TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series SLVU2.8-4 Series 2.8V 40A TVS Array RoHS Pb GREEN Description The SLVU2.8-4 was designed to protect low voltage, CMOS devices from ESD and lightning induced transients. There is a compensating diode in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive ESD strikes at ±30kV (contact discharge) per IEC 61000-4-2 standard and each structure can safely dissipate up to 40A (IEC 61000-4-5 2nd edition, t =8/20μs) with very P low clamping voltages. Features • ESD, IEC 61000-4-2, • SOIC-8 (JEDEC MO-012) Pinout ±30kV contact, ±30kV air pin configuration allows 4 3 2 1 • EFT, IEC 61000-4-4, 40A for simple flow-through (5/50ns) layout • Lightning, IEC 61000-4-5 • RoHS Compliant and 2nd edition, 40A (8/20μs) Lead Free • Low capacitance of 2pF • Moisture Sensitivity Level per line (MSL-1) • Low leakage current of 1μA (MAX) at 2.8V 5 6 7 8 Applications • 10/100/1000 Ethernet • Analog Inputs Functional Block Diagram • WAN/LAN Equipment • Base Stations • Switching Systems Pin 1.3 Pin 6.8 • Desktops, Servers, and Notebooks Application Example RJ-45 Ethernet Connector PHY Pin 2.4 Pin 5.7 J1 Tx+ Tx- Rx+ Rx- Additional Information SLVU2.8-4 Device is shown as transparent for actual footprint Resources Samples J8 Case GND © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Electrical Characteristics (T = 25°C) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤1μA 2.8 V RWM R Reverse Breakdown Voltage V I=2μA 3.0 V BR T Snap Back Voltage V I=50mA 2.8 V SB T Reverse Leakage Current I V =2.8V (Each Line) 1 μA LEAK R Clamping Voltage1 V I =5A, t =8/20μs (Each Line) 7.0 8.5 V C PP P Clamping Voltage1 V I =24A, t =8/20μs (Each Line) 13.9 15.0 V C PP P IEC61000-4-2 (Contact) ±30 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±30 kV Dynamic Resistance R (V - V ) / (I - I ) (Each Line) 0.4 Ω DYN C2 C1 PP2 PP1 Diode Capacitance1 CD VR=0V, f=1MHz (Each Line) 2.0 2.5 pF Note: 1Parameter is guaranteed by design and/or device characterization. Absolute Maximum Ratings Figure 1: Capacitance vs. Reverse Voltage Parameter Rating Units 4.0 Peak Pulse Power (t =8/20µs) 600 W P 3.5 Peak Pulse Current (t =8/20µs) 40 A P Operating Temperature –40 to 125 ºC pF) 3.0 Storage Temperature –55 to 150 ºC e ( 2.5 c n a 2.0 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause t permanent damage to the device. This is a stress only rating and operation of the device aci 1.5 at these or any other conditions above those indicated in the operational sections of this p a specification is not implied. C 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 DC Bias (V) Figure 2: Clamping Voltage vs. I Figure 3: 8/20 µs Pulse Waveform PP 14 110% 100% 12 90% V) 80% g Voltage-V(C 1680 Percent of IPP 3456700000%%%%% n pi 4 20% m 10% a Cl 2 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) 0 5 10 15 20 25 Peak Pulse Current-I (A) PP © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Product Characteristics Soldering Parameters Reflow Condition Pb – Free assembly Lead Plating Matte Tin - Temperature Min (T ) 150°C s(min) Lead Material Copper Alloy Pre Heat - Temperature Max (T ) 200°C s(max) Lead Coplanarity 0.0004 inches (0.102mm) - Time (min to max) (t) 60 – 180 secs s Average ramp up rate (Liquidus) Temp Substitute Material Silicon 5°C/second max (T) to peak L Body Material V-0 per UL 94 Molded Epoxy T to T - Ramp-up Rate 5°C/second max S(max) L Notes : - Temperature (T) (Liquidus) 217°C 1. All dimensions are in millimeters Reflow L 2. Dimensions include solder plating. - Temperature (tL) 60 – 150 seconds 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A Peak Temperature (TP) 260+0/-5 °C 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Time within 5°C of actual peak 6. Package surface matte finish VDI 11-13. 20 – 40 seconds Temperature (t ) p Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres Inches LF Min Max Min Max A 1.35 1.75 0.053 0.069 o A1 0.10 0.25 0.004 0.010 Recommended A2 1.25 1.65 0.050 0.065 Soldering Pad Outline (Reference Only) B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC L 0.40 1.27 0.016 0.050 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Part Numbering System Part Marking System U2.8-4 SLVU2.8 -4BT G U2.8-4 PVrooUdl t=ua ScgLteV SU L2ee.r8vieesl No. of channels G= Green T= Tape & Reel Package B = SOIC-8 Series No. of channels Ordering Information Part Number Package Marking Min. Order Qty. SLVU2.8-4BTG SOIC-8 U2.8-4 2500 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres Inches User Feeding Direction Symbol Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.9 2.1 0.075 0.083 Pin 1 Location D 1.5 1.6 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t 0.30 ± 0.05 0.012 ± 0.002 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17