SF1186B-2 • Designed for Front-end GPS Applications • Low Insertion Loss Pb 1575.42 MHz • 3.0 x 3.0 x 1.3 mm Surface-mount Case • No Matching Network Required SAW Filter • Complies with Directive 2002/95/EC (RoHS) • Qualified per AEC-Q200 requirements Maximum Ratings Rating Symbol Value Units Maximum Input Signal Level +10 dBm DC Voltage on any Non-ground Terminal WVdc 4 Volts Operable Temperature Range -45 to +125 °C Storage Temperature Range TSTG -40 to +105 °C Lead Soldering Temperature for 10 Seconds TWAVE 260 °C Peak Reflow Solder Temp for 40 Seconds TReflow 235 °C SM3030-6 Suitable for Lead-free Soldering - Max Soldering Temperature 260°C for 30 s Electrical Characteristics Characteristic Sym Notes Min Typ Max Units Center Frequency f 1 1575.42 MHz O 1 dB Bandwidth BW 1 2.046 15.3 MHz 1 Passband Amplitude Ripple, f ±2.0 MHz 0.1 1.0 dB O P-P Passband Group Delay 27 ns Passband Group Delay Ripple, f ±2.0 MHz 1 ns O P-P Passband VSWR, f ±2.0 MHz 1.4 2.0 O Insertion Loss 1 2.68 3.5 dB Attenuation Referenced to 0 dB: 850 MHz 1 45 51.2 1500 MHz 1 40 52.7 1535.42 MHz 1 20 38.9 dB 1615.42 MHz 1 20 58.8 1640 MHz 1 45 59.1 1700 MHz 1 50 56.7 Temperature Coefficient -30 ppm/°C Operating Temperature T 1 -40 +85 °C A Single-ended Input /Output Impedance Match No matching network required for operation at 50 ohms Case Style SM3030-6 3 x 3 mm Nominal Footprint Lid Symbolization y=year, ww=week, s=shift 468 YWWS Standard Reel Quantity Reel Size 7 Inch 500 Pieces/Reel 6 Reel Size 13 Inch 3000 Pieces/Reel Electrical Connections Pin # Description Pin # Description 1 Ground 4 Ground 2 Input 5 Output 3 Ground 6 Ground CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. NOTES: 1. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board without imped- ance matching and measured with 50  network analyzer. 2. The design, manufacturing process, and specifications of this filter are subject to change. 3. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. 4. US and international patents may apply. 5. Murata, stylized Murata logo, and Murata N.A., Inc. are registered trademarks of Murata Manufacturing Co., Ltd. 6. Tape and Reel Standard Per ANSI/EIA 481. Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 1 of 7

Transfer function : (1) S21 response (span : 300 MHz) (2) S21 response (span : 3 GHz) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 2 of 7

Reflection Functions: S11 S22 Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 3 of 7

Reflection Functions: Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 4 of 7

Group Delay: 28 Oct 2010 10:49:43 CH1 S21 DEL 10 ns/ REF 0 s 3: 422 .72 ps -4 .000 000 MHz SF1186B-2 GDD S mo CH1 MRaErFke=r2s mean : 27.016 ns C s.dev : 240 .27 ps p-p : 869 .03 ps 3 1 2 Full CENTER 1 575 .830 000 MHz SPAN 40.000 000 MHz Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 5 of 7

SM3030-6 Case 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions mm Inches Dimension Min Nom Max Min Nom Max A 2.87 3.00 3.13 0.113 0.118 0.123 B 2.87 3.00 3.13 0.113 0.118 0.123 C 1.12 1.25 1.38 0.044 0.049 0.054 D 0.77 0.90 1.03 0.030 0.035 0.040 E 2.67 2.80 2.93 0.105 0.110 0.115 F 1.47 1.60 1.73 0.058 0.063 0.068 G 0.72 0.85 0.98 0.028 0.033 0.038 H 1.37 1.50 1.63 0.054 0.059 0.064 I 0.47 0.60 0.73 0.019 0.024 0.029 (cid:2) J 1.17 1.30 1.43 0.046 0.051 0.056 (cid:6) K 3.20 0.126 L 1.70 0.067 (cid:5) M 1.05 0.041 N 0.81 0.032 O 0.38 0.015 (cid:2) (cid:5) Case Materials (cid:3) Materials (cid:5) Solder Pad 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Plating (cid:4) (cid:4) Lid Plating 2.0 to 3.0 µm Nickel PCB Footprint Top View Body Al2O3 Ceramic Pb Free TOP VIEW BOTTOM VIEW B C G H 1 6 6 1 Y W 4 A 2 6 5 E F 5 2 I W 8 S 3 4 4 3 D J Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 6 of 7

Tape and Reel Specifications “B” Quantity Per Reel .F F. Inches millimeters E E R R 0 " 7 178 500 0 B 1 " 13 330 3000 See Detail "A" 12.0 0 3. 1 2.0 20.2 COMPONENT ORIENTATION 0.3 2.0 4.0 PIN #1 1.5 A 75 1. RO.3 (MAX.) 5 5. 0 2. 3.35 1 B B A 3.35 8.0 R0.5 (TYP.) 1.4 1.5 SECTION A-A USER DIRECTION OF FEED SECTION B-B Copyright © Murata Manufacturing Co., Ltd. All rights reserved. April 2014 www.murata.com SF1186B-2 (R) 5/2/17 Page 7 of 7