SD05 and SD12 Single Line TVS Diode for ESD Protection in Portable Electronics PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Description Features The SDxx TVS diodes are designed to replace multilayer (cid:139) 350 Watts peak pulse power (t = 8/20µs) p varistors (MLVs) in portable applications such as cell (cid:139) Transient protection for data lines to phones, notebook computers, and PDA’s. They offer IEC 61000-4-2 (ESD) ±25kV (air), ±10kV (contact) superior electrical characteristics such as lower clamp- IEC 61000-4-4 (EFT) 40A (5/50ns) ing voltage and no device degradation when compared IEC 61000-4-5 (Lightning) 24A (8/20µs) to MLVs. The SDxx series TVS diodes are designed to (cid:139) Small package for use in portable electronics protect sensitive semiconductor components from (cid:139) Suitable replacement for MLV’s in ESD protection damage or upset due to electrostatic discharge (ESD) applications and other voltage induced transient events. (cid:139) Protects one I/O or power line (cid:139) Low clamping voltage The SDxx is in a SOD-323 package and will protect one (cid:139) Working voltages: 5V and 12V unidirectional line. They are available with working (cid:139) Low leakage current voltages of 5 volts (SD05) and 12 volts (SD12). These (cid:139) Solid-state silicon-avalanche technology devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to Mechanical Characteristics protect one line in applications where arrays are not (cid:139) EIAJ SOD-323 package practical. Additionally, it may be “sprinkled” around the (cid:139) Molding compound flammability rating: UL 94V-0 board in applications where board space is at a pre- (cid:139) Marking : Marking code, cathode band mium. (cid:139) Packaging : Tape and Reel per EIA 481 They may be used to meet the ESD immunity require- Applications ments of IEC 61000-4-2, Level 4 (±15kV air, ±8kV (cid:139) Cell Phone Handsets and Accessories contact discharge). (cid:139) Microprocessor based equipment (cid:139) Personal Digital Assistants (PDA’s) (cid:139) Notebooks, Desktops, and Servers (cid:139) Portable Instrumentation (cid:139) Pagers Peripherals Schematic & PIN Configuration SOD-323 (Top View) Revision 07/12/04 1 www.semtech.com

SD05 and SD12 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Absolute Maximum Rating Rating Symbol Value Units PeakPulsePower(t =8/20µs) P 350 Watts p pk ESDVoltage(HBM WaveformperIEC61000-4-2) V 30 kV ESD Lead Soldering Temperature T 260(10sec.) °C L Operating Temperature T -55to+125 °C J StorageTemperature T -55to+150 °C STG Electrical Characteristics SD05 Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 5 V RWM ReverseBreakdown Voltage V I =1mA 6 V BR t ReverseLeakageCurrent I V =5V, T=25°C 10 µA R RWM Clamping Voltage V I =5A, t =8/20µs 9.8 V C PP p Clamping Voltage V I =24A, t =8/20µs 14.5 V C PP p Peak PulseCurrent I t =8/20µs 24 A PP p Junction Capacitance C V =0V, f =1MHz 350 pF j R SD12 Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 12 V RWM ReverseBreakdown Voltage V I =1mA 13.3 V BR t ReverseLeakageCurrent I V =12V, T=25°C 1 µA R RWM Clamping Voltage V I =5A, t =8/20µs 19 V C PP p Clamping Voltage V I =15A, t =8/20µs 25 V C PP p Peak PulseCurrent I t =8/20µs 15 A PP p Junction Capacitance C V =0V, f =1MHz 150 pF j R  2004 Semtech Corp. 2 www.semtech.com

SD05 and SD12 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 100 W) 90 wer - P (kpk 1 Power or IPP 678000 Po ed 50 e at s R 40 k Pul 0.1 % of 30 ea 20 P 10 0 0.01 0 25 50 75 100 125 150 0.1 1 10 100 1000 Ambient Temperature - TA (oC) Pulse Duration - t (µs) p Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 100 Waveform 30 Parameters Waveform 90 tr = 8µs 25 Parameters nt of IPP 678000 e-t td = 20µs oltage - V (V)C 1250 SD12 tdtr == 280µµss e 50 V Perc 40 td = IPP/2 mping 10 SD05 30 a Cl 20 5 10 0 0 0 5 10 15 20 25 30 0 5 10 15 20 25 30 Peak Pulse Current - IPP (A) Time (µs) Capacitance vs. Reverse Voltage Forward Voltage vs. Forward Current 7.00 350 f = 1MHz 6.00 300 ce - C (pF)j220500 SD05 oltage -V (V)F45..0000 SD12 SD05 an150 d V 3.00 cit war apa100 For 2.00 Waveform C SD12 Parameters: 50 1.00 tr = 8µs td = 10µs 0 0.00 0 2 4 6 8 10 12 14 0 5 10 15 20 25 30 35 40 45 Reverse Voltage - VR (V) Forward Current - IF (A)  2004 Semtech Corp. 3 www.semtech.com

SD05 and SD12 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Applications Information Device Connection Options Device Schematic and Pin Configuration The SDxx TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Size Comparison to 0805 MLV Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): (cid:122) Place the TVS near the input terminals or connectors to restrict transient coupling. (cid:122) Minimize the path length between the TVS and the protected line. SOD-323 0805 MLV (cid:122) The ESD transient return path to ground should Note: Nominal dimensions in inches be kept as short as possible. (cid:122) Place a TVS and decoupling capacitor between power and ground of components that may be Component Placement Comparison vulnerable to electrostatic discharges to the ground plane. (cid:122) Minimize all conductive loops including power and ground loops. (cid:122) Use multilayer boards when possible. (cid:122) Minimize interconnecting line lengths (cid:122) Never run critical signals near board edges. (cid:122) Fill unused portions of the PCB with ground plane. 0805 MLV on SOD-323 on 0805 SOD-323 on Recommended Matte Tin Lead Finish 0805 Solder Pad MLV Pad (SOD-323) Solder Pad Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 4 www.semtech.com

SD05 and SD12 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Outline Drawing Land Pattern  2004 Semtech Corp. 5 www.semtech.com

SD05 and SD12 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Marking Codes Marking Part Number Code SD05 5U SD12 6U Ordering Information Part Qtyper Lead Finish ReelSize Number Reel SD05.TC SnPb 3,000 7” SD12.TC SnPb 3,000 7” SD05.TCT Pb free 3,000 7” SD12.TCT Pb free 3,000 7” Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 6 www.semtech.com