NE5532, SA5532, SE5532, NE5532A, SE5532A Internally Compensated Dual Low Noise Operational Amplifier http://onsemi.com The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, SOIC−8 such as the 1458, it shows better noise performance, improved output 8 D SUFFIX drive capability and considerably higher small-signal and power CASE 751 1 bandwidths. This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and PDIP−8 control circuits, and telephone channel amplifiers. The op amp is N SUFFIX CASE 626 internally compensated for gains equal to one. If very low noise is of 8 prime importance, it is recommended that the 5532A version be used 1 because it has guaranteed noise voltage specifications. SOIC−16 WB Features 16 D SUFFIX • Small-Signal Bandwidth: 10 MHz CASE 751G • Output Drive Capability: 600 (cid:2), 10 V 1 RMS • Input Noise Voltage: 5.0nV(cid:2)(cid:3)Hz (Typical) PIN CONNECTIONS • DC Voltage Gain: 50000 • N, D8 Packages AC Voltage Gain: 2200 at 10 kHz • Power Bandwidth: 140 kHz OUTA 1 8 V+ •• SLlaerwge R Sautpe:p l9y.0 V Vol/t(cid:3)asge Range: (cid:4)3.0 to (cid:4)20 V +−IINNAA 32 A B 76 O−IUNTBB • Compensated for Unity Gain V- 4 5 +INB • Pb−Free Packages are Available Top View D Package* −INA 1 16 NC +INA 2 15 NC NC 3 14 NC V− 4 13 OUTA NC 5 12 V+ NC 6 11 OUTB +INB 7 10 NC −INB 8 9 NC Top View *SOL and non-standard pinout. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: September, 2013 − Rev. 2 NE5532/D

NE5532, SA5532, SE5532, NE5532A, SE5532A + _ Figure 1. Equivalent Schematic (Each Amplifier) MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage VS (cid:4)22 V Input Voltage VIN (cid:4)VSUPPLY V Differential Input Voltage (Note 1) VDIFF (cid:4)0.5 V Operating Temperature Range Tamb °C NE5532/A 0 to 70 SA5532 −40 to +85 SE5532/A −55 to +125 Storage Temperature Tstg −65 to +150 °C Junction Temperature Tj 150 °C Maximum Power Dissipation, Tamb = 25°C (Still-Air) PD mW 8 D8 Package 780 8 N Package 1200 16 D Packagee 1200 Thermal Resistance, Junction−to−Ambient R(cid:4)JA °C/W 8 D8 Package 182 8 N Package 130 16 D Packagee 140 Lead Soldering Temperature (10 sec max) Tsld 230 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to (cid:4)10 mA. http://onsemi.com 2

NE5532, SA5532, SE5532, NE5532A, SE5532A DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = (cid:4)15 V, unless otherwise noted.) (Notes 2, 3 and 4) SE5532/A NE5532/A, SA5532 Characteristic Symbol Test Conditions Min Typ Max Min Typ Max Unit Offset Voltage VOS − − 0.5 2.0 − 0.5 4.0 mV − Overtemperature − − 3.0 − − 5.0 mV (cid:5)VOS/(cid:5)T − − 5.0 − − 5.0 − (cid:3)V/°C Offset Current IOS − − − 100 − 10 150 nA − Overtemperature − − 200 − − 200 nA (cid:5)IOS/(cid:5)T − − 200 − − 200 − pA/°C Input Current IB − − 300 500 − 300 800 nA − Overtemperature − − 700 − − 1000 nA (cid:5)IB/(cid:5)T − − 5.0 − − 5.0 − nA/°C Supply Current ICC − − 8.0 10.5 − 8.0 16 mA − Overtemperature − − 13 − − − Common-Mode Input Range VCM − (cid:4)12 (cid:4)13 − (cid:4)12 (cid:4)13 − V Common-Mode Rejection Ratio CMRR − 80 100 − 70 100 − dB Power Supply Rejection Ratio PSRR − − 10 50 − 10 100 (cid:3)V/V Large-Signal Voltage Gain AVOL RL (cid:5)2.0 k(cid:2); VO = (cid:4)10 V 50 100 − 25 100 − V/mV Overtemperature 25 − − 15 − − RL (cid:5)600 (cid:2); VO = (cid:4)10 V 40 50 − 15 50 − Overtemperature 20 − − 10 − − Output Swing VOUT RL (cid:5) 600 (cid:2) (cid:4)12 (cid:4)13 − (cid:4)12 (cid:4)13 − V Overtemperature (cid:4)10 (cid:4)12 − (cid:4)10 (cid:4)12 − RL (cid:5) 600 (cid:2); VS = (cid:4)18 V (cid:4)15 (cid:4)16 − (cid:4)15 (cid:4)16 − Overtemperature (cid:4)12 (cid:4)14 − (cid:4)12 (cid:4)14 − RL (cid:5) 2.0 k(cid:2) (cid:4)13 (cid:4)13.5 − (cid:4)13 (cid:4)13.5 − Overtemperature (cid:4)12 (cid:4)12.5 − (cid:4)10 (cid:4)12.5 − Input Resistance RIN − 30 300 − 30 300 − k(cid:2) Output Short Circuit Current ISC − 10 38 60 10 38 60 mA 2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to (cid:4)10 mA. 3. For operation at elevated temperature, derate packages based on the package thermal resistance. 4. Output may be shorted to ground at VS = (cid:4)15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. http://onsemi.com 3

NE5532, SA5532, SE5532, NE5532A, SE5532A AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = (cid:4)15 V, unless otherwise noted.) NE/SE5532/A, SA5532 Characteristic Symbol Test Conditions Min Typ Max Unit Output Resistance ROUT AV = 30 dB Closed-loop − 0.3 − (cid:2) f = 10 kHz, RL = 600 (cid:2) Overshoot − Voltage-Follower % VIN = 100 mVP-P − 10 − CL = 100 pF; RL = 600 (cid:2) Gain AV f = 10 kHz − 2.2 − V/mV Gain Bandwidth Product GBW CL = 100 pF; RL = 600 (cid:2) − 10 − MHz Slew Rate SR − − 9.0 − V/(cid:3)s Power Bandwidth − VOUT = (cid:4)10 V − 140 − kHz VOUT = (cid:4)14 V; − 100 − RL = 600 (cid:2) VCC = (cid:4)18 V ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = (cid:4)15 V, unless otherwise noted.) NE/SE5532 NE/SA/SE5532A Characteristic Symbol Test Conditions Min Typ Max Min Typ Max Unit Input Noise Voltage VNOISE fO = 30 Hz − 8.0 − − 8.0 12 nV/√Hz fO = 1.0 kHz − 5.0 − − 5.0 6.0 Input Noise Current INOISE fO = 30 Hz − 2.7 − − 2.7 − pA/√Hz fO = 1.0 kHz − 0.7 − − 0.7 − Channel Separation − f = 1.0 kHz; RS = 5.0 k(cid:2) − 110 − − 110 − dB http://onsemi.com 4

NE5532, SA5532, SE5532, NE5532A, SE5532A TYPICAL PERFORMANCE CHARACTERISTICS 60 40 120 TYPICAL VALUES RF = 10 k(cid:2); RE = 100 (cid:2) TYPICAL VALUES TYPVISC A= L(cid:4) V1A5L VUES 40 30 80 B) dB) N (d RF = 9 k(cid:2); RE = 1 k(cid:2) (V) AIN (40 GAI20 Vo(p-p) 20 G RF = 1 k(cid:2); RE = ∞ 0 0 10 -40 -20 0102 103 104 105 106 107 10 102 103 104 105 106 107 103 104 105 106 107 108 f (Hz) f (Hz) f (Hz) Figure 2. Open-Loop Frequency Figure 3. Closed-Loop Frequency Figure 4. Large−Signal Frequency Response Response Response 80 1,4 30 VS = (cid:4)15 V VS = (cid:4)15 V TYPICAL VALUES 60 1,2 20 (mIOA) 40 TYP (mIIA) 0,8 VIN (V) 10 20 0,4 0 0 0 -55 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125 0 10 20 Tamb (oC) Tamb (oC) Vp; −VN (V) Figure 5. Output Short−Circuit Figure 6. Input Bias Current Figure 7. Input Common−Mode Current Voltage Range 6 IO = 0 10−2 TYP 10 4 TYP IP IN (nV(cid:2)(cid:3)Hz) 1 (mA) 2 10−1 0 10−2 0 10 20 10 102 103 104 Vp; −VN (V) f (Hz) Figure 8. Supply Current Figure 9. Input Noise Voltage Density http://onsemi.com 5

NE5532, SA5532, SE5532, NE5532A, SE5532A + 5532 (1/2) V+ RS 25 (cid:2) − 5532 RF VIN − VOUT + 1 k(cid:2) 100 pF VI RE 100 pF 800 (cid:2) 600 (cid:2) V− Closed-Loop Frequency Response Voltage-Follower Figure 10. Test Circuits MARKING DIAGRAMS 8 8 8 N5532 N5532 S5532 NE5532AN NE5532N SA5532N SE5532N ALYWA ALYW ALYWA AWL AWL AWL AWL (cid:2) (cid:2) (cid:2) YYWWG YYWWG YYWWG YYWWG 1 1 1 SOIC−8 PDIP−8 D SUFFIX N SUFFIX CASE 751 CASE 626 16 NE5532D AWLYYWWG 1 SOIC−16 WB D SUFFIX CASE 751G A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or (cid:2) = Pb−Free Packagee http://onsemi.com 6

NE5532, SA5532, SE5532, NE5532A, SE5532A ORDERING INFORMATION Device Description Temperature Range Shipping† NE5532AD8 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail (Pb−Free) NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel (Pb−Free) NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail (Pb−Free) NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 47 Units / Rail NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package 47 Units / Rail (Pb−Free) 0 to 70°C NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 1000 Tape & Reel NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package 1000 Tape & Reel (Pb−Free) NE5532D8 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail (Pb−Free) NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel (Pb−Free) NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail (Pb−Free) SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail (Pb−Free) SE5532AD8 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package 98 Units / Rail (Pb−Free) SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Package 2500 / Tape & Reel SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package −55 to +125°C 2500 / Tape & Reel (Pb−Free) SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) 50 Units / Rail (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7

NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK NOTES: −X− 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. A 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) 8 5 PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR B S 0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL 1 IN EXCESS OF THE D DIMENSION AT −Y− 4 K 6. M75A1X−I0M1U TMH RMUA T7E51R−IA06L CAROEN DOIBTSIOONL.ETE. NEW STANDARD IS 751−07. G MILLIMETERS INCHES DIM MIN MAX MIN MAX C NX 45(cid:3) A 4.80 5.00 0.189 0.197 B 3.80 4.00 0.150 0.157 SEATING PLANE C 1.35 1.75 0.053 0.069 −Z− D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC 0.10 (0.004) H 0.10 0.25 0.004 0.010 H D M J J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 (cid:3) 8 (cid:3) 0 (cid:3) 8 (cid:3) 0.25 (0.010)M Z Y S X S N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 4.0 0.275 0.155 0.6 1.270 0.024 0.050 (cid:6) (cid:7) mm SCALE 6:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8

NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE N D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. E 2. CONTROLLING DIMENSION: INCHES. H 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK- AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 8 5 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT E1 TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM 1 4 PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE NOTE 8 c LEADS UNCONSTRAINED. b2 B 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE END VIEW LEADS, WHERE THE LEADS EXIT THE BODY. TOP VIEW WITH LEADS CONSTRAINED 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). NOTE 5 INCHES MILLIMETERS A2 DIM MIN MAX MIN MAX e/2 A A −−−− 0.210 −−− 5.33 NOTE 3 A1 0.015 −−−− 0.38 −−− A2 0.115 0.195 2.92 4.95 L b 0.014 0.022 0.35 0.56 b2 0.060 TYP 1.52 TYP C 0.008 0.014 0.20 0.36 D 0.355 0.400 9.02 10.16 SEATING A1 PLANE D1 0.005 −−−− 0.13 −−− E 0.300 0.325 7.62 8.26 C M E1 0.240 0.280 6.10 7.11 D1 e 0.100 BSC 2.54 BSC e eB eB −−−− 0.430 −−− 10.92 L 0.115 0.150 2.92 3.81 8Xb END VIEW M −−−− 10° −−− 10° 0.010 M C A M B M NOTE 6 SIDE VIEW http://onsemi.com 9

NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−16 WB D SUFFIX CASE 751G−03 ISSUE D NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. D A 2. INTERPRET DIMENSIONS AND TOLERANCES (cid:2) PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 16 9 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR M PROTRUSION. ALLOWABLE DAMBAR B PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM H8X 25M E (cid:3)X 45 MATERMIAILL LCIMOENTDEITRIOSN. 0. h DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 1 8 B 0.35 0.49 C 0.23 0.32 16X B B D 10.15 10.45 E 7.40 7.60 e 1.27 BSC 0.25 M T A S B S H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0 (cid:3) 7 (cid:3) A SOLDERING FOOTPRINT SEATING L 14X e 1 PLANE 16X0.58 A T C 11.00 1 16X 1.62 1.27 PITCH DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your loca Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NE5532/D 10

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NE5532AD8G NE5532AD8R2G NE5532D8G NE5532D8R2G NE5532DG NE5532DR2G SE5532AD8G SE5532AD8R2G