Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series SACB Series RoHS Pb e3 Description Uni-directional SACB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features • 500W peak pulse power • Glass passivated chip Agency Approvals capability at 10/1000μs junction AGENCY AGENCY FILE NUMBER waveform, repetition rate • Fast response time: (duty cycles):0.01% typically less than 1.0ps E230531 • For surface mounted from 0V to BV min applications in order to • Excellent clamping optimize board space capability Maximum Ratings and Thermal Characteristics • Low profile package • Low incremental surge (T =25OC unless otherwise noted) A • Built-in strain relief resistance Parameter Symbol Value Unit • Typical failure mode is • High temperature Peak Pulse Power Dissipation at short from over-specified to reflow soldering T=25OC by 10/1000μs Waveform P 500 W voltage or current guaranteed: 260°C/40sec L PPM (fig.1)( Note 1) • Whisker test is conducted • Plastic package is Power Dissipation on Infinite Heat P 3.0 W based on JEDEC flammability rated V-0 per Sink at T=50ºC D L JESD201A per its table 4a Underwriters Laboratories Operating Temperature Range TJ -65 to 150 °C and 4c • Meet MSL level1, per Storage Temperature Range T -65 to 175 °C • IEC-61000-4-2 ESD J-STD-020, LF maximun STG 30kV(Air), 30kV (Contact) peak of 260°C Note: 1. Non-repetitive current pulse , per Fig. 3 and derated above T (initial) = 25OC per Fig. 2. • ESD protection of data • Matte tin lead–free plated J lines in accordance with • Halogen free and RoHS IEC 61000-4-2 compliant • EFT protection of data • Pb-free E3 means 2nd lines in accordance with level interconnect is IEC 61000-4-4 Pb-free and the terminal • V @ T= V @25°C finish material is tin(Sn) BR J BR x (1+αT x (T - 25)) (IPC/JEDEC J-STD- J (αT:Temperature 609A.01) Coefficient, typical value is 0.1%) Additional Infomarion Applications TVS devices are ideal for the protection of I/O Interfaces, V bus and other vulnerable circuits used in Telecom, CC Computer, Industrial and Consumer electronic Datasheet Resources Samples applications. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16

Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Electrical Characteristics (T=25°C unless otherwise noted) A Maximum Inverse Minimum Maximum Maximum Peak Maximum Working Blocking Peak Inverse Part Marking Stand-Off Breakdown Reverse Clamping Pulse Junction Inverse Leakage Blocking Agency Number Code Voltage VR Voltage at IT Leakage at Voltage at Current per Capacitance Blocking Current at Voltage V Approval (V) =V1.B0R(MV)A IR (@uA V)R IPPV=C5(V.0)A (IFPiPg(A.3)) 0 Volatst (pF) VVoWltIBa(gVe) VW(mIB@A )IIB (V) PIB SACB5.0 SKE 5.0 7.60 300 10.0 44.0 45 75 1.0 100 X SACB6.0 SKG 6.0 7.90 300 11.2 41.0 45 75 1.0 100 X SACB7.0 SKM 7.0 8.33 300 12.6 38.0 45 75 1.0 100 X SACB8.0 SKR 8.0 8.89 100 13.4 36.0 45 75 1.0 100 X SACB8.5 SKT 8.5 9.44 50 14.0 34.0 45 75 1.0 100 X SACB10 SKX 10.0 11.10 5 16.3 29.0 45 75 1.0 100 X SACB12 SLE 12.0 13.30 5 19.0 25.0 45 75 1.0 100 X SACB15 SLM 15.0 16.70 5 23.6 20.0 45 75 1.0 100 X SACB18 SLT 18.0 20.00 5 28.8 15.0 45 75 1.0 100 X SACB22 SLX 22.0 24.40 5 35.4 14.0 45 75 1.0 100 X SACB26 SME 26.0 28.90 5 42.3 11.1 45 75 1.0 100 X SACB30 SMK 30.0 33.30 5 48.6 10.0 45 75 1.0 100 X SACB36 SMP 36.0 40.00 5 60.0 8.6 45 75 1.0 100 X SACB45 SMV 45.0 50.00 5 77.0 6.8 45 150 1.0 200 X SACB50 SMZ 50.0 55.50 5 88.0 5.8 45 150 1.0 200 X RRaattiinnggss aanndd CChhaarraacctteerriissttiicc CCuurrvveess ((TTA==2 255°°CC u unnlelesss so othtehrewrwiseis en ontoedted) A Figure 1 - Peak Pulse Power Rating Curve Figure 2 - Peak Pulse Power Derating Curve 100 100 wer (kW) 30 urrent (I)PPe % 80 I- Peak Pulse PoPPM 110 PPPKP"K.µ5" tdtd Half ESxIimDnpeoepncuealsnyetial k Pulse Power (P) or CPPDerating in Percentag 246000 td=7tp ea PPK td Square P 0 Current Waveforms 0.1 0 25 50 75 100 125 150 175 0.001 0.01 0.1 1 10 T - Initial Junction Temperature (ºC) J td - Pulse Width (ms) Figure 3 - Pulse Waveform Figure 4 - AC Line Protection Application 150 % IRSM tr=1P0eµaske cValue TPacusuJ r=ltrsh2eee5n W °tpC diodeitnchta( wytdsh) teiosr e5d 0teh%fien opefde IaPkP M nt, 100 IPPM e urr Pulse C HIPaPlMf Va(lI Pu P2eM ) eak 50 10/1000µsec. Waveform P as defined by R.E.A Low Capacitance - M IPP Application Note: Device must be used with two td units in parallel, opposite in polarity as shown in 0 circuit for AC signal line protection. 0 1.0 2.0 3.0 4.0 t-Time (ms) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16

Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Soldering Parameters Lead–free Reflow Condition assembly TP tp - Temperature Min (T ) 150°C Ramp-up Critical Zone Pre Heat - Temperature Max (Tss(m(mina)x)) 200°C T) TL tL TL to TP - Time (min to max) (t) 60 – 180 secs (e Ts(max) s ur Atov epreaagke ramp up rate (Liquidus Temp (TA) 3°C/second max TemperatTs(min) Prethseat Ramp-down T to T - Ramp-up Rate 3°C/second max S(max) A - Temperature (T ) (Liquidus) 217°C 25˚C Reflow A t 25˚C to Peak - Time (min to max) (t) 60 – 150 seconds Time (t) s Peak Temperature (T) 260+0/-5 °C P Time within 5°C of actual peak Flow/Wave Soldering (Solder Dipping) 20 – 40 seconds Temperature (t) p Ramp-down Rate 6°C/second max Peak Temperature : 265OC Time 25°C to peak Temperature (T) 8 minutes Max. Dipping Time : 10 seconds P Do not exceed 260°C Soldering : 1 time Physical Specifications Environmental Specifications Weight 0.003oz., 0.093g High Temp. Storage JESD22-A103 JEDEC DO-214AA molded plastic body Case over glass passivated junction. HTRB JESD22-A108 Color band denotes cathode except Polarity Temperature Cycling JESD22-A104 Bidirectional Matte Tin-plated leads. Solderable per MSL JEDEC-J-STD-020, Level 1 Terminal JESD22-B102. H3TRB JESD22-A101 RSH JESD22-A111 Dimensions DO-214AA (SMB J-Bend) Inches Millimeters Dimensions Min Max Min Max Cathode Band A 0.077 0.086 1.950 2.200 B 0.160 0.180 4.060 4.570 A C C 0.130 0.155 3.300 3.940 D 0.084 0.096 2.130 2.440 B E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 H G 0.205 0.220 5.210 5.590 D H 0.006 0.012 0.152 0.305 F E G 33 Dimension in inches and (millimeters) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16

Transient Voltage Suppression Diodes Surface Mount – 500W > SACB series Part Numbering System Part Marking System SACB XX Cathode Band F Littelfuse Logo Series Type Stand Off Voltage XX Marking Code YMXXX Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Component Packaging Part number Quantity Packaging Specification Package Option SACBXX DO-214AA 3000 Tape & Reel - 12mm tape/13” reel EIA STD RS-481 Schematic Transient Voltage Suppressor Diode Tape and Reel Specification 0.157 (4.0) 0.47 (12.0) Cathode 0.315 0.059 DIA Cover tape (8.0) (1.5) 13.0 (330) Dimensions are in inches 0.80 (20.2) (and millimeters). Arbor Hole Dia. Direction of Feed 0.49 (12.5) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/27/16