RCL e3 www.vishay.com Vishay Draloric Long Side Termination Thick Film Chip Resistors FEATURES • Enhanced power rating • Long side terminations • Enhanced thermal cycling performance • Pure tin solder contacts on Ni barrier layer, provides compatibility with lead (Pb)­free and lead containing soldering processes • AEC-Q200 qualified • Material categorization: for definitions of compliance RCL e3 resistors series are the perfect choice for most fields please see www.vishay.com/doc?99912 of power measurement electronics where reliability, APPLICATIONS stability, power dissipation, and robust design is of major concern. • Automotive Typical applications include power electronics in automotive • Industrial and industrial appliances. • Commercial TECHNICAL SPECIFICATIONS DESCRIPTION RCL0406 e3 RCL0612 e3 RCL1020 e3 RCL1218 e3 RCL1225 e3 Imperial size 0406 0612 1020 1218 1225 Metric size code RR1016M RR1632M RR2550M RR3246M RR3263M Resistance range 1 Ω to 1 MΩ; jumper (0 Ω) 1 juΩm top e2r. 2(0 M ΩΩ); 1ju Ωm ptoe r1 ( 0M ΩΩ); Resistance tolerance ± 5 %; ± 1 % Temperature coefficient ± 200 ppm/K; ± 100 ppm/K Rated dissipation, P (1) 0.25 W 0.75 W 1.0 W 1.0 W 2.0 W (2) 70 Operating voltage, U AC /DC 50 V 75 V 200 V 200 V 200 V max. RMS Permissible film temperature, ϑ (1) 155 °C F max. Operating temperature range -55 °C to +155 °C Max. resistance change at P 70 for resistance range, |ΔR/R| after: 1000 h ≤ 1.0 % 8000 h ≤ 2.0 % Permissible voltage against ambient (insulation): 1 min, U 100 V 100 V 300 V 300 V 300 V ins Notes (1) Please refer to APPLICATION INFORMATION below (2) Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 12-Jul-17 1 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 200 ppm/K ± 5 % 1 Ω to 1 MΩ E24 RCL0406 e3 ± 100 ppm/K ± 1 % 1 Ω to 1 MΩ E24; E96 Jumper, I = 4 A ≤ 10 mΩ 0 Ω - max. ± 200 ppm/K ± 5 % 1 Ω to 1 MΩ E24 RCL0612 e3 ± 100 ppm/K ± 1 % 1 Ω to 1 MΩ E24; E96 Jumper, I = 6 A ≤ 10 mΩ 0 Ω - max. ± 200 ppm/K ± 5 % 1 Ω to 1 MΩ E24 RCL1020 e3 ± 100 ppm/K ± 1 % 1 Ω to 1 MΩ E24; E96 Jumper, I = 10 A ≤ 10 mΩ 0 Ω - max. ± 200 ppm/K ± 5 % 1 Ω to 2.2 MΩ E24 RCL1218 e3 ± 100 ppm/K ± 1 % 1 Ω to 2.2 MΩ E24; E96 Jumper, I = 7 A ≤ 20 mΩ 0 Ω - max. ± 200 ppm/K ± 5 % 1 Ω to 1 MΩ E24 RCL1225 e3 ± 100 ppm/K ± 1 % 1 Ω to 1 MΩ E24; E96 Jumper, I = 12 A ≤ 10 mΩ 0 Ω - max. Note • The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumpers PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH DIMENSIONS EA = ET1 5000 Ø 180 mm/7" RCL0406 e3 EB = ET5 10 000 4 mm Ø 285 mm/11.25" EC = ET6 20 000 Paper tape acc. to Ø 330 mm/13" 8 mm EA = ET1 5000 IEC 60286-3, Type 1a Ø 180 mm/7" RCL0612 e3 EB = ET5 10 000 4 mm Ø 285 mm/11.25" EC = ET6 20 000 Ø 330 mm/13" RCL1020 e3 EF = E02 4000 4 mm RCL1218 e3 EK = ET9 4000 Blister tape acc. to 12 mm Ø 180 mm/7" EG = E67 2000 IEC 60286-3, Type 2a 8 mm RCL1225 e3 EH = E82 4000 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCL061210K0FKEA Part Number: RCL06120000Z0EA R C L 0 6 1 2 1 0 K 0 F K E A MODEL RESISTANCE TOLERANCE TCR PACKAGING RCL0406 R = decimal F = ± 1 % K = ± 100 ppm/K EA RCL0612 K = thousand J = ± 5 % N = ± 200 ppm/K EB RCL1020 M = million Z = jumper 0 = jumper EC RCL1218 0000 = jumper EF RCL1225 EG EH EK Product Description: RCL0612 100 10K 1 % ET1 e3 Product Description: RCL0612 0R0 ET1 e3 RCL0612 100 10K 1 % ET1 e3 MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCL0406 ± 100 ppm/K 10R = 10 Ω ± 1 % ET1 e3 = pure tin RCL0612 ± 200 ppm/K 1K = 1 kΩ ± 5 % ET5 termination RCL1020 10K = 10 kΩ ET6 finish RCL1218 1M0 = 1 MΩ ET9 RCL1225 0R0 = jumper E02 E67 E82 Revision: 12-Jul-17 2 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric DESCRIPTION The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, Production is strictly controlled and follows an extensive set see www.vishay.com/how/leadfree. of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (Al O ) Hence the products fully comply with the following 2 3 ceramic substrate with its prepared inner contacts on both directives: sides. A special laser is used to achieve the target value by • 2000/53/EC End-of-Life Vehicle Directive (ELV) and smoothly fine trimming the resistive layer without damaging Annex II (ELV II) the ceramics. The resistor elements are covered by a • 2011/65/EU Restriction of the Use of Hazardous protective coating designed for electrical, mechanical and Substances Directive (RoHS) with amendment climatic protection. The terminations receive a final pure tin 2015/863/EU on nickel plating. • 2012/19/EU Waste Electrical and Electronic Equipment The result of the determined production is verified by an Directive (WEEE) extensive testing procedure on 100 % of the individual chip Vishay pursues the elimination of conflict minerals from its resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a and supply chain, see the Conflict Minerals Policy at Type 2a (1). www.vishay.com/doc?49037. ASSEMBLY APPROVALS The resistors are suitable for processing on automatic SMD The resistors are qualified according to AEC-Q200. assembly systems. They are suitable for automatic Where applicable, the resistors are tested in accordance soldering using wave, reflow or vapor phase as shown in with EN 140401-802 which refers to EN 60115-1, IEC 61760-1 (1). The encapsulation is resistant to all EN 60115-8 and the variety of environmental test cleaning solvents commonly used in the electronics procedures of the IEC 60068 (1) series. industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds RELATED PRODUCTS and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the The RCA-LS e3, Sulfur Resistant, Long Side Termination whole system. Thick Film Chip Resistors series is designed for harsh environment applications. For ordering RCA-LS e3 products The resistors are RoHS-compliant, the pure tin plating please refer to latest edition of datasheet, provides compatibility with lead (Pb)-free and www.vishay.com/doc?20060. lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 12-Jul-17 3 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric FUNCTIONAL PERFORMANCE Single Pulse (1) Axis Title 1000 10000 neW) 1225 2 nd lise Load ( 100 1100264011028260 in work ul 1000 P 10 ^P-max. 1 1st line2nd line 100 0.1 0.01 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t-Pulse Duration (s) i 2nd line Maximum pulse load, single pulse; applicable if P→0 and n < 1000 and Uˆ ≤ Uˆ ; max. for permissible resistance change equivalent to 8000 h operation Continuous Pulse (1) Axis Title neW) 1000 1225 10000 2 nd liLoad ( 100 110260112820 in work se 0406 ul 1000 ntinuous P 101 1st line2nd line o C 100 - max. 0.1 ^P 0.01 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t-Pulse Duration (s) i 2nd line Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑ ) and Uˆ ≤ Uˆ ; amb max. for permissible resistance change equivalent to 8000 h operation Note (1) Pulse upgrade under review to match upgraded rated dissipation Pulse Voltage Axis Title 800 10000 eV) d linge ( 700 1020,1218, 1225 na 2 Volt 600 ulse 500 1000 ^U-Pmax. 400 1st line2nd line 300 0612 100 200 0406 100 0 10 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 t-Pulse Duration (s) i 2nd line Maximum pulse voltage, single and continuous pulses; applicable if Pˆ ≤ Pˆ ; max. for permissible resistance change equivalent to 8000 h operation Revision: 12-Jul-17 4 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric Derating Axis Title 70 W) 2.5 10000 n ( RCL1225 o ati 2 ep d linDissi 1000 2n-Power 1.15 RCL1020, RCL1218 1st line2nd line P RCL0612 100 0.5 RCL0406 0 10 -50 0 50 100 150 ϑ -Ambient Temperature (°C) amb 2nd line Revision: 12-Jul-17 5 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the The testing also covers most of the requirements specified following specifications: by EIA/IS-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric EN 60115-8 (successor of EN 140400), conditions in accordance with IEC 60068-1, 4.3, whereupon sectional specification the following values are applied: EN 140401-802, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures and Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS IEC EN 60115-1 60068-2 (1) REQUIREMENTS CLAUSE TEST TEST PROCEDURE PERMISSIBLE CHANGE (ΔR) METHOD STABILITY CLASS 1 STABILITY CLASS 2 Stability for product types: OR BETTER OR BETTER RCL e3 1 Ω to 2.2 MΩ 4.5 - Resistance - ± 1 % ± 5 % Temperature (20 / -55 / 20) °C and 4.8 - ± 100 ppm/K ± 200 ppm/K coefficient (20 / 155 / 20) °C U = P x R or U = U 70 max.; whichever is the less severe; 1.5 h on; 0.5 h off 4.25.1 - Endurance at 70 °C 70 °C; 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 70 °C; 8000 h ± (2 % R + 0.1 Ω) ± (4 % R + 0.1 Ω) Endurance at 4.25.3 - upper category 155 °C, 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) temperature 4.24 78 (Cab) Damp heat, (40 ± 2) °C; 56 days; ± (1 % R + 0.05 Ω) steady state (93 ± 3) % RH; Damp heat, (85 ± 2) °C; (85 ± 5) % RH; 4.37 67 (Cy) steady state, U = 0.1 x P x R ≤ 100 V; ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 70 accelerated 1000 h 4.23 - Climatic sequence: - 4.23.2 2 (Bb) dry heat 125 °C; 16 h 55 °C; 24 h; ≥ 90 % RH; 4.23.3 30 (Db) damp heat, cyclic 1 cycle 4.23.4 1 (Ab) cold -55 °C; 2 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 24 h; 4.23.6 30 (Db) damp heat, cyclic ≥ 90 % RH; 5 cycles 4.23.7 - DC load U = P x R ≤ U 1 min 70 max.; - 1 (Aa) Cold -55 °C; 2 h ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 30 min at -55 °C and 4.19 14 (Na) Rapid change of 30 min at 125 °C; ± (1 % R + 0.05 Ω) temperature 1000 cycles Revision: 12-Jul-17 6 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS IEC EN 60115-1 60068-2 (1) REQUIREMENTS CLAUSE TEST TEST PROCEDURE PERMISSIBLE CHANGE (ΔR) METHOD STABILITY CLASS 1 STABILITY CLASS 2 Stability for product types: OR BETTER OR BETTER RCL e3 1 Ω to 2.2 MΩ U = 2.5 x P70 x R ≤ 2 x Umax.; 4.13 - Short time overload whichever is the less severe; ± (2 % R + 0.05 Ω) 5 s Severity no. 4: 4.27 - Single pulse high U = 1U0 =x 2 xP U70 x R or ± (1 % R + 0.05 Ω) voltage overload max.; no visible damage whichever is the less severe; 10 pulses 10 μs/700 μs U = 15 x P x R or 70 Periodic electric U = 2 x Umax.; ± (1 % R + 0.05 Ω) 4.39 - whichever is the less severe; overload no visible damage 0.1 s on; 2.5 s off; 1000 cycles Electrostatic IEC 61340-3-1 (1); 4.38 - discharge 3 pos. + 3 neg. discharges; ± (1 % R + 0.05 Ω) (human body model) ESD voltage acc. to the size Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 4.22 6 (Fc) Vibration amplitude ≤ 1.5 mm or no visible damage no visible damage ≤ 200 m/s2; 7.5 h Solder bath method; Sn60Pb40 non-activated flux; (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered) 4.17 58 (Td) Solderability Solder bath method; no visible damage Sn96.5Ag3Cu0.5 non-activated flux; (245 ± 5) °C; (3 ± 0.3) s Solder bath method 4.18 58 (Td) Resistance to (260 ± 5) °C; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) soldering heat (10 ± 1) s Component solvent Isopropyl alcohol; 4.29 45 (XA) No visible damage resistance +50 °C; method 2 Shear 4.32 21 (Uu ) 17.7 N No visible damage 3 (adhesion) Depth 2 mm; ± (0.25 % R + 0.05 Ω) 4.33 21 (Uu ) Substrate bending 1 3 times no visible damage, no open circuit in bent position 4.7 - Voltage proof U = 1.4 x U ; 60 s No flashover or breakdown ins Flammability, IEC 60695-11-5 (1); 4.35 - No burning after 30 s needle flame test 10 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 12-Jul-17 7 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RCL e3 www.vishay.com Vishay Draloric DIMENSIONS T2 L H W T1 DIMENSIONS AND MASS L W H T1 T2 MASS TYPE / SIZE (mm) (mm) (mm) (mm) (mm) (mg) RCL0406 e3 1.0 ± 0.10 1.6 ± 0.10 0.35 ± 0.10 0.2 +0.10 / -0.15 0.2 ± 0.10 2 RCL0612 e3 1.6 ± 0.20 3.2 ± 0.20 0.55 ± 0.10 0.35 ± 0.15 0.25 ± 0.15 11 RCL1020 e3 2.5 ± 0.20 5.0 ± 0.20 0.55 ± 0.10 0.38 ± 0.15 0.25 ± 0.15 25.5 RCL1218 e3 3.2 +0.10 / -0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 29.5 RCL1225 e3 3.2 ± 0.20 6.3 ± 0.20 0.70 ± 0.10 0.8 ± 0.20 0.4 ± 0.20 55 SOLDER PAD DIMENSIONS G X Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G Y X Z G Y X Z (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) RCL0406 e3 0.30 0.80 1.95 1.90 0.35 0.60 1.75 1.55 RCL0612 e3 0.50 1.20 3.70 2.90 0.60 1.00 3.50 2.60 RCL1020 e3 1.30 1.25 5.50 3.80 1.30 1.10 5.25 3.50 RCL1218 e3 1.80 1.30 5.10 4.40 1.90 1.10 4.90 4.10 RCL1225 e3 1.10 1.80 6.80 4.70 1.20 1.60 6.60 4.40 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or in publication IPC-7351. Still, the given solder pad dimensions will be found adequate for most general applications (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 12-Jul-17 8 Document Number: 20046 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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