AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr RoHS lLL DEE DD a tXX a 11 S00 h44 99 e Specification e00 t SSC-SAW8P42A RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 1 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZ - cP ho nw i ce ar l DLE SAW8P42A SAW8P42A D a tX a 1 S0 h4 Description Features 9 e • Suitable for all SMT e0 This surface-mount LED comes 사진 assembly methods; t in standard package dimension. Suitable for all soldering It has a substrate made up of a • Lead Free product molded plastic reflector sitting on • RoHS compliant top of a bent lead frame. The die is attached within the reflector Cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and door displays • Architectural/ Decorative lighting RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 2 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr lLL Contents DEE DD a tXX a 11 S00 h44 99 e e00 t 1. Outline dimensions 2. Characteristics of SAW8P42A LED 3. Characteristic diagrams 4. Color & Binning 5. Bin Code Description 6. Labeling 7. Packing 8. Recommended solder pad 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 3 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i 1. Outline dimensions cee arr lLL DEE DD a tXX a 11 S00 h44 99 e e00 Anod Cathod t e e Slug (Anode) Circuit Diagram Cathode Anode 1 2 ESD Protection Device Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ±0.1mm RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 44 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i 2. Characteristics of SAW8P42A cee arr (Ta=25℃) lLL Electro-Optical characteristics DEE DD a tXX a 11 Parameter Symbol Condition Min. Typ. Max. Unit S00 h44 99 e Forward Voltage* V I 20mA 11.8 13.0 14.2 V F F= e00 t Reverse Voltage V I 5mA - 0.7 1.2 V R R= Luminous Intensity [1] 8.5 9.7 10.5 Cd I I 20mA (3700~7000K) V F= (26.4) (30.1) (32.5) (lm) Color Correlated CCT I =20mA 3,700 - 7,000 K Temperature F Viewing Angle [2] 2Θ ½ I 20mA 115 deg. F= Color Rendering R I 20mA 80 83 90 - Index* a F= 1.5kΩ;100 ESD (HBM) 5 - - KV pF Thermal resistance [3] Rθ I 20mA - 20 - K/W J-S F= [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] Thermal resistance: RthJS(Junction / solder) * Tolerance : VF:±0.4V, IV:±7%, Ra :±2, x,y :±0.01[Note] All measurements were made under the standardized environment of SSC. Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation *[1] P 0.43 W d Forward Current I 30 mA F Operating Temperature T -30~+85 ℃ opr Storage Temperature T -40~+100 ℃ stg Junction Temperature T 125 ℃ j [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 55 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i 3. Characteristic diagrams cee arr lLL DEE DD a Color Spectrum, Ta=25oC tXX a 11 S00 1. Cool white4700 K~7000 K h44 e99 2. Neutral white 3700 K~4700 K e00 t 1.2 4700~7000K 3700~4700K 1.0 ] . u . al [a 0.8 r n ct o e ti p u S b 0.6 e tri v s ti Di a el r 0.4 e R w o P 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 66 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i Current – Voltage characteristics, Ta=25oC cee arr l L L 50 DEE DD a tXX a 11 40 S00 ] h44 A m 99 e [ e00 nt 30 t e r r u c d ar 20 w r o F 10 0 0 5 10 15 Forward Votage [V] Forward Current–Relative Luminous Intensity characteristics, Ta=25oC 200 ] % [ y t 150 si n e t n I s u o 100 n i m u L e v i 50 t a l e R 0 0 10 20 30 40 50 Forward Current [mA] RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 77 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww icee Forward Voltage Shift - Junction Temperature characteristics, arr IF=20mA lLL DEE DD a tXX 1.0 a 11 S00 h44 ee9090 age 0.8 t olt V d r 0.6 a w r o F e 0.4 v ti a el R 0.2 0.0 30 45 60 75 90 105 120 Junction temperature Tj(OC) Relative Light Output - Junction Temperature characteristics , IF=20mA 1.0 0.8 t u p t u O 0.6 t h g Li e v 0.4 ti a el R 0.2 0.0 30 45 60 75 90 105 120 O RREEVV..0000 Junction temperature Tj( C) MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 8 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee Viewing Angle Characteristics, IF=20mA arr lLL DEE DD a tXX 1.0 a 11 S00 u.] h44 a. e99 y [ 0.8 e00 sit t n e t n 0.6 s I u o n mi 0.4 u L e v ti 0.2 a el R 0.0 -90 -60 -30 0 30 60 90 Angle [degree] Forward Current -Chromaticity Coordinate characteristics, Ta=25℃ 0.370 0.368 5mA 0.366 10mA y 15mA 0.364 20mA 0.362 0.360 0.3660 0.3665 0.3670 0.3675 0.3680 0.3685 0.3690 0.3695 0.3700 RREEVV..0000 x MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 9 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr Junction Temperature (℃) - Chromaticity Coordinate lLL DEE characteristics DD a tXX a 11 S00 0.3550 h44 99 e e00 0.3525 t 0.3500 0.3475 25 y 50 0.3450 80 0.3425 100 120 0.3400 0.3375 0.3500 0.3525 0.3550 0.3575 0.3600 0.3625 0.3650 x RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i 4. Color & binning cee arr lLL 1. SAW8P42A DEE DD a tXX a 11 0.42 S00 h44 Cool White 99 3700K e Neutral White e00 0.40 t E1 4200K E0 E3 0.38 4700K D1 E2 D0 E5 D3 5300K C1 E4 y D2 E 0.36 C0 C3 D5 CI 6000K B1 C2 D4 C5 B0 B3 C4 0.34 A1 B2 B5 7000K A3 A0 B4 A2 A5 0.32 A4 0.30 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 CIE x RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 11 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr lLL DEE DD a ● COLOR RANK <IF=20mA, Ta=25℃> tXX a 11 S00 h44 6500~7000K 99 e e00 A0 A2 A4 t CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 6000~6500K A1 A3 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 5600~6000K B0 B2 B4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 5300~5600K B1 B3 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 RREEVV..0000 MMaayy 22001122 * Measurement Uncertainty of the Color Coordinates : ±0.01 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr lLL DEE DD a ● COLOR RANK <IF=20mA, Ta=25℃> tXX a 11 S00 h44 5000~5300K 99 e e00 C0 C2 C4 t CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 4700~5000K C1 C3 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 4500~4700K D0 D2 D4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 4200~4500K D1 D3 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 RREEVV..0000 MMaayy 22001122 * Measurement Uncertainty of the Color Coordinates : ±0.01 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr lLL DEE DD a ● COLOR RANK <IF=20mA, Ta=25℃> tXX a 11 S00 h44 4000~4200K 99 e E0 E2 E4 e00 t CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 3700~4000K E1 E3 E5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.4006 0.4044 0.397 0.3935 0.3934 0.3825 RREEVV..0000 MMaayy 22001122 * Measurement Uncertainty of the Color Coordinates : ±0.01 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee 5. Bin code description arr lLL DEE 1. Luminous Intensity Bins DD a - Luminous Intensity bin structure for Cool white, neutral white, warm white tXX a 11 · Example S00 BIN CODE : R5C2B h44 e99 Luminous Intensity bin e00 t Bin Code Luminous Intensity [cd] *[note] Flux (lm) R5 8.5~9.0 26.4~27.9 S0 9.0~9.5 27.9~29.5 S5 9.5~10.0 29.5~31.0 T0 10.0~10.5 31.0~32.6 [Note] SSC sort the LED package according to the luminous intensity IV. (The lumen table is only for reference.) 2. Color Rank white product tested and binned by x,y coordinates and CC · Example BIN CODE : R5C2B Color bin [Note] Color Rank @ IF = 20mA 3. Voltage Bins · Example BIN CODE : R5C2B Voltage bin Bin Code Min. Max. A 11.8 12.4 B 12.4 13.0 C 13.0 13.6 D 13.6 14.2 [Note] Forward Voltage(V) @ I = 20mA F RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee 6. Labeling arr lLL DEE DD a tXX a 11 S00 h44 99 e e00 1,500 t SAW8P42A RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww icee 7. Packing arr lLL DEE DD Reel a tXX a 11 S00 h44 e99 QUANTITY : XXXX e00 LOT NUMBER : XXXXXXXXXX t PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a b c 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS b PART NUMBER : a SEOUL SEMICONDUCTOR CO., LTD. RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 17 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee ● Reel Packing Structure arr lLL DEE DD a tXX a 11 S00 h44 99 e Cathode mark e00 t [ Tolerance: ±0.2, Unit: mm ] Notes : [1] Quantity : 1,500pcs/Reel [2] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm [3] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape RREEVV..0000 [4] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof MMaayy 22001122 Package wwwwww..sseeoouullsseemmiiccoonn..ccoomm 18 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee 8. Recommended solder pad arr lLL DEE 1. Solder pad DD a tXX a 11 S00 h44 99 e e00 t Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] This drawing without tolerances are for reference only RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 1199 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee arr 9. Soldering lLL DEE DD a tXX a 11 S00 h44 99 e e00 t IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) 100 °C 150 °C - Temperature Max (Tsmax) 150 °C 200 °C - Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-180 seconds Time maintained above: - Temperature (TL) 183 °C 217 °C - Time (tL) 60-150 seconds 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak 10-30 seconds 20-40 seconds Temperature (tp)2 Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. RREEVV..0000 MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 2200 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww i cee 10. Precaution for use arr lLL DEE (1) Storage DD a To avoid the moisture penetration, we recommend storing SSC LEDs in a dry box tXX a11 with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum S00 h44 humidity of RH50%. 99 e (2) Use Precaution after Opening the Packaging e00 Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens t may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDsare in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures RREEVV..0000 can help prevent these issues. MMaayy 22001122 wwwwww..sseeoouullsseemmiiccoonn..ccoomm 2211 서식번호 : SSC-QP-7-07-12 (Rev.01)

AAPCPCWM_4828539:WP_0000001WP_0000001PCPCWM_4828539:WP_0000001WP_0000001 T eZZ -- cPP hoo nww 11. Handling of Silicone Resin LEDs i cee (1) During processing, mechanical stress on the surface should be minimized as much as arr possible. Sharp objects of all types should not be used to pierce the sealing compound. lLL DEE DD a tXX a 11 S00 h44 99 e e00 t (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not RREEVV..0000 handle this product with acid or sulfur material in sealed space. MMaayy 22001122 (7) Avoid leaving fingerprints on silicone resin parts. wwwwww..sseeoouullsseemmiiccoonn..ccoomm 22 서식번호 : SSC-QP-7-07-12 (Rev.01)