T eZZ -- cPP hoo nww i cee arr lLL Specification DEE DD a tXX a11 SFT722N-S 00 S h44 99 e e00 t SSC CUSTOMER Drawn Approval Approval RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee arr lLL CONTENTS DEE DD a tXX a11 00 S h44 99 e e00 1. Feature & Application t 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of SFT722N-S 7. Outline Dimension 8. Packing 9. Lot Number 10. Soldering 11. Precaution for use 12. Reliability Test Item and Condition RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZ - cP ho nw i ce ar lL SFT722N-S DE SFT722N-S D a tX a1 S0 Features Description h4 e9 • Pb-free Reflow Soldering e0 This surface-mount LED comes application t in PLCC standard package • RoHSCompliant dimension. It has a substrate • 6-Pin (R,G,B separate) made up of a molded plastic type reflector sitting on top of a bent lead frame. The die is attached • White colored SMT within the reflector cavity and package the cavity is encapsulated by • Suitable for all SMT epoxy or silicone. assembly methods The package design coupled • ESD-withstand voltage : with careful selection of up to 2 kV (MIL-STD-883D) component materials allow these • Encapsulating Resin : products to perform with high silicone resin reliability in a larger • High Reliability (silicone temperature range -40℃ to resin) 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. Applications • Indoor and outdoor displays • LCD Backlights etc. • R G B –displays • Automotive • Signage and Channel letter • Indicator RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 2. Absolute maximum ratings arr lLL (Ta=25ºC) DEE DD a tXX Value a11 00 Parameter Symbol Unit S h44 Red Green Blue 99 e e00 Forward Current I 30 30 30 mA F t Forward Peak Surge Current*2 I 100 100 100 mA FM Reverse Voltage (per die) V 5 V R 81*3 120*3 114*3 Power Dissipation P mW d 263*4 Operating Temperature T -40 ~ +100 ºC opr Storage Temperature T -40 ~ +100 ºC stg *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤1msec of pulse width and D ≤1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 3. Electric & Optical characteristics (Ta=25ºC) arr lLL DEE Parameter Symbol Condition Min Typ Max Unit DD a tXX a11 Red IF =20mA 1.8 2.1 2.3 00 S Forward Voltage Green V I =20mA 3.0 3.2 3.8 V h44 F F 99 Blue I =20mA 3.0 3.2 3.6 e F e00 Red - - 1 t V =10V Reverse Current Green I R - - 1 µA R (per die) Blue - - 1 Red - 700 1100 Luminance I =20mA Green I F - 1200 1600 mcd Intensity *1 V (per chip) Blue - 200 560 Red - 1.7 - I =20mA Luminance Flux Green Φ F - 3 - lm V (per chip) Blue - 1 - Red I =20mA - 632 - F Peak Wavelength Green λ I =20mA - 518 - nm P F Blue I =20mA - 453 - F Red I =20mA 620 623 625 F Dominant Green λ I =20mA 520 527 535 nm Wavelength d F Blue I =20mA 455 460 465 F Red I =20mA - 14 - F Spectral Bandwidth Green ∆λ I =20mA - 33 - nm F Blue I =20mA - 23 - F I =20mA Viewing Angle *3 R, G, B 2θ F - 120 - deg. ½ (per die) Red - 41 - η I =20mA Optical Efficiency Green op F - 47 - lm/W (per chip) Blue - 16 - Red I =20mA - 157 - Thermal Resistance F (one chip on) Green Rth I =20mA - 177 - K/W ja F Blue I =20mA - 186 - F *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2　½is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i 4. Optical characteristics cee arr lLL DEE Forward Current vs. Forward Voltage (per die) DD a t X X (Ta=25 OC ) a11 100 00 S h44 e99 50 Blue Green e00 Red t A] m P [ 20 F nt I e 10 r r u C d 5 r a w r o F 1 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 Forward Voltage VF [V] Relative Luminous Intensity vs Forward Current (T =25 OC ) 6 a RED BLUE 5 GREEN ) u. (a. 4 y sit o n mi 3 u L e ativ 2 el R 1 0 0 20 40 60 80 100 120 Forward Current IFP [mA] RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 4. Optical characteristics arr lLL DEE Ambient Temperature vs. Power Dissipation DD a tXX a11 280 S00 260 h44 3 CHIP ON 240 99 e e00 220 t 200 180 W) m 160 (D P 140 n atio 120 p Dissi 100 wer 80 1 CHIP ON o P 60 40 20 0 0 20 40 60 80 100 Ambient Temperature T [OC] a Radiation Diagram (T =25 OC ) a 0 -30 30 -60 60 -90 90 RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i 4. Optical characteristics cee arr lLL DEE DD a tXX Spectrum a11 00 S (T =25℃, I=20mA/chip) h44 A F 99 e e00 1.0 t RED u.] 0.8 GREEN . a BLUE [ y t si n 0.6 e t n I e v ti 0.4 a el R 0.2 0.0 400 500 600 700 800 Wavelength [nm] RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 5. Color & Binning arr lLL DEE DD a tXX a11 00 S h44 99 e e00 t 0.9 520 Green 525 0.8 515 530 535 510 540 545 0.7 550 505 555 560 0.6 A B 565 570 500 575 0.5 580 585 y 590 495 0.4 595 Red 600 610 0.3 620 490 630 830 0.2 485 Bluish White 480 0.1 2 475 1 Blue 470 460 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo 5. Color & Binning nww i cee arr lLL DEE DD a tXX a11 00 S h44 99 e e00 t 0.30 g h 0.28 e f 0.26 y c d 0.24 b a 0.22 0.20 0.22 0.24 0.26 0.28 0.30 x RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 6. Rank of SFT722N-S arr lLL DEE DD 1) Rank Name a tXX X X X X a11 1 2 3 4 00 Total Iv Green Color Blue Color White Color S h44 99 e 2) Test Condition e00 Value t Parameter Symbol Unit R G B Forward Current If 20 20 20 mA Reverse Voltage Vr 10 10 10 V 3) Luminous Intensity [Iv] R G B MIN MAX MIN MAX MIN MAX 460 1100 800 1600 200 560 Rank Total Iv Unit Name MIN MAX N 1460 1900 O 1900 2500 mcd P 2500 2880 4) Forward Voltage [Vf] R G B Unit MIN MAX MIN MAX MIN MAX 1.8 2.3 3.0 3.8 3.0 3.6 V 5) Reverse Current [Ir] R G B Unit MIN MAX MIN MAX MIN MAX - 1 - 1 - 1 uA [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 7.Outline Dimension arr lLL DEE DD Package Outlines a tXX a11 00 S h44 6 5 4 99 e e00 t Package Marking (Cathode) 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Circuit Diagram Solder Pad Blue Green Red Anode Anode Anode 6 5 4 1 2 3 Blue Green Red Cathode Cathode Cathode * MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Silicone Resin Electrodes Ag Plating Copper Alloy RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 8. Packing arr lLL DEE DD Package a t X X Marking a11 00 S h44 99 e e00 t ( Tolerance: ±0.2, Unit: mm ) (1)Quantity : 700 pcs/Reel (2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee ● Reel Packing Structure arr lLL Reel DEE DD a tXX a11 00 S h44 QUANTITY : XXXX 99 e LOT NUMBER : XXXXXXXXXX e00 t PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a b c 245 220 102 7inch 245 220 142 1 SIDE c TUV MADE IN KOREA Acriche 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX Semiconductor EcoLight RoHS b PART NUMBER : a SEOUL SEMICONDUCTOR CO., LTD. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 9. Lot Number arr lLL DEE The lot number is composed of the following characters; DD a tXX a11 SFT○□□◎◎ # ~ # 00 S SFT –First Part Name h44 e99 ○ – Year (6 for 2006, 7 for 2007, 8 for 2008 ) e00 t □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# – The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT722N-S SEOUL SEMICONDUCTOR CO., LTD. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 10. Soldering arr lLL DEE DD a (1) Reflow Soldering Conditions / Profile tXX a11 00 S h44 Lead Solder 99 e et00 Lead Solder 1~5 o C / sec. 240 oC Max. 10 sec. Max. Pre-heat 130~210℃ Pre-heating Pre-heat time 120 sec. Max. 1~5 o C / sec. 130~210 o C 6A0bsoevc.e M21a0x o. C c6o ooCli/nsegc. Max. Peak-Temperature 240℃Max. 120sec. Max. Soldering time Condition 10 sec. Max. Lead Free Solder Lead Free Solder 1~5 o C / sec. 260 oC Max. Pre-heat 180~200℃ 10 sec. Max. Pre-heating Pre-heat time 120 sec. Max. 1~5 o C / sec. 180~220 oC 60sec. Maxo. cooling Above 220 C o 6 C/sec. Max. Peak-Temperature 260℃Max. 120sec. Max. Soldering time Condition 10 sec. Max. (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (3) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww i cee 11. Precaution for use arr lLL DEE (1) Storage DD a In order to avoid the absorption of moisture, it is recommended to store in a dry tXX a11 box (or a desiccator) with a desiccant. Otherwise, to store them in the following S00 environment is recommended. h44 Temperature : 5ºC ~30ºC Humidity : maximum 70%RH 99 e e00 (2) Attention after open. t LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture- proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

T eZZ -- cPP hoo nww 12. Reliability Test Item and Condition i cee arr Number lLL Duration DEE Item Reference Test Condition / Cycle of aDD Damage tXX EIAJ ED- T =-40oC (30MIN) ~ 100oC 100 a11 Thermal Shock a 0/22 00 4701 (30MIN) Cycle S h44 Temperature EIAJ ED- T =-40oC (30MIN) ~ 25oC (5MIN) 100 e99 a 0/22 Cycle 4701 ~ 100oC (30MIN) ~ 25oC (5MIN) Cycle e00 t High EIAJ ED- 1000 Temperature T =100oC 0/22 4701 a Hours Storage High Temperature EIAJ ED- 1000 T =85oC, RH=85% 0/22 High Humidity 4701 a Hours Storage Low EIAJ ED- 1000 Temperature T =-40oC 0/22 4701 a Hours Storage Operating Internal 1000 T =25oC, I =20mA 0/22 Endurance Test Reference a F Hours High Temperature Internal 300 T =85oC, RH=85%, I =15mA 0/22 High Humidity Reference a F Hours Life Test High Internal 500 Temperature T =85oC, I =20mA 0/22 Reference a F Hours Life Test Low Internal 1000 Temperature T =-40oC, I =20mA 0/22 Reference a F Hours Life Test MIL-STD- ESD(HBM) 1KV at 1.5kΩ; 100pF 3 Time 0/22 883D (cid:0) Criteria for Judging the Damage Criteria for Judgement Item Symbol Condition MIN MAX Forward Voltage V I =20mA - USL*1 × 1.2 F F Reverse Current I V =5V - USL*1 × 2.0 R R Luminous I I =20mA LSL*2 × 0.5 - Intensity V F Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level RReevv.. 0055 SSeepptteemmbbeerr 22000099 wwwwww..ZZLLEEDD..ccoomm 서식번호 : SSC-QP-7-07-24 (Rev.04)

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