2016-07-22 CHIPLED® with High Power Infrared Emitter (850 nm) Version 1.4 SFH 4053 Features: • Very small package: (LxWxH) 1.0 mm x 0.5 mm x 0.45 mm Applications • Miniature photointerrupters • Proximity sensor • Mobile devices • Touchscreen Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code I [mW/sr] e I = 70 mA, t =20 ms F p SFH 4053 7 (≥ 4) Q65111A0651 Note: Measured at a solid angle of Ω = 0.01 sr 2016-07-22 1

Version 1.4 SFH 4053 Maximum Ratings (T = 25 °C) A Parameter Symbol Values Unit Operation and storage temperature range T ; T -40 ... 85 °C op stg Reverse voltage V 5 V R Forward current I 70 mA F Surge current I 0.7 A FSM (t ≤ 400 µs, D = 0) p Power consumption P 140 mW tot ESD withstand voltage V 2 kV ESD (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) Thermal resistance junction - ambient 1) page 12 R 450 K / W thJA Thermal resistance junction - soldering point R 350 K / W thJS 2) page 12 Characteristics (T = 25 °C) A Parameter Symbol Values Unit Peak wavelength (typ) λ 860 nm peak (I = 70 mA, t = 20 ms) F p Centroid wavelength (typ) λ 850 nm centroid (I = 70 mA, t = 20 ms) F p Spectral bandwidth at 50% of I (typ) ∆λ 30 nm max (I = 70 mA, t = 20 ms) F p Half angle (typ) ϕ ± 70 ° Dimensions of active chip area (typ) L x W 0.2 x 0.2 mm x mm Rise and fall time of I ( 10% and 90% of I ) (typ) t, t 12 ns e e max r f (I = 70 mA, R = 50 Ω) F L Forward voltage (typ (max)) V 1.6 (≤ 2) V F (I = 70 mA, t = 20 ms) F p Forward voltage (typ (max)) V 2.4 V F (I = 500 mA, t = 100 µs) F p Reverse current I not designed for µA R (V = 5 V) reverse operation R Total radiant flux (typ) Φ 35 mW e (I = 70 mA, t =20 ms) F p 2016-07-22 2

Version 1.4 SFH 4053 Parameter Symbol Values Unit Temperature coefficient of I or Φ (typ) TC -0.5 % / K e e I (I = 70 mA, t = 20 ms) F p Temperature coefficient of V (typ) TC -0.7 mV / K F V (I = 70 mA, t = 20 ms) F p Temperature coefficient of wavelength (typ) TC 0.3 nm / K λ (I = 70 mA, t = 20 ms) F p Grouping (T = 25 °C) A Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity I = 70 mA, t =20 ms I = 70 mA, t =20 ms I = 500 mA, t = 25 µs F p F p F p I [mW / sr] I [mW / sr] I [mW / sr] e, min e, max e, typ SFH 4053-P 4 8 35 SFH 4053-Q 6.3 12.5 55 Note: measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 3) page 12 Radiant Intensity 3) page 12 I = f(λ), T = 25°C I / I (100 mA) = f(I ), single pulse, t = 25 µs, rel A e e F p OHF04132 T = 25°C 100 A % 101 OHF04406 I rel I e 80 I (70 mA) e 100 5 60 10-1 40 5 20 10-2 5 0 700 750 800 850 nm 950 10-3 λ 100 5 101 5 102 mA 103 I F 2016-07-22 3

Version 1.4 SFH 4053 Max. Permissible Forward Current Forward Current 3) page 12 I = f(T ), R = 450 K/W I = f(V ), single pulse, t = 100 µs, T = 25°C F, max A thJA F F p A 80 OHF05343 100 OHF03826 mA A I I F F 70 60 10-1 5 50 40 10-2 5 30 20 10-3 5 10 0 10-4 0 20 40 60 80 ˚C100 0 0.5 1 1.5 2 2.5 V 3 T V A F Permissible Pulse Handling Capability I = f(t ), T = 25 °C, duty cycle D = parameter F p A OHF05344 0.8 t A P IF 0.7 D=TtP IF T 0.6 0.5 D= 0.005 0.4 0.01 0.02 0.05 0.3 0.1 0.2 0.5 0.2 1 0.1 0 10-5 10-4 10-3 10-2 10-1 100 101s102 t p 2016-07-22 4

Version 1.4 SFH 4053 Radiation Characteristics 3) page 12 I = f(ϕ), T = 25°C rel A 40˚ 30˚ 20˚ 10˚ 0˚ OHF05523 ϕ 1.0 50˚ 0.8 long axis short axis 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Package Outline Dimensions in mm. 2016-07-22 5

Version 1.4 SFH 4053 Pinning Pin Description 1 anode 2 cathode Package Chipled (EIA 0805) Approximate Weight: 0.56 mg Note: Colour: colourless Recommended Solder Pad Dimensions in mm (inch). 2016-07-22 6

Version 1.4 SFH 4053 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 OHA04525 300 ˚C T 250 T 245 ˚C 240 ˚C p t 217 ˚C P 200 t L 150 t S 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t OHA04612 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Profil-Charakteristik Symbol Einheit Minimum Recommendation Maximum Ramp-up rate to preheat*) 2 3 K/s 25 °C to 150 °C Time t t 60 100 120 s S S T to T Smin Smax Ramp-up rate to peak*) 2 3 K/s T to T Smax P Liquidus temperature T 217 °C L Time above liquidus temperature t 80 100 s L Peak temperature T 245 260 °C P Time within 5 °C of the specified peak t 10 20 30 s P temperature T - 5 K P Ramp-down rate* 3 6 K/s T to 100 °C P Time 480 s 25 °C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2016-07-22 7

Version 1.4 SFH 4053 Taping Dimensions in mm [inch]. Tape and Reel 8 mm tape with 3000 pcs. on ∅ 180 mm reel W 1 D P 0 0 P 2 5 2 0. ± E 3.0 1 F W A N Label P 1 Direction of unreeling Direction of unreeling W 2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2016-07-22 8

Version 1.4 SFH 4053 Tape dimensions [mm] Tape dimensions in mm W P P P D E F 0 1 2 0 8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05 or 4 ± 0.1 Reel dimensions [mm] Reel dimensions in mm A W N W W min 1 2max 180 8 60 8.4 + 2 14.4 Barcode-Product-Label (BPL) OOOOSSSSRRRRAAAAMMMM OOOOppppttttoooo SSSSSSeeeeeemmmmmmiiiiiiccccccoooooonnnnnnddddddEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEuuuuuuccccccttttttoooooorrrrrrssssss LX XXXX BIN1: XX-XX-X-XXX-X XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX RoHS Compliant ((((((666666PPPPPP)))))) BBBBBBAAAAAATTTTTTCCCCCCHHHHHH NNNNNNOOOOOO::::::1111111111222222222233333333334444444444555555555566666666667777777777888888888899999999990000000000 AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA MLTemp ST MMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMM X XXX °C X (1T) LOT NO:1234567890 (((((((((999999999DDDDDDDDD))))))))) DDDDDDDDD/////////CCCCCCCCC:::::::::111111111222222222333333333PPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPPP444444444 PPPPPPPPaaaaaaaacccccccckkkkkkkk::::::::LLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLLL RRRRRRRRXXXXXXXXXXXXXXXX DDDDDDEEEEEEMMMMMMYYYYYY XXXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXX____________XXXXXXXXXXXX111111111111222222222222333333333333____________111111111111222222222222333333333333444444444444............EEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEE111111111111222222222222333333333333444444444444 XXXXXXXXXXXX (X) PROD NO:123456789(Q)QTY:9999 (G) GROUP:XXXXXXXXXXXXXX-------XXXXXXXXXXXXXX-------XXXXXXX-------XXXXXXX OHA04563 Dry Packing Process and Materials Moisture-sensitive label or print Barcode label 1. 2S. hAefrltfe eblfilrfo otedaw hi)yi, nst3M bv.e) sba omDeaSpuagtapeoln .)4oritvb e.i-r)s eHd I Icpe ffd2oe uhd br abpbsCmawBela aOeiafirstMaogtaenkdT:eerPnihi _< rg AOietqh Drnk2T2eIin,ydu1seg 4aibn,OsSf Ie 0 t r lsiMU icnTmdeaeo%esbFselS odM le Uwea irioIabE Tnod,vRscegRioP nMnabtI ooiMataqcotHrtkduECatIsc ihoM r eutr.reit/ toimn iCosiOsuerrSsJ eo c mgtrminteOeEa,qEtoLCuest thde t.e urDNadeN,bN i aaiL u<eetvrsEveDo r S n efIedleaLe4pClw Uslvo a iTeie0 ereIel L 1sCbllJvne ˚n bVe- etTe>eClb2˚e lSvmE l OdCepe1:To 2laro)F R0.swDaolnu3%uaS-ocdFnt lbt0 eoijf<orF3wsne al(oti3sig9hcoFicfr t,t lfmn0eo teioiboorfg%nlr red:mo t a yi( rrt br>nempeto c ieak eali1o, emkL aad nn et sfY1eki E dr a eive pttaYp4 Vaire1ra l a2eo oreW6EIhc3fdanc d8 rkbu aesbe˚Lla tamHrdCea oegin ucfk oikedro±,siO_u< sd et rMs.ei5y3 esl deo˚M(0aie bCRS˚soeMn,tliCtH ius/oMo)trci.r6ueasol 0trRi Lue%sw trei LuetvR rehAeLe lHv de.eL4lva ete5lve Me5lcF aol6odFloeorF) .lotioFr lmotior emot ir emt7 i 2em 4 H8e 2 oH4 uorH6 suorHsuorusrs Humidity indicator Barcode label Desiccant yyrraa.yssrssrdeee ycctfleeaenn ttyan ffl.ueiian q,,tcussa.certrttiociiidrdrnnseoatiaeuumssavtt.t 5dangtt oolc.iieemltnn roni3d iaetanndsuuscii 8eng ,,,piiekn mmCttt8 sleeeneeemclatIctIo-pkkaeaa wwwrHtryoIenaaaohhxxi- ctC Lm peebbfff ccei oIIIgdfIh iDaMi dtmdb ikoruacvceHAsTh%%icD% Ee50s5Wa11elP OSRAM OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2016-07-22 9

Version 1.4 SFH 4053 Transportation Packing and Materials Barcode label Barcode label 1. 2S. hAefrltfe eblfilrfo otedaw hi)yi, nst3M bv.e) sba omDeaSpuagtapeoln .)4oritvb e.i-r)s eHd I Icpe ffd2oe uhd br abpbsCmawBela aOeiafirstMaogtaenkdT:eerPnihi _< rg AOietqh Drnk2T2eIin,ydu1seg 4aibn,OsSf Ie 0 t rlsiMU icnTmdeaeo%esbFselS odM le Uwea irioIabE Tnod,vRscegRioP nMnabtI ooiMataqcotHrtdkuECatIsc ihoM r eutr.reit/ toimn iCosiOsuerrSsJ eo c mgtrminteOeEa,qEtoLCuest thde t.e urDNadeN,bN i aaiL u<eetvrsEveDo r S n efIedleaLe4pClw Uslvo a iTeie0 ereIel L 1sCbllJvne ˚n bVe- etTe>eClb2˚e lSvmE l OdCepe1:To 2laro)F R0.swDaolnu3%uaS-ocdFnt lbt0 eoijf<orF3wsne al(oti3sig9hcoFicfr t,t lfmn0eo teioiboorfg%nlr redm:o t a yi( rrt br>nempeto c ieak eali1o, emkL aad nn et sfY1eki E dr a eive pttaYp4 Vaire1ra l a2eo oreW6EIhc3fdancO d8 rkbu aesbe˚LlaS taSmHrdCea oeegiRn ucfk oikderom±,sAii_u< sd et rcMs.e(i5My3 eos6 l deo˚PM(0an)ie ObCdR˚sBoenMp,utliACtH tciuTs/toMo)trocCi.ro6ueHarso l 0tr(is N1Lue%sTOw tr2:)e i Lu1eLtvR r0OeheLeT 0lH v de2N.eL4l1vaO :et9e15lve9( 2 eX835)lc F aPoGl6RodFHlO1oeDorF) 2 .lNo3tioFrO41: lmot1ior0 emo(t 0ir9 1emDt7) i4 M2eDm2Muster/ 4 uLl5 CH:8etSi 2 0 oYH41 T u4TorOH64(6 suPQo7rH)L6suQoErTBiusYD:nrB1i2:s n0B2Pi:-0 n103-Q:-2M10-L220T2ea2m32p 02 S4C0T 2A 6dRC0 d itRRiC0 o7nRP7aTlA CTKEVX(ATGR): GRR1DO8EUMP:YP-1+Q-1 OSSeRmAic(Mo6 Pn) OdBpuAtcTtoCoHr (sN1TO2:) 1L0OT0 2N1O:919(2X83) PGRHO1D 2N3O41:10(091D)4 MD2Muster/uLl5C:tSi0 Y1 T4TO4(6PQ7)L6QETBiYD:nB1i2: n0B2Pi:-0 n103-Q:-2M10-L220T2ea2m32p 02 S4C0T 2A 6dRC0 d itRRiC0 o7nRP7aTlA CTKEVX(ATGR): GRR1DO8EUMP:YP-1+Q-1 OSRAM Packing Sealing label OHA02044 Dimensions of transportation box in mm Width Length Height 200 ± 5 195 ± 5 30 ± 5 2016-07-22 10

Version 1.4 SFH 4053 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-07-22 11

Version 1.4 SFH 4053 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 5 mm2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-07-22 12

Version 1.4 SFH 4053 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-07-22 13