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RYM002N05T2CL产品简介:
ICGOO电子元器件商城为您提供RYM002N05T2CL由ROHM Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 RYM002N05T2CL价格参考¥0.48-¥0.48。ROHM SemiconductorRYM002N05T2CL封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 50V 200mA(Ta) 150mW(Ta) VMT3。您可以下载RYM002N05T2CL参考资料、Datasheet数据手册功能说明书,资料中有RYM002N05T2CL 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | MOSFET N-CH 50V 0.2A VMT3 |
产品分类 | FET - 单 |
FET功能 | 逻辑电平栅极,0.9V 驱动 |
FET类型 | MOSFET N 通道,金属氧化物 |
品牌 | Rohm Semiconductor |
数据手册 | 点击此处下载产品Datasheet点击此处下载产品Datasheet点击此处下载产品Datasheet点击此处下载产品Datasheet |
产品图片 | |
产品型号 | RYM002N05T2CL |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | - |
不同Id时的Vgs(th)(最大值) | 800mV @ 1mA |
不同Vds时的输入电容(Ciss) | 26pF @ 10V |
不同Vgs时的栅极电荷(Qg) | - |
不同 Id、Vgs时的 RdsOn(最大值) | 2.2 欧姆 @ 200mA,4.5V |
供应商器件封装 | VMT3 |
其它名称 | RYM002N05T2CL-ND |
功率-最大值 | 150mW |
包装 | 带卷 (TR) |
安装类型 | 表面贴装 |
封装/外壳 | 3-SMD,扁平引线 |
标准包装 | 8,000 |
漏源极电压(Vdss) | 50V |
电流-连续漏极(Id)(25°C时) | 200mA (Ta) |
RYM002N05 Nch 50V 200mA Small Signal MOSFET Datasheet llOutline VDSS 50V SOT-723 RDS(on)(Max.) 2.2Ω SC-105AA ID ±200mA VMT3 P 150mW D llInner circuit llFeatures 1) High speed switching 2) Small package(VMT3) 3) Ultra low voltage drive(0.9V drive) llPackaging specifications Embossed Packing Tape Reel size (mm) 180 llApplication Type Tape width (mm) 8 Switching Basic ordering unit (pcs) 8000 Taping code T2L Marking QJ llAbsolute maximum ratings (T = 25°C ,unless otherwise specified) a Parameter Symbol Value Unit Drain - Source voltage V 50 V DSS Continuous drain current I ±200 mA D Pulsed drain current I *1 ±800 mA DP Gate - Source voltage V ±8 V GSS Power dissipation P *2 150 mW D Junction temperature T 150 ℃ j Operating junction and storage temperature range T -55 to +150 ℃ stg www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 1/10 20160711 - Rev.001
RYM002N05 Datasheet llThermal resistance Values Parameter Symbol Unit Min. Typ. Max. Thermal resistance, junction - ambient R *2 - - 833 ℃/W thJA llElectrical characteristics (T = 25°C) a Values Parameter Symbol Conditions Unit Min. Typ. Max. Drain - Source breakdown V V = 0V, I = 1mA 50 - - V voltage (BR)DSS GS D Breakdown voltage ΔV(BR)DSS ID = 1mA - 53.7 - mV/℃ temperature coefficient ΔTj referenced to 25℃ Zero gate voltage I V = 50V, V = 0V - - 1 μA drain current DSS DS GS Gate - Source leakage current I V = ±8V, V = 0V - - ±10 μA GSS GS DS Gate threshold voltage V V = 10V, I = 1mA 0.3 - 0.8 V GS(th) DS D Gate threshold voltage ΔVGS(th) ID = 1mA - -1.4 - mV/℃ temperature coefficient ΔTj referenced to 25℃ V = 4.5V, I = 200mA - 1.6 2.2 GS D V = 2.5V, I = 200mA - 1.7 2.4 GS D Static drain - source R *3 V = 1.5V, I = 200mA - 2.0 2.8 Ω on - state resistance DS(on) GS D V = 1.2V, I = 100mA - 2.2 3.3 GS D V = 0.9V, I = 10mA - 3.0 9.0 GS D Forward Transfer |Y |*3 V = 10V, I = 200mA 200 - - mS Admittance fs DS D *1 Pw≦10μs, Duty cycle≦1% *2 Each terminal mounted on a reference land. *3 Pulsed www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 2/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristics (T = 25°C) a Values Parameter Symbol Conditions Unit Min. Typ. Max. Input capacitance C V = 0V - 26 - iss GS Output capacitance C V = 10V - 6 - pF oss DS Reverse transfer capacitance C f = 1MHz - 3 - rss Turn - on delay time t *3 V ⋍ 25V,V = 4.5V - 5 - d(on) DD GS Rise time t*3 I = 100mA - 8 - r D ns Turn - off delay time t *3 R ⋍ 250Ω - 17 - d(off) L Fall time t*3 R = 10Ω - 43 - f G llBody diode electrical characteristics (Source-Drain) (T = 25°C) a Values Parameter Symbol Conditions Unit Min. Typ. Max. Continuous forward current I - - 125 mA S T = 25℃ a Pulse forward current I *1 - - 800 mA SP Forward voltage V *3 V = 0V, I = 200mA - - 1.2 V SD GS S www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 3/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristic curves Fig.1 Power Dissipation Derating Curve Fig.2 Drain Current Derating Curve Fig.3 Typical Output Characteristics(I) Fig.4 Typical Output Characteristics(II) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 4/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristic curves Fig.5 Breakdown Voltage vs. Fig.6 Typical Transfer Characteristics Junction Temperature Fig.7 Gate Threshold Voltage vs. Fig.8 Forward Transfer Admittance vs. Junction Temperature Drain Current www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 5/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristic curves Fig.9 Static Drain - Source On - State Fig.10 Static Drain - Source On - State Resistance vs. Gate Source Voltage Resistance vs. Junction Temperature Fig.11 Static Drain - Source On - State Fig.12 Static Drain - Source On - State Resistance vs. Drain Current (I) Resistance vs. Drain Current (II) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 6/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristic curves Fig.13 Static Drain - Source On - State Fig.14 Static Drain - Source On - State Resistance vs. Drain Current (lII) Resistance vs. Drain Current (IV) Fig.15 Static Drain - Source On - State Fig.16 Static Drain - Source On - State Resistance vs. Drain Current (V) Resistance vs. Drain Current (VI) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 7/10 20160711 - Rev.001
RYM002N05 Datasheet llElectrical characteristic curves Fig.17 Typical Capacitance vs. Fig.18 Switching Characteristics Drain - Source Voltage Fig.19 Source Current vs. Source Drain Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 8/10 20160711 - Rev.001
RYM002N05 Datasheet llMeasurement circuits Fig. 1-1 SWITCHING TIME MEASUREMENT CIRCUIT Fig. 1-2 SWITCHING WAVEFORMS llNotice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 9/10 20160711 - Rev.001
RYM002N05 Datasheet llDimensions www.rohm.com 10/10 20160711 - Rev.001 © 2016 ROHM Co., Ltd. All rights reserved.
Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.
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