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  • 型号: RRR040P03TL
  • 制造商: ROHM Semiconductor
  • 库位|库存: xxxx|xxxx
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RRR040P03TL产品简介:

ICGOO电子元器件商城为您提供RRR040P03TL由ROHM Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 RRR040P03TL价格参考¥1.15-¥4.58。ROHM SemiconductorRRR040P03TL封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 P 沟道 30V 4A(Ta) 1W(Ta) TSMT3。您可以下载RRR040P03TL参考资料、Datasheet数据手册功能说明书,资料中有RRR040P03TL 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET P-CH 30V 4A TSMT3MOSFET 4V DRIVE PCH MOSFET

产品分类

FET - 单分离式半导体

FET功能

逻辑电平栅极,4V 驱动

FET类型

MOSFET P 通道,金属氧化物

Id-ContinuousDrainCurrent

4 A

Id-连续漏极电流

4 A

品牌

ROHM Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,ROHM Semiconductor RRR040P03TL-

数据手册

点击此处下载产品Datasheet

产品型号

RRR040P03TL

Pd-PowerDissipation

1 W

Pd-功率耗散

1 W

Qg-GateCharge

10.5 nC

Qg-栅极电荷

10.5 nC

RdsOn-Drain-SourceResistance

32 mOhms

RdsOn-漏源导通电阻

32 mOhms

Vds-Drain-SourceBreakdownVoltage

30 V

Vds-漏源极击穿电压

- 30 V

Vgs-Gate-SourceBreakdownVoltage

+/- 20 V

Vgs-栅源极击穿电压

20 V

上升时间

30 ns

下降时间

45 ns

不同Id时的Vgs(th)(最大值)

2.5V @ 1mA

不同Vds时的输入电容(Ciss)

1000pF @ 10V

不同Vgs时的栅极电荷(Qg)

10.5nC @ 5V

不同 Id、Vgs时的 RdsOn(最大值)

45 毫欧 @ 4A,10V

产品种类

MOSFET

供应商器件封装

TSMT3

其它名称

RRR040P03TLCT

典型关闭延迟时间

85 ns

功率-最大值

1W

包装

剪切带 (CT)

商标

ROHM Semiconductor

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-236-3,SC-59,SOT-23-3

封装/箱体

TSMT-3

工厂包装数量

3000

晶体管极性

P-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

1

正向跨导-最小值

2.7 S

漏源极电压(Vdss)

30V

电流-连续漏极(Id)(25°C时)

4A (Ta)

通道模式

Enhancement

配置

Single

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PDF Datasheet 数据手册内容提取

RRR040P03   Pch -30V -4A Small Signal MOSFET    Datasheet llOutline VDSS -30V SOT-346T r   RDS(on)(Max.) 45mΩ SC-96 o ID ±4A TSMT3 f PD 1.0W   d             e llInner circuit llFeatures d 1) Low on - resistance s n 2) Built-in G-S Protection Diode 3) Small Surface Mount Package (TSMT3) n e 4) Pb-free lead plating ; RoHS compliant g m i s m llPackaging specifications e Embossed Packing Tape o D Reel size (mm) 180 llApplication c Type Tape width (mm) 8 DC/DC converters w Basic ordering unit (pcs) 3000 e Taping code TL R e Marking UG llAbsolute ma ximum ratings (TNa = 25°C ,unless otherwise specified) t Parameter Symbol Value Unit o Drain - Source voltage V -30 V DSS CoNntinuous drain current I ±4 A D Pulsed drain current I *1 ±16 A DP Gate - Source voltage V ±20 V GSS P *2 1.0 W D Power dissipation P *3 0.7 W D Junction temperature T 150 ℃ j Operating junction and storage temperature range T -55 to +150 ℃ stg                                                                                                                                                                                     www.rohm.com       © 2017 ROHM Co., Ltd. All rights reserved. 1/11 20170613 - Rev.002

RRR040P03                          Datasheet llThermal resistance                                     Values Parameter Symbol Unit Min. Typ. Max. R *2 - - 125 ℃/W thJA Thermal resistance, junction - ambient r R *3 - - 178 ℃/W thJA o f llElectrical characteristics (T = 25°C) a Values d Parameter Symbol Conditions Unit Min. Typ. Max. e Drain - Source breakdown voltage V(BR)DSS VGS = 0V, ID = -1mA d -30 - - V s Breakdown voltage  ΔV(BR)DSS  ID = -1mA n - -24.1 - mV/℃ temperature coefficient    ΔTj    referenced to e25℃ n Zero gate voltage drain current IDSS VDS = -3m0V, VGS = -0V g- - -1 μA i Gate - Source leakage current I V = ±20V, V = 0V - - ±10 μA GSS GS DS s m Gate threshold voltage V V = -10V, I = -1mA -1.0 - -2.5 V GS(th) DS D e Gate threshold voltage  ΔVGS(th)   ID = -1mA o - 3.3 - mV/℃ temperature coefficient D    ΔTj    referenced to 25℃ c V = -10V, I = -4A - 32 45 GS D Static drain - source w e R *4 V = -4.5V, I = -2A - 45 63 mΩ on - state resistance DS(on) GS D R VGS = -4.0V, ID = -2A - 52 72 e Gate resistance R f = 1MHz, open drain - 13 - Ω G N Forward Tratnsfer |Y |*4 V = -10V, I = -4A 2.7 - - S Admittaonce fs DS D N *1 Pw ≦ 10μs, Duty cycle ≦ 1% *2 Mounted on a ceramic boad (30×30×0.8mm) *3 Mounted on a FR4 (25×25×0.8mm) *4 Pulsed                                                                                          www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 2/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristics (T = 25°C) a Values Parameter Symbol Conditions Unit Min. Typ. Max. Input capacitance C V = 0V - 1000 - iss GS r Output capacitance C V = -10V - 150 o- pF oss DS Reverse transfer capacitance C f = 1MHz - 130 f - rss Turn - on delay time td(on)*4 VDD ⋍ -15V,VGS = -10V - d15 - Rise time t*4 I = -2A - 30 - r D e ns Turn - off delay time t *4 R ⋍ 7.5Ω - 85 - d(off) L d Fall time t*4 R = 10Ω - 45 - f G s n n e g m llGate charge characteristics (T = 25°C) a i Values s Parameter Symbol m Conditions Unit Min. Typ. Max. e Total gate charge Q *4 - 10.5 - og VDD ⋍ -15VD, Gate - Source charge Q *4 I = -4A, - 3.0 - nC c gs D V = -5V Gate - Drain charge Q *4 GS - 3.3 - gd w e R e llBody diode electrical characNteristics (Source-Drain) (T = 25°C) a t Values o Parameter Symbol Conditions Unit Min. Typ. Max. N Continuous forward current I - - -0.8 A S T = 25℃ a Pulse forward current I *1 - - -16 A SP Forward voltage V *4 V = 0V, I = -4A - - -1.2 V SD GS S                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 3/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area r o f d e d s n n e g m i s m e o D Fig.3 Normalized Transient Thermal Fig.4 Single Pulse Maximum Power c     Resistance vs. Pulse Width     dissipation w e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 4/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.5 Typical Output Characteristics(I) Fig.6 Typical Output Characteristics(II) r o f d e d s n n e g m i s m e o D Fig.7 Breakdown Voltage vs. c      Junction Temperature w e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 5/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.8 Typical Transfer Characteristics Fig.9 Gate Threshold Voltage vs.      Junction Temperature r o f d e d s n n e g m i s m e o D c Fig.10 Forward Transfer Admittance vs.      Drain Current w e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 6/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.11 Drain Current Derating Curve Fig.12 Static Drain - Source On - State    Resistance vs. Gate Source Voltage r o f d e d s n n e g m i s m e o D c Fig.13 Static Drain - Source On - State    Resistance vs. Junction Temperwature e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 7/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.14 Static Drain - Source On - State Fig.15 Static Drain - Source On - State      Resistance vs. Drain Current (I)      Resistance vs. Drain Current (II) r o f d e d s n n e g m i s m e o D c Fig.16 Static Drain - Source On - State Fig.17 Static Drain - Source On - State      Resistance vs. Drain Currentw (III)      Resistance vs. Drain Current (Ⅳ) e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 8/11 20170613 - Rev.002

RRR040P03                             Datasheet llElectrical characteristic curves Fig.18 Typical Capacitance vs. Fig.19 Switching Characteristics       Drain - Source Voltage r o f d e d s n n e g m i s m e o D c Fig.20 Dynamic Input Characteristics Fig.21 Source Current vs. w       Source Drain Voltage e R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 9/11 20170613 - Rev.002

RRR040P03                             Datasheet llMeasurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms r o f d e Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform d s n n e g m i s m                                                                             e o llNotice D c This product might cause chip aging and break down under the large electrified environment. w Please consider to desiegn ESD protection circuit. R e N t o N                                                                                             www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. 10/11 20170613 - Rev.002

RRR040P03                                  Datasheet llDimensions r o f d e d s n n e g m i s m e o D c w e R e N t o N                                                                                             www.rohm.com 11/11 20170613 - Rev.002 © 2017 ROHM Co., Ltd. All rights reserved.

Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment inc luding car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bordily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsibleo or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. f (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA d CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ e 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implemdent, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety meassures: n [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure n e 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordinggly, ROHM shall not be in any way m responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend tio use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of s product performance, reliability, etc, prior to usme, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Prodeucts are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 o D [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products inc proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin o r other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of w flux is recommeended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of thRe Products in places subject to dew condensation e 4. The Products are not subject to radiation-proof design. N 5. Pleaset verify and confirm characteristics of the final or mounted products in using the Products. 6. Ino particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power N exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. r o Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic dischafrge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humididty control). Precaution for Storage / Transportation e 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHdM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic n s 2. Even under ROHM recommended storage condition, solderability of products out of recnommended storage time period may be degraded. It is strongly recommended to confirm soldeerability before using Products of which storage time is exceeding the recommended storage time period. m g 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. i s 4. Use Products within the specified time after opmening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. e Precaution for Product Label o A two-dimensional barcode printed on ROHM Products label isD for ROHM’s internal use only. Precaution for Disposition c When disposing Products please dispose them properly using an authorized industry waste company. w e Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consRult with ROHM in case of export. e Precaution Regarding Intellectual Property Rights 1. All information and data includiNng but not limited to application example contained in this document is for reference only. RtOHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. o 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). N 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.

DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. r 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any waoy responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. f d e d s n n e g m i s m e o D c w e R e N t o N Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.

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