General-Purpose Rectifiers S3A-S3N Features • Low−Profile Package • Glass−Passivated Junction • UL Flammability Classification: 94V−0 • UL Certified, UL #E258596 • These are Pb−Free Devices www.onsemi.com ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Value Cathode Symbol Parameter S3A S3B S3D S3G S3J S3K S3M S3N Unit (2) VRRM Maximum 50 100 200 400 600 800 1000 1200 V Repetitive Anode Reverse Voltage (1) VRMS RMS 35 70 140 280 420 560 700 840 V SMC Reverse Voltage CASE 403AG VR DC 50 100 200 400 600 800 1000 1200 V Blocking Voltage IF(AV) Average Rectified 3.0 A Anode Cathode Forward Current TL = 105°C (1) (2) IFSM Non-Repetitive 100 A Peak Forward MARKING DIAGRAM Surge Current 8.3 ms Single Half-Sine-Wave TSTG Storage −55 to +150 °C Temperature $Y&Z&3 Range S3X TJ Operating −55 to +150 °C Junction Temperature Range $Y = ON Semiconductor Logo Stresses exceeding those listed in the Maximum Ratings table may damage the &Z = Assembly Plant Code device. If any of these limits are exceeded, device functionality should not be &3 = Numeric Date Code assumed, damage may occur and reliability may be affected. S3X = Specific Device Code THERMAL CHARACTERISTICS (Note 1) X = A−N Symbol Parameter Value Unit PD Power Dissipation 2.6 W ORDERING INFORMATION R(cid:2)JA Thermal Resistance, Junction-to-Ambient 100 °C/W Stheise ddaettaa islehde eotr.dering and shipping information on page 3 of R(cid:2)JL Thermal Resistance, Junction-to-Lead 13 °C/W 1. Device is mounted on FR−4 PCB 0.013 mm. Land pattern size: refer to the package drawing. Trace size: force line = 50 mil & sense line = 4 mil. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted (per leg)) Value Symbol Parameter Conditions S3A S3B S3D S3G S3J S3K S3M S3N Unit VF Maximum Forward Voltage IF = 3.0 A 1.2 V trr Typical Reverse Recovery Time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 2.5 (cid:3)s IR Maximum Reverse Current at TA = 25(cid:2)C 5 (cid:3)A Rated VR TA = 125(cid:2)C 250 CT Typical Total Capacitance VR = 4.0 V, f = 1.0 MHz 60 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. © Semiconductor Components Industries, LLC, 2001 1 Publication Order Number: February, 2020 − Rev. 6 S3N/D

S3A−S3N TYPICAL PERFORMANCE CHARACTERISTICS nt, 4.0 100 e r 3.5 r u C A] rward 23..50 nt, I [F 10 ctified Fo [A]IF 12..50 ard Curre 1 TPJu l=s e2 5W°Cidth = 300 (cid:3)s Re 1.0 rw 0.1 2% Duty Cycle ge Fo a 0.5 r e v A 0.0 0.01 50 60 70 80 90 100 110 120 130 140 150 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Lead Temperature [(cid:2)C] Forward Voltage, VF [V] Figure 1. Forward Current Derating Curve Figure 2. Forward Voltage Characteristics 120 100 rent, 100 8S.i3n em-Ws aSvineg JleE DHEalCf A] TA = 125°C Cur Method (cid:2) [R ward Surge I [A]FSM 8600 e Current, I 10 For 40 vers 1 k e ea 20 R TA = 25°C P 0 0.1 1 2 5 10 20 50 100 0 20 40 60 80 100 120 140 Number of Cycles at 60 Hz % of Reverse Voltage, VR [V] Figure 3. Non-Repetitive Surge Current Figure 4. Reverse Current vs. Reverse Voltage 100 F] p [T 50 C e, c n a cit a p a C al 10 ot T 5 1 5 10 50 100 Reverse Voltage, VR [V] Figure 5. Total Capacitance www.onsemi.com 2

S3A−S3N ORDERING INFORMATION Part Number Top Marking Package Shipping† S3A S3A DO−214AB (SMC) 3000 / Tape & Reel (Pb−Free) S3B S3B S3D S3D S3G S3G S3J S3J S3K S3K S3M S3M S3N S3N †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 3

MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMC CASE 403AG ISSUE O DATE 31 AUG 2016 8.15 B 7.75 1.96 6.25 3.27 3.39 5.55 2.75 B 6.81 A 7.15 0.13 M C B A LAND PATTERN RECOMMENDATION 6.60 TOP VIEW 8 ° R0.15 0 ° 2.45 A 2.65 MAX 4X 1.90 GAGE C PLANE 0.41 0.15 SEATING PLANE 0.203 0.30 4.70 0.050 B 0.05 8° 4.40 0.13 M C B A 0.45 1.60 0° 0.75 SIDE VIEW DETAIL A NOTES: SCALE 2:1 A. EXCEPT WHERE NOTED, CONFORMS TO JEDEC DO−214, VARIATION AB B DOES NOT COMPLY TO JEDEC STD. VALUE C. ALL DIMENSIONS ARE IN MILLIMETERS D. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR PROTRUSIONS. E. DIMENSIONS AND TOLERANCING AS PER ASME Y14.5−2009 F. LAND PATTERN STANDARD: DIOM7957X241M Electronic versions are uncontrolled except when accessed directly from the Document Repository. DOCUMENT NUMBER: 98AON13442G Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. DESCRIPTION: SMC PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

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