REG1117 REG1117A SBVS001D − OCTOBER 1992 − REVISED JULY 2004 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable FEATURES DESCRIPTION (cid:1) FIXED AND ADJUSTABLE VERSIONS The REG1117 is a family of easy-to-use three-terminal (cid:1) 2.85V MODEL FOR SCSI-2 ACTIVE voltage regulators. The family includes a variety of fixed- TERMINATION and adjustable-voltage versions, two currents (800mA and (cid:1) 1A) and two package types (SOT-223 and DDPAK). See OUTPUT CURRENT: the chart below for available options. REG1117: 800mA max REG1117A: 1A max Output voltage of the adjustable versions is set with two (cid:1) OUTPUT TOLERANCE: (cid:1)1% max external resistors. The REG1117 low dropout voltage (cid:1) allows its use with as little as 1V input-output voltage DROPOUT VOLTAGE: differential. REG1117: 1.2V max at I = 800mA O REG1117A: 1.3V max at I = 1A Laser trimming assures excellent output voltage accuracy O (cid:1) without adjustment. An NPN output stage allows output INTERNAL CURRENT LIMIT (cid:1) stage drive to contribute to the load current for maximum THERMAL OVERLOAD PROTECTION efficiency. (cid:1) SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES 800mA 1A VOLTAGE SOT-223 DDPAK SOT-223 DDPAK APPLICATIONS 1.8V (cid:2) (cid:2) (cid:1) SCSI-2 ACTIVE TERMINATION 2.5V (cid:2) (cid:2) (cid:1) HAND-HELD DATA COLLECTION DEVICES 2.85V (cid:2) (cid:1) HIGH EFFICIENCY LINEAR REGULATORS 3.3V (cid:2) (cid:2) (cid:1) BATTERY-POWERED INSTRUMENTATION 5V (cid:2) (cid:2) (cid:1) BATTERY MANAGEMENT CIRCUITS FOR Adjustable (cid:2) (cid:2) (cid:2) NOTEBOOK AND PALMTOP PCs (cid:1) CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. (cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:3)(cid:9) (cid:4)(cid:10)(cid:7)(cid:10) (cid:11)(cid:12)(cid:13)(cid:14)(cid:15)(cid:16)(cid:17)(cid:18)(cid:11)(cid:14)(cid:12) (cid:11)(cid:19) (cid:20)(cid:21)(cid:15)(cid:15)(cid:22)(cid:12)(cid:18) (cid:17)(cid:19) (cid:14)(cid:13) (cid:23)(cid:21)(cid:24)(cid:25)(cid:11)(cid:20)(cid:17)(cid:18)(cid:11)(cid:14)(cid:12) (cid:26)(cid:17)(cid:18)(cid:22)(cid:27) (cid:1)(cid:15)(cid:14)(cid:26)(cid:21)(cid:20)(cid:18)(cid:19) Copyright  1992−2004, Texas Instruments Incorporated (cid:20)(cid:14)(cid:12)(cid:13)(cid:14)(cid:15)(cid:16) (cid:18)(cid:14) (cid:19)(cid:23)(cid:22)(cid:20)(cid:11)(cid:13)(cid:11)(cid:20)(cid:17)(cid:18)(cid:11)(cid:14)(cid:12)(cid:19) (cid:23)(cid:22)(cid:15) (cid:18)(cid:28)(cid:22) (cid:18)(cid:22)(cid:15)(cid:16)(cid:19) (cid:14)(cid:13) (cid:7)(cid:22)(cid:29)(cid:17)(cid:19) (cid:8)(cid:12)(cid:19)(cid:18)(cid:15)(cid:21)(cid:16)(cid:22)(cid:12)(cid:18)(cid:19) (cid:19)(cid:18)(cid:17)(cid:12)(cid:26)(cid:17)(cid:15)(cid:26) (cid:30)(cid:17)(cid:15)(cid:15)(cid:17)(cid:12)(cid:18)(cid:31)(cid:27) (cid:1)(cid:15)(cid:14)(cid:26)(cid:21)(cid:20)(cid:18)(cid:11)(cid:14)(cid:12) (cid:23)(cid:15)(cid:14)(cid:20)(cid:22)(cid:19)(cid:19)(cid:11)(cid:12)! (cid:26)(cid:14)(cid:22)(cid:19) (cid:12)(cid:14)(cid:18) (cid:12)(cid:22)(cid:20)(cid:22)(cid:19)(cid:19)(cid:17)(cid:15)(cid:11)(cid:25)(cid:31) (cid:11)(cid:12)(cid:20)(cid:25)(cid:21)(cid:26)(cid:22) (cid:18)(cid:22)(cid:19)(cid:18)(cid:11)(cid:12)! (cid:14)(cid:13) (cid:17)(cid:25)(cid:25) (cid:23)(cid:17)(cid:15)(cid:17)(cid:16)(cid:22)(cid:18)(cid:22)(cid:15)(cid:19)(cid:27) www.ti.com

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ABSOLUTE MAXIMUM RATINGS(1) This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited handled with appropriate precautions. Failure to observe Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V proper handling and installation procedures can cause damage. Operating Junction Temperature Range. . . . . . . . −40°C to +125°C ESD damage can range from subtle performance degradation to Storage Temperature Range . . . . . . . . . . . . . . . . . −65°C to +150°C complete device failure. Precision integrated circuits may be more Lead Temperature (soldering, 10s)(2) . . . . . . . . . . . . . . . . . +300°C susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (1)Stresses above these ratings may cause permanent damage. (2)See Soldering Methods section. CONNECTION DIAGRAM Front View PlasticDDPAK PlasticSOT−223 Tabis V OUT TabisV OUT Ground V V Ground V V OUT IN OUT IN (Adj.)(1) (Adj.)(1) NOTE:(1)Adjustable−VoltageModel. 2

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 PACKAGE/ORDERING INFORMATION(1) OPERATING TRANSPORT PACKAGE PACKAGE ORDERING PRODUCT VO/IO PACKAGE-LEAD DESIGNATOR TEMPERATURE MARKING NUMBER MEDIA, RANGE QUANTITY REG1117-2.85 Rails, 80 −−4400°°CC ttoo REG1117-2.85 2.85/800mA SOT223-3 DCY +125°C BB11172 REG1117-2.85 Tape and Reel, 2500 REG1117-3.3 Rails, 80 −−4400°°CC ttoo REG1117-3.3 3.3/800mA SOT223-3 DCY +125°C BB11174 REG1117-3.3 Tape and Reel, 2500 Tape and Reel, REG1117F-3.3KTTT −−4400°CC ttoo 50 RREEGG11111177FF--33..33 33..33//880000mmAA DDDDPPAAKK--33 KKTTTT BBBB11111177FF44 +125°C Tape and Reel, REG1117F-3.3/500 500 REG1117-5 Rails, 80 −−4400°°CC ttoo REG1117-5 5V/800mA SOT223-3 DCY +125°C BB11175 REG1117-5 Tape and Reel, 2500 REG1117 Rails, 80 −−4400°°CC ttoo REG1117 Adj./800mA SOT223-3 DCY +125°C BB1117 REG1117 Tape and Reel, 2500 REG1117A-1.8 Rails, 80 −−4400°°CC ttoo REG1117A-1.8 1.8V/1A SOT223-3 DCY +125°C R111718 REG1117A-1.8 Tape and Reel, 2500 Tape and Reel, REG1117FA-1.8KTTT −−4400°CC ttoo 50 RREEGG11111177FFAA--11..88 11..88//11AA DDDDPPAAKK--33 KKTTTT RREEGG11111177FFAA11..88 +125°C Tape and Reel, REG1117FA-1.8/500 500 REG1117A-2.5 Rails, 80 −−4400°°CC ttoo REG1117A-2.5 2.5/1A SOT223-3 DCY +125°C R111725 REG1117A-2.5 Tape and Reel, 2500 Tape and Reel, REG1117FA-2.5KTTT −−4400°CC ttoo 50 RREEGG11111177FFAA--22..55 22..55//11AA DDDDPPAAKK--33 KKTTTT RREEGG11111177FFAA22..55 +125°C Tape and Reel, REG1117FA-2.5/500 500 Tape and Reel, REG1117FA-5/KTTT −−4400°CC ttoo 50 RREEGG11111177FFAA--55 55//11AA DDDDPPAAKK--33 KKTTTT BBBB11111177FFAA55..00 +125°C Tape and Reel, REG1117FA-5/500 500 REG1117A Rails, 80 −−4400°°CC ttoo REG1117A Adj./1A SOT223-3 DCY +125°C BB1117A REG1117A Tape and Reel, 2500 Tape and Reel, REG1117FA/KTTT −−4400°CC ttoo 50 RREEGG11111177FFAA AAddjj..//11AA DDDDPPAAKK--33 KKTTTT RREEGG11111177FFAA +125°C Tape and Reel, REG1117FA/500 500 (1)For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. 3

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITION MIN TYP MAX UNIT OUTPUT VOLTAGE REG1117-2.85 I = 10mA, V = 4.85V 2.820 2.85 2.880 V O IN See Note 1 I = 0 to 800mA, V = 4.05V to 10V 2.790 2.85 2.910 V O IN REG1117-3.3 I = 10mA, V = 5.3V 3.270 3.30 3.330 V O IN See Note 1 I = 0 to 800mA, V = 4.8V to 10V 3.240 3.30 3.360 V O IN REG1117-5 I = 10mA, V = 7V 4.950 5.00 5.050 V O IN See Note 1 I = 0 to 800mA, V = 6.5V to 10V 4.900 5.00 5.100 V O IN REG1117A-1.8 I = 10mA, V = 3.8V 1.782 1.8 1.818 V O IN See Note 1 I = 0 to 1A, V = 3.8V to 10V 1.764 1.8 1.836 V O IN REG1117A-2.5 I = 10mA, V = 4.5V 2.475 2.5 2.525 V O IN See Note 1 I = 0 to 1A, V = 4.5V to 10V 2.450 2.5 2.550 V O IN REG1117A-5 I = 10mA, V = 7V 4.950 5.0 5.050 V O IN See Note 1 I = 0 to 1A, V = 7V to 10V 4.900 5.0 5.100 V O IN REFERENCE VOLTAGE REG1117 (Adjustable) I = 10mA, V − V = 2V 1.238 1.250 1.262 V O IN O See Note 1 I = 10 to 800mA, V − V = 1.4 to 10V 1.225 1.250 1.280 V O IN O REG1117A (Adjustable) I = 10mA, V − V = 2V 1.238 1.250 1.262 V O IN O See Note 1 I = 10mA to 1A, V − V = 1.4 to 10V 1.225 1.250 1.280 V O IN O LINE REGULATION REG1117-2.85(1) I = 0, V = 4.25 to 10V 1 7 mV O IN REG1117-3.3(1) I = 0, V = 4.8 to 10V 2 7 mV O IN REG1117-5(1) I = 0, V = 6.5 to 15V 3 10 mV O IN REG1117 (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 % REG1117A (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 % REG1117A-1.8(1) I = 0, V = 3.8V to 10V 1 7 mV O IN REG1117A-2.5(1) I = 0, V = 4.5V to 10V 1 7 mV O IN REG1117A-5.0(1) I = 0, V = 7V to 15V 3 10 mV O IN LOAD REGULATION REG1117-2.85(1) I = 0 to 800mA, V = 4.25V 2 10 mV O IN REG1117-3.3(1) I = 0 to 800mA, V = 4.8V 3 12 mV O IN REG1117-5(1) I = 0 to 800mA, V = 6.5V 3 15 mV O IN REG1117 (Adjustable)(1)(2) I = 10 to 800mA, V − V = 3V 0.1 0.4 % O IN O REG1117A (Adjustable)(1)(2) IO = 10mA to 1A, VIN − VO = 3V 0.1 0.4 % REG1117A-1.8(1) I = 0 to 1A, V = 3.8V 2 10 mV O IN REG1117A-2.5 I = 0 to 1A, V = 4.5V 2 10 mV O IN REG1117A-5 I = 0 to 1A, V = 7.0V 3 15 mV O IN DROPOUT VOLTAGE(3) All Models(1) I = 100mA 1.00 1.10 V O See Note 1 I = 500mA 1.05 1.15 V O REG1117 Models(1) I = 800mA 1.10 1.20 V O REG1117A I = 1A 1.2 1.30 V O See Note 1 I = 1A 1.2 1.55 V O (1)Specification applies over the full specified junction temperature range, 0°C to +125°C. (2)REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3)Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4)Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 4

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS (continued) At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITION MIN TYP MAX UNIT CURRENT LIMIT REG1117 Models V − V = 5V 800 950 1200 mA IN O REG1117A V − V = 5V 1000 1250 1600 mA IN O MINIMUM LOAD CURRENT Adjustable Models(1)(2) V − V = 13.75V 1.7 5 mA IN O QUIESCENT CURRENT Fixed-Voltage Models(1) V − V = 5V 4 10 mA IN O ADJUSTABLE PIN CURRENT(1)(2) I = 10mA, V − V = 1.4 to 10V 50 120 µA O IN O vs Load Current, REG1117(1) I = 10mA to 800mA, V − V = 1.4 to 10V 0.5 5 µA O IN O vs Load Current, REG1117A(1) I = 10mA to 1A, V − V = 1.4 to 10V 0.5 5 µA O IN O THERMAL REGULATION All Models(4) 30ms Pulse 0.01 0.1 %/W RIPPLE REJECTION All Models f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple 62 dB TEMPERATURE DRIFT Fixed-Voltage Models T = 0°Cto +125°C 0.5 % J Adjustable Models T = 0°Cto +125°C 2 % J LONG-TERM STABILITY All Models TA = 125°C, 1000Hr 0.3 % OUTPUT NOISE rms Noise, All Models f = 10Hz to 10kHz 0.003 % THERMAL RESISTANCE Thermal Resistance, (cid:1)JC (Junction-to-Case at Tab) 3-Lead SOT-223 Surface-Mount 15 °C/W 3-Lead DDPAK Surface-Mount f > 50Hz 2 °C/W dc 3 °C/W Thermal Resistance, (cid:1)JA (Junction-to-Case at Tab) 3-Lead DDPAK Surface-Mount No Heatsink 65 °C/W (1)Specification applies over the full specified junction temperature range, 0°C to +125°C. (2)REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3)Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4)Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 5

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 SIMPLIFIED SCHEMATIC V IN + Current Limit Thermal Limit V 10X OUT (Substrate) Ground(Fixed−voltageModels) Adj.(Adjustable−voltageModel) 6

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS At TA = +25°C, all models, unless otherwise noted. LOADREGULATION SHORT−CIRCUITCURRENTvsTEMPERATURE (∆I =800mA) LOAD 1400 1 0 1300 V) REG1117−2.85 A) m m ( 1 Current( 11210000 REG1117A Deviation −−23 REG1117A−1.8 uit ge Circ 1000 REG1117Models olta −4 − V ort ut −5 Sh 900 utp REG1117−5 O −6 800 −7 −50 −25 0 25 50 75 100 −50 −25 0 25 50 75 100 Temperature((cid:3)C) Temperature((cid:3)C) LINEREGULATIONvsTEMPERATURE RIPPLEREJECTIONvsFREQUENCY 6 100 5 90 IOUT=100mA V) VIN=6.5Vto15V 80 VRIPPLE=1.0VPP e(m 4 REG1117−5 dB) 70 g ( an 3 on 60 Ch 2 ecti 50 utVoltage 10 REG1117A−1.8 RippleRej 4300 utp VIN=3.8Vto10V 20 O −1 10 −2 0 −50 −25 0 25 50 75 100 10 100 1k 10k 100k Temperature((cid:3)C) Frequency(Hz) OUTPUTVOLTAGEvsTEMPERATURE QUIESCENTCURRENTvsTEMPERATURE 2.0 8 IO=10mA 7 %) Fixed−VoltageModels ( 1.0 A) 6 e m ang nt( 5 h e geC 0 Curr 4 Volta scent 3 utput −1.0 Quie 2 O 1 −2.0 0 −50 −25 0 25 50 75 100 −50 −25 0 25 50 75 100 Temperature((cid:3)C) Temperature((cid:3)C) 7

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, all models, unless otherwise noted. LOADTRANSIENTRESPONSE LINETRANSIENTRESPONSE 60 OutputVoltageDeviations(V)−00..101 OutputVoltageDeviation(mV) 42000 CCIOIOUNUT=T==10µ1.F10AµFTantalum −20 A) 0.5 CCIONU=T=101µ0FµF V) −40 Current( −0.05 PTVaIrNenl=toaa4lud.2m=5V0.1A Voltage( 54..2255 Load 0 20 40 60 80 100 Input 3.25 0 20 40 60 80 100 120 140 160 180 200 Time(µs) Time(µs) APPLICATIONS INFORMATION Figure 2 shows a hookup diagram for the adjustable voltage model. Resistor values are shown for some Figure 1 shows the basic hookup diagram for fixed-voltage commonly-used output voltages. Values for other voltages models. All models require an output capacitor for proper can be calculated from the equation shown in Figure 2. For operation, and for improving high-frequency load best load regulation, connect R close to the output pin and 1 regulation; a 10µF tantalum capacitor is recommended. R close to the ground side of the load as shown. 2 Aluminum electrolytic types of 50µF or greater can also be used. A high-quality capacitor should be used to assure that the ESR (Effective Series Resistance) is less than THERMAL CONSIDERATIONS 0.5Ω. The REG1117 has current limit and thermal shutdown circuits that protect it from overload. The thermal shutdown activates at approximately TJ = 165°C. For continuous operation, however, the junction temperature should not be allowed to exceed 125°C. Any tendency to activate the thermal shutdown in normal use is an indication of an VIN REG1117 VO inadequate heat sink or excessive power dissipation. The 10µF + +10µF power dissipation is equal to: Tantalum Tantalum P = (V – V ) I D IN OUT OUT The junction temperature can be calculated by: T = T + P ((cid:1) ) J A D JA Figure 1. Fixed-Voltage Model—Basic where TA is the ambient temperature, and (cid:1)JA is the Connections junction-to-ambient thermal resistance. VIN 3 REG1117 2 VO V R R (Adj) (OVU)T (Ω)(12) (Ω)(22) 10µCF1+ 1 R1 +C102µF Load VO= R1R+1R2 x(1.25V)+(50µA)(R2) 11.2.55 O7p5e0n S1h4o7rt 2.1 158 107 C(1)+ 2.85 169 215 103µF R2 Thistermisnegligiblewith 3 137 191 properchoiceofvalues−see 3.3 115 187 tableatright. 5 113 340 10 113 787 NOTES:(1)C optional.Improveshigh−frequencylinerejection.(2)Resistorsarestandard1%values. 3 Figure 2. Adjustable-Voltage Model—Basic Connections 8

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 A simple experiment will determine whether the maximum LAYOUT CONSIDERATIONS recommended junction temperature is exceeded in an The DDPAK (REG1117F-3.3 and REG1117FA) is a actual circuit board and mounting configuration: Increase surface-mount power package that has excellent thermal the ambient temperature above that expected in normal characteristics. For best thermal performance, the operation until the device’s thermal shutdown is activated. mounting tab should be soldered directly to a circuit board If this occurs at more than 40°C above the maximum copper area, as shown in Figure 3. Increasing the copper expected ambient temperature, then TJ will be less than area improves heat dissipation. Figure 4 shows typical 125°C during normal operation. thermal resistance from junction-to-ambient as a function The internal protection circuitry of the REG1117 was of the copper area. designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability. 3−LeadDDPAK(1) 0.51 5 4 0. 5 8 0 0. 2 Allmeasurements 0. ininches. 0.155 0.05 0.10 NOTE:(1)Forimprovedthermalperformanceincrease footprintarea.SeeFigure4(ThermalResistancevs CircuitBoardCopperArea). Figure 3. DDPAK Footprint THERMALRESISTANCEvs CIRCUITBOARDCOPPERAREA CircuitBoardCopperArea 60 W) REG1117F C/ 50 DDPAKSurfaceMountPackage ° (A 1ozcopper (cid:1)J e, 40 c n a st si 30 e R al m er 20 h T REG1117F DDPAKSurface−MountPackage 10 0 1 2 3 4 5 CopperArea(inches2) Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area 9

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 The SOT-223 package derives heat sinking from Table 1. SOT-223 (cid:1) for Various Board JA conduction through its copper leads, especially the large Configurations mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown SOT-223 in Figure 5. Circuit board traces connecting the tab and the TTHHEERRMMAALL TOTAL PC TOPSIDE((11)) BACKSIDE RESISTANCE leads should be made as large as practical. The mounting BBOOAARRDD CCOOPPPPEERR CCOOPPPPEERR JJUUNNCCTTIIOONN-- tab of both packages is electrically connected to V . OUT AREA AREA AREA TO-AMBIENT 2500mm2 2500mm2 2500mm2 46°C/W 2500mm2 1250mm2 2500mm2 47°C/W TotalArea:50x50mm 2500mm2 950mm2 2500mm2 49°C/W 2500mm2 2500mm2 0 51°C/W 2500mm2 1800mm2 0 53°C/W 35x17mm 1600mm2 600mm2 1600mm2 55°C/W 2500mm2 1250mm2 0 58°C/W 2500mm2 915mm2 0 59°C/W 16x10mm 16x10mm 1600mm2 600mm2 0 67°C/W 900mm2 340mm2 900mm2 72°C/W 900mm2 340mm2 0 85°C/W Withoutbacksidecopper:(cid:1) ≈59(cid:3)C/W JA Withsolidbacksidecopper:(cid:1)JA≈49(cid:3)C/W (1)Tab is attached to the topside copper. Figure 5. SOT-223 Circuit Board Layout Example SOLDERING METHODS Other nearby circuit traces, including those on the back Both REG1117 packages are suitable for infrared reflow side of the circuit board, help conduct heat away from the and vapor-phase reflow soldering techniques. The high device, even though they may not be electrically rate of temperature change that occurs with wave connected. Make all nearby copper traces as wide as soldering or hand soldering can damage the REG1117. possible and leave only narrow gaps between traces. Table 1 shows approximate values of (cid:1) for various circuit INSPEC Abstract Number: B91007604, C91012627. JA board and copper areas for the SOT-223 package. Nearby Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω heat dissipating components, circuit board mounting Packages.” The Proceedings of SMTCON. Surface Mount conditions, and ventilation can dramatically affect the Technology Conference and Exposition: Competitive actual (cid:1) . Proper heat sinking significantly increases the Surface Mount Technology, April 3−6, 1990, Atlantic City, JA maximum power dissipation at a given ambient NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, temperature, as shown in Figure 6. IL, USA. MAXIMUMPOWERDISSIPATION vsAMBIENTTEMPERATURE 6 (cid:1)(4JAin2=o2n7e(cid:3)oCz/Wcopper PD=T(T(mJ(amxa)x=)1−5T0A(cid:3))C/(cid:1)JA 5 mountingpad) J s) att n(W 4 ((cid:1)2JA50=04m6m(cid:3)2Ct/oWpsideand DSODPT−A2K23 patio 3 backsidecopper) Dissi (cid:1)JA=65(cid:3)(nCo/Wheatsink) er 2 w Po 1 (cid:1)JA=85(cid:3)C/W (340mm2topsidecopper, nobacksidecopper) 0 0 25 50 75 100 125 AmbientTemperature((cid:3)C) Figure 6. Maximum Power Dissipation versus Ambient Temperature 10

(cid:2)"#$$$% (cid:2)"#$$$%(cid:10) www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TERMPWR TERMPWR 5V 5V 1N5817 2.85V 110Ω 110Ω 2.85V 1N5817 REG1117−2.85 REG1117−2.85 10µF 10µF 10µF 10µF (Upto27Lines) 110Ω 110Ω Figure 7. SCSI Active Termination Configuration REG1117−5 REG1117−5 V >12V In Out 5Vto10V V >9.0V In Out 7.5V IN IN + + + + 10µF GND 100µF 10µF GND 100µF 2.5V OUT + 10µF 1kΩ REF1004−2.5 Figure 8. Adjusting Output of Fixed Voltage Models Figure 9. Regulator with Reference REG1117−5 5.2VLine V In Out IN 5.0VBattery + GND 10µF 50Ω 1kΩ REG1117−5 In Out + GND + 6.5V 10µF 100µF Figure 10. Battery Backed-Up Regulated Supply REG1117−5 V In Out IN + + 10µF GND 100µF V =−5V OUT FloatingInput Figure 11. Low Dropout Negative Supply 11

PACKAGE OPTION ADDENDUM www.ti.com 15-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) REG1117 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB1117 & no Sb/Br) REG1117-2.85 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11172 & no Sb/Br) REG1117-2.85/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11172 & no Sb/Br) REG1117-2.85G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11172 & no Sb/Br) REG1117-3.3 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11174 & no Sb/Br) REG1117-3.3/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11174 & no Sb/Br) REG1117-3.3/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11174 & no Sb/Br) REG1117-3.3G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11174 & no Sb/Br) REG1117-5 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11175 & no Sb/Br) REG1117-5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11175 & no Sb/Br) REG1117-5G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB11175 & no Sb/Br) REG1117/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB1117 & no Sb/Br) REG1117/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB1117 & no Sb/Br) REG1117A ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB1117A & no Sb/Br) REG1117A-1.8 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 R111718 & no Sb/Br) REG1117A-1.8/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 R111718 & no Sb/Br) REG1117A-1.8G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 R111718 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 15-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) REG1117A-2.5 ACTIVE SOT-223 DCY 4 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 R111725 & no Sb/Br) REG1117A-2.5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 R111725 & no Sb/Br) REG1117A/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 BB1117A & no Sb/Br) REG1117F-3.3/500 ACTIVE DDPAK/ KTT 3 500 Green (RoHS Call TI | SN Level-2-260C-1 YEAR -40 to 125 REG1117F4 TO-263 & no Sb/Br) REG1117FA-1.8KTTT ACTIVE DDPAK/ KTT 3 50 Green (RoHS Call TI | SN Level-2-260C-1 YEAR -40 to 125 REG TO-263 & no Sb/Br) 1117FA1.8 REG1117FA-2.5/500 ACTIVE DDPAK/ KTT 3 500 Green (RoHS Call TI | SN Level-2-260C-1 YEAR -40 to 125 REG TO-263 & no Sb/Br) 1117FA2.5 REG1117FA-5.0/500 ACTIVE DDPAK/ KTT 3 500 Green (RoHS Call TI | SN Level-2-260C-1 YEAR -40 to 125 REG TO-263 & no Sb/Br) 1117FA5.0 REG1117FA/500 ACTIVE DDPAK/ KTT 3 500 Green (RoHS Call TI | SN Level-2-260C-1 YEAR -40 to 125 REG1117FA TO-263 & no Sb/Br) REG1117FA1.8KTTTG3 ACTIVE DDPAK/ KTT 3 50 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 REG TO-263 & no Sb/Br) 1117FA1.8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 15-Feb-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) REG1117-2.85/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117-3.3/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117-5/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117A-1.8/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117A-2.5/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117A/2K5 SOT-223 DCY 4 2500 330.0 12.4 7.1 7.45 1.88 8.0 12.0 Q3 REG1117F-3.3/500 DDPAK/ KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2 TO-263 REG1117FA-2.5/500 DDPAK/ KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2 TO-263 REG1117FA-5.0/500 DDPAK/ KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2 TO-263 REG1117FA/500 DDPAK/ KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2 TO-263 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) REG1117-2.85/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117-3.3/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117-5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117A-1.8/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117A-2.5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117A/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0 REG1117F-3.3/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 REG1117FA-2.5/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 REG1117FA-5.0/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 REG1117FA/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 PackMaterials-Page2

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MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 7,30 (0.287) 3,70 (0.146) 6,70 (0.264) 3,30 (0.130) Gauge Plane 1 2 3 0,84 (0.033) 0°–10° 0,25 (0.010) 2,30 (0.091) 0,66 (0.026) 0,10 (0.004) M 4,60 (0.181) 0,75 (0.030) MIN 1,70 (0.067) 1,80 (0.071) MAX 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,10 (0.0040) 0,08 (0.003) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO-261 Variation AA. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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