PPPrrroooddduuucccttt GGGuuuiiidddeee 11111122HH SSeerriieess TThhiinn TTyyppee SSMMTT LLEEDD (cid:2) (cid:2) Features Applications (cid:127) Meets industry standards for 2012 (0806) footprint (cid:127) Membrane switch panels (cid:127)2.0mm (L) x 1.25mm (W) x 0.8mm (H) (cid:127) Backlighting (cid:127) 1112H is 50% thinner than the W series. (cid:127) Cellular telephones (cid:2) Outline Dimensions PCB Warpage direction Unit: mm Tolerances +0.1 (cid:2) Electro-Optical Characteristics (Ta=25°C) Type No. Material Emitted Lens Luminous Wavelength Forward Reverse Viewing Color Color Intensity IV Peak DominantSHpaelcf tWraild Lthin e Voltage VF CurrentIR Angle λλp λλd ∆λλ (2 θ1/2) MIN. TYP. IF TYP. TYP. TYP. IF TYP MAX. IF MAX. VR BR1112H GaAIAs Red 7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 150° AA1112H GaAsP Orange 2.2 3.7 20 605 606 30 20 2.2 2.8 20 100 4 AY1112H GaAsP Yellow 2.2 3.7 20 580 590 30 20 2.2 2.8 20 100 4 Milky PY1112H GaP Yellow-Green White 7.0 11.7 20 570 572 30 20 2.1 2.8 20 100 4 160° PG1112H GaP Green 3.8 6.4 20 560 567 30 20 2.1 2.8 20 100 4 BG1112H GaP Pure Green 1.6 2.7 20 555 558 30 20 2.1 2.8 20 100 4 Units mcd mA nm mA V mA µA V Deg.

(cid:2) Absolute Maximum Ratings (Ta=25°C) Yellow Pure Red Orange Yellow Green Green Green Item Units Symbol BR AA AY PY PG BG Power Dissipation Pd 57.5 70 70 70 70 70 mW Forward Current I 25 25 25 25 25 25 mA F Peak Forward Current I 60 60 60 60 60 60 mA FM Reverse Voltage V 4 4 4 4 4 4 V R Operating Temperature Topr -30 to +85 °C Storage Temperature Tstg -40 to +100 °C Derating* ∆I 0.36 (DC) 0.86 (Pulse) mA/°C F * Ta=25°C, IFMapplies for the pulse width ≤1msec. and duty cycle ≤1/20. (cid:2) Taping Specifications (cid:2) Operation Current Derating Chart (DC) 0.1 4+0.1 + 1.75 (1.45) φ 1.5 + 00.1(cid:31) (0.2) Quantity on tape: 8+0.2 3.5+0.05 4p0e0r 0re peileces (φ 0.5) 2+0.05 (2.25) (1) φ 21+0.8 2+0.5 Center(cid:31) BR, AA, AY, PY, PG, BG Hole 4+0.1 Direction to pull +1(cid:31) 60 φ -0 13+0.2φ φ 13+0.2 11.4+1 9+0.3 φ(cid:31) 180+ 30(cid:31) (cid:2) Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: (cid:127) Soldering iron: Temperature at tip of iron:280°C max. (30W max.) Soldering time: 3 sec. max. (cid:127) Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature:260°C max. Dipping Time: 5 sec. max. (cid:127) Reflow Soldering: (cid:2) Spatial Distribution LED Surface Temperature112~°254C000 Pre-heating Triesme: p5e°rCa/tsuerec(cid:31).Operation HeatingC—o5o°lCin/gs:e(cid:31)c. 0 60 to 120 sec. 5 sec. max 2. Cleaning: (cid:127) If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. (cid:127) Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. (cid:127) Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1112H-0301 Stanley Electric Sales of America,Inc. 2660 Barranca Parkway,Irvine,CA 92606 ••Tel: 800-LED-LCD1 (533-5231) ••Fax: 949-222-0555 Website: www.stanley-electric.com