Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PMBD7000 Double high-speed switching diode Rev. 4 — 16 September 2010 Product data sheet 1. Product profile 1.1 General description The PMBD7000 consists of two high-speed switching diodes connected in series, fabricated in planar technology, and encapsulated in a small SOT23(TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits (cid:132) High switching speed: t ≤4ns (cid:132) Reverse voltage: V ≤100V rr R (cid:132) Repetitive peak forward current: (cid:132) Repetitive peak reverse voltage: I ≤450mA V ≤100V FRM RRM (cid:132) Small SMD plastic package (cid:132) AEC-Q101 qualified 1.3 Applications (cid:132) High-speed switching (cid:132) General-purpose switching 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I reverse current V =100V - - 0.5 μA R R V reverse voltage - - 100 V R t reverse recovery time [1] - - 4 ns rr [1] When switched from IF=10mA to IR=10mA; RL=100Ω; measured at IR=1mA.

PMBD7000 NXP Semiconductors Double high-speed switching diode 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 anode (diode1) 3 3 2 cathode (diode2) 3 cathode (diode1), anode(diode2) 1 2 1 2 006aaa763 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PMBD7000 - plastic surface-mounted package; 3leads SOT23 4. Marking Table 4. Marking codes Type number Marking code[1] PMBD7000 *5C [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 2 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V repetitive peak reverse - 100 V RRM voltage V reverse voltage - 100 V R I forward current [1] - 215 mA F [2] - 125 mA I repetitive peak forward - 450 mA FRM current I non-repetitive peak square wave [3] FSM forward current t =1μs - 4 A p t =1ms - 1 A p t =1s - 0.5 A p P total power dissipation T ≤25°C [1][4] - 250 mW tot amb Per device T junction temperature - 150 °C j T ambient temperature −55 +150 °C amb T storage temperature −65 +150 °C stg [1] Single diode loaded. [2] Double diode loaded. [3] Tj=25°C prior to surge. [4] Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from in free air [1][2] - - 500 K/W th(j-a) junction to ambient R thermal resistance from - - 360 K/W th(j-t) junction to tie-point [1] Single diode loaded. [2] Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint. PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 3 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 7. Characteristics Table 7. Characteristics T =25°C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit Per diode V forward voltage I =1mA - 550 700 mV F F I =10mA - 670 820 mV F I =50mA - - 1 V F I =100mA - 0.75 1.1 V F I =150mA - - 1.25 V F I reverse current V =50V - - 300 nA R R V =100V - - 500 nA R V =50V; T =150°C - - 100 μA R j C diode capacitance f=1MHz; V =0V - - 1.5 pF d R t reverse recovery time [1] - - 4 ns rr V forward recovery voltage [2] - - 1.75 V FR [1] When switched from IF=10mA to IR=10mA; RL=100Ω; measured at IR=1mA. [2] When switched from I =10mA; t =20ns. F r mbd033 mbg382 300 300 IF IF (mA) (mA) (1) (2) (3) 200 200 single diode loaded double diode loaded 100 100 0 0 0 100 Tamb (°C) 200 0 1 VF (V) 2 FR4PCB, standard footprint (1) Tj=150°C; typical values (2) Tj=25°C; typical values (3) Tj=25°C; maximum values Fig 1. Forward current as a function of ambient Fig 2. Forward current as a function of forward temperature; derating curve voltage PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 4 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 102 mbg704 105 mbg378 IR IFSM (nA) (A) 104 10 (1) (2) (3) 103 1 102 10−1 10 1 10 102 103 tp (μs) 104 0 100 Tj (°C) 200 Based on square wave currents. (1) V =50V; maximum values R Tj=25°C; prior to surge (2) VR=30V; typical values (3) V =50V; typical values R Fig 3. Non-repetitive peak forward current as a Fig 4. Reverse current as a function of junction function of pulse duration; maximum values temperature mbg446 0.8 Cd (pF) 0.6 0.4 0.2 0 0 4 8 12 16 VR (V) f=1MHz; Tamb=25°C Fig 5. Diode capacitance as a function of reverse voltage; typical values PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 5 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 8. Test information tr tp t D.U.T. 10 % RS = 50 Ω IF SAMPLING + IF trr t OSCILLOSCOPE V = VR + IF × RS Ri = 50 Ω 90 % (1) VR mga881 input signal output signal (1) I =1mA R Fig 6. Reverse recovery time test circuit and waveforms I 1 kΩ 450 Ω I V 90 % RS = 50 Ω D.U.T. OSCILLOSCOPE VFR Ri = 50 Ω 10 % t t tr tp input signal output signal mga882 Fig 7. Forward recovery voltage test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 6 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 9. Package outline 3.0 1.1 2.8 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 0.48 0.15 0.38 0.09 1.9 Dimensions in mm 04-11-04 Fig 8. Package outline PMBD7000(SOT23/TO-236AB) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PMBD7000 SOT23 4mm pitch, 8mm tape and reel -215 -235 [1] For further information and the availability of packing methods, see Section14. PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 7 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste 0.7 0.6 occupied area (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr Fig 9. Reflow soldering footprint PMBD7000(SOT23/TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 10. Wave soldering footprint PMBD7000(SOT23/TO-236AB) PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 8 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBD7000v.4 20100916 Product data sheet - PMBD7000_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 4 “Marking codes”: updated • Table 7 “Characteristics”: corrected V unit for condition I =150mA F F • Figure2: updated • Section 8 “Test information”: figure title of Figure6 amended • Section 8.1 “Quality information”: added • Section 13 “Legal information”: updated PMBD7000_3 19990511 Product specification - PMBD7000_2 PMBD7000_2 19960918 Product specification - PMBD7000_1 PMBD7000_1 19960419 Product specification - - PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 9 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. NXP Semiconductors and its customer, unless NXP Semiconductors and NXP Semiconductors does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the NXP Semiconductors product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and 13.3 Disclaimers the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall NXP Semiconductors be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from national authorities. PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 10 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode Quick reference data — The Quick reference data is an extract of the 13.4 Trademarks product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PMBD7000 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 4 — 16 September 2010 11 of 12

PMBD7000 NXP Semiconductors Double high-speed switching diode 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Contact information. . . . . . . . . . . . . . . . . . . . . 11 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 September 2010 Document identifier: PMBD7000