Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PZUxBL series Single Zener diodes Rev. 01 — 6 May 2008 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted Device(SMD) plastic package. 1.2 Features n Non-repetitive peak reverse power n Low reverse current I range R dissipation: P £ 40W ZSM n Total power dissipation: P £ 250mW n Small plastic package suitable for tot surface-mounted design n Toleranceseries: n AEC-Q101 qualified B:approximately– 5%; B2:approximately– 2% n Wide working voltage range: nominal2.4Vto36V (E24range) 1.3 Applications n General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =100mA [1] - - 1.1 V F F P non-repetitivepeakreverse [2] - - 40 W ZSM power dissipation P total power dissipation T £ 25(cid:176) C [3][4] - - 250 mW tot amb [1] Pulse test: t £ 300m s;d£ 0.02. p [2] t =100m s; square wave; T =25(cid:176) C prior to surge p j [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

PZUxBL series NXP Semiconductors Single Zener diodes 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode 1 2 1 2 006aaa152 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PZU2.4BL to - leadless ultra small plastic package; 2terminals; SOD882 PZU36BL[1] body 1.0· 0.6· 0.5mm PZU2.7B2L to PZU24B2L[2] [1] The series consists of 29types with nominal working voltages from 2.4V to36V. [2] The series consists of 25types with nominal working voltages from 2.7V to24V. 4. Marking Table 4. Marking codes Type number Marking code Type number Marking code PZU2.4BL H2 PZU2.7B2L HZ PZU2.7BL H3 PZU3.0B2L K1 PZU3.0BL H4 PZU3.3B2L K2 PZU3.3BL H5 PZU3.6B2L K3 PZU3.6BL H6 PZU3.9B2L K4 PZU3.9BL H7 PZU4.3B2L K5 PZU4.3BL H8 PZU4.7B2L K6 PZU4.7BL H9 PZU5.1B2L K7 PZU5.1BL HA PZU5.6B2L K8 PZU5.6BL HB PZU6.2B2L H1 PZU6.2BL HC PZU6.8B2L K9 PZU6.8BL HD PZU7.5B2L KA PZU7.5BL HE PZU8.2B2L KB PZU8.2BL HF PZU9.1B2L KC PZU9.1BL HG PZU10B2L KD PZU10BL HH PZU11B2L KE PZU11BL HK PZU12B2L KF PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 2 of 13

PZUxBL series NXP Semiconductors Single Zener diodes Table 4. Marking codes …continued Type number Marking code Type number Marking code PZU12BL HL PZU13B2L KG PZU13BL HM PZU14B2L KH PZU15BL HN PZU15B2L KK PZU16BL HP PZU16B2L KL PZU18BL HR PZU18B2L KM PZU20BL HS PZU20B2L KN PZU22BL HT PZU22B2L KP PZU24BL HU PZU24B2L KR PZU27BL HV - - PZU30BL HW - - PZU33BL HX - - PZU36BL HY - - 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit I forward current - 200 mA F I non-repetitive peak reverse [1] - see ZSM current Table8 and9 P non-repetitive peak reverse [1] - 40 W ZSM power dissipation P total power dissipation T £ 25(cid:176) C [2][3] - 250 mW tot amb [2][4] - 500 mW T junction temperature - 150 (cid:176) C j T ambient temperature - 55 +150 (cid:176) C amb T storage temperature - 65 +150 (cid:176) C stg [1] t =100m s; square wave; T =25(cid:176) C prior to surge p j [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 3 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from in free air [1][2] - - 500 K/W th(j-a) junction to ambient [1][3] - - 250 K/W R thermal resistance from [4] - - 55 K/W th(j-sp) junction to solder point [1] Reflow soldering is the only recommended soldering method. [2] Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. [4] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics T=25(cid:176) C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit V forward voltage [1] F I =10mA - - 0.9 V F I =100mA - - 1.1 V F [1] Pulse test: t £ 300m s;d£ 0.02. p Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L T=25(cid:176) C unless otherwise specified. j PZUxxx Sel Working Differential resistance Reverse Temperature Diode Non-repetitive voltage r (W ) current coefficient capacitance peak reverse dif V (V) I (m A) S (mV/K) C (pF)[1] current Z R Z d I (A)[2] ZSM I =5mA I =0.5mA I =5mA I =5mA Z Z Z Z Min Max Max Max Max V (V) Typ Max Max R 2.4 B 2.3 2.6 1000 100 50 1 - 1.6 450 8 2.7 B 2.5 2.9 1000 100 20 1 - 2.0 440 8 B2 2.65 2.9 3.0 B 2.80 3.20 1000 95 10 1 - 2.1 425 8 B2 2.95 3.20 3.3 B 3.10 3.50 1000 95 5 1 - 2.4 410 8 B2 3.25 3.50 3.6 B 3.40 3.80 1000 90 5 1 - 2.4 390 8 B2 3.55 3.80 3.9 B 3.70 4.10 1000 90 3 1 - 2.5 370 8 B2 3.87 4.10 4.3 B 4.01 4.48 1000 90 3 1 - 2.5 350 8 B2 4.15 4.34 PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 4 of 13

PZUxBL series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L …continued T=25(cid:176) C unless otherwise specified. j PZUxxx Sel Working Differential resistance Reverse Temperature Diode Non-repetitive voltage r (W ) current coefficient capacitance peak reverse dif V (V) I (m A) S (mV/K) C (pF)[1] current Z R Z d I (A)[2] ZSM I =5mA I =0.5mA I =5mA I =5mA Z Z Z Z Min Max Max Max Max V (V) Typ Max Max R 4.7 B 4.42 4.90 800 80 2 1 - 1.4 325 8 B2 4.55 4.75 5.1 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5 B2 4.98 5.20 5.6 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5 B2 5.49 5.73 [1] f=1MHz; V =0V R [2] t =100m s; square wave; T =25(cid:176) C prior to surge p j Table 9. Characteristics per type; PZU6.2BL to PZU36BL T=25(cid:176) C unless otherwise specified. j PZUxxx Sel Working Differential resistance Reverse Temperature Diode Non-repetitive voltage r (W ) current coefficient capacitance peak reverse dif V (V) I (nA) S (mV/K) C (pF)[1] current Z R Z d I (A)[2] ZSM I =5mA I =0.5mA I =5mA I =5mA Z Z Z Z Min Max Max Max Max V (V) Typ Max Max R 6.2 B 5.86 6.53 80 30 500 3 2.7 250 5.5 B2 6.06 6.33 6.8 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5 B2 6.65 6.93 7.5 B 7.06 7.84 60 10 500 4 4.0 170 3.5 B2 7.28 7.60 8.2 B 7.76 8.64 60 10 500 5 4.6 150 3.5 B2 8.02 8.36 9.1 B 8.56 9.55 60 10 500 6 5.5 120 3.5 B2 8.85 9.23 10 B 9.45 10.55 60 10 100 7 6.4 110 3.5 B2 9.77 10.21 11 B 10.44 11.56 60 10 100 8 7.4 108 3 B2 10.76 11.22 12 B 11.42 12.60 80 10 100 9 8.4 105 3 B2 11.74 12.24 13 B 12.47 13.96 80 10 100 10 9.4 103 2.5 B2 12.91 13.49 14 B2 13.70 14.30 80 10 100 11 10.4 101 2 PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 5 of 13

PZUxBL series NXP Semiconductors Single Zener diodes Table 9. Characteristics per type; PZU6.2BL to PZU36BL …continued T=25(cid:176) C unless otherwise specified. j PZUxxx Sel Working Differential resistance Reverse Temperature Diode Non-repetitive voltage r (W ) current coefficient capacitance peak reverse dif V (V) I (nA) S (mV/K) C (pF)[1] current Z R Z d I (A)[2] ZSM I =5mA I =0.5mA I =5mA I =5mA Z Z Z Z Min Max Max Max Max V (V) Typ Max Max R 15 B 13.84 15.52 80 15 50 11 11.4 99 2 B2 14.34 14.98 16 B 15.37 17.09 80 20 50 12 12.4 97 1.5 B2 15.85 16.51 18 B 16.94 19.03 80 20 50 13 14.4 93 1.5 B2 17.56 18.35 20 B 18.86 21.08 100 20 50 15 16.4 88 1.5 B2 19.52 20.39 22 B 20.88 23.17 100 25 50 17 18.4 84 1.3 B2 21.54 22.47 24 B 22.93 25.57 120 30 50 19 20.4 80 1.3 B2 23.72 24.78 27 B 25.1 28.9 150 40 50 21 23.4 73 1 30 B 28 32 200 40 50 23 26.6 66 1 33 B 31 35 250 40 50 25 29.7 60 0.9 36 B 34 38 300 60 50 27 33.0 59 0.8 [1] f=1MHz; V =0V R [2] t =100m s; square wave; T =25(cid:176) C prior to surge p j PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 6 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 103 006aab129 300 mbg781 PZSM IF (W) (mA) 102 200 10 100 1 0 10- 1 1 10 0.6 0.8 1 tp (ms) VF (V) T =25(cid:176) C (prior to surge) T =25(cid:176) C j j Fig 1. Non-repetitive peak reverse power dissipation Fig 2. Forward current as a function of forward as a function of pulse duration; maximum voltage; typical values values mgl273 mgl274 0 10 12 SZ SZ 11 (mV/K) 4.3 (mV/K) 10 9.1 - 1 5 3.9 8.2 7.5 3.6 6.8 6.2 5.6 5.1 - 2 0 3.3 4.7 3.0 2.4 2.7 - 3 - 5 0 20 40 60 0 4 8 12 16 20 IZ (mA) IZ (mA) T =25(cid:176) Cto150(cid:176) C T =25(cid:176) Cto150(cid:176) C j j PZU2.4BL to PZU4.3B2L PZU4.7BL to PZU12B2L Fig 3. Temperature coefficient as a function of Fig 4. Temperature coefficient as a function of working current; typical values working current; typical values PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 7 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 102 006aab246 102 006aab247 IZ IZ VZ(nom) (V) = 4.7 (mA) VZ(nom) (V) = 2.4 (mA) 10 3.0 3.6 4.3 10 2.7 3.3 3.9 5.6 6.8 9.1 11 6.2 8.2 1 1 5.1 7.5 10 12 10- 1 10- 1 10- 2 10- 2 10- 3 10- 3 0 1 2 3 4 5 0 2 4 6 8 10 12 14 VZ (V) VZ (V) T =25(cid:176) C T =25(cid:176) C j j PZU2.4BL to PZU4.3B2L PZU4.7BL to PZU12B2L Fig 5. Working current as a function of working Fig 6. Working current as a function of working voltage; typical values voltage; typical values 102 006aab248 IZ VZ(nom) (V) = 13 (mA) 10 14 18 22 27 33 15 20 24 30 36 16 1 10- 1 10- 2 10- 3 10 20 30 40 VZ (V) T =25(cid:176) C j PZU13BL to PZU36BL Fig 7. Working current as a function of working voltage; typical values PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 8 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standardQ101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 0.62 0.50 0.55 0.46 0.30 2 0.22 1.02 0.65 0.95 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm 03-04-17 Fig 8. Package outline SOD882 10. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 PZU2.4BL to SOD882 2mm pitch, 8mm tape and reel -315 PZU36BL PZU2.7B2L to PZU24B2L [1] For further information and the availability of packing methods, seeSection13. PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 9 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 11. Soldering 1.30 R = 0.05 (8· ) 0.30 R = 0.05 (8· ) 0.60 0.70 0.80 0.90 (2· ) (2· ) (2· ) solder lands 0.30 (2· ) solder paste 0.40 (2· ) solder resist 0.50 (2· ) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 9. Reflow soldering footprint SOD882 PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 10 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 12. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PZUXBL_SER_1 20080506 Product data sheet - - PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 11 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in Applications —Applications that are described herein for any of these modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the informationincludedhereinandshallhavenoliabilityfortheconsequencesof specified use without further testing or modification. use of such information. Limiting values —Stress above one or more limiting values (as defined in Short data sheet —A short data sheet is an extract from a full data sheet theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand the device at these or any other conditions above those given in the full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability. office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale —NXP Semiconductors products are sold full data sheet shall prevail. subjecttothegeneraltermsandconditionsofcommercialsale,aspublished athttp://www.nxp.com/profile/terms, including those pertaining to warranty, 13.3 Disclaimers intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such General —Information in this document is believed to be accurate and terms and conditions, the latter will prevail. reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsor No offer to sell or license —Nothing in this document may be interpreted warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch or construed as an offer to sell products that is open for acceptance or the information and shall have no liability for the consequences of use of such grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents information. or other industrial or intellectual property rights. Right to make changes —NXPSemiconductorsreservestherighttomake Quick reference data —The Quick reference data is an extract of the changes to information published in this document, including without product data given in the Limiting values and Characteristics sections of this limitation specifications and product descriptions, at any time and without document, and as such is not complete, exhaustive or legally binding. notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, 13.4 Trademarks authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or Notice:Allreferencedbrands,productnames,servicenamesandtrademarks malfunction of an NXP Semiconductors product can reasonably be expected are the property of their respective owners. to result in personal injury, death or severe property or environmental 14. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 6 May 2008 12 of 13

PZUxBL series NXP Semiconductors Single Zener diodes 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 14 Contact information. . . . . . . . . . . . . . . . . . . . . 12 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 May 2008 Document identifier: PZUXBL_SER_1