SA605 High performance low power mixer FM IF system Rev. 5 — 14 November 2014 Product data sheet 1. General description The SA605 is a high performance monolithic low-power FM IF system incorporating a mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector, muting, logarithmic received signal strength indicator (RSSI), and voltage regulator. The SA605 combines the functions of NXP SA602A and SA604A, but features a higher mixer input intercept point, higher IF bandwidth (25MHz) and temperature compensated RSSI and limiters permitting higher performance application. The SA605 is available in 20-lead SO (surface-mounted miniature package) and 20-lead SSOP (shrink small outline package). The SA605 and SA615 are functionally the same device types. The difference between the two devices lies in the guaranteed specifications. The SA615 has a higher I , lower CC input third-order intercept point, lower conversion mixer gain, lower limiter gain, lower AM rejection, lower SINAD, higher THD, and higher RSSI error than the SA605. Both the SA605 and SA615 devices meet the EIA specifications for AMPS and TACS cellular radio applications. 2. Features and benefits  Low power consumption: 5.7mA typical at 6V  Mixer input to >500MHz  Mixer conversion power gain of 13dB at 45MHz  Mixer noise figure of 4.6dB at 45MHz  XTAL oscillator effective to 150MHz (L/C oscillator to 1GHz local oscillator can be injected)  102dB of IF amplifier/limiter gain  25MHz limiter small signal bandwidth  Temperature-compensated logarithmic Received Signal Strength Indicator (RSSI) with a dynamic range in excess of 90dB  Two audio outputs — muted and unmuted  Low external component count; suitable for crystal/ceramic/LC filters  Excellent sensitivity: 0.22V into 50 matching network for 12dB SINAD (Signal-to-Noise-and-Distortion ratio) for 1kHz tone with RF at 45MHz and IF at 455kHz  SA605 meets cellular radio specifications  ESD hardened

SA605 NXP Semiconductors High performance low power mixer FM IF system 3. Applications  Cellular radio FM IF  High performance communications receivers  Single conversion VHF/UHF receivers  SCA receivers  RF level meter  Spectrum analyzer  Instrumentation  FSK and ASK data receivers  Log amps  Wideband low current amplification 4. Ordering information Table 1. Ordering info rmation Type number Topside Package marking Name Description Version SA605D/01 SA605D SO20 plastic small outline package; 20leads; bodywidth7.5mm SOT163-1 SA605DK/01 SA605DK SSOP20 plastic shrink small outline package; 20leads; bodywidth4.4mm SOT266-1 4.1 Ordering options Table 2. Ordering opt ions Type number Orderable Package Packing method Minimum Temperature partnumber order quantity SA605D/01 SA605D/01,112 SO20 Standard marking 1520 T =40C to +85C amb *IC’s tube - DSC bulk pack SA605D/01,118 SO20 Reel 13” Q1/T1 2000 T =40C to +85C amb *Standard mark SMD SA605DK/01 SA605DK/01,112 SSOP20 Standard marking 1350 T =40C to +85C amb *IC’s tube - DSC bulk pack SA605DK/01,118 SSOP20 Reel 13” Q1/T1 2500 T =40C to +85C amb *Standard mark SMD SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 2 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 5. Block diagram OUPL OUPL OUPL OUPL MIXER_OUT IF_AMP_DEC IF_AMP_IN IF_AMP_DEC IF_AMP_OUT GND LIMITER_IN LIMITER_DEC LIMITER_DEC LIMITER_OUT 20 19 18 17 16 15 14 13 12 11 IF amp limiter mixer RSSI OSCILLATOR quad mute E B 1 2 3 4 5 6 7 8 9 10 N S T N T C T P P N RF_I RF_BYPAS OSC_OU OSC_I MUTE_INPU VC RSSI_OU UTED_AUD_OUT UTED_AUD_OUT QUADRATURE_I M M N U aaa-012909 Fig 1. Block diagram SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 3 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 6. Pinning information 6.1 Pinning RF_IN 1 20 MIXER_OUT RF_BYPASS 2 19 IF_AMP_DECOUPL OSC_OUT 3 18 IF_AMP_IN OSC_IN 4 17 IF_AMP_DECOUPL MUTE_INPUT 5 16 IF_AMP_OUT SA605D/01 VCC 6 15 GND RSSI_OUT 7 14 LIMITER_IN MUTE_AUD_OUTP 8 13 LIMITER_DECOUPL UNMUTE_AUD_OUTP 9 12 LIMITER_DECOUPL QUADRATURE_IN 10 11 LIMITER_OUT aaa-012910 Fig 2. Pin configuration for SO20 RF_IN 1 20 MIXER_OUT RF_BYPASS 2 19 IF_AMP_DECOUPL OSC_OUT 3 18 IF_AMP_IN OSC_IN 4 17 IF_AMP_DECOUPL MUTE_INPUT 5 16 IF_AMP_OUT SA605DK/01 VCC 6 15 GND RSSI_OUT 7 14 LIMITER_IN MUTE_AUD_OUTP 8 13 LIMITER_DECOUPL UNMUTE_AUD_OUTP 9 12 LIMITER_DECOUPL QUADRATURE_IN 10 11 LIMITER_OUT aaa-012911 Fig 3. Pin configuration for SSOP20 SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 4 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 6.2 Pin description Table 3. Pin description Symbol Pin Description RF_IN 1 RF input RF_BYPASS 2 RF bypass pin OSC_OUT 3 oscillator output OSC_IN 4 oscillator input MUTE_INPUT 5 mute input V 6 positive supply voltage CC RSSI_OUT 7 RSSI output MUTED_AUD_OUTP 8 mute audio output UNMUTED_AUD_OUTP 9 unmute audio output QUADRATURE_IN 10 quadrature detector input terminal LIMITER_OUT 11 limiter amplifier output LIMITER_DECOUPL 12 limiter amplifier decoupling pin LIMITER_DECOUPL 13 limiter amplifier decoupling pin LIMITER_IN 14 limiter amplifier input GND 15 ground; negative supply IF_AMP_OUT 16 IF amplifier output IF_AMP_DECOUPL 17 IF amplifier decoupling pin IF_AMP_IN 18 IF amplifier input IF_AMP_DECOUPL 19 IF amplifier decoupling pin MIXER_OUT 20 mixer output SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 5 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage - 9 V CC T storage temperature 65 +150 C stg T ambient temperature operating 40 +85 C amb 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Z transient thermal impedance SA605D/01 (SO20) 90 K/W th(j-a) fromjunction to ambient SA605DK/01 (SSOP20) 117 K/W 9. Static characteristics Table 6. Static characteristics V =+6V; T =25C; unless specified otherwise. CC amb Symbol Parameter Conditions Min Typ Max Unit V supply voltage 4.5 - 8.0 V CC I supply current 4.55 5.7 6.55 mA CC V threshold voltage mute switch-on 1.7 - - V th mute switch-off - - 1.0 V SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 6 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 10. Dynamic characteristics Table 7. Dynamic cha racteristics T =25C; V =+6V; unless specified otherwise. RF frequency = 45MHz+14.5dBV RF input step-up. amb CC IFfrequency=455kHz; R17=5.1k; RFlevel=45dBm; FM modulation=1kHz with 8kHz peak deviation. Audiooutput with C-message weighted filter and de-emphasis capacitor. Test circuit Figure7. The parameters listed below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters. Symbol Parameter Conditions Min Typ Max Unit Mixer/oscillator section (external LO = 300mV) f input frequency - 500 - MHz i f oscillator frequency - 150 - MHz osc NF noise figure at 45MHz - 5.0 - dB IP3 input third-order intercept point FL1=45.0MHz;FL2=45.06MHz - 10 - dBm i G conversion power gain matched 14.5dBV step-up 10 13 15 dB p(conv) 50 source - 1.7 - dB R RF input resistance single-ended input 3.0 4.7 - k i(RF) C RF input capacitance - 3.5 4.0 pF i(RF) R mixer output resistance MIXER_OUT pin 1.25 1.5 - k o(mix) IF section G IF amplifier gain 50 source - 39.7 - dB amp(IF) G limiter gain 50 source - 62.5 - dB lim P IF input power for 3dB input limiting sensitivity; - 113 - dBm i(IF) R17=5.1k; test at IF_AMP_IN pin  AM rejection 80% AM 1kHz 29 34 43 dB AM audio level RMS value; R10=100k; 80 150 260 mV 15nF de-emphasis unmuted audio level R11=100k; 150pF de-emphasis - 480 - mV SINAD signal-to-noise-and-distortion ratio RF level 118dB - 16 - dB THD total harmonic distortion 34 42 - dB S/N signal-to-noise ratio no modulation for noise - 73 - dB V RSSI output voltage IF; R9=100k [1] o(RSSI) IF level = 118dBm 0 160 650 mV IF level = 68dBm 1.9 2.5 3.1 V IF level = 18dBm 4.0 4.8 5.6 V  RSSI range R9=100k; IF_AMP_OUT pin - 90 - dB RSSI(range)  RSSI variation R9=100k; IF_AMP_OUT pin - 1.5 - dB RSSI Z IF input impedance 1.40 1.6 - k i(IF) Z IF output impedance 0.85 1.0 - k o(IF) Z limiter input impedance 1.40 1.6 - k i(lim) R output resistance unmuted audio - 58 - k o muted audio - 58 - k SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 7 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system Table 7. Dynamic characteristics …continued T =25C; V =+6V; unless specified otherwise. RF frequency = 45MHz+14.5dBV RF input step-up. amb CC IFfrequency=455kHz; R17=5.1k; RFlevel=45dBm; FM modulation=1kHz with 8kHz peak deviation. Audiooutput with C-message weighted filter and de-emphasis capacitor. Test circuit Figure7. The parameters listed below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters. Symbol Parameter Conditions Min Typ Max Unit RF/IF section (internal LO) unmuted audio level RMS value; V =4.5V; - 450 - mV CC RFlevel=27dBm V RSSI output voltage system; V =4.5V; - 4.3 - V o(RSSI) CC RFlevel=27dBm [1] The generator source impedance is 50, but the SA605 input impedance at pin18 (IF_AMP_IN) is 1500. As a result, IF level refers to the actual signal that enters the SA605 input (pin 8, MUTED_AUD_OUTP) which is about 21dB less than the ‘available power’ at the generator. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 8 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 11. Application information R17 C15 5.1 kΩ FL1 FL2 C23 C21 C18 C17 20 19 18 17 16 15 14 13 12 11 700 Ω IF amp limiter mixer quad RSSI detector mute OSCILLATOR switch 1 2 3 4 5 6 7 8 9 10 C3 C9 R9 R10 R11 R5(1) C8 C1 C7 C24 L1 C10 C11 C12 C13 C26 C25 C2 L2 L3 45 MHz C5 C6 input X1 C14 MUTE VCC RSSITPUT UDIO UTEDUDIO U A MA O N U aaa-012965 The layout is very critical in the performance of the receiver. We highly recommend our demo board layout. All of the inductors, the quad tank, and their shield must be grounded. A 10F to 15F or higher value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this capacitor ensures consistent good sensitivity in production. A 0.1F bypass capacitor on the supply pin, and grounded near the 44.545MHz oscillator improves sensitivity by 2dB to 3dB. (1) R5 can be used to bias the oscillator transistor at a higher current for operation above 45MHz. Recommended value is 22k, but should not be below 10k. Fig 4. SA605 45MHz application circuit SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 9 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system Table 8. SA605 applic ation component list Component Value Description Package Part number C1 33pF NPO ceramic C0805K 445-127x-1-ND C2 220pF NPO ceramic C0805K 445-7484-6-ND C3 5pF to 30pF NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND C5 100nF  10% 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C6 5pF to 30pF NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND C7 1nF ceramic C0805K 399-3293-1-ND C8 10pF NPO ceramic C0805K 490-1994-2-ND C9 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C10[1] 22F tantalum C1812 478-3117-1-ND C11 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C12 15nF  10% ceramic C0805K 399-1161-1-ND C13 150pF  2% N1500 ceramic C0805K 399-1125-1-ND C14 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C15 10.0pF NPO ceramic C0805K 311-1036-1-ND C17 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C18 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C21 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C23 100nF  10% monolithic ceramic C0805K 311-1036-1-ND C24 5pF to 30pF trim NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND C25 470pF monolithic ceramic C0805K C26 39pF monolithic ceramic C0805K CN1 8-pin header MA08-1 399-8083-10ND CN2 BU-SMA-H J502-ND-142- 520-142-0701-881 0701-881/886 FL1, FL2[2] ceramic filter; surface mount CFUKF455KB4X-R0 Murata CFUKF455KB4X orequivalent L1 330nH Coilcraft 1008CS-331 WE-KI_1008_B 1008CS-331 L2 1.2H fixed inductor Coilcraft 1008CS-122XKLC WE-KI_1008_B 1008CS-122 L3 220H fixed inductor WE-GF_L 1812LS-224XJB R9 100k  1% 1/4 W metal film R0603 311-100KCRCT-ND R10[3] 100k  1% 1/4 W metal film C0805K 311-100KCRCT-ND R11[3] 100k  1% 1/4 W metal film C0805K 311-100KCRCT-ND R17 5.1k  5% 1/4 W carbon composition C0805K 311-5.10KCRDKR-ND U1 SA605DK TSSOP20 568-2087-5-nd X1 44.545MHz resonant 3rd-overtone crystal UM-1 49HC/11453 [1] This value can be reduced when a battery is the power source. [2] The ceramic filters can be 30kHz SFG455A3s made by Murata, which have 30kHz IF bandwidth (they come in blue), or 16kHz CFU455Ds, also made by Murata (they come in black). All of our specifications and testing are done with the more wideband filter. [3] Optional. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 10 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system RF GENERATOR(1) 45 MHz SA605 DEMOBOARD VCC ( +6 V) RSSI(2) AUDIO DATA DC VOLTMETER C-MESSAGE(3) HP339A DISTORTION SCOPE ANALYZER(4) aaa-012958 (1) The C-message filter has a peak gain of 100dB for accurate measurements. Without the gain, the measurements may be affected by the noise of the scope and HP339 analyzer. (2) Set your RF generator at 45.000MHz, use a 1kHz modulation frequency and a 6kHz deviation if you use 16kHz filters, or 8kHz if you use 30kHz filters. (3) The smallest RSSI voltage (that is, when no RF input is present and the input is terminated) is a measure of the quality of the layout and design. If the lowest RSSI voltage is 250mV or higher, it means that the receiver is in regenerative mode. In that case, the receiver sensitivity is worse than expected. (4) The measured typical sensitivity for 12dB SINAD should be 0.22V or 120dBm at the RF input. Fig 5. SA605 application circuit test setup 20 6 RF = 45 MHz IF = 455 kHz RSSI VCC = 6 V AUDIO REF = 174 mV (RMS value) (V) 0 5 THD + NOISE AM (80 % MOD) NOISE (dB) −20 4 THD + NOISE −40 3 AM (80 % MOD) −60 2 RSSI (V) −80 1 NOISE −100 0 −130 −110 −90 −70 −50 −30 −10 10 20 RF input level (dBm) aaa-012967 Audio out: C message weighted 0dB reference = recovered audio for 8kHz peak deviation (dB) Fig 6. Performance of the SA605 application board at 25C SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 11 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 11.1 Circuit description The SA605 is an IF signal processing system suitable for second IF or single conversion systems with input frequency as high as 1GHz. The bandwidth of the IF amplifier is about 40MHz, with 39.7dB of gain from a 50 source. The bandwidth of the limiter is about 28MHz with about 62.5dB of gain from a 50 source. However, the gain/bandwidth distribution is optimized for 455kHz, 1.5k source applications. The overall system is well-suited to battery operation as well as high-performance and high-quality products of all types. The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include a noise figure of 5dB, conversion gain of 13dB, and input third-order intercept of 10dBm. The oscillator operates in excess of 1GHz in L/C tank configurations. Hartley or Colpitts circuits can be used up to 100MHz for crystal configurations. Butler oscillators are recommended for crystal configurations up to 150MHz. The output of the mixer is internally loaded with a 1.5k resistor, permitting direct connection to a 455kHz ceramic filter. The input resistance of the limiting IF amplifiers is also 1.5k. With most 455kHz ceramic filters and many crystal filters, no impedance matching network is necessary. To achieve optimum linearity of the log signal strength indicator, there must be a 12dBV insertion loss between the first and second IF stages. If the IF filter or inter-stage network does not cause 12dBV insertion loss, a fixed or variable resistor can be added between the first IF output (pin16, IF_AMP_OUT) and the inter-stage network. The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector. One port of the Gilbert cell is internally driven by the IF. The other output of the IF is AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase relationship to the internal signal, drives the other port of the multiplier cell. Overall, the IF section has a gain of 90dB. For operation at intermediate frequencies greater than 455kHz, special care must be given to layout, termination, and inter-stage loss to avoid instability. The demodulated output of the quadrature detector is available at two pins, one continuous and one with a mute switch. Signal attenuation with the mute activated is greater than 60dB. The mute input is very high-impedance and is compatible with CMOS or TTL levels. A log signal strength completes the circuitry. The output range is greater than 90dB and is temperature compensated. This log signal strength indicator exceeds the criteria for AMPS or TACS cellular telephone. Remark: dBV = 20log V /V. O I SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 12 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 12. Test information −25 dB, −10.6 dB, −29 dB, −10.6 dB, −36 dB, 1500 Ω/50 Ω pad 50 Ω/50 Ω pad 929 Ω/50 Ω pad 50 Ω/50 Ω pad 156 kΩ/50 Ω pad 50.5 Ω 96.5 Ω 51.5 Ω 96.5 Ω 51.7 Ω Ω 3880 Ω 430 3721..65 ΩΩ 32.8 Ω 71.5 Ω 1.3 kΩ 2 C24 C22C20 R17 C19 C16 C15 5.1 kΩ SW9 SW8 SW7 SW6 SW5 FL1 FL2 C18 C17 C23 C21 20 19 18 17 16 15 14 13 12 11 700 Ω IF amp limiter mixer quad RSSI detector mute OSCILLATOR switch er mitt ase e b 1 2 3 4 5 6 7 8 9 10 C9 R9 R10 R11 C3 SW1 SW3 SW4 C1 C8 C10 C11 C12 C13 L1 C7 C2 IFT1 C5 L2 ‘C’ WEIGHTED C26 AUDIO R1 SW2 R4 51.1 Ω C6 X1 MEACSIURRCEUMITENT C14 C3 C4 R3 R2 4M5H.04z64L.O5e4Cx5 t o.MscHz 30R.57 Ω MUTE VCC RSSIOUTPUT AUDIO UNMUTEDAUDIO 45 MHz R6 R8 178 Ω 39.2 Ω mini-circuit ZSC2-1B aaa-012966 Fig 7. SA605 45MHz test circuit (relays as shown) SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 13 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system Table 9. Automatic test circuit component list Component Description C1 33pF NPO ceramic C2 180pF NPO ceramic C3, C6 5pF to 30pF variable capacitor; Murata TZC3P300A 110R00 C5, C9, C11, C14, C17, 100nF10% monolithic ceramic C18, C21, C23 C7 1nF ceramic C8, C15 10pF NPO ceramic C10[1] 6.8F tantalum (minimum) C12 15nF10% ceramic C13 150pF2% N1500 ceramic C26 390pF10% monolithic ceramic FL1 ceramic filter Murata SFG455A3 or equivalent FL2 IFT1 330H variable shielded inductor, Toko 836AN-0129Z L1 330nH Coilcraft 1008CS-331 L2 1.2H Coilcraft 1008CS-122 X1 44.545MHz 3rd Overtone series resonant crystal in the HC-49U case R9 100k1% 1/4W metal film R10, R11 100k1% 1/4W metal film (optional) R17 5.1k5% 1/4W carbon composition [1] This value can be reduced when a battery is the power source. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 14 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 13. Package outline (cid:54)(cid:50)(cid:21)(cid:19)(cid:29)(cid:3)(cid:83)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:86)(cid:80)(cid:68)(cid:79)(cid:79)(cid:3)(cid:82)(cid:88)(cid:87)(cid:79)(cid:76)(cid:81)(cid:72)(cid:3)(cid:83)(cid:68)(cid:70)(cid:78)(cid:68)(cid:74)(cid:72)(cid:30)(cid:3)(cid:21)(cid:19)(cid:3)(cid:79)(cid:72)(cid:68)(cid:71)(cid:86)(cid:30)(cid:3)(cid:69)(cid:82)(cid:71)(cid:92)(cid:3)(cid:90)(cid:76)(cid:71)(cid:87)(cid:75)(cid:3)(cid:26)(cid:17)(cid:24)(cid:3)(cid:80)(cid:80)(cid:3) (cid:54)(cid:50)(cid:55)(cid:20)(cid:25)(cid:22)(cid:16)(cid:20)(cid:3) (cid:39)(cid:3) (cid:40)(cid:3) (cid:36)(cid:3) (cid:59)(cid:3) (cid:70)(cid:3) (cid:92)(cid:3) (cid:43)(cid:3)(cid:40)(cid:3) (cid:89)(cid:3)(cid:48)(cid:3) (cid:36)(cid:3) (cid:61)(cid:3) (cid:21)(cid:19)(cid:3) (cid:20)(cid:20)(cid:3) (cid:52)(cid:3) (cid:36)(cid:3)(cid:21)(cid:3) (cid:36)(cid:3) (cid:36)(cid:3)(cid:20)(cid:3) (cid:11)(cid:36)(cid:3)(cid:22)(cid:3)(cid:3)(cid:12)(cid:3) (cid:83)(cid:76)(cid:81)(cid:3)(cid:20)(cid:3)(cid:76)(cid:81)(cid:71)(cid:72)(cid:91)(cid:3) (cid:537)(cid:3) (cid:47)(cid:3)(cid:83)(cid:3) (cid:47)(cid:3) (cid:20)(cid:3) (cid:20)(cid:19)(cid:3) (cid:71)(cid:72)(cid:87)(cid:68)(cid:76)(cid:79)(cid:3)(cid:59)(cid:3) (cid:72)(cid:3) (cid:90)(cid:3)(cid:48)(cid:3) (cid:69)(cid:3)(cid:83)(cid:3) (cid:19)(cid:3) (cid:24)(cid:3) (cid:20)(cid:19)(cid:3)(cid:80)(cid:80)(cid:3) (cid:86)(cid:70)(cid:68)(cid:79)(cid:72)(cid:3) (cid:39)(cid:44)(cid:48)(cid:40)(cid:49)(cid:54)(cid:44)(cid:50)(cid:49)(cid:54)(cid:3)(cid:11)(cid:76)(cid:81)(cid:70)(cid:75)(cid:3)(cid:71)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:68)(cid:85)(cid:72)(cid:3)(cid:71)(cid:72)(cid:85)(cid:76)(cid:89)(cid:72)(cid:71)(cid:3)(cid:73)(cid:85)(cid:82)(cid:80)(cid:3)(cid:87)(cid:75)(cid:72)(cid:3)(cid:82)(cid:85)(cid:76)(cid:74)(cid:76)(cid:81)(cid:68)(cid:79)(cid:3)(cid:80)(cid:80)(cid:3)(cid:71)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:12)(cid:3) (cid:56)(cid:49)(cid:44)(cid:55)(cid:3) (cid:80)(cid:36)(cid:68)(cid:91)(cid:3)(cid:17)(cid:3) (cid:36)(cid:3)(cid:20)(cid:3) (cid:36)(cid:3)(cid:21)(cid:3) (cid:36)(cid:3)(cid:22)(cid:3) (cid:69)(cid:3)(cid:83)(cid:3) (cid:70)(cid:3) (cid:39)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:40)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:72)(cid:3) (cid:43)(cid:3)(cid:40)(cid:3) (cid:47)(cid:3) (cid:47)(cid:3)(cid:83)(cid:3) (cid:52)(cid:3) (cid:89)(cid:3) (cid:90)(cid:3) (cid:92)(cid:3) (cid:61)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:537)(cid:3) (cid:19)(cid:17)(cid:22)(cid:3) (cid:21)(cid:17)(cid:23)(cid:24)(cid:3) (cid:19)(cid:17)(cid:23)(cid:28)(cid:3) (cid:19)(cid:17)(cid:22)(cid:21)(cid:3) (cid:20)(cid:22)(cid:17)(cid:19)(cid:3) (cid:26)(cid:17)(cid:25)(cid:3) (cid:20)(cid:19)(cid:17)(cid:25)(cid:24)(cid:3) (cid:20)(cid:17)(cid:20)(cid:3) (cid:20)(cid:17)(cid:20)(cid:3) (cid:19)(cid:17)(cid:28)(cid:3) (cid:80)(cid:80)(cid:3) (cid:21)(cid:17)(cid:25)(cid:24)(cid:3) (cid:19)(cid:17)(cid:21)(cid:24)(cid:3) (cid:20)(cid:17)(cid:21)(cid:26)(cid:3) (cid:20)(cid:17)(cid:23)(cid:3) (cid:19)(cid:17)(cid:21)(cid:24)(cid:3) (cid:19)(cid:17)(cid:21)(cid:24)(cid:3) (cid:19)(cid:17)(cid:20)(cid:3) (cid:19)(cid:17)(cid:20)(cid:3) (cid:21)(cid:17)(cid:21)(cid:24)(cid:3) (cid:19)(cid:17)(cid:22)(cid:25)(cid:3) (cid:19)(cid:17)(cid:21)(cid:22)(cid:3) (cid:20)(cid:21)(cid:17)(cid:25)(cid:3) (cid:26)(cid:17)(cid:23)(cid:3) (cid:20)(cid:19)(cid:17)(cid:19)(cid:19)(cid:3) (cid:19)(cid:17)(cid:23)(cid:3) (cid:20)(cid:17)(cid:19)(cid:3) (cid:19)(cid:17)(cid:23)(cid:3) (cid:27)(cid:3)(cid:82)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:21)(cid:3) (cid:19)(cid:17)(cid:19)(cid:28)(cid:25)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:28)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:22)(cid:3) (cid:19)(cid:17)(cid:24)(cid:20)(cid:3) (cid:19)(cid:17)(cid:22)(cid:19)(cid:3) (cid:19)(cid:17)(cid:23)(cid:20)(cid:28)(cid:3) (cid:19)(cid:17)(cid:19)(cid:23)(cid:22)(cid:3) (cid:19)(cid:17)(cid:19)(cid:23)(cid:22)(cid:3) (cid:19)(cid:17)(cid:19)(cid:22)(cid:24)(cid:3) (cid:19)(cid:3)(cid:82)(cid:3) (cid:76)(cid:81)(cid:70)(cid:75)(cid:72)(cid:86)(cid:3) (cid:19)(cid:17)(cid:20)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:3) (cid:19)(cid:17)(cid:19)(cid:24)(cid:3) (cid:19)(cid:17)(cid:19)(cid:24)(cid:24)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:3) (cid:19)(cid:17)(cid:19)(cid:19)(cid:23)(cid:3) (cid:19)(cid:17)(cid:19)(cid:19)(cid:23)(cid:3) (cid:19)(cid:17)(cid:19)(cid:27)(cid:28)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:23)(cid:3) (cid:19)(cid:17)(cid:19)(cid:19)(cid:28)(cid:3) (cid:19)(cid:17)(cid:23)(cid:28)(cid:3) (cid:19)(cid:17)(cid:21)(cid:28)(cid:3) (cid:19)(cid:17)(cid:22)(cid:28)(cid:23)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:25)(cid:3) (cid:19)(cid:17)(cid:19)(cid:22)(cid:28)(cid:3) (cid:19)(cid:17)(cid:19)(cid:20)(cid:25)(cid:3) (cid:49)(cid:82)(cid:87)(cid:72)(cid:3) (cid:20)(cid:17)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:82)(cid:85)(cid:3)(cid:80)(cid:72)(cid:87)(cid:68)(cid:79)(cid:3)(cid:83)(cid:85)(cid:82)(cid:87)(cid:85)(cid:88)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:82)(cid:73)(cid:3)(cid:19)(cid:17)(cid:20)(cid:24)(cid:3)(cid:80)(cid:80)(cid:3)(cid:11)(cid:19)(cid:17)(cid:19)(cid:19)(cid:25)(cid:3)(cid:76)(cid:81)(cid:70)(cid:75)(cid:12)(cid:3)(cid:80)(cid:68)(cid:91)(cid:76)(cid:80)(cid:88)(cid:80)(cid:3)(cid:83)(cid:72)(cid:85)(cid:3)(cid:86)(cid:76)(cid:71)(cid:72)(cid:3)(cid:68)(cid:85)(cid:72)(cid:3)(cid:81)(cid:82)(cid:87)(cid:3)(cid:76)(cid:81)(cid:70)(cid:79)(cid:88)(cid:71)(cid:72)(cid:71)(cid:17)(cid:3)(cid:3)(cid:3) (cid:50)(cid:56)(cid:55)(cid:47)(cid:44)(cid:49)(cid:40)(cid:3) (cid:3)(cid:53)(cid:40)(cid:41)(cid:40)(cid:53)(cid:40)(cid:49)(cid:38)(cid:40)(cid:54)(cid:3) (cid:40)(cid:56)(cid:53)(cid:50)(cid:51)(cid:40)(cid:36)(cid:49)(cid:3) (cid:44)(cid:54)(cid:54)(cid:56)(cid:40)(cid:3)(cid:39)(cid:36)(cid:55)(cid:40)(cid:3) (cid:57)(cid:40)(cid:53)(cid:54)(cid:44)(cid:50)(cid:49)(cid:3) (cid:3)(cid:44)(cid:40)(cid:38)(cid:3) (cid:3)(cid:45)(cid:40)(cid:39)(cid:40)(cid:38)(cid:3) (cid:3)(cid:45)(cid:40)(cid:44)(cid:55)(cid:36)(cid:3) (cid:51)(cid:53)(cid:50)(cid:45)(cid:40)(cid:38)(cid:55)(cid:44)(cid:50)(cid:49)(cid:3) (cid:28)(cid:28)(cid:16)(cid:20)(cid:21)(cid:16)(cid:21)(cid:26)(cid:3) (cid:3)(cid:54)(cid:50)(cid:55)(cid:20)(cid:25)(cid:22)(cid:16)(cid:20)(cid:3) (cid:3)(cid:19)(cid:26)(cid:24)(cid:40)(cid:19)(cid:23)(cid:3) (cid:3)(cid:48)(cid:54)(cid:16)(cid:19)(cid:20)(cid:22)(cid:3) (cid:19)(cid:22)(cid:16)(cid:19)(cid:21)(cid:16)(cid:20)(cid:28)(cid:3) Fig 8. Package outline SOT163-1 (SO20) SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 15 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system (cid:54)(cid:54)(cid:50)(cid:51)(cid:21)(cid:19)(cid:29)(cid:3)(cid:83)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:86)(cid:75)(cid:85)(cid:76)(cid:81)(cid:78)(cid:3)(cid:86)(cid:80)(cid:68)(cid:79)(cid:79)(cid:3)(cid:82)(cid:88)(cid:87)(cid:79)(cid:76)(cid:81)(cid:72)(cid:3)(cid:83)(cid:68)(cid:70)(cid:78)(cid:68)(cid:74)(cid:72)(cid:30)(cid:3)(cid:21)(cid:19)(cid:3)(cid:79)(cid:72)(cid:68)(cid:71)(cid:86)(cid:30)(cid:3)(cid:69)(cid:82)(cid:71)(cid:92)(cid:3)(cid:90)(cid:76)(cid:71)(cid:87)(cid:75)(cid:3)(cid:23)(cid:17)(cid:23)(cid:3)(cid:80)(cid:80)(cid:3) (cid:54)(cid:50)(cid:55)(cid:21)(cid:25)(cid:25)(cid:16)(cid:20)(cid:3) (cid:39)(cid:3) (cid:40)(cid:3) (cid:36)(cid:3) (cid:59)(cid:3) (cid:70)(cid:3) (cid:92)(cid:3) (cid:43)(cid:3)(cid:40)(cid:3) (cid:89)(cid:3)(cid:48)(cid:3) (cid:36)(cid:3) (cid:61)(cid:3) (cid:21)(cid:19)(cid:3) (cid:20)(cid:20)(cid:3) (cid:52)(cid:3) (cid:83)(cid:76)(cid:81)(cid:3)(cid:20)(cid:3)(cid:76)(cid:81)(cid:71)(cid:72)(cid:91)(cid:3) (cid:36)(cid:3)(cid:21)(cid:3)(cid:36)(cid:3)(cid:20)(cid:3) (cid:11)(cid:36)(cid:3)(cid:22)(cid:3)(cid:3)(cid:12)(cid:3) (cid:36)(cid:3) (cid:537)(cid:3) (cid:47)(cid:3)(cid:83)(cid:3) (cid:47)(cid:3) (cid:20)(cid:3) (cid:20)(cid:19)(cid:3) (cid:71)(cid:72)(cid:87)(cid:68)(cid:76)(cid:79)(cid:3)(cid:59)(cid:3) (cid:90)(cid:3)(cid:48)(cid:3) (cid:72)(cid:3) (cid:69)(cid:3)(cid:83)(cid:3) (cid:19)(cid:3) (cid:21)(cid:17)(cid:24)(cid:3) (cid:24)(cid:3)(cid:80)(cid:80)(cid:3) (cid:86)(cid:70)(cid:68)(cid:79)(cid:72)(cid:3) (cid:39)(cid:44)(cid:48)(cid:40)(cid:49)(cid:54)(cid:44)(cid:50)(cid:49)(cid:54)(cid:3)(cid:11)(cid:80)(cid:80)(cid:3)(cid:68)(cid:85)(cid:72)(cid:3)(cid:87)(cid:75)(cid:72)(cid:3)(cid:82)(cid:85)(cid:76)(cid:74)(cid:76)(cid:81)(cid:68)(cid:79)(cid:3)(cid:71)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:12)(cid:3) (cid:56)(cid:49)(cid:44)(cid:55)(cid:3) (cid:80)(cid:36)(cid:68)(cid:91)(cid:3)(cid:17)(cid:3) (cid:36)(cid:3)(cid:20)(cid:3) (cid:36)(cid:3)(cid:21)(cid:3) (cid:36)(cid:3)(cid:22)(cid:3) (cid:69)(cid:3)(cid:83)(cid:3) (cid:70)(cid:3) (cid:39)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:40)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:72)(cid:3) (cid:43)(cid:3)(cid:40)(cid:3) (cid:47)(cid:3) (cid:47)(cid:3)(cid:83)(cid:3) (cid:52)(cid:3) (cid:89)(cid:3) (cid:90)(cid:3) (cid:92)(cid:3) (cid:61)(cid:3)(cid:11)(cid:20)(cid:12)(cid:3) (cid:537)(cid:3) (cid:19)(cid:17)(cid:20)(cid:24)(cid:3) (cid:20)(cid:17)(cid:23)(cid:3) (cid:19)(cid:17)(cid:22)(cid:21)(cid:3) (cid:19)(cid:17)(cid:21)(cid:19)(cid:3) (cid:25)(cid:17)(cid:25)(cid:3) (cid:23)(cid:17)(cid:24)(cid:3) (cid:25)(cid:17)(cid:25)(cid:3) (cid:19)(cid:17)(cid:26)(cid:24)(cid:3) (cid:19)(cid:17)(cid:25)(cid:24)(cid:3) (cid:19)(cid:17)(cid:23)(cid:27)(cid:3) (cid:20)(cid:19)(cid:3)(cid:82)(cid:3) (cid:80)(cid:80)(cid:3) (cid:20)(cid:17)(cid:24)(cid:3) (cid:19)(cid:3) (cid:20)(cid:17)(cid:21)(cid:3) (cid:19)(cid:17)(cid:21)(cid:24)(cid:3) (cid:19)(cid:17)(cid:21)(cid:19)(cid:3) (cid:19)(cid:17)(cid:20)(cid:22)(cid:3) (cid:25)(cid:17)(cid:23)(cid:3) (cid:23)(cid:17)(cid:22)(cid:3) (cid:19)(cid:17)(cid:25)(cid:24)(cid:3) (cid:25)(cid:17)(cid:21)(cid:3) (cid:20)(cid:3) (cid:19)(cid:17)(cid:23)(cid:24)(cid:3) (cid:19)(cid:17)(cid:23)(cid:24)(cid:3) (cid:19)(cid:17)(cid:21)(cid:3) (cid:19)(cid:17)(cid:20)(cid:22)(cid:3) (cid:19)(cid:17)(cid:20)(cid:3) (cid:19)(cid:17)(cid:20)(cid:27)(cid:3) (cid:19)(cid:3)(cid:82)(cid:3) (cid:49)(cid:82)(cid:87)(cid:72)(cid:3) (cid:20)(cid:17)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:82)(cid:85)(cid:3)(cid:80)(cid:72)(cid:87)(cid:68)(cid:79)(cid:3)(cid:83)(cid:85)(cid:82)(cid:87)(cid:85)(cid:88)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:82)(cid:73)(cid:3)(cid:19)(cid:17)(cid:21)(cid:19)(cid:3)(cid:80)(cid:80)(cid:3)(cid:80)(cid:68)(cid:91)(cid:76)(cid:80)(cid:88)(cid:80)(cid:3)(cid:83)(cid:72)(cid:85)(cid:3)(cid:86)(cid:76)(cid:71)(cid:72)(cid:3)(cid:68)(cid:85)(cid:72)(cid:3)(cid:81)(cid:82)(cid:87)(cid:3)(cid:76)(cid:81)(cid:70)(cid:79)(cid:88)(cid:71)(cid:72)(cid:71)(cid:17)(cid:3)(cid:3) (cid:50)(cid:56)(cid:55)(cid:47)(cid:44)(cid:49)(cid:40)(cid:3) (cid:3)(cid:53)(cid:40)(cid:41)(cid:40)(cid:53)(cid:40)(cid:49)(cid:38)(cid:40)(cid:54)(cid:3) (cid:40)(cid:56)(cid:53)(cid:50)(cid:51)(cid:40)(cid:36)(cid:49)(cid:3) (cid:44)(cid:54)(cid:54)(cid:56)(cid:40)(cid:3)(cid:39)(cid:36)(cid:55)(cid:40)(cid:3) (cid:57)(cid:40)(cid:53)(cid:54)(cid:44)(cid:50)(cid:49)(cid:3) (cid:3)(cid:44)(cid:40)(cid:38)(cid:3) (cid:3)(cid:45)(cid:40)(cid:39)(cid:40)(cid:38)(cid:3) (cid:3)(cid:45)(cid:40)(cid:44)(cid:55)(cid:36)(cid:3) (cid:51)(cid:53)(cid:50)(cid:45)(cid:40)(cid:38)(cid:55)(cid:44)(cid:50)(cid:49)(cid:3) (cid:28)(cid:28)(cid:16)(cid:20)(cid:21)(cid:16)(cid:21)(cid:26)(cid:3) (cid:3)(cid:54)(cid:50)(cid:55)(cid:21)(cid:25)(cid:25)(cid:16)(cid:20)(cid:3) (cid:3)(cid:48)(cid:50)(cid:16)(cid:20)(cid:24)(cid:21)(cid:3) (cid:19)(cid:22)(cid:16)(cid:19)(cid:21)(cid:16)(cid:20)(cid:28)(cid:3) Fig 9. Package outline SOT266-1 (SSOP20) SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 16 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 17 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure10) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table10 and11 Table 10. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 11. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure10. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 18 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 19 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 15. Soldering: PCB footprints (cid:20)(cid:22)(cid:17)(cid:23)(cid:19) (cid:19)(cid:17)(cid:25)(cid:19)(cid:3)(cid:11)(cid:21)(cid:19)(cid:238)(cid:12) (cid:20)(cid:17)(cid:24)(cid:19) (cid:27)(cid:17)(cid:19)(cid:19) (cid:20)(cid:20)(cid:17)(cid:19)(cid:19) (cid:20)(cid:20)(cid:17)(cid:23)(cid:19) (cid:20)(cid:17)(cid:21)(cid:26)(cid:3)(cid:11)(cid:20)(cid:27)(cid:238)(cid:12) (cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:3)(cid:79)(cid:68)(cid:81)(cid:71)(cid:86) (cid:82)(cid:70)(cid:70)(cid:88)(cid:83)(cid:76)(cid:72)(cid:71)(cid:3)(cid:68)(cid:85)(cid:72)(cid:68) (cid:83)(cid:79)(cid:68)(cid:70)(cid:72)(cid:80)(cid:72)(cid:81)(cid:87)(cid:3)(cid:68)(cid:70)(cid:70)(cid:88)(cid:85)(cid:68)(cid:70)(cid:92)(cid:3)(cid:147)(cid:3)(cid:19)(cid:17)(cid:21)(cid:24) (cid:39)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:76)(cid:81)(cid:3)(cid:80)(cid:80) (cid:86)(cid:82)(cid:87)(cid:20)(cid:25)(cid:22)(cid:16)(cid:20)(cid:66)(cid:73)(cid:85) Fig 11. PCB footprint for SOT163-1 (SO20); reflow soldering (cid:20)(cid:17)(cid:21)(cid:19)(cid:3)(cid:11)(cid:21)(cid:238)(cid:12) (cid:19)(cid:17)(cid:22)(cid:3)(cid:11)(cid:21)(cid:238)(cid:12) (cid:72)(cid:81)(cid:79)(cid:68)(cid:85)(cid:74)(cid:72)(cid:71)(cid:3)(cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:3)(cid:79)(cid:68)(cid:81)(cid:71) (cid:20)(cid:17)(cid:24)(cid:19) (cid:27)(cid:17)(cid:19)(cid:19) (cid:20)(cid:20)(cid:17)(cid:19)(cid:19) (cid:20)(cid:20)(cid:17)(cid:23)(cid:19) (cid:19)(cid:17)(cid:25)(cid:19)(cid:3)(cid:11)(cid:20)(cid:27)(cid:238)(cid:12) (cid:20)(cid:17)(cid:21)(cid:26)(cid:3)(cid:11)(cid:20)(cid:27)(cid:238)(cid:12) (cid:20)(cid:22)(cid:17)(cid:23)(cid:19) (cid:69)(cid:82)(cid:68)(cid:85)(cid:71)(cid:3)(cid:71)(cid:76)(cid:85)(cid:72)(cid:70)(cid:87)(cid:76)(cid:82)(cid:81) (cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:3)(cid:79)(cid:68)(cid:81)(cid:71)(cid:86) (cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:3)(cid:85)(cid:72)(cid:86)(cid:76)(cid:86)(cid:87) (cid:82)(cid:70)(cid:70)(cid:88)(cid:83)(cid:76)(cid:72)(cid:71)(cid:3)(cid:68)(cid:85)(cid:72)(cid:68) (cid:83)(cid:79)(cid:68)(cid:70)(cid:72)(cid:80)(cid:72)(cid:81)(cid:87)(cid:3)(cid:68)(cid:70)(cid:70)(cid:88)(cid:85)(cid:85)(cid:68)(cid:70)(cid:92)(cid:3)(cid:147)(cid:3)(cid:19)(cid:17)(cid:21)(cid:24) (cid:39)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:76)(cid:81)(cid:3)(cid:80)(cid:80) (cid:86)(cid:82)(cid:87)(cid:20)(cid:25)(cid:22)(cid:16)(cid:20)(cid:66)(cid:73)(cid:90) Fig 12. PCB footprint for SOT163-1 (SO20); wave soldering SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 20 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system (cid:41)(cid:82)(cid:82)(cid:87)(cid:83)(cid:85)(cid:76)(cid:81)(cid:87)(cid:3)(cid:76)(cid:81)(cid:73)(cid:82)(cid:85)(cid:80)(cid:68)(cid:87)(cid:76)(cid:82)(cid:81)(cid:3)(cid:73)(cid:82)(cid:85)(cid:3)(cid:85)(cid:72)(cid:73)(cid:79)(cid:82)(cid:90)(cid:3)(cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:76)(cid:81)(cid:74)(cid:3)(cid:82)(cid:73)(cid:3)(cid:54)(cid:54)(cid:50)(cid:51)(cid:21)(cid:19)(cid:3)(cid:83)(cid:68)(cid:70)(cid:78)(cid:68)(cid:74)(cid:72) (cid:54)(cid:50)(cid:55)(cid:21)(cid:25)(cid:25)(cid:16)(cid:20) (cid:43)(cid:91) (cid:42)(cid:91) (cid:51)(cid:21) (cid:11)(cid:19)(cid:17)(cid:20)(cid:21)(cid:24)(cid:12) (cid:11)(cid:19)(cid:17)(cid:20)(cid:21)(cid:24)(cid:12) (cid:43)(cid:92) (cid:42)(cid:92) (cid:37)(cid:92) (cid:36)(cid:92) (cid:38) (cid:39)(cid:21)(cid:3)(cid:11)(cid:23)(cid:91)(cid:12) (cid:51)(cid:20) (cid:39)(cid:20) (cid:86)(cid:82)(cid:79)(cid:71)(cid:72)(cid:85)(cid:3)(cid:79)(cid:68)(cid:81)(cid:71) (cid:82)(cid:70)(cid:70)(cid:88)(cid:83)(cid:76)(cid:72)(cid:71)(cid:3)(cid:68)(cid:85)(cid:72)(cid:68) (cid:39)(cid:44)(cid:48)(cid:40)(cid:49)(cid:54)(cid:44)(cid:50)(cid:49)(cid:54)(cid:3)(cid:76)(cid:81)(cid:3)(cid:80)(cid:80) (cid:51)(cid:20) (cid:51)(cid:21) (cid:36)(cid:92) (cid:37)(cid:92) (cid:38) (cid:39)(cid:20) (cid:39)(cid:21) (cid:42)(cid:91) (cid:42)(cid:92) (cid:43)(cid:91) (cid:43)(cid:92) (cid:19)(cid:17)(cid:25)(cid:24)(cid:19) (cid:19)(cid:17)(cid:26)(cid:24)(cid:19) (cid:26)(cid:17)(cid:21)(cid:19)(cid:19) (cid:23)(cid:17)(cid:24)(cid:19)(cid:19) (cid:20)(cid:17)(cid:22)(cid:24)(cid:19) (cid:19)(cid:17)(cid:23)(cid:19)(cid:19) (cid:19)(cid:17)(cid:25)(cid:19)(cid:19) (cid:25)(cid:17)(cid:28)(cid:19)(cid:19) (cid:24)(cid:17)(cid:22)(cid:19)(cid:19) (cid:26)(cid:17)(cid:22)(cid:19)(cid:19) (cid:26)(cid:17)(cid:23)(cid:24)(cid:19) (cid:86)(cid:82)(cid:87)(cid:21)(cid:25)(cid:25)(cid:16)(cid:20)(cid:66)(cid:73)(cid:85) Fig 13. PCB footprint for SOT266-1 (SSOP20); reflow soldering SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 21 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 16. Abbreviations Table 12. Abbreviations Acronym Description AM Amplitude Modulation AMPS Advanced Mobile Phone System ASK Amplitude Shift Keying CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge ESR Equivalent Series Resistor FM Frequency Modulation FSK Frequency Shift Keying IF Intermediate Frequency L/C inductor-capacitor filter RF Radio Frequency RSSI Received Signal Strength Indicator SCA Subsidiary Communications Authorization SINAD Signal-to-Noise-And-Distortion ratio TACS Total Access Communication System THD Total Harmonic Distortion UHF Ultra High Frequency TTL Transistor-Transistor Logic VHF Very High Frequency 17. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes SA605 v.5 20141114 Product data sheet - SA605 v.4 Modifications: • Table 8 “SA605 application component list” updated • Figure 4 “SA605 45MHz application circuit” updated SA605 v.4 20140801 Product data sheet - SA605 v.3 SA605 v.3 20140501 Product data sheet - SA605 v.2 SA605 v.2 19971107 Product specification ECN 853-1401 18663 SA605 v.1 SA605 v.1 19921103 Product specification - - SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 22 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 18.2 Definitions Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Draft — The document is a draft version only. The content is still under malfunction of an NXP Semiconductors product can reasonably be expected internal review and subject to formal approval, which may result in to result in personal injury, death or severe property or environmental modifications or additions. NXP Semiconductors does not give any damage. NXP Semiconductors and its suppliers accept no liability for representations or warranties as to the accuracy or completeness of inclusion and/or use of NXP Semiconductors products in such equipment or information included herein and shall have no liability for the consequences of applications and therefore such inclusion and/or use is at the customer’s own use of such information. risk. Short data sheet — A short data sheet is an extract from a full data sheet Applications — Applications that are described herein for any of these with the same product type number(s) and title. A short data sheet is intended products are for illustrative purposes only. NXP Semiconductors makes no for quick reference only and should not be relied upon to contain detailed and representation or warranty that such applications will be suitable for the full information. For detailed and full information see the relevant full data specified use without further testing or modification. sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product Product specification — The information and data provided in a Product design. It is customer’s sole responsibility to determine whether the NXP data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customer’s applications and NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of customer have explicitly agreed otherwise in writing. In no event however, customer’s third party customer(s). Customers should provide appropriate shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their deemed to offer functions and qualities beyond those described in the applications and products. Product data sheet. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the 18.3 Disclaimers customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Limited warranty and liability — Information in this document is believed to Semiconductors products in order to avoid a default of the applications and be accurate and reliable. However, NXP Semiconductors does not give any the products or of the application or use by customer’s third party representations or warranties, expressed or implied, as to the accuracy or customer(s). NXP does not accept any liability in this respect. completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. Constant or profits, lost savings, business interruption, costs related to the removal or repeated exposure to limiting values will permanently and irreversibly affect replacement of any products or rework charges) whether or not such the quality and reliability of the device. damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 23 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system Export control — This document as well as the item(s) described herein NXP Semiconductors’ specifications such use shall be solely at customer’s may be subject to export control regulations. Export might require a prior own risk, and (c) customer fully indemnifies NXP Semiconductors for any authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ Non-automotive qualified products — Unless this data sheet expressly standard warranty and NXP Semiconductors’ product specifications. states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions. non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in 18.4 Trademarks automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the Notice: All referenced brands, product names, service names and trademarks product for such automotive applications, use and specifications, and (b) are the property of their respective owners. whenever customer uses the product for automotive applications beyond 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SA605 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 14 November 2014 24 of 25

SA605 NXP Semiconductors High performance low power mixer FM IF system 20. Contents 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics. . . . . . . . . . . . . . . . . . 7 11 Application information. . . . . . . . . . . . . . . . . . . 9 11.1 Circuit description. . . . . . . . . . . . . . . . . . . . . . 12 12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 13 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 15 14 Soldering of SMD packages . . . . . . . . . . . . . . 17 14.1 Introduction to soldering. . . . . . . . . . . . . . . . . 17 14.2 Wave and reflow soldering. . . . . . . . . . . . . . . 17 14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 17 14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 18 15 Soldering: PCB footprints. . . . . . . . . . . . . . . . 20 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 19 Contact information. . . . . . . . . . . . . . . . . . . . . 24 20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 November 2014 Document identifier: SA605