Solid State Relay OCMOS FET PS7801C-1A 4-PIN ULTRA SMALL FLAT-LEAD, D SUPER LOW OUTPUT CAPACITANCE, −NEPOC Series− 1-ch Optical Coupled MOS FET E DESCRIPTION The PS7801C-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side U (input side) and MOS FETs on the output side. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the PS72xx series. It is suitable for high-frequency signal control, due to its low C × R, super low output capacitance, and low off-state N leakage current. FEATURES PIN CONNECTION • Ultra small flat-lead package (4.2 (L) × 2.5 (W) × 1.85 (H) mm) I (Top View) • Super low output capacitance (Cout = 0.5 pF TYP.) T 4 3 • Low C × R (C × R = 6.5 pF • Ω) • 1 channel type (1 a output) 1. LED Anode • Designed for AC/DC switching line changer 2. LED Cathode N 3. MOS FET • Low offset voltage 4. MOS FET <R> • Ordering number of taping product: PS7801C-1A-F3 (3 500 pcs/reel) <R> • Pb-Free product 1 2 <R> • Safety standards O • UL approved: File No. E72422 APPLICATIONS • Measurement equipment C S I D Document No. PN10549EJ02V0DS (2nd edition) Date Published January 2008 NS The mark <R> shows major revised points. 2004, 2008 The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

PS7801C-1A PACKAGE DIMENSIONS (UNIT: mm) 2.5±0.3 D 0.2 MAX. 4 3 E N 4.2±0.2 U+0.33.6 –0.4 1 0. ± 2 0. 1 2 N 3.0 MAX. 4.6±0.2 85±0.05 I+0.10.15–0.05 0.36 1. T 0.4±0.1 0.2±0.1 1.27 N <R> MARKING EXAMPLE O Last number of 1C type No. : 1C* 1 *2 C N An initial of "NEC" 801 Assembly lot S No.1 pin mark (Nicked 8 01(Marking details) corIner) Week assembled Year assembled D *1 The marking corresponds to the last two digits of the part number below. PS7801C-1A *2 Bar : Pb-Free 2 Data Sheet PN10549EJ02V0DS

PS7801C-1A <R> ORDERING INFORMATION Solder Plating Safety Standard Application Part Number Order Number Packing Style Specification Approval PDart *1 Number PS7801C-1A PS7801C-1A-A Pb-Free 50 pcs (Tape 50 pcs cut) Standard products PS7801C-1A PS7801C-1A-F3 PS7801C-1A-F3-A Embossed Tape 3 500 pcs/reel (UL approved) E *1 For the application of the Safety Standard, following part number should be used. U ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current (DC) IF 50 mNA Reverse Voltage VR 5.0 V Power Dissipation PD 50 mW Peak Forward Current *1 IFP 1 IA MOS FET Break Down Voltage VL 30 V T Continuous Load Current IL 80 mA Pulse Load Current *2 ILP 160 mA (AC/DC Connection) N Power Dissipation PD 250 mW Isolation Voltage *3 BV 500 Vr.m.s. Total Power Dissipation PT 300 mW O Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C *1 PW = 100 µs, Duty CyclCe = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. S RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit I LED Operating Current IF 2 5 20 mA D LED Off Voltage VF 0 0.5 V Data Sheet PN10549EJ02V0DS 3

PS7801C-1A ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Symbol Conditions MIN. TYP. MAX. Unit D Diode Forward Voltage VF IF = 5 mA 1.1 1.4 V Reverse Current IR VR = 5 V 5.0 µA MOS FET Off-state Leakage ILoff VD = 30 V 0.1 1.0 nA Current E Output Capacitance Cout VD = 0 V, f = 1 MHz 0.5 0.7 pF Coupled LED On-state Current IFon IL = 80 mA 2.0 mA <R> On-state Resistance Ron1 IF = 5 mA, IL = 10 mA U12.5 17 Ω Ron2 IF = 5 mA, IL = 80 mA 13 17 Turn-on Time*1, 2 ton IF = 5 mA, VO = 5 V, RL = 500 Ω, 0.03 0.5 ms Turn-off Time*1, 2 toff PW ≥ 10 ms N 0.1 0.5 Isolation Resistance RI-O VI-O = 0.5 kVDC 109 Ω Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.3 pF I *1 Test Circuit for Switching Time T IF Pulse Input VL Input 50% N 0 O VO = 5 V 90% Input monitor VOmonitor Output Rin RL 10% C ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increSase. I D 4 Data Sheet PN10549EJ02V0DS

PS7801C-1A <R> TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE D 100 100 A) m A) ent I (F 80 nt I (mL 80 E Curr 60 urre 60 d C ar d orw 40 Loa 40 U F m m u u m m 20 xi 20 axi Ma M 0 0 N –25 0 25 50 75 85 100 –25 0 25 50 75 85 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. OUTPUT CAPACITANCE vs. I AMBIENT TEMPERATURE APPLIED VOLTAGE 1.6 T1 f = 1 MHz F) V (V)F 1.4 N C (pout 0.8 Voltage 1.2 IF = 235000 mmmAAA acitance 0.6 ard O10 mA Cap 0.4 Forw 1.0 51 mmAA utput 0.2 O 0.8 –25 0 25 C50 75 100 0 5 10 15 20 25 30 35 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. AMBIENTS TEMPERATURE LOAD CURRENT vs. LOAD VOLTAGE 10–9 100 VD = 30 V IF = 5 mA A) 80 nt I (Loff10–10I mA) 6400 e Curre1D0–11 ent I (L 20 akag Curr –1.5 –1.0 –0.5 0 –20 0.5 1.0 1.5 state Le10–12 Load ––4600 Off- –80 10–13 –100 0 20 40 60 80 100 Ambient Temperature TA (˚C) Load Voltage VL (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10549EJ02V0DS 5

PS7801C-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 3.0 60 nce R on 2.5 INaFt o =Tr mA5 =aml i2zA5e,˚ dC t,o 1.0 50 InIFL === 58500 Dm pmAcA,s, sista 2.0 IL = 80 mA s) 40 e c R p ate 1.5 er ( 30 E On-st 1.0 Numb 20 d e aliz 0.5 10 U m or N 0.0 0 –25 0 25 50 75 100 12.5 13.0 13.5 14.0 14.5 Ambient Temperature TA (˚C) NOn-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT TURN-OFF TIME vs. FORWARD CURRENT 250 I200 VO = 5 V, VO = 5 V, RL = 500 Ω T RL = 500 Ω 200 160 µme t ( s)on 150 N µme t ( s)off 120 Ti Ti on 100 off 80 n- n- ur ur T T 50 40 O 0 5 10 15 20 25 0 5 10 15 20 25 Forward Current IF (mA) Forward Current IF (mA) C TURN-ON TIME DISTRIBUTION TURN-OFF TIME DISTRIBUTION 60 60 S n = 50 pcs, n = 50 pcs, 50 IF = 5 mA, 50 IF = 5 mA, VO = 5 V, VO = 5 V, RL = 500 Ω RL = 500 Ω s) 40 s) 40 c c p I p er ( 30 er ( 30 b D b m m u u N 20 N 20 10 10 0 0 0.01 0.02 0.03 0.04 0.05 0.04 0.05 0.06 0.07 0.08 Turn-on Time ton (ms) Turn-off Time toff (ms) Remark The graphs indicate nominal characteristics. 6 Data Sheet PN10549EJ02V0DS

PS7801C-1A NORMALIZED TURN-ON TIME vs. NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE 3.0 3.0 Normalized to 1.0 Normalized to 1.0 D me ton 2.5 IaRFt L = T= A5 5 =m0 20A5 ,Ω˚ VCO, = 5 V, me toff 2.5 IaRFt L = T= A5 5 =m0 20A5 ,Ω˚ VCO, = 5 V, Ti 2.0 Ti 2.0 on off n- n- E ur 1.5 ur 1.5 T T d d e e z 1.0 z 1.0 ali ali m m Nor 0.5 Nor 0.5 U 0.0 0.0 –50 –25 0 25 50 75 100 –50 –25 0 25 50 75 100 Ambient Temperature TA (˚C) NAmbient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. I T N O C S I D Data Sheet PN10549EJ02V0DS 7

PS7801C-1A <R> TAPING SPECIFICATIONS (UNIT: mm) D Outline and Dimensions (Tape) 1 2.0±0.05 ±0. 5 4.0±0.1 1.5+–00. 1 1.7 2.9 MAX. E 5 0 5.5±0. 2.0±0.2 3±0.1 U 1 5. 0.3 1.55±0.05 2.4±0.1 2.9±0.1 4.0±0.1 N I Tape Direction T PS7801C-1A-F3 N N N N N O Outline and Dimensions (Reel) 2.0±0.5 C 2.0±0.5 S φ13.0±0.2 0 φ330±2. 00±1.0 3.0±0.2 I R 1.0 φ21.0±0.8 φ1 φ1 13.5±1.0 D 17.5±1.0 11.9 to 15.4 Outer edge of Packing: 3 500 pcs/reel flange 8 Data Sheet PN10549EJ02V0DS

PS7801C-1A <R> RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 1.27 D 0.8 5) 0.6 3 0. ( E U 6 4 3 3. 4. 5. N I T ( ) : Reference value 24-R0.1 N Remark All dimensions in this figure must be evaluated before use. O C S I D Data Sheet PN10549EJ02V0DS 9

PS7801C-1A <R> RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) D • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three E • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared RUeflow C) N T (˚ (htoe a1t0in sg) e ur 260˚C MAX. erat 220˚C p I m to 60 s e T e T c 180˚C a urf S 120˚C ge 120±30 s ka (preheating)N c a P O Time (s) (2) Wave soldering C • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of timeSs One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) I (3) Soldering by soldering iron • PDeak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet PN10549EJ02V0DS

PS7801C-1A <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. D E U N I T N O C S I D Data Sheet PN10549EJ02V0DS 11

PS7801C-1A D E • The information in this document is current as of January, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data U sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no reNsponsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual propeIrty rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative T purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. N • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and antOi-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depenCd on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. S "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life Isupport systems and medical equipment for life support, etc. ThDe quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10549EJ02V0DS

PS7801C-1A This product uses gallium arsenide (GaAs). Caution GaAs Products GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicaDble laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbageE, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. U N I T N O C S I D