Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PMEG3010EB 1 A very low VF MEGA Schottky barrier rectifier Rev. 2 — 15 March 2012 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD523 ultra small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits  Forward current: I ≤ 1 A  AEC-Q101 qualified F  Reverse voltage: V ≤ 30 V  Ultra small and flat lead SMD plastic R package  Very low forward voltage 1.3 Applications  Low voltage rectification  Reverse polarity protection  High efficiency DC-to-DC conversion  Low power consumption applications  Switch mode power supply 1.4 Quick reference data Table 1. Quick refere nce data Symbol Parameter Conditions Min Typ Max Unit I forward current T ≤55°C - - 1 A F sp V reverse voltage - - 30 V R V forward voltage I =1A; pulsed; t ≤300µs; δ≤0.02; - 610 680 mV F F p T =25°C amb 2. Pinning information Table 2. Pinning infor mation Pin Symbol Description Simplified outline Graphic symbol 1 K cathode[1] 1 2 2 A anode 1 2 sym001 SOD523 [1] The marking bar indicates the cathode.

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 3. Ordering information Table 3. Ordering info rmation Type number Package Name Description Version PMEG3010EB - plastic surface-mounted package; 2 leads SOD523 4. Marking Table 4. Marking cod es Type number Marking code PMEG3010EB KA 5. Limiting values Table 5. Limiting valu es In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 30 V R I forward current T ≤55°C - 1 A F sp I repetitive peak forward current t ≤1ms; δ≤0.25 - 3 A FRM p I non-repetitive peak forward t =8ms; T =25°C; square wave - 5 A FSM p j(init) current P total power dissipation T ≤25°C [1] - 310 mW tot amb T junction temperature - 150 °C j T ambient temperature -65 150 °C amb T storage temperature -65 150 °C stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Thermal cha racteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance in free air [1][2] - - 400 K/W th(j-a) from junction to ambient R thermal resistance [3] - - 75 K/W th(j-sp) from junction to solder point [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P are a R significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Soldering point of cathode tab. PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 2 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 7. Characteristics Table 7. Characterist ics Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =0.1mA; pulsed; t ≤300µs; - 90 180 mV F F p δ≤0.02; T =25°C amb I =1mA; pulsed; t ≤300µs; - 150 200 mV F p δ≤0.02; T =25°C amb I =10mA; pulsed; t ≤300µs; - 210 270 mV F p δ≤0.02; T =25°C amb I =100mA; pulsed; t ≤300µs; - 295 360 mV F p δ≤0.02; T =25°C amb I =500mA; pulsed; t ≤300µs; - 430 500 mV F p δ≤0.02; T =25°C amb I =1A; pulsed; t ≤300µs; δ≤0.02; - 610 680 mV F p T =25°C amb I reverse current V =10V; T =25°C - 15 200 µA R R amb V =30V; T =25°C - 70 500 µA R amb C diode capacitance V =1V; f=1MHz; T =25°C - 24 30 pF d R amb 104 006aaa855 105 006aaa856 IF (μIRA) (1) (mA) 104 (2) 103 103 (3) 102 102 (4) 10 10 (1) 1 (2) (3) 10−1 (5) (4) 1 (5) 10−2 10−1 10−3 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 VF (V) VR (V) (1) T = 150 °C (1) T = 150 °C amb amb (2) T = 125 °C (2) T = 125 °C amb amb (3) T = 85 °C (3) T = 85 °C amb amb (4) T = 25 °C (4) T = 25 °C amb amb (5) T = −40 °C (5) T = −40 °C amb amb Fig 1. Forward current as a function of forward Fig 2. Reverse current as a function of reverse voltage; typical values voltage; typical values PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 3 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 006aaa857 40 Cd (pF) 30 20 10 0 0 10 20 30 VR (V) f = 1 MHz; T = 25 °C amb Fig 3. Diode capacitance as a function of reverse voltage; typical values 8. Test information P duty cycle δ = tp tcy tcy tp t 006aac658 Fig 4. Duty cycle definition 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 4 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 9. Package outline 0.85 0.65 0.75 0.58 1 1.65 1.25 1.55 1.15 2 0.34 0.17 0.26 0.11 Dimensions in mm 02-12-13 Fig 5. Package outline SOD523 10. Soldering 2.15 1.1 solder lands solder resist 0.5 0.6 1.2 (2×) (2×) solder paste occupied area 0.7 Dimensions in mm (2×) 0.8 (2×) sod523_fr Fig 6. Reflow soldering footprint for SOD523 PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 5 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 11. Revision history Table 8. Revision his tory Document ID Release date Data sheet status Change notice Supersedes PMEG3010EB v.2 20120315 Product data sheet - PMEG3010EB v.1 Modifications: • 1 “Product profile” updated • 5 “Limiting values”:I and I values corrected FRM FSM • 8 “Test information” updated PMEG3010EB v.1 20061201 Product data sheet - - PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 6 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 12. Legal information 12.1 Data sheet status Document status[1] [2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 12.2 Definitions Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without Preview — The document is a preview version only. The document is still limitation specifications and product descriptions, at any time and without subject to formal approval, which may result in modifications or additions. notice. This document supersedes and replaces all information supplied prior NXP Semiconductors does not give any representations or warranties as to to the publication hereof. the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or Draft — The document is a draft version only. The content is still under safety-critical systems or equipment, nor in applications where failure or internal review and subject to formal approval, which may result in malfunction of an NXP Semiconductors product can reasonably be expected modifications or additions. NXP Semiconductors does not give any to result in personal injury, death or severe property or environmental representations or warranties as to the accuracy or completeness of damage. NXP Semiconductors and its suppliers accept no liability for information included herein and shall have no liability for the consequences of inclusion and/or use of NXP Semiconductors products in such equipment or use of such information. applications and therefore such inclusion and/or use is at the customer’s own risk. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Quick reference data — The Quick reference data is an extract of the for quick reference only and should not be relied upon to contain detailed and product data given in the Limiting values and Characteristics sections of this full information. For detailed and full information see the relevant full data document, and as such is not complete, exhaustive or legally binding. sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the Applications — Applications that are described herein for any of these full data sheet shall prevail. products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the Product specification — The information and data provided in a Product specified use without further testing or modification. data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and Customers are responsible for the design and operation of their applications customer have explicitly agreed otherwise in writing. In no event however, and products using NXP Semiconductors products, and NXP Semiconductors shall an agreement be valid in which the NXP Semiconductors product is accepts no liability for any assistance with applications or customer product deemed to offer functions and qualities beyond those described in the design. It is customer’s sole responsibility to determine whether the NXP Product data sheet. Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate 12.3 Disclaimers design and operating safeguards to minimize the risks associated with their applications and products. Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any NXP Semiconductors does not accept any liability related to any default, representations or warranties, expressed or implied, as to the accuracy or damage, costs or problem which is based on any weakness or default in the completeness of such information and shall have no liability for the customer’s applications or products, or the application or use by customer’s consequences of use of such information. NXP Semiconductors takes no third party customer(s). Customer is responsible for doing all necessary responsibility for the content in this document if provided by an information testing for the customer’s applications and products using NXP source outside of NXP Semiconductors. Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party In no event shall NXP Semiconductors be liable for any indirect, incidental, customer(s). NXP does not accept any liability in this respect. punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or Limiting values — Stress above one or more limiting values (as defined in replacement of any products or rework charges) whether or not such the Absolute Maximum Ratings System of IEC 60134) will cause permanent damages are based on tort (including negligence), warranty, breach of damage to the device. Limiting values are stress ratings only and (proper) contract or any other legal theory. operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Notwithstanding any damages that customer might incur for any reason Characteristics sections of this document is not warranted. Constant or whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards repeated exposure to limiting values will permanently and irreversibly affect customer for the products described herein shall be limited in accordance the quality and reliability of the device. with theTerms and conditions of commercial sale of NXP Semiconductors. PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 7 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier Terms and conditions of commercial sale — NXP Semiconductors product for such automotive applications, use and specifications, and (b) products are sold subject to the general terms and conditions of commercial whenever customer uses the product for automotive applications beyond sale, as published athttp://www.nxp.com/profile/terms, unless otherwise NXP Semiconductors’ specifications such use shall be solely at customer’s agreed in a valid written individual agreement. In case an individual own risk, and (c) customer fully indemnifies NXP Semiconductors for any agreement is concluded only the terms and conditions of the respective liability, damages or failed product claims resulting from customer design and agreement shall apply. NXP Semiconductors hereby expressly objects to use of the product for automotive applications beyond NXP Semiconductors’ applying the customer’s general terms and conditions with regard to the standard warranty and NXP Semiconductors’ product specifications. purchase of NXP Semiconductors products by customer. Translations — A non-English (translated) version of a document is for No offer to sell or license — Nothing in this document may be interpreted or reference only. The English version shall prevail in case of any discrepancy construed as an offer to sell products that is open for acceptance or the grant, between the translated and English versions. conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior Notice: All referenced brands, product names, service names and trademarks authorization from competent authorities. are the property of their respective owners. Non-automotive qualified products — Unless this data sheet expressly Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G states that this specific NXP Semiconductors product is automotive qualified, reenChip,HiPerSmart,HITAG,I²C-bus the product is not suitable for automotive use. It is neither qualified nor tested logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE in accordance with automotive testing or application requirements. NXP Ultralight,MoReUse,QLPAK,Silicon Semiconductors accepts no liability for inclusion and/or use of Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia non-automotive qualified products in automotive equipment or applications. andUCODE — are trademarks of NXP B.V. In the event that customer uses the product for design-in and use in HD Radio andHD Radio logo — are trademarks of iBiquity Digital automotive applications to automotive specifications and standards, customer Corporation. (a) shall use the product without NXP Semiconductors’ warranty of the 13. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com PMEG3010EB All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 15 March 2012 8 of 9

PMEG3010EB NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 6 Thermal characteristics . . . . . . . . . . . . . . . . . . .2 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .3 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . .4 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . .4 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . .5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .6 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .7 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .7 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 13 Contact information. . . . . . . . . . . . . . . . . . . . . . .8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 March 2012 Document identifier: PMEG3010EB