Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 SNx4ACT244 Octal Buffers and Drivers With 3-State Outputs 1 Features 3 Description • 4.5-Vto5.5-VV Operation These SNx4ACT244 octal buffers and drivers are 1 CC designed specifically to improve the performance and • InputsAcceptVoltagesto5.5V density of 3-state memory address drivers, clock • Maxtpdof9.5nsat5V drivers,andbus-orientedreceiversandtransmitters. • InputsareTTLCompatible The SNx4ACT244 devices are organized as two 4-bit • OnProductsComplianttoMIL-PRF-38535, buffers and drivers with separate output-enable (OE) AllParametersareTestedUnlessOtherwise inputs. When OE is low, the device passes non- Noted.OnAllOtherProducts,Production inverted data from the A inputs to the Y outputs. ProcessingDoesNotNecessarilyIncludeTesting When OE is high, the outputs are in the high- ofAllParameters. impedancestate. DeviceInformation(1) 2 Applications PARTNUMBER PACKAGE BODYSIZE(NOM) • LEDdisplays SN74ACT244DB SSOP(20) 7.20mm×5.30mm • ServersandTelecommunication 12.80mm×7.50 SN74ACT244DW SOIC(20) • SwitchingNetworks mm 24.33mm×6.35 SN74ACT244N PDIP(20) mm 12.60mm×7.80 SN74ACT244NS SO(20) mm SN74ACT244PW TSSOP(20) 6.50mm×6.40mm SNJ54ACT244FK LCCC(20) 8.89mm×8.89mm 24.20mm×6.92 SNJ54ACT244J CDIP(20) mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. LogicDiagram(PositiveLogic) 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 Copyright © 2016,Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8.3 FeatureDescription...................................................9 2 Applications........................................................... 1 8.4 DeviceFunctionalModes..........................................9 3 Description............................................................. 1 9 ApplicationandImplementation........................ 10 4 RevisionHistory..................................................... 2 9.1 ApplicationInformation............................................10 9.2 TypicalApplication .................................................10 5 PinConfigurationandFunctions......................... 3 10 PowerSupplyRecommendations..................... 12 6 Specifications......................................................... 4 11 Layout................................................................... 12 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 11.1 LayoutGuidelines.................................................12 6.3 RecommendedOperatingConditions.......................4 11.2 LayoutExample....................................................12 6.4 ThermalInformation..................................................5 12 DeviceandDocumentationSupport................. 13 6.5 ElectricalCharacteristics...........................................5 12.1 DocumentationSupport........................................13 6.6 SwitchingCharacteristics..........................................6 12.2 RelatedLinks........................................................13 6.7 OperatingCharacteristics..........................................6 12.3 ReceivingNotificationofDocumentationUpdates13 6.8 TypicalCharacteristics..............................................7 12.4 CommunityResources..........................................13 7 ParameterMeasurementInformation..................8 12.5 Trademarks...........................................................13 12.6 ElectrostaticDischargeCaution............................13 8 DetailedDescription.............................................. 9 12.7 Glossary................................................................13 8.1 Overview...................................................................9 13 Mechanical,Packaging,andOrderable 8.2 FunctionalBlockDiagram.........................................9 Information........................................................... 13 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionC(October2002)toRevisionD Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection ................................................................................................. 1 2 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 5 Pin Configuration and Functions SN54ACT244:JorWPackages 20-PinCDIPorCFP SN74ACT244:DB,DW,N,NS,orPWPackages TopView 20-PinSSOP,SOIC,PDIP,SO,orTSSOP TopView 11OAE1 12 2109 V2OCCE 1OE 1 20 VCC 1A1 2 19 2OE 2Y4 3 18 1Y1 2Y4 3 18 1Y1 1A2 4 17 2A4 1A2 4 17 2A4 2Y3 5 16 1Y2 2Y3 5 16 1Y2 1A3 6 15 2A3 1A3 6 15 2A3 2Y2 7 14 1Y3 2Y2 7 14 1Y3 1A4 8 13 2A2 1A4 8 13 2A2 2Y1 9 12 1Y4 2Y1 9 12 1Y4 GND 10 11 2A1 GND 10 11 2A1 SN54ACT244:FKPackage 20-PinLCCC TopView 4 1E CE Y AO CO 2 11V 2 3 2 1 20 19 1A2 4 18 1Y1 2Y3 5 17 2A4 1A3 6 16 1Y2 2Y2 7 15 2A3 1A4 8 14 1Y3 9 10 11 12 13 1 D 142 Y N AYA 2 G 212 PinFunctions PIN I/O DESCRIPTION NO. NAME 1 1OE I 1ActivelowOutputenable 2 1A1 I 1A1input 3 2Y4 O 2Y4output 4 1A2 I 1A2input 5 2Y3 O 2Y3Output 6 1A3 I 1A3input 7 2Y2 O 2Y2Output 8 1A4 I 1A4input 9 2Y1 O 2Y1Output 10 GND — Ground 11 2A1 I 2A1input 12 1Y4 O 1Y4output 13 2A2 I 2A2input 14 1Y3 O 1Y3Output 15 2A3 I 2A3input 16 1Y2 O 1Y2Output 17 2A4 I 2A4input 18 1Y1 O 1Y1Output Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com PinFunctions(continued) PIN I/O DESCRIPTION NO. NAME 19 2OE I 2ActivelowOutputenable 20 V — Power CC 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC V Inputvoltage(2) –0.5 V +0.5 V I CC V Outputvoltage(2) –0.5 V +0.5 V O CC I Inputclampcurrent V <0orV >V ±20 mA IK I I CC I Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±50 mA O O CC ContinuouscurrentthroughV orGND ±200 mA CC T AbsoluteMaximumJunctionTemperature 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings VALUE UNIT SN74ACT244inDWPackage Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±3000 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22- V C101(2) ±2000 SN54ACT244inJ,W,DB,N,NS,PW,FKPackages V Electrostaticdischarge Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V (ESD) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage 4.5 5.5 V CC V High-levelinputvoltage 2 V IH V Low-levelinputvoltage 0.8 V IL V Inputvoltage 0 V V I CC V Outputvoltage 0 V V O CC I High-leveloutputcurrent –24 mA OH I Low-leveloutputcurrent 24 mA OL Δt/Δv Inputtransitionriseorfallrate 8 ns/V SN54ACT244 –55 125 T Operatingfree-airtemperature °C A SN74ACT244 –40 85 (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.SeetheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs(SCBA004). 4 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 6.4 Thermal Information SN74ACT244 THERMALMETRIC(1) DB DW N NS PW UNIT (SSOP) (SOIC) (PDIP) (SO) (TSSOP) 20PINS 20PINS 20PINS 20PINS 20PINS R Junction-to-ambientthermalresistance 94.1 81.4 48.1 76.4 103 °C/W θJA Junction-to-case(top)thermal R 55.6 46.8 34.1 42.6 37.7 °C/W θJC(top) resistance R Junction-to-boardthermalresistance 49.3 49.3 29 43.9 54 °C/W θJB Junction-to-topcharacterization ψ 20.8 20 19.5 18.8 2.8 °C/W JT parameter Junction-to-boardcharacterization ψ 48.9 48.8 28.9 43.5 53.5 °C/W JB parameter (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6.5 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP MAX UNIT CC T =25°C 4.4 4.49 A SN54ACT244 4.5V 4.4 SN74ACT244 4.4 I =–50µA OH T =25°C 5.4 5.49 A SN54ACT244 5.5V 5.4 SN74ACT244 5.4 T =25°C 3.86 A V V OH SN54ACT244 4.5V 3.7 SN74ACT244 3.76 I =–24mA OH T =25°C 4.86 A SN54ACT244 5.5V 4.7 SN74ACT244 4.76 I =–50mA(1) SN54ACT244 5.5V 3.85 OH I =–75mA(1) SN74ACT244 5.5V 3.85 OH T =25°C 0.001 0.1 A SN54ACT244 4.5V 0.1 SN74ACT244 0.1 I =50µA OL T =25°C 0.001 0.1 A SN54ACT244 5.5V 0.1 SN74ACT244 0.1 T =25°C 0.36 A V V OL SN54ACT244 4.5V 0.5 SN74ACT244 0.44 I =24mA OL T =25°C 0.36 A SN54ACT244 5.5V 0.5 SN74ACT244 0.44 I =50mA(1) SN54ACT244 5.5V 1.65 OL I =75mA(1) SN74ACT244 5.5V 1.65 OL T =25°C ±0.25 A I V =V orGND SN54ACT244 5.5V ±5 µA OZ O CC SN74ACT244 ±2.5 (1) Notmorethanoneoutputshouldbetestedatatime,andthedurationofthetestshouldnotexceed2ms. Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com Electrical Characteristics (continued) overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP MAX UNIT CC T =25°C ±0.1 A I V =V orGND SN54ACT244 5.5V ±1 µA I I CC SN74ACT244 ±1 T =25°C 4 A I V =V orGND,I =0 SN54ACT244 5.5V 80 µA CC I CC O SN74ACT244 40 T =25°C 0.6 A Δ (2) Oneinputat3.4V, SN54ACT244 5.5V 1.6 mA ICC OtherinputsatGNDorV CC SN74ACT244 1.5 C V =V orGND T =25°C 5V 2.5 pF I I CC A C V =V orGND T =25°C 5V 8 pF o I CC A (2) ThisistheincreaseinsupplycurrentforeachinputthatisatoneofthespecifiedTTLvoltagelevels,ratherthan0VorV . CC 6.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V±0.5V(unlessotherwisenoted)(seeFigure2) CC FROM TO PARAMETER TESTCONDITIONS MIN TYP MAX UNIT (INPUT) (OUTPUT) T =25°C 2 6.5 9 A t SN54ACT244 1 10 PLH SN74ACT244 1.5 10 A Y ns T =25°C 2 7 9 A t SN54ACT244 1 10 PHL SN74ACT244 1.5 10 T =25°C 1.5 7 8.5 A t SN54ACT244 1 9.5 PZH SN74ACT244 1 9.5 OE Y ns T =25°C 2 7 9.5 A t SN54ACT244 1 11 PZL SN74ACT244 1.5 10.5 T =25°C 2 8 9.5 A t SN54ACT244 1 11 PHZ SN74ACT244 1.5 10.5 OE Y ns T =25°C 2.5 7.5 10 A t SN54ACT244 1 11.5 PLZ SN74ACT244 2 10.5 6.7 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitanceperbuffer/driver C =50pF, f=1MHz 45 pF pd L 6 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 6.8 Typical Characteristics 5.4 5.3 VCC 5.5V 5.2 5.1 5 4.9 V) 4.8 n ( 4.7 mi 4.6 H 4.5 O V 4.4 4.3 4.2 4.1 4 3.9 3.8 -75 -65 -55 -45 -35 -25 -15 -5 IOH mA D001 Figure1.V VsI OH OH Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com 7 Parameter Measurement Information 2×VCC FromOutput 500Ω S1 Open TEST S1 UnderTest tPLH/tPHL Open CL=50pF tPLZ/tPZL 2×VCC (see NoteA) 500Ω tPHZ/tPZH Open LOAD CIRCUIT Output 3 V Control 1.5 V 1.5 V (low-level 0 V enabling) tPZL tPLZ 3 V Output ≈V Input 1.5 V 1.5 V 0 V SW1 aavt e2fo×rVmCC1 50% VCC VOL+ 0.3 V V CC OL (see Note B) tPLH tPHL tPZH tPHZ Output 50% VCC 50% VCVCOH WSa1v aeOtf oOurtpmpeu n2t 50% VCC VOH−0.3 V VOH VOL (see Note B) ≈0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS NOTES: A. CLincludes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics: PRR≤1MHz,ZO= 50Ω, tr≤2.5 ns,tf≤2.5 ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. Figure2. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 8 Detailed Description 8.1 Overview The SNx4ACT244 devices are buffer drivers with separate output enable inputs. The active low output enable ensure the outputs are in high impedance when high. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup resistor; the minimum value of the resistor is determined CC bythecurrent-sinkingcapabilityofthedriver. 8.2 Functional Block Diagram 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 Copyright © 2016,Texas Instruments Incorporated Figure3. LogicDiagram(PositiveLogic) 8.3 Feature Description The SNx4ACT244 devices are recommended for 4.5 V to 5.5-V V range under normal operating conditions. CC TheinputsareTTLcompatibleaccepting2-Vminimumhighat5-VV . CC 8.4 Device Functional Modes Table1liststhefunctionsofthedevice. Table1.FunctionTable(EachBuffer) INPUTS OUTPUT OE A Y L H H L L L H X Hi-Z Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The SNx4ACT244 is high-drive buffer drivers providing 24-mA current drive per channel at nominal operating specifications. It can be used as LED driver with appropriate current-limiting resistors to ground or V withing CC thedevice'sandLED'soperatingcharacteristics. 9.2 Typical Application Vcc Control signal 1k(cid:13) LED SNx4ACT244 Vcc Vcc Control signal 1k(cid:13) LED SNx4ACT244 Copyright © 2016, Texas Instruments Incorporated Figure4. TypicalLEDdrivingapplication 9.2.1 DesignRequirements The pullup and pulldown current limiting resistors are chosen to operate within the LED and the SNx4ACT244 deviceoperatingspecifications.A1-kΩresistor,limitsthecurrenttolessthan5mAat5-VV operation. CC 9.2.2 DetailedDesignProcedure 1. Recommendedinputconditions: – ForthespecifiedhighandlowlevelsSee(V andV )intheRecommendedOperatingConditions. IH IL – InputsarenotovervoltagetolerantandmustbelimitedtoV . CC 2. Recommendedoutputconditions: – LimittheoutputvoltagetoV . CC – Choose the current-limiting resistor for the LED to limit the output current to I as per the O RecommendedOperatingConditions. 10 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 Typical Application (continued) 9.2.3 ApplicationCurve 1.7 1.6 VCC 5.5V 1.5 1.4 1.3 1.2 V) 1.1 x ( 1 ma 0.9 V OL 00..78 0.6 0.5 0.4 0.3 0.2 0.1 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 IOL (mA) D001 Figure5.V vsI OL OL Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 SCAS517D–JUNE1995–REVISEDAUGUST2016 www.ti.com 10 Power Supply Recommendations The power supply may be any voltage between the MIN and MAX supply voltage rating located in the RecommendedOperatingConditions. Each V terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-µF capacitor is CC recommended for devices with a single supply. If there are multiple V terminals, then 0.01-µF or 0.022-µF CC capacitors are recommended for each power terminal. It is permissible to parallel multiple bypass capacitors to reject different frequencies of noise. Multiple bypass capacitors may be paralleled to reject different frequencies ofnoise.Thebypasscapacitorshouldbeinstalledasclosetothepowerterminalaspossibleforthebestresults. 11 Layout 11.1 Layout Guidelines Inputs should not float when using multiple bit logic devices. In many cases, functions or parts of functions of digital logic devices are unused. Some examples include situations when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected becausetheundefinedvoltagesattheoutsideconnectionsresultinundefinedoperationalstates. Specified in the Figure 6 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally, they will be tied to GNDorV ,whichevermakesmoresenseorismoreconvenient. CC 11.2 Layout Example VCC Input Unused Input Output Unused Input Output Input Figure6. LayoutExample 12 SubmitDocumentationFeedback Copyright©1995–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN54ACT244 SN74ACT244

SN54ACT244,SN74ACT244 www.ti.com SCAS517D–JUNE1995–REVISEDAUGUST2016 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: ImplicationsofSloworFloatingCMOSInputs (SCBA004). 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54ACT244 Clickhere Clickhere Clickhere Clickhere Clickhere SN74ACT244 Clickhere Clickhere Clickhere Clickhere Clickhere 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.5 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.6 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.7 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowserbasedversionsofthisdatasheet,refertothelefthandnavigation. Copyright©1995–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN54ACT244 SN74ACT244

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-8776001M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 8776001M2A SNJ54ACT 244FK 5962-8776001MRA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001MR A SNJ54ACT244J 5962-8776001MSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001MS A SNJ54ACT244W 5962-8776001SRA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001SR A SNV54ACT244J 5962-8776001SSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001SS A SNV54ACT244W SN74ACT244DBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244DW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244DWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244N ACTIVE PDIP N 20 20 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 SN74ACT244N (RoHS) SN74ACT244NE4 ACTIVE PDIP N 20 20 Pb-Free NIPDAU N / A for Pkg Type -40 to 85 SN74ACT244N (RoHS) SN74ACT244NSR ACTIVE SO NS 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74ACT244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 ACT244 & no Sb/Br) SN74ACT244PW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SN74ACT244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 AD244 & no Sb/Br) SNJ54ACT244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 8776001M2A SNJ54ACT 244FK SNJ54ACT244J ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001MR A SNJ54ACT244J SNJ54ACT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8776001MS A SNJ54ACT244W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ACT244, SN54ACT244-SP, SN74ACT244 : •Catalog: SN74ACT244, SN54ACT244 •Automotive: SN74ACT244-Q1, SN74ACT244-Q1 •Enhanced Product: SN74ACT244-EP, SN74ACT244-EP •Military: SN54ACT244 •Space: SN54ACT244-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 14-May-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74ACT244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ACT244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74ACT244NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74ACT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74ACT244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 SN74ACT244PWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 14-May-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74ACT244DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74ACT244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74ACT244NSR SO NS 20 2000 367.0 367.0 45.0 SN74ACT244PWR TSSOP PW 20 2000 364.0 364.0 27.0 SN74ACT244PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74ACT244PWRG4 TSSOP PW 20 2000 367.0 367.0 38.0 PackMaterials-Page2

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PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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