Effective August 2017 Technical Data 4146 Supersedes September 2011 SD8350 Low profile shielded drum core power inductors Applications • Server power • Notebook and laptop power • High power LED driver, portable devices • Base station, telecom, and networking • Battery chargers, RAM power supply • Industrial and automotive power systems • Noise filtering output filter chokes • Buck/boost converters, output converters Environmental data Product features • Storage temperature range (component): -40 °C to +125 °C • Low-profile surface mount inductor • Operating temperature range: -40 °C to +125 °C • 9.5 mm x 8.3 mm x 4.5 mm shielded drum core (ambient plus self-temperature rise) • Ferrite core material • Solder reflow temperature: • Inductance range from 1.5 µH to 100 µH J-STD-020 (latest revision) compliant • Current range from 0.8 A to 9.1 A • Frequency range up to 1 MHz HALOGEN Pb HF FREE

SD8350 Technical Data 4146 Low profile shielded drum core power inductors Effective August 2017 Product specifications Rated OCL1 Irms2 Isat3 DCR mΩ DCR mΩ Part Number Inductance (µH) µH±30% (A) (A) @ +20 °C Typ @ +20 °C Max K-factor4 SD8350-1R8-R 1.8 1.5 5.50 9.1 11.8 14.0 16.0 SD8350-3R9-R 3.9 3.2 4.50 6.3 16.2 19.0 9.6 SD8350-4R7-R 4.7 4.2 4.10 5.5 18.5 22.0 8.5 SD8350-6R8-R 6.8 6.8 3.90 4.4 20.8 25.0 7.6 SD8350-100-R 10 9.9 3.20 4.0 31.4 36.0 6.3 SD8350-150-R 15 13.6 2.30 2.9 45.0 53.0 5.3 SD8350-220-R 22 20.4 1.80 2.6 63.5 75.0 4.4 SD8350-330-R 33 31.4 1.40 2.2 111.4 125.0 3.5 SD8350-470-R 47 44.9 1.30 1.8 130.0 150.0 2.9 SD8350-680-R 68 65.1 1.00 1.5 200.8 240.0 2.4 SD8350-101-R 100 99.7 0.80 1.3 308.0 360.0 2.0 1. Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 4. K-factor: Used to determine Bp-p for core loss (see graph). 2. Irms: DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC Bp-p= K*L*ΔI, Bp-p(mT), K: (K factor from table), L: (Inductance in µH), ΔI (Peak to currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating peak ripple current in Amps). components will affect the temperature rise. It is recommended that the temperature of the part 5. Part Number Definition: SD8350-xxx-R not exceed +125 °C under worst case operating conditions verified in the end application. SD8350 = Product code and size; -xxx = Inductance value in µH; 3. Isat Amps peak for approximately 35% rolloff (@ +25 °C) R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant Dimensions-mm RECOMMENDED PCB LAYOUT SCHEMATIC TOP VIEW BOTTOM VIEW FRONT VIEW 8.3 max. 2.5 2.9 1 1 1.2 4.5 max. 1.8 6.3 XXX 9.5 max. LEFT VIEW 5.7 2 wwlly R 2 Part Marking: xxx = Inductance value in μH. (R = Decimal point). If no R is present, third character = number of zeros wwlly - or - wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information-mm Supplied in tape-and-reel packaging, 750 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics

SD8350 Technical Data 4146 Low profile shielded drum core power inductors Effective August 2017 Temperature rise vs total loss 140 120 C) (° 100 e Ris re 80 u at per 60 m e T 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Total Loss (W) Core loss vs Bp-p 10 300kHz 1MHz 500kHz 200kHz 100kHz 1 0.1 W) ( s s o L ore 0.01 C 0.001 0.0001 1 10 100 1000 Bp-p (mT) Inductance characteristics OCL Vs. Isat 120% 100% 80% OCL 60% % +85 Deg. C 40% +25 Deg. C -40 Deg. C 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % Isat www.eaton.com/electronics 3

SD8350 Technical Data 4146 Low profile shielded drum core power inductors Effective August 2017 Solder Reflow Profile TP TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 Thickness <350 >_350 TL <2.5mm 235°C 220°C Preheat t A >_2.5mm 220°C 220°C e Tsmax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) per Volume Volume Volume Tem Tsmin ts Package mm3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4146 BU-SB111111 All other trademarks are property August 2017 of their respective owners.