInduction (1) For all available packages, see the orderable addendum at • PatientMonitoring theendofthedatasheet. • ElectronicPointsofSale 4 Simplified Schematic OE A Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9 DetailedDescription.............................................. 8 2 Applications........................................................... 1 9.1 Overview...................................................................8 3 Description............................................................. 1 9.2 FunctionalBlockDiagram.........................................8 4 SimplifiedSchematic............................................. 1 9.3 FeatureDescription...................................................8 9.4 DeviceFunctionalModes..........................................8 5 RevisionHistory..................................................... 2 10 ApplicationandImplementation.......................... 9 6 PinConfigurationandFunctions......................... 3 10.1 ApplicationInformation............................................9 7 Specifications......................................................... 4 10.2 TypicalApplication .................................................9 7.1 AbsoluteMaximumRatings......................................4 11 PowerSupplyRecommendations..................... 10 7.2 ESDRatings ............................................................4 12 Layout................................................................... 11 7.3 RecommendedOperatingConditions.......................4 7.4 ThermalInformation..................................................5 12.1 LayoutGuidelines.................................................11 7.5 ElectricalCharacteristics...........................................5 12.2 LayoutExample....................................................11 7.6 SwitchingCharacteristics,V =3.3V±0.3V........5 13 DeviceandDocumentationSupport................. 11 CC 7.7 SwitchingCharacteristics,V =5V±0.5V...........6 13.1 Trademarks...........................................................11 CC 7.8 OperatingCharacteristics..........................................6 13.2 ElectrostaticDischargeCaution............................11 7.9 TypicalCharacteristics..............................................6 13.3 Glossary................................................................11 8 ParameterMeasurementInformation..................7 14 Mechanical,Packaging,andOrderable Information........................................................... 11 5 Revision History ChangesfromRevisionJ(June2005)toRevisionK Page • AddedApplications,DeviceInformationtable,PinFunctionstable,ESDRatingstable,ThermalInformationtable, TypicalCharacteristics,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 • DeletedOrderingInformationtable........................................................................................................................................ 1 • ChangedMAXoperatingtemperatureto125°CinRecommendedOperatingConditionstable........................................... 4 2 SubmitDocumentationFeedback Copyright©1997–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 www.ti.com SCLS377K–AUGUST1997–REVISEDDECEMBER2014 6 Pin Configuration and Functions DBVPACKAGE DCK PACKAGE DRLPACKAGE (TOPVIEW) (TOPVIEW) (TOPVIEW) OE 1 5 VCC OE 1 5 VCC OE 1 5 VCC A 2 A 2 GND 3 4 Y A 2 GND 3 4 Y GND 3 4 Y See mechanical drawings for dimensions. PinFunctions PIN TYPE DESCRIPTION NO. NAME 1 OE I OutputEnable 2 A I InputA 3 GND — GroundPin 4 Y O OutputY 5 V — PowerPin CC Copyright©1997–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 7 V CC V Inputvoltagerange(2) –0.5 7 V I V Outputvoltagerange(2) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –20 mA IK I I Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouschannelcurrentthroughV orGND ±50 mA CC T Storagetemperaturerange –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 7.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) 1500 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101, V allpins(2) 2000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage 2 5.5 V CC V =2V 1.5 CC V High-levelinputvoltage V =3V 2.1 V IH CC V =5.5V 3.85 CC V =2V 0.5 CC V Low-levelinputvoltage V =3V 0.9 V IL CC V =5.5V 1.65 CC V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC V =2V –50 µA CC I High-leveloutputcurrent V =3.3V±0.3V –4 OH CC mA V =5V±0.5V –8 CC V =2V 50 µA CC I Low-leveloutputcurrent V =3.3V±0.3V 4 OL CC mA V =5V±0.5V 8 CC V =3.3V±0.3V 100 CC ∆t/∆v Inputtransitionriseorfallrate ns/V V =5V±0.5V 20 CC T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs(SCBA004). 4 SubmitDocumentationFeedback Copyright©1997–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 www.ti.com SCLS377K–AUGUST1997–REVISEDDECEMBER2014 7.4 Thermal Information SN74AHC1G125 THERMALMETRIC(1) DBV DCK DRL UNIT 5PINS R Junction-to-ambientthermalresistance 231.3 287.6 328.7 θJA R Junction-to-case(top)thermalresistance 119.9 97.7 105.1 θJC(top) R Junction-to-boardthermalresistance 60.6 65. 150.3 °C/W θJB ψ Junction-to-topcharacterizationparameter 17.8 2.0 6.9 JT ψ Junction-to-boardcharacterizationparameter 60.1 64.2 148.4 JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport(SPRA953). 7.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) T =25°C –40°Cto85°C –40°Cto125°C A PARAMETER TESTCONDITIONS V UNIT CC MIN TYP MAX MIN MAX MIN MAX 2V 1.9 2 1.9 1.9 I =–50µA 3V 2.9 3 2.9 2.9 OH V 4.5V 4.4 4.5 4.4 4.4 V OH I =−4mA 3V 2.58 2.48 2.48 OH I =−8mA 4.5V 3.94 3.8 3.8 OH 2V 0.1 0.1 0.1 I =50µA 3V 0.1 0.1 0.1 OL V 4.5V 0.1 0.1 0.1 V OL I =4mA 3V 0.36 0.44 0.44 OL I =8mA 4.5V 0.36 0.44 0.44 OL 0Vto I V =5.5VorGND ±0.1 ±1 ±1 µA I I 5.5V I V =V orGND 5.5V ±0.25 ±2.5 ±2.5 µA OZ I CC I V =V orGND, I =0 5.5V 1 10 10 µA CC I CC O C V =V orGND 5V 4 10 10 10 pF i I CC C V =V orGND 5V 10 pF o O CC 7.6 Switching Characteristics, V = 3.3 V ± 0.3 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure3) FROM TO LOAD TA=25°C –40°Cto85°C –40°Cto125°C PARAMETER UNIT (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX tPLH 5.6 8 1 9.5 1 10.5 A Y CL=15pF ns tPHL 5.6 8 1 9.5 1 10.5 tPZH 5.4 8 1 9.5 1 10.5 OE Y CL=15pF ns tPZL 5.4 8 1 9.5 1 10.5 tPHZ 7 9.7 1 11.5 1 12.5 OE Y CL=15pF ns tPLZ 7 9.7 1 11.5 1 12.5 tPLH 8.1 11.5 1 13 1 14 A Y CL=50pF ns tPHL 8.1 11.5 1 13 1 14 tPZH 7.9 11.5 1 13 1 14 OE Y CL=50pF ns tPZL 7.9 11.5 1 13 1 14 tPHZ 9.5 13.2 1 15 1 16 OE Y CL=50pF ns tPLZ 9.5 13.2 1 15 1 16 Copyright©1997–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 www.ti.com 7.7 Switching Characteristics, V = 5 V ± 0.5 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure3) FROM TO LOAD TA=25°C –40°Cto85°C –40°Cto125°C PARAMETER UNIT (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX MIN MAX MIN MAX tPLH 3.8 5.5 1 6.5 1 7 A Y CL=15pF ns tPHL 3.8 5.5 1 6.5 1 7 tPZH 3.6 5.1 1 6 1 6.5 OE Y CL=15pF ns tPZL 3.6 5.1 1 6 1 6.5 tPHZ 4.6 6.8 1 8 1 8.5 OE Y CL=15pF ns tPLZ 4.6 6.8 1 8 1 8.5 tPLH 5.3 7.5 1 8.5 1 9.5 A Y CL=50pF ns tPHL 5.3 7.5 1 8.5 1 9.5 tPZH 5.1 7.1 1 8 1 9 OE Y CL=50pF ns tPZL 5.1 7.1 1 8 1 9 tPHZ 6.1 8.8 1 10 1 11 OE Y CL=50pF ns tPLZ 6.1 8.8 1 10 1 11 7.8 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload, f=1MHz 14 pF pd 7.9 Typical Characteristics 8 8 7 7 6 6 5 5 s) s) n n D ( 4 D ( 4 P P T T 3 3 2 2 1 1 TPD in ns TPD in ns 0 0 -100 -50 0 50 100 150 0 1 2 3 4 5 6 Temperature (qC) D001 VCC D002 Figure1.TPDvsTemperature Figure2.TPDvsV at25°C CC 6 SubmitDocumentationFeedback Copyright©1997–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 www.ti.com SCLS377K–AUGUST1997–REVISEDDECEMBER2014 8 Parameter Measurement Information VCC From Output Test From Output RL= 1 kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (see NoteA) (see NoteA) tPHZ/tPZH GND Open Drain VCC LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATEAND OPEN-DRAIN OUTPUTS VCC Timing Input 50% VCC tw th 0 V VCC tsu VCC Input 50% VCC 50% VCC Data Input 50% VCC 50% VCC 0 V 0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPAND HOLD TIMES VCC VCC Output Input 50% VCC 50% VCC Control 50% VCC 50% VCC 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 ≈VCC InO-Puhtapsuet 50%VCC 50% VCC S1 at VCC 50% VCC VOL+0.3V VOL (see Note B) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50% VCC 50% VCVVCOOHL (WseSae1v eNaftoo GtremN B D2) 50% VCC VOH−0.3VV≈0O VH VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. CLincludes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤1 MHz, ZO= 50Ω, tr≤3ns,tf≤3 ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. Allparametersandwaveformsarenotapplicabletoalldevices. Figure3. LoadCircuitandVoltageWaveforms Copyright©1997–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 www.ti.com 9 Detailed Description 9.1 Overview The SN74AHC1G125 device is a single bus buffer gate/line driver with 3-state output. The output is disabled whentheoutput-enable(OE)inputishigh.WhenOEislow,truedataispassedfromtheAinputtotheYoutput. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. 9.2 Functional Block Diagram OE A Y Figure4. LogicDiagram(PositiveLogic) 9.3 Feature Description • Wideoperatingvoltagerange – Operatesfrom2Vto5.5V • Allowsdown-voltagetranslation – Inputsacceptvoltagesto5.5V 9.4 Device Functional Modes Table1.FunctionTable INPUTS OUTPUT OE A Y L H H L L L H X Z 8 SubmitDocumentationFeedback Copyright©1997–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 www.ti.com SCLS377K–AUGUST1997–REVISEDDECEMBER2014 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 10.1 Application Information SN74AHC1G125 is a low-drive CMOS device that can be used for a multitude of bus interface type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on theoutputs.Theinputscanacceptvoltagesto5.5VatanyvalidV makingitIdealfordowntranslation. CC 10.2 Typical Application 5-V system 5-V regulated VCC OE µC or A Y System Logic µC System Logic LEDs GND Figure5. TypicalApplicationSchematic 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloads,soroutingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. RecommendedInputConditions – Forrisetimeandfalltimespecifications,see Δt/ΔVintheRecommendedOperatingConditions table. – ForspecifiedHighandlowlevels,seeV andV intheRecommendedOperatingConditions table. IH IL 2. RecommendOutputConditions – Loadcurrentsshouldnotexceed25mAperoutputand50mAtotalforthepart. – OutputsshouldnotbepulledaboveV . CC Copyright©1997–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 SCLS377K–AUGUST1997–REVISEDDECEMBER2014 www.ti.com Typical Application (continued) 10.2.3 ApplicationCurves Figure6. 11 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the RecommendedOperatingConditionstable. Each V pin should have a good bypass capacitor to prevent power disturbance. For devices with a single CC supply, 0.1 μF is recommended. If there are multiple V pins, 0.01 μF or 0.022 μF is recommended for each CC power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 10 SubmitDocumentationFeedback Copyright©1997–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC1G125

SN74AHC1G125 www.ti.com SCLS377K–AUGUST1997–REVISEDDECEMBER2014 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the undefinedvoltagesattheoutsideconnectionsresultinundefinedoperationalstates. Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V , whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a CC transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when asserted.ThiswillnotdisabletheinputsectionoftheI/Ossotheyalsocannotfloatwhendisabled. 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure7. LayoutDiagram 13 Device and Documentation Support 13.1 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 13.2 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.3 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1997–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74AHC1G125

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74AHC1G125DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A25G & no Sb/Br) 74AHC1G125DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A25G & no Sb/Br) 74AHC1G125DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A25G & no Sb/Br) 74AHC1G125DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 A25G & no Sb/Br) 74AHC1G125DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AM3 & no Sb/Br) 74AHC1G125DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AM3 & no Sb/Br) 74AHC1G125DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AM3 & no Sb/Br) SN74AHC1G125DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (A253, A25G, A25J, & no Sb/Br) A25L, A25S) SN74AHC1G125DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (A253, A25G, A25J, & no Sb/Br) A25L, A25S) SN74AHC1G125DCK3 ACTIVE SC70 DCK 5 3000 Pb-Free SNBI Level-1-260C-UNLIM -40 to 85 AMY (RoHS) SN74AHC1G125DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AM3, AMG, AMJ, AM & no Sb/Br) L, AMS) SN74AHC1G125DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (AM3, AMG, AMJ, AM & no Sb/Br) L, AMS) SN74AHC1G125DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS NIPDAUAG Level-1-260C-UNLIM -40 to 125 AMS & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) 74AHC1G125DBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 74AHC1G125DBVTG4 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 74AHC1G125DCKTG4 SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74AHC1G125DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHC1G125DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74AHC1G125DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHC1G125DBVR SOT-23 DBV 5 3000 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3 SN74AHC1G125DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHC1G125DBVT SOT-23 DBV 5 250 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3 SN74AHC1G125DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74AHC1G125DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHC1G125DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 SN74AHC1G125DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHC1G125DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74AHC1G125DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHC1G125DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHC1G125DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHC1G125DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AHC1G125DRLR SOT-5X3 DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) 74AHC1G125DBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 74AHC1G125DBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0 74AHC1G125DCKTG4 SC70 DCK 5 250 180.0 180.0 18.0 SN74AHC1G125DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AHC1G125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHC1G125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHC1G125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHC1G125DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74AHC1G125DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHC1G125DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHC1G125DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHC1G125DCKR SC70 DCK 5 3000 202.0 201.0 28.0 SN74AHC1G125DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AHC1G125DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AHC1G125DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AHC1G125DCKT SC70 DCK 5 250 180.0 180.0 18.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AHC1G125DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHC1G125DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHC1G125DRLR SOT-5X3 DRL 5 4000 202.0 201.0 28.0 PackMaterials-Page3

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

None

None

None

None

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated