RE46C100 Piezoelectric Horn Driver Circuit Features: Package Types • Low Quiescent Current (<100nA) RE46C100 PDIP, SOIC • Low Driver R – 20typical at 9V ON • Wide Operating Voltage Range NC 1 8 HRNEN • Available in 8-pin DFN, PDIP and SOIC packages VDD 2 7 HORNS NC 3 6 HORNB General Description: FEED 4 5 VSS The RE46C100 devices are intended for applications RE46C100 using a self oscillating piezoelectric horn, although it 2x3 DFN* can be used in direct drive applications. Feedback control and a driver circuit are provided, as well as a NC 1 8 HRNEN horn enable function. VDD 2 EP 7 HORNS 9 The RE46C100 is intended for use in smoke detectors, NC 3 6 HORNB CO detectors, personal security products and FEED 4 5 V SS electronic toys. * Includes Exposed Thermal Pad (EP); see Table2-1. Functional Block Diagram 4 FEED 7 HORNS HRNEN 8 V 2 DD V 5 SS 6 HORNB  2009-2014 Microchip Technology Inc. DS20002166B-page 1

RE46C100 Typical Application Horn Enable Active High 1 8 2 7 + RE46C100 9V C2(1) 3 6 Battery - 1 µF 4 5 R3 R4 C1 1.5 MΩ 220 kΩ 0.001 µF Note1: Place C2 close to the device power pins to minimize horn switching noise. DS20002166B-page 2  2009-2014 Microchip Technology Inc.

RE46C100 1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum CHARACTERISTICS ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those Absolute Maximum Ratings† indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for Supply Voltage..............................................................V =18V DD Input Voltage Range Except FEED, TEST.......V =-0.3V to V +0.3V extended periods may affect device reliability. IN DD FEED Input Voltage Range........................... VINFD=-10 to +22V Input Current except FEED.........................................IIN=10mA Operating Temperature......................................T =-40 to +85°C A Storage Temperature...................................T =-55 to +125°C STG Maximum Junction Temperature...............................T =+150°C J DC ELECTRICAL CHARACTERISTICS DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at T =+25°C, V =9V, A DD Typical Application. Test Parameter Symbol Min. Typ. Max. Units Conditions Pin Supply Voltage V 2 6 9 16 V Operating DD Supply Current I 2 — — 100 nA HRNEN=0V, FEED=0V DD1 Input Voltage Low V 8 — — 1 V IL1 Input Voltage High V 8 2.3 — — V IH1 Input Leakage Low I 8 — — -100 nA V =V IL1 IN SS I 4 — — -50 µA FEED=-10V LFD Input Leakage High I 8 — — 100 nA V =V IH1 IN DD I 4 — — 50 µA FEED=22V HFD Output Voltage Low V 6, 7 — 0.3 0.5 V I =16mA OL1 OL V 6, 7 — — 0.9 V I =16mA, V =7.2V OL2 OL DD Output Voltage High V 6, 7 8.5 8.7 — V I =-16mA OH1 OH V 6, 7 6.3 — — V I =-16mA, V =7.2V OH2 OH DD TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all parameters apply at T =+25°C, V =9V, A DD Typical Application. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range T -40 — +85 °C A Storage Temperature Range T -55 — +125 °C STG Thermal Package Resistances Thermal Resistance, 8L 2x3 DFN θ — 75 — °C/W JA Thermal Resistance, 8L-PDIP θ — 89.3 — °C/W JA Thermal Resistance, 8L-SOIC θ — 149.5 — °C/W JA  2009-2014 Microchip Technology Inc. DS20002166B-page 3

RE46C100 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE RE46C100 RE46C100 Symbol Description PDIP, SOIC DFN 1 1 NC No connection 2 2 V Connect to the positive supply voltage DD 3 3 NC No connection 4 4 FEED Usually connected to the feedback electrode through a current-limiting resistor. If not used, this pin must be connected to V or V . DD SS 5 5 V Connect to the negative supply voltage SS 6 6 HORNB This pin is connected to the metal electrode of a piezoelectric transducer. 7 7 HORNS This pin is a complementary output to HORNB, connected to the ceramic electrode of the piezoelectric transducer. 8 8 HRNEN This pin enables the horn with a logic high. — 9 EP Exposed thermal pad. This pad should be connected to V . SS DS20002166B-page 4  2009-2014 Microchip Technology Inc.

RE46C100 3.0 DEVICE DESCRIPTION The RE46C100 horn driver provides the circuitry necessary to drive a three-terminal self-oscillating piezoelectric horn. It can also drive a two-terminal piezoelectric horn with the FEED pin used as a signal input. The horn driver provides a push-pull circuit to drive the horn, as shown in the Typical Application circuit. In a self-oscillating application, the FEED pin is connected to the feedback pin of the piezoelectric horn through a resistor. To drive a two-terminal piezoelectric horn with an external signal, the FEED pin should be used as the external signal input. The horn is enabled when HRNEN is driven to a logic high and is silenced when HRNEN is driven to a logic low. The horn output can be modulated using the HRNEN input.  2009-2014 Microchip Technology Inc. DS20002166B-page 5

RE46C100 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead DFN (2x3x0.9 mm) Example ADG 420 25 8-Lead PDIP (300 mil) Example XXXXXXXX RE46C100 XXXXXNNN I/P^e^3^256 1420 YYWW 8-Lead SOIC (3.90 mm) Example 46C100I SN^e^3^1420 NNN 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS20002166B-page 6  2009-2014 Microchip Technology Inc.

RE46C100 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:8)(cid:17)(cid:10)(cid:6)(cid:12)(cid:18)(cid:8)(cid:19)(cid:20)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)(cid:21)(cid:6)(cid:22)(cid:5)(cid:8)(cid:23)(cid:24)(cid:25)(cid:26)(cid:8)(cid:27)(cid:8)(cid:28)(cid:29)(cid:30)(cid:29)(cid:31) !(cid:8)""(cid:8)#(cid:20)(cid:7)$(cid:8)%(cid:15)(cid:17)(cid:19)& (cid:19)(cid:20)(cid:12)(cid:5)’ 3(cid:22)(cid:21)(cid:15)&(cid:23)(cid:14)(cid:15)’(cid:22)!&(cid:15)(cid:20)"(cid:21)(cid:21)(cid:14)(cid:25)&(cid:15)(cid:11)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:14)(cid:15)#(cid:21)(cid:12)*(cid:19)(cid:25)(cid:13)!((cid:15)(cid:11)(cid:26)(cid:14)(cid:12)!(cid:14)(cid:15)!(cid:14)(cid:14)(cid:15)&(cid:23)(cid:14)(cid:15)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:11)(cid:15)(cid:31)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:19)(cid:25)(cid:13)(cid:15)(cid:4)(cid:11)(cid:14)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:12)&(cid:19)(cid:22)(cid:25)(cid:15)(cid:26)(cid:22)(cid:20)(cid:12)&(cid:14)#(cid:15)(cid:12)&(cid:15) (cid:23)&&(cid:11)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:11)(cid:29)(cid:20)(cid:22)’4(cid:11)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:19)(cid:25)(cid:13) D e b N N L K E E2 EXPOSEDPAD NOTE1 NOTE1 1 2 2 1 D2 TOPVIEW BOTTOMVIEW A NOTE2 A3 A1 5(cid:25)(cid:19)&! 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(cid:8), (cid:5)(cid:29)(cid:16)(cid:5)(cid:15)(cid:9)-3 8 (cid:14)(cid:21)(cid:12)(cid:26)(cid:26)(cid:15)6(cid:14)(cid:25)(cid:13)&(cid:23) (cid:3) (cid:16)(cid:29)(cid:5)(cid:5)(cid:15)0(cid:4)1 8 (cid:14)(cid:21)(cid:12)(cid:26)(cid:26)(cid:15)<(cid:19)#&(cid:23) - ,(cid:29)(cid:5)(cid:5)(cid:15)0(cid:4)1 -$(cid:11)(cid:22)!(cid:14)#(cid:15)(cid:31)(cid:12)#(cid:15)6(cid:14)(cid:25)(cid:13)&(cid:23) (cid:3)(cid:16) (cid:30)(cid:29),(cid:5) = (cid:30)(cid:29)// -$(cid:11)(cid:22)!(cid:14)#(cid:15)(cid:31)(cid:12)#(cid:15)<(cid:19)#&(cid:23) -(cid:16) (cid:30)(cid:29)/(cid:5) = (cid:30)(cid:29)(cid:17)/ 1(cid:22)(cid:25)&(cid:12)(cid:20)&(cid:15)<(cid:19)#&(cid:23) ) (cid:5)(cid:29)(cid:16)(cid:5) (cid:5)(cid:29)(cid:16)/ (cid:5)(cid:29),(cid:5) 1(cid:22)(cid:25)&(cid:12)(cid:20)&(cid:15)6(cid:14)(cid:25)(cid:13)&(cid:23) 6 (cid:5)(cid:29),(cid:5) (cid:5)(cid:29)(cid:6)(cid:5) (cid:5)(cid:29)/(cid:5) 1(cid:22)(cid:25)&(cid:12)(cid:20)&(cid:10)&(cid:22)(cid:10)-$(cid:11)(cid:22)!(cid:14)#(cid:15)(cid:31)(cid:12)# > (cid:5)(cid:29)(cid:16)(cid:5) = = (cid:19)(cid:20)(cid:12)(cid:5)(cid:11)’ (cid:30)(cid:29) (cid:31)(cid:19)(cid:25)(cid:15)(cid:30)(cid:15) (cid:19)!"(cid:12)(cid:26)(cid:15)(cid:19)(cid:25)#(cid:14)$(cid:15)%(cid:14)(cid:12)&"(cid:21)(cid:14)(cid:15)’(cid:12)(cid:27)(cid:15) (cid:12)(cid:21)(cid:27)((cid:15))"&(cid:15)’"!&(cid:15))(cid:14)(cid:15)(cid:26)(cid:22)(cid:20)(cid:12)&(cid:14)#(cid:15)*(cid:19)&(cid:23)(cid:19)(cid:25)(cid:15)&(cid:23)(cid:14)(cid:15)(cid:23)(cid:12)&(cid:20)(cid:23)(cid:14)#(cid:15)(cid:12)(cid:21)(cid:14)(cid:12)(cid:29) (cid:16)(cid:29) (cid:31)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:14)(cid:15)’(cid:12)(cid:27)(cid:15)(cid:23)(cid:12) (cid:14)(cid:15)(cid:22)(cid:25)(cid:14)(cid:15)(cid:22)(cid:21)(cid:15)’(cid:22)(cid:21)(cid:14)(cid:15)(cid:14)$(cid:11)(cid:22)!(cid:14)#(cid:15)&(cid:19)(cid:14)(cid:15))(cid:12)(cid:21)!(cid:15)(cid:12)&(cid:15)(cid:14)(cid:25)#!(cid:29) ,(cid:29) (cid:31)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:14)(cid:15)(cid:19)!(cid:15)!(cid:12)*(cid:15)!(cid:19)(cid:25)(cid:13)"(cid:26)(cid:12)&(cid:14)#(cid:29) (cid:6)(cid:29) (cid:3)(cid:19)’(cid:14)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:13)(cid:15)(cid:12)(cid:25)#(cid:15)&(cid:22)(cid:26)(cid:14)(cid:21)(cid:12)(cid:25)(cid:20)(cid:19)(cid:25)(cid:13)(cid:15)(cid:11)(cid:14)(cid:21)(cid:15)(cid:8)(cid:4)(cid:18)-(cid:15).(cid:30)(cid:6)(cid:29)/(cid:18)(cid:29) 0(cid:4)12 0(cid:12)!(cid:19)(cid:20)(cid:15)(cid:3)(cid:19)’(cid:14)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:29)(cid:15)(cid:24)(cid:23)(cid:14)(cid:22)(cid:21)(cid:14)&(cid:19)(cid:20)(cid:12)(cid:26)(cid:26)(cid:27)(cid:15)(cid:14)$(cid:12)(cid:20)&(cid:15) (cid:12)(cid:26)"(cid:14)(cid:15)!(cid:23)(cid:22)*(cid:25)(cid:15)*(cid:19)&(cid:23)(cid:22)"&(cid:15)&(cid:22)(cid:26)(cid:14)(cid:21)(cid:12)(cid:25)(cid:20)(cid:14)!(cid:29) (cid:9)-32 (cid:9)(cid:14)%(cid:14)(cid:21)(cid:14)(cid:25)(cid:20)(cid:14)(cid:15)(cid:3)(cid:19)’(cid:14)(cid:25)!(cid:19)(cid:22)(cid:25)((cid:15)"!"(cid:12)(cid:26)(cid:26)(cid:27)(cid:15)*(cid:19)&(cid:23)(cid:22)"&(cid:15)&(cid:22)(cid:26)(cid:14)(cid:21)(cid:12)(cid:25)(cid:20)(cid:14)((cid:15)%(cid:22)(cid:21)(cid:15)(cid:19)(cid:25)%(cid:22)(cid:21)’(cid:12)&(cid:19)(cid:22)(cid:25)(cid:15)(cid:11)"(cid:21)(cid:11)(cid:22)!(cid:14)!(cid:15)(cid:22)(cid:25)(cid:26)(cid:27)(cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:11)(cid:24)(cid:14)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:13)(cid:27)(cid:3)(cid:21)(cid:12)*(cid:19)(cid:25)(cid:13)1(cid:5)(cid:6)(cid:10)(cid:30)(cid:16),1  2009-2014 Microchip Technology Inc. DS20002166B-page 7

RE46C100 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002166B-page 8  2009-2014 Microchip Technology Inc.

RE46C100 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2009-2014 Microchip Technology Inc. DS20002166B-page 9

RE46C100 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20002166B-page 10  2009-2014 Microchip Technology Inc.

RE46C100 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009-2014 Microchip Technology Inc. DS20002166B-page 11

RE46C100 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002166B-page 12  2009-2014 Microchip Technology Inc.

RE46C100 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)("(cid:6)(cid:10)(cid:10)(cid:8))(cid:16)(cid:12)(cid:10)(cid:13)*(cid:5)(cid:8)(cid:23)((cid:19)(cid:26)(cid:8)(cid:27)(cid:8)(cid:19)(cid:6)++(cid:20),(cid:18)(cid:8)(cid:30) !(cid:31)(cid:8)""(cid:8)#(cid:20)(cid:7)$(cid:8)%()-(cid:25)& (cid:19)(cid:20)(cid:12)(cid:5)’ 3(cid:22)(cid:21)(cid:15)&(cid:23)(cid:14)(cid:15)’(cid:22)!&(cid:15)(cid:20)"(cid:21)(cid:21)(cid:14)(cid:25)&(cid:15)(cid:11)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:14)(cid:15)#(cid:21)(cid:12)*(cid:19)(cid:25)(cid:13)!((cid:15)(cid:11)(cid:26)(cid:14)(cid:12)!(cid:14)(cid:15)!(cid:14)(cid:14)(cid:15)&(cid:23)(cid:14)(cid:15)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:11)(cid:15)(cid:31)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:19)(cid:25)(cid:13)(cid:15)(cid:4)(cid:11)(cid:14)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:12)&(cid:19)(cid:22)(cid:25)(cid:15)(cid:26)(cid:22)(cid:20)(cid:12)&(cid:14)#(cid:15)(cid:12)&(cid:15) (cid:23)&&(cid:11)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:11)(cid:29)(cid:20)(cid:22)’4(cid:11)(cid:12)(cid:20)+(cid:12)(cid:13)(cid:19)(cid:25)(cid:13)  2009-2014 Microchip Technology Inc. DS20002166B-page 13

RE46C100 NOTES: DS20002166B-page 14  2009-2014 Microchip Technology Inc.

RE46C100 APPENDIX A: REVISION HISTORY Revision B (June 2014) The following is the list of modifications: 1. Added new package to the family (2x3 DFN) and related information throughout the document. 2. Added thermal package resistance information in Temperature Specifications. 3. Added package markings and drawings for all packages. 4. Added Product Identification System. Revision A (May 2009) • Original Release of this Document.  2009-2014 Microchip Technology Inc. DS20002166B-page 15

RE46C100 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX T X Examples: Device Package Number Tape Lead a) RE46C100D8F: 8LD DFN Package, of Pins and Reel Free Lead Free b) RE46C100D8TF: 8LD DFN Package, Device: RE46C100: CMOS Photoelectric Smoke Detector ASIC Tape and Reel, RE46C100T: CMOS Photoelectric Smoke Detector ASIC Lead Free (Tape and Reel) c) RE46C100E8F: 8LD PDIP Package, Lead Free Package: D = 8-Lead DFN E = Plastic Dual In-Line (300 mil Body), 8-lead (PDIP) d) RE46C100S8F: 8LD SOIC Package, S = Plastic Small Outline - Narrow, 3.90 mm Body, Lead Free 8-Lead (SOIC) e) RE46C100S8TF: 8LD SOIC Package, Tape and Reel, Lead Free  2009-2014 Microchip Technology Inc. DS20002166B-page 16

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2009-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-63276-287-0 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2009-2014 Microchip Technology Inc. DS20002166B-page 17

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