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  • 型号: PIC16F1947-I/PT
  • 制造商: Microchip
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PIC16F1947-I/PT产品简介:

ICGOO电子元器件商城为您提供PIC16F1947-I/PT由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 PIC16F1947-I/PT价格参考¥19.35-¥24.19。MicrochipPIC16F1947-I/PT封装/规格:嵌入式 - 微控制器, PIC 微控制器 IC PIC® XLP™ 16F 8-位 32MHz 28KB(16K x 14) 闪存 64-TQFP(10x10)。您可以下载PIC16F1947-I/PT参考资料、Datasheet数据手册功能说明书,资料中有PIC16F1947-I/PT 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
A/D位大小

10 bit

产品目录

集成电路 (IC)半导体

描述

IC MCU 8BIT 28KB FLASH 64TQFP8位微控制器 -MCU 28KB Flash, 1KB RAM LCD, 1.8-5.5V

EEPROM容量

256 x 8

产品分类

嵌入式 - 微控制器

I/O数

54

品牌

Microchip Technology

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

嵌入式处理器和控制器,微控制器 - MCU,8位微控制器 -MCU,Microchip Technology PIC16F1947-I/PTPIC® XLP™ 16F

数据手册

http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en547347点击此处下载产品Datasheethttp://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en548028http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en545146http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en555608

产品型号

PIC16F1947-I/PT

PCN组件/产地

http://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5780&print=viewhttp://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5897&print=viewhttp://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5968&print=viewhttp://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=IIRA-22KPRZ871&print=view

RAM容量

1K x 8

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=25053

产品种类

8位微控制器 -MCU

供应商器件封装

64-TQFP(10x10)

其它名称

PIC16F1947IPT

包装

管件

可用A/D通道

17

可编程输入/输出端数量

54

商标

Microchip Technology

处理器系列

PIC16

外设

欠压检测/复位,LCD,POR,PWM,WDT

安装风格

SMD/SMT

定时器数量

5 Timer

封装

Tray

封装/外壳

64-TQFP

封装/箱体

TQFP-64

工作温度

-40°C ~ 85°C

工作电源电压

2.3 V to 5.5 V

工厂包装数量

160

振荡器类型

内部

接口类型

EUSART, I2C, SPI

数据RAM大小

1024 B

数据总线宽度

8 bit

数据转换器

A/D 17x10b

最大工作温度

+ 85 C

最大时钟频率

32 MHz

最小工作温度

- 40 C

标准包装

160

核心

PIC

核心处理器

PIC

核心尺寸

8-位

片上ADC

Yes

特色产品

http://www.digikey.com/cn/zh/ph/Microchip/xlp.html

电压-电源(Vcc/Vdd)

1.8 V ~ 5.5 V

电源电压-最大

5.5 V

电源电压-最小

1.8 V

程序存储器大小

28 kB

程序存储器类型

Flash

程序存储容量

28KB(16K x 14)

系列

PIC16

输入/输出端数量

54 I/O

连接性

I²C, LIN, SPI, UART/USART

速度

32MHz

配用

/product-detail/zh/MA180032/MA180032-ND/2651349

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PDF Datasheet 数据手册内容提取

PIC16(L)F1946/47 64-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver and XLP Technology High-Performance RISC CPU PIC16LF1946/47 Low-Power Features • Only 49 Instructions to Learn: • Standby Current: - All single-cycle instructions except branches - 60nA @ 1.8V, typical • Operating Speed: • Operating Current: - DC – 32MHz oscillator/clock input - 7.0A @ 32kHz, 1.8V, typical - DC – 125ns instruction cycle - 35A/MHz, 1.8V, typical • Up to 16K x 14 Words of Flash Program Memory • Timer1 Oscillator Current: • Up to 1024 Bytes of Data Memory (RAM) - 600 nA @ 32 kHz, 1.8V, typical • Interrupt Capability with Automatic Context • Low-Power Watchdog Timer Current: Saving - 500 nA @ 1.8V, typical • 16-Level Deep Hardware Stack Peripheral Features • Direct, Indirect and Relative Addressing modes • Processor Read Access to Program Memory • 54 I/O Pins (One Input-only pin): - High-current source/sink for direct LED drive Special Microcontroller Features - Individually programmable Interrupt-on-pin • Precision Internal Oscillator: change pins - Factory-calibrated to ±1%, typical - Individually programmable weak pull-ups - Software-selectable frequency range from • Integrated LCD Controller: 32MHz to 31kHz - Up to 184 segments • Power-Saving Sleep mode - Variable clock input • Power-on Reset (POR) - Contrast control • Power-up Timer (PWRT) and Oscillator Start-up - Internal voltage reference selections Timer (OST) • Capacitive Sensing (CSM) Module (mTouch®): - 17 selectable channels • Brown-out Reset (BOR): • A/D Converter: - Selectable between two trip points - 10-bit resolution and 17 channels - Disable in Sleep option - Selectable 1.024/2.048/4.096V voltage • Multiplexed Master Clear with Pull-up/Input Pin reference • Programmable Code Protection • Timer0: 8-Bit Timer/Counter with 8-Bit • High Endurance Flash/EEPROM cell: Programmable Prescaler - 100,000 write Flash endurance • Enhanced Timer1: - 1,000,000 write EEPROM endurance - Flash/Data EEPROM retention: > 40 years - Dedicated low-power 32 kHz oscillator driver - 16-bit timer/counter with prescaler • Wide Operating Voltage Range: - 1.8V-5.5V (PIC16F1946/47) - External Gate Input mode with toggle and single shot modes - 1.8V-3.6V (PIC16LF1946/47) - Interrupt-on-gate completion • Timer2, 4, 6: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler • Two Capture, Compare, PWM Modules (CCP): - 16-bit Capture, max. resolution 125ns - 16-bit Compare, max. resolution 125ns - 10-bit PWM, max. frequency 31.25kHz • Three Enhanced Capture, Compare, PWM Modules (ECCP): - Three PWM time-base options - Auto-shutdown and auto-restart - PWM steering - Programmable dead-band delay  2010-2016 Microchip Technology Inc. DS40001414E-page 1

PIC16(L)F1946/47 Peripheral Features (Continued) • Two Master Synchronous Serial Ports (MSSPs) with SPI and I 2 C with: - 7-bit address masking - SMBus/PMBusTM compatibility - Auto-wake-up on start • Two Enhanced Universal Synchronous: Asynchronous Receiver Transmitters (EUSARTs) - RS-232, RS-485 and LIN compatible - Auto-Baud Detect • SR Latch (555 Timer): - Multiple Set/Reset input options - Emulates 555 Timer applications • Three Comparators: - Rail-to-rail inputs/outputs - Power mode control - Software enable hysteresis • Voltage Reference Module: - Fixed Voltage Reference (FVR) with 1.024V, 2.048V and 4.096V output levels - 5-bit rail-to-rail resistive DAC with positive and negative reference selection PIC16(L)F193X/194X Family Types ) Device Data Sheet Index Program MemoryFlash (words) Data EEPROM(bytes) Data SRAM(bytes) (2)I/Os 10-bit ADC (ch) CapSense (ch) Comparators Timers(8/16-bit) EUSART 2MSSP (IC/SPI) ECCP CCP CD (Com/Seg/Total (1)Debug XLP L PIC16(L)F1933 (1) 4096 256 256 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1934 (2) 4096 256 256 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1936 (2) 8192 256 512 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1937 (2) 8192 256 512 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1938 (3) 16384 256 1024 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1939 (3) 16384 256 1024 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1946 (4) 8192 256 512 54 17 17 3 4/1 2 2 3 2 4/46/184 I Y PIC16(L)F1947 (4) 16384 256 1024 54 17 17 3 4/1 2 2 3 2 4/46/184 I Y Note 1: I – Debugging, Integrated on Chip; H – Debugging, Requires Debug Header. 2: One pin is input-only. 3: COM3 and SEG15 share the same physical pin, therefore SEG15 is not available when using 1/4 multiplex displays. Data Sheet Index: (Unshaded devices are described in this document.) 1: DS41575 PIC16(L)F1933 Data Sheet, 28-Pin Flash, 8-bit Microcontrollers. 2: DS41364 PIC16(L)F1934/6/7 Data Sheet, 28/40/44-Pin Flash, 8-bit Microcontrollers. 3: DS40001574 PIC16(L)F1938/9 Data Sheet, 28/40/44-Pin Flash, 8-bit Microcontrollers. 4: DS41414 PIC16(L)F1946/1947 Data Sheet, 64-Pin Flash, 8-bit Microcontrollers. DS40001414E-page 2  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 Pin Diagram – 64-Pin TQFP/QFN (PIC16(L)F1946/47) 64-pin TQFP, QFN E2E3E4E5E6E7D0 DD SSD1D2D3D4D5D6D7 RRRRRRRVVRRRRRRR 64636261605958575655545352515049 RE1 1 48 RB0 RE0 2 47 RB1 RG0 3 46 RB2 RG1 4 45 RB3 RG2 5 44 RB4 RG3 6 43 RB5 VPP/MCLR/RG5 7 PIC16(L)F1946/47 42 RB6 RG4 8 41 VSS VSS 9 40 RA6 VDD 10 39 RA7 RF7 11 38 VDD RF6 12 37 RB7 RF5 13 36 RC5 RF4 14 35 RC4 RF3 15 34 RC3 RF2 16 33 RC2 17181920212223242526272829303132 10D S3210 S D541067 FFD SAAAA S DAACCCC RRAV AVRRRRVVRRRRRR Note 1: Pin location selected by APFCON register setting. Default location. 2: Pin function can be moved using the APFCON register. Alternate location. 3: QFN package orientation is the same. No leads are present on the QFN package. Note: AVDD and AVSS are dedicated power connection pins for the on-board analog circuits of the PIC® microcontroller. The separate power pins help eliminate digital switching noise interference with the analog circuitry inside the device, especially on larger devices with more I/O pins and larger switching currents on the VDD/VSS pins. Customers typically connect these to the appropriate VDD or VSS connections on the PCB, unless there is a lot of noise on the external power rails. In those situations, they will add additional noise filtering components (like capacitors) on the AVDD/AVSS pins to help ensure good solid supply to the analog modules inside the device.  2010-2016 Microchip Technology Inc. DS40001414E-page 3

PIC16(L)F1946/47 TABLE 1: 64-PIN SUMMARY(PIC16(L)F1946/47) N F I/O Pin TQFP, Q ANSEL A/D Reference Cap Sense Comparator SR Latch Timers CCP USART MSSP LCD Interrupt Pull-up Basic 4- 6 RA0 24 Y AN0 — CPS0 — — — — — — SEG33 — — — RA1 23 Y AN1 — CPS1 — — — — — — SEG18 — — — RA2 22 Y AN2 VREF- CPS2 — — — — — — SEG34 — — — RA3 21 Y AN3 VREF+ CPS3 — — — — — — SEG35 — — — RA4 28 — — — — — — T0CKI — — — SEG14 — — — RA5 27 Y AN4 — CPS4 — — — — — — SEG15 — — — RA6 40 — — — — — — — — — — SEG36 — — OSC2/ CLKOUT RA7 39 — — — — — — — — — — SEG37 — — OSC1/ CLKIN RB0 48 — — — — — SRI — FLT0 — — SEG30 INT/ Y — IOC RB1 47 — — — — — — — — — — SEG8 IOC Y — RB2 46 — — — — — — — — — — SEG9 IOC Y — RB3 45 — — — — — — — — — — SEG10 IOC Y — RB4 44 — — — — — — — — — — SEG11 IOC Y — RB5 43 — — — — — — T1G — — — SEG29 IOC Y — RB6 42 — — — — — — — — — — SEG38 IOC Y ICSP- CLK/ ICDCLK RB7 37 — — — — — — — — — — SEG39 IOC Y ICSP- DAT/ ICDDAT RC0 30 — — — — — — T1OSO/ — — — SEG40 — — — T1CKI RC1 29 — — — — — — T1OSI CCP2(1)/ — — SEG32 — — — P2A(1) RC2 33 — — — — — — — CCP1/ — — SEG13 — — — P1A RC3 34 — — — — — — — — — SCK1/ SEG17 — — — SCL1 RC4 35 — — — — — — — — — SDI1/ SEG16 — — — SDA1 RC5 36 — — — — — — — — — SDO1 SEG12 — — — RC6 31 — — — — — — — — TX1/ — SEG27 — — — CK1 RC7 32 — — — — — — — — RX1/ — SEG28 — — — DT1 RD0 58 — — — — — — — P2D(2) — — SEG0 — — — RD1 55 — — — — — — — P2C(2) — — SEG1 — — — RD2 54 — — — — — — — P2B(2) — — SEG2 — — — RD3 53 — — — — — — — P3C(2) — — SEG3 — — — RD4 52 — — — — — — — P3B(2) — SDO2 SEG4 — — — RD5 51 — — — — — — — P1C(2) — SDI2 SEG5 — — — SDA2 RD6 50 — — — — — — — P1B(2) — SCK2/ SEG6 — — — SCL2 RD7 49 — — — — — — — — — SS2 SEG7 — — — Note 1: Pin functions can be moved using the APFCON register(s). Default location. 2: Pin function can be moved using the APFCON register. Alternate location. 3: Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 4: See Section8.0 “Low Dropout (LDO) Voltage Regulator”. DS40001414E-page 4  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 1: 64-PIN SUMMARY(PIC16(L)F1946/47) (Continued) N F I/O Pin TQFP, Q ANSEL A/D Reference Cap Sense Comparator SR Latch Timers CCP USART MSSP LCD Interrupt Pull-up Basic 4- 6 RE0 2 Y — — — — — — P2D(1) — VLCD1 — — — RE1 1 Y — — — — — — P2C(1) — — VLCD2 — — — RE2 64 Y — — — — — — P2B(1) — — VLCD3 — — — RE3 63 — — — — — — — P3C(1) — — COM0 — — — RE4 62 — — — — — — — P3B(1) — — COM1 — — — RE5 61 — — — — — — — P1C(1) — — COM2 — — — RE6 60 — — — — — — — P1B(1) — — COM3 — — — RE7 59 — — — — — — — CCP2(2)/ — — SEG31 — — — P2A(2) RF0 18 Y AN16 — CPS16 C1IN0- — — — — — SEG41 — — VCAP(4) C2IN0- RF1 17 Y AN6 — CPS6 C2OUT SRNQ — — — — SEG19 — — — RF2 16 Y AN7 — CPS7 C1OUT SRQ — — — — SEG20 — — — RF3 15 Y AN8 CPS8 C1IN2- — — — — — SEG21 — — — C2IN2- C3IN2- RF4 14 Y AN9 — CPS9 C2IN+ — — — — — SEG22 — — — RF5 13 Y AN10 DACOUT CPS10 C1IN1- — — — — SEG23 — — — C2IN1- RF6 12 Y AN11 — CPS11 C1IN+ — — — — — SEG24 — — — RF7 11 Y AN5 — CPS5 C1IN3- — — — — SS1 SEG25 — — — C2IN3- C3IN3- RG0 3 — — — — — — — CCP3 — — SEG42 — — — P3A RG1 4 Y AN15 — CPS15 C3OUT — — — TX2/ — SEG43 — — — CK2 RG2 5 Y AN14 — CPS14 C3IN+ — — — RX2/ — SEG44 — — — DT2 RG3 6 Y AN13 — CPS13 C3IN0- — — CCP4 — — SEG45 — — — P3D RG4 8 Y AN12 — CPS12 C3IN1- — — CCP5 — — SEG26 — — — P1D RG5 7 — — — — — — — — — — — — Y(3) MCLR/V PP VDD 10 — — — — — — — — — — — — — VDD 26 38 57 VSS 9 — — — — — — — — — — — — — VSS 25 41 56 AVDD 19 — — — — — — — — — — — — — AVDD AVSS 20 — — — — — — — — — — — — — AVSS Note 1: Pin functions can be moved using the APFCON register(s). Default location. 2: Pin function can be moved using the APFCON register. Alternate location. 3: Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. 4: See Section8.0 “Low Dropout (LDO) Voltage Regulator”.  2010-2016 Microchip Technology Inc. DS40001414E-page 5

PIC16(L)F1946/47 Table of Contents 1.0 Device Overview........................................................................................................................................................................08 2.0 Enhanced Mid-Range CPU........................................................................................................................................................16 3.0 Memory Organization.................................................................................................................................................................18 4.0 Device Configuration..................................................................................................................................................................53 5.0 Oscillator Module (With Fail-Safe Clock Monitor).......................................................................................................................60 6.0 Resets........................................................................................................................................................................................77 7.0 Interrupts....................................................................................................................................................................................85 8.0 Low Dropout (LDO) Voltage Regulator.......................................................................................................................................99 9.0 Power-Down Mode (Sleep)......................................................................................................................................................100 10.0 Watchdog Timer (WDT)............................................................................................................................................................102 11.0 Data EEPROM and Flash Program Memory Control...............................................................................................................106 12.0 I/O Ports...................................................................................................................................................................................121 13.0 Interrupt-On-Change................................................................................................................................................................146 14.0 Fixed Voltage Reference (FVR)................................................................................................................................................150 15.0 Temperature Indicator Module..................................................................................................................................................152 16.0 Analog-to-Digital Converter (ADC) Module..............................................................................................................................161 17.0 Digital-to-Analog Converter (DAC) Module..............................................................................................................................168 18.0 Comparator Module..................................................................................................................................................................172 19.0 SR Latch...................................................................................................................................................................................181 20.0 Timer0 Module..........................................................................................................................................................................186 21.0 Timer1 Module with Gate Control.............................................................................................................................................189 22.0 Timer2/4/6 Modules..................................................................................................................................................................200 23.0 Capture/Compare/PWM Modules.............................................................................................................................................204 24.0 Master Synchronous Serial Port (MSSP1 and MSSP2) Module..............................................................................................232 25.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)...............................................................287 26.0 Capacitive Sensing (CPS) Module...........................................................................................................................................316 27.0 Liquid Crystal Display (LCD) Driver Module.............................................................................................................................324 28.0 In-Circuit Serial Programming™ (ICSP™)...............................................................................................................................359 29.0 Instruction Set Summary..........................................................................................................................................................362 30.0 Electrical Specifications............................................................................................................................................................376 31.0 DC and AC Characteristics Graphs and Charts.......................................................................................................................409 32.0 Development Support...............................................................................................................................................................443 33.0 Packaging Information..............................................................................................................................................................447 Appendix A: Data Sheet Revision History..........................................................................................................................................455 Appendix B: Migrating From Other PIC® Devices..............................................................................................................................455 The Microchip Website.......................................................................................................................................................................456 Customer Change Notification Service..............................................................................................................................................456 Customer Support..............................................................................................................................................................................456 Product Identification System.............................................................................................................................................................457 DS40001414E-page 6  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Website; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products.  2010-2016 Microchip Technology Inc. DS40001414E-page 7

PIC16(L)F1946/47 1.0 DEVICE OVERVIEW The PIC16(L)F1946/47 are described within this data sheet. They are available in 64-pin packages. Figure1-1 shows a block diagram of the PIC16(L)F1946/47 devices. Table1-2 shows the pinout descriptions. Reference Table1-1 for peripherals available per device. TABLE 1-1: DEVICE PERIPHERAL SUMMARY 6 7 4 4 9 9 1 1 F F Peripheral L) L) 6( 6( 1 1 C C PI PI ADC ● ● Capacitive Sensing (CPS) Module ● ● Data EEPROM ● ● Digital-to-Analog Converter (DAC) ● ● Fixed Voltage Reference (FVR) ● ● LCD ● ● SR Latch ● ● Capture/Compare/PWM Modules ECCP1 ● ● ECCP2 ● ● ECCP3 ● ● CCP4 ● ● CCP5 ● ● Comparators C1 ● ● C2 ● ● C3 ● ● EUSARTS EUSART1 ● ● EUSART2 ● ● Master Synchronous Serial Ports MSSP1 ● ● MSSP2 ● ● Timers Timer0 ● ● Timer1 ● ● Timer2 ● ● Timer4 ● ● Timer6 ● ● DS40001414E-page 8  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 1-1: PIC16(L)F1946/47 BLOCK DIAGRAM Program Flash Memory RAM EEPROM PORTA OSC2/CLKOUT Timing Generation OSC1/CLKIN CPU PORTB INTRC Oscillator Figure2-1 PORTC MCLR PORTD PORTE PORTF SR ADC PORTG Timer0 Timer1 Timer2 Timer4 Timer6 Comparators Latch 10-Bit LCD ECCP1 ECCP2 ECCP3 CCP4 CCP5 MSSPx EUSARTx Note 1: See applicable chapters for more information on peripherals.  2010-2016 Microchip Technology Inc. DS40001414E-page 9

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION Input Output Name Function Description Type Type RA0/AN0/CPS0/SEG33 RA0 TTL CMOS General purpose I/O. AN0 AN — A/D Channel input. CPS0 AN — Capacitive sensing input 0. SEG33 — AN LCD Analog output. RA1/AN1/CPS1/SEG18 RA1 TTL CMOS General purpose I/O. AN1 AN — A/D Channel input. CPS1 AN — Capacitive sensing input. SEG18 — AN LCD Analog output. RA2/AN2/VREF-/CPS2/SEG34 RA2 TTL CMOS General purpose I/O. AN2 AN — A/D Channel input. VREF- AN — A/D Negative Voltage Reference input. CPS2 AN — Capacitive sensing input. SEG34 — AN LCD Analog output. RA3/AN3/VREF+/CPS3/SEG35 RA3 TTL CMOS General purpose I/O. AN3 AN — A/D Channel input. VREF+ AN — A/D Voltage Reference input. CPS3 AN — Capacitive sensing input. SEG35 — AN LCD Analog output. RA4/T0CKI/SEG14 RA4 TTL CMOS General purpose I/O. T0CKI ST — Timer0 clock input. SEG14 — AN LCD Analog output. RA5/AN4/CPS4/SEG15 RA5 TTL CMOS General purpose I/O. AN4 AN — A/D Channel input. CPS4 AN — Capacitive sensing input. SEG15 — AN LCD Analog output. RA6/OSC2/CLKOUT/SEG36 RA6 TTL CMOS General purpose I/O. OSC2 — XTAL Crystal/Resonator (LP, XT, HS modes). CLKOUT — CMOS FOSC/4 output. SEG36 — AN LCD Analog output. RA7/OSC1/CLKIN/SEG37 RA7 TTL CMOS General purpose I/O. OSC1 XTAL — Crystal/Resonator (LP, XT, HS modes). CLKIN CMOS — External clock input (EC mode). SEG37 — AN LCD Analog output. RB0/INT/SRI/FLT0/SEG30 RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. INT ST — External interrupt. SRI — ST SR Latch input. FLT0 ST — ECCP Auto-shutdown Fault input. SEG30 — AN LCD analog output. RB1/SEG8 RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. SEG8 — AN LCD Analog output. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. DS40001414E-page 10  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RB2/SEG9 RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. SEG9 — AN LCD Analog output. RB3/SEG10 RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. SEG10 — AN LCD Analog output. RB4/SEG11 RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. SEG11 — AN LCD Analog output. RB5/T1G/SEG29 RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. T1G ST — Timer1 Gate input. SEG29 — AN LCD Analog output. RB6/ICSPCLK/ICDCLK/SEG38 RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPCLK ST — Serial Programming Clock. ICDCLK ST — In-Circuit Debug Clock. SEG38 — AN LCD Analog output. RB7/ICSPDAT/ICDDAT/SEG39 RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPDAT ST CMOS ICSP™ Data I/O. ICDDAT ST CMOS In-Circuit Data I/O. SEG39 — AN LCD Analog output. RC0/T1OSO/T1CKI/SEG40 RC0 ST CMOS General purpose I/O. T1OSO XTAL XTAL Timer1 oscillator connection. T1CKI ST — Timer1 clock input. SEG40 — AN LCD Analog output. RC1/T1OSI/P2A(1)/CCP2(1)/ RC1 ST CMOS General purpose I/O. SEG32 T1OSI XTAL XTAL Timer1 oscillator connection. P2A — CMOS PWM output. CCP2 ST CMOS Capture/Compare/PWM. SEG32 — AN LCD Analog output. RC2/CCP1/P1A/SEG13 RC2 ST CMOS General purpose I/O. CCP1 ST CMOS Capture/Compare/PWM. P1A — CMOS PWM output. SEG13 — AN LCD Analog output. RC3/SCK1/SCL1/SEG17 RC3 ST CMOS General purpose I/O. SCK1 ST CMOS SPI clock. SCL1 I2C OD I2C clock. SEG17 — AN LCD Analog output. RC4/SDI1/SDA1/SEG16 RC4 ST CMOS General purpose I/O. SDI1 ST — SPI data input. SDA1 I2C OD I2C data input/output. SEG16 — AN LCD Analog output. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register.  2010-2016 Microchip Technology Inc. DS40001414E-page 11

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RC5/SDO1/SEG12 RC5 ST CMOS General purpose I/O. SDO1 — CMOS SPI data output. SEG12 — AN LCD Analog output. RC6/TX1/CK1/SEG27 RC6 ST CMOS General purpose I/O. TX1 — CMOS USART1 asynchronous transmit. CK1 ST CMOS USART1 synchronous clock. SEG27 — AN LCD Analog output. RC7/RX1/DT1/SEG28 RC7 ST CMOS General purpose I/O. RX1 ST — USART1 asynchronous input. DT1 ST CMOS USART1 synchronous data. SEG28 — AN LCD Analog output. RD0/P2D(1)/SEG0 RD0 ST CMOS General purpose I/O. P2D — CMOS PWM output. SEG0 — AN LCD Analog output. RD1/P2C(1)/SEG1 RD1 ST CMOS General purpose I/O. P2C — CMOS PWM output. SEG1 — AN LCD Analog output. RD2/P2B(1)/SEG2 RD2 ST CMOS General purpose I/O. P2B — CMOS PWM output. SEG2 — AN LCD Analog output. RD3/P3C(1)/SEG3 RD3 ST CMOS General purpose I/O. P3C — CMOS PWM output. SEG3 — AN LCD analog output. RD4/SDO2/P3B(1)/SEG4 RD4 ST CMOS General purpose I/O. SDO2 — CMOS SPI data output. P3B — CMOS PWM output. SEG4 — AN LCD analog output. RD5/SDI2/SDA2/P1C(1)/SEG5 RD5 ST CMOS General purpose I/O. SDI2 ST — SPI data input. SDA2 I2C OD I2C data input/output. P1C — CMOS PWM output. SEG5 — AN LCD analog output. RD6/SCK2/SCL2/P1B(1)/SEG6 RD6 ST CMOS General purpose I/O. SCK2 ST CMOS SPI clock. SCL2 I2C OD I2C clock. P1B — CMOS PWM output. SEG6 — AN LCD analog output. RD7/SS2/SEG7 RD7 ST CMOS General purpose I/O. SS2 ST — Slave Select input. SEG7 — AN LCD analog output. RE0/P2D(1)/VLCD1 RE0 ST CMOS General purpose I/O. P2D — CMOS PWM output. VLCD1 AN — LCD analog input. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. DS40001414E-page 12  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RE1/P2C(1)/VLCD2 RE1 ST CMOS General purpose I/O. P2C — CMOS PWM output. VLCD2 AN — LCD analog input. RE2/P2B(1)/VLCD3 RE2 ST CMOS General purpose I/O. P2B — CMOS PWM output. VLCD3 AN — LCD analog input. RE3/P3C(1)/COM0 RE3 ST CMOS General purpose I/O. P3C — CMOS PWM output. COM0 — AN LCD Analog output. RE4/P3B(1)/COM1 RE4 ST CMOS General purpose I/O. P3B — CMOS PWM output. COM1 — AN LCD Analog output. RE5/P1C(1)/COM2 RE5 ST CMOS General purpose I/O. P1C — CMOS PWM output. COM2 — AN LCD Analog output. RE6/P1B(1)/COM3 RE6 ST — General purpose I/O. P1B — CMOS PWM output. COM3 — AN LCD Analog output. RE7/CCP2(1)/P2A(1)/SEG31 RE7 ST CMOS General purpose I/O. CCP2 ST CMOS Capture/Compare/PWM. P2A — CMOS PWM output. SEG31 — AN LCD analog output. RF0/AN16/CPS16/C1IN0-/C2IN0 RF0 ST CMOS General purpose I/O. /SEG41/VCAP AN16 AN — A/D Channel input. CPS16 AN — Capacitive sensing input. C1IN0- AN — Comparator negative input. C2IN0- AN — Comparator negative input. SEG41 — AN LCD Analog output. VCAP Power Power Filter capacitor for Voltage Regulator. RF1/AN6/CPS6/C2OUT/SRNQ/ RF1 ST CMOS General purpose I/O. SEG19 AN6 AN — A/D Channel input. CPS6 AN — Capacitive sensing input. C2OUT — CMOS Comparator output. SRNQ — CMOS SR Latch inverting output. SEG19 — AN LCD Analog output. RF2/AN7/CPS7/C1OUT/SRQ/ RF2 ST CMOS General purpose I/O. SEG20 AN7 AN — A/D Channel input. CPS7 AN — Capacitive sensing input. C1OUT — CMOS Comparator output. SRQ — CMOS SR Latch non-inverting output. SEG20 — AN LCD Analog output. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register.  2010-2016 Microchip Technology Inc. DS40001414E-page 13

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RF3/AN8/CPS8/C123IN2-/ RF3 ST CMOS General purpose I/O. SEG21 AN8 AN — A/D Channel input. CPS8 AN — Capacitive sensing input. C1IN2- AN — Comparator negative input. C2IN2- AN — Comparator negative input. C3IN2- AN — Comparator negative input. SEG21 — AN LCD Analog output. RF4/AN9/CPS9/C2IN+/SEG22 RF4 ST CMOS General purpose I/O. AN9 AN — A/D Channel input. CPS9 AN — Capacitive sensing input. C2IN+ AN — Comparator positive input. SEG22 — AN LCD Analog output. RF5/AN10/CPS10/C12IN1-/ RF5 ST CMOS General purpose I/O. DACOUT/SEG23 AN10 AN — A/D Channel input. CPS10 AN — Capacitive sensing input. C1IN1- AN — Comparator negative input. C2IN1- AN — Comparator negative input. DACOUT — AN Voltage Reference output. SEG23 — AN LCD Analog output. RF6/AN11/CPS11/C1IN+/SEG24 RF6 ST CMOS General purpose I/O. AN11 AN — A/D Channel input. CPS11 AN — Capacitive sensing input. C1IN+ AN — Comparator positive input. SEG24 — AN LCD Analog output. RF7/AN5/CPS5/C123IN3-/SS1/ RF7 ST CMOS General purpose I/O. SEG25 AN5 AN — A/D Channel input. CPS5 AN — Capacitive sensing input. C1IN3- AN — Comparator negative input. C2IN3- AN — Comparator negative input. C3IN3- AN — Comparator negative input. SS1 ST — Slave Select input. SEG25 — AN LCD Analog output. RG0/CCP3/P3A/SEG42 RG0 ST CMOS General purpose I/O. CCP3 ST CMOS Capture/Compare/PWM. P3A — CMOS PWM output. SEG42 — AN LCD Analog output. RG1/AN15/CPS15/TX2/CK2/ RG1 ST CMOS General purpose I/O. C3OUT/SEG43 AN15 AN — A/D Channel input. CPS15 AN — Capacitive sensing input. TX2 — CMOS USART2 asynchronous transmit. CK2 ST CMOS USART2 synchronous clock. C3OUT — CMOS Comparator output. SEG43 — AN LCD Analog output. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. DS40001414E-page 14  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 1-2: PIC16(L)F1946/47 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RG2/AN14/CPS14/RX2/DT2/ RG2 ST CMOS General purpose I/O. C3IN+/SEG44 AN14 AN — A/D Channel input. CPS14 AN — Capacitive sensing input. RX2 ST — USART2 asynchronous input. DT2 ST CMOS USART2 synchronous data. C3IN+ AN — Comparator positive input. SEG44 — AN LCD Analog output. RG3/AN13/CPS13/C3IN0-/ RG3 ST CMOS General purpose I/O. CCP4/P3D/SEG45 AN13 AN — A/D Channel input. CPS13 AN — Capacitive sensing input. C3IN0- AN — Comparator negative input. CCP4 ST CMOS Capture/Compare/PWM. P3D — CMOS PWM output. SEG45 — AN LCD Analog output. RG4/AN12/CPS12/C3IN1-/ RG4 ST CMOS General purpose I/O. CCP5/P1D/SEG26 AN12 AN — A/D Channel input. CPS12 AN — Capacitive sensing input. C3IN1- AN — Comparator negative input. CCP5 ST CMOS Capture/Compare/PWM. P1D — CMOS PWM output. SEG26 — AN LCD Analog output. RG5/MCLR/VPP RG5 ST — General purpose input. MCLR ST — Master Clear with internal pull-up. VPP HV — Programming voltage. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open-drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register.  2010-2016 Microchip Technology Inc. DS40001414E-page 15

PIC16(L)F1946/1947 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. • Automatic Interrupt Context Saving • 16-level Stack with Overflow and Underflow • File Select Registers • Instruction Set 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section7.5 “Automatic Context Saving”, for more information. 2.2 16-level Stack with Overflow and Underflow These devices have an external stack memory 15-bit wide and 16-word deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled will cause a software Reset. See section Section3.5 “Stack” for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, one additional instruc- tion cycle is required to fetch the data at that address. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section3.6 “Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section29.0 “Instruction Set Summary” for more details. DS40001414E-page 16  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 FIGURE 2-1: CORE BLOCK DIAGRAM 15 CCCooonnnfiffgiigguuurarraatittoiioonnn 15 888 DDDaaatttaaa BBBuuusss PPPrrrooogggrrraaammm CCCooouuunnnttteeerrr Flash X U Program M Memory 1886 -LLLeeevvveeell lSS Sttaataccckkk RAM (((111335---bbbiiittt))) PPPrrrooogggrrraaammm 111444 Program Memory 12 RAM Addr BBBuuusss Read (PMR) AAAddddddrrr MMMUUUXXX IIInnnssstttrrruuuccctttiiiooonnn Rrreeeggg Indirect DDDiiirrreeecccttt AAAddddddrrr 777 Addr 5 12 12 15 BFFSSSRRR Rrreeeggg FFFSSSRRR 0rr eeRggeg FFFSSSRRR1 rrReeeggg 15 SSSTTTAAATTTUUUSSS Rrreeeggg 888 333 MMMUUUXXX Power-up Timer IIInnnssstttrrruuuccctttiiiooonnn Oscillator DDDeeecccooodddeee a &&nd Start-up Timer AAALLLUUU CCCooonnntttrrrooolll Power-on OSC1/CLKIN Reset 888 TTTiiimmmiiinnnggg Watchdog OSC2/CLKOUT GGGeeennneeerrraaatttiiiooonnn Timer W reg Brown-out Reset IIInnnttteeerrrnnnaaalll OOOsssccciiillllllaaatttooorrr BBBllloooccckkk VVVDDDDDD VVVSSSSSS  2010-2016 Microchip Technology Inc. DS40001414E-page 17

PIC16(L)F1946/1947 3.0 MEMORY ORGANIZATION The following features are associated with access and control of program memory and data memory: These devices contain the following types of memory: • PCL and PCLATH • Program Memory • Stack - Configuration Words • Indirect Addressing - Device ID - User ID 3.1 Program Memory Organization - Flash Program Memory The enhanced mid-range core has a 15-bit program • Data Memory counter capable of addressing a 32K x 14 program - Core Registers memory space. Table3-1 shows the memory sizes - Special Function Registers implemented for the PIC16(L)F1946/47 family. - General Purpose RAM Accessing a location above these boundaries will cause - Common RAM a wrap-around within the implemented memory space. • Data EEPROM memory(1) The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figures3-1 and3-2). Note1: The Data EEPROM Memory and the method to access Flash memory through the EECON registers is described in Section11.0 “Data EEPROM and Flash Program Memory Control”. TABLE 3-1: DEVICE SIZES AND ADDRESSES Device Program Memory Space (Words) Last Program Memory Address PIC16(L)F1946 8,192 1FFFh PIC16(L)F1947 16,384 3FFFh DS40001414E-page 18  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 FIGURE 3-1: PROGRAM MEMORY MAP FIGURE 3-2: PROGRAM MEMORY MAP AND STACK FOR AND STACK FOR PIC16(L)F1946 PIC16(L)F1947 PC<14:0> PC<14:0> CALL, CALLW 15 CALL, CALLW 15 RETURN, RETLW RETURN, RETLW Interrupt, RETFIE Interrupt, RETFIE Stack Level 0 Stack Level 0 Stack Level 1 Stack Level 1 Stack Level 15 Stack Level 15 Reset Vector 0000h Reset Vector 0000h Interrupt Vector 0004h Interrupt Vector 0004h 0005h 0005h Page 0 Page 0 07FFh On-chip 07FFh Program 0800h 0800h Memory Page 1 Page 1 On-chip 0FFFh 0FFFh Program Memory 1000h 1000h Page 2 Page 2 17FFh 17FFh 1800h 1800h Page 3 Page 3 1FFFh 1FFFh Rollover to Page 0 2000h Page 4 2000h Page 7 3FFFh Rollover to Page 0 4000h Rollover to Page 3 7FFFh Rollover to Page 7 7FFFh  2010-2016 Microchip Technology Inc. DS40001414E-page 19

PIC16(L)F1946/1947 3.1.1 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.1.1.1 RETLW Instruction The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example3-1. EXAMPLE 3-1: RETLW INSTRUCTION constants BRW ;Add Index in W to ;program counter to ;select data RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;… LOTS OF CODE… MOVLW DATA_INDEX CALL constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used. DS40001414E-page 20  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 3.1.1.2 Indirect Read with FSR 3.2.1 CORE REGISTERS The program memory can be accessed as data by The core registers contain the registers that directly setting bit 7 of the FSRxH register and reading the affect the basic operation. The core registers occupy matching INDFx register. The MOVIW instruction will the first 12 addresses of every data memory bank place the lower eight bits of the addressed word in the (addresses x00h/x08h through x0Bh/x8Bh). These W register. Writes to the program memory cannot be registers are listed below in Table3-2. For detailed performed via the INDF registers. Instructions that information, see Table3-4. access the program memory via the FSR require one extra instruction cycle to complete. Example3-2 TABLE 3-2: CORE REGISTERS demonstrates accessing the program memory via an FSR. The HIGH directive will set bit<7> if a label points to a Addresses BANKx location in program memory. x00h or x80h INDF0 x01h or x81h INDF1 EXAMPLE 3-2: ACCESSING PROGRAM x02h or x82h PCL MEMORY VIA FSR x03h or x83h STATUS constants x04h or x84h FSR0L DW DATA0 ;First constant x05h or x85h FSR0H DW DATA1 ;Second constant x06h or x86h FSR1L DW DATA2 DW DATA3 x07h or x87h FSR1H my_function x08h or x88h BSR ;… LOTS OF CODE… x09h or x89h WREG MOVLW DATA_INDEX x0Ah or x8Ah PCLATH ADDLW LOW constants x0Bh or x8Bh INTCON MOVWF FSR1L MOVLW HIGH constant ;MSb is set automatically MOVWF FSR1H BTFSC STATUS,C ;cary from ADDLW? INCF FSR1H,f ;yes MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W 3.2 Data Memory Organization The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure3-3): • 12 core registers • 20 Special Function Registers (SFR) • Up to 80 bytes of General Purpose RAM (GPR) • 16 bytes of common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section3.6 “Indirect Addressing” for more information. Data Memory uses a 12-bit address. The upper five bits of the address define the Bank address and the lower seven bits select the registers/RAM in that bank.  2010-2016 Microchip Technology Inc. DS40001414E-page 21

PIC16(L)F1946/1947 3.2.1.1 STATUS Register For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register The STATUS register, shown in Register3-1, contains: as ‘000u u1uu’ (where u = unchanged). • the arithmetic status of the ALU It is recommended, therefore, that only BCF, BSF, • the Reset status SWAPF and MOVWF instructions are used to alter the The STATUS register can be the destination for any STATUS register, because these instructions do not instruction, like any other register. If the STATUS affect any Status bits. For other instructions not register is the destination for an instruction that affects affecting any Status bits (Refer to Section29.0 the Z, DC or C bits, then the write to these three bits is “Instruction Set Summary”). disabled. These bits are set or cleared according to the Note1: The C and DC bits operate as Borrow device logic. Furthermore, the TO and PD bits are not and Digit Borrow out bits, respectively, in writable. Therefore, the result of an instruction with the subtraction. STATUS register as destination may be different than intended. 3.3 Register Definitions: Status REGISTER 3-1: STATUS: STATUS REGISTER U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u — — — TO PD Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC(1): Digit Carry/Digit Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C(1): Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. DS40001414E-page 22  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 3.3.1 SPECIAL FUNCTION REGISTER FIGURE 3-3: BANKED MEMORY PARTITIONING The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function 7-bit Bank Offset Memory Region Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the 00h operation of the peripherals are described in the Core Registers appropriate peripheral chapter of this data sheet. (12 bytes) 0Bh 3.3.2 GENERAL PURPOSE RAM 0Ch There are up to 80bytes of GPR in each data memory Special Function Registers bank. The Special Function Registers occupy the 20 (20 bytes maximum) bytes after the core registers of every data memory 1Fh bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). 20h 3.3.2.1 Linear Access to GPR The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section3.6.2 “Linear Data Memory” for more information. General Purpose RAM (80 bytes maximum) 3.3.3 COMMON RAM There are 16 bytes of common RAM accessible from all banks. 6Fh 70h Common RAM (16 bytes) 7Fh 3.3.4 DEVICE MEMORY MAPS The memory maps for the device family are as shown in Table3-3. TABLE 3-3: MEMORY MAP TABLES Device Banks Table No. PIC16(L)F1946/47 0-7 Table3-4 8-15 Table3-5, Table3-8 16-23 Table3-6 23-31 Table3-7, Table3-9  2010-2016 Microchip Technology Inc. DS40001414E-page 23

D TABLE 3-4: PIC16(L)F1946/47 MEMORY MAP, BANKS 0-7 P S 40 BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7 I 0 C 0 000h INDF0 080h INDF0 100h INDF0 180h INDF0 200h INDF0 280h INDF0 300h INDF0 380h INDF0 1 41 001h INDF1 081h INDF1 101h INDF1 181h INDF1 201h INDF1 281h INDF1 301h INDF1 381h INDF1 1 4E 002h PCL 082h PCL 102h PCL 182h PCL 202h PCL 282h PCL 302h PCL 382h PCL 6 -p 003h STATUS 083h STATUS 103h STATUS 183h STATUS 203h STATUS 283h STATUS 303h STATUS 383h STATUS ag 004h FSR0L 084h FSR0L 104h FSR0L 184h FSR0L 204h FSR0L 284h FSR0L 304h FSR0L 384h FSR0L ( e L 2 005h FSR0H 085h FSR0H 105h FSR0H 185h FSR0H 205h FSR0H 285h FSR0H 305h FSR0H 385h FSR0H 4 006h FSR1L 086h FSR1L 106h FSR1L 186h FSR1L 206h FSR1L 286h FSR1L 306h FSR1L 386h FSR1L ) F 007h FSR1H 087h FSR1H 107h FSR1H 187h FSR1H 207h FSR1H 287h FSR1H 307h FSR1H 387h FSR1H 008h BSR 088h BSR 108h BSR 188h BSR 208h BSR 288h BSR 308h BSR 388h BSR 1 009h WREG 089h WREG 109h WREG 189h WREG 209h WREG 289h WREG 309h WREG 389h WREG 9 00Ah PCLATH 08Ah PCLATH 10Ah PCLATH 18Ah PCLATH 20Ah PCLATH 28Ah PCLATH 30Ah PCLATH 38Ah PCLATH 4 00Bh INTCON 08Bh INTCON 10Bh INTCON 18Bh INTCON 20Bh INTCON 28Bh INTCON 30Bh INTCON 38Bh INTCON 6 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch — 28Ch PORTF 30Ch TRISF 38Ch LATF 00Dh PORTB 08Dh TRISB 10Dh LATB 18Dh — 20Dh WPUB 28Dh PORTG 30Dh TRISG 38Dh LATG / 1 00Eh PORTC 08Eh TRISC 10Eh LATC 18Eh — 20Eh — 28Eh — 30Eh — 38Eh — 00Fh PORTD 08Fh TRISD 10Fh LATD 18Fh — 20Fh — 28Fh — 30Fh — 38Fh — 9 010h PORTE 090h TRISE 110h LATE 190h ANSELE 210h — 290h — 310h — 390h — 4 011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSP1BUF 291h CCPR1L 311h CCPR3L 391h — 7 012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSP1ADD 292h CCPR1H 312h CCPR3H 392h — 013h PIR3 093h PIE3 113h CM2CON0 193h EEDATL 213h SSP1MSK 293h CCP1CON 313h CCP3CON 393h — 014h PIR4 094h PIE4 114h CM2CON1 194h EEDATH 214h SSP1STAT 294h PWM1CON 314h PWM3CON 394h IOCBP 015h TMR0 095h OPTION_REG 115h CMOUT 195h EECON1 215h SSP1CON1 295h CCP1AS 315h CCP3AS 395h IOCBN 016h TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSP1CON2 296h PSTR1CON 316h PSTR3CON 396h IOCBF 017h TMR1H 097h WDTCON 117h FVRCON 197h — 217h SSP1CON3 297h — 317h — 397h — 018h T1CON 098h OSCTUNE 118h DACCON0 198h — 218h — 298h CCPR2L 318h CCPR4L 398h — 019h T1GCON 099h OSCCON 119h DACCON1 199h RC1REG 219h SSP2BUF 299h CCPR2H 319h CCPR4H 399h — 01Ah TMR2 09Ah OSCSTAT 11Ah SRCON0 19Ah TX1REG 21Ah SSP2ADD 29Ah CCP2CON 31Ah CCP4CON 39Ah — 01Bh PR2 09Bh ADRESL 11Bh SRCON1 19Bh SP1BRGL 21Bh SSP2MSK 29Bh PWM2CON 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SP1BRGH 21Ch SSP2STAT 29Ch CCP2AS 31Ch CCPR5L 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RC1STA 21Dh SSP2CON1 29Dh PSTR2CON 31Dh CCPR5H 39Dh — 01Eh CPSCON0 09Eh ADCON1 11Eh CM3CON0 19Eh TX1STA 21Eh SSP2CON2 29Eh CCPTMRS0 31Eh CCP5CON 39Eh —  2 01Fh CPSCON1 09Fh — 11Fh CM3CON1 19Fh BAUD1CON 21Fh SSP2CON3 29Fh CCPTMRS1 31Fh — 39Fh — 01 020h 0A0h 120h 1A0h 220h 2A0h 320h General Purpose 3A0h 0-20 PGuernpeorsael PGuernpeorsael PGuernpeorsael PGuernpeorsael PGuernpeorsael 32Fh 1R6e gBiystteesr PGuernpeorsael 1 6 Micro 06Fh PRGueergnpiesortseaerl 0EFh 8R0e gBiystteesr 16Fh 8R0e gBiystteesr 1EFh 8R0e gBiystteesr 26Fh 8R0e gBiystteesr 2EFh 8R0e gBiystteesr 3363F0hh Gen6e4Rr eBagly iPtseutser(rp1 o)se 3EFh 80R eBgyitsetse(r1) c 96 Bytes h 070h 0F0h 170h 1F0h 270h 2F0h 370h 3F0h ip T Accesses Accesses Accesses Accesses Accesses Accesses Accesses e 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh c hn 07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh o lo Legend: = Unimplemented data memory locations, read as ‘0’. gy Note 1: Not available on PIC16F1946. In c .

D TABLE 3-5: PIC16(L)F1946/47 MEMORY MAP, BANKS 8-15 P S 40 BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15 I 0 C 01 400h INDF0 480h INDF0 500h INDF0 580h INDF0 600h INDF0 680h INDF0 700h INDF0 780h INDF0 41 401h INDF1 481h INDF1 501h INDF1 581h INDF1 601h INDF1 681h INDF1 701h INDF1 781h INDF1 1 4 E 402h PCL 482h PCL 502h PCL 582h PCL 602h PCL 682h PCL 702h PCL 782h PCL 6 -page 440043hh SFTSART0ULS 448843hh SFTSART0ULS 550043hh SFTSART0ULS 558843hh SFTSART0ULS 660034hh SFTSART0ULS 668834hh SFTSART0ULS 770034hh SFTSART0ULS 778834hh SFTSART0ULS (L 2 405h FSR0H 485h FSR0H 505h FSR0H 585h FSR0H 605h FSR0H 685h FSR0H 705h FSR0H 785h FSR0H 5 ) 406h FSR1L 486h FSR1L 506h FSR1L 586h FSR1L 606h FSR1L 686h FSR1L 706h FSR1L 786h FSR1L F 407h FSR1H 487h FSR1H 507h FSR1H 587h FSR1H 607h FSR1H 687h FSR1H 707h FSR1H 787h FSR1H 408h BSR 488h BSR 508h BSR 588h BSR 608h BSR 688h BSR 708h BSR 788h BSR 1 409h WREG 489h WREG 509h WREG 589h WREG 609h WREG 689h WREG 709h WREG 789h WREG 9 40Ah PCLATH 48Ah PCLATH 50Ah PCLATH 58Ah PCLATH 60Ah PCLATH 68Ah PCLATH 70Ah PCLATH 78Ah PCLATH 4 40Bh INTCON 48Bh INTCON 50Bh INTCON 58Bh INTCON 60Bh INTCON 68Bh INTCON 70Bh INTCON 78Bh INTCON 6 40Ch ANSELF 48Ch — 50Ch — 58Ch — 60Ch — 68Ch — 70Ch — 78Ch — 40Dh ANSELG 48Dh WPUG 50Dh — 58Dh — 60Dh — 68Dh — 70Dh — 78Dh — /1 40Eh — 48Eh — 50Eh — 58Eh — 60Eh — 68Eh — 70Eh — 78Eh — 9 40Fh — 48Fh — 50Fh — 58Fh — 60Fh — 68Fh — 70Fh — 78Fh — 410h — 490h — 510h — 590h — 610h — 690h — 710h — 790h — 4 411h — 491h RC2REG 511h — 591h — 611h — 691h — 711h — 791h 7 412h — 492h TX2REG 512h — 592h — 612h — 692h — 712h — 792h 413h — 493h SP2BRGL 513h — 593h — 613h — 693h — 713h — 793h 414h — 494h SP2BRGH 514h — 594h — 614h — 694h — 714h — 794h 415h TMR4 495h RC2STA 515h — 595h — 615h — 695h — 715h — 795h 416h PR4 496h TX2STA 516h — 596h — 616h — 696h — 716h — 796h 417h T4CON 497h BAUD2CON 517h — 597h — 617h — 697h — 717h — 797h 418h — 498h — 518h — 598h — 618h — 698h — 718h — 798h 419h — 499h — 519h — 599h — 619h — 699h — 719h — 799h 41Ah — 49Ah — 51Ah — 59Ah — 61Ah — 69Ah — 71Ah — 79Ah 41Bh — 49Bh — 51Bh — 59Bh — 61Bh — 69Bh — 71Bh — 79Bh See Table3-8 41Ch TMR6 49Ch — 51Ch — 59Ch — 61Ch — 69Ch — 71Ch — 79Ch 41Dh PR6 49Dh — 51Dh — 59Dh — 61Dh — 69Dh — 71Dh — 79Dh 41Eh T6CON 49Eh — 51Eh — 59Eh — 61Eh — 69Eh — 71Eh — 79Eh  2 41Fh — 49Fh — 51Fh — 59Fh — 61Fh — 69Fh — 71Fh — 79Fh 01 420h 4A0h 520h 5A0h 620h General Purpose 6A0h 720h 7A0h 0-201 PGuernpeorsael PGuernpeorsael PGuernpeorsael PGuernpeorsael 48R eBgyitsetse(r1 ) Unimplemented Unimplemented 6 M 80R eBgyitsetse(r1) 80R eBgyitsetse(r1) 80R eBgyitsetse(r1) 80R eBgyitsetse(r1) Unimplemented Read as ‘0’ Read as ‘0’ icroc 46Fh 4EFh 56Fh 5EFh 66Fh Read as ‘0’ 6EFh 76Fh 7EFh h ip 470h 4F0h 570h 5F0h 670h 6F0h 770h 7F0h Te Accesses Accesses Accesses Accesses Accesses Accesses Accesses Accesses ch 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh n olo 47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh g y In LNeogteend:1: Not av=a iUlanbimle polenm PeICnt1e6dF d1a9t4a6 m. emory locations, read as ‘0’ c .

D TABLE 3-6: PIC16(L)F1946/47 MEMORY MAP, BANKS 16-23 P S 40 BANK 16 BANK 17 BANK 18 BANK 19 BANK 20 BANK 21 BANK 22 BANK 23 I 0 C 0 800h INDF0 880h INDF0 900h INDF0 980h INDF0 A00h INDF0 A80h INDF0 B00h INDF0 B80h INDF0 1 41 801h INDF1 881h INDF1 901h INDF1 981h INDF1 A01h INDF1 A81h INDF1 B01h INDF1 B81h INDF1 1 4E 802h PCL 882h PCL 902h PCL 982h PCL A02h PCL A82h PCL B02h PCL B82h PCL 6 -p 803h STATUS 883h STATUS 903h STATUS 983h STATUS A03h STATUS A83h STATUS B03h STATUS B83h STATUS ag 804h FSR0L 884h FSR0L 904h FSR0L 984h FSR0L A04h FSR0L A84h FSR0L B04h FSR0L B84h FSR0L ( e L 2 805h FSR0H 885h FSR0H 905h FSR0H 985h FSR0H A05h FSR0H A85h FSR0H B05h FSR0H B85h FSR0H 6 806h FSR1L 886h FSR1L 906h FSR1L 986h FSR1L A06h FSR1L A86h FSR1L B06h FSR1L B86h FSR1L ) F 807h FSR1H 887h FSR1H 907h FSR1H 987h FSR1H A07h FSR1H A87h FSR1H B07h FSR1H B87h FSR1H 808h BSR 888h BSR 908h BSR 988h BSR A08h BSR A88h BSR B08h BSR B88h BSR 1 809h WREG 889h WREG 909h WREG 989h WREG A09h WREG A89h WREG B09h WREG B89h WREG 9 80Ah PCLATH 88Ah PCLATH 90Ah PCLATH 98Ah PCLATH A0Ah PCLATH A8Ah PCLATH B0Ah PCLATH B8Ah PCLATH 4 80Bh INTCON 88Bh INTCON 90Bh INTCON 98Bh INTCON A0Bh INTCON A8Bh INTCON B0Bh INTCON B8Bh INTCON 6 80Ch — 88Ch — 90Ch — 98Ch — A0Ch — A8Ch — B0Ch — B8Ch — 80Dh — 88Dh — 90Dh — 98Dh — A0Dh — A8Dh — B0Dh — B8Dh — / 1 80Eh — 88Eh — 90Eh — 98Eh — A0Eh — A8Eh — B0Eh — B8Eh — 80Fh — 88Fh — 90Fh — 98Fh — A0Fh — A8Fh — B0Fh — B8Fh — 9 810h — 890h — 910h — 990h — A10h — A90h — B10h — B90h — 4 811h — 891h — 911h — 991h — A11h — A91h — B11h — B91h — 7 812h — 892h — 912h — 992h — A12h — A92h — B12h — B92h — 813h — 893h — 913h — 993h — A13h — A93h — B13h — B93h — 814h — 894h — 914h — 994h — A14h — A94h — B14h — B94h — 815h — 895h — 915h — 995h — A15h — A95h — B15h — B95h — 816h — 896h — 916h — 996h — A16h — A96h — B16h — B96h — 817h — 897h — 917h — 997h — A17h — A97h — B17h — B97h — 818h — 898h — 918h — 998h — A18h — A98h — B18h — B98h — 819h — 899h — 919h — 999h — A19h — A99h — B19h — B99h — 81Ah — 89Ah — 91Ah — 99Ah — A1Ah — A9Ah — B1Ah — B9Ah — 81Bh — 89Bh — 91Bh — 99Bh — A1Bh — A9Bh — B1Bh — B9Bh — 81Ch — 89Ch — 91Ch — 99Ch — A1Ch — A9Ch — B1Ch — B9Ch — 81Dh — 89Dh — 91Dh — 99Dh — A1Dh — A9Dh — B1Dh — B9Dh — 81Eh — 89Eh — 91Eh — 99Eh — A1Eh — A9Eh — B1Eh — B9Eh —  81Fh — 89Fh — 91Fh — 99Fh — A1Fh — A9Fh — B1Fh — B9Fh — 20 820h 8A0h 920h 9A0h A20h AA0h B20h BA0h 1 0 -20 Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented 16 Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ M icro 86Fh 8EFh 96Fh 9EFh A6Fh AEFh B6Fh BEFh ch 870h 8F0h 970h 9F0h A70h AF0h B70h BF0h ip Accesses Accesses Accesses Accesses Accesses Accesses Accesses Accesses T 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh e c h 87Fh 8FFh 97Fh 9FFh A7Fh AFFh B7Fh BFFh n o log Legend: = Unimplemented data memory locations, read as ‘0’. y In c .

D TABLE 3-7: PIC16(L)F1946/47 MEMORY MAP, BANKS 24-31 P S 40 BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30 BANK 31 I 0 C 01 C00h INDF0 C80h INDF0 D00h INDF0 D80h INDF0 E00h INDF0 E80h INDF0 F00h INDF0 F80h INDF0 41 C01h INDF1 C81h INDF1 D01h INDF1 D81h INDF1 E01h INDF1 E81h INDF1 F01h INDF1 F81h INDF1 1 4 E C02h PCL C82h PCL D02h PCL D82h PCL E02h PCL E82h PCL F02h PCL F82h PCL 6 -p C03h STATUS C83h STATUS D03h STATUS D83h STATUS E03h STATUS E83h STATUS F03h STATUS F83h STATUS age C04h FSR0L C84h FSR0L D04h FSR0L D84h FSR0L E04h FSR0L E84h FSR0L F04h FSR0L F84h FSR0L (L 2 C05h FSR0H C85h FSR0H D05h FSR0H D85h FSR0H E05h FSR0H E85h FSR0H F05h FSR0H F85h FSR0H 7 ) C06h FSR1L C86h FSR1L D06h FSR1L D86h FSR1L E06h FSR1L E86h FSR1L F06h FSR1L F86h FSR1L F C07h FSR1H C87h FSR1H D07h FSR1H D87h FSR1H E07h FSR1H E87h FSR1H F07h FSR1H F87h FSR1H C08h BSR C88h BSR D08h BSR D88h BSR E08h BSR E88h BSR F08h BSR F88h BSR 1 C09h WREG C89h WREG D09h WREG D89h WREG E09h WREG E89h WREG F09h WREG F89h WREG 9 C0Ah PCLATH C8Ah PCLATH D0Ah PCLATH D8Ah PCLATH E0Ah PCLATH E8Ah PCLATH F0Ah PCLATH F8Ah PCLATH 4 C0Bh INTCON C8Bh INTCON D0Bh INTCON D8Bh INTCON E0Bh INTCON E8Bh INTCON F0Bh INTCON F8Bh INTCON 6 C0Ch — C8Ch — D0Ch — D8Ch — E0Ch — E8Ch — F0Ch — F8Ch C0Dh — C8Dh — D0Dh — D8Dh — E0Dh — E8Dh — F0Dh — F8Dh / 1 C0Eh — C8Eh — D0Eh — D8Eh — E0Eh — E8Eh — F0Eh — F8Eh 9 C0Fh — C8Fh — D0Fh — D8Fh — E0Fh — E8Fh — F0Fh — F8Fh C10h — C90h — D10h — D90h — E10h — E90h — F10h — F90h 4 C11h — C91h — D11h — D91h — E11h — E91h — F11h — F91h 7 C12h — C92h — D12h — D92h — E12h — E92h — F12h — F92h C13h — C93h — D13h — D93h — E13h — E93h — F13h — F93h C14h — C94h — D14h — D94h — E14h — E94h — F14h — F94h C15h — C95h — D15h — D95h — E15h — E95h — F15h — F95h C16h — C96h — D16h — D96h — E16h — E96h — F16h — F96h C17h — C97h — D17h — D97h — E17h — E97h — F17h — F97h C18h — C98h — D18h — D98h — E18h — E98h — F18h — F98h See Table3-9 C19h — C99h — D19h — D99h — E19h — E99h — F19h — F99h C1Ah — C9Ah — D1Ah — D9Ah — E1Ah — E9Ah — F1Ah — F9Ah C1Bh — C9Bh — D1Bh — D9Bh — E1Bh — E9Bh — F1Bh — F9Bh C1Ch — C9Ch — D1Ch — D9Ch — E1Ch — E9Ch — F1Ch — F9Ch C1Dh — C9Dh — D1Dh — D9Dh — E1Dh — E9Dh — F1Dh — F9Dh C1Eh — C9Eh — D1Eh — D9Eh — E1Eh — E9Eh — F1Eh — F9Eh  2 C1Fh — C9Fh — D1Fh — D9Fh — E1Fh — E9Fh — F1Fh — F9Fh 0 C20h CA0h D20h DA0h E20h EA0h F20h FA0h 1 0 -2 0 Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented 16 Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ M ic ro C6Fh CEFh D6Fh DEFh E6Fh EEFh F6Fh FEFh ch C70h CF0h D70h DF0h E70h EF0h F70h FF0h ip T Accesses Accesses Accesses Accesses Accesses Accesses Accesses Accesses e 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh 70h – 7Fh c hn CFFh CFFh D7Fh DFFh E7Fh EFFh F7Fh FFFh o log Legend: = Unimplemented data memory locations, read as ‘0’. y In c .

PIC16(L)F1946/1947 TABLE 3-8: PIC16(L)F1946/47 MEMORY TABLE 3-9: PIC16(L)F1946/47 MEMORY MAP, BANK 15 MAP, BANK 31 Bank 15 Bank 31 791h LCDCON F8Ch — 792h LCDPS F8Dh — 793h LCDREF F8Eh — 794h LCDCST F8Fh — F90h — 795h LCDRL F91h — 796h — F92h — 797h — F93h — 798h LCDSE0 F94h — 799h LCDSE1 F95h — 79Ah LCDSE2 F96h — 79Bh LCDSE3 F97h — 79Ch LCDSE4 F98h — 79Dh LCDSE5 F99h — 79Eh — F9Ah — 79Fh — F9Bh — 7A0h LCDDATA0 F9Ch — 7A1h LCDDATA1 F9Dh — 7A2h LCDDATA2 F9Eh — 7A3h LCDDATA3 F9Fh — 7A4h LCDDATA4 7A5h LCDDATA5 FA0h — 7A6h LCDDATA6 FA1h — 7A7h LCDDATA7 FA2h — 7A8h LCDDATA8 FA3h — 7A9h LCDDATA9 FA4h — 7AAh LCDDATA10 FA5h — 7ABh LCDDATA11 FA6h — 7ACh LCDDATA12 7ADh LCDDATA13 FA7h — 7AEh LCDDATA14 FA8h — 7AFh LCDDATA15 FA9h — 7B0h LCDDATA16 FAAh — 7B1h LCDDATA17 FABh — 7B2h LCDDATA18 7B3h LCDDATA19 FDFh — 7B4h LCDDATA20 FC0h — 7B5h LCDDATA21 FDFh — 7B6h LCDDATA22 FE0h — 7B7h LCDDATA23 FE1h — 7B8h FE2h — Unimplemented FE3h — Read as ‘0’ FE4h STATUS_SHAD FE5h WREG_SHAD 7EFh FE6h BSR_SHAD Legend: = Unimplemented data memory locations, read FE7h PCLATH_SHAD as ‘0’. FE8h FSR0L_SHAD FE9h FSR0H_SHAD FEAh FSR1L_SHAD FEBh FSR1H_SHAD FECh — FEDh STKPTR FEEh TOSL FEFh TOSH Legend: = Unimplemented data memory locations, read as ‘0’. DS40001414E-page 28  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 3.3.5 SPECIAL FUNCTION REGISTERS SUMMARY The Special Function Register Summary for the device family are as follows: Device Bank(s) Page No. 0 30 1 31 2 32 3 33 4 34 5 35 PIC16(L)F1946/1947 6 36 7 37 8 38 9-14 40 15 41 16-30 44 31 45  2010-2016 Microchip Technology Inc. DS40001414E-page 29

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 0 000h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 001h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 002h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 003h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 004h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 005h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 006h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 007h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 008h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 009h(2) WREG Working Register 0000 0000 uuuu uuuu 00Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 00Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 00Ch PORTA PORTA Data Latch when written: PORTA pins when read xxxx xxxx uuuu uuuu 00Dh PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu 00Eh PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu 00Fh PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx uuuu uuuu 010h PORTE PORTE Data Latch when written: PORTE pins when read xxxx xxxx xxxx uuuu 011h PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 012h PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 0000 0000 0000 0000 013h PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — -000 0-0- -000 0-0- 014h PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF --00 --00 --00 --00 015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 018h T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 0000 00-0 uuuu uu-u 019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu DONE 01Ah TMR2 Timer 2 Module Register 0000 0000 0000 0000 01Bh PR2 Timer 2 Period Register 1111 1111 1111 1111 01Ch T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 01Dh — Unimplemented — — 01Eh CPSCON0 CPSON CPSRM — — CPSRNG1 CPSRNG0 CPSOUT T0XCS 00-- 0000 00-- 0000 01Fh CPSCON1 — — — CPSCH<4:0> ---0 0000 ---0 0000 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 30  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 1 080h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 081h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 082h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 083h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 084h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 085h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 086h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 087h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 088h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 089h(2) WREG Working Register 0000 0000 uuuu uuuu 08Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 08Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 08Ch TRISA PORTA Data Direction Register 1111 1111 1111 1111 08Dh TRISB PORTB Data Direction Register 1111 1111 1111 1111 08Eh TRISC PORTC Data Direction Register 1111 1111 1111 1111 08Fh TRISD PORTD Data Direction Register 1111 1111 1111 1111 090h TRISE PORTE Data Direction Register 1111 1111 1111 1111 091h PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 092h PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 0000 0000 0000 0000 093h PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — -000 0-0- -000 0-0- 094h PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE --00 --00 --00 --00 095h OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 1111 1111 1111 1111 096h PCON STKOVF STKUNF — — RMCLR RI POR BOR 00-- 11qq qq-- qquu 097h WDTCON — — WDTPS<4:0> SWDTEN --01 0110 --01 0110 098h OSCTUNE — — TUN<5:0> --00 0000 --00 0000 099h OSCCON SPLLEN IRCF<3:0> — SCS<1:0> 0011 1-00 0011 1-00 09Ah OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 00q0 0q0- qqqq qq0- 09Bh ADRESL A/D Result Register Low xxxx xxxx uuuu uuuu 09Ch ADRESH A/D Result Register High xxxx xxxx uuuu uuuu 09Dh ADCON0 — CHS<4:0> GO/DONE ADON -000 0000 -000 0000 09Eh ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF1 ADPREF0 0000 -000 0000 -000 09Fh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 31

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 2 100h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 101h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 102h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 103h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 104h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 105h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 106h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 107h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 108h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 109h(2) WREG Working Register 0000 0000 uuuu uuuu 10Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 10Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 10Ch LATA PORTA Data Latch xxxx xxxx uuuu uuuu 10Dh LATB PORTB Data Latch xxxx xxxx uuuu uuuu 10Eh LATC PORTC Data Latch xxxx xxxx uuuu uuuu 10Fh LATD PORTD Data Latch xxxx xxxx uuuu uuuu 110h LATE PORTE Data Latch xxxx xxxx uuuu uuuu 111h CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 0000 -100 0000 -100 112h CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0 — — C1NCH<1:0> 0000 --00 0000 --00 113h CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 0000 -100 0000 -100 114h CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0 — — C2NCH<1:0> 0000 --00 0000 --00 115h CMOUT — — — — — MC3OUT MC2OUT MC1OUT ---- -000 ---- -000 116h BORCON SBOREN — — — — — — BORRDY 1--- ---q u--- ---u 117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR1 CDAFVR0 ADFVR<1:0> 0q00 0000 0q00 0000 118h DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 000- 00-0 000- 00-0 119h DACCON1 — — — DACR<4:0> ---0 0000 ---0 0000 11Ah SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR 0000 0000 0000 0000 11Bh SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 0000 0000 0000 0000 11Ch — Unimplemented — — 11Dh APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 0000 0000 0000 0000 11Eh CM3CON0 C3ON C3OUT C3OE C3POL — C3SP C3HYS C3SYNC 0000 -100 0000 -100 11Fh CM3CON1 C3INTP C3INTN C3PCH1 C3PCH0 — — C3NCH<1:0> 0000 --00 0000 --00 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 32  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 3 180h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 181h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 182h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 183h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 184h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 185h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 186h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 187h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 188h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 189h(2) WREG Working Register 0000 0000 uuuu uuuu 18Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 18Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 18Ch ANSELA — — ANSA5 — ANSA3 ANSA2 ANSA1 ANSA0 --1- 1111 --1- 1111 18Dh — Unimplemented — — 18Eh — Unimplemented — — 18Fh — Unimplemented — — 190h ANSELE — — — — — ANSE2 ANSE1 ANSE0 ---- -111 ---- -111 191h EEADRL EEPROM / Program Memory Address Register Low Byte 0000 0000 0000 0000 192h EEADRH —(3) EEPROM / Program Memory Address Register High Byte 1000 0000 1000 0000 193h EEDATL EEPROM / Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu 194h EEDATH — — EEPROM / Program Memory Read Data Register High Byte --xx xxxx --uu uuuu 195h EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 0000 x000 0000 q000 196h EECON2 EEPROM control register 2 0000 0000 0000 0000 197h — Unimplemented — — 198h — Unimplemented — — 199h RC1REG USART Receive Data Register 0000 0000 0000 0000 19Ah TX1REG USART Transmit Data Register 0000 0000 0000 0000 19Bh SP1BRGL EUSART1 Baud Rate Generator, Low Byte 0000 0000 0000 0000 19Ch SP1BRGH EUSART1 Baud Rate Generator, High Byte 0000 0000 0000 0000 19Dh RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19Eh TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010 19Fh BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 33

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 4 200h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 201h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 202h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 203h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 204h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 205h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 206h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 207h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 208h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 209h(2) WREG Working Register 0000 0000 uuuu uuuu 20Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 20Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 20Ch — Unimplemented — — 20Dh WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111 20Eh — Unimplemented — — 20Fh — Unimplemented — — 210h — Unimplemented — — 211h SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 212h SSP1ADD ADD<7:0> 0000 0000 0000 0000 213h SSP1MSK MSK<7:0> 1111 1111 1111 1111 214h SSP1STAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 215h SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 0000 0000 0000 0000 216h SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 217h SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 218h — Unimplemented — — 219h SSP2BUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 21Ah SSP2ADD ADD<7:0> 0000 0000 0000 0000 21Bh SSP2MSK MSK<7:0> 1111 1111 1111 1111 21Ch SSP2STAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 21Dh SSP2CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 0000 0000 0000 0000 21Eh SSP2CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 21Fh SSP2CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 34  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 5 280h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 281h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 282h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 283h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 284h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 285h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 286h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 287h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 288h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 289h(2) WREG Working Register 0000 0000 uuuu uuuu 28Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 28Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 28Ch PORTF PORTF Data Latch when written: PORTF pins when read xxxx xxxx uuuu uuuu 28Dh PORTG — — RG5 RG4 RG3 RG2 RG1 RG0 --xx xxxx --uu uuuu 28Eh — Unimplemented — — 28Fh — Unimplemented — — 290h — Unimplemented — — 291h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu 292h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu 293h CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 0000 0000 0000 0000 294h PWM1CON P1RSEN P1DC<6:0> 0000 0000 0000 0000 295h CCP1AS CCP1ASE CCP1AS<2:0> PSS1AC<1:0> PSS1BD<1:0> 0000 0000 0000 0000 296h PSTR1CON — — — STR1SYNC STR1D STR1C STR1B STR1A ---0 0001 ---0 0001 297h — Unimplemented — — 298h CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu 299h CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu 29Ah CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 0000 0000 0000 0000 29Bh PWM2CON P2RSEN P2DC<6:0> 0000 0000 0000 0000 29Ch CCP2AS CCP2ASE CCP2AS<2:0> PSS2AC<1:0> PSS2BD<1:0> 0000 0000 0000 0000 29Dh PSTR2CON — — — STR2SYNC STR2D STR2C STR2B STR2A ---0 0001 ---0 0001 29Eh CCPTMRS0 C4TSEL1 C4TSEL0 C3TSEL1 C3TSEL0 C2TSEL1 C2TSEL0 C1TSEL1 C1TSEL0 0000 0000 0000 0000 29Fh CCPTMRS1 — — — — — — C5TSEL<1:0> ---- --00 ---- --00 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 35

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 6 300h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 301h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 302h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 303h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 304h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 305h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 306h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 307h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 308h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 309h(2) WREG Working Register 0000 0000 uuuu uuuu 30Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 30Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 30Ch TRISF PORTF Data Direction Register 1111 1111 1111 1111 30Dh TRISG — — TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 --11 1111 --11 1111 30Eh — Unimplemented — — 30Fh — Unimplemented — — 310h — Unimplemented — — 311h CCPR3L Capture/Compare/PWM Register 3 (LSB) xxxx xxxx uuuu uuuu 312h CCPR3H Capture/Compare/PWM Register 3 (MSB) xxxx xxxx uuuu uuuu 313h CCP3CON P3M<1:0> DC3B<1:0> CCP3M<1:0> 0000 0000 0000 0000 314h PWM3CON P3RSEN P3DC<6:0> 0000 0000 0000 0000 315h CCP3AS CCP3ASE CCP3AS<2:0> PSS3AC<1:0> PSS3BD<1:0> 0000 0000 0000 0000 316h PSTR3CON — — — STR3SYNC STR3D STR3C STR3B STR3A ---0 0001 ---0 0001 317h — Unimplemented — — 318h CCPR4L Capture/Compare/PWM Register 4 (LSB) xxxx xxxx uuuu uuuu 319h CCPR4H Capture/Compare/PWM Register 4 (MSB) xxxx xxxx uuuu uuuu 31Ah CCP4CON — — DC4B<1:0> CCP4M<3:0> --00 0000 --00 0000 31Bh — Unimplemented — — 31Ch CCPR5L Capture/Compare/PWM Register 5 (LSB) xxxx xxxx uuuu uuuu 31Dh CCPR5H Capture/Compare/PWM Register 5 (MSB) xxxx xxxx uuuu uuuu 31Eh CCP5CON — — DC5B<1:0> CCP5M<3:0> --00 0000 --00 0000 31Fh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 36  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 7 380h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 381h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 382h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 383h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 384h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 385h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 386h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 387h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 388h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 389h(2) WREG Working Register 0000 0000 uuuu uuuu 38Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 38Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 38Ch LATF PORTF Data Latch xxxx xxxx uuuu uuuu 38Dh LATG — — LATG5 LATG4 LATG3 LATG2 LATG1 LATG0 --xx xxxx --uu uuuu 38Eh — Unimplemented — — 38Fh — Unimplemented — — 390h — Unimplemented — — 391h — Unimplemented — — 392h — Unimplemented — — 393h — Unimplemented — — 394h IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 0000 0000 0000 0000 395h IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 0000 0000 0000 0000 396h IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 0000 0000 0000 0000 397h — Unimplemented — — 398h — Unimplemented — — 399h — Unimplemented — — 39Ah — Unimplemented — — 39Bh — Unimplemented — — 39Ch — Unimplemented — — 39Dh — Unimplemented — — 39Eh — Unimplemented — — 39Fh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 37

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 8 400h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 401h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 402h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 403h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 404h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 405h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 406h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 407h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 408h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 409h(2) WREG Working Register 0000 0000 uuuu uuuu 40Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 40Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 40Ch ANSELF ANSELF7 ANSELF6 ANSELF5 ANSELF4 ANSELF3 ANSELF2 ANSELF1 ANSELF0 1111 1111 1111 1111 40Dh ANSELG — — — ANSELG4 ANSELG3 ANSELG2 ANSELG1 — ---1 111- ---1 111- 40Eh — Unimplemented — — 40Fh — Unimplemented — — 410h — Unimplemented — — 411h — Unimplemented — — 412h — Unimplemented — — 413h — Unimplemented — — 414h — Unimplemented — — 415h TMR4 Timer 4 Module Register 0000 0000 0000 0000 416h PR4 Timer 4 Period Register 1111 1111 1111 1111 417h T4CON — T4OUTPS<3:0> TMR4ON T4CKPS<1:0> -000 0000 -000 0000 418h — Unimplemented — — 419h — Unimplemented — — 41Ah — Unimplemented — — 41Bh — Unimplemented — — 41Ch TMR6 Timer 6 Module Register 0000 0000 0000 0000 41Dh PR6 Timer 6 Period Register 1111 1111 1111 1111 41Eh T6CON — T6OUTPS<3:0> TMR6ON T6CKPS<1:0> -000 0000 -000 0000 41Fh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 38  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 9 480h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 481h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 482h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 483h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 404h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 485h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 486h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 487h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 488h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 489h(2) WREG Working Register 0000 0000 uuuu uuuu 48Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 48Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 48Ch — Unimplemented — — 48Dh WPUG — — WPUG5 — — — — — --1- ---- --1- ---- 48Eh — Unimplemented — — 48Fh — Unimplemented — — 490h — Unimplemented — — 491h RC2REG USART Receive Data Register 0000 0000 0000 0000 492h TX2REG USART Transmit Data Register 0000 0000 0000 0000 493h SP2BRGL EUSART2 Baud Rate Generator, Low Byte 0000 0000 0000 0000 494h SP2BRGH EUSART2 Baud Rate Generator, High Byte 0000 0000 0000 0000 495h RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 496h TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010 497h BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00 498h — Unimplemented — — 499h — Unimplemented — — 49Ah — Unimplemented — — 49Bh — Unimplemented — — 49Ch — Unimplemented — — 49Dh — Unimplemented — — 49Eh — Unimplemented — — 49Fh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 39

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Banks 10-14 x00h/ INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx x80h(2) (not a physical register) x00h/ INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx x81h(2) (not a physical register) x02h/ PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x82h(2) x03h/ STATUS — — — TO PD Z DC C ---1 1000 ---q quuu x83h(2) x04h/ FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x84h(2) x05h/ FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x85h(2) x06h/ FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x86h(2) x07h/ FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x87h(2) x08h/ BSR — — — BSR<4:0> ---0 0000 ---0 0000 x88h(2) x09h/ WREG Working Register 0000 0000 uuuu uuuu x89h(2) x0Ah/ PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 x8Ah(1),(2) x0Bh/ INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u x8Bh(2) x0Ch/ — Unimplemented — — x8Ch — x1Fh/ x9Fh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 40  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 15 780h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 781h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) 782h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 783h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu 784h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 785h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 786h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 787h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 788h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 789h(2) WREG Working Register 0000 0000 uuuu uuuu 78Ah(1, 2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 78Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u 78Ch — Unimplemented — — 78Dh — Unimplemented — — 78Eh — Unimplemented — — 78Fh — Unimplemented — — 790h — Unimplemented — — 791h LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 000- 0011 000- 0011 792h LCDPS WFT BIASMD LCDA WA LP<3:0> 0000 0000 0000 0000 793h LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — 000- 000- 000- 000- 794h LCDCST — — — — — LCDCST<2:0> ---- -000 ---- -000 795h LCDRL LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> 0000 -000 0000 -000 796h — Unimplemented — — 797h — Unimplemented — — 798h LCDSE0 SE<7:0> 0000 0000 uuuu uuuu 799h LCDSE1 SE<15:8> 0000 0000 uuuu uuuu 79Ah LCDSE2 SE<23:16> 0000 0000 uuuu uuuu 79Bh LCDSE3 SE<31:24> 0000 0000 uuuu uuuu 79Ch LCDSE4 SE<39:32> 0000 0000 uuuu uuuu 79Dh LCDSE5 — — SE<45:40> --00 0000 --uu uuuu 79Eh — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 41

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets 79Fh — Unimplemented — — 7A0h LCDDATA0 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 xxxx xxxx uuuu uuuu COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 7A1h LCDDATA1 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 xxxx xxxx uuuu uuuu COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 7A2h LCDDATA2 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 xxxx xxxx uuuu uuuu COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 7A3h LCDDATA3 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 xxxx xxxx uuuu uuuu COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 7A4h LCDDATA4 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 xxxx xxxx uuuu uuuu COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 7A5h LCDDATA5 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 xxxx xxxx uuuu uuuu COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 42  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 15 (Continued) 7A6h LCDDATA6 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 xxxx xxxx uuuu uuuu COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 7A7h LCDDATA7 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 xxxx xxxx uuuu uuuu COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 7A8h LCDDATA8 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 xxxx xxxx uuuu uuuu COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 7A9h LCDDATA9 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 xxxx xxxx uuuu uuuu COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 7AAh LCDDATA10 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 xxxx xxxx uuuu uuuu COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 7ABh LCDDATA11 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 xxxx xxxx uuuu uuuu COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 7ACh LCDDATA12 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 xxxx xxxx uuuu uuuu COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 7ADh LCDDATA13 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 xxxx xxxx uuuu uuuu COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 7AEh LCDDATA14 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 --xx xxxx --uu uuuu COM0 COM0 COM0 COM0 COM0 COM0 7AFh LCDDATA15 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 xxxx xxxx uuuu uuuu COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 7B0h LCDDATA16 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 xxxx xxxx uuuu uuuu COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 7B1h LCDDATA17 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 --xx xxxx --uu uuuu COM1 COM1 COM1 COM1 COM1 COM1 7B2h LCDDATA18 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 xxxx xxxx uuuu uuuu COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 7B3h LCDDATA19 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 xxxx xxxx uuuu uuuu COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 7B4h LCDDATA20 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 --xx xxxx --uu uuuu COM2 COM2 COM2 COM2 COM2 COM2 7B5h LCDDATA21 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 xxxx xxxx uuuu uuuu COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 7B6h LCDDATA22 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 xxxx xxxx uuuu uuuu COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 7B7h LCDDATA23 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 --xx xxxx --uu uuuu COM3 COM3 COM3 COM3 COM3 COM3 7B8h — Unimplemented — — — 7EFh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 43

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Banks 16-30 x00h/ INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx x80h(2) (not a physical register) x00h/ INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx x81h(2) (not a physical register) x02h/ PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x82h(2) x03h/ STATUS — — — TO PD Z DC C ---1 1000 ---q quuu x83h(2) x04h/ FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x84h(2) x05h/ FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x85h(2) x06h/ FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x86h(2) x07h/ FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x87h(2) x08h/ BSR — — — BSR<4:0> ---0 0000 ---0 0000 x88h(2) x09h/ WREG Working Register 0000 0000 uuuu uuuu x89h(2) x0Ah/ PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 x8Ah(1),(2) x0Bh/ INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u x8Bh(2) x0Ch/ — Unimplemented — — x8Ch — x1Fh/ x9Fh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’. DS40001414E-page 44  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 TABLE 3-10: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 31 F80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory xxxx xxxx xxxx xxxx (not a physical register) F81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory xxxx xxxx xxxx xxxx (not a physical register) F82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 F83h(2) STATUS — — — TO PD Z DC C ---1 1000 ---q quuu F84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu F85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 F86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu F87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 F88h(2) BSR — — — BSR<4:0> ---0 0000 ---0 0000 F89h(2) WREG Working Register 0000 0000 uuuu uuuu F8Ah(1),(2) PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 F8Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 000x 0000 000u F8Ch — Unimplemented — — — FE3h FE4h STATUS_ Z DC C ---- -xxx ---- -uuu SHAD FE5h WREG_ Working Register Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FE6h BSR_ Bank Select Register Normal (Non-ICD) Shadow ---x xxxx ---u uuuu SHAD FE7h PCLATH_ Program Counter Latch High Register Normal (Non-ICD) Shadow -xxx xxxx uuuu uuuu SHAD FE8h FSR0L_ Indirect Data Memory Address 0 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FE9h FSR0H_ Indirect Data Memory Address 0 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FEAh FSR1L_ Indirect Data Memory Address 1 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FEBh FSR1H_ Indirect Data Memory Address 1 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FECh — Unimplemented — — FEDh STKPTR — — — Current Stack Pointer ---1 1111 ---1 1111 FEEh TOSL Top of Stack Low byte xxxx xxxx uuuu uuuu FEFh TOSH — Top of Stack High byte -xxx xxxx -uuu uuuu Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<14:8>, whose contents are transferred to the upper byte of the program counter. 2: These registers can be addressed from any bank. 3: Unimplemented, read as ‘1’.  2010-2016 Microchip Technology Inc. DS40001414E-page 45

PIC16(L)F1946/1947 3.4 PCL and PCLATH 3.4.3 COMPUTED FUNCTION CALLS The Program Counter (PC) is 15-bit wide. The low byte A computed function CALL allows programs to maintain comes from the PCL register, which is a readable and tables of functions and provide another way to execute writable register. The high byte (PC<14:8>) is not directly state machines or look-up tables. When performing a readable or writable and comes from PCLATH. On any table read using a computed function CALL, care Reset, the PC is cleared. Figure3-4 shows the five should be exercised if the table location crosses a PCL situations for the loading of the PC. memory boundary (each 256-byte block). If using the CALL instruction, the PCH<2:0> and PCL FIGURE 3-4: LOADING OF PC IN registers are loaded with the operand of the CALL DIFFERENT SITUATIONS instruction. PCH<6:3> is loaded with PCLATH<6:3>. The CALLW instruction enables computed calls by 14 PCH PCL 0 Instruction with PC PCL as combining PCLATH and W to form the destination Destination address. A computed CALLW is accomplished by 6 7 0 8 loading the W register with the desired address and PCLATH ALU Result executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. 14 PCH PCL 0 3.4.4 BRANCHING PC GOTO, CALL The branching instructions add an offset to the PC. 6 4 0 11 This allows relocatable code and code that crosses PCLATH OPCODE <10:0> page boundaries. There are two forms of branching, 14 PCH PCL 0 BRW and BRA. The PC will have incremented to fetch PC CALLW the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be 6 7 0 8 crossed. PCLATH W If using BRW, load the W register with the desired 14 PCH PCL 0 unsigned address and execute BRW. The entire PC will PC BRW be loaded with the address PC + 1 + W. If using BRA, the entire PC will be loaded with PC+1+, 15 PC + W the signed value of the operand of the BRA instruction. 14 PCH PCL 0 PC BRA 15 PC + OPCODE <8:0> 3.4.1 MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper seven bits to the PCLATH register. When the lower eight bits are written to the PCL register, all 15 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 3.4.2 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the Application Note AN556, Implementing a Table Read (DS00556). DS40001414E-page 46  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 3.5 Stack 3.5.1 ACCESSING THE STACK All devices have a 16-levelx15-bit wide hardware The stack is available through the TOSH, TOSL and stack (refer to Figures3-4 and3-5). The stack space is STKPTR registers. STKPTR is the current value of the not part of either program or data space. The PC is Stack Pointer. TOSH:TOSL register pair points to the PUSHed onto the stack when CALL or CALLW instruc- TOP of the stack. Both registers are read/writable. TOS tions are executed or an interrupt causes a branch. The is split into TOSH and TOSL due to the 15-bit size of the stack is POPed in the event of a RETURN, RETLW or a PC. To access the stack, adjust the value of STKPTR, RETFIE instruction execution. PCLATH is not affected which will position TOSH:TOSL, then read/write to by a PUSH or POP operation. TOSH:TOSL. STKPTR has five bits to allow detection of overflow and underflow. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0‘ (Configuration Words). This Note: Care should be taken when modifying the means that after the stack has been PUSHed sixteen STKPTR while interrupts are enabled. times, the seventeenth PUSH overwrites the value that During normal program operation, CALL, CALLW and was stored from the first PUSH. The eighteenth PUSH Interrupts will increment STKPTR while RETLW, overwrites the second PUSH (and so on). The RETURN, and RETFIE will decrement STKPTR. At any STKOVF and STKUNF flag bits will be set on an Over- time STKPTR can be inspected to see how much stack flow/Underflow, regardless of whether the Reset is is left. The STKPTR always points at the currently used enabled. place on the stack. Therefore, a CALL or CALLW will Note1: There are no instructions/mnemonics increment the STKPTR and then write the PC, and a called PUSH or POP. These are actions return will unload the PC and then decrement the that occur from the execution of the STKPTR. CALL, CALLW, RETURN, RETLW and Reference Figure3-5 through Figure3-5 for examples RETFIE instructions or the vectoring to of accessing the stack. an interrupt address. FIGURE 3-5: ACCESSING THE STACK EXAMPLE 1 Stack Reset Disabled TOSH:TOSL 0x0F STKPTR = 0x1F (STVREN = 0) 0x0E 0x0D 0x0C 0x0B 0x0A Initial Stack Configuration: 0x09 After Reset, the stack is empty. The 0x08 empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack 0x07 Overflow/Underflow Reset is enabled, the 0x06 TOSH/TOSL registers will return ‘0’. If the Stack Overflow/Underflow Reset is 0x05 disabled, the TOSH/TOSL registers will return the contents of stack address 0x0F. 0x04 0x03 0x02 0x01 0x00 Stack Reset Enabled TOSH:TOSL 0x1F 0x0000 STKPTR = 0x1F (STVREN = 1)  2010-2016 Microchip Technology Inc. DS40001414E-page 47

PIC16(L)F1946/1947 FIGURE 3-6: ACCESSING THE STACK EXAMPLE 2 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 This figure shows the stack configuration after the first CALL or a single interrupt. 0x08 If a RETURN instruction is executed, the return address will be placed in the 0x07 Program Counter and the Stack Pointer 0x06 decremented to the empty state (0x1F). 0x05 0x04 0x03 0x02 0x01 TOSH:TOSL 0x00 Return Address STKPTR = 0x00 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 3 0x0F 0x0E 0x0D 0x0C After seven CALLs or six CALLs and an 0x0B interrupt, the stack looks like the figure on the left. A series of RETURN instructions 0x0A will repeatedly place the return addresses into the Program Counter and pop the stack. 0x09 0x08 0x07 TOSH:TOSL 0x06 Return Address STKPTR = 0x06 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address DS40001414E-page 48  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 FIGURE 3-8: ACCESSING THE STACK EXAMPLE 4 0x0F Return Address 0x0E Return Address 0x0D Return Address 0x0C Return Address 0x0B Return Address 0x0A Return Address When the stack is full, the next CALL or 0x09 Return Address an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 0x08 Return Address so the stack will wrap and overwrite the return address at 0x00. If the Stack 0x07 Return Address Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will 0x06 Return Address not be overwritten. 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address TOSH:TOSL 0x00 Return Address STKPTR = 0x10 3.5.2 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Words is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.6 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory  2010-2016 Microchip Technology Inc. DS40001414E-page 49

PIC16(L)F1946/1947 FIGURE 3-9: INDIRECT ADDRESSING 0x0000 0x0000 Traditional Data Memory 0x0FFF 0x0FFF 0x1000 Reserved 0x1FFF 0x2000 Linear Data Memory 0x29AF 0x29B0 FSR Reserved 0x7FFF Address Range 0x8000 0x0000 Program Flash Memory 0xFFFF 0x7FFF Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits. DS40001414E-page 50  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 3.6.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-10: TRADITIONAL DATA MEMORY MAP Direct Addressing Indirect Addressing 4 BSR 0 6 From Opcode 0 7 FSRxH 0 7 FSRxL 0 0 0 0 0 Bank Select Location Select Bank Select Location Select 00000 00001 00010 11111 0x00 0x7F Bank 0 Bank 1 Bank 2 Bank 31  2010-2016 Microchip Technology Inc. DS40001414E-page 51

PIC16(L)F1946/1947 3.6.2 LINEAR DATA MEMORY 3.6.3 PROGRAM FLASH MEMORY The linear data memory is the region from FSR To make constant data access easier, the entire address 0x2000 to FSR address 0x29AF. This region is program Flash memory is mapped to the upper half of a virtual region that points back to the 80-byte blocks of the FSR address space. When the MSB of FSRnH is GPR memory in all the banks. set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the Unimplemented memory reads as 0x00. Use of the lower eight bits of each memory location is accessible linear data memory region allows buffers to be larger via INDF. Writing to the program Flash memory cannot than 80 bytes because incrementing the FSR beyond be accomplished via the FSR/INDF interface. All one bank will go directly to the GPR memory of the next instructions that access program Flash memory via the bank. FSR/INDF interface will require one additional The 16 bytes of common memory are not included in instruction cycle to complete. the linear data memory region. FIGURE 3-12: PROGRAM FLASH FIGURE 3-11: LINEAR DATA MEMORY MEMORY MAP MAP 7 FSRnH 0 7 FSRnL 0 7 FSRnH 0 7 FSRnL 0 1 0 0 1 Location Select 0x8000 0x0000 Location Select 0x2000 0x020 Bank 0 0x06F 0x0A0 Bank 1 Program 0x0EF Flash 0x120 Memory (low 8 Bank 2 bits) 0x16F 0xF20 Bank 30 0xFFFF 0x7FFF 0x29AF 0xF6F DS40001414E-page 52  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 4.0 DEVICE CONFIGURATION Device Configuration consists of Configuration Words, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. Note: The DEBUG bit in Configuration Word 2 is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a '1'.  2010-2016 Microchip Technology Inc. DS40001414E-page 53

PIC16(L)F1946/1947 4.2 Register Definitions: Configuration Words REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 FCMEN IESO CLKOUTEN BOREN<1:0> CPD bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 12 IESO: Internal External Switchover bit 1 = Internal/External Switchover mode is enabled 0 = Internal/External Switchover mode is disabled bit 11 CLKOUTEN: Clock Out Enable bit If FOSC configuration bits are set to LP, XT, HS modes: This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin. All other FOSC modes: 1 =CLKOUT function is disabled. I/O function on the CLKOUT pin. 0 =CLKOUT function is enabled on the CLKOUT pin bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled bit 8 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 7 CP: Code Protection bit(3) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 =MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 =MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUG5 bit. Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: The entire data EEPROM will be erased when the code protection is turned off during an erase. 3: The entire program memory will be erased when the code protection is turned off. DS40001414E-page 54  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 (CONTINUED) bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit 11 =WDT enabled 10 =WDT enabled while running and disabled in Sleep 01 =WDT controlled by the SWDTEN bit in the WDTCON register 00 =WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 111 = ECH: External Clock, High-Power mode (4-20MHz): device clock supplied to CLKIN pin 110 = ECM: External Clock, Medium-Power mode (0.5-4MHz): device clock supplied to CLKIN pin 101 = ECL: External Clock, Low-Power mode (0-0.5MHz): device clock supplied to CLKIN pin 100 = INTOSC oscillator: I/O function on CLKIN pin 011 = EXTRC oscillator: External RC circuit connected to CLKIN pin 010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins 001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins 000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: The entire data EEPROM will be erased when the code protection is turned off during an erase. 3: The entire program memory will be erased when the code protection is turned off.  2010-2016 Microchip Technology Inc. DS40001414E-page 55

PIC16(L)F1946/1947 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 R/P-1 U-1 R/P-1 R/P-1 R/P-1 LVP(1) DEBUG(2) — BORV(3) STVREN PLLEN bit 13 bit 8 U-1 U-1 U-1 R/P-1/1 U-1 U-1 R/P-1 R/P-1 — — — VCAPEN — — WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR must be used for programming bit 12 DEBUG: In-Circuit Debugger Mode bit(2) 1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger bit 11 Unimplemented: Read as ‘1’ bit 10 BORV: Brown-out Reset Voltage Selection bit(3) 1 = Brown-out Reset voltage (Vbor), low trip point selected. 0 = Brown-out Reset voltage (Vbor), high trip point selected. bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8 PLLEN: PLL Enable bit 1 = 4xPLL enabled 0 = 4xPLL disabled bit 7-5 Unimplemented: Read as ‘1’ bit 4 VCAPEN: Voltage Regulator Capacitor Enable bits 0 = VCAP functionality is enabled on RF0 1 = No capacitor on VCAP pin bit 3-2 Unimplemented: Read as ‘1’ Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. 2: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. 3: See Vbor parameter for specific trip point voltages. DS40001414E-page 56  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 (CONTINUED) bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 8 kW Flash memory (PIC16(L)F1946): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 1FFFh may be modified by EECON control 01 = 000h to FFFh write-protected, 1000h to 1FFFh may be modified by EECON control 00 = 000h to 1FFFh write-protected, no addresses may be modified by EECON control 16 kW Flash memory (PIC16(L)F1947): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 3FFFh may be modified by EECON control 01 = 000h to 1FFFh write-protected, 2000h to 3FFFh may be modified by EECON control 00 = 000h to 3FFFh write-protected, no addresses may be modified by EECON control Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. 2: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. 3: See Vbor parameter for specific trip point voltages.  2010-2016 Microchip Technology Inc. DS40001414E-page 57

PIC16(L)F1946/1947 4.3 Code Protection Code protection allows the device to be protected from unauthorized access. Program memory protection and data EEPROM protection are controlled independently. Internal access to the program memory and data EEPROM are unaffected by any code protection setting. 4.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section4.4 “Write Protection” for more information. 4.3.2 DATA EEPROM PROTECTION The entire data EEPROM is protected from external reads and writes by the CPD bit. When CPD = 0, external reads and writes of data EEPROM are inhibited. The CPU can continue to read and write data EEPROM regardless of the protection bit settings. 4.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Words define the size of the program memory block that is protected. 4.5 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section4.6 “Device ID and Revision ID” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC16F193X/LF193X/PIC16F194X/LF190X Memory Programming Specification” (DS41397). DS40001414E-page 58  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/1947 4.6 Device ID and Revision ID The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section11.5 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. 4.7 Register Definitions: Device ID REGISTER 4-3: DEVICEID: DEVICE ID REGISTER R R R R R R DEV<8:3> bit 13 bit 8 R R R R R R R R DEV<2:0> REV<4:0> bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set ‘0’ = Bit is cleared -n = Value when blank or after Bulk Erase bit 13-5 DEV<8:0>: Device ID bits DEVICEID<13:0> Values Device DEV<8:0> REV<4:0> PIC16F1946 10 0011 001 x xxxx PIC16F1947 10 0011 010 x xxxx PIC16LF1946 10 0011 011 x xxxx PIC16LF1947 10 0011 100 x xxxx bit 4-0 REV<4:0>: Revision ID bits These bits are used to identify the revision (see Table under DEV<8:0> above).  2010-2016 Microchip Technology Inc. DS40001414E-page 59

PIC16(L)F1946/47 5.0 OSCILLATOR MODULE (WITH The oscillator module can be configured in one of eight FAIL-SAFE CLOCK MONITOR) clock modes. 1. ECL – External Clock Low Power mode 5.1 Overview (0MHz to 0.5MHz) 2. ECM – External Clock Medium Power mode The oscillator module has a wide variety of clock (0.5MHz to 4MHz) sources and selection features that allow it to be used 3. ECH – External Clock High Power mode in a wide range of applications while maximizing perfor- (4MHz to 32MHz) mance and minimizing power consumption. Figure5-1 4. LP – 32kHz Low-Power Crystal mode. illustrates a block diagram of the oscillator module. 5. XT – Medium Gain Crystal or Ceramic Resonator Clock sources can be supplied from external oscillators, Oscillator mode (up to 4 MHz) quartz crystal resonators, ceramic resonators and 6. HS – High Gain Crystal or Ceramic Resonator Resistor-Capacitor (RC) circuits. In addition, the system mode (4 MHz to 20 MHz) clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds 7. RC – External Resistor-Capacitor (RC). selectable via software. Additional clock features 8. INTOSC – Internal oscillator (31kHz to 32 MHz). include: Clock Source modes are selected by the FOSC<2:0> • Selectable system clock source between external bits in the Configuration Words. The FOSC bits or internal sources via software. determine the type of oscillator that will be used when • Two-Speed Start-up mode, which minimizes the device is first powered. latency between external oscillator start-up and The EC clock mode relies on an external logic level code execution. signal as the device clock source. The LP, XT, and HS • Fail-Safe Clock Monitor (FSCM) designed to clock modes require an external crystal or resonator to detect a failure of the external clock source (LP, be connected to the device. Each mode is optimized for XT, HS, EC or RC modes) and switch a different frequency range. The RC clock mode automatically to the internal oscillator. requires an external resistor and capacitor to set the • Oscillator Start-up Timer (OST) ensures stability oscillator frequency. of crystal oscillator sources The INTOSC internal oscillator block produces low, medium, and high frequency clock sources, designated LFINTOSC, MFINTOSC, and HFINTOSC. (see Internal Oscillator Block, Figure5-1). A wide selection of device clock frequencies may be derived from these three clock sources. DS40001414E-page 60  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 5-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM External Oscillator LP, XT, HS, RC, EC OSC2 Sleep 4 x PLL Sleep OSC1 Oscillator Timer1 FOSC<2:0> = 100 T1OSC X CPU and T1OSO U Peripherals M T1OSCEN Enable T1OSI Oscillator IRCF<3:0> Internal Oscillator 16 MHz 8 MHz Internal Oscillator 4 MHz Block 2 MHz er 1 MHz Clock HFPLL 16 MHz scal 500 kHz UX Control (HFINTOSC) ost 250 kHz M P 125 kHz FOSC<2:0> SCS<1:0> 500 kHz Source 500 kHz 62.5 kHz (MFINTOSC) 31.25 kHz Clock Source Option for other modules 31 kHz 31 kHz Source 31 kHz (LFINTOSC) WDT, PWRT, Fail-Safe Clock Monitor Two-Speed Start-up and other modules  2010-2016 Microchip Technology Inc. DS40001414E-page 61

PIC16(L)F1946/47 5.2 Clock Source Types The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in Clock sources can be classified as external or internal. operation after a Power-on Reset (POR) or wake-up External clock sources rely on external circuitry for the from Sleep. Because the PIC® MCU design is fully clock source to function. Examples are: oscillator mod- static, stopping the external clock input will have the ules (EC mode), quartz crystal resonators or ceramic effect of halting the device while leaving all data intact. resonators (LP, XT and HS modes) and Resis- Upon restarting the external clock, the device will tor-Capacitor (RC) mode circuits. resume operation as if no time had elapsed. Internal clock sources are contained within the FIGURE 5-2: EXTERNAL CLOCK (EC) oscillator module. The internal oscillator block has two MODE OPERATION internal oscillators and a dedicated Phase-Lock Loop (HFPLL) that are used to generate three internal system clock sources: the 16MHz High-Frequency Clock from OSC1/CLKIN Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) Ext. System and the 31kHz Low-Frequency Internal Oscillator PIC® MCU (LFINTOSC). OSC2/CLKOUT The system clock can be selected between external or FOSC/4 or I/O(1) internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section5.3 Note 1: Output depends upon CLKOUTEN bit of the “Clock Switching” for additional information. Configuration Words. 5.2.1 EXTERNAL CLOCK SOURCES 5.2.1.2 LP, XT, HS Modes An external clock source can be used as the device system clock by performing one of the following The LP, XT and HS modes support the use of quartz actions: crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure5-3). The three modes select • Program the FOSC<2:0> bits in the Configuration a low, medium or high gain setting of the internal Words to select an external clock source that will inverter-amplifier to support various resonator types be used as the default system clock upon a and speed. device Reset. • Write the SCS<1:0> bits in the OSCCON register LP Oscillator mode selects the lowest gain setting of the to switch the system clock source to: internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to - Timer1 oscillator during run-time, or drive only 32.768 kHz tuning-fork type crystals (watch - An external clock source determined by the crystals). value of the FOSC bits. XT Oscillator mode selects the intermediate gain See Section5.3 “Clock Switching” for more setting of the internal inverter-amplifier. XT mode information. current consumption is the medium of the three modes. This mode is best suited to drive resonators with a 5.2.1.1 EC Mode medium drive level specification. The External Clock (EC) mode allows an externally HS Oscillator mode selects the highest gain setting of the generated logic level signal to be the system clock internal inverter-amplifier. HS mode current consumption source. When operating in this mode, an external clock is the highest of the three modes. This mode is best source is connected to the OSC1 input. suited for resonators that require a high drive setting. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. Figure5-2 shows the pin connections for EC Figure5-3 and Figure5-4 show typical circuits for mode. quartz crystal and ceramic resonators, respectively. EC mode has 3 power modes to select from through Configuration Words: • High power, 4-32MHz (FOSC = 111) • Medium power, 0.5-4MHz (FOSC = 110) • Low power, 0-0.5MHz (FOSC = 101) DS40001414E-page 62  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 5-3: QUARTZ CRYSTAL FIGURE 5-4: CERAMIC RESONATOR OPERATION (LP, XT OR OPERATION HS MODE) (XT OR HS MODE) PIC® MCU PIC® MCU OSC1/CLKIN OSC1/CLKIN C1 To Internal C1 To Internal Logic Logic QCruyasrttazl RF(2) Sleep RP(3) RF(2) Sleep C2 RS(1) OSC2/CLKOUT C2 Ceramic RS(1) OSC2/CLKOUT Resonator Note 1: A series resistor (RS) may be required for quartz crystals with low drive level. Note 1: A series resistor (RS) may be required for ceramic resonators with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2M to 10M. 2: The value of RF varies with the Oscillator mode selected (typically between 2M to 10M. 3: An additional parallel feedback resistor (RP) Note 1: Quartz crystal characteristics vary may be required for proper ceramic resonator according to type, package and operation. manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 5.2.1.3 Oscillator Start-up Timer (OST) 2: Always verify oscillator performance over If the oscillator module is configured for LP, XT or HS the VDD and temperature range that is modes, the Oscillator Start-up Timer (OST) counts expected for the application. 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer 3: For oscillator design assistance, reference (PWRT) has expired (if configured), or a wake-up from the following Microchip Applications Notes: Sleep. During this time, the program counter does not • AN826, Crystal Oscillator Basics and increment and program execution is suspended. The Crystal Selection for rfPIC® and PIC® OST ensures that the oscillator circuit, using a quartz Devices (DS00826) crystal resonator or ceramic resonator, has started and • AN849, Basic PICmicro® Oscillator is providing a stable system clock to the oscillator Design (DS00849) module. • AN943, Practical PICmicro® Oscillator In order to minimize latency between external oscillator Analysis and Design (DS00943) start-up and code execution, the Two-Speed Clock • AN949, Making Your Oscillator Work Start-up mode can be selected (see Section5.4 (DS00949) “Two-Speed Clock Start-up Mode”). 5.2.1.4 4x PLL The oscillator module contains a 4x PLL that can be used with both external and internal clock sources to provide a system clock source. The input frequency for the 4x PLL must fall within specifications. See the PLL Clock Timing Specifications in Section30.0 “Electrical Specifications”. The 4x PLL may be enabled for use by one of two methods: 1. Program the PLLEN bit in Configuration Words to a ‘1’. 2. Write the SPLLEN bit in the OSCCON register to a ‘1’. If the PLLEN bit in Configuration Words is programmed to a ‘1’, then the value of SPLLEN is ignored.  2010-2016 Microchip Technology Inc. DS40001414E-page 63

PIC16(L)F1946/47 5.2.1.5 TIMER1 Oscillator 5.2.1.6 External RC Mode The Timer1 Oscillator is a separate crystal oscillator The external Resistor-Capacitor (RC) modes support that is associated with the Timer1 peripheral. It is opti- the use of an external RC circuit. This allows the mized for timekeeping operations with a 32.768 kHz designer maximum flexibility in frequency choice while crystal connected between the T1OSO and T1OSI keeping costs to a minimum when clock accuracy is not device pins. required. The Timer1 Oscillator can be used as an alternate The RC circuit connects to OSC1. OSC2/CLKOUT is system clock source and can be selected during available for general purpose I/O or CLKOUT. The run-time using clock switching. Refer to Section5.3 function of the OSC2/CLKOUT pin is determined by the “Clock Switching” for more information. CLKOUTEN bit in Configuration Words. Figure5-6 shows the external RC mode connections. FIGURE 5-5: QUARTZ CRYSTAL OPERATION (TIMER1 FIGURE 5-6: EXTERNAL RC MODES OSCILLATOR) VDD PIC® MCU PIC® MCU REXT T1OSI OSC1/CLKIN Internal Clock C1 To Internal CEXT Logic 32.768 kHz VSS Quartz Crystal FOSC/4 or I/O(1) OSC2/CLKOUT C2 T1OSO Recommended values: 10 k  REXT  100 k, <3V 3 k  REXT  100 k, 3-5V CEXT > 20 pF, 2-5V Note 1: Quartz crystal characteristics vary Note 1: Output depends upon CLKOUTEN bit of the according to type, package and Configuration Words. manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values 2: Always verify oscillator performance over and the operating temperature. Other factors affecting the VDD and temperature range that is the oscillator frequency are: expected for the application. • threshold voltage variation 3: For oscillator design assistance, reference • component tolerances the following Microchip Applications Notes: • packaging variations in capacitance • AN826, Crystal Oscillator Basics and The user also needs to take into account variation due Crystal Selection for rfPIC® and PIC® to tolerance of external RC components used. Devices (DS00826) • AN849, Basic PICmicro® Oscillator Design (DS00849) • AN943, Practical PICmicro® Oscillator Analysis and Design (DS00943) • AN949, Making Your Oscillator Work (DS00949) • TB097, Interfacing a Micro Crystal MS1V-T1K 32.768 kHz Tuning Fork Crystal to a PIC16F690/SS (DS91097) • AN1288, Design Practices for Low-Power External Oscillators (DS01288) DS40001414E-page 64  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 5.2.2 INTERNAL CLOCK SOURCES 5.2.2.1 HFINTOSC The device may be configured to use the internal The High-Frequency Internal Oscillator (HFINTOSC) is oscillator block as the system clock by performing one a factory-calibrated 16MHz internal clock source. The of the following actions: frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register5-3). • Program the FOSC<2:0> bits in Configuration Words to select the INTOSC clock source, which The output of the HFINTOSC connects to a postscaler will be used as the default system clock upon a and multiplexer (see Figure5-1). One of multiple device Reset. frequencies derived from the HFINTOSC can be • Write the SCS<1:0> bits in the OSCCON register selected via software using the IRCF<3:0> bits of the to switch the system clock source to the internal OSCCON register. See Section5.2.2.7 “Internal oscillator during run-time. See Section5.3 Oscillator Clock Switch Timing” for more information. “Clock Switching”for more information. The HFINTOSC is enabled by: In INTOSC mode, OSC1/CLKIN is available for general • Configure the IRCF<3:0> bits of the OSCCON purpose I/O. OSC2/CLKOUT is available for general register for the desired HF frequency, and purpose I/O or CLKOUT. • FOSC<2:0> = 100, or The function of the OSC2/CLKOUT pin is determined • Set the System Clock Source (SCS) bits of the by the CLKOUTEN bit in Configuration Words. OSCCON register to ‘1x’. The internal oscillator block has two independent A fast start-up oscillator allows internal circuits to oscillators and a dedicated Phase-Lock Loop, HFPLL power-up and stabilize before switching to HFINTOSC. that can produce one of three internal system clock The High-Frequency Internal Oscillator Ready bit sources. (HFIOFR) of the OSCSTAT register indicates when the 1. The HFINTOSC (High-Frequency Internal HFINTOSC is running. Oscillator) is factory calibrated and operates at The High-Frequency Internal Oscillator Status Locked 16MHz. The HFINTOSC source is generated bit (HFIOFL) of the OSCSTAT register indicates when from the 500 kHz MFINTOSC source and the the HFINTOSC is running within 2% of its final value. dedicated Phase-Lock Loop, HFPLL. The frequency of the HFINTOSC can be The High-Frequency Internal Oscillator Stable bit user-adjusted via software using the OSCTUNE (HFIOFS) of the OSCSTAT register indicates when the register (Register5-3). HFINTOSC is running within 0.5% of its final value. 2. The MFINTOSC (Medium-Frequency Internal 5.2.2.2 MFINTOSC Oscillator) is factory calibrated and operates at 500kHz. The frequency of the MFINTOSC can The Medium-Frequency Internal Oscillator be user-adjusted via software using the (MFINTOSC) is a factory calibrated 500kHz internal OSCTUNE register (Register5-3). clock source. The frequency of the MFINTOSC can be 3. The LFINTOSC (Low-Frequency Internal altered via software using the OSCTUNE register Oscillator) is uncalibrated and operates at (Register5-3). 31kHz. The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The MFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<2:0> = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ The Medium-Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running.  2010-2016 Microchip Technology Inc. DS40001414E-page 65

PIC16(L)F1946/47 5.2.2.3 Internal Oscillator Frequency 5.2.2.5 Internal Oscillator Frequency Adjustment Selection The 500 kHz internal oscillator is factory calibrated. The system clock speed can be selected via software This internal oscillator can be adjusted in software by using the Internal Oscillator Frequency Select bits writing to the OSCTUNE register (Register5-3). Since IRCF<3:0> of the OSCCON register. the HFINTOSC and MFINTOSC clock sources are The output of the 16MHz HFINTOSC and 31kHz derived from the 500 kHz internal oscillator a change in LFINTOSC connects to a postscaler and multiplexer the OSCTUNE register value will apply to both. (see Figure5-1). The Internal Oscillator Frequency The default value of the OSCTUNE register is ‘0’. The Select bits IRCF<3:0> of the OSCCON register select value is a 6-bit two’s complement number. A value of the frequency output of the internal oscillators. One of 1Fh will provide an adjustment to the maximum the following frequencies can be selected via software: frequency. A value of 20h will provide an adjustment to • HFINTOSC the minimum frequency. - 32 MHz (requires 4x PLL) When the OSCTUNE register is modified, the oscillator - 16 MHz frequency will begin shifting to the new frequency. Code - 8 MHz execution continues during this shift. There is no - 4 MHz indication that the shift has occurred. - 2 MHz OSCTUNE does not affect the LFINTOSC frequency. - 1 MHz Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer - 500 kHz (default after Reset) (PWRT), Watchdog Timer (WDT), Fail-Safe Clock - 250 kHz Monitor (FSCM) and peripherals, are not affected by the - 125 kHz change in frequency. - 62.5 kHz 5.2.2.4 LFINTOSC - 31.25 kHz • LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31kHz internal clock source. - 31 kHz The output of the LFINTOSC connects to a multiplexer Note: Following any Reset, the IRCF<3:0> bits (see Figure5-1). Select 31kHz, via software, using the of the OSCCON register are set to ‘0111’ IRCF<3:0> bits of the OSCCON register. See and the frequency selection is set to Section5.2.2.7 “Internal Oscillator Clock Switch 500kHz. The user can modify the IRCF Timing” for more information. The LFINTOSC is also bits to select a different frequency. the frequency for the Power-up Timer (PWRT), The IRCF<3:0> bits of the OSCCON register allow Watchdog Timer (WDT) and Fail-Safe Clock Monitor duplicate selections for some frequencies. These dupli- (FSCM). cate choices can offer system design trade-offs. Lower The LFINTOSC is enabled by selecting 31kHz power consumption can be obtained when changing (IRCF<3:0> bits of the OSCCON register=000) as the oscillator sources for a given frequency. Faster transi- system clock source (SCS bits of the OSCCON tion times can be obtained between frequency changes register= 1x), or when any of the following are that use the same oscillator source. enabled: • Configure the IRCF<3:0> bits of the OSCCON register for the desired LF frequency, and • FOSC<2:0> = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ Peripherals that use the LFINTOSC are: • Power-up Timer (PWRT) • Watchdog Timer (WDT) • Fail-Safe Clock Monitor (FSCM) The Low Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running. DS40001414E-page 66  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 5.2.2.6 32 MHz Internal Oscillator 5.2.2.7 Internal Oscillator Clock Switch Frequency Selection Timing The Internal Oscillator Block can be used with the 4x When switching between the HFINTOSC, MFINTOSC PLL associated with the External Oscillator Block to and the LFINTOSC, the new oscillator may already be produce a 32 MHz internal system clock source. The shut down to save power (see Figure5-7). If this is the following settings are required to use the 32 MHz case, there is a delay after the IRCF<3:0> bits of the internal clock source: OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will • The FOSC bits in Configuration Words must be reflect the current active status of the HFINTOSC, set to use the INTOSC source as the device MFINTOSC and LFINTOSC oscillators. The sequence system clock (FOSC<2:0> = 100). of a frequency selection is as follows: • The SCS bits in the OSCCON register must be cleared to use the clock determined by 1. IRCF<3:0> bits of the OSCCON register are FOSC<2:0> in Configuration Words modified. (SCS<1:0>=00). 2. If the new clock is shut down, a clock start-up • The IRCF bits in the OSCCON register must be delay is started. set to the 8 MHz HFINTOSC set to use 3. Clock switch circuitry waits for a falling edge of (IRCF<3:0>=1110). the current clock. • The SPLLEN bit in the OSCCON register must be 4. The current clock is held low and the clock set to enable the 4xPLL, or the PLLEN bit of the switch circuitry waits for a rising edge in the new Configuration Words must be programmed to a clock. ‘1’. 5. The new clock is now active. Note: When using the PLLEN bit of the 6. The OSCSTAT register is updated as required. Configuration Words, the 4xPLL cannot 7. Clock switch is complete. be disabled by software and the 8 MHz See Figure5-7 for more details. HFINTOSC option will no longer be available. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay The 4xPLL is not available for use with the internal before the new frequency is selected. Clock switching oscillator when the SCS bits of the OSCCON register time delays are shown in Table. are set to ‘1x’. The SCS bits must be set to ‘00’ to use Start-up delay specifications are located in the the 4xPLL with the internal oscillator. oscillator tables of Section30.0 “Electrical Specifications”  2010-2016 Microchip Technology Inc. DS40001414E-page 67

PIC16(L)F1946/47 FIGURE 5-7: INTERNAL OSCILLATOR SWITCH TIMING HFINTOSC/ LFINTOSC (FSCM and WDT disabled) MFINTOSC HFINTOSC/ MFINTOSC Oscillator Delay(1) 2-cycle Sync Running LFINTOSC IRCF <3:0> 0 0 System Clock HFINTOSC/ LFINTOSC (Either FSCM or WDT enabled) MFINTOSC HFINTOSC/ MFINTOSC 2-cycle Sync Running LFINTOSC   IRCF <3:0> 0 0 System Clock LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled LFINTOSC Oscillator Delay(1) 2-cycle Sync Running HFINTOSC/ MFINTOSC IRCF <3:0> = 0  0 System Clock Note: See Table5-1, Oscillator Switching Delays, for more information. DS40001414E-page 68  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 5.3 Clock Switching 5.3.3 TIMER1 OSCILLATOR The system clock source can be switched between The Timer1 oscillator is a separate crystal oscillator external and internal clock sources via software using associated with the Timer1 peripheral. It is optimized the System Clock Select (SCS) bits of the OSCCON for timekeeping operations with a 32.768 kHz crystal register. The following clock sources can be selected connected between the T1OSO and T1OSI device using the SCS bits: pins. • Default system oscillator determined by FOSC The Timer1 oscillator is enabled using the T1OSCEN bits in Configuration Words control bit in the T1CON register. See Section21.0 “Timer1 Module with Gate Control” for more • Timer1 32 kHz crystal oscillator information about the Timer1 peripheral. • Internal Oscillator Block (INTOSC) 5.3.4 TIMER1 OSCILLATOR READY 5.3.1 SYSTEM CLOCK SELECT (SCS) (T1OSCR) BIT BITS The user must ensure that the Timer1 oscillator is The System Clock Select (SCS) bits of the OSCCON ready to be used before it is selected as a system clock register selects the system clock source that is used for source. The Timer1 Oscillator Ready (T1OSCR) bit of the CPU and peripherals. the OSCSTAT register indicates whether the Timer1 • When the SCS bits of the OSCCON register = 00, oscillator is ready to be used. After the T1OSCR bit is the system clock source is determined by value of set, the SCS bits can be configured to select the Timer1 the FOSC<2:0> bits in the Configuration Words. oscillator. • When the SCS bits of the OSCCON register = 01, 5.3.5 CLOCK SWITCHING BEFORE the system clock source is the Timer1 oscillator. SLEEP • When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal When clock switching from an old clock to a new clock oscillator frequency selected by the IRCF<3:0> is requested just prior to entering Sleep mode, it is bits of the OSCCON register. After a Reset, the necessary to confirm that the switch is complete before SCS bits of the OSCCON register are always the SLEEP instruction is executed. Failure to do so may cleared. result in an incomplete switch and consequential loss of the system clock altogether. Clock switching is Note: Any automatic clock switch, which may confirmed by monitoring the clock Status bits in the occur from Two-Speed Start-up or OSCSTAT register. Switch confirmation can be Fail-Safe Clock Monitor, does not update accomplished by sensing that the Ready bit for the new the SCS bits of the OSCCON register. The clock is set or the Ready bit for the old clock is cleared. user can monitor the OSTS bit of the For example, when switching between the internal OSCSTAT register to determine the current oscillator with the PLL and the internal oscillator without system clock source. the PLL, monitor the PLLR bit. When PLLR is set, the When switching between clock sources, a delay is switch to 32 MHz operation is complete. Conversely, required to allow the new clock to stabilize. These when PLLR is cleared the switch from 32 MHz oscillator delays are shown in Table5-1. operation to the selected internal clock is complete. 5.3.2 OSCILLATOR START-UP TIME-OUT STATUS (OSTS) BIT The Oscillator Start-up Time-out Status (OSTS) bit of the OSCSTAT register indicates whether the system clock is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Words, or from the internal clock source. In particular, OSTS indicates that the Oscillator Start-up Timer (OST) has timed out for LP, XT or HS modes. The OST does not reflect the status of the Timer1 oscillator.  2010-2016 Microchip Technology Inc. DS40001414E-page 69

PIC16(L)F1946/47 5.4 Two-Speed Clock Start-up Mode 5.4.1 TWO-SPEED START-UP MODE CONFIGURATION Two-Speed Start-up mode provides additional power savings by minimizing the latency between external Two-Speed Start-up mode is configured by the oscillator start-up and code execution. In applications following settings: that make heavy use of the Sleep mode, Two-Speed • IESO (of the Configuration Words) = 1; Inter- Start-up will remove the external oscillator start-up nal/External Switchover bit (Two-Speed Start-up time from the time spent awake and can reduce the mode enabled). overall power consumption of the device. This mode • SCS (of the OSCCON register) = 00. allows the application to wake-up from Sleep, perform • FOSC<2:0> bits in the Configuration Words a few instructions using the INTOSC internal oscillator configured for LP, XT or HS mode. block as the clock source and go back to Sleep without waiting for the external oscillator to become stable. Two-Speed Start-up mode is entered after: Two-Speed Start-up provides benefits when the oscil- • Power-on Reset (POR) and, if enabled, after lator module is configured for LP, XT, or HS modes. Power-up Timer (PWRT) has expired, or The Oscillator Start-up Timer (OST) is enabled for • Wake-up from Sleep. these modes and must count 1024 oscillations before the oscillator can be used as the system clock source. If the oscillator module is configured for any mode other than LP, XT or HS mode, then Two-Speed Start-up is disabled. This is because the external clock oscillator does not require any stabilization time after POR or an exit from Sleep. If the OST count reaches 1024 before the device enters Sleep mode, the OSTS bit of the OSCSTAT reg- ister is set and program execution switches to the external oscillator. However, the system may never operate from the external oscillator if the time spent awake is very short. Note: Executing a SLEEP instruction will abort the oscillator start-up time and will cause the OSTS bit of the OSCSTAT register to remain clear. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Switch From Switch To Frequency Oscillator Delay LFINTOSC(1) 31kHz Sleep MFINTOSC(1) 31.25kHz-500 kHz 2 cycles HFINTOSC(1) 31.25kHz-16MHz Sleep/POR EC, RC(1) DC – 32MHz 2 cycles LFINTOSC EC, RC(1) DC – 32MHz 1 cycle of each Timer1 Oscillator Sleep/POR 32kHz-20MHz 1024 Clock Cycles (OST) LP, XT, HS(1) MFINTOSC(1) 31.25kHz-500kHz Any clock source 2s (approx.) HFINTOSC(1) 31.25kHz-16MHz Any clock source LFINTOSC(1) 31kHz 1 cycle of each Any clock source Timer1 Oscillator 32kHz 1024 Clock Cycles (OST) PLL inactive PLL active 16-32MHz 2ms (approx.) Note 1: PLL inactive. DS40001414E-page 70  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 5.4.2 TWO-SPEED START-UP 5.4.3 CHECKING TWO-SPEED CLOCK SEQUENCE STATUS 1. Wake-up from Power-on Reset or Sleep. Checking the state of the OSTS bit of the OSCSTAT 2. Instructions begin execution by the internal register will confirm if the microcontroller is running oscillator at the frequency set in the IRCF<3:0> from the external clock source, as defined by the bits of the OSCCON register. FOSC<2:0> bits in the Configuration Words, or the internal oscillator. 3. OST enabled to count 1024 clock cycles. 4. OST timed out, wait for falling edge of the internal oscillator. 5. OSTS is set. 6. System clock held low until the next falling edge of new clock (LP, XT or HS mode). 7. System clock is switched to external clock source. FIGURE 5-8: TWO-SPEED START-UP INTOSC TTOST OSC1 0 1 1022 1023 OSC2 Program Counter P C - N PC PC + 1 System Clock  2010-2016 Microchip Technology Inc. DS40001414E-page 71

PIC16(L)F1946/47 5.5 Fail-Safe Clock Monitor 5.5.3 FAIL-SAFE CONDITION CLEARING The Fail-Safe Clock Monitor (FSCM) allows the device The Fail-Safe condition is cleared after a Reset, to continue operating should the external oscillator fail. executing a SLEEP instruction or changing the SCS bits The FSCM can detect oscillator failure any time after of the OSCCON register. When the SCS bits are the Oscillator Start-up Timer (OST) has expired. The changed, the OST is restarted. While the OST is FSCM is enabled by setting the FCMEN bit in the running, the device continues to operate from the Configuration Words. The FSCM is applicable to all INTOSC selected in OSCCON. When the OST times external Oscillator modes (LP, XT, HS, EC, Timer1 out, the Fail-Safe condition is cleared after successfully Oscillator and RC). switching to the external clock source. The OSFIF bit should be cleared prior to switching to the external clock source. If the Fail-Safe condition still exists, the FIGURE 5-9: FSCM BLOCK DIAGRAM OSFIF flag will again become set by hardware. Clock Monitor 5.5.4 RESET OR WAKE-UP FROM SLEEP Latch External S Q The FSCM is designed to detect an oscillator failure Clock after the Oscillator Start-up Timer (OST) has expired. The OST is used after waking up from Sleep and after LFINTOSC any type of Reset. The OST is not used with the EC or Oscillator ÷ 64 R Q RC Clock modes so that the FSCM will be active as soon as the Reset or wake-up has completed. When 31 kHz 488 Hz the FSCM is enabled, the Two-Speed Start-up is also (~32 s) (~2 ms) enabled. Therefore, the device will always be executing code while the OST is operating. Sample Clock Clock Failure Note: Due to the wide range of oscillator start-up Detected times, the Fail-Safe circuit is not active during oscillator start-up (i.e., after exiting Reset or Sleep). After an appropriate 5.5.1 FAIL-SAFE DETECTION amount of time, the user should check the The FSCM module detects a failed oscillator by Status bits in the OSCSTAT register to comparing the external oscillator to the FSCM sample verify the oscillator start-up and that the clock. The sample clock is generated by dividing the system clock switchover has successfully LFINTOSC by 64. See Figure5-9. Inside the fail completed. detector block is a latch. The external clock sets the latch on each falling edge of the external clock. The sample clock clears the latch on each rising edge of the sample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the external clock goes low. 5.5.2 FAIL-SAFE OPERATION When the external clock fails, the FSCM switches the device clock to an internal clock source and sets the bit flag OSFIF of the PIR2 register. Setting this flag will generate an interrupt if the OSFIE bit of the PIE2 register is also set. The device firmware can then take steps to mitigate the problems that may arise from a failed clock. The system clock will continue to be sourced from the internal clock source until the device firmware successfully restarts the external oscillator and switches back to external operation. The internal clock source chosen by the FSCM is determined by the IRCF<3:0> bits of the OSCCON register. This allows the internal oscillator to be configured before a failure occurs. DS40001414E-page 72  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 5-10: FSCM TIMING DIAGRAM Sample Clock System Oscillator Clock Failure Output Clock Monitor Output (Q) Failure Detected OSCFIF Test Test Test Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity.  2010-2016 Microchip Technology Inc. DS40001414E-page 73

PIC16(L)F1946/47 5.6 Register Definitions: Oscillator Control REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0 SPLLEN IRCF<3:0> — SCS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPLLEN: Software PLL Enable bit If PLLEN in Configuration Words = 1: SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements) If PLLEN in Configuration Words = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 1111 =16MHz HF 1110 =8MHz or 32 MHz HF (see Section5.2.2.1 “HFINTOSC”) 1101 =4MHz HF 1100 =2MHz HF 1011 =1MHz HF 1010 =500kHz HF(1) 1001 =250kHz HF(1) 1000 =125kHz HF(1) 0111 =500kHz MF (default upon Reset) 0110 =250kHz MF 0101 =125kHz MF 0100 =62.5kHz MF 0011 =31.25kHz HF(1) 0010 =31.25kHz MF 000x =31kHz LF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Timer1 oscillator 00 = Clock determined by FOSC<2:0> in Configuration Words Note 1: Duplicate frequency derived from HFINTOSC. DS40001414E-page 74  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional bit 7 T1OSCR: Timer1 Oscillator Ready bit If T1OSCEN = 1: 1 = Timer1 oscillator is ready 0 = Timer1 oscillator is not ready If T1OSCEN = 0: 1 = Timer1 clock source is always ready bit 6 PLLR 4x PLL Ready bit 1 = 4x PLL is ready 0 = 4x PLL is not ready bit 5 OSTS: Oscillator Start-up Time-out Status bit 1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Words 0 = Running from an internal oscillator (FOSC<2:0> = 100) bit 4 HFIOFR: High Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3 HFIOFL: High Frequency Internal Oscillator Locked bit 1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate bit 2 MFIOFR: Medium Frequency Internal Oscillator Ready bit 1 = MFINTOSC is ready 0 = MFINTOSC is not ready bit 1 LFIOFR: Low Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High Frequency Internal Oscillator Stable bit 1 = HFINTOSC is at least 0.5% accurate 0 = HFINTOSC is not 0.5% accurate  2010-2016 Microchip Technology Inc. DS40001414E-page 75

PIC16(L)F1946/47 REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — TUN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: Frequency Tuning bits 100000 = Minimum frequency • • • 111111 = 000000 = Oscillator module is running at the factory-calibrated frequency. 000001 = • • • 011110 = 011111 = Maximum frequency TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page OSCCON SPLLEN IRCF<3:0> — SCS<1:0> 74 OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 75 OSCTUNE — — TUN<5:0> 76 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE(1) 92 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF(1) 96 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. Note 1: PIC16F1947 only. TABLE 5-3: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD CONFIG1 54 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> 13:8 — — LVP DEBUG — BORV STVREN PLLEN CONFIG2 56 7:0 — — — VCAPEN — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. Note 1: PIC16F1946/47 only. DS40001414E-page 76  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 6.0 RESETS There are multiple ways to reset this device: • Power-on Reset (POR) • Brown-out Reset (BOR) • MCLR Reset • WDT Reset • RESET instruction • Stack Overflow • Stack Underflow • Programming mode exit To allow VDD to stabilize, an optional Power-up Timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Rev. 10-000006B 8/14/2013 ICSP™ Programming Mode Exit RESET Instruction Stack Underflow Stack Overlfow MCLRE VPP/MCLR Sleep WDT Time-out Device Reset Power-on Reset VDD BOR Active(1) Brown-out R Power-up Reset Timer LFINTOSC PWRTE Note 1: See Table 6-1 for BOR active conditions Note: See Table6-1 for BOR active conditions.  2010-2016 Microchip Technology Inc. DS40001414E-page 77

PIC16(L)F1946/47 6.1 Power-on Reset (POR) 6.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has The BOR circuit holds the device in Reset when VDD reached an acceptable level for minimum operation. reaches a selectable minimum level. Between the Slow rising VDD, fast operating speeds or analog POR and BOR, complete voltage range coverage for performance may require greater than minimum VDD. execution protection can be implemented. The PWRT, BOR or MCLR features can be used to The Brown-out Reset module has four operating extend the start-up period until all device operation modes controlled by the BOREN<1:0> bits in conditions have been met. Configuration Words. The four operating modes are: 6.1.1 POWER-UP TIMER (PWRT) • BOR is always ON • BOR is off when in Sleep The Power-up Timer provides a nominal 64ms time- out on POR or Brown-out Reset. • BOR is controlled by software • BOR is always OFF The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to Refer to Table6-1 for more information. rise to an acceptable level. The Power-up Timer is The Brown-out Reset voltage level is selectable by enabled by clearing the PWRTE bit in Configuration configuring the BORV bit in Configuration Words. Words. A VDD noise rejection filter prevents the BOR from The Power-up Timer starts after the release of the POR triggering on small events. If VDD falls below VBOR for and BOR. a duration greater than parameter TBORDC, the device For additional information, refer to Application Note will reset. See Figure6-2 for more information. AN607, Power-up Trouble Shooting (DS00607). TABLE 6-1: BOR OPERATING MODES Instruction Execution upon: BOREN<1:0> SBOREN Device Mode BOR Mode Release of POR or Wake-up from Sleep 11 X X Active Waits for BOR ready(1) (BORRDY = 1) Awake Active 10 X Waits for BOR ready (BORRDY = 1) Sleep Disabled 1 X Active Waits for BOR ready(1) (BORRDY = 1) 01 0 X Disabled Begins immediately (BORRDY = x) 00 X X Disabled Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. 6.2.1 BOR IS ALWAYS ON 6.2.3 BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Words are When the BOREN bits of Configuration Words are programmed to ‘11’, the BOR is always on. The device programmed to ‘01’, the BOR is controlled by the start-up will be delayed until the BOR is ready and VDD SBOREN bit of the BORCON register. The device start- is higher than the BOR threshold. up is not delayed by the BOR ready condition or the BOR protection is active during Sleep. The BOR does VDD level. not delay wake-up from Sleep. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the 6.2.2 BOR IS OFF IN SLEEP BORRDY bit of the BORCON register. When the BOREN bits of Configuration Words are BOR protection is unchanged by Sleep. programmed to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. DS40001414E-page 78  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 6-2: BROWN-OUT SITUATIONS VDD VBOR Internal Reset TPWRT(1) VDD VBOR Internal < TPWRT Reset TPWRT(1) VDD VBOR Internal Reset TPWRT(1) Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’. 6.3 Register Definitions: BOR Control REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u U-0 U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN — — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN <1:0> in Configuration Words  01: SBOREN is read/write, but has no effect on the BOR. If BOREN <1:0> in Configuration Words = 01: 1 = BOR Enabled 0 = BOR Disabled bit 6-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive  2010-2016 Microchip Technology Inc. DS40001414E-page 79

PIC16(L)F1946/47 6.4 MCLR 6.8 Programming Mode Exit The MCLR is an optional external input that can reset Upon exit of Programming mode, the device will the device. The MCLR function is controlled by the behave as if a POR had just occurred. MCLRE bit of Configuration Words and the LVP bit of Configuration Words (Table6-2). 6.9 Power-Up Timer The Power-up Timer optionally delays device execution TABLE 6-2: MCLR CONFIGURATION after a BOR or POR event. This timer is typically used to MCLRE LVP MCLR allow VDD to stabilize before allowing the device to start running. 0 0 Disabled The Power-up Timer is controlled by the PWRTE bit of 1 0 Enabled Configuration Words. x 1 Enabled 6.10 Start-up Sequence 6.4.1 MCLR ENABLED Upon the release of a POR or BOR, the following must When MCLR is enabled and the pin is held low, the occur before the device will begin executing: device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. 1. Power-up Timer runs to completion (if enabled). 2. Oscillator start-up timer runs to completion (if The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. required for oscillator source). 3. MCLR must be released (if enabled). Note: A Reset does not drive the MCLR pin low. The total time-out will vary based on oscillator 6.4.2 MCLR DISABLED configuration and Power-up Timer configuration. See Section5.0 “Oscillator Module (With Fail-Safe When MCLR is disabled, the pin functions as a general Clock Monitor)” for more information. purpose input and the internal weak pull-up is under The Power-up Timer and oscillator start-up timer run software control. See Section12.15 “PORTG independently of MCLR Reset. If MCLR is kept low long Registers” for more information. enough, the Power-up Timer and oscillator start-up timer will expire. Upon bringing MCLR high, the device 6.5 Watchdog Timer (WDT) Reset will begin execution immediately (see Figure6-3). This The Watchdog Timer generates a Reset if the firmware is useful for testing purposes or to synchronize more does not issue a CLRWDT instruction within the time-out than one device operating in parallel. period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section10.0 “Watchdog Timer (WDT)” for more information. 6.6 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Table for default conditions after a RESET instruction has occurred. 6.7 Stack Overflow/Underflow Reset The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Words. See Section3.5.2 “Overflow/Underflow Reset” for more information. DS40001414E-page 80  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 6-3: RESET START-UP SEQUENCE VDD Internal POR TPWRT Power-Up Timer MCLR TMCLR Internal RESET Oscillator Modes External Crystal TOST Oscillator Start-Up Timer Oscillator FOSC Internal Oscillator Oscillator FOSC External Clock (EC) CLKIN FOSC  2010-2016 Microchip Technology Inc. DS40001414E-page 81

PIC16(L)F1946/47 6.11 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Table6-3 and Table6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RMCLR RI POR BOR TO PD Condition 0 0 1 1 0 x 1 1 Power-on Reset 0 0 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 0 x x 0 Illegal, PD is set on POR 0 0 1 1 u 0 1 1 Brown-out Reset u u u u u u 0 u WDT Reset u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u 1 0 Interrupt Wake-up from Sleep u u 0 u u u u u MCLR Reset during normal operation u u 0 u u u 1 0 MCLR Reset during Sleep u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS(2) Program STATUS PCON Condition Counter Register Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0 Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-- uuuu RESET Instruction Executed 0000h ---u uuuu uu-- u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2: If a Status bit is not implemented, that bit will be read as ‘0’. DS40001414E-page 82  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 6.12 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-on Reset (POR) • Brown-out Reset (BOR) • Reset Instruction Reset (RI) • Stack Overflow Reset (STKOVF) • Stack Underflow Reset (STKUNF) • MCLR Reset (RMCLR) The PCON register bits are shown in Register6-2. 6.13 Register Definitions: Power Control REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q U-0 U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u STKOVF STKUNF — — RMCLR RI POR BOR bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or set to ‘0’ by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or set to ‘0’ by firmware bit 5-4 Unimplemented: Read as ‘0’ bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set to ‘1’ by firmware 0 = A MCLR Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set to ‘1’ by firmware 0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs)  2010-2016 Microchip Technology Inc. DS40001414E-page 83

PIC16(L)F1946/47 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BORCON SBOREN — — — — — — BORRDY 79 PCON STKOVF STKUNF — — RMCLR RI POR BOR 83 STATUS — — — TO PD Z DC C 22 WDTCON — — WDTPS<4:0> SWDTEN 104 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. DS40001414E-page 84  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the PIC microcontroller from Sleep mode. This chapter contains the following information for Interrupts: • Operation • Interrupt Latency • Interrupts During Sleep • INT Pin • Automatic Context Saving Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure7-1. FIGURE 7-1: INTERRUPT LOGIC TMR0IF Wake-up TMR0IE (If in Sleep mode) INTF Peripheral Interrupts INTE (TMR1IF) PIR1<0> IOCIF Interrupt (TMR1IF) PIR1<0> IOCIE to CPU PEIE PIRn<7> GIE PIEn<7>  2010-2016 Microchip Technology Inc. DS40001414E-page 85

PIC16(L)F1946/47 7.1 Operation 7.2 Interrupt Latency Interrupts are disabled upon any device Reset. They Interrupt latency is defined as the time from when the are enabled by setting the following bits: interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous • GIE bit of the INTCON register interrupts is 3 or 4 instruction cycles. For asynchronous • Interrupt Enable bit(s) for the specific interrupt interrupts, the latency is 3 to 5 instruction cycles, event(s) depending on when the interrupt occurs. See Figure7-2 • PEIE bit of the INTCON register (if the Interrupt and Figure7-3 for more details. Enable bit of the interrupt event is contained in the PIE1, PIE2, PIE3 and PIE4 registers) The INTCON, PIR1, PIR2, PIR3 and PIR4 registers record individual interrupts via interrupt flag bits. Inter- rupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See “Section7.5 “Automatic Context Saving”.”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. DS40001414E-page 86  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 7-2: INTERRUPT LATENCY OSC1 Q1Q2Q3 Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3 Q4Q1Q2Q3 Q4Q1Q2Q3Q4Q1Q2Q3 Q4Q1Q2Q3 Q4 CLKOUT Interrupt Sampled during Q1 Interrupt GIE PC PC-1 PC PC+1 0004h 0005h Execute 1 Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC+1/FSR New PC/ PC PC-1 PC ADDR PC+1 0004h 0005h Execute 2 Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3 Cycle Instruction at PC INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3 Cycle Instruction at PC INST(PC) NOP NOP NOP NOP Inst(0004h)  2010-2016 Microchip Technology Inc. DS40001414E-page 87

PIC16(L)F1946/47 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 (3) CLKOUT (4) INT pin (1) (1) (2) INTF (5) Interrupt Latency GIE INSTRUCTION FLOW PC PC PC + 1 PC + 1 0004h 0005h Instruction Fetched Inst (PC) Inst (PC + 1) — Inst (0004h) Inst (0005h) Instruction Inst (PC – 1) Inst (PC) Dummy Cycle Dummy Cycle Inst (0004h) Executed Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT not available in all Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section30.0 “Electrical Specifications””. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. DS40001414E-page 88  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to the Section9.0 “Power- Down Mode (Sleep)”for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the Shadow registers: • W register • STATUS register (except for TO and PD) • BSR register • FSR registers • PCLATH register Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding Shadow register should be modified and the value will be restored when exiting the ISR. The Shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s application, other registers may also need to be saved.  2010-2016 Microchip Technology Inc. DS40001414E-page 89

PIC16(L)F1946/47 7.6 Register Definitions: Interrupt Control REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCBF register have been cleared by software. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001414E-page 90  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 Gate Acquisition interrupt 0 = Disables the Timer1 Gate Acquisition interrupt bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 RCIE: USART1 Receive Interrupt Enable bit 1 = Enables the USART1 receive interrupt 0 = Disables the USART1 receive interrupt bit 4 TXIE: USART1 Transmit Interrupt Enable bit 1 = Enables the USART1 transmit interrupt 0 = Disables the USART1 transmit interrupt bit 3 SSPIE: Synchronous Serial Port (MSSP1) Interrupt Enable bit 1 = Enables the MSSP1 interrupt 0 = Disables the MSSP1 interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2010-2016 Microchip Technology Inc. DS40001414E-page 91

PIC16(L)F1946/47 REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIE: Oscillator Fail Interrupt Enable bit 1 = Enables the Oscillator Fail interrupt 0 = Disables the Oscillator Fail interrupt bit 6 C2IE: Comparator C2 Interrupt Enable bit 1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit 1 = Enables the EEPROM Write Completion interrupt 0 = Disables the EEPROM Write Completion interrupt bit 3 BCLIE: MSSP1 Bus Collision Interrupt Enable bit 1 = Enables the MSSP1 Bus Collision Interrupt 0 = Disables the MSSP1 Bus Collision Interrupt bit 2 LCDIE: LCD Module Interrupt Enable bit 1 = Enables the LCD module interrupt 0 = Disables the LCD module interrupt bit 1 C3IE: Comparator C3 Interrupt Enable bit 1 = Enables the Comparator C3 interrupt 0 = Disables the Comparator C3 interrupt bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enables the CCP2 interrupt 0 = Disables the CCP2 interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. DS40001414E-page 92  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IE: CCP5 Interrupt Enable bit 1 = Enables the CCP5 interrupt 0 = Disables the CCP5 interrupt bit 5 CCP4IE: CCP4 Interrupt Enable bit 1 = Enables the CCP4 interrupt 0 = Disables the CCP4 interrupt bit 4 CCP3IE: CCP3 Interrupt Enable bit 1 = Enables the CCP3 interrupt 0 = Disables the CCP3 interrupt bit 3 TMR6IE: TMR6 to PR6 Match Interrupt Enable bit 1 = Enables the TMR6 to PR6 Match interrupt 0 = Disables the TMR6 to PR6 Match interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IE: TMR4 to PR4 Match Interrupt Enable bit 1 = Enables the TMR4 to PR4 Match interrupt 0 = Disables the TMR4 to PR4 Match interrupt bit 0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2010-2016 Microchip Technology Inc. DS40001414E-page 93

PIC16(L)F1946/47 REGISTER 7-5: PIE4: PERIPHERAL INTERRUPT ENABLE REGISTER 4 U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 — — RC2IE TX2IE — — BCL2IE SSP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 RC2IE: USART2 Receive Interrupt Enable bit 1 = Enables the USART2 receive interrupt 0 = Disables the USART2 receive interrupt bit 4 TX2IE: USART2 Transmit Interrupt Enable bit 1 = Enables the USART2 transmit interrupt 0 = Disables the USART2 transmit interrupt bit 3-2 Unimplemented: Read as ‘0’ bit 1 BCL2IE: MSSP2 Bus Collision Interrupt Enable bit 1 = Enables the MSSP2 Bus Collision Interrupt 0 = Disables the MSSP2 Bus Collision Interrupt bit 0 SSP2IE: Synchronous Serial Port (MSSP2) Interrupt Enable bit 1 = Enables the MSSP2 interrupt 0 = Disables the MSSP2 interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. DS40001414E-page 94  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 7-6: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 RCIF: USART1 Receive Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 TXIF: USART1 Transmit Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 SSPIF: Synchronous Serial Port (MSSP1) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 CCP1IF: CCP1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.  2010-2016 Microchip Technology Inc. DS40001414E-page 95

PIC16(L)F1946/47 REGISTER 7-7: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIF: Oscillator Fail Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 C2IF: Comparator C2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 C1IF: Comparator C1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 BCLIF: MSSP1 Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 LCDIF: LCD Module Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 Unimplemented: Read as ‘0’ bit 0 CCP2IF: CCP2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001414E-page 96  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 7-8: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IF: CCP5 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 CCP4IF: CCP4 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 CCP3IF: CCP3 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 TMR6IF: TMR6 to PR6 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IF: TMR4 to PR4 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.  2010-2016 Microchip Technology Inc. DS40001414E-page 97

PIC16(L)F1946/47 REGISTER 7-9: PIR4: PERIPHERAL INTERRUPT REQUEST REGISTER 4 U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 — — RC2IF TX2IF — — BCL2IF SSP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 RC2IF: USART2 Receive Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 TX2IF: USART2 Transmit Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3-2 Unimplemented: Read as ‘0’ bit 1 BCL2IF: MSSP2 Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 SSP2IF: Synchronous Serial Port (MSSP2) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 188 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupts. DS40001414E-page 98  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 8.0 LOW DROPOUT (LDO) On power-up, the external capacitor will load the LDO VOLTAGE REGULATOR voltage regulator. To prevent erroneous operation, the device is held in Reset while a constant current source The PIC16F1946/47 has an internal Low Dropout charges the external capacitor. After the cap is fully Regulator (LDO) which provides operation above 3.6V. charged, the device is released from Reset. For more The LDO regulates a voltage for the internal device information on the constant current rate, refer to the logic while permitting the VDD and I/O pins to operate LDO Regulator Characteristics Table in Section30.0 at a higher voltage. There is no user enable/disable “Electrical Specifications”. control available for the LDO, it is always active. The PIC16LF1946/47 operates at a maximum VDD of 3.6V and does not incorporate an LDO. A device I/O pin may be configured as the LDO voltage output, identified as the VCAP pin. Although not required, an external low-ESR capacitor may be connected to the VCAP pin for additional regulator stability. The VCAPEN bit of Configuration Words enables or disables the VCAP pin. Refer to Table8-1. TABLE 8-1: VCAPEN SELECT BIT VCAPEN Pin 0 RF0 1 No VCAP TABLE 8-2: SUMMARY OF CONFIGURATION WORD WITH LDO Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — LVP DEBUG — BORV STVREN PLLEN CONFIG2 56 7:0 — — — VCAPEN — — WRT1 WRT0 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by LDO.  2010-2016 Microchip Technology Inc. DS40001414E-page 99

PIC16(L)F1946/47 9.0 POWER-DOWN MODE (SLEEP) 9.1 Wake-up from Sleep The Power-Down mode is entered by executing a The device can wake-up from Sleep through one of the SLEEP instruction. following events: Upon entering Sleep mode, the following conditions 1. External Reset input on MCLR pin, if enabled exist: 2. BOR Reset, if enabled 1. WDT will be cleared but keeps running, if 3. POR Reset enabled for operation during Sleep. 4. Watchdog Timer, if enabled 2. PD bit of the STATUS register is cleared. 5. Any external interrupt 3. TO bit of the STATUS register is set. 6. Interrupts by peripherals capable of running 4. CPU clock is disabled. during Sleep (see individual peripheral for more 5. 31 kHz LFINTOSC is unaffected and peripherals information) that operate from it may continue operation in The first three events will cause a device Reset. The Sleep. last three events are considered a continuation of pro- 6. Timer1 oscillator is unaffected and peripherals gram execution. To determine whether a device Reset that operate from it may continue operation in or wake-up event occurred, refer to Section6.11 Sleep. “Determining the Cause of a Reset”. 7. ADC is unaffected, if the dedicated FRC clock is When the SLEEP instruction is being executed, the next selected. instruction (PC + 1) is prefetched. For the device to 8. Capacitive Sensing oscillator is unaffected. wake-up through an interrupt event, the corresponding 9. I/O ports maintain the status they had before interrupt enable bit must be enabled. Wake-up will SLEEP was executed (driving high, low or high- occur regardless of the state of the GIE bit. If the GIE impedance). bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is 10. Resets other than WDT are not affected by enabled, the device executes the instruction after the Sleep mode. SLEEP instruction; the device will then call the Interrupt Refer to individual chapters for more details on Service Routine. In cases where the execution of the peripheral operation during Sleep. instruction following SLEEP is not desirable, the user To minimize current consumption, the following should have a NOP after the SLEEP instruction. conditions should be considered: The WDT is cleared when the device wakes up from • I/O pins should not be floating Sleep, regardless of the source of wake-up. • External circuitry sinking current from I/O pins • Internal circuitry sourcing current from I/O pins • Current draw from pins with internal weak pull-ups • Modules using 31 kHz LFINTOSC • Modules using Timer1 oscillator I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching currents caused by floating inputs. Examples of internal circuitry that might be sourcing current include modules such as the DAC and FVR modules. See Section17.0 “Digital-to-Analog Con- verter (DAC) Module” and Section14.0 “Fixed Volt- age Reference (FVR)” for more information on these modules. DS40001414E-page 100  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 9.1.1 WAKE-UP USING INTERRUPTS • If the interrupt occurs during or after the execution of a SLEEP instruction When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit - SLEEP instruction will be completely and interrupt flag bit set, one of the following will occur: executed - Device will immediately wake-up from Sleep • If the interrupt occurs before the execution of a SLEEP instruction - WDT and WDT prescaler will be cleared - SLEEP instruction will execute as a NOP. - TO bit of the STATUS register will be set - WDT and WDT prescaler will not be cleared - PD bit of the STATUS register will be cleared. - TO bit of the STATUS register will not be set Even if the flag bits were checked before executing a - PD bit of the STATUS register will not be SLEEP instruction, it may be possible for flag bits to cleared. become set before the SLEEP instruction completes. To determine whether a SLEEP instruction is executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. FIGURE 9-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1(1) CLKOUT(2) TOST(3) Interrupt flag Interrupt Latency(4) GIE bit Processor in (INTCON reg.) Sleep Instruction Flow PC PC PC + 1 PC + 2 PC + 2 PC + 2 0004h 0005h IFnesttcrhuectdion Inst(PC) = Sleep Inst(PC + 1) Inst(PC + 2) Inst(0004h) Inst(0005h) IEnxsetrcuuctteiodn Inst(PC - 1) Sleep Inst(PC + 1) Forced NOP Forced NOP Inst(0004h) Note 1: XT, HS or LP Oscillator mode assumed. 2: CLKOUT is not available in XT, HS, or LP Oscillator modes, but shown here for timing reference. 3: TOST = 1024 TOSC (drawing not to scale). This delay applies only to XT, HS or LP Oscillator modes. 4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 148 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 148 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 148 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 STATUS — — — TO PD Z DC C 22 WDTCON — — WDTPS<4:0> SWDTEN 104 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-Down mode.  2010-2016 Microchip Technology Inc. DS40001414E-page 101

PIC16(L)F1946/47 10.0 WATCHDOG TIMER (WDT) The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: • Independent clock source • Multiple operating modes - WDT is always ON - WDT is off when in Sleep - WDT is controlled by software - WDT is always OFF • Configurable time-out period is from 1 ms to 256 seconds (nominal) • Multiple Reset conditions • Operation during Sleep FIGURE 10-1: WATCHDOG TIMER BLOCK DIAGRAM WDTE<1:0>=01 SWDTEN 23-bit Programmable WDTE<1:0>=11 LFINTOSC WDT Time-out Prescaler WDT WDTE<1:0>=10 Sleep WDTPS<4:0> DS40001414E-page 102  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 10.1 Independent Clock Source 10.3 Time-Out Period The WDT derives its time base from the 31kHz The WDTPS bits of the WDTCON register set the LFINTOSC internal oscillator. Time intervals in this time-out period from 1 ms to 256 seconds (nominal). chapter are based on a nominal interval of 1ms. See After a Reset, the default time-out period is two Section30.0 “Electrical Specifications” for the seconds. LFINTOSC tolerances. 10.4 Clearing the WDT 10.2 WDT Operating Modes The WDT is cleared when any of the following The Watchdog Timer module has four operating modes conditions occur: controlled by the WDTE<1:0> bits in Configuration • Any Reset Words. See Table10-1. • CLRWDT instruction is executed 10.2.1 WDT IS ALWAYS ON • Device enters Sleep • Device wakes up from Sleep When the WDTE bits of Configuration Words are set to ‘11’, the WDT is always on. • Oscillator fail • WDT is disabled WDT protection is active during Sleep. • Oscillator Start-up Timer (OST) is running 10.2.2 WDT IS OFF IN SLEEP See Table10-2 for more information. When the WDTE bits of Configuration Words are set to ‘10’, the WDT is on, except in Sleep. 10.5 Operation During Sleep WDT protection is not active during Sleep. When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes 10.2.3 WDT CONTROLLED BY SOFTWARE counting. When the WDTE bits of Configuration Words are set to When the device exits Sleep, the WDT is cleared ‘01’, the WDT is controlled by the SWDTEN bit of the again. The WDT remains clear until the OST, if WDTCON register. enabled, completes. See Section5.0 “Oscillator WDT protection is unchanged by Sleep. See Module (With Fail-Safe Clock Monitor)” for more Table10-1 for more details. information on the OST. When a WDT time-out occurs while the device is in TABLE 10-1: WDT OPERATING MODES Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the Device WDT WDTE<1:0> SWDTEN STATUS register are changed to indicate the event. See Mode Mode Section3.0 “Memory Organization” and STATUS 11 X X Active register (Register3-1) for more information. Awake Active 10 X Sleep Disabled 1 Active 01 X 0 Disabled 00 X X Disabled TABLE 10-2: WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0>=00 WDTE<1:0>=01 and SWDTEN = 0 WDTE<1:0>=10 and enter Sleep Cleared CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST Change INTOSC divider (IRCF bits) Unaffected  2010-2016 Microchip Technology Inc. DS40001414E-page 103

PIC16(L)F1946/47 10.6 Register Definitions: Watchdog Control REGISTER 10-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 — — WDTPS<4:0> SWDTEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits Bit Value = Prescale Rate 00000 = 1:32 (Interval 1ms typ) 00001 = 1:64 (Interval 2ms typ) 00010 = 1:128 (Interval 4ms typ) 00011 = 1:256 (Interval 8ms typ) 00100 = 1:512 (Interval 16ms typ) 00101 = 1:1024 (Interval 32ms typ) 00110 = 1:2048 (Interval 64ms typ) 00111 = 1:4096 (Interval 128ms typ) 01000 = 1:8192 (Interval 256ms typ) 01001 = 1:16384 (Interval 512ms typ) 01010 = 1:32768 (Interval 1s typ) 01011 = 1:65536 (Interval 2s typ) (Reset value) 01100 = 1:131072 (217) (Interval 4s typ) 01101 = 1:262144 (218) (Interval 8s typ) 01110 = 1:524288 (219) (Interval 16s typ) 01111 = 1:1048576 (220) (Interval 32s typ) 10000 = 1:2097152 (221) (Interval 64s typ) 10001 = 1:4194304 (222) (Interval 128s typ) 10010 = 1:8388608 (223) (Interval 256s typ) 10011 = Reserved. Results in minimum interval (1:32) • • • 11111 = Reserved. Results in minimum interval (1:32) bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 00: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 1x: This bit is ignored. DS40001414E-page 104  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page OSCCON — IRCF<3:0> — SCS<1:0> 74 STATUS — — — TO PD Z DC C 22 WDTCON — — WDTPS<4:0> SWDTEN 104 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD CONFIG1 54 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.  2010-2016 Microchip Technology Inc. DS40001414E-page 105

PIC16(L)F1946/47 11.0 DATA EEPROM AND FLASH 11.1 EEADRL and EEADRH Registers PROGRAM MEMORY The EEADRH:EEADRL register pair can address up to CONTROL a maximum of 256bytes of data EEPROM or up to a maximum of 32K words of program memory. The data EEPROM and Flash program memory are readable and writable during normal operation (full VDD When selecting a program address value, the MSB of range). These memories are not directly mapped in the the address is written to the EEADRH register and the register file space. Instead, they are indirectly LSB is written to the EEADRL register. When selecting addressed through the Special Function Registers a EEPROM address value, only the LSB of the address (SFRs). There are six SFRs used to access these is written to the EEADRL register. memories: 11.1.1 EECON1 AND EECON2 REGISTERS • EECON1 EECON1 is the control register for EE memory • EECON2 accesses. • EEDATL Control bit EEPGD determines if the access will be a • EEDATH program or data memory access. When clear, any • EEADRL subsequent operations will operate on the EEPROM • EEADRH memory. When set, any subsequent operations will When interfacing the data memory block, EEDATL operate on the program memory. On Reset, EEPROM is holds the 8-bit data for read/write, and EEADRL holds selected by default. the address of the EEDATL location being accessed. Control bits RD and WR initiate read and write, These devices have 256 bytes of data EEPROM with respectively. These bits cannot be cleared, only set, in an address range from 0h to 0FFh. software. They are cleared in hardware at completion When accessing the program memory block, the of the read or write operation. The inability to clear the EEDATH:EEDATL register pair forms a 2-byte word WR bit in software prevents the accidental, premature that holds the 14-bit data for read/write, and the termination of a write operation. EEADRL and EEADRH registers form a 2-byte word The WREN bit, when set, will allow a write operation to that holds the 15-bit address of the program memory occur. On power-up, the WREN bit is clear. The location being read. WRERR bit is set when a write operation is interrupted The EEPROM data memory allows byte read and write. by a Reset during normal operation. In these situations, An EEPROM byte write automatically erases the following Reset, the user can check the WRERR bit location and writes the new data (erase before write). and execute the appropriate error handling routine. The write time is controlled by an on-chip timer. The Interrupt flag bit EEIF of the PIR2 register is set when write/erase voltages are generated by an on-chip write is complete. It must be cleared in the software. charge pump rated to operate over the voltage range of Reading EECON2 will read all ‘0’s. The EECON2 the device for byte or word operations. register is used exclusively in the data EEPROM write Depending on the setting of the Flash Program sequence. To enable writes, a specific pattern must be Memory Self Write Enable bits WRT<1:0> of the written to EECON2. Configuration Words, the device may or may not be able to write certain blocks of the program memory. However, reads from the program memory are always allowed. When the device is code-protected, the device programmer can no longer access data or program memory. When code-protected, the CPU may continue to read and write the data EEPROM memory and Flash program memory. DS40001414E-page 106  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 11.2 Using the Data EEPROM 11.2.2 WRITING TO THE DATA EEPROM MEMORY The data EEPROM is a high-endurance, byte addressable array that has been optimized for the To write an EEPROM data location, the user must first storage of frequently changing information (e.g., write the address to the EEADRL register and the data program variables or other data that are updated to the EEDATL register. Then the user must follow a often). When variables in one section change specific sequence to initiate the write for each byte. frequently, while variables in another section do not The write will not initiate if the above sequence is not change, it is possible to exceed the total number of followed exactly (write 55h to EECON2, write AAh to write cycles to the EEPROM without exceeding the EECON2, then set the WR bit) for each byte. Interrupts total number of write cycles to a single byte. Refer to should be disabled during this codesegment. Section30.0 “Electrical Specifications”. If this is the Additionally, the WREN bit in EECON1 must be set to case, then a refresh of the array must be performed. enable write. This mechanism prevents accidental For this reason, variables that change infrequently writes to data EEPROM due to errant (unexpected) (such as constants, IDs, calibration, etc.) should be code execution (i.e., lost programs). The user should stored in Flash program memory. keep the WREN bit clear at all times, except when 11.2.1 READING THE DATA EEPROM updating EEPROM. The WREN bit is not cleared byhardware. MEMORY After a write sequence has been initiated, clearing the To read a data memory location, the user must write the WREN bit will not affect this write cycle. The WR bit will address to the EEADRL register, clear the EEPGD and be inhibited from being set unless the WREN bit is set. CFGS control bits of the EECON1 register, and then set control bit RD. The data is available at the very next At the completion of the write cycle, the WR bit is cycle, in the EEDATL register; therefore, it can be read cleared in hardware and the EE Write Complete in the next instruction. EEDATL will hold this value until Interrupt Flag bit (EEIF) is set. The user can either another read or until it is written to by the user (during enable this interrupt or poll this bit. EEIF must be a write operation). cleared by software. 11.2.3 PROTECTION AGAINST SPURIOUS EXAMPLE 11-1: DATA EEPROM READ WRITE BANKSELEEADRL ; MOVLW DATA_EE_ADDR ; There are conditions when the user may not want to MOVWF EEADRL ;Data Memory write to the data EEPROM memory. To protect against ;Address to read spurious EEPROM writes, various mechanisms have BCF EECON1, CFGS ;Deselect Config space been built-in. On power-up, WREN is cleared. Also, the BCF EECON1, EEPGD;Point to DATA memory Power-up Timer (64ms duration) prevents EEPROM BSF EECON1, RD ;EE Read write. MOVF EEDATL, W ;W = EEDATL The write initiate sequence and the WREN bit together help prevent an accidental write during: • Brown-out Note: Data EEPROM can be read regardless of • Power Glitch the setting of the CPD bit. • Software Malfunction 11.2.4 DATA EEPROM OPERATION DURING CODE-PROTECT Data memory can be code-protected by programming the CPD bit in the Configuration Words to ‘0’. When the data memory is code-protected, only the CPU is able to read and write data to the data EEPROM. It is recommended to code-protect the pro- gram memory when code-protecting data memory. This prevents anyone from replacing your program with a program that will access the contents of the data EEPROM.  2010-2016 Microchip Technology Inc. DS40001414E-page 107

PIC16(L)F1946/47 EXAMPLE 11-2: DATA EEPROM WRITE BANKSEL EEADRL ; MOVLW DATA_EE_ADDR ; MOVWF EEADRL ;Data Memory Address to write MOVLW DATA_EE_DATA ; MOVWF EEDATL ;Data Memory Value to write BCF EECON1, CFGS ;Deselect Configuration space BCF EECON1, EEPGD ;Point to DATA memory BSF EECON1, WREN ;Enable writes BCF INTCON, GIE ;Disable INTs. MOVLW 55h ; RequiredSequence MMMBOOOSVVVFWLWFWF E0EEEAEECACCOhOONNN221, WR ;;;;WWSerriit ttWeeR 5Ab5Aihht to begin write BSF INTCON, GIE ;Enable Interrupts BCF EECON1, WREN ;Disable writes BTFSC EECON1, WR ;Wait for write to complete GOTO $-2 ;Done FIGURE 11-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR PC PC + 1 EEADRH,EEADRL PPCC ++ 33 PC + 4 PC + 5 Flash Data INSTR (PC) INSTR (PC + 1) EEDATH,EEDATL INSTR (PC + 3) INSTR (PC + 4) INSTR(PC - 1) BSF EECON1,RD INSTR(PC + 1) Forced NOP INSTR(PC + 3) INSTR(PC + 4) executed here executed here executed here executed here executed here executed here RD bit EEDATH EEDATL Register DS40001414E-page 108  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 11.3 Flash Program Memory Overview 11.3.1 READING THE FLASH PROGRAM MEMORY It is important to understand the Flash program memory structure for erase and programming To read a program memory location, the user must: operations. Flash Program memory is arranged in 1. Write the Least and Most Significant address rows. A row consists of a fixed number of 14-bit bits to the EEADRH:EEADRL register pair. program memory words. A row is the minimum block 2. Clear the CFGS bit of the EECON1 register. size that can be erased by user software. 3. Set the EEPGD control bit of the EECON1 Flash program memory may only be written or erased register. if the destination address is in a segment of memory 4. Then, set control bit RD of the EECON1 register. that is not write-protected, as defined in bits WRT<1:0> Once the read control bit is set, the program memory of Configuration Words. Flash controller will use the second instruction cycle to After a row has been erased, the user can reprogram read the data. This causes the second instruction all or a portion of this row. Data to be written into the immediately following the “BSF EECON1,RD” instruction program memory row is written to 14-bit wide data write to be ignored. The data is available in the very next cycle, latches. These write latches are not directly accessible in the EEDATH:EEDATL register pair; therefore, it can to the user, but may be loaded via sequential writes to be read as two bytes in the following instructions. the EEDATH:EEDATL register pair. EEDATH:EEDATL register pair will hold this value until Note: If the user wants to modify only a portion another read or until it is written to by the user. of a previously programmed row, then the Note1: The two instructions following a program contents of the entire row must be read and saved in RAM prior to the erase. memory read are required to be NOPs. This prevents the user from executing a The number of data write latches may not be equivalent two-cycle instruction on the next to the number of row locations. During programming, instruction after the RD bit is set. user software may need to fill the set of write latches 2: Flash program memory can be read and initiate a programming operation multiple times in regardless of the setting of the CP bit. order to fully reprogram an erased row. For example, a device with a row size of 32 words and eight write latches will need to load the write latches with data and initiate a programming operation four times. The size of a program memory row and the number of program memory write latches may vary by device. See Table11-1 for details. TABLE 11-1: FLASH MEMORY ORGANIZATION BY DEVICE Device Erase Block (Row) Size/Boundary Number of Write Latches/Boundary PIC16(L)F1946/47 32 words, EEADRL<4:0> = 00000 32 words, EEADRL<4:0> = 00000  2010-2016 Microchip Technology Inc. DS40001414E-page 109

PIC16(L)F1946/47 EXAMPLE 11-3: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL EEADRL ; Select Bank for EEPROM registers MOVLW PROG_ADDR_LO ; MOVWF EEADRL ; Store LSB of address MOVLW PROG_ADDR_HI ; MOVWL EEADRH ; Store MSB of address BCF EECON1,CFGS ; Do not select Configuration Space BSF EECON1,EEPGD ; Select Program Memory BCF INTCON,GIE ; Disable interrupts BSF EECON1,RD ; Initiate read NOP ; Executed (Figure 11-1) NOP ; Ignored (Figure 11-1) BSF INTCON,GIE ; Restore interrupts MOVF EEDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF EEDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location DS40001414E-page 110  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 11.3.2 ERASING FLASH PROGRAM The following steps should be completed to load the MEMORY write latches and program a block of program memory. These steps are divided into two parts. First, all write While executing code, program memory can only be latches are loaded with data except for the last program erased by rows. To erase a row: memory location. Then, the last write latch is loaded 1. Load the EEADRH:EEADRL register pair with and the programming sequence is initiated. A special the address of new row to be erased. unlock sequence is required to load a write latch with 2. Clear the CFGS bit of the EECON1 register. data or initiate a Flash programming operation. This 3. Set the EEPGD, FREE, and WREN bits of the unlock sequence should not be interrupted. EECON1 register. 1. Set the EEPGD and WREN bits of the EECON1 4. Write 55h, then AAh, to EECON2 (Flash register. programming unlock sequence). 2. Clear the CFGS bit of the EECON1 register. 5. Set control bit WR of the EECON1 register to 3. Set the LWLO bit of the EECON1 register. When begin the erase operation. the LWLO bit of the EECON1 register is ‘1’, the 6. Poll the FREE bit in the EECON1 register to write sequence will only load the write latches determine when the row erase has completed. and will not initiate the write to Flash program memory. See Example11-4. 4. Load the EEADRH:EEADRL register pair with After the “BSF EECON1,WR” instruction, the processor the address of the location to be written. requires two cycles to set up the erase operation. The 5. Load the EEDATH:EEDATL register pair with user must place two NOP instructions after the WR bit is the program memory data to be written. set. The processor will halt internal operations for the 6. Write 55h, then AAh, to EECON2, then set the typical 2ms erase time. This is not Sleep mode as the WR bit of the EECON1 register (Flash clocks and peripherals will continue to run. After the programming unlock sequence). The write latch erase cycle, the processor will resume operation with is now loaded. the third instruction after the EECON1 write instruction. 7. Increment the EEADRH:EEADRL register pair 11.3.3 WRITING TO FLASH PROGRAM to point to the next location. MEMORY 8. Repeat steps 5 through 7 until all but the last Program memory is programmed using the following write latch has been loaded. steps: 9. Clear the LWLO bit of the EECON1 register. When the LWLO bit of the EECON1 register is 1. Load the starting address of the word(s) to be ‘0’, the write sequence will initiate the write to programmed. Flash program memory. 2. Load the write latches with data. 10. Load the EEDATH:EEDATL register pair with 3. Initiate a programming operation. the program memory data to be written. 4. Repeat steps 1 through 3 until all data is written. 11. Write 55h, then AAh, to EECON2, then set the Before writing to program memory, the word(s) to be WR bit of the EECON1 register (Flash written must be erased or previously unwritten. programming unlock sequence). The entire Program memory can only be erased one row at a time. latch block is now written to Flash program No automatic erase occurs upon the initiation of the memory. write. It is not necessary to load the entire write latch block Program memory can be written one or more words at with user program data. However, the entire write latch a time. The maximum number of words written at one block will be written to program memory. time is equal to the number of write latches. See An example of the complete write sequence for eight Figure11-2 (block writes to program memory with 16 words is shown in Example11-5. The initial address is write latches) for more details. The write latches are loaded into the EEADRH:EEADRL register pair; the aligned to the address boundary defined by EEADRL eight words of data are loaded using indirect as shown in Table11-1. Write operations do not cross addressing. these boundaries. At the completion of a program memory write operation, the write latches are reset to contain 0x3FFF. Note: The code sequence provided in Example11-5 must be repeated multiple times to fully program an erased program memory row.  2010-2016 Microchip Technology Inc. DS40001414E-page 111

PIC16(L)F1946/47 After the “BSF EECON1,WR” instruction, the processor continue to run. The processor does not stall when requires two cycles to set up the write operation. The LWLO = 1, loading the write latches. After the write user must place two NOP instructions after the WR bit is cycle, the processor will resume operation with the third set. The processor will halt internal operations for the instruction after the EECON1 write instruction. typical 2ms, only during the cycle in which the write takes place (i.e., the last word of the block write). This is not Sleep mode as the clocks and peripherals will FIGURE 11-2: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 32 WRITE LATCHES 7 5 0 7 0 EEDATH EEDATA 6 8 First word of block Last word of block to be written to be written 14 14 14 14 EEADRL<4:0> = 00000 EEADRL<4:0> = 00001 EEADRL<4:0> = 00010 EEADRL<4:0> = 11111 Buffer Register Buffer Register Buffer Register Buffer Register Program Memory DS40001414E-page 112  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 EXAMPLE 11-4: ERASING ONE ROW OF PROGRAM MEMORY - ; This row erase routine assumes the following: ; 1. A valid address within the erase block is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL EEADRL MOVF ADDRL,W ; Load lower 8 bits of erase address boundary MOVWF EEADRL MOVF ADDRH,W ; Load upper 6 bits of erase address boundary MOVWF EEADRH BSF EECON1,EEPGD ; Point to program memory BCF EECON1,CFGS ; Not configuration space BSF EECON1,FREE ; Specify an erase operation BSF EECON1,WREN ; Enable writes MOVLW 55h ; Start of required sequence to initiate erase MOVWF EECON2 ; Write 55h RequiredSequence MMBNOOSOVVFPLW WF 0EEAEEACChOO NN21 ,WR ;;;; WSArenityt eWi RnA sAbthirtu cttoi obnesg ihne reer aasree ignored as processor ; halts to begin erase sequence NOP ; Processor will stop here and wait for erase complete. ; after erase processor continues with 3rd instruction BCF EECON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts  2010-2016 Microchip Technology Inc. DS40001414E-page 113

PIC16(L)F1946/47 EXAMPLE 11-5: WRITING TO FLASH PROGRAM MEMORY ; This write routine assumes the following: ; 1. The 16 bytes of data are loaded, starting at the address in DATA_ADDR ; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, ; stored in little endian format ; 3. A valid starting address (the least significant bits = 000) is loaded in ADDRH:ADDRL ; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) ; BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL EEADRH ; Bank 3 MOVF ADDRH,W ; Load initial address MOVWF EEADRH ; MOVF ADDRL,W ; MOVWF EEADRL ; MOVLW LOW DATA_ADDR ; Load initial data address MOVWF FSR0L ; MOVLW HIGH DATA_ADDR ; Load initial data address MOVWF FSR0H ; BSF EECON1,EEPGD ; Point to program memory BCF EECON1,CFGS ; Not configuration space BSF EECON1,WREN ; Enable writes BSF EECON1,LWLO ; Only Load Write Latches LOOP MOVIW FSR0++ ; Load first data byte into lower MOVWF EEDATL ; MOVIW FSR0++ ; Load second data byte into upper MOVWF EEDATH ; MOVF EEADRL,W ; Check if lower bits of address are '000' XORLW 0x07 ; Check if we're on the last of 8 addresses ANDLW 0x07 ; BTFSC STATUS,Z ; Exit if last of eight words, GOTO START_WRITE ; MOVLW 55h ; Start of required write sequence: MOVWF EECON2 ; Write 55h RequiredSequence MMBNOOSOVVFPLW WF 0EEAEEACChOO NN21 ,WR ;;;; WSArenityt eWi RnA sAbthirtu cttoi obnesg ihne rwer iatree ignored as processor ; halts to begin write sequence NOP ; Processor will stop here and wait for write to complete. ; After write processor continues with 3rd instruction. INCF EEADRL,F ; Still loading latches Increment address GOTO LOOP ; Write next latches START_WRITE BCF EECON1,LWLO ; No more loading latches - Actually start Flash program ; memory write MOVLW 55h ; Start of required write sequence: MOVWF EECON2 ; Write 55h RequiredSequence MMBNOOSOVVFPLW WF 0EEAEEACChOO NN21 ,WR ;;;; WSArenityt eWi RnA sAbthirtu cttoi obnesg ihne rwer iatree ignored as processor ; halts to begin write sequence NOP ; Processor will stop here and wait for write complete. ; after write processor continues with 3rd instruction BCF EECON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts DS40001414E-page 114  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 11.4 Modifying Flash Program Memory 11.5 User ID, Device ID and Configuration Word Access When modifying existing data in a program memory row, and data within that row must be preserved, it must Instead of accessing program memory or EEPROM first be read and saved in a RAM image. Program data memory, the User ID’s, Device ID/Revision ID and memory is modified using the following steps: Configuration Words can be accessed when CFGS=1 1. Load the starting address of the row to be in the EECON1 register. This is the region that would modified. be pointed to by PC<15>=1, but not all addresses are accessible. Different access may exist for reads and 2. Read the existing data from the row into a RAM writes. Refer to Table11-3. image. 3. Modify the RAM image to contain the new data When read access is initiated on an address outside the to be written into program memory. parameters listed in Table11-3, the EEDATH:EEDATL register pair is cleared. 4. Load the starting address of the row to be rewritten. 5. Erase the program memory row. 6. Load the write latches with data from the RAM image. 7. Initiate a programming operation. 8. Repeat steps 6 and 7 as many times as required to reprogram the erased row. TABLE 11-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS=1) Address Function Read Access Write Access 8000h-8003h User IDs Yes Yes 8006h Device ID/Revision ID Yes No 8007h-8008h Configuration Words 1 and 2 Yes No EXAMPLE 11-3: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL EEADRL ; Select correct Bank MOVLW PROG_ADDR_LO ; MOVWF EEADRL ; Store LSB of address CLRF EEADRH ; Clear MSB of address BSF EECON1,CFGS ; Select Configuration Space BCF INTCON,GIE ; Disable interrupts BSF EECON1,RD ; Initiate read NOP ; Executed (See Figure 11-1) NOP ; Ignored (See Figure 11-1) BSF INTCON,GIE ; Restore interrupts MOVF EEDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF EEDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location  2010-2016 Microchip Technology Inc. DS40001414E-page 115

PIC16(L)F1946/47 11.6 Write Verify Depending on the application, good programming practice may dictate that the value written to the data EEPROM or program memory should be verified (see Example11-6) to the desired value to be written. Example11-6 shows how to verify a write to EEPROM. EXAMPLE 11-6: EEPROM WRITE VERIFY BANKSELEEDATL ; MOVF EEDATL, W ;EEDATL not changed ;from previous write BSF EECON1, RD ;YES, Read the ;value written XORWF EEDATL, W ; BTFSS STATUS, Z ;Is data the same GOTO WRITE_ERR ;No, handle error : ;Yes, continue DS40001414E-page 116  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 11.7 Register Definitions: Data EEPROM Control REGISTER 11-1: EEDATL: EEPROM DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u EEDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEDAT<7:0>: Read/write value for EEPROM data byte or Least Significant bits of program memory REGISTER 11-2: EEDATH: EEPROM DATA HIGH BYTE REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — EEDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 EEDAT<13:8>: Read/write value for Most Significant bits of program memory  2010-2016 Microchip Technology Inc. DS40001414E-page 117

PIC16(L)F1946/47 REGISTER 11-3: EEADRL: EEPROM ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 EEADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEADR<7:0>: Specifies the Least Significant bits for program memory address or EEPROM address REGISTER 11-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 —(1) EEADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘1’ bit 6-0 EEADR<14:8>: Specifies the Most Significant bits for program memory address or EEPROM address Note 1: Unimplemented, read as ‘1’. DS40001414E-page 118  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 11-5: EECON1: EEPROM CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W-x/q R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 EEPGD CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 EEPGD: Flash Program/Data EEPROM Memory Select bit 1 = Accesses program space Flash memory 0 = Accesses data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Accesses Configuration, User ID and Device ID Registers 0 = Accesses Flash Program or data EEPROM Memory bit 5 LWLO: Load Write Latches Only bit If CFGS=1 (Configuration space) OR CFGS=0 and EEPGD=1 (program Flash): 1 = The next WR command does not initiate a write; only the program memory latches are updated. 0 = The next WR command writes a value from EEDATH:EEDATL into program memory latches and initiates a write of all the data stored in the program memory latches. If CFGS=0 and EEPGD=0: (Accessing data EEPROM) LWLO is ignored. The next WR command initiates a write to the data EEPROM. bit 4 FREE: Program Flash Erase Enable bit If CFGS=1 (Configuration space) OR CFGS=0 and EEPGD=1 (program Flash): 1 = Performs an erase operation on the next WR command (cleared by hardware after completion of erase). 0 = Performs a write operation on the next WR command. If EEPGD=0 and CFGS= 0: (Accessing data EEPROM) FREE is ignored. The next WR command will initiate both a erase cycle and a write cycle. bit 3 WRERR: EEPROM Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit). 0 = The program or erase operation completed normally. bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash and data EEPROM bit 1 WR: Write Control bit 1 = Initiates a program Flash or data EEPROM program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash or data EEPROM is complete and inactive. bit 0 RD: Read Control bit 1 = Initiates an program Flash or data EEPROM read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash or data EEPROM data read.  2010-2016 Microchip Technology Inc. DS40001414E-page 119

PIC16(L)F1946/47 REGISTER 11-6: EECON2: EEPROM CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 EEPROM Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Data EEPROM Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the EECON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. Refer to Section11.2.2 “Writing to the Data EEPROM Memory” for more information. TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 119 EECON2 EEPROM Control Register 2 (not a physical register) 106* EEADRL EEADRL<7:0> 118 EEADRH —(1) EEADRH<6:0> 118 EEDATL EEDATL<7:0> 117 EEDATH — — EEDATH<5:0> 117 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by data EEPROM module. * Page provides register information. Note 1: Unimplemented, read as ‘1’. DS40001414E-page 120  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.0 I/O PORTS FIGURE 12-1: GENERIC I/O PORT OPERATION Each port has three standard registers for its operation. These registers are: • TRISx registers (data direction) • PORTx registers (reads the levels on the pins of Read LATx TRISx the device) • LATx registers (output latch) D Q Some ports may have one or more of the following Write LATx Write PORTx additional registers. These registers are: CK VDD • ANSELx (analog select) Data Register • WPUx (weak pull-up) Data Bus In general, when a peripheral is enabled on a port pin, I/O pin that pin cannot be used as a general purpose output. Read PORTx However, the pin can still be read. To peripherals VSS ANSELx TABLE 12-1: PORT AVAILABILITY PER DEVICE A B C D E F G EXAMPLE 12-1: INITIALIZING PORTA T T T T T T T Device R R R R R R R ; This code example illustrates O O O O O O O P P P P P P P ; initializing the PORTA register. The ; other ports are initialized in the same PIC16F1946 ● ● ● ● ● ● ● ; manner. PIC16F1947 ● ● ● ● ● ● ● BANKSEL PORTA ; The Data Latch (LATx registers) is useful for CLRF PORTA ;Init PORTA read-modify-write operations on the value that the I/O BANKSEL LATA ;Data Latch pins are driving. CLRF LATA ; BANKSEL ANSELA ; A write operation to the LATx register has the same CLRF ANSELA ;digital I/O effect as a write to the corresponding PORTx register. BANKSEL TRISA ; A read of the LATx register reads of the values held in MOVLW B'00111000' ;Set RA<5:3> as inputs the I/O PORT latches, while a read of the PORTx MOVWF TRISA ;and set RA<2:0> as register reads the actual I/O pin value. ;outputs Ports that support analog inputs have an associated ANSELx register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure12-1.  2010-2016 Microchip Technology Inc. DS40001414E-page 121

PIC16(L)F1946/47 12.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register12-1. For this device family, the following functions can be moved between different pins. • CCP3/P3C output • CCP3/P3B output • CCP2/P2D output • CCP2/P2C output • CCP2/P2B output • CCP2/P2A output • CCP1/P1C output • CCP1/P1B output These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected. DS40001414E-page 122  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.2 Register Definitions: Alternate Pin Function Control REGISTER 12-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 P3CSEL: CCP3 PWM C Output Pin Selection bit 0 = P3C function is on RE3/P3C/COM0 1 = P3C function is on RD3/P3C/SEG3 bit 6 P3BSEL: CCP3 PWM B Output Pin Selection bit 0 = P3B function is on RE4/P3B/COM1 1 = P3B function is on RD4/P3B/SEG4 bit 5 P2DSEL: CCP2 PWM D Output Pin Selection bit 0 = P2D function is on RE0/P2D/VLCD1 1 = P2D function is on RD0/P2D/SEG0 bit 4 P2CSEL: CCP2 PWM C Output Pin Selection bit 0 = P2C function is on RE1/P2C/VLCD2 1 = P2C function is on RD1/P2C/SEG1 bit 3 P2BSEL: CCP2 PWM B Output Pin Selection bit 0 = P2B function is on RE2/P2B/VLCD3 1 = P2B function is on RD2/P2B/SEG2 bit 2 CCP2SEL: CCP2 Input/Output Pin Selection bit 0 = CCP2/P2A function is on RC1/CCP2/P2A/T1OSI/SEG32 1 = CCP2/P2A function is on RE7/CCP2/P2A/SEG31 bit 1 P1CSEL: CCP1 PWM C Output Pin Selection bit 0 = P1C function is on RE5/P1C/COM2 1 = P1C function is on RD5/P1C/SEG5 bit 0 P1BSEL: CCP1 PWM B Output Pin Selection bit 0 = P1B function is on RE6/P1B/COM3 1 = P1B function is on RD6/P1B/SEG6  2010-2016 Microchip Technology Inc. DS40001414E-page 123

PIC16(L)F1946/47 12.3 PORTA Registers 12.3.2 PORTA FUNCTIONS AND OUTPUT PRIORITIES PORTA is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISA Each PORTA pin is multiplexed with other functions. The (Register12-3). Setting a TRISA bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTA pin an input (i.e., disable the are shown in Table12-2. output driver). Clearing a TRISA bit (= 0) will make the When multiple outputs are enabled, the actual pin corresponding PORTA pin an output (i.e., enables control goes to the peripheral with the highest priority. output driver and puts the contents of the output latch Analog input functions, such as ADC, comparator and on the selected pin). Example12-1 shows how to CapSense inputs, are not shown in the priority lists. initialize PORTA. These inputs are active when the I/O pin is set for Reading the PORTA register (Register12-2) reads the Analog mode using the ANSELx registers. Digital status of the pins, whereas writing to it will write to the output functions may control the pin when it is in Analog PORT latch. All write operations are read-modify-write mode with the priority list. operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then TABLE 12-2: PORTA OUTPUT PRIORITY written to the PORT data latch (LATA). The TRISA register (Register12-3) controls the Pin Function Priority(1) PORTA pin output drivers, even when they are being Name used as analog inputs. The user should ensure the bits RA0 SEG33 (LCD) in the TRISA register are maintained set when using RA0 them as analog inputs. I/O pins configured as analog RA1 SEG18 input always read ‘0’. RA1 12.3.1 ANSELA REGISTER RA2 SEG34 (LCD) RA2 The ANSELA register (Register12-5) is used to configure the Input mode of an I/O pin to analog. RA3 SEG35 (LCD) Setting the appropriate ANSELA bit high will cause all RA3 digital reads on the pin to be read as ‘0’ and allow RA4 SEG14 (LCD) analog functions on the pin to operate correctly. RA4 The state of the ANSELA bits has no effect on digital RA5 SEG15 (LCD) output functions. A pin with TRIS clear and ANSEL set RA5 will still operate as a digital output, but the Input mode RA6 OSC2 (enabled by Configuration Word) will be analog. This can cause unexpected behavior CLKOUT (enabled by Configuration Word) when executing read-modify-write instructions on the SEG36 (LCD) affected port. RA6 Note: The ANSELA bits default to the Analog RA7 OSC1/CLKIN (enabled by Configuration mode after Reset. To use any pins as Word) digital general purpose or peripheral SEG37 (LCD) inputs, the corresponding ANSEL bits RA7 must be initialized to ‘0’ by user software. Note 1: Priority listed from highest to lowest. DS40001414E-page 124  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.4 Register Definitions: PORTA REGISTER 12-2: PORTA: PORTA REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RA<7:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 12-3: TRISA: PORTA TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISA<7:0>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output REGISTER 12-4: LATA: PORTA DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATA<7:0>: PORTA Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values.  2010-2016 Microchip Technology Inc. DS40001414E-page 125

PIC16(L)F1946/47 REGISTER 12-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — ANSA5 — ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 ANSA5: Analog Select between Analog or Digital Function on pins RA<5>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. bit 4 Unimplemented: Read as ‘0’ bit 3-0 ANSA<3:0>: Analog Select between Analog or Digital Function on pins RA<3:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ADCON0 — CHS<4:0> GO/DONE ADON 161 ADCON1 ADFM ADCS<2:0> — — ADPREF<1:0> 162 ANSELA — — ANSA5 — ANSA3 ANSA2 ANSA1 ANSA0 126 CPSCON0 CPSON CPSRM — — CPSRNG1 CPSRNG0 CPSOUT T0XCS 322 CPSCON1 — — — CPSCH<4:0> 323 DACCON0 DACEN DACLPS DACOE --- DACPSS<1:0> --- DACNSS 171 LATA LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 125 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 330 LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 330 LCDSE4 SE39 SE38 SE37 SE36 SE35 SE34 SE33 SE32 330 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 188 PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 125 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 125 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. TABLE 12-4: SUMMARY OF CONFIGURATION WORD WITH PORTA Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD CONFIG1 54 7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. DS40001414E-page 126  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.5 PORTB Registers 12.5.3 PORTB FUNCTIONS AND OUTPUT PRIORITIES PORTB is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB Each PORTB pin is multiplexed with other functions. The (Register12-7). Setting a TRISB bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTB pin an input (i.e., put the are shown in Table12-5. corresponding output driver in a High-Impedance mode). When multiple outputs are enabled, the actual pin Clearing a TRISB bit (= 0) will make the corresponding control goes to the peripheral with the highest priority. PORTB pin an output (i.e., enable the output driver and Analog input and some digital input functions are not put the contents of the output latch on the selected pin). included in the list below. These input functions can Example12-1 shows how to initialize an I/O port. remain active when the pin is configured as an output. Reading the PORTB register (Register12-6) reads the Certain digital input functions, such as the EUSART RX status of the pins, whereas writing to it will write to the signal, override other port functions and are included in PORT latch. All write operations are read-modify-write the priority list. operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATB). TABLE 12-5: PORTB OUTPUT PRIORITY The TRISB register (Register12-7) controls the PORTB Pin Function Priority(1) pin output drivers, even when they are being used as Name analog inputs. The user should ensure the bits in the RB0 SEG30 (LED) TRISB register are maintained set when using them as SRI (SR Latch) analog inputs. I/O pins configured as analog inputs RB0 always read ‘0’. RB1 SEG8 (LCD) 12.5.1 WEAK PULL-UPS RB1 Each of the PORTB pins has an individually configurable RB2 SEG9 (LCD) internal weak pull-up. Control bits WPUB<7:0> enable or RB2 disable each pull-up (see Register12-9). Each weak RB3 SEG10 (LCD) pull-up is automatically turned off when the port pin is RB3 configured as an output. All pull-ups are disabled on a RB4 SEG11 (LCD) Power-on Reset by the WPUEN bit of the OPTION_REG RB4 register. RB5 SEG29 (LCD) 12.5.2 INTERRUPT-ON-CHANGE RB5 All of the PORTB pins are individually configurable as RB6 ICSPCLK (Programming) an interrupt-on-change pin. Control bits IOCB<7:0> ICDCLK (enabled by Configuration Word) enable or disable the interrupt function for each pin. SEG38 (LCD) The interrupt-on-change feature is disabled on a RB6 Power-on Reset. Reference Section13.0 RB7 ICSPDAT (Programming) “Interrupt-On-Change” for more information. ICDDAT (enabled by Configuration Word) SEG39 (LCD) RB7 Note 1: Priority listed from highest to lowest.  2010-2016 Microchip Technology Inc. DS40001414E-page 127

PIC16(L)F1946/47 12.6 Register Definitions: PORTB REGISTER 12-6: PORTB: PORTB REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RB<7:0>: PORTB I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-7: TRISB: PORTB TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISB<7:0>: PORTB Tri-State Control bits 1 = PORTB pin configured as an input (tri-stated) 0 = PORTB pin configured as an output REGISTER 12-8: LATB: PORTB DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATB<7:0>: PORTB Output Latch Value bits(1) Note 1: Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of actual I/O pin values. DS40001414E-page 128  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 12-9: WPUB: WEAK PULL-UP PORTB REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 WPUB<7:0>: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in configured as an output. TABLE 12-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 148 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 148 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 148 LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 128 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 330 LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 330 LCDSE4 SE39 SE38 SE37 SE36 SE35 SE34 SE33 SE32 330 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 188 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 128 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 198 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 129 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTB.  2010-2016 Microchip Technology Inc. DS40001414E-page 129

PIC16(L)F1946/47 12.7 PORTC Registers 12.7.1 PORTC FUNCTIONS AND OUTPUT PRIORITIES PORTC is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISC Each PORTC pin is multiplexed with other functions. The (Register12-11). Setting a TRISC bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTC pin an input (i.e., put the are shown in Table12-7. corresponding output driver in a High-Impedance mode). When multiple outputs are enabled, the actual pin Clearing a TRISC bit (= 0) will make the corresponding control goes to the peripheral with the highest priority. PORTC pin an output (i.e., enable the output driver and Analog input and some digital input functions are not put the contents of the output latch on the selected pin). included in the list below. These input functions can Example12-1 shows how to initialize an I/O port. remain active when the pin is configured as an output. Certain digital input functions override other port Reading the PORTC register (Register12-10) reads the functions and are included in the priority list. status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the TABLE 12-7: PORTC OUTPUT PRIORITY port pins are read, this value is modified and then written to the PORT data latch (LATC). Pin Name Function Priority(1) The TRISC register (Register12-11) controls the RC0 T1OSO (Timer1 Oscillator) PORTC pin output drivers, even when they are being SEG40 (ICD) used as analog inputs. The user should ensure the bits in RC0 the TRISC register are maintained set when using them RC1 T1OSI (Timer1 Oscillator) as analog inputs. I/O pins configured as analog inputs CCP2(2)/P2A(2) always read ‘0’. SEG32 (ICD) RC1 RC2 SEG13 (LCD) CCP1/P1A RC2 RC3 SEG17 (LCD) SCL1 (MSSP1) SCK1 (MSSP1) RC3 RC4 SEG16 (LCD) SDA1 (MSSP1) RC4 RC5 SEG12 (LCD) SDO1 (MSSP1) RC5 RC6 SEG27 (LCD) TX1 (EUSART1) CK1 (EUSART1) RC6 RC7 SEG28 (LCD) DT1 (EUSART1) RC7 Note 1: Priority listed from highest to lowest. 2: Default pin (see APFCON register). DS40001414E-page 130  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.8 Register Definitions: PORTC REGISTER 12-10: PORTC: PORTC REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RC<7:0>: PORTC General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-11: TRISC: PORTC TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISC<7:0>: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output REGISTER 12-12: LATC: PORTC DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATC<7:0>: PORTC Output Latch Value bits(1) Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values.  2010-2016 Microchip Technology Inc. DS40001414E-page 131

PIC16(L)F1946/47 TABLE 12-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 131 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 330 LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 330 LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 330 LCDSE4 SE39 SE38 SE37 SE36 SE35 SE34 SE33 SE32 330 LCDSE5 — — SE45 SE44 SE43 SE42 SE41 SE40 330 PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 131 RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 282 SSP2STAT SMP CKE D/A P S R/W UA BF 281 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC. DS40001414E-page 132  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.9 PORTD Registers 12.9.1 PORTD FUNCTIONS AND OUTPUT PRIORITIES PORTD is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB Each PORTD pin is multiplexed with other functions. The (Register12-13). Setting a TRISD bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTD pin an input (i.e., put the are shown in Table12-9. corresponding output driver in a High-Impedance mode). When multiple outputs are enabled, the actual pin Clearing a TRISD bit (= 0) will make the corresponding control goes to the peripheral with the highest priority. PORTD pin an output (i.e., enable the output driver and Analog input and some digital input functions are not put the contents of the output latch on the selected pin). included in the list below. These input functions can Example12-1 shows how to initialize an I/O port. remain active when the pin is configured as an output. Reading the PORTD register (Register12-13) reads the Certain digital input functions override other port status of the pins, whereas writing to it will write to the functions and are included in the priority list. PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the TABLE 12-9: PORTD OUTPUT PRIORITY port pins are read, this value is modified and then written to the PORT data latch (LATD). Pin Name Function Priority(1) The TRISD register (Register12-14) controls the PORTD RD0 SEG0 (LCD) pin output drivers, even when they are being used as P2D(2) (CCP) analog inputs. The user should ensure the bits in the RD0 TRISD register are maintained set when using them as RD1 SEG1 (LCD) analog inputs. I/O pins configured as analog inputs P2C(2) (CCP) always read ‘0’. RD1 RD2 P2B(2) (CCP) SEG2 (LCD) RD2 RD3 SEG3 (LCD) P3C(2) (CCP) RD3 RD4 SEG4 (LCD) P3B(2) (CCP) SDO2 (SSP2) RD4 RD5 SEG5 (LCD) P1C(2) (CCP) SDA2 (SSP2) RD5 RD6 SEG6 (LED) P1B(2) (CCP) SCK2/SCL2 (SSP2) RD6 RD7 SEG7 (LCD) RD7 Note 1: Priority listed from highest to lowest. 2: Alternate pin (see APFCON register).  2010-2016 Microchip Technology Inc. DS40001414E-page 133

PIC16(L)F1946/47 12.10 Register Definitions: PORTD REGISTER 12-13: PORTD: PORTD REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RD<7:0>: PORTD General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-14: TRISD: PORTD TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISD<7:0>: PORTD Tri-State Control bits 1 = PORTD pin configured as an input (tri-stated) 0 = PORTD pin configured as an output REGISTER 12-15: LATD: PORTD DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATD<7:0>: PORTD Output Latch Value bits(1) Note 1: Writes to PORTD are actually written to corresponding LATD register. Reads from PORTD register is return of actual I/O pin values. DS40001414E-page 134  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 12-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 LATD LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 134 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 326 LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 330 PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 134 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 134 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTD. Note 1: Applies to ECCP modules only.  2010-2016 Microchip Technology Inc. DS40001414E-page 135

PIC16(L)F1946/47 12.11 PORTE Registers 12.11.2 PORTE FUNCTIONS AND OUTPUT PRIORITIES PORTE is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISE. Setting a Each PORTE pin is multiplexed with other functions. The TRISE bit (= 1) will make the corresponding PORTE pin pins, their combined functions and their output priorities an input (i.e., put the corresponding output driver in a are shown in Table12-11. High-Impedance mode). Clearing a TRISE bit (= 0) will When multiple outputs are enabled, the actual pin make the corresponding PORTE pin an output (i.e., control goes to the peripheral with the highest priority. enable the output driver and put the contents of the Each PORTE pin is multiplexed with other functions. The output latch on the selected pin). Example12-1 shows pins, their combined functions and their output priorities how to initialize an I/O port. are briefly described here. For additional information, Reading the PORTE register (Register12-16) reads refer to the appropriate section in this data sheet. the status of the pins, whereas writing to it will write to When multiple outputs are enabled, the actual pin the PORT latch. All write operations are control goes to the peripheral with the lowest number in read-modify-write operations. Therefore, a write to a the following lists. port implies that the port pins are read, this value is modified and then written to the PORT data latch Analog input and some digital input functions are not (LATE). included in the list below. These input functions can remain active when the pin is configured as an output. 12.11.1 ANSELE REGISTER Certain digital input functions, such as the EUSART RX signal, override other port functions and are included in The ANSELE register (Register12-19) is used to the priority list. configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELE bit high will cause all digital reads on the pin to be read as ‘0’ and allow TABLE 12-11: PORTE OUTPUT PRIORITY analog functions on the pin to operate correctly. Pin Name Function Priority(1) The state of the ANSELE bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set RE0 P2D(2) (CCP) will still operate as a digital output, but the Input mode RE0 will be analog. This can cause unexpected behavior RE1 P2C(2) (CCP) when executing read-modify-write instructions on the RE1 affected port. RE2 P2B(2) (CCP) The TRISE register (Register12-17) controls the PORTE RE2 pin output drivers, even when they are being used as RE3 P3C(2) (CCP) analog inputs. The user should ensure the bits in the COM0 (LCD) TRISE register are maintained set when using them as RE3 analog inputs. I/O pins configured as analog inputs RE4 P3B(2) (CCP) always read ‘0’. COM1 (LCD) Note: The ANSELE register must be initialized RE4 to configure an analog channel as a digital RE5 P1C(2) (CCP) input. Pins configured as analog inputs COM2 (LCD) will read ‘0’. RE5 RE6 P1B(2) (CCP) COM3 (LCD) RE6 RE7 CCP2(3)/P2A(3) (CCP) SEG31 (LCD) RE7 Note 1: Priority listed from highest to lowest. 2: Default pin (see APFCON register). 3: Alternate pin (see APFCON register). DS40001414E-page 136  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.12 Register Definitions: PORTE REGISTER 12-16: PORTE: PORTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RE<7:0>: PORTE I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-17: TRISE: PORTE TRI-STATE REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISE<7:0>: RE<7:0> Tri-State Control bits 1 = PORTE pin configured as an input (tri-stated) 0 = PORTE pin configured as an output  2010-2016 Microchip Technology Inc. DS40001414E-page 137

PIC16(L)F1946/47 REGISTER 12-18: LATE: PORTE DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATE<7:0>: PORTE Output Latch Value bits(1) Note 1: Writes to PORTE are actually written to corresponding LATE register. Reads from PORTE register is return of actual I/O pin values. REGISTER 12-19: ANSELE: PORTE ANALOG SELECT REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — — — — ANSE2 ANSE1 ANSE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ANSE<7:0>: Analog Select between Analog or Digital Function on Pins RE<7:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 12-12: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 ANSELE — — — — — ANSE2 ANSE1 ANSE0 138 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 LATE LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 138 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 326 LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — 328 LCDSE2 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 330 PORTE RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 137 TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 137 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTE. Note 1: Applies to ECCP modules only. DS40001414E-page 138  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.13 PORTF Registers 12.13.2 PORTF FUNCTIONS AND OUTPUT PRIORITIES PORTF is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISF Each PORTF pin is multiplexed with other functions. The (Register12-21). Setting a TRISF bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTF pin an input (i.e., put the are shown in Table12-13. corresponding output driver in a High-Impedance mode). When multiple outputs are enabled, the actual pin Clearing a TRISF bit (= 0) will make the corresponding control goes to the peripheral with the highest priority. PORTF pin an output (i.e., enable the output driver and Analog input and some digital input functions are not put the contents of the output latch on the selected pin). included in the list below. These input functions can Example12-1 shows how to initialize an I/O port. remain active when the pin is configured as an output. Reading the PORTF register (Register12-13) reads the Certain digital input functions override other port status of the pins, whereas writing to it will write to the functions and are included in the priority list. PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the TABLE 12-13: PORTF OUTPUT PRIORITY port pins are read, this value is modified and then written to the PORT data latch (LATF). Pin Name Function Priority(1) The TRISF register (Register12-14) controls the RF0 SEG41 (LCD) PORTF pin output drivers, even when they are being RF0 used as analog inputs. The user should ensure the bits RF1 C2OUT (Comparator) in the TRISF register are maintained set when using SRNQ (SR Latch) them as analog inputs. I/O pins configured as analog SEG19 (LCD) inputs always read ‘0’. RF1 12.13.1 ANSELF REGISTER RF2 C1OUT (Comparator) SEG20 (LCD) The ANSELF register (Register12-23) is used to SRQ (SR Latch) configure the Input mode of an I/O pin to analog. RF2 Setting the appropriate ANSELF bit high will cause all RF3 SEG21 (LCD) digital reads on the pin to be read as ‘0’ and allow RF3 analog functions on the pin to operate correctly. RF4 SEG22 (LCD) The state of the ANSELF bits has no effect on digital RF4 output functions. A pin with TRIS clear and ANSEL set RF5 DACOUT (DAC) will still operate as a digital output, but the Input mode SEG23 (LCD) will be analog. This can cause unexpected behavior RF5 when executing read-modify-write instructions on the RF6 SEG24 (LCD) affected port. RF6 Note: The ANSELF register must be initialized RF7 SEG25 (LCD) to configure an analog channel as a digital RF7 input. Pins configured as analog inputs Note 1: Priority listed from highest to lowest. will read ‘0’.  2010-2016 Microchip Technology Inc. DS40001414E-page 139

PIC16(L)F1946/47 12.14 Register Definitions: PORTF REGISTER 12-20: PORTF: PORTF REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RF<7:0>: PORTF General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-21: TRISF: PORTF TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISF<7:0>: PORTF Tri-State Control bits 1 = PORTF pin configured as an input (tri-stated) 0 = PORTF pin configured as an output REGISTER 12-22: LATF: PORTF DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 LATF<7:0>: PORTF Output Latch Value bits(1) Note 1: Writes to PORTF are actually written to corresponding LATF register. Reads from PORTF register is return of actual I/O pin values. DS40001414E-page 140  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 12-23: ANSELF: PORTF ANALOG SELECT REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 ANSF7 ANSF6 ANSF5 ANSDF4 ANSF3 ANSF2 ANSDF1 ANSF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ANSF<7:0>: Analog Select between Analog or Digital Function on Pins RF<7:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 12-14: SUMMARY OF REGISTERS ASSOCIATED WITH PORTF Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page ADCON0 — CHS<4:0> GO/DONE ADON 161 ANSELF ANSF7 ANSF6 ANSF5 ANSF4 ANSF3 ANSF2 ANSF1 ANSF0 141 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CMOUT — — — — — MC3OUT MC2OUT MC1OUT 179 CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0 — — C1NCH<1:0> 179 CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0 — — C2NCH<1:0> 179 CPSCON0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS 322 CPSCON1 — — — — CPSCH<3:0> 323 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 171 LATF LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 134 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 326 LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 330 LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 330 LCDSE5 — — SE45 SE44 SE43 SE42 SE41 SE40 330 PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 140 SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR 184 TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 140 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTF. Note 1: Applies to ECCP modules only. TABLE 12-15: SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH PORTF Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — LVP DEBUG — BORV STVREN PLLEN CONFIG2 56 7:0 — — — VCAPEN — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.  2010-2016 Microchip Technology Inc. DS40001414E-page 141

PIC16(L)F1946/47 12.15 PORTG Registers 12.15.2 PORTG FUNCTIONS AND OUTPUT PRIORITIES PORTG is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISG Each PORTG pin is multiplexed with other functions. The (Register12-25). Setting a TRISG bit (= 1) will make the pins, their combined functions and their output priorities corresponding PORTG pin an input (i.e., put the are shown in Table12-16. corresponding output driver in a High-Impedance mode). When multiple outputs are enabled, the actual pin Clearing a TRISG bit (= 0) will make the corresponding control goes to the peripheral with the highest priority. PORTG pin an output (i.e., enable the output driver and Analog input and some digital input functions are not put the contents of the output latch on the selected pin). included in the list below. These input functions can The exception is RG5, which is input only and its TRIS remain active when the pin is configured as an output. bit will always read as ‘1’. Example12-1 shows how to Certain digital input functions override other port initialize an I/O port. functions and are included in the priority list. Reading the PORTG register (Register12-24) reads the status of the pins, whereas writing to it will write to the TABLE 12-16: PORTG OUTPUT PRIORITY PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the Pin Name Function Priority(1) port pins are read, this value is modified and then written RG0 CCP3 (CCP) to the PORT data latch (LATG). RG5 reads ‘0’ when P3A (CCP) MCLRE = 1. SEG42 (LCD) The TRISG register (Register12-25) controls the RG0 PORTG pin output drivers, even when they are being RG1 TX2 (EUSART) used as analog inputs. The user should ensure the bits CK2 (EUSART) in the TRISG register are maintained set when using C3OUT (Comparator) them as analog inputs. I/O pins configured as analog SEG43 (LCD) inputs always read ‘0’. RG1 12.15.1 ANSELG REGISTER RG2 DT2 SEG44 (LCD) The ANSELG register (Register12-27) is used to RG2 configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELG bit high will cause all RG3 CCP4 (CCP) digital reads on the pin to be read as ‘0’ and allow P3D (CCP) analog functions on the pin to operate correctly. SEG45 (LCD) RG3 The state of the ANSELG bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set RG4 CCP5 (CCP) will still operate as a digital output, but the Input mode P1D (CCP) will be analog. This can cause unexpected behavior SEG26 (LCD) when executing read-modify-write instructions on the RG4 affected port. RG5 Input-only pin Note: The ANSELG register must be initialized Note 1: Priority listed from highest to lowest. to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. DS40001414E-page 142  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 12.16 Register Definitions: PORTG REGISTER 12-24: PORTG: PORTG REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — RG5 RG4 RG3 RG2 RG1 RG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’. bit 5-0 RG<5:0>: PORTG General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-25: TRISG: PORTG TRI-STATE REGISTER U-0 U-0 R-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’. bit 5 TRISG5: PORTG Tri-State Control bit This bit (RG5 pin) is an input only and always read as ‘1’. bit 4-0 TRISG<4:0>: PORTG Tri-State Control bits 1 = PORTG pin configured as an input (tri-stated) 0 = PORTG pin configured as an output REGISTER 12-26: LATG: PORTG DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — LATG5 LATG4 LATG3 LATG2 LATG1 LATG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’. bit 5-0 LATG<5:0>: PORTG Output Latch Value bits Note 1: Writes to PORTG are actually written to corresponding LATG register. Reads from PORTG register is return of actual I/O pin values.  2010-2016 Microchip Technology Inc. DS40001414E-page 143

PIC16(L)F1946/47 REGISTER 12-27: ANSELG: PORTG ANALOG SELECT REGISTER U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 U-0 — — — ANSG4 ANSG3 ANSG2 ANSG1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’. bit 4-1 ANSG<4:1>: Analog Select between Analog or Digital Function on Pins RG<4:0>, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. bit 0 Unimplemented: Read as ‘0’. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. REGISTER 12-28: WPUG: WEAK PULL-UP PORTG REGISTER U-0 U-0 R/W-1/1 U-0 U-0 U-0 U-0 U-0 — — WPUG5 — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’. bit 5 WPUG5: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled bit 4-0 Unimplemented: Read as ‘0’. Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in configured as an output. DS40001414E-page 144  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 12-17: SUMMARY OF REGISTERS ASSOCIATED WITH PORTG Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page ADCON0 — CHS<4:0> GO/DONE ADON 161 ANSELG — — — ANSG4 ANSG3 ANSG2 ANSG1 — 144 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CMOUT — — — — — MC3OUT MC2OUT MC1OUT 179 CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0 — — C1NCH<1:0> 179 CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0 — — C2NCH<1:0> 179 CPSCON0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS 322 CPSCON1 — — — — CPSCH<3:0> 323 LATG — — — LATG4 LATG3 LATG2 LATG1 LATG0 143 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 326 LCDSE3 SE31 SE30 SE29 SE28 SE27 SE26 SE25 SE24 330 LCDSE5 — — SE45 SE44 SE43 SE42 SE41 SE40 330 PORTG — — RG5 RG4 RG3 RG2 RG1 RG0 143 TRISG — — TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 WPUG — — WPUG5 — — — — — 144 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTG. Note 1: Applies to ECCP modules only.  2010-2016 Microchip Technology Inc. DS40001414E-page 145

PIC16(L)F1946/47 13.0 INTERRUPT-ON-CHANGE 13.3 Interrupt Flags The PORTB pins can be configured to operate as The IOCBFx bits located in the IOCBF register are Interrupt-On-Change (IOC) pins. An interrupt can be status flags that correspond to the interrupt-on-change generated by detecting a signal that has either a rising pins of PORTB. If an expected edge is detected on an edge or a falling edge. Any individual PORTB pin, or appropriately enabled pin, then the status flag for that pin combination of PORTB pins, can be configured to will be set, and an interrupt will be generated if the IOCIE generate an interrupt. The interrupt-on-change module bit is set. The IOCIF bit of the INTCON register reflects has the following features: the status of all IOCBFx bits. • Interrupt-on-change enable (Master Switch) 13.4 Clearing Interrupt Flags • Individual pin configuration • Rising and falling edge detection The individual status flags, (IOCBFx bits), can be • Individual pin interrupt flags cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated Figure13-1 is a block diagram of the IOC module. status flag will be set at the end of the sequence, regardless of the value actually being written. 13.1 Enabling the Module In order to ensure that no detected edge is lost while To allow individual PORTB pins to generate an interrupt, clearing flags, only AND operations masking out known the IOCIE bit of the INTCON register must be set. If the changed bits should be performed. The following IOCIE bit is disabled, the edge detection on the pin will sequence is an example of what should be performed. still occur, but an interrupt will not be generated. EXAMPLE 13-1: CLEARING INTERRUPT 13.2 Individual Pin Configuration FLAGS (PORTA EXAMPLE) For each PORTB pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a MOVLW 0xff rising edge, the associated IOCBPx bit of the IOCBP XORWF IOCAF, W register is set. To enable a pin to detect a falling edge, ANDWF IOCAF, F the associated IOCBNx bit of the IOCBN register is set. A pin can be configured to detect rising and falling 13.5 Operation in Sleep edges simultaneously by setting both the IOCBPx bit and the IOCBNx bit of the IOCBP and IOCBN registers, The interrupt-on-change interrupt sequence will wake respectively. the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCBF register will be updated prior to the first instruction executed out of Sleep. DS40001414E-page 146  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM IOCBNx D Q Q4Q1 CK edge detect R RBx data bus = S to data bus IOCBPx D Q 0 or 1 D Q IOCBFx CK write IOCBFx CK IOCIE R Q2 from all other IOCBFx individual IOC interrupt pin detectors to CPU core Q1 Q1 Q1 Q2 Q2 Q2 Q3 Q3 Q3 Q4 Q4 Q4 Q4 Q4Q1 Q4Q1 Q4Q1 Q4Q1  2010-2016 Microchip Technology Inc. DS40001414E-page 147

PIC16(L)F1946/47 13.6 Register Definitions: Interrupt-on-Change Control REGISTER 13-1: IOCBP: INTERRUPT-ON-CHANGE PORTB POSITIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBP<7:0>: Interrupt-on-Change PORTB Positive Edge Enable bits 1 = Interrupt-on-change enabled on the pin for a positive going edge. IOCBFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-change disabled for the associated pin. REGISTER 13-2: IOCBN: INTERRUPT-ON-CHANGE PORTB NEGATIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBN<7:0>: Interrupt-on-Change PORTB Negative Edge Enable bits 1 = Interrupt-on-change enabled on the pin for a negative going edge. IOCBFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-change disabled for the associated pin. REGISTER 13-3: IOCBF: INTERRUPT-ON-CHANGE PORTB FLAG REGISTER R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-0 IOCBF<7:0>: Interrupt-on-Change PORTB Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCBPx=1 and a rising edge was detected on RBx, or when IOCBNx=1 and a falling edge was detected on RBx. 0 = No change was detected, or the user cleared the detected change. DS40001414E-page 148  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 13-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 148 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 148 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 148 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change.  2010-2016 Microchip Technology Inc. DS40001414E-page 149

PIC16(L)F1946/47 14.0 FIXED VOLTAGE REFERENCE 14.1 Independent Gain Amplifiers (FVR) The output of the FVR supplied to the ADC, Comparators, DAC and CPS module is routed through The Fixed Voltage Reference, or FVR, is a stable two independent programmable gain amplifiers. Each voltage reference, independent of VDD, with 1.024V, amplifier can be configured to amplify the reference 2.048V or 4.096V selectable output levels. The output voltage by 1x, 2x or 4x, to produce the three possible of the FVR can be configured to supply a reference voltage levels. voltage to the following: The ADFVR<1:0> bits of the FVRCON register are • ADC input channel used to enable and configure the gain amplifier settings • ADC positive reference for the reference supplied to the ADC module. • Comparator positive input Reference Section16.0 “Analog-to-Digital • Digital-to-Analog Converter (DAC) Converter (ADC) Module” for additional information. • Capacitive Sensing (CPS) module The CDAFVR<1:0> bits of the FVRCON register are • LCD bias generator used to enable and configure the gain amplifier settings The FVR can be enabled by setting the FVREN bit of for the reference supplied to the Comparators, DAC and CPS module. Reference Section17.0 “Digital-to- the FVRCON register. Analog Converter (DAC) Module”, Section18.0 “Comparator Module” and Section26.0 “Capacitive Sensing (CPS) Module” for additional information. 14.2 FVR Stabilization Period When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See Section30.0 “Electrical Specifications” for the minimum delay requirement. FIGURE 14-1: VOLTAGE REFERENCE BLOCK DIAGRAM ADFVR<1:0> 2 X1 X2 FVR BUFFER1 X4 (To ADC Module) CDAFVR<1:0> 2 X1 X2 FVR BUFFER2 X4 (To Comparators, DAC, CPS) FVR VREF 1.024V Fixed (To LCD Bias Generator) Reference + FVREN _ FVRRDY Any peripheral requiring the Fixed Reference (See Table14-1) DS40001414E-page 150  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 14.3 Register Definitions: FVR Control REGISTER 14-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 FVREN FVRRDY(1) TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 CDAFVR<1:0>: Comparator and DAC Fixed Voltage Reference Selection bit 11 =Comparator and DAC and CPS Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 =Comparator and DAC and CPS Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 =Comparator and DAC and CPS Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 =Comparator and DAC and CPS Fixed Voltage Reference Peripheral output is off bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit 11 =ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 =ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 =ADC Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 =ADC Fixed Voltage Reference Peripheral output is off Note 1: FVRRDY is always ‘1’ on PIC16F1946/47 only. 2: Fixed Voltage Reference output cannot exceed VDD. 3: See Section15.0 “Temperature Indicator Module” for additional information. TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 151 Legend: Shaded cells are not used with the Fixed Voltage Reference.  2010-2016 Microchip Technology Inc. DS40001414E-page 151

PIC16(L)F1946/47 15.0 TEMPERATURE INDICATOR FIGURE 15-1: TEMPERATURE CIRCUIT MODULE DIAGRAM This family of devices is equipped with a temperature circuit designed to measure the operating temperature VDD of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The TSEN output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. TSRNG The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A one- point calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point VOUT To ADC calibration allows the circuit to sense the entire range of temperature more accurately. Refer to the application note AN1333, Use and Calibration of the Internal Temperature Indicator (DS01333) for more details regarding the calibration process. 15.1 Circuit Operation 15.2 Minimum Operating VDD Figure15-1 shows a simplified block diagram of the When the temperature circuit is operated in low range, temperature circuit. The proportional voltage output is the device may be operated at any operating voltage achieved by measuring the forward voltage drop across that is within specifications. multiple silicon junctions. When the temperature circuit is operated in high range, Equation15-1 describes the output characteristics of the device operating voltage, VDD, must be high the temperature indicator. enough to ensure that the temperature circuit is correctly biased. EQUATION 15-1: VOUT RANGES Table15-1 shows the recommended minimum VDD vs. range setting. High Range: VOUT = VDD - 4VT TABLE 15-1: RECOMMENDED VDD VS. Low Range: VOUT = VDD - 2VT RANGE Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 The temperature sense circuit is integrated with the 3.6V 1.8V Fixed Voltage Reference (FVR) module. See Section14.0 “Fixed Voltage Reference (FVR)” for 15.3 Temperature Output more information. The circuit is enabled by setting the TSEN bit of the The output of the circuit is measured using the internal FVRCON register. When disabled, the circuit draws no Analog-to-Digital Converter. A channel is reserved for current. the temperature circuit output. Refer to Section16.0 “Analog-to-Digital Converter (ADC) Module” for The circuit operates in either high or low range. The high detailed information. range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This Note: Every time the ADC MUX is changed to provides more resolution over the temperature range, the temperature indicator output selection but may be less consistent from part to part. This range (CHS bit in the ADCCON0 register), wait requires a higher bias voltage to operate and thus, a 500 sec for the sampling capacitor to fully higher VDD is needed. charge before sampling the temperature The low range is selected by clearing the TSRNG bit of indicator output. the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low voltage operation. DS40001414E-page 152  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 15.4 ADC Acquisition Time To ensure accurate temperature measurements, the user must wait at least 200s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200s between sequential conversions of the temperature indicator output. TABLE 15-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 151 Legend: Shaded cells are unused by the temperature indicator module.  2010-2016 Microchip Technology Inc. DS40001414E-page 153

PIC16(L)F1946/47 16.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure16-1 shows the block diagram of the ADC. The ADC voltage reference is software selectable to be either internally generated or externally supplied. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake up the device from Sleep. DS40001414E-page 154  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 16-1: ADC BLOCK DIAGRAM VREF- ADNREF = 1 ADNREF = 0 VSS VDD ADPREF = 00 ADPREF = 11 VREF+ ADPREF = 10 AN0 00000 AN1 00001 VREF-/AN2 00010 VREF+/AN3 00011 AN4 00100 AN5 00101 AN6 00110 Ref+ Ref- AN7 00111 AN8 01000 ADC AN9 01001 GO/DONE 10 AN10 01010 AN11 01011 ADFM 0 = Left Justify 1 = Right Justify AN12 01100 ADON 16 AN13 01101 AN14 01110 VSS ADRESH ADRESL AN15 01111 AN16 10000 Temp Indicator 11101 DAC Output 11110 FVR Buffer1 11111 CHS<4:0> Note: When ADON = 0, all multiplexer inputs are disconnected.  2010-2016 Microchip Technology Inc. DS40001414E-page 155

PIC16(L)F1946/47 16.1 ADC Configuration 16.1.4 CONVERSION CLOCK When configuring and using the ADC, the following The source of the conversion clock is software functions must be considered: selectable via the ADCS bits of the ADCON1 register. There are seven possible clock options: • Port configuration • FOSC/2 • Channel selection • FOSC/4 • ADC voltage reference selection • FOSC/8 • ADC conversion clock source • FOSC/16 • Interrupt control • FOSC/32 • Result formatting • FOSC/64 16.1.1 PORT CONFIGURATION • FRC (dedicated internal oscillator) The ADC can be used to convert both analog and The time to complete one bit conversion is defined as digital signals. When converting analog signals, the I/O TAD. One full 10-bit conversion requires 11.5 TAD pin should be configured for analog by setting the periods as shown in Figure16-2. associated TRIS and ANSEL bits. Refer to For correct conversion, the appropriate TAD Section12.0 “I/O Ports” for more information. specification must be met. Refer to the A/D conversion Note: Analog voltages on any pin that is defined requirements in Section30.0 “Electrical as a digital input may cause the input Specifications” for more information. Table16-1 gives buffer to conduct excess current. examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the 16.1.2 CHANNEL SELECTION system clock frequency will change the There are 20 selections available: ADC clock frequency, which may adversely affect the ADC result. • AN<16:0> pins • Temperature Indicator • DAC Output • FVR (Fixed Voltage Reference) Output Refer to Section15.0 “Temperature Indicator Module”, Section17.0 “Digital-to-Analog Converter (DAC) Module” and Section14.0 “Fixed Voltage Reference (FVR)” for more information on these channel selections. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section16.2 “ADC Operation” for more information. 16.1.3 ADC VOLTAGE REFERENCE The ADPREF bit of the ADCON1 register provides control of the positive voltage reference. The positive voltage reference can be: • VREF+ pin • VDD The ADNREF bit of the ADCON1 register provides control of the negative voltage reference. The negative voltage reference can be: • VREF- pin • VSS See Section14.0 “Fixed Voltage Reference (FVR)” for more details on the fixed voltage reference. DS40001414E-page 156  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 16-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC ADCS<2:0> 32 MHz 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz Clock Source Fosc/2 000 62.5ns(2) 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s Fosc/4 100 125 ns(2) 200 ns(2) 250 ns(2) 500 ns(2) 1.0 s 4.0 s Fosc/8 001 0.5 s(2) 400 ns(2) 0.5 s(2) 1.0 s 2.0 s 8.0 s(3) Fosc/16 101 800 ns 800 ns 1.0 s 2.0 s 4.0 s 16.0 s(3) Fosc/32 010 1.0 s 1.6 s 2.0 s 4.0 s 8.0 s(3) 32.0 s(3) Fosc/64 110 2.0 s 3.2 s 4.0 s 8.0 s(3) 16.0 s(3) 64.0 s(3) FRC x11 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 1.6 s for VDD. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 16-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TADTAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input.  2010-2016 Microchip Technology Inc. DS40001414E-page 157

PIC16(L)F1946/47 16.1.5 INTERRUPTS 16.1.6 RESULT FORMATTING The ADC module allows for the ability to generate an The 10-bit A/D conversion result can be supplied in two interrupt upon completion of an Analog-to-Digital formats, left justified or right justified. The ADFM bit of conversion. The ADC Interrupt Flag is the ADIF bit in the ADCON1 register controls the output format. the PIR1 register. The ADC Interrupt Enable is the Figure16-4 shows the two output formats. ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruc- tion is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execu- tion, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. FIGURE 16-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 bit 0 10-bit A/D Result Unimplemented: Read as ‘0’ (ADFM = 1) MSB LSB bit 7 bit 0 bit 7 bit 0 Unimplemented: Read as ‘0’ 10-bit A/D Result DS40001414E-page 158  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 16.2 ADC Operation 16.3 ADC Operation During Sleep 16.2.1 STARTING A CONVERSION The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC To enable the ADC module, the ADON bit of the option. When the FRC clock source is selected, the ADCON0 register must be set to a ‘1’. Setting the GO/ ADC waits one additional instruction before starting the DONE bit of the ADCON0 register to a ‘1’ will start the conversion. This allows the SLEEP instruction to be Analog-to-Digital conversion. executed, which can reduce system noise during the Note: The GO/DONE bit should not be set in the conversion. If the ADC interrupt is enabled, the device same instruction that turns on the ADC. will wake-up from Sleep when the conversion Refer to Section16.3.2 “A/D Conver- completes. If the ADC interrupt is disabled, the ADC sion Procedure”. module is turned off after the conversion completes, although the ADON bit remains set. 16.2.2 COMPLETION OF A CONVERSION When the ADC clock source is something other than When the conversion is complete, the ADC module will: FRC, a SLEEP instruction causes the present conver- sion to be aborted and the ADC module is turned off, • Clear the GO/DONE bit although the ADON bit remains set. • Set the ADIF Interrupt Flag bit 16.3.1 SPECIAL EVENT TRIGGER • Update the ADRESH and ADRESL registers with the new conversion result The Special Event Trigger of the CCPx/ECCPX module allows periodic ADC measurements without software 16.2.3 TERMINATING A CONVERSION intervention. When this trigger occurs, the GO/DONE If a conversion must be terminated before completion, bit is set by hardware and the Timer1 counter resets to the GO/DONE bit can be cleared in software. The zero. ADRESH and ADRESL registers will be updated with TABLE 16-2: SPECIAL EVENT TRIGGER the partially complete Analog-to-Digital conversion Device CCPx/ECCPx sample. Incomplete bits will match the last bit converted. PIC16(L)F1946/47 CCP5 Note: A device Reset forces all registers to their Using the Special Event Trigger does not assure proper Reset state. Thus, the ADC module is ADC timing. It is the user’s responsibility to ensure that turned off and any pending conversion is the ADC timing requirements are met. terminated. Refer to Section23.0 “Capture/Compare/PWM Modules” for more information.  2010-2016 Microchip Technology Inc. DS40001414E-page 159

PIC16(L)F1946/47 16.3.2 A/D CONVERSION PROCEDURE EXAMPLE 16-1: A/D CONVERSION This is an example procedure for using the ADC to ;This code block configures the ADC perform an Analog-to-Digital conversion: ;for polling, Vdd and Vss references, Frc ;clock and AN0 input. 1. Configure Port: ; • Disable pin output driver (Refer to the TRIS ;Conversion start & polling for completion register) ; are included. • Configure pin as analog (Refer to the ANSEL ; register) BANKSEL ADCON1 ; MOVLW B’11110000’ ;Right justify, Frc • Disable weak pull-ups either globally (Refer ;clock to the OPTION_REG register) or individually MOVWF ADCON1 ;Vdd and Vss Vref (Refer to the appropriate WPUx register) BANKSEL TRISA ; 2. Configure the ADC module: BSF TRISA,0 ;Set RA0 to input • Select ADC conversion clock BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog • Configure voltage reference BANKSEL ADCON0 ; • Select ADC input channel MOVLW B’00000001’ ;Select channel AN0 • Turn on ADC module BANKSEL WPUA BCF WPUA, 0 ;Disable weak 3. Configure ADC interrupt (optional): ;pull-up on RA0 • Clear ADC interrupt flag MOVWF ADCON0 ;Turn ADC On • Enable ADC interrupt CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion • Enable peripheral interrupt BTFSC ADCON0,ADGO ;Is conversion done? • Enable global interrupt(1) GOTO $-1 ;No, test again 4. Wait the required acquisition time(2). BANKSEL ADRESH ; 5. Start conversion by setting the GO/DONE bit. MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space 6. Wait for ADC conversion to complete by one of BANKSEL ADRESL ; the following: MOVF ADRESL,W ;Read lower 8 bits • Polling the GO/DONE bit MOVWF RESULTLO ;Store in GPR space • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result. 8. Clear the ADC interrupt flag (required if interrupt is enabled). Note1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section16.5 “A/D Acquisition Requirements”. DS40001414E-page 160  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 16.4 Register Definitions: ADC Control REGISTER 16-1: ADCON0: A/D CONTROL REGISTER 0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CHS<4:0> GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 11111 =FVR (Fixed Voltage Reference) Buffer 1 Output(2) 11110 =DAC output(1) 11101 =Temperature Indicator(3) 11100 =Reserved. No channel connected. • • • 10001 =Reserved. No channel connected. 10000 =AN16 01111 =AN15 01110 =AN14 01101 =AN13 01100 =AN12 01011 =AN11 01010 =AN10 01001 =AN9 01000 =AN8 00111 =AN7 00110 =AN6 00101 =AN5 00100 =AN4 00011 =AN3 00010 =AN2 00001 =AN1 00000 =AN0 bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: See Section17.0 “Digital-to-Analog Converter (DAC) Module” for more information. 2: See Section14.0 “Fixed Voltage Reference (FVR)” for more information. 3: See Section15.0 “Temperature Indicator Module” for more information.  2010-2016 Microchip Technology Inc. DS40001414E-page 161

PIC16(L)F1946/47 REGISTER 16-2: ADCON1: A/D CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: A/D Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded. bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 111 =FRC (clock supplied from a dedicated RC oscillator) 110 =FOSC/64 101 =FOSC/16 100 =FOSC/4 011 =FRC (clock supplied from a dedicated RC oscillator) 010 =FOSC/32 001 =FOSC/8 000 =FOSC/2 bit 3 Unimplemented: Read as ‘0’ bit 2 ADNREF: A/D Negative Voltage Reference Configuration bit 1 = VREF- is connected to external VREF- pin(1) 0 = VREF- is connected to VSS bit 1-0 ADPREF<1:0>: A/D Positive Voltage Reference Configuration bits 11 = VREF+ is connected to internal Fixed Voltage Reference (FVR) module(1) 10 = VREF+ is connected to external VREF+ pin(1) 01 = Reserved 00 = VREF+ is connected to VDD Note 1: When selecting the FVR or the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See Section30.0 “Electrical Specifications” for details. DS40001414E-page 162  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 16-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<9:2>: ADC Result Register bits Upper eight bits of 10-bit conversion result REGISTER 16-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<1:0> — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower two bits of 10-bit conversion result bit 5-0 Reserved: Do not use.  2010-2016 Microchip Technology Inc. DS40001414E-page 163

PIC16(L)F1946/47 REGISTER 16-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper two bits of 10-bit conversion result REGISTER 16-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits Lower eight bits of 10-bit conversion result DS40001414E-page 164  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 16.5 A/D Acquisition Requirements source impedance is decreased, the acquisition time may be decreased. After the analog input channel is For the ADC to meet its specified accuracy, the charge selected (or changed), an A/D acquisition must be holding capacitor (CHOLD) must be allowed to fully done before the conversion can be started. To calculate charge to the input channel voltage level. The Analog the minimum acquisition time, Equation16-1 may be Input model is shown in Figure16-4. The source used. This equation assumes that 1/2 LSb error is used impedance (RS) and the internal sampling switch (RSS) (1,024 steps for the ADC). The 1/2 LSb error is the impedance directly affect the time required to charge maximum error allowed for the ADC to meet its the capacitor CHOLD. The sampling switch (RSS) specified resolution. impedance varies over the device voltage (VDD), refer to Figure16-4. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 16-1: ACQUISITION TIME EXAMPLE Assumptions: Temperature = 50°C and external impedance of 10k 5.0V VDD TACQ = Amplifier Settling Time +Hold Capacitor Charging Time+Temperature Coefficient = TAMP+TC+TCOFF = 2µs+TC+Temperature - 25°C0.05µs/°C The value for TC can be approximated with the following equations:  1  VAPPLIED1– ------n----+----1------------ = VCHOLD ;[1] VCHOLD charged to within 1/2 lsb 2 –1 –TC  ---------- RC VAPPLIED1–e  = VCHOLD ;[2] VCHOLD charge response to VAPPLIED   –Tc  -R----C----  1  VAPPLIED1–e  = VAPPLIED1– ------n----+----1------------ ;combining [1] and [2]   2  –1 Note: Where n = number of bits of the ADC. Solving for TC: TC = –CHOLDRIC+RSS+RS ln(1/2047) –4 = –10pF1k+7k+10kln4.8810  = 1.37µs Therefore: TACQ = 2µs+1.37µs+50°C- 25°C0.05µs/°C = 4.62µs  2010-2016 Microchip Technology Inc. DS40001414E-page 165

PIC16(L)F1946/47 Note1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10k. This is required to meet the pin leakage specification. FIGURE 16-4: ANALOG INPUT MODEL VDD Analog Sampling Input Switch VT  0.6V Rs pin RIC  1k SS Rss VA C5 PpIFN VT  0.6V I LEAKAGE(1) CHOLD = 10 pF VSS/VREF- 6V 5V RSS Legend: CHOLD = Sample/Hold Capacitance VDD4V 3V CPIN = Input Capacitance 2V I LEAKAGE = Leakage current at the pin due to various junctions 5 6 7 891011 RIC = Interconnect Resistance Sampling Switch RSS = Resistance of Sampling Switch (k) SS = Sampling Switch VT = Threshold Voltage Note1: Refer to Section30.0 “Electrical Specifications”. FIGURE 16-5: ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh 3FDh 3FCh e od 3FBh C ut p ut O C D 03h A 02h 01h 00h Analog Input Voltage 0.5 LSB 1.5 LSB Zero-Scale VREF- Transition Full-Scale Transition VREF+ DS40001414E-page 166  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 16-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ADCON0 — CHS<4:0> GO/DONE ADON 161 ADCON1 ADFM ADCS<2:0> — ADNREF ADPREF<1:0> 162 ADRESH A/D Result Register High 163 ADRESL A/D Result Register Low 163 ANSELA — — ANSA5 — ANSA3 ANSA2 ANSA1 ANSA0 126 ANSELF ANSELF7 ANSELF6 ANSELF5 ANSELF4 ANSELF3 ANSELF2 ANSELF1 ANSELF0 141 ANSELG — — — ANSELG4 ANSELG3 ANSELG2 ANSELG1 — 144 CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 227 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 125 TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 140 TRISG TRISG7 TRISG6 TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 151 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 171 DACCON1 — — — DACR<4:0> 171 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module.  2010-2016 Microchip Technology Inc. DS40001414E-page 167

PIC16(L)F1946/47 17.0 DIGITAL-TO-ANALOG 17.1 Output Voltage Selection CONVERTER (DAC) MODULE The DAC has 32 voltage level ranges. The 32 levels are set with the DACR<4:0> bits of the DACCON1 The Digital-to-Analog Converter supplies a variable register. voltage reference, ratiometric with the input source, with 32 selectable output levels. The DAC output voltage is determined by the following equations: The input of the DAC can be connected to: • External VREF pins • VDD supply voltage • FVR (Fixed Voltage Reference) The output of the DAC can be configured to supply a reference voltage to the following: • Comparator positive input • ADC input channel • DACOUT pin • Capacitive Sensing module (CPS) The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACCON0 register. EQUATION 17-1: DAC OUTPUT VOLTAGE IF DACEN = 1  DACR4:0 VOUT = VSOURCE+–VSOURCE------------------------------ +VSOURCE-  5  2 IF DACEN = 0 & DACLPS = 1 & DACR[4:0] = 11111 VOUT = VSOURCE+ IF DACEN = 0 & DACLPS = 0 & DACR[4:0] = 00000 VOUT = VSOURCE– VSOURCE+ = VDD, VREF, or FVR BUFFER 2 VSOURCE- = VSS 17.2 Ratiometric Output Level 17.3 DAC Voltage Reference Output The DAC output value is derived using a resistor ladder The DAC can be output to the DACOUT pin by setting with each end of the ladder tied to a positive and the DACOE bit of the DACCON0 register to ‘1’. negative voltage reference input source. If the voltage Selecting the DAC reference voltage for output on the of either input source fluctuates, a similar fluctuation will DACOUT pin automatically overrides the digital output result in the DAC output value. buffer and digital input threshold detector functions of that pin. Reading the DACOUT pin when it has been The value of the individual resistors within the ladder configured for DAC reference voltage output will can be found in Section30.0 “Electrical always return a ‘0’. Specifications”. Due to the limited current drive capability, a buffer must be used on the DAC voltage reference output for external connections to DACOUT. Figure17-2 shows an example buffering technique. DS40001414E-page 168  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 17-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Digital-to-Analog Converter (DAC) FVR BUFFER2 VSOURCE+ VDD DACR<4:0> 5 VREF+ R R DACPSS<1:0> 2 R DACEN DACLPS R R X 32 U DAC Output (To Comparator, CPS and M Steps 1 ADC Modules) o- 2-t R 3 R DACOUT R DACOE DACNSS VREF- VSOURCE- VSS FIGURE 17-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC® MCU DAC R Module + Voltage DACOUT – Buffered DAC Output Reference Output Impedance  2010-2016 Microchip Technology Inc. DS40001414E-page 169

PIC16(L)F1946/47 17.4 Low-Power Voltage State This is also the method used to output the voltage level from the FVR to an output pin. See Section17.5 In order for the DAC module to consume the least “Operation During Sleep” for more information. amount of power, one of the two voltage reference input Refer to Figure17-3 for output clamping examples. sources to the resistor ladder must be disconnected. Either the positive voltage source, (VSOURCE+), or the 17.4.2 OUTPUT CLAMPED TO NEGATIVE negative voltage source, (VSOURCE-) can be disabled. VOLTAGE SOURCE The negative voltage source is disabled by setting the DACLPS bit in the DACCON0 register. Clearing the The DAC output voltage can be set to VSOURCE- with the least amount of power consumption by performing DACLPS bit in the DACCON0 register disables the the following: positive voltage source. • Clearing the DACEN bit in the DACCON0 register. 17.4.1 OUTPUT CLAMPED TO POSITIVE • Clearing the DACLPS bit in the DACCON0 register. VOLTAGE SOURCE • Configuring the DACNSS bits to the proper The DAC output voltage can be set to VSOURCE+ with negative source. the least amount of power consumption by performing • Configuring the DACR<4:0> bits to ‘00000’ in the the following: DACCON1 register. • Clearing the DACEN bit in the DACCON0 register. This allows the comparator to detect a zero-crossing • Setting the DACLPS bit in the DACCON0 register. while not consuming additional current through the DAC • Configuring the DACPSS bits to the proper module. positive source. Refer to Figure17-3 for output clamping examples. • Configuring the DACR<4:0> bits to ‘11111’ in the DACCON1 register. FIGURE 17-3: OUTPUT VOLTAGE CLAMPING EXAMPLES Output Clamped to Positive Voltage Source Output Clamped to Negative Voltage Source VSOURCE+ VSOURCE+ R R DACR<4:0> = 11111 R R DACEN = 0 DACEN = 0 DACLPS = 1 DAC Voltage Ladder DACLPS = 0 DAC Voltage Ladder (see Figure17-1) (see Figure17-1) R R DACR<4:0> = 00000 VSOURCE- VSOURCE- 17.5 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 17.6 Effects of a Reset A device Reset affects the following: • DAC is disabled. • DAC output voltage is removed from the DACOUT pin. • The DACR<4:0> range select bits are cleared. DS40001414E-page 170  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 17.7 Register Definitions: DAC Control REGISTER 17-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 DACLPS: DAC Low-Power Voltage State Select bit 1 = DAC Positive reference source selected 0 = DAC Negative reference source selected bit 5 DACOE: DAC Voltage Output Enable bit 1 = DAC voltage level is also an output on the DACOUT pin 0 = DAC voltage level is disconnected from the DACOUT pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits 00 = VDD 01 = VREF+ pin 10 = FVR Buffer2 output 11 = Reserved, do not use bit 1 Unimplemented: Read as ‘0’ bit 0 DACNSS: DAC Negative Source Select bits 1 = VREF- 0 = VSS REGISTER 17-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — DACR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR<4:0>: DAC Voltage Output Select bits TABLE 17-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR1 ADFVR0 151 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 171 DACCON1 — — — DACR<4:0> 171 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.  2010-2016 Microchip Technology Inc. DS40001414E-page 171

PIC16(L)F1946/47 18.0 COMPARATOR MODULE FIGURE 18-1: SINGLE COMPARATOR Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and VIN+ + providing a digital indication of their relative magnitudes. Output Comparators are very useful mixed signal building VIN- – blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: • Independent comparator control VIN- • Programmable input selection VIN+ • Comparator output is available internally/externally • Programmable output polarity • Interrupt-on-change Output • Wake-up from Sleep • Programmable Speed/Power optimization • PWM shutdown Note: The black areas of the output of the • Programmable and fixed voltage reference comparator represents the uncertainty 18.1 Comparator Overview due to input offsets and response time. A single comparator is shown in Figure18-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. The comparators available for this device are located in Table18-1. TABLE 18-1: COMPARATOR AVAILABILITY PER DEVICE Device C1 C2 C3 PIC16(L)F1946 ● ● ● PIC16(L)F1947 ● ● ● DS40001414E-page 172  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 18-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM CxNCH<1:0> CxON(1) 2 Interrupt CxINTP det CXIN0- 0 Set CxIF CXIN1- 1 MUX Interrupt CxINTN CXIN2- 2 (2) det CXPOL CXIN3- 3 CxVN - to CMXCON0 (CXOUT) Cx(3) D Q and CM2CON1 (MCXOUT) + CxVP Q1 EN CXIN+ 0 MUX CxHYS DAC Output 1 (2) CxSP async_CxOUT to PWM FVR Buffer2 2 3 CXSYNC VSS CxON CXOE TRIS bit CXPCH<1:0> 0 CXOUT 2 D Q 1 (from Timer1) T1CLK sync_CxOUT To Timer1 or SR Latch Note 1: When CxON = 0, the Comparator will produce a ‘0’ at the output. 2: When CxON = 0, all multiplexer inputs are disconnected. 3: Output of comparator can be frozen during debugging.  2010-2016 Microchip Technology Inc. DS40001414E-page 173

PIC16(L)F1946/47 18.2 Comparator Control 18.2.3 COMPARATOR OUTPUT POLARITY Each comparator has two control registers: CMxCON0 Inverting the output of the comparator is functionally and CMxCON1. equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by The CMxCON0 registers (see Register18-1) contain setting the CxPOL bit of the CMxCON0 register. Control and Status bits for the following: Clearing the CxPOL bit results in a noninverted output. • Enable Table18-2 shows the output state versus input • Output selection conditions, including polarity control. • Output polarity TABLE 18-2: COMPARATOR OUTPUT • Speed/Power selection STATE VS. INPUT • Hysteresis enable CONDITIONS • Output synchronization Input Condition CxPOL CxOUT The CMxCON1 registers (see Register18-2) contain CxVN > CxVP 0 0 Control bits for the following: CxVN < CxVP 0 1 • Interrupt enable CxVN > CxVP 1 1 • Interrupt edge polarity CxVN < CxVP 1 0 • Positive input channel selection • Negative input channel selection 18.2.4 COMPARATOR SPEED/POWER SELECTION 18.2.1 COMPARATOR ENABLE The trade-off between speed or power can be opti- Setting the CxON bit of the CMxCON0 register enables mized during program execution with the CxSP control the comparator for operation. Clearing the CxON bit bit. The default state for this bit is ‘1’ which selects the disables the comparator resulting in minimum current normal speed mode. Device power consumption can consumption. be optimized at the cost of slower comparator propaga- 18.2.2 COMPARATOR OUTPUT tion delay by clearing the CxSP bit to ‘0’. SELECTION The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set Note1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. DS40001414E-page 174  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 18.3 Comparator Hysteresis 18.5 Comparator Interrupt A selectable amount of separation voltage can be An interrupt can be generated upon a change in the added to the input pins of each comparator to provide a output value of the comparator for each comparator, a hysteresis function to the overall operation. Hysteresis rising edge detector and a falling edge detector are is enabled by setting the CxHYS bit of the CMxCON0 present. register. When either edge detector is triggered and its See Section30.0 “Electrical Specifications” for associated enable bit is set (CxINTP and/or CxINTN more information. bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be 18.4 Timer1 Gate Operation set. To enable the interrupt, you must set the following bits: The output resulting from a comparator operation can be used as a source for gate control of Timer1. See • CxON, CxPOL and CxSP bits of the CMxCON0 Section21.6 “Timer1 Gate” for more information. register This feature is useful for timing the duration or interval • CxIE bit of the PIE2 register of an analog event. • CxINTP bit of the CMxCON1 register (for a rising It is recommended that the comparator output be edge detection) synchronized to Timer1. This ensures that Timer1 does • CxINTN bit of the CMxCON1 register (for a falling not increment while a change in the comparator is edge detection) occurring. • PEIE and GIE bits of the INTCON register 18.4.1 COMPARATOR OUTPUT The associated interrupt flag bit, CxIF bit of the PIR2 SYNCHRONIZATION register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still The output from a comparator can be synchronized be set at the end of the sequence. with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Note: Although a comparator is disabled, an interrupt can be generated by changing Once enabled, the comparator output is latched on the the output polarity with the CxPOL bit of falling edge of the Timer1 source clock. If a prescaler is the CMxCON0 register, or by switching used with Timer1, the comparator output is latched after the comparator on or off with the CxON bit the prescaling function. To prevent a race condition, the of the CMxCON0 register. comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the 18.6 Comparator Positive Input rising edge of its clock source. See the Comparator Block Diagram (Figure18-2) and the Timer1 Block Selection Diagram (Figure21-1) for more information. Configuring the CxPCH<1:0> bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: • CxIN+ analog pin • DAC output • FVR (Fixed Voltage Reference) • VSS (Ground) See Section14.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section17.0 “Digital-to-Analog Converter (DAC) Module” for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled.  2010-2016 Microchip Technology Inc. DS40001414E-page 175

PIC16(L)F1946/47 18.7 Comparator Negative Input 18.10 Analog Input Connection Selection Considerations The CxNCH<1:0> bits of the CMxCON0 register direct A simplified circuit for an analog input is shown in one of four analog pins to the comparator inverting Figure18-3. Since the analog input pins share their input. connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The Note: To use CxIN+ and CxINx- pins as analog analog input, therefore, must be between VSS and VDD. input, the appropriate bits must be set in If the input voltage deviates from this range by more the ANSEL register and the correspond- than 0.6V in either direction, one of the diodes is ing TRIS bits must also be set to disable forward biased and a latch-up may occur. the output drivers. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component 18.8 Comparator Response Time connected to an analog input pin, such as a capacitor or The comparator output is indeterminate for a period of a Zener diode, should have very little leakage current to time after the change of an input source or the selection minimize inaccuracies introduced. of a new reference voltage. This period is referred to as the response time. The response time of the comparator Note1: When reading a PORT register, all pins differs from the settling time of the voltage reference. configured as analog inputs will read as a Therefore, both of these times must be considered when ‘0’. Pins configured as digital inputs will determining the total response time to a comparator convert as an analog input, according to input change. See the Comparator and Voltage the input specification. Reference Specifications in Section30.0 “Electrical Specifications” for more details. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to 18.9 Interaction with ECCP Logic consume more current than is specified. The comparators can be used as general purpose comparators. Their outputs can be brought out to the CxOUT pins. When the ECCP Auto-Shutdown is active it can use one or both comparator signals. If auto-restart is also enabled, the comparators can be configured as a closed loop analog feedback to the ECCP, thereby, creating an analog controlled PWM. Note: When the Comparator module is first initialized the output state is unknown. Upon initialization, the user should verify the output state of the comparator prior to relying on the result, primarily when using the result in connection with other peripheral features, such as the ECCP Auto-Shutdown mode. DS40001414E-page 176  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 18-3: ANALOG INPUT MODEL VDD Analog Input Rs < 10K pin VT  0.6V RIC To Comparator VA C5 PpIFN VT  0.6V ILEAKAGE(1) Vss Legend: CPIN = Input Capacitance ILEAKAGE= Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage VT = Threshold Voltage Note1: See Section30.0 “Electrical Specifications”  2010-2016 Microchip Technology Inc. DS40001414E-page 177

PIC16(L)F1946/47 18.11 Register Definitions: Comparator Control REGISTER 18-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled and consumes no active power bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in low-power, low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous. DS40001414E-page 178  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 18-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 CxINTP CxINTN CxPCH<1:0> — — CxNCH<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 11 = CxVP connects to VSS 10 = CxVP connects to FVR Voltage Reference 01 = CxVP connects to DAC Voltage Reference 00 = CxVP connects to CxIN+ pin bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 CxNCH<1:0>: Comparator Negative Input Channel Select bits 11 = CxVN connects to CXIN3- pin 10 = CxVN connects to CXIN2- pin 01 = CxVN connects to CXIN1- pin 00 = CxVN connects to CXIN0- pin REGISTER 18-3: CMOUT: COMPARATOR OUTPUT REGISTER U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 R-0/0 — — — — — MC3OUT MC2OUT MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2 MC3OUT: Mirror Copy of C3OUT bit bit 1 MC2OUT: Mirror Copy of C2OUT bit bit 0 MC1OUT: Mirror Copy of C1OUT bit  2010-2016 Microchip Technology Inc. DS40001414E-page 179

PIC16(L)F1946/47 TABLE 18-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELF ANSF7 ANSF6 ANSF5 ANSF4 ANSF3 ANSF2 ANSF1 ANSF0 141 ANSELG — — — ANSG4 ANSG3 ANSG2 ANSG1 — 144 CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 178 CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 178 CM1CON1 C1NTP C1INTN C1PCH<1:0> — — C1NCH<1:0> 179 CM2CON1 C2NTP C2INTN C2PCH<1:0> — — C2NCH<1:0> 179 CM3CON0 C3ON C3OUT C3OE C3POL — C3SP C3HYS C3SYNC 178 CM3CON1 C3INTP C3INTN C3PCH1 C3PCH0 — — C3NCH<1:0> 179 CMOUT — — — — — MC3OUT MC2OUT MC1OUT 179 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 151 DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — DACNSS 171 DACCON1 — — — DACR<4:0> 171 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 140 TRISG — — TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module. DS40001414E-page 180  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 19.0 SR LATCH 19.2 Latch Output The module consists of a single SR Latch with multiple The SRQEN and SRNQEN bits of the SRCON0 Set and Reset inputs as well as separate latch outputs. register control the Q and Q latch outputs. Both of the The SR Latch module includes the following features: SR Latch outputs may be directly output to an I/O pin at the same time. • Programmable input selection • SR Latch output is available externally The applicable TRIS bit of the corresponding port must be cleared to enable the port pin output driver. • Separate Q and Q outputs • Firmware Set and Reset 19.3 Effects of a Reset The SR Latch can be used in a variety of analog applications, including oscillator circuits, one-shot Upon any device Reset, the SR Latch output is not circuit, hysteretic controllers, and analog timing initialized to a known state. The user’s firmware is applications. responsible for initializing the latch output before enabling the output pins. 19.1 Latch Operation The latch is a Set-Reset Latch that does not depend on a clock source. Each of the Set and Reset inputs are active-high. The latch can be set or reset by: • Software control (SRPS and SRPR bits) • Comparator C1 output (sync_C1OUT) • Comparator C2 output (sync_C2OUT) • SRI pin • Programmable clock (SRCLK) The SRPS and the SRPR bits of the SRCON0 register may be used to set or reset the SR Latch, respectively. The latch is Reset-dominant. Therefore, if both Set and Reset inputs are high, the latch will go to the Reset state. Both the SRPS and SRPR bits are self resetting which means that a single write to either of the bits is all that is necessary to complete a latch Set or Reset operation. The output from Comparator C1 or C2 can be used as the Set or Reset inputs of the SR Latch. The output of either comparator can be synchronized to the Timer1 clock source. See Section18.0 “Comparator Mod- ule” and Section21.0 “Timer1 Module with Gate Control” for more information. An external source on the SRI pin can be used as the Set or Reset inputs of the SR Latch. An internal clock source is available that can periodically set or reset the SR Latch. The SRCLK<2:0> bits in the SRCON0 register are used to select the clock source period. The SRSCKE and SRRCKE bits of the SRCON1 register enable the clock source to set or reset the SR Latch, respectively.  2010-2016 Microchip Technology Inc. DS40001414E-page 181

PIC16(L)F1946/47 FIGURE 19-1: SR LATCH SIMPLIFIED BLOCK DIAGRAM SRLEN SRPS Pulse SRQEN Gen(2) SRI SRSPE S Q SRCLK SRQ SRSCKE sync_C2OUT(3) SRSC2E sync_C1OUT(3) SR SRSC1E Latch(1) SRPR Pulse Gen(2) SRI SRRPE R Q SRCLK SRNQ SRRCKE SRLEN sync_C2OUT(3) SRNQEN SRRC2E sync_C1OUT(3) SRRC1E Note 1: If R=1 and S=1 simultaneously, Q=0, Q=1. 2: Pulse generator causes a 1 Q-state pulse width. 3: Name denotes the connection point at the comparator output. DS40001414E-page 182  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 19-1: SRCLK FREQUENCY TABLE SRCLK Divider FOSC = 32 MHz FOSC = 20 MHz FOSC = 16 MHz FOSC = 4 MHz FOSC = 1 MHz 111 512 62.5kHz 39.0kHz 31.3kHz 7.81kHz 1.95kHz 110 256 125kHz 78.1kHz 62.5kHz 15.6kHz 3.90kHz 101 128 250kHz 156kHz 125kHz 31.25kHz 7.81kHz 100 64 500kHz 313kHz 250kHz 62.5kHz 15.6kHz 011 32 1MHz 625kHz 500kHz 125kHz 31.3 kHz 010 16 2MHz 1.25MHz 1MHz 250kHz 62.5kHz 001 8 4MHz 2.5MHz 2MHz 500kHz 125kHz 000 4 8MHz 5MHz 4MHz 1MHz 250kHz  2010-2016 Microchip Technology Inc. DS40001414E-page 183

PIC16(L)F1946/47 19.4 Register Definitions: SR Latch Control REGISTER 19-2: SRCON0: SR LATCH CONTROL 0 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/S-0/0 R/S-0/0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared S = Bit is set only bit 7 SRLEN: SR Latch Enable bit 1 = SR Latch is enabled 0 = SR Latch is disabled bit 6-4 SRCLK<2:0>: SR Latch Clock Divider bits 111 = Generates a 1 FOSC wide pulse every 512th FOSC cycle clock 110 = Generates a 1 FOSC wide pulse every 256th FOSC cycle clock 101 = Generates a 1 FOSC wide pulse every 128th FOSC cycle clock 100 = Generates a 1 FOSC wide pulse every 64th FOSC cycle clock 011 = Generates a 1 FOSC wide pulse every 32nd FOSC cycle clock 010 = Generates a 1 FOSC wide pulse every 16th FOSC cycle clock 001 = Generates a 1 FOSC wide pulse every 8th FOSC cycle clock 000 = Generates a 1 FOSC wide pulse every 4th FOSC cycle clock bit 3 SRQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRQ pin 0 = External Q output is disabled If SRLEN = 0: SR Latch is disabled bit 2 SRNQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRnQ pin 0 = External Q output is disabled If SRLEN = 0: SR Latch is disabled bit 1 SRPS: Pulse Set Input of the SR Latch bit(1) 1 = Pulse set input for 1 Q-clock period 0 = No effect on set input bit 0 SRPR: Pulse Reset Input of the SR Latch bit(1) 1 = Pulse Reset input for 1 Q-clock period 0 = No effect on Reset input Note 1: Set only, always reads back ‘0’. DS40001414E-page 184  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 19-3: SRCON1: SR LATCH CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SRSPE: SR Latch Peripheral Set Enable bit 1 = SR Latch is set when the SRI pin is high 0 = SRI pin has no effect on the set input of the SR Latch bit 6 SRSCKE: SR Latch Set Clock Enable bit 1 = Set input of SR Latch is pulsed with SRCLK 0 = SRCLK has no effect on the set input of the SR Latch bit 5 SRSC2E: SR Latch C2 Set Enable bit 1 = SR Latch is set when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the set input of the SR Latch bit 4 SRSC1E: SR Latch C1 Set Enable bit 1 = SR Latch is set when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the set input of the SR Latch bit 3 SRRPE: SR Latch Peripheral Reset Enable bit 1 = SR Latch is reset when the SRI pin is high 0 = SRI pin has no effect on the Reset input of the SR Latch bit 2 SRRCKE: SR Latch Reset Clock Enable bit 1 = Reset input of SR Latch is pulsed with SRCLK 0 = SRCLK has no effect on the Reset input of the SR Latch bit 1 SRRC2E: SR Latch C2 Reset Enable bit 1 = SR Latch is reset when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the Reset input of the SR Latch bit 0 SRRC1E: SR Latch C1 Reset Enable bit 1 = SR Latch is reset when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the Reset input of the SR Latch TABLE 19-2: SUMMARY OF REGISTERS ASSOCIATED WITH SR LATCH MODULE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELF ANSELF7 ANSELF6 ANSELF5 ANSELF4 ANSELF3 ANSELF2 ANSELF1 ANSELF0 126 SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 184 SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 185 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 125 TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 125 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the SR Latch module.  2010-2016 Microchip Technology Inc. DS40001414E-page 185

PIC16(L)F1946/47 20.0 TIMER0 MODULE When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. The Timer0 module is an 8-bit timer/counter with the following features: Note: The value written to the TMR0 register can be adjusted, in order to account for • 8-bit timer/counter register (TMR0) the two instruction cycle delay when • 8-bit prescaler (independent of Watchdog Timer) TMR0 is written. • Programmable internal or external clock source • Programmable external clock edge selection 20.1.2 8-BIT COUNTER MODE • Interrupt on overflow In 8-Bit Counter mode, the Timer0 module will increment • TMR0 can be used to gate Timer1 on every rising or falling edge of the T0CKI pin or the Capacitive Sensing Oscillator (CPSCLK) signal. Figure20-1 is a block diagram of the Timer0 module. 8-Bit Counter mode using the T0CKI pin is selected by 20.1 Timer0 Operation setting the TMR0CS bit in the OPTION_REG register to ‘1’ and resetting the T0XCS bit in the CPSCON0 register The Timer0 module can be used as either an 8-bit timer to ‘0’. or an 8-bit counter. 8-Bit Counter mode using the Capacitive Sensing Oscillator (CPSCLK) signal is selected by setting the 20.1.1 8-BIT TIMER MODE TMR0CS bit in the OPTION_REG register to ‘1’ and The Timer0 module will increment every instruction setting the T0XCS bit in the CPSCON0 register to ‘1’. cycle, if used without a prescaler. 8-bit Timer mode is The rising or falling transition of the incrementing edge selected by clearing the TMR0CS bit of the for either input source is determined by the TMR0SE bit OPTION_REG register. in the OPTION_REG register. FIGURE 20-1: BLOCK DIAGRAM OF THE TIMER0 FOSC/4 Data Bus 0 8 T0CKI 1 Sync 0 1 2 TCY TMR0 0 From CPSCLK 1 TMR0SE TMR0CS 8-bit Set Flag bit TMR0IF on Overflow Prescaler PSA T0XCS Overflow to Timer1 8 PS<2:0> DS40001414E-page 186  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 20.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 20.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. 20.1.5 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section30.0 “Electrical Specifications”. 20.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode.  2010-2016 Microchip Technology Inc. DS40001414E-page 187

PIC16(L)F1946/47 20.2 Register Definitions: Option Register REGISTER 20-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value Timer0 Rate 000 1 : 2 001 1 : 4 010 1 : 8 011 1 : 16 100 1 : 32 101 1 : 64 110 1 : 128 111 1 : 256 TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page CPSCON0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS 322 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 188 TMR0 Timer0 Module Register 186* TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 125 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. DS40001414E-page 188  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 21.0 TIMER1 MODULE WITH GATE • Gate Toggle mode CONTROL • Gate Single-Pulse mode • Gate Value Status The Timer1 module is a 16-bit timer/counter with the • Gate Event Interrupt following features: Figure21-1 is a block diagram of the Timer1 module. • 16-bit timer/counter register pair (TMR1H:TMR1L) • Programmable internal or external clock source • 2-bit prescaler • Dedicated 32 kHz oscillator circuit • Optionally synchronized comparator out • Multiple Timer1 gate (count enable) sources • Interrupt on overflow • Wake-up on overflow (external clock, Asynchronous mode only) • Time base for the Capture/Compare function • Special Event Trigger (with CCP/ECCP) • Selectable Gate Source Polarity FIGURE 21-1: TIMER1 BLOCK DIAGRAM T1GSS<1:0> T1G 00 T1GSPM FrOomve Trfilmower0 01 t1g_in 0 0 T1GVAL D Q Data Bus sync_C1OUT 10 SAicnqg.l eC-oPnutlrsoel 1 Q1 EN T1GRCDON D Q 1 sync_C2OUT 11 CK Q T1GGO/DONE Interrupt Set TMR1ON R det TMR1GIF T1GPOL T1GTM TMR1GE Set flag bit TMR1ON TMR1IF on To Comparator Module Overflow TMR1(2) EN Synchronized TMR1H TMR1L T1CLK 0 clock input Q D 1 TMR1CS<1:0> T1SYNC T1OSO OUT Cap. Sensing T1OSC Oscillator 11 Prescaler Synchronize(3) 1 1, 2, 4, 8 det T1OSI EN 10 2 0 FOSC T1CKPS<1:0> Internal 01 T1OSCEN Clock IFnOteSrCn/a2l Sleep input FOSC/4 Clock Internal 00 (1) Clock T1CKI To LCD and Clock Switching Modules Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep.  2010-2016 Microchip Technology Inc. DS40001414E-page 189

PIC16(L)F1946/47 21.1 Timer1 Operation 21.2 Clock Source Selection The Timer1 module is a 16-bit incrementing counter The TMR1CS<1:0> and T1OSCEN bits of the T1CON which is accessed through the TMR1H:TMR1L register register are used to select the clock source for Timer1. pair. Writes to TMR1H or TMR1L directly update the Table21-2 displays the clock source selections. counter. 21.2.1 INTERNAL CLOCK SOURCE When used with an internal clock source, the module is a timer and increments on every instruction cycle. When the internal clock source is selected, the When used with an external clock source, the module TMR1H:TMR1L register pair will increment on multiples can be used as either a timer or counter and of FOSC as determined by the Timer1 prescaler. increments on every selected edge of the external When the FOSC internal clock source is selected, the source. Timer1 register value will increment by four counts every Timer1 is enabled by configuring the TMR1ON and instruction clock cycle. Due to this condition, a 2LSB TMR1GE bits in the T1CON and T1GCON registers, error in resolution will occur when reading the Timer1 respectively. Table21-1 displays the Timer1 enable value. To utilize the full resolution of Timer1, an selections. asynchronous input signal must be used to gate the Timer1 clock input. TABLE 21-1: TIMER1 ENABLE The following asynchronous sources may be used: SELECTIONS • Asynchronous event on the T1G pin to Timer1 gate Timer1 TMR1ON TMR1GE • C1 or C2 comparator input to Timer1 gate Operation 0 0 Off 21.2.2 EXTERNAL CLOCK SOURCE 0 1 Off When the external clock source is selected, the Timer1 1 0 Always On module may work as a timer or a counter. 1 1 Count Enabled When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI or the capacitive sensing oscillator signal. Either of these external clock sources can be synchronized to the microcontroller system clock or they can run asynchronously. When used as a timer with a clock oscillator, an external 32.768kHz crystal can be used in conjunction with the dedicated internal oscillator circuit. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: • Timer1 enabled after POR • Write to TMR1H or TMR1L • Timer1 is disabled • Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. TABLE 21-2: CLOCK SOURCE SELECTIONS TMR1CS1 TMR1CS0 T1OSCEN Clock Source 0 1 x System Clock (FOSC) 0 0 x Instruction Clock (FOSC/4) 1 1 x Capacitive Sensing Oscillator 1 0 0 External Clocking on T1CKI Pin 1 0 1 Osc.Circuit On T1OSI/T1OSO Pins DS40001414E-page 190  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 21.3 Timer1 Prescaler 21.5.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER Timer1 has four prescaler options allowing 1, 2, 4 or 8 MODE divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The Reading TMR1H or TMR1L while the timer is running prescale counter is not directly readable or writable; from an external asynchronous clock will ensure a valid however, the prescaler counter is cleared upon a write to read (taken care of in hardware). However, the user TMR1H or TMR1L. should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the 21.4 Timer1 Oscillator timer may overflow between the reads. For writes, it is recommended that the user simply stop A dedicated low-power 32.768kHz oscillator circuit is the timer and write the desired values. A write built-in between pins T1OSI (input) and T1OSO contention may occur by writing to the timer registers, (amplifier output). This internal circuit is to be used in while the register is incrementing. This may produce an conjunction with an external 32.768kHz crystal. unpredictable value in the TMR1H:TMR1L register pair. The oscillator circuit is enabled by setting the T1OSCEN bit of the T1CON register. The oscillator will 21.6 Timer1 Gate continue to run during Sleep. Timer1 can be configured to count freely or the count Note: The oscillator requires a start-up and can be enabled and disabled using Timer1 gate stabilization time before use. Thus, circuitry. This is also referred to as Timer1 Gate Enable. T1OSCEN should be set and a suitable Timer1 gate can also be driven by multiple selectable delay observed prior to using Timer1. A suitable delay, similar to the OST delay sources. can be implemented in software by 21.6.1 TIMER1 GATE ENABLE clearing the TMR1IF bit, then presetting the TMR1H:TMR1L register pair to The Timer1 Gate Enable mode is enabled by setting FC00h. The TMR1IF flag will be set when the TMR1GE bit of the T1GCON register. The polarity 1024 clock cycles have elapsed, thereby of the Timer1 Gate Enable mode is configured using indicating that the oscillator is running and the T1GPOL bit of the T1GCON register. is reasonably stable. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock 21.5 Timer1 Operation in source. When Timer1 Gate Enable mode is disabled, Asynchronous Counter Mode no incrementing will occur and Timer1 will hold the current count. See Figure21-3 for timing details. If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer TABLE 21-3: TIMER1 GATE ENABLE increments asynchronously to the internal phase clocks. If the external clock source is selected then the SELECTIONS timer will continue to run during Sleep and can T1CLK T1GPOL T1G Timer1 Operation generate an interrupt on overflow, which will wake-up the processor. However, special precautions in  0 0 Counts software are needed to read/write the timer (see  0 1 Holds Count Section21.5.1 “Reading and Writing Timer1 in  1 0 Holds Count Asynchronous Counter Mode”).  1 1 Counts Note: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment.  2010-2016 Microchip Technology Inc. DS40001414E-page 191

PIC16(L)F1946/47 21.6.2 TIMER1 GATE SOURCE 21.6.3 TIMER1 GATE TOGGLE MODE SELECTION When Timer1 Gate Toggle mode is enabled, it is Timer1 gate source selections are shown in Table21-4. possible to measure the full-cycle length of a Timer1 Source selection is controlled by the T1GSS bits of the gate signal, as opposed to the duration of a single level T1GCON register. The polarity for each available source pulse. is also selectable. Polarity selection is controlled by the The Timer1 gate source is routed through a flip-flop that T1GPOL bit of the T1GCON register. changes state on every incrementing edge of the signal. See Figure21-4 for timing details. TABLE 21-4: TIMER1 GATE SOURCES Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM T1GSS Timer1 Gate Source bit is cleared, the flip-flop is cleared and held clear. This 00 Timer1 Gate Pin is necessary in order to control which edge is 01 Overflow of Timer0 measured. (TMR0 increments from FFh to 00h) Note: Enabling Toggle mode at the same time 10 Comparator 1 Output sync_C1OUT as changing the gate polarity may result in (optionally Timer1 synchronized output) indeterminate operation. 11 Comparator 2 Output sync_C2OUT 21.6.4 TIMER1 GATE SINGLE-PULSE (optionally Timer1 synchronized output) MODE 21.6.2.1 T1G Pin Gate Operation When Timer1 Gate Single-Pulse mode is enabled, it is The T1G pin is one source for Timer1 gate control. It possible to capture a single-pulse gate event. Timer1 can be used to supply an external source to the Timer1 Gate Single-Pulse mode is first enabled by setting the gate circuitry. T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. 21.6.2.2 Timer0 Overflow Gate Operation The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the When Timer0 increments from FFh to 00h, a T1GGO/DONE bit will automatically be cleared. No other low-to-high pulse will automatically be generated and gate events will be allowed to increment Timer1 until the internally supplied to the Timer1 gate circuitry. T1GGO/DONE bit is once again set in software. See 21.6.2.3 Comparator C1 Gate Operation Figure21-5 for timing details. The output resulting from a Comparator 1 operation can If the Single-Pulse Gate mode is disabled by clearing the be selected as a source for Timer1 gate control. The T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Comparator 1 output (sync_C1OUT) can be synchronized to the Timer1 clock or left asynchronous. Enabling the Toggle mode and the Single-Pulse mode For more information see Section18.4.1 “Comparator simultaneously will permit both sections to work Output Synchronization”. together. This allows the cycle times on the Timer1 gate source to be measured. See Figure21-6 for timing 21.6.2.4 Comparator C2 Gate Operation details. The output resulting from a Comparator 2 operation 21.6.5 TIMER1 GATE VALUE STATUS can be selected as a source for Timer1 gate control. The Comparator 2 output (sync_C2OUT) can be When Timer1 Gate Value Status is utilized, it is possible synchronized to the Timer1 clock or left asynchronous. to read the most current level of the gate control value. For more information see Section18.4.1 “Comparator The value is stored in the T1GVAL bit in the T1GCON Output Synchronization”. register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 21.6.6 TIMER1 GATE EVENT INTERRUPT When Timer1 Gate Event Interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). DS40001414E-page 192  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 21.7 Timer1 Interrupt 21.9 ECCP/CCP Capture/Compare Time Base The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls The CCP modules use the TMR1H:TMR1L register over, the Timer1 interrupt flag bit of the PIR1 register is pair as the time base when operating in Capture or set. To enable the interrupt on rollover, you must set Compare mode. these bits: In Capture mode, the value in the TMR1H:TMR1L • TMR1ON bit of the T1CON register register pair is copied into the CCPR1H:CCPR1L • TMR1IE bit of the PIE1 register register pair on a configured event. • PEIE bit of the INTCON register In Compare mode, an event is triggered when the value • GIE bit of the INTCON register CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a The interrupt is cleared by clearing the TMR1IF bit in Special Event Trigger. the Interrupt Service Routine. For more information, see Section23.0 Note: The TMR1H:TMR1L register pair and the “Capture/Compare/PWM Modules”. TMR1IF bit should be cleared before enabling interrupts. 21.10 ECCP/CCP Special Event Trigger 21.8 Timer1 Operation During Sleep When any of the CCP’s are configured to trigger a special event, the trigger will clear the TMR1H:TMR1L Timer1 can only operate during Sleep when setup in register pair. This special event does not cause a Asynchronous Counter mode. In this mode, an external Timer1 interrupt. The CCP module may still be crystal or clock source can be used to increment the configured to generate a CCP interrupt. counter. To set up the timer to wake the device: In this mode of operation, the CCPR1H:CCPR1L • TMR1ON bit of the T1CON register must be set register pair becomes the period register for Timer1. • TMR1IE bit of the PIE1 register must be set Timer1 should be synchronized and FOSC/4 should be • PEIE bit of the INTCON register must be set selected as the clock source in order to utilize the • T1SYNC bit of the T1CON register must be set Special Event Trigger. Asynchronous operation of • TMR1CS bits of the T1CON register must be Timer1 can cause a Special Event Trigger to be configured missed. • T1OSCEN bit of the T1CON register must be In the event that a write to TMR1H or TMR1L coincides configured with a Special Event Trigger from the CCP, the write will take precedence. The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON For more information, see Section16.3.1 “Special register is set, the device will call the Interrupt Service Event Trigger”. Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. FIGURE 21-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.  2010-2016 Microchip Technology Inc. DS40001414E-page 193

PIC16(L)F1946/47 FIGURE 21-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 FIGURE 21-4: TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8 DS40001414E-page 194  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 21-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM Cleared by hardware on T1GGO/ Set by software falling edge of T1GVAL DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 Cleared by TMR1GIF Cleared by software Set by hardware on software falling edge of T1GVAL  2010-2016 Microchip Technology Inc. DS40001414E-page 195

PIC16(L)F1946/47 FIGURE 21-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM Cleared by hardware on T1GGO/ Set by software falling edge of T1GVAL DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 Set by hardware on Cleared by TMR1GIF Cleared by software falling edge of T1GVAL software DS40001414E-page 196  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 21.11 Register Definitions: Timer1 Control REGISTER 21-1: T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 =Timer1 clock source is Capacitive Sensing Oscillator (CAPOSC) 10 =Timer1 clock source is pin or oscillator: If T1OSCEN = 0: External clock from T1CKI pin (on the rising edge) If T1OSCEN = 1: Crystal oscillator on T1OSI/T1OSO pins 01 =Timer1 clock source is system clock (FOSC) 00 =Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 =1:8 Prescale value 10 =1:4 Prescale value 01 =1:2 Prescale value 00 =1:1 Prescale value bit 3 T1OSCEN: LP Oscillator Enable Control bit 1 = Dedicated Timer1 oscillator circuit enabled 0 = Dedicated Timer1 oscillator circuit disabled bit 2 T1SYNC: Timer1 Synchronization Control bit 1 = Do not synchronize asynchronous clock input 0 = Synchronize asynchronous clock input with system clock (FOSC) bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop  2010-2016 Microchip Technology Inc. DS40001414E-page 197

PIC16(L)F1946/47 REGISTER 21-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> DONE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 = Comparator 2 optionally synchronized output (sync_C2OUT) 10 = Comparator 1 optionally synchronized output (sync_C1OUT) 01 = Timer0 overflow output 00 = Timer1 gate pin DS40001414E-page 198  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 21-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 227 CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 227 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 193* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 193* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> 198 DONE Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 199

PIC16(L)F1946/47 22.0 TIMER2/4/6 MODULES There are up to three identical Timer2-type modules available. To maintain pre-existing naming conventions, the Timers are called Timer2, Timer4 and Timer6 (also Timer2/4/6). Note: The ‘x’ variable used in this section is used to designate Timer2, Timer4, or Timer6. For example, TxCON references T2CON, T4CON or T6CON. PRx references PR2, PR4 or PR6. The Timer2/4/6 modules incorporate the following features: • 8-bit Timer and Period registers (TMRx and PRx, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4, 1:16 and 1:64) • Software programmable postscaler (1:1 to 1:16) • Interrupt on TMRx match with PRx, respectively • Optional use as the shift clock for the MSSPx modules (Timer2 only) See Figure22-1 for a block diagram of Timer2/4/6. FIGURE 22-1: TIMER2/4/6 BLOCK DIAGRAM Prescaler Reset FOSC/4 TMRx TMRx Output 1:1, 1:4, 1:16, 1:64 2 Comparator Postscaler Sets Flag bit TMRxIF EQ 1:1 to 1:16 TxCKPS<1:0> PRx 4 TxOUTPS<3:0> DS40001414E-page 200  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 22.1 Timer2/4/6 Operation 22.3 Timer2/4/6 Output The clock input to the Timer2/4/6 modules is the The unscaled output of TMRx is available primarily to system instruction clock (FOSC/4). the CCP modules, where it is used as a time base for operations in PWM mode. TMRx increments from 00h on each clock edge. Timer2 can be optionally used as the shift clock source A 4-bit counter/prescaler on the clock input allows direct for the MSSPx modules operating in SPI mode. input, divide-by-4 and divide-by-16 prescale options. Additional information is provided in Section24.0 These options are selected by the prescaler control bits, “Master Synchronous Serial Port (MSSP1 and TxCKPS<1:0> of the TxCON register. The value of MSSP2) Module”. TMRx is compared to that of the Period register, PRx, on each clock cycle. When the two values match, the 22.4 Timer2/4/6 Operation During Sleep comparator generates a match signal as the timer output. This signal also resets the value of TMRx to 00h The Timer2/4/6 timers cannot be operated while the on the next cycle and drives the output processor is in Sleep mode. The contents of the TMRx counter/postscaler (see Section22.2 “Timer2/4/6 and PRx registers will remain unchanged while the Interrupt”). processor is in Sleep mode. The TMRx and PRx registers are both directly readable and writable. The TMRx register is cleared on any device Reset, whereas the PRx register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: • a write to the TMRx register • a write to the TxCON register • Power-on Reset (POR) • Brown-out Reset (BOR) • MCLR Reset • Watchdog Timer (WDT) Reset • Stack Overflow Reset • Stack Underflow Reset • RESET Instruction Note: TMRx is not cleared when TxCON is written. 22.2 Timer2/4/6 Interrupt Timer2/4/6 can also generate an optional device interrupt. The Timer2/4/6 output signal (TMRx-to-PRx match) provides the input for the 4-bit counter/postscaler. This counter generates the TMRx match interrupt flag which is latched in TMRxIF of the PIRx register. The interrupt is enabled by setting the TMRx Match Interrupt Enable bit, TMRxIE of the PIEx register. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, TxOUTPS<3:0>, of the TxCON register.  2010-2016 Microchip Technology Inc. DS40001414E-page 201

PIC16(L)F1946/47 22.5 Register Definitions: Timer2 Control REGISTER 22-1: TXCON: TIMER2/TIMER4/TIMER6 CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — TxOUTPS<3:0> TMRxON TxCKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TxOUTPS<3:0>: Timerx Output Postscaler Select bits 1111 =1:16 Postscaler 1110 =1:15 Postscaler 1101 =1:14 Postscaler 1100 =1:13 Postscaler 1011 =1:12 Postscaler 1010 =1:11 Postscaler 1001 =1:10 Postscaler 1000 =1:9 Postscaler 0111 =1:8 Postscaler 0110 =1:7 Postscaler 0101 =1:6 Postscaler 0100 =1:5 Postscaler 0011 =1:4 Postscaler 0010 =1:3 Postscaler 0001 =1:2 Postscaler 0000 =1:1 Postscaler bit 2 TMRxON: Timerx On bit 1 = Timerx is on 0 = Timerx is off bit 1-0 TxCKPS<1:0>: Timer2-type Clock Prescale Select bits 11 =Prescaler is 64 10 =Prescaler is 16 01 =Prescaler is 4 00 =Prescaler is 1 DS40001414E-page 202  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 22-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2/4/6 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page CCP2CON P2M<1:0> DC2B<1:0> CCP2M<3:0> 227 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 PR2 Timer2 Module Period Register 200* PR4 Timer4 Module Period Register 200* PR6 Timer6 Module Period Register 200* T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 202 T4CON — T4OUTPS<3:0> TMR4ON T4CKPS<1:0> 202 T6CON — T6OUTPS<3:0> TMR6ON T6CKPS<1:0> 202 TMR2 Holding Register for the 8-bit TMR2 Register 200* TMR4 Holding Register for the 8-bit TMR4 Register 200* TMR6 Holding Register for the 8-bit TMR6 Register 200* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 203

PIC16(L)F1946/47 23.0 CAPTURE/COMPARE/PWM MODULES Note1: In devices with more than one CCP The Capture/Compare/PWM module is a peripheral module, it is very important to pay close which allows the user to time and control different attention to the register names used. A events, and to generate Pulse-Width Modulation number placed after the module acronym (PWM) signals. In Capture mode, the peripheral allows is used to distinguish between separate the timing of the duration of an event. The Compare modules. For example, the CCP1CON mode allows the user to trigger an external event when and CCP2CON control the same a predetermined amount of time has expired. The operational aspects of two completely PWM mode can generate pulse-width modulated different CCP modules. signals of varying frequency and duty cycle. 2: Throughout this section, generic This family of devices contains three Enhanced references to a CCP module in any of its Capture/Compare/PWM modules (ECCP1, ECCP2, operating modes may be interpreted as and ECCP3) and two standard Capture/Compare/PWM being equally applicable to ECCP1, modules (CCP4 and CCP5). ECCP2, ECCP3, CCP4 and CCP5. Register names, module signals, I/O pins, The Capture and Compare functions are identical for all and bit names may use the generic five CCP modules (ECCP1, ECCP2, ECCP3, CCP4, designator 'x' to indicate the use of a and CCP5). The only differences between CCP numeral to distinguish a particular module, modules are in the Pulse-Width Modulation (PWM) when required. function. The standard PWM function is identical in modules CCP4 and CCP5. In CCP modules ECCP1, ECCP2, and ECCP3, the Enhanced PWM function has slight variations from one another. Full-Bridge ECCP modules have four available I/O pins while half-bridge ECCP modules only have two available I/O pins. See Table23-1 for more information. TABLE 23-1: PWM RESOURCES Device Name ECCP1 ECCP2 ECCP3 CCP4 CCP5 Enhanced PWM Enhanced PWM Enhanced PWM PIC16(L)F1946/47 Standard PWM Standard PWM Full-Bridge Full-Bridge Full-Bridge DS40001414E-page 204  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.1 Capture Mode 23.1.2 TIMER1 MODE RESOURCE The Capture mode function described in this section is Timer1 must be running in Timer mode or Synchronized available and identical for CCP modules ECCP1, Counter mode for the CCP module to use the capture ECCP2, ECCP3, CCP4 and CCP5. feature. In Asynchronous Counter mode, the capture operation may not work. Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCPx pin, the See Section21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. 16-bit CCPRxH:CCPRxL register pair captures and stores the 16-bit value of the TMR1H:TMR1L register 23.1.3 SOFTWARE INTERRUPT MODE pair, respectively. An event is defined as one of the following and is configured by the CCPxM<3:0> bits of When the Capture mode is changed, a false capture the CCPxCON register: interrupt may be generated. The user should keep the CCPxIE interrupt enable bit of the PIEx register clear to • Every falling edge avoid false interrupts. Additionally, the user should • Every rising edge clear the CCPxIF interrupt flag bit of the PIRx register • Every 4th rising edge following any change in Operating mode. • Every 16th rising edge Note: Clocking Timer1 from the system clock When a capture is made, the Interrupt Request Flag bit (FOSC) should not be used in Capture CCPxIF of the PIRx register is set. The interrupt flag mode. In order for the Capture mode to must be cleared in software. If another capture occurs recognize the trigger event on the CCPx before the value in the CCPRxH, CCPRxL register pair pin, Timer1 must be clocked from the is read, and the old captured value is overwritten by the instruction clock (FOSC/4) or from an new captured value. external clock source. Figure23-1 shows a simplified diagram of the Capture operation. 23.1.4 CCP PRESCALER There are four prescaler settings specified by the 23.1.1 CCP PIN CONFIGURATION CCPxM<3:0> bits of the CCPxCON register. Whenever In Capture mode, the CCPx pin should be configured the CCP module is turned off, or the CCP module is not as an input by setting the associated TRIS control bit. in Capture mode, the prescaler counter is cleared. Any Also, the CCPx pin function can be moved to Reset will clear the prescaler counter. alternative pins using the APFCON register. Refer to Switching from one capture prescaler to another does not Section12.1 “Alternate Pin Function” for more clear the prescaler and may generate a false interrupt. To details. avoid this unexpected operation, turn the module off by clearing the CCPxCON register before changing the Note: If the CCPx pin is configured as an output, prescaler. Example23-1 demonstrates the code to a write to the port can cause a capture perform this function. condition. EXAMPLE 23-1: CHANGING BETWEEN FIGURE 23-1: CAPTURE MODE CAPTURE PRESCALERS OPERATION BLOCK DIAGRAM BANKSELCCPxCON ;Set Bank bits to point ;to CCPxCON Set Flag bit CCPxIF CLRF CCPxCON ;Turn CCP module off (PIRx register) Prescaler MOVLW NEW_CAPT_PS;Load the W reg with  1, 4, 16 ;the new prescaler CCPx CCPRxH CCPRxL ;move value and CCP ON pin MOVWF CCPxCON ;Load CCPxCON with this and Capture ;value Edge Detect Enable TMR1H TMR1L CCPxM<3:0> System Clock (FOSC)  2010-2016 Microchip Technology Inc. DS40001414E-page 205

PIC16(L)F1946/47 23.1.5 CAPTURE DURING SLEEP 23.1.6 ALTERNATE PIN LOCATIONS Capture mode depends upon the Timer1 module for This module incorporates I/O pins that can be moved to proper operation. There are two options for driving the other locations with the use of the alternate pin function Timer1 module in Capture mode. It can be driven by the register, APFCON. To determine which pins can be instruction clock (FOSC/4), or by an external clock source. moved and what their default locations are upon a Reset, see Section12.1 “Alternate Pin Function” for When Timer1 is clocked by FOSC/4, Timer1 will not more information. increment during Sleep. When the device wakes from Sleep, Timer1 will continue from its previous state. Capture mode will operate during Sleep when Timer1 is clocked by an external clock source. TABLE 23-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) 205* CCPRxH Capture/Compare/PWM Register x High Byte (MSB) 205* INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 198 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 193* TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 193* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 137 TRISG TRISG7 TRISG6 TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Capture mode. Note 1: Applies to ECCP modules only. * Page provides register information. DS40001414E-page 206  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.2 Compare Mode 23.2.2 TIMER1 MODE RESOURCE The Compare mode function described in this section In Compare mode, Timer1 must be running in either is available and identical for CCP modules ECCP1, Timer mode or Synchronized Counter mode. The ECCP2, ECCP3, CCP4 and CCP5. compare operation may not work in Asynchronous Counter mode. Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCPRxH:CCPRxL See Section21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a Note: Clocking Timer1 from the system clock match occurs, one of the following events can occur: (FOSC) should not be used in Capture • Toggle the CCPx output mode. In order for Capture mode to recognize the trigger event on the CCPx • Set the CCPx output pin, TImer1 must be clocked from the • Clear the CCPx output instruction clock (FOSC/4) or from an • Generate a Special Event Trigger external clock source. • Generate a Software Interrupt The action on the pin is based on the value of the 23.2.3 SOFTWARE INTERRUPT MODE CCPxM<3:0> control bits of the CCPxCON register. At When Generate Software Interrupt mode is chosen the same time, the interrupt flag CCPxIF bit is set. (CCPxM<3:0>=1010), the CCPx module does not All Compare modes can generate an interrupt. assert control of the CCPx pin (see the CCPxCON register). Figure23-2 shows a simplified diagram of the Compare operation. 23.2.4 SPECIAL EVENT TRIGGER FIGURE 23-2: COMPARE MODE When Special Event Trigger mode is chosen (CCPxM<3:0>=1011), the CCPx module does the OPERATION BLOCK following: DIAGRAM • Resets Timer1 CCPxM<3:0> • Starts an ADC conversion if ADC is enabled Mode Select (CCP5 only) CCPx Set CCPxIF Interrupt Flag The CCPx module does not assert control of the CCPx (PIRx) CCPx 4 pin in this mode. Pin CCPRxH CCPRxL The Special Event Trigger output of the CCP occurs Q S Output Comparator immediately upon a match between the TMR1H, R Logic Match TMR1L register pair and the CCPRxH, CCPRxL register pair. The TMR1H, TMR1L register pair is not TMR1H TMR1L TRIS reset until the next rising edge of the Timer1 clock. The Output Enable Special Event Trigger output starts an A/D conversion Special Event Trigger (if the A/D module is enabled). This allows the CCPRxH, CCPRxL register pair to effectively provide a 16-bit programmable period register for Timer1. 23.2.1 CCP PIN CONFIGURATION TABLE 23-3: SPECIAL EVENT TRIGGER The user must configure the CCPx pin as an output by Device CCPx/ECCPx clearing the associated TRIS bit. PIC16(L)F1946/47 ECCP1, ECCP2, CCP3, CCP4, CCP5 Also, the CCPx pin function can be moved to alternative pins using the APFCON register. Refer to Refer to Section16.0 “Analog-to-Digital Converter Section12.1 “Alternate Pin Function” for more (ADC) Module” for more information. details. Note1: The Special Event Trigger from the CCP Note: Clearing the CCPxCON register will force module does not set interrupt flag bit the CCPx compare output latch to the TMR1IF of the PIR1 register. default low level. This is not the PORT I/O 2: Removing the match condition by data latch. changing the contents of the CCPRxH and CCPRxL register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring.  2010-2016 Microchip Technology Inc. DS40001414E-page 207

PIC16(L)F1946/47 23.2.5 COMPARE DURING SLEEP 23.2.6 ALTERNATE PIN LOCATIONS The Compare mode is dependent upon the system This module incorporates I/O pins that can be moved to clock (FOSC) for proper operation. Since FOSC is shut other locations with the use of the alternate pin function down during Sleep mode, the Compare mode will not register, APFCON. To determine which pins can be function properly during Sleep. moved and what their default locations are upon a Reset, see Section12.1 “Alternate Pin Function” for more information. TABLE 23-4: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) 205* CCPRxH Capture/Compare/PWM Register x High Byte (MSB) 205* INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C31F CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 198 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 193* TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 193* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 137 TRISG TRISG7 TRISG6 TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Compare mode. Note 1: Applies to ECCP modules only. * Page provides register information. DS40001414E-page 208  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.3 PWM Overview FIGURE 23-3: CCP PWM OUTPUT SIGNAL Pulse-Width Modulation (PWM) is a scheme that Period provides power to a load by switching quickly between fully On and fully Off states. The PWM signal resembles Pulse Width a square wave where the high portion of the signal is TMRx = PRx considered the On state and the low portion of the TMRx = CCPRxH:CCPxCON<5:4> signal is considered the Off state. The high portion, also known as the pulse width, can vary in time and is TMRx = 0 defined in steps. A larger number of steps applied, which lengthens the pulse width, also supplies more FIGURE 23-4: SIMPLIFIED PWM BLOCK power to the load. Lowering the number of steps DIAGRAM applied, which shortens the pulse width, supplies less power. The PWM period is defined as the duration of CCPxCON<5:4> one complete cycle or the total amount of On and Off Duty Cycle Registers time combined. CCPRxL PWM resolution defines the maximum number of steps that can be present in a single PWM period. A higher resolution allows for more precise control of the pulse CCPx width time and in turn the power that is applied to the CCPRxH(2) (Slave) CCPx load. Pin The term duty cycle describes the proportion of the On Comparator R Q time to the Off time and is expressed in percentages, where 0% is fully Off and 100% is fully On. A lower duty S TMRx (1) cycle corresponds to less power applied and a higher TRIS duty cycle corresponds to more power applied. Figure23-3 shows a typical waveform of the PWM Comparator Clear Timer, signal. toggle CCPx pin and latch duty cycle PRx 23.3.1 STANDARD PWM OPERATION Note 1: The 8-bit timer TMRx register is concatenated The standard PWM function described in this section is with the 2-bit internal system clock (FOSC), or available and identical for CCP modules ECCP1, 2 bits of the prescaler, to create the 10-bit time ECCP2, ECCP3, CCP4 and CCP5. base. The standard PWM mode generates a Pulse-Width 2: In PWM mode, CCPRxH is a read-only register. modulation (PWM) signal on the CCPx pin with up to ten bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: • PRx registers • TxCON registers • CCPRxL registers • CCPxCON registers Figure23-4 shows a simplified block diagram of the PWM operation. Note1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. 2: Clearing the CCPxCON register will relinquish control of the CCPx pin.  2010-2016 Microchip Technology Inc. DS40001414E-page 209

PIC16(L)F1946/47 23.3.2 SETUP FOR PWM OPERATION When TMRx is equal to PRx, the following three events occur on the next increment cycle: The following steps should be taken when configuring the CCP module for standard PWM operation: • TMRx is cleared • The CCPx pin is set. (Exception: If the PWM duty 1. Disable the CCPx pin output driver by setting the cycle=0%, the pin will not be set.) associated TRIS bit. 2. Timer2/4/6 resource selection: • The PWM duty cycle is latched from CCPRxL into CCPRxH. • Select the Timer2/4/6 resource to be used for PWM generation by setting the CxTSEL<1:0> bits in the CCPTMRSx Note: The Timer postscaler (see Section22.1 “Timer2/4/6 Operation”) is not used in the register. determination of the PWM frequency. 3. Load the PRx register with the PWM period value. 23.3.5 PWM DUTY CYCLE 4. Configure the CCP module for the PWM mode The PWM duty cycle is specified by writing a 10-bit by loading the CCPxCON register with the value to multiple registers: CCPRxL register and appropriate values. DCxB<1:0> bits of the CCPxCON register. The 5. Load the CCPRxL register and the DCxBx bits CCPRxL contains the eight MSbs and the DCxB<1:0> of the CCPxCON register, with the PWM duty bits of the CCPxCON register contain the two LSbs. cycle value. CCPRxL and DCxB<1:0> bits of the CCPxCON 6. Configure and start Timer2/4/6: register can be written to at any time. The duty cycle • Clear the TMRxIF interrupt flag bit of the value is not latched into CCPRxH until after the period PIRx register. See Note below. completes (i.e., a match between PRx and TMRx • Configure the TxCKPS bits of the TxCON registers occurs). While using the PWM, the CCPRxH register with the Timer prescale value. register is read-only. • Enable the Timer by setting the TMRxON Equation23-2 is used to calculate the PWM pulse bit of the TxCON register. width. 7. Enable PWM output pin: Equation23-3 is used to calculate the PWM duty cycle • Wait until the Timer overflows and the ratio. TMRxIF bit of the PIRx register is set. See Note below. EQUATION 23-2: PULSE WIDTH • Enable the CCPx pin output driver by clearing the associated TRIS bit. Pulse Width = CCPRxL:CCPxCON<5:4>  Note: In order to send a complete duty cycle and TOSC  (TMRx Prescale Value) period on the first PWM output, the above steps must be included in the setup sequence. If it is not critical to start with a EQUATION 23-3: DUTY CYCLE RATIO complete PWM signal on the first output, then step 6 may be ignored. CCPRxL:CCPxCON<5:4> Duty Cycle Ratio = ----------------------------------------------------------------------- 23.3.3 TIMER2/4/6 TIMER RESOURCE 4PRx+1 The PWM standard mode makes use of one of the 8-bit Timer2/4/6 timer resources to specify the PWM period. The CCPRxH register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double Configuring the CxTSEL<1:0> bits in the CCPTMRSx buffering is essential for glitchless PWM operation. register selects which Timer2/4/6 timer is used. The 8-bit timer TMRx register is concatenated with either 23.3.4 PWM PERIOD the 2-bit internal system clock (FOSC), or two bits of the prescaler, to create the 10-bit time base. The system The PWM period is specified by the PRx register of clock is used if the Timer2/4/6 prescaler is set to 1:1. Timer2/4/6. The PWM period can be calculated using the formula of Equation23-1. When the 10-bit time base matches the CCPRxH and 2-bit latch, then the CCPx pin is cleared (see EQUATION 23-1: PWM PERIOD Figure23-4). PWM Period = PRx+14TOSC (TMRx Prescale Value) Note 1: TOSC = 1/FOSC DS40001414E-page 210  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.3.6 PWM RESOLUTION EQUATION 23-4: PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution log4PRx+1 Resolution = ------------------------------------------ bits will result in 1024 discrete duty cycles, whereas an 8-bit log2 resolution will result in 256 discrete duty cycles. The maximum PWM resolution is ten bits when PRx is Note: If the pulse-width value is greater than the 255. The resolution is a function of the PRx register period, the assigned PWM pin(s) will value as shown by Equation23-4. remain unchanged. TABLE 23-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz) PWM Frequency 1.95 kHz 7.81 kHz 31.25 kHz 125 kHz 250 kHz 333.3 kHz Timer Prescale 16 4 1 1 1 1 PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 TABLE 23-6: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescale 16 4 1 1 1 1 PRx Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 TABLE 23-7: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz Timer Prescale 16 4 1 1 1 1 PRx Value 0x65 0x65 0x65 0x19 0x0C 0x09 Maximum Resolution (bits) 8 8 8 6 5 5  2010-2016 Microchip Technology Inc. DS40001414E-page 211

PIC16(L)F1946/47 23.3.7 OPERATION IN SLEEP MODE 23.3.10 ALTERNATE PIN LOCATIONS In Sleep mode, the TMRxregister will not increment This module incorporates I/O pins that can be moved to and the state of the module will not change. If the CCPx other locations with the use of the alternate pin function pin is driving a value, it will continue to drive that value. register, APFCON. To determine which pins can be When the device wakes up, TMRx will continue from its moved and what their default locations are upon a previous state. reset, see Section12.1 “Alternate Pin Function” for more information. 23.3.8 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section5.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional details. 23.3.9 EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. TABLE 23-8: SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CCPTMRS0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 228 CCPTMRS1 — — — — — — C5TSEL<1:0> 228 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 PR2 Timer2 Period Register 200* PR4 Timer4Period Register 200* PR6 Timer6 Period Register 200* T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<:0>1 202 T4CON — T4OUTPS<3:0> TMR4ON T4CKPS<:0>1 202 T6CON — T6OUTPS<3:0> TMR6ON T6CKPS<:0>1 202 TMR2 Timer2 Module Register 200* TMR4 Timer4 Module Register 200* TMR6 Timer6 Module Register 200* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 137 TRISG TRISG7 TRISG6 TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. * Page provides register information. DS40001414E-page 212  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4 PWM (Enhanced Mode) To select an Enhanced PWM Output mode, the PxM bits of the CCPxCON register must be configured The enhanced PWM function described in this section is appropriately. available for CCP modules ECCP1, ECCP2 and The PWM outputs are multiplexed with I/O pins and are ECCP3, with any differences between modules noted. designated PxA, PxB, PxC and PxD. The polarity of the The enhanced PWM mode generates a Pulse-Width PWM pins is configurable and is selected by setting the Modulation (PWM) signal on up to four different output CCPxM bits in the CCPxCON register appropriately. pins with up to ten bits of resolution. The period, duty Figure23-5 shows an example of a simplified block cycle, and resolution are controlled by the following diagram of the Enhanced PWM module. registers: Table shows the pin assignments for various Enhanced • PRx registers PWM modes. • TxCON registers • CCPRxL registers Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the • CCPxCON registers CCPx pin. The ECCP modules have the following additional PWM 2: Clearing the CCPxCON register will registers which control Auto-shutdown, Auto-restart, relinquish control of the CCPx pin. Dead-band Delay and PWM Steering modes: 3: Any pin not used in the enhanced PWM • CCPxAS registers mode is available for alternate pin • PSTRxCON registers functions, if applicable. • PWMxCON registers 4: To prevent the generation of an The enhanced PWM module can generate the following incomplete waveform when the PWM is five PWM Output modes: first enabled, the ECCP module waits • Single PWM until the start of a new PWM period before generating a PWM signal. • Half-Bridge PWM • Full-Bridge PWM, Forward Mode • Full-Bridge PWM, Reverse Mode • Single PWM with PWM Steering Mode FIGURE 23-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE DCxB<1:0> PxM<1:0> CCPxM<3:0> Duty Cycle Registers 2 4 CCPRxL CCPx/PxA CCPx/PxA TRISx CCPRxH (Slave) PxB PxB Output TRISx Comparator R Q Controller PxC PxC TMRx (1) S TRISx PxD PxD Comparator Clear Timer, TRISx toggle PWM pin and latch duty cycle PRx PWMxCON Note 1: The 8-bit timer TMRx register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base.  2010-2016 Microchip Technology Inc. DS40001414E-page 213

PIC16(L)F1946/47 TABLE 23-9: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES ECCP Mode PxM<1:0> CCPx/PxA PxB PxC PxD Single 00 Yes(1) Yes(1) Yes(1) Yes(1) Half-Bridge 10 Yes Yes No No Full-Bridge, Forward 01 Yes Yes Yes Yes Full-Bridge, Reverse 11 Yes Yes Yes Yes Note 1: PWM Steering enables outputs in Single mode. FIGURE 23-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) Pulse PRX+1 PxM<1:0> Signal 0 Width Period 00 (Single Output) PxA Modulated Delay Delay PxA Modulated 10 (Half-Bridge) PxB Modulated PxA Active (Full-Bridge, PxB Inactive 01 Forward) PxC Inactive PxD Modulated PxA Inactive (Full-Bridge, PxB Modulated 11 Reverse) PxC Active PxD Inactive Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON<6:0>) DS40001414E-page 214  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 23-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) PxM<1:0> Signal 0 Pulse PRx+1 Width Period 00 (Single Output) PxA Modulated PxA Modulated Delay Delay 10 (Half-Bridge) PxB Modulated PxA Active (Full-Bridge, PxB Inactive 01 Forward) PxC Inactive PxD Modulated PxA Inactive (Full-Bridge, PxB Modulated 11 Reverse) PxC Active PxD Inactive Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON<6:0>)  2010-2016 Microchip Technology Inc. DS40001414E-page 215

PIC16(L)F1946/47 23.4.1 HALF-BRIDGE MODE Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be In Half-Bridge mode, two pins are used as outputs to cleared to configure PxA and PxB as outputs. drive push-pull loads. The PWM output signal is output on the CCPx/PxA pin, while the complementary PWM FIGURE 23-8: EXAMPLE OF output signal is output on the PxB pin (see HALF-BRIDGE PWM Figure23-9). This mode can be used for Half-Bridge applications, as shown in Figure23-9, or for Full-Bridge OUTPUT applications, where four power switches are being Period Period modulated with two PWM signals. Pulse Width In Half-Bridge mode, the programmable dead-band delay can be used to prevent shoot-through current in PxA(2) Half-Bridge power devices. The value of the PDC<6:0> td bits of the PWMxCON register sets the number of td instruction cycles before the output is driven active. If the PxB(2) value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See (1) (1) (1) Section23.4.5 “Programmable Dead-Band Delay Mode” for more details of the dead-band delay td = Dead-Band Delay operations. Note 1: At this time, the TMRx register is equal to the PRx register. 2: Output signals are shown as active-high. FIGURE 23-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS Standard Half-Bridge Circuit (“Push-Pull”) FET Driver + PxA - Load FET Driver + PxB - Half-Bridge Output Driving a Full-Bridge Circuit V+ FET FET Driver Driver PxA Load FET FET Driver Driver PxB DS40001414E-page 216  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4.2 FULL-BRIDGE MODE In Full-Bridge mode, all four pins are used as outputs. An example of Full-Bridge application is shown in Figure23-10. In the Forward mode, pin CCPx/PxA is driven to its active state, pin PxD is modulated, while PxB and PxC will be driven to their inactive state as shown in Figure23-11. In the Reverse mode, PxC is driven to its active state, pin PxB is modulated, while PxA and PxD will be driven to their inactive state as shown Figure23-11. PxA, PxB, PxC and PxD outputs are multiplexed with the PORT data latches. The associated TRIS bits must be cleared to configure the PxA, PxB, PxC and PxD pins as outputs. FIGURE 23-10: EXAMPLE OF FULL-BRIDGE APPLICATION V+ FET QA QC FET Driver Driver PxA Load PxB FET FET Driver Driver PxC QB QD V- PxD  2010-2016 Microchip Technology Inc. DS40001414E-page 217

PIC16(L)F1946/47 FIGURE 23-11: EXAMPLE OF FULL-BRIDGE PWM OUTPUT Forward Mode Period PxA(2) Pulse Width PxB(2) PxC(2) PxD(2) (1) (1) Reverse Mode Period Pulse Width PxA(2) PxB(2) PxC(2) PxD(2) (1) (1) Note 1: At this time, the TMRx register is equal to the PRx register. 2: Output signal is shown as active-high. DS40001414E-page 218  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4.2.1 Direction Change in Full-Bridge The Full-Bridge mode does not provide dead-band Mode delay. As one output is modulated at a time, dead-band delay is generally not required. There is a situation In the Full-Bridge mode, the PxM1 bit in the CCPxCON where dead-band delay is required. This situation register allows users to control the forward/reverse occurs when both of the following conditions are true: direction. When the application firmware changes this direction control bit, the module will change to the new 1. The direction of the PWM output changes when direction on the next PWM cycle. the duty cycle of the output is at or near 100%. 2. The turn-off time of the power switch, including A direction change is initiated in software by changing the power device and driver circuit, is greater the PxM1 bit of the CCPxCON register. The following than the turn on time. sequence occurs four Timer cycles prior to the end of the current PWM period: Figure23-13 shows an example of the PWM direction changing from forward to reverse, at a near 100% duty • The modulated outputs (PxB and PxD) are placed cycle. In this example, at time t1, the output PxA and in their inactive state. PxD become inactive, while output PxC becomes • The associated unmodulated outputs (PxA and active. Since the turn-off time of the power devices is PxC) are switched to drive in the opposite longer than the turn-on time, a shoot-through current direction. will flow through power devices QC and QD (see • PWM modulation resumes at the beginning of the Figure23-10) for the duration of ‘t’. The same next period. phenomenon will occur to power devices QA and QB See Figure23-12 for an illustration of this sequence. for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, two possible solutions for eliminating the shoot-through current are: 1. Reduce PWM duty cycle for one PWM period before changing directions. 2. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. FIGURE 23-12: EXAMPLE OF PWM DIRECTION CHANGE Signal Period(1) Period PxA (Active-High) PxB (Active-High) Pulse Width PxC (Active-High) (2) PxD (Active-High) Pulse Width Note 1: The direction bit PxM1 of the CCPxCON register is written any time during the PWM cycle. 2: When changing directions, the PxA and PxC signals switch before the end of the current PWM cycle. The modulated PxB and PxD signals are inactive at this time. The length of this time is four Timer counts.  2010-2016 Microchip Technology Inc. DS40001414E-page 219

PIC16(L)F1946/47 FIGURE 23-13: EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE Forward Period t1 Reverse Period PxA PxB PW PxC PxD PW TON External Switch C TOFF External Switch D Potential T = TOFF – TON Shoot-Through Current Note 1: All signals are shown as active-high. 2: TON is the turn-on delay of power switch QC and its driver. 3: TOFF is the turn-off delay of power switch QD and its driver. DS40001414E-page 220  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4.3 ENHANCED PWM AUTO-SHUTDOWN MODE Note1: The auto-shutdown condition is a The PWM mode supports an Auto-Shutdown mode that level-based signal, not an edge-based will disable the PWM outputs when an external signal. As long as the level is present, the shutdown event occurs. Auto-Shutdown mode places auto-shutdown will persist. the PWM output pins into a predetermined state. This 2: Writing to the CCPxASE bit of the mode is used to help prevent the PWM from damaging CCPxAS register is disabled while an the application. auto-shutdown condition persists. The auto-shutdown sources are selected using the 3: Once the auto-shutdown condition has CCPxAS<2:0> bits of the CCPxAS register. A shutdown been removed and the PWM restarted event may be generated by: (either through firmware or auto-restart) • A logic ‘0’ on the FLT0 pin the PWM signal will always restart at the • A logic ‘1’ on a Comparator (async_CxOUT) output beginning of the next PWM period. A shutdown condition is indicated by the CCPxASE 4: Prior to an auto-shutdown event caused (Auto-Shutdown Event Status) bit of the CCPxAS by a comparator output or FLT0 pin event, register. If the bit is a ‘0’, the PWM pins are operating a software shutdown can be triggered in normally. If the bit is a ‘1’, the PWM outputs are in the firmware by setting the CCPxASE bit of shutdown state. the CCPxAS register to ‘1’. The Auto-Restart feature tracks the active When a shutdown event occurs, two things happen: status of a shutdown caused by a The CCPxASE bit is set to ‘1’. The CCPxASE will comparator output or FLT0 pin event only. remain set until cleared in firmware or an auto-restart If it is enabled at this time, it will occurs (see Section23.4.4 “Auto-Restart Mode”). immediately clear this bit and restart the The enabled PWM pins are asynchronously placed in ECCP module at the beginning of the their shutdown states. The PWM output pins are next PWM period. grouped into pairs [PxA/PxC] and [PxB/PxD]. The state of each pin pair is determined by the PSSxAC and PSSxBD bits of the CCPxAS register. Each pin pair may be placed into one of three states: • Drive logic ‘1’ • Drive logic ‘0’ • Tri-state (high-impedance)  2010-2016 Microchip Technology Inc. DS40001414E-page 221

PIC16(L)F1946/47 FIGURE 23-14: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PXRSEN = 0) Missing Pulse Missing Pulse (Auto-Shutdown) (CCPxASE not clear) Timer Timer Timer Timer Timer Overflow Overflow Overflow Overflow Overflow PWM Period PWM Activity Start of PWM Period ShutdownEvent CCPxASE bit PWM Shutdown Shutdown Resumes Event Occurs Event Clears CCPxASE Cleared by Firmware 23.4.4 AUTO-RESTART MODE If auto-restart is enabled, the CCPxASE bit will remain set as long as the auto-shutdown condition is active. The Enhanced PWM can be configured to When the auto-shutdown condition is removed, the automatically restart the PWM signal once the CCPxASE bit will be cleared via hardware and normal auto-shutdown condition has been removed. operation will resume. Auto-restart is enabled by setting the PxRSEN bit in the PWMxCON register. FIGURE 23-15: PWM AUTO-SHUTDOWN WITH AUTO-RESTART (PXRSEN = 1) Missing Pulse Missing Pulse (Auto-Shutdown) (CCPxASE not clear) Timer Timer Timer Timer Timer Overflow Overflow Overflow Overflow Overflow PWM Period PWM Activity Start of PWM Period ShutdownEvent CCPxASE bit PWM Shutdown Resumes Event Occurs Shutdown CCPxASE Event Clears Cleared by Hardware DS40001414E-page 222  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4.5 PROGRAMMABLE DEAD-BAND FIGURE 23-16: EXAMPLE OF DELAY MODE HALF-BRIDGE PWM OUTPUT In half-bridge applications, where all power switches are modulated at the PWM frequency, the power Period Period switches normally require more time to turn off than to turn on. If both the upper and lower power switches are Pulse Width switched at the same time (one turned on, and the PxA(2) other turned off), both switches may be on for a short td period of time until one switch completely turns off. td During this brief interval, a very high current PxB(2) (shoot-through current) will flow through both power switches, shorting the bridge supply. To avoid this (1) (1) (1) potentially destructive shoot-through current from flowing during switching, turning on either of the power td = Dead-Band Delay switches is normally delayed to allow the other switch to completely turn off. Note 1: At this time, the TMRx register is equal to the In Half-Bridge mode, a digitally programmable PRx register. dead-band delay is available to avoid shoot-through 2: Output signals are shown as active-high. current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure23-16 for illustration. The lower seven bits of the associated PWMxCON register (Register23-5) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 23-17: EXAMPLE OF HALF-BRIDGE APPLICATIONS V+ Standard Half-Bridge Circuit (“Push-Pull”) FET Driver + PxA V - Load FET Driver + PxB V - V-  2010-2016 Microchip Technology Inc. DS40001414E-page 223

PIC16(L)F1946/47 23.4.6 PWM STEERING MODE In Single Output mode, PWM steering allows any of the PWM pins to be the modulated signal. Additionally, the same PWM signal can be simultaneously available on multiple pins. Once the Single Output mode is selected (CCPxM<3:2>=11 and PxM<1:0>=00 of the CCPxCON register), the user firmware can bring out the same PWM signal to one, two, three or four output pins by setting the appropriate STRx<D:A> bits of the PSTRxCON register, as shown in Table23-9. Note: The associated TRIS bits must be set to output (‘0’) to enable the pin output driver in order to see the PWM signal on the pin. While the PWM Steering mode is active, CCPxM<1:0> bits of the CCPxCON register select the PWM output polarity for the Px<D:A> pins. The PWM auto-shutdown operation also applies to PWM Steering mode as described in Section23.4.3 “Enhanced PWM Auto-shutdown mode”. An auto-shutdown event will only affect pins that have PWM outputs enabled. FIGURE 23-18: SIMPLIFIED STEERING BLOCK DIAGRAM STRxA PxA Signal PxA pin CCPxM1 1 PORT Data 0 TRIS STRxB PxB pin CCPxM0 1 PORT Data 0 TRIS STRxC PxC pin CCPxM1 1 PORT Data 0 TRIS STRxD PxD pin CCPxM0 1 PORT Data 0 TRIS Note 1: Port outputs are configured as shown when the CCPxCON register bits PxM<1:0>=00 and CCPxM<3:2>=11. 2: Single PWM output requires setting at least one of the STRx bits. DS40001414E-page 224  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.4.6.1 Steering Synchronization drivers are enabled. Changing the polarity configuration while the PWM pin output drivers are The STRxSYNC bit of the PSTRxCON register gives enable is not recommended since it may result in the user two selections of when the steering event will damage to the application circuits. happen. When the STRxSYNC bit is ‘0’, the steering event will happen at the end of the instruction that The PxA, PxB, PxC and PxD output latches may not be writes to the PSTRxCON register. In this case, the in the proper states when the PWM module is output signal at the Px<D:A> pins may be an initialized. Enabling the PWM pin output drivers at the incomplete PWM waveform. This operation is useful same time as the Enhanced PWM modes may cause when the user firmware needs to immediately remove damage to the application circuit. The Enhanced PWM a PWM signal from the pin. modes must be enabled in the proper Output mode and complete a full PWM cycle before enabling the PWM When the STRxSYNC bit is ‘1’, the effective steering pin output drivers. The completion of a full PWM cycle update will happen at the beginning of the next PWM is indicated by the TMRxIF bit of the PIRx register period. In this case, steering on/off the PWM output will being set as the second PWM period begins. always produce a complete PWM waveform. Note: When the microcontroller is released from Figures 23-19 and 23-20 illustrate the timing diagrams Reset, all of the I/O pins are in the of the PWM steering depending on the STRxSYNC high-impedance state. The external cir- setting. cuits must keep the power switch devices 23.4.7 START-UP CONSIDERATIONS in the Off state until the microcontroller drives the I/O pins with the proper signal When any PWM mode is used, the application levels or activates the PWM output(s). hardware must use the proper external pull-up and/or pull-down resistors on the PWM output pins. The CCPxM<1:0> bits of the CCPxCON register allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (PxA/PxC and PxB/PxD). The PWM output polarities must be selected before the PWM pin output FIGURE 23-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRxSYNC = 0) PWM Period PWM STRx P1<D:A> PORT Data PORT Data P1n = PWM FIGURE 23-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STRxSYNC = 1) PWM STRx P1<D:A> PORT Data PORT Data P1n = PWM  2010-2016 Microchip Technology Inc. DS40001414E-page 225

PIC16(L)F1946/47 23.4.8 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a reset, see Section12.1 “Alternate Pin Function” for more information. TABLE 23-10: SUMMARY OF REGISTERS ASSOCIATED WITH ENHANCED PWM Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page APFCON P3CSEL P3BSEL P2DSEL P2CSEL P2BSEL CCP2SEL P1CSEL P1BSEL 123 CCPxCON PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> 227 CCPxAS CCPxASE CCPxAS<2:0> PSSxAC<1:0> PSSxBD<1:0> 229 CCPTMRS0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 228 CCPTMRS1 — — — — — — C5TSEL<1:0> 228 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 93 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 97 PR2 Timer2 Period Register 200* PR4 Timer4 Period Register 200* PR6 Timer6 Period Register 200* PSTRxCON — — — STRx- STRxD STRxC STRxB STRxA 231 SYNC PWMxCON PxRSEN PxDC<6:0> 230 T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<:0>1 202 T4CON — T4OUTPS<3:0> TMR4ON T4CKPS<:0>1 202 T6CON — T6OUTPS<3:0> TMR6ON T6CKPS<:0>1 202 TMR2 Timer2 Module Register 200* TMR4 Timer4 Module Register 200* TMR6 Timer6 Module Register 200* TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 134 TRISE TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 137 TRISG TRISG7 TRISG6 TRISG5 TRISG4 TRISG3 TRISG2 TRISG1 TRISG0 143 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. * Page provides register information. DS40001414E-page 226  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 23.5 Register Definitions: ECCP Control REGISTER 23-1: CCPxCON: CCPx CONTROL REGISTER R/W-00 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PxM<1:0>(1) DCxB<1:0> CCPxM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PxM<1:0>: Enhanced PWM Output Configuration bits(1) Capture mode: Unused Compare mode: Unused If CCPxM<3:2> = 00, 01, 10: xx = PxA assigned as Capture/Compare input; PxB, PxC, PxD assigned as port pins If CCPxM<3:2> = 11: 11 = Full-Bridge output reverse; PxB modulated; PxC active; PxA, PxD inactive 10 = Half-Bridge output; PxA, PxB modulated with dead-band control; PxC, PxD assigned as port pins 01 = Full-Bridge output forward; PxD modulated; PxA active; PxB, PxC inactive 00 = Single output; PxA modulated; PxB, PxC, PxD assigned as port pins bit 5-4 DCxB<1:0>: PWM Duty Cycle Least Significant bits Capture mode: Unused Compare mode: Unused PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL. bit 3-0 CCPxM<3:0>: ECCPx Mode Select bits 1011 = Compare mode: Special Event Trigger (ECCPx resets Timer, sets CCPxIF bit, starts A/D conversion if A/D mod- ule is enabled)(2) 1010 = Compare mode: generate software interrupt only; ECCPx pin reverts to I/O state 1001 = Compare mode: initialize ECCPx pin high; clear output on compare match (set CCPxIF) 1000 = Compare mode: initialize ECCPx pin low; set output on compare match (set CCPxIF) 0111 = Capture mode: every 16th rising edge 0110 = Capture mode: every 4th rising edge 0101 = Capture mode: every rising edge 0100 = Capture mode: every falling edge 0011 = Reserved 0010 = Compare mode: toggle output on match 0001 = Reserved 0000 = Capture/Compare/PWM off (resets ECCPx module) CCP4/CCP5 only: 11xx = PWM mode ECCP1/ECCP2/ECCP3 only: 1111 = PWM mode: PxA, PxC active-low; PxB, PxD active-low 1110 = PWM mode: PxA, PxC active-low; PxB, PxD active-high 1101 = PWM mode: PxA, PxC active-high; PxB, PxD active-low 1100 = PWM mode: PxA, PxC active-high; PxB, PxD active-high Note 1: These bits are not implemented on CCP<5:4>. 2: A/D conversion start applies to CCP5 only.  2010-2016 Microchip Technology Inc. DS40001414E-page 227

PIC16(L)F1946/47 REGISTER 23-2: CCPTMRS0: PWM TIMER SELECTION CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 C4TSEL<1:0> C3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 C4TSEL<1:0>: CCP4 Timer Selection 11 =Reserved 10 =CCP4 is based off Timer6 in PWM Mode 01 =CCP4 is based off Timer4 in PWM Mode 00 =CCP4 is based off Timer2 in PWM Mode bit 5-4 C3TSEL<1:0>: CCP3 Timer Selection 11 =Reserved 10 =CCP3 is based off Timer6 in PWM Mode 01 =CCP3 is based off Timer4 in PWM Mode 00 =CCP3 is based off Timer2 in PWM Mode bit 3-2 C2TSEL<1:0>: CCP2 Timer Selection 11 =Reserved 10 =CCP2 is based off Timer6 in PWM Mode 01 =CCP2 is based off Timer4 in PWM Mode 00 =CCP2 is based off Timer2 in PWM Mode bit 1-0 C1TSEL<1:0>: CCP1 Timer Selection 11 =Reserved 10 =CCP1 is based off Timer6 in PWM Mode 01 =CCP1 is based off Timer4 in PWM Mode 00 =CCP1 is based off Timer2 in PWM Mode REGISTER 23-3: CCPTMRS1: PWM TIMER SELECTION CONTROL REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 — — — — — — C5TSEL<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 C5TSEL<1:0>: CCP5 Timer Selection 11 =Reserved 10 =CCP5 is based off Timer6 in PWM Mode 01 =CCP5 is based off Timer4 in PWM Mode 00 =CCP5 is based off Timer2 in PWM Mode DS40001414E-page 228  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 23-4: CCPxAS: CCPX AUTO-SHUTDOWN CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 CCPxASE CCPxAS<2:0> PSSxAC<1:0> PSSxBD<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CCPxASE: CCPx Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; CCPx outputs are in shutdown state 0 = CCPx outputs are operating bit 6-4 CCPxAS<2:0>: CCPx Auto-Shutdown Source Select bits 111 =VIL on FLT0 pin or Comparator C1 or Comparator C2 high(1, 2) 110 =VIL on FLT0 pin or Comparator C2 high(1, 2) 101 =VIL on FLT0 pin or Comparator C1 high(1) 100 =VIL on FLT0 pin 011 =Either Comparator C1 or C2 high(1, 2) 010 =Comparator C2 output high(1, 2) 001 =Comparator C1 output high(1) 000 =Auto-shutdown is disabled bit 3-2 PSSxAC<1:0>: Pins PxA and PxC Shutdown State Control bits 1x = Pins PxA and PxC tri-state 01 = Drive pins PxA and PxC to ‘1’ 00 = Drive pins PxA and PxC to ‘0’ bit 1-0 PSSxBD<1:0>: Pins PxB and PxD Shutdown State Control bits 1x = Pins PxB and PxD tri-state 01 = Drive pins PxB and PxD to ‘1’ 00 = Drive pins PxB and PxD to ‘0’ Note 1: If CxSYNC is enabled, the shutdown will be delayed by Timer1. 2: For PIC16F1946/47 devices in ECCP3 mode, CCPxAS uses C3 instead of C2.  2010-2016 Microchip Technology Inc. DS40001414E-page 229

PIC16(L)F1946/47 REGISTER 23-5: PWMxCON: ENHANCED PWM CONTROL REGISTER(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PxRSEN PxDC<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PxRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the CCPxASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, CCPxASE must be cleared in software to restart the PWM bit 6-0 PxDC<6:0>: PWM Delay Count bits PxDCx = Number of FOSC/4 (4*TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe mode is enabled. DS40001414E-page 230  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 23-6: PSTRxCON: PWM STEERING CONTROL REGISTER(1) U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 — — — STRxSYNC STRxD STRxC STRxB STRxA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4 STRxSYNC: Steering Sync bit 1 = Output steering update occurs on next PWM period 0 = Output steering update occurs at the beginning of the instruction cycle boundary bit 3 STRxD: Steering Enable bit D 1 = PxD pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxD pin is assigned to port pin bit 2 STRxC: Steering Enable bit C 1 = PxC pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxC pin is assigned to port pin bit 1 STRxB: Steering Enable bit B 1 = PxB pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxB pin is assigned to port pin bit 0 STRxA: Steering Enable bit A 1 = PxA pin has the PWM waveform with polarity control from CCPxM<1:0> 0 = PxA pin is assigned to port pin Note 1: The PWM Steering mode is available only when the CCPxCON register bits CCPxM<3:2>=11 and PxM<1:0>=00.  2010-2016 Microchip Technology Inc. DS40001414E-page 231

PIC16(L)F1946/47 24.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP1 AND MSSP2) MODULE 24.1 Master SSPx (MSSPx) Module Overview The Master Synchronous Serial Port (MSSPx) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSPx module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C) The SPI interface supports the following modes and features: • Master mode • Slave mode • Clock Parity • Slave Select Synchronization (Slave mode only) • Daisy-chain connection of slave devices Figure24-1 is a block diagram of the SPI interface module. FIGURE 24-1: MSSPX BLOCK DIAGRAM (SPI MODE) Data Bus Read Write SSPxBUF Reg SDIx SSPxSR Reg SDOx bit 0 Shift Clock SSx SSxControl 2 (CKP, CKE) Enable Clock Select Edge Select SSPM<3:0> 4 ( T M R 2 O u tp u t ) 2 SCKx Edge Prescaler TOSC Select 4, 16, 64 Baud Rate Generator TRIS bit (SSPxADD) DS40001414E-page 232  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 The I2C interface supports the following modes and The PIC16F1947 has two MSSP modules, MSSP1 and features: MSSP2, each module operating independently from the other. • Master mode • Slave mode • Byte NACKing (Slave mode) Note1: In devices with more than one MSSP • Limited Multi-master support module, it is very important to pay close • 7-bit and 10-bit addressing attention to SSPxCONx register names. SSP1CON1 and SSP1CON2 registers • Start and Stop interrupts control different operational aspects of • Interrupt masking the same module, while SSP1CON1 and • Clock stretching SSP2CON1 control the same features for • Bus collision detection two different modules. • General call address matching 2: Throughout this section, generic refer- • Address masking ences to an MSSP module in any of its • Address Hold and Data Hold modes operating modes may be interpreted as • Selectable SDAx hold times being equally applicable to MSSP1 or MSSP2. Register names, module I/O sig- Figure24-2 is a block diagram of the I2C interface nals, and bit names may use the generic module in Master mode. Figure24-3 is a diagram of the designator ‘x’ to indicate the use of a I2C interface module in Slave mode. numeral to distinguish a particular module when required. FIGURE 24-2: MSSPx BLOCK DIAGRAM (I2C MASTER MODE) Internal data bus <SSPM 3:0> Read Write SSPxBUF Baud Rate Generator (SSPxADD) SDAx Shift SDAx in Clock SSPxSR ct e Enable (RCEN) GMeSnSbetAararcttk ebn i(otS,w SSletPodxpgC ebOitL,NS2b) Clock Cntl arbitrate/BCOL det d off clock source) SCLx ceive Clock (Hol e R Start bit detect, Stop bit detect SCLx in Write collision detect Set/Reset: S, P, SSPxSTAT, WCOL, SSPOV Clock arbitration Reset SEN, PEN (SSPxCON2) Bus Collision State counter for Set SSPxIF, BCLxIF end of XMIT/RCV Address Match detect  2010-2016 Microchip Technology Inc. DS40001414E-page 233

PIC16(L)F1946/47 FIGURE 24-3: MSSPx BLOCK DIAGRAM (I2C SLAVE MODE) Internal Data Bus Read Write SSPxBUF Reg SCLx Shift Clock SSPxSR Reg SDAx MSb LSb SSPxMSK Reg Match Detect Addr Match SSPxADD Reg Start and Set, Reset Stop bit Detect S, P bits (SSPxSTAT Reg) DS40001414E-page 234  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.2 SPI Mode Overview its SDOx pin) and the slave device is reading this bit and saving it as the LSb of its shift register, that the The Serial Peripheral Interface (SPI) bus is a slave device is also sending out the MSb from its shift synchronous serial data communication bus that register (on its SDOx pin) and the master device is operates in Full Duplex mode. Devices communicate in reading this bit and saving it as the LSb of its shift a master/slave environment where the master device register. initiates the communication. A slave device is After eight bits have been shifted out, the master and controlled through a chip select known as Slave Select. slave have exchanged register values. The SPI bus specifies four signal connections: If there is more data to exchange, the shift registers are • Serial Clock (SCKx) loaded with new data and the process repeats itself. • Serial Data Out (SDOx) Whether the data is meaningful or not (dummy data), • Serial Data In (SDIx) depends on the application software. This leads to • Slave Select (SSx) three scenarios for data transmission: Figure24-1 shows the block diagram of the MSSPx • Master sends useful data and slave sends dummy module when operating in SPI Mode. data. The SPI bus operates with a single master device and • Master sends useful data and slave sends useful one or more slave devices. When multiple slave data. devices are used, an independent Slave Select • Master sends dummy data and slave sends useful connection is required from the master device to each data. slave device. Transmissions may involve any number of clock Figure24-4 shows a typical connection between a cycles. When there is no more data to be transmitted, master device and multiple slave devices. the master stops sending the clock signal and it The master selects only one slave at a time. Most slave deselects the slave. devices have tri-state outputs so their output signal Every slave device connected to the bus that has not appears disconnected from the bus when they are not been selected through its slave select line must selected. disregard the clock and transmission signals and must Transmissions involve two shift registers, eight bits in not transmit out any data of its own. size, one in the master and one in the slave. With either the master or the slave device, data is always shifted out one bit at a time, with the Most Significant bit (MSb) shifted out first. At the same time, a new Least Significant bit (LSb) is shifted into the same register. Figure24-5 shows a typical connection between two processors configured as master and slave devices. Data is shifted out of both shift registers on the programmed clock edge and latched on the opposite edge of the clock. The master device transmits information out on its SDOx output pin which is connected to, and received by, the slave’s SDIx input pin. The slave device trans- mits information out on its SDOx output pin, which is connected to, and received by, the master’s SDIx input pin. To begin communication, the master device first sends out the clock signal. Both the master and the slave devices should be configured for the same clock polarity. The master device starts a transmission by sending out the MSb from its shift register. The slave device reads this bit from that same line and saves it into the LSb position of its shift register. During each SPI clock cycle, a full duplex data transmission occurs. This means that while the master device is sending out the MSb from its shift register (on  2010-2016 Microchip Technology Inc. DS40001414E-page 235

PIC16(L)F1946/47 FIGURE 24-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION SCKx SCKx SPI Master SDOx SDIx SPI Slave SDIx SDOx #1 General I/O SSx General I/O General I/O SCKx SDIx SPI Slave SDOx #2 SSx SCKx SDIx SPI Slave SDOx #3 SSx 24.2.1 SPI MODE REGISTERS The MSSPx module has five registers for SPI mode operation. These are: • MSSPx STATUS register (SSPxSTAT) • MSSPx Control Register 1 (SSPxCON1) • MSSPx Control Register 3 (SSPxCON3) • MSSPx Data Buffer register (SSPxBUF) • MSSPx Address register (SSPxADD) • MSSPx Shift register (SSPxSR) (Not directly accessible) SSPxCON1 and SSPxSTAT are the control and STATUS registers in SPI mode operation. The SSPxCON1 register is readable and writable. The lower six bits of the SSPxSTAT are read-only. The upper two bits of the SSPxSTAT are read/write. In SPI master mode, SSPxADD can be loaded with a value used in the Baud Rate Generator. More information on the Baud Rate Generator is available in Section24.7 “Baud Rate Generator”. SSPxSR is the shift register used for shifting data in and out. SSPxBUF provides indirect access to the SSPxSR register. SSPxBUF is the buffer register to which data bytes are written, and from which data bytes are read. In receive operations, SSPxSR and SSPxBUF together create a buffered receiver. When SSPxSR receives a complete byte, it is transferred to SSPxBUF and the SSPxIF interrupt is set. During transmission, the SSPxBUF is not buffered. A write to SSPxBUF will write to both SSPxBUF and SSPxSR. DS40001414E-page 236  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.2.2 SPI MODE OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPxCON1<5:0> and SSPxSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCKx is the clock output) • Slave mode (SCKx is the clock input) • Clock Polarity (Idle state of SCKx) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCKx) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) To enable the serial port, SSPx Enable bit, SSPEN of the SSPxCON1 register, must be set. To reset or recon- figure SPI mode, clear the SSPEN bit, re-initialize the SSPxCONx registers and then set the SSPEN bit. This configures the SDIx, SDOx, SCKx and SSx pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDIx must have corresponding TRIS bit set • SDOx must have corresponding TRIS bit cleared • SCKx (Master mode) must have corresponding TRIS bit cleared • SCKx (Slave mode) must have corresponding TRIS bit set • SSx must have corresponding TRIS bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. The MSSPx consists of a transmit/receive shift register (SSPxSR) and a buffer register (SSPxBUF). The SSPxSR shifts the data in and out of the device, MSb first. The SSPxBUF holds the data that was written to the SSPxSR until the received data is ready. Once the eight bits of data have been received, that byte is moved to the SSPxBUF register. Then, the Buffer Full Detect bit, BF of the SSPxSTAT register, and the interrupt flag bit, SSPxIF, are set. This double-buffering of the received data (SSPxBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPxBUF register during transmission/reception of data will be ignored and the write collision detect bit WCOL of the SSPxCON1 register, will be set. User software must clear the WCOL bit to allow the following write(s) to the SSPxBUF register to complete successfully.  2010-2016 Microchip Technology Inc. DS40001414E-page 237

PIC16(L)F1946/47 When the application software is expecting to receive The SSPxSR is not directly readable or writable and valid data, the SSPxBUF should be read before the can only be accessed by addressing the SSPxBUF next byte of data to transfer is written to the SSPxBUF. register. Additionally, the SSPxSTAT register indicates The Buffer Full bit, BF of the SSPxSTAT register, the various Status conditions. indicates when SSPxBUF has been loaded with the received data (transmission is complete). When the SSPxBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSPx interrupt is used to determine when the transmission/reception has completed. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. FIGURE 24-5: SPI MASTER/SLAVE CONNECTION SPI Master SSPM<3:0> = 00xx SPI Slave SSPM<3:0> = 010x = 1010 SDOx SDIx Serial Input Buffer Serial Input Buffer (BUF) (SSPxBUF) SDIx SDOx Shift Register Shift Register (SSPxSR) (SSPxSR) MSb LSb MSb LSb Serial Clock SCKx SCKx Slave Select General I/O SSx Processor 1 (optional) Processor 2 DS40001414E-page 238  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.2.3 SPI MASTER MODE The clock polarity is selected by appropriately programming the CKP bit of the SSPxCON1 register The master can initiate the data transfer at any time and the CKE bit of the SSPxSTAT register. This then, because it controls the SCKx line. The master would give waveforms for SPI communication as determines when the slave (Processor 2, Figure24-5) shown in Figure24-6, Figure24-8 and Figure24-9, is to broadcast data by the software protocol. where the MSb is transmitted first. In Master mode, the In Master mode, the data is transmitted/received as SPI clock rate (bit rate) is user programmable to be one soon as the SSPxBUF register is written to. If the SPI of the following: is only going to receive, the SDOx output could be dis- • FOSC/4 (or TCY) abled (programmed as an input). The SSPxSR register will continue to shift in the signal present on the SDIx • FOSC/16 (or 4 * TCY) pin at the programmed clock rate. As each byte is • FOSC/64 (or 16 * TCY) received, it will be loaded into the SSPxBUF register as • Timer2 output/2 if a normal received byte (interrupts and Status bits • Fosc/(4 * (SSPxADD + 1)) appropriately set). Figure24-6 shows the waveforms for Master mode. When the CKE bit is set, the SDOx data is valid before there is a clock edge on SCKx. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPxBUF is loaded with the received data is shown. FIGURE 24-6: SPI MODE WAVEFORM (MASTER MODE) Write to SSPxBUF SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) 4 Clock Modes SCKx (CKP = 0 CKE = 1) SCKx (CKP = 1 CKE = 1) SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 1) SDIx (SMP = 0) bit 7 bit 0 Input Sample (SMP = 0) SDIx (SMP = 1) bit 7 bit 0 Input Sample (SMP = 1) SSPxIF SSPxSR to SSPxBUF  2010-2016 Microchip Technology Inc. DS40001414E-page 239

PIC16(L)F1946/47 24.2.4 SPI SLAVE MODE 24.2.5 SLAVE SELECT SYNCHRONIZATION In Slave mode, the data is transmitted and received as external clock pulses appear on SCKx. When the last The Slave Select can also be used to synchronize bit is latched, the SSPxIF interrupt flag bit is set. communication. The Slave Select line is held high until the master device is ready to communicate. When the Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can Slave Select line is pulled low, the slave knows that a be observed by reading the SCKx pin. The Idle state is new transmission is starting. determined by the CKP bit of the SSPxCON1 register. If the slave fails to receive the communication properly, While in Slave mode, the external clock is supplied by it will be reset at the end of the transmission, when the the external clock source on the SCKx pin. This exter- Slave Select line returns to a high state. The slave is nal clock must meet the minimum high and low times then ready to receive a new transmission when the as specified in the electrical specifications. Slave Select line is pulled low again. If the Slave Select line is not used, there is a risk that the slave will even- While in Sleep mode, the slave can transmit/receive tually become out of sync with the master. If the slave data. The shift register is clocked from the SCKx pin misses a bit, it will always be one bit off in future trans- input and when a byte is received, the device will gen- missions. Use of the Slave Select line allows the slave erate an interrupt. If enabled, the device will wake-up and master to align themselves at the beginning of from Sleep. each transmission. 24.2.4.1 Daisy-Chain Configuration The SSx pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SSx pin control The SPI bus can sometimes be connected in a enabled (SSPxCON1<3:0> = 0100). daisy-chain configuration. The first slave output is connected to the second slave input, the second slave When the SSx pin is low, transmission and reception output is connected to the third slave input, and so on. are enabled and the SDOx pin is driven. The final slave output is connected to the master input. When the SSx pin goes high, the SDOx pin is no longer Each slave sends out, during a second group of clock driven, even if in the middle of a transmitted byte and pulses, an exact copy of what was received during the becomes a floating output. External pull-up/pull-down first group of clock pulses. The whole chain acts as resistors may be desirable depending on the one large communication shift register. The application. daisy-chain feature only requires a single Slave Select line from the master device. Note 1: When the SPI is in Slave mode with SSx pin control enabled (SSPxCON1<3:0> = Figure24-7 shows the block diagram of a typical 0100), the SPI module will reset if the SSx daisy-chain connection when operating in SPI Mode. pin is set to VDD. In a daisy-chain configuration, only the most recent 2: When the SPI is used in Slave mode with byte on the bus is required by the slave. Setting the CKE set; the user must enable SSx pin BOEN bit of the SSPxCON3 register will enable writes control. to the SSPxBUF register, even if the previous byte has not been read. This allows the software to ignore data 3: While operated in SPI Slave mode, the that may not apply to it. SMP bit of the SSPxSTAT register must remain clear. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SSx pin to a high level or clearing the SSPEN bit. DS40001414E-page 240  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-7: SPI DAISY-CHAIN CONNECTION SCK SCK SPI Master SDOx SDIx SPI Slave SDIx SDOx #1 General I/O SSx SCK SDIx SPI Slave SDOx #2 SSx SCK SDIx SPI Slave SDOx #3 SSx FIGURE 24-8: SLAVE SELECT SYNCHRONOUS WAVEFORM SSx SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) Write to SSPxBUF Shift register SSPxSR and bit count are reset SSPxBUF to SSPxSR SDOx bit 7 bit 6 bit 7 bit 6 bit 0 SDIx bit 0 bit 7 bit 7 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF  2010-2016 Microchip Technology Inc. DS40001414E-page 241

PIC16(L)F1946/47 FIGURE 24-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE=0) SSx Optional SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) Write to SSPxBUF Valid SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDIx bit 7 bit 0 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF Write Collision detection active FIGURE 24-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SSx Not Optional SCKx (CKP = 0 CKE = 1) SCKx (CKP = 1 CKE = 1) Write to SSPxBUF Valid SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDIx bit 7 bit 0 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF Write Collision detection active DS40001414E-page 242  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.2.6 SPI OPERATION IN SLEEP MODE In SPI Master mode, when the Sleep mode is selected, all module clocks are halted and the In SPI Master mode, module clocks may be operating transmission/reception will remain in that state until the at a different speed than when in Full Power mode; in device wakes. After the device returns to Run mode, the case of the Sleep mode, all clocks are halted. the module will resume transmitting and receiving data. Special care must be taken by the user when the In SPI Slave mode, the SPI Transmit/Receive Shift MSSPx clock is much faster than the system clock. register operates asynchronously to the device. This In Slave mode, when MSSPx interrupts are enabled, allows the device to be placed in Sleep mode and data after the master completes sending data, an MSSPx to be shifted into the SPI Transmit/Receive Shift interrupt will wake the controller from Sleep. register. When all eight bits have been received, the MSSPx interrupt flag bit will be set and if enabled, will If an exit from Sleep mode is not desired, MSSPx wake the device. interrupts should be disabled. TABLE 24-1: SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register 236* SSP2BUF Synchronous Serial Port Receive Buffer/Transmit Register 236* SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 282 SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 285 SSP1STAT SMP CKE D/A P S R/W UA BF 281 SSP2CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 282 SSP2CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 285 SSP2STAT SMP CKE D/A P S R/W UA BF 281 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 134 TRISF TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 140 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSPx in SPI mode. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 243

PIC16(L)F1946/47 24.3 I2C MODE OVERVIEW FIGURE 24-11: I2C MASTER/ SLAVE CONNECTION The Inter-Integrated Circuit Bus (I²C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment where the master VDD devices initiate the communication. A Slave device is controlled through addressing. SCLx SCLx The I2C bus specifies two signal connections: VDD • Serial Clock (SCLx) Master Slave • Serial Data (SDAx) SDAx SDAx Figure24-2 and Figure24-3 show the block diagrams of the MSSPx module when operating in I2C mode. Both the SCLx and SDAx connections are bidirectional open-drain lines, each requiring pull-up resistors for the The Acknowledge bit (ACK) is an active-low signal, supply voltage. Pulling the line to ground is considered which holds the SDAx line low to indicate to the a logical zero and letting the line float is considered a transmitter that the slave device has received the logical one. transmitted data and is ready to receive more. Figure24-11 shows a typical connection between two The transition of a data bit is always performed while processors configured as master and slave devices. the SCLx line is held low. Transitions that occur while The I2C bus can operate with one or more master the SCLx line is held high are used to indicate Start and devices and one or more slave devices. Stop bits. There are four potential modes of operation for a given If the master intends to write to the slave, then it device: repeatedly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this • Master Transmit mode example, the master device is in Master Transmit mode (master is transmitting data to a slave) and the slave is in Slave Receive mode. • Master Receive mode If the master intends to read from the slave, then it (master is receiving data from a slave) repeatedly receives a byte of data from the slave, and • Slave Transmit mode responds after each byte with an ACK bit. In this (slave is transmitting data to a master) example, the master device is in Master Receive mode • Slave Receive mode and the slave is Slave Transmit mode. (slave is receiving data from the master) On the last byte of data communicated, the master To begin communication, a master device starts out in device may end the transmission by sending a Stop bit. Master Transmit mode. The master device sends out a If the master device is in Receive mode, it sends the Start bit followed by the address byte of the slave it Stop bit in place of the last ACK bit. A Stop bit is intends to communicate with. This is followed by a indicated by a low-to-high transition of the SDAx line single Read/Write bit, which determines whether the while the SCLx line is held high. master intends to transmit to or receive data from the In some cases, the master may want to maintain slave device. control of the bus and re-initiate another transmission. If the requested slave exists on the bus, it will respond If so, the master device may send another Start bit in with an Acknowledge bit, otherwise known as an ACK. place of the Stop bit or last ACK bit when it is in receive The master then continues in either Transmit mode or mode. Receive mode and the slave continues in the The I2C bus specifies three message protocols: complement, either in Receive mode or Transmit mode, respectively. • Single message where a master writes data to a slave. A Start bit is indicated by a high-to-low transition of the SDAx line while the SCLx line is held high. Address and • Single message where a master reads data from data bytes are sent out, Most Significant bit (MSb) first. a slave. The Read/Write bit is sent out as a logical one when the • Combined message where a master initiates a master intends to read data from the slave, and is sent minimum of two writes, or two reads, or a out as a logical zero when it intends to write data to the combination of writes and reads, to one or more slave. slaves. DS40001414E-page 244  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 When one device is transmitting a logical one, or letting cations, because so far, the transmission appears the line float, and a second device is transmitting a exactly as expected with no other transmitter disturbing logical zero, or holding the line low, the first device can the message. detect that the line is not a logical one. This detection, Slave Transmit mode can also be arbitrated, when a when used on the SCLx line, is called clock stretching. master addresses multiple slaves, but this is less Clock stretching gives slave devices a mechanism to common. control the flow of data. When this detection is used on the SDAx line, it is called arbitration. Arbitration If two master devices are sending a message to two ensures that there is only one master device different slave devices at the address stage, the master communicating at any single time. sending the lower slave address always wins arbitration. When two master devices send messages 24.3.1 CLOCK STRETCHING to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration When a slave device has not completed processing process must continue into the data stage. data, it can delay the transfer of more data through the process of clock stretching. An addressed slave device Arbitration usually occurs very rarely, but it is a may hold the SCLx clock line low after receiving or necessary process for proper multi-master support. sending a bit, indicating that it is not yet ready to con- tinue. The master that is communicating with the slave 24.4 I2C Mode Operation will attempt to raise the SCLx line in order to transfer All MSSPx I2C communication is byte-oriented and the next bit, but will detect that the clock line has not yet shifts out MSb first. Six SFR registers and two interrupt been released. Because the SCLx connection is flags interface the module with the PIC® open-drain, the slave has the ability to hold that line low microcontroller and user software. Two pins, SDAx until it is ready to continue communicating. and SCLx, are exercised by the module to Clock stretching allows receivers that cannot keep up communicate with other external I2C devices. with a transmitter to control the flow of incoming data. 24.4.1 BYTE FORMAT 24.3.2 ARBITRATION All communication in I2C is done in 9-bit segments. A Each master device must monitor the bus for Start and byte is sent from a Master to a Slave or vice-versa, Stop bits. If the device detects that the bus is busy, it followed by an Acknowledge bit sent back. After the cannot begin a new message until the bus returns to an eighth falling edge of the SCLx line, the device Idle state. outputting data on the SDAx changes that pin to an However, two master devices may try to initiate a input and reads in an acknowledge value on the next transmission on or about the same time. When this clock pulse. occurs, the process of arbitration begins. Each The clock signal, SCLx, is provided by the master. transmitter checks the level of the SDAx data line and Data is valid to change while the SCLx signal is low, compares it to the level that it expects to find. The first and sampled on the rising edge of the clock. Changes transmitter to observe that the two levels do not match, on the SDAx line while the SCLx line is high define loses arbitration, and must stop transmitting on the special conditions on the bus, explained below. SDAx line. 24.4.2 DEFINITION OF I2C TERMINOLOGY For example, if one transmitter holds the SDAx line to a logical one (lets it float) and a second transmitter There is language and terminology in the description of holds it to a logical zero (pulls it low), the result is that I2C communication that have definitions specific to I2C. the SDAx line will be low. The first transmitter then That word usage is defined below and may be used in observes that the level of the line is different than the rest of this document without explanation. This table expected and concludes that another transmitter is was adapted from the Philips I2C specification. communicating. 24.4.3 SDAx AND SCLx PINS The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDAx Selection of any I2C mode with the SSPEN bit set, line. If this transmitter is also a master device, it also forces the SCLx and SDAx pins to be open-drain. must stop driving the SCLx line. It then can monitor the These pins should be set by the user to inputs by lines for a Stop condition before trying to reissue its setting the appropriate TRIS bits. transmission. In the meantime, the other device that has not noticed any difference between the expected Note: Data is tied to output zero when an I2C and actual levels on the SDAx line continues with its mode is enabled. original transmission. It can do so without any compli-  2010-2016 Microchip Technology Inc. DS40001414E-page 245

PIC16(L)F1946/47 24.4.4 SDAx HOLD TIME The hold time of the SDAx pin is selected by the SDAHT bit of the SSPxCON3 register. Hold time is the time SDAx is held valid after the falling edge of SCLx. Setting the SDAHT bit selects a longer 300ns minimum hold time and may help on buses with large capacitance. TABLE 24-2: I2C BUS TERMS TERM Description Transmitter The device which shifts data out onto the bus. Receiver The device which shifts data in from the bus. Master The device that initiates a transfer, generates clock signals and termi- nates a transfer. Slave The device addressed by the master. Multi-master A bus with more than one device that can initiate data transfers. Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus. Idle No master is controlling the bus, and both SDAx and SCLx lines are high. Active Any time one or more master devices are controlling the bus. Addressed Slave device that has received a Slave matching address and is actively being clocked by a master. Matching Address byte that is clocked into a Address slave that matches the value stored in SSPxADD. Write Request Slave receives a matching address with R/W bit clear, and is ready to clock in data. Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus hold SCLx low to stall communication. Bus Collision Any time the SDAx line is sampled low by the module while it is out- putting and expected high state. DS40001414E-page 246  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.4.5 START CONDITION has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an The I2C specification defines a Start condition as a address. The master may want to address the same or transition of SDAx from a high to a low state while another slave. SCLx line is high. A Start condition is always gener- In 10-bit Addressing Slave mode, a Restart is required ated by the master and signifies the transition of the for the master to clock data out of the addressed bus from an Idle to an Active state. Figure24-10 slave. Once a slave has been fully addressed, match- shows waveforms for Start and Stop conditions. ing both high and low address bytes, the master can A bus collision can occur on a Start condition if the issue a Restart and the high address byte with the module samples the SDAx line low before asserting it R/W bit set. The slave logic will then hold the clock low. This does not conform to the I2C Specification that and prepare to clock out data. states no bus collision can occur on a Start. After a full match with R/W clear in 10-bit mode, a prior 24.4.6 STOP CONDITION match flag is set and maintained. Until a Stop condition, a high address with R/W clear, or high A Stop condition is a transition of the SDAx line from address match fails. low-to-high state while the SCLx line is high. 24.4.8 START/STOP CONDITION INTERRUPT Note: At least one SCLx low time must appear MASKING before a Stop is valid, therefore, if the SDAx line goes low then high again while the SCLx The SCIE and PCIE bits of the SSPxCON3 register line stays high, only the Start condition is can enable the generation of an interrupt in Slave detected. modes that do not typically support this function. Slave modes where interrupt on Start and Stop detect are 24.4.7 RESTART CONDITION already enabled, these bits will have no effect. A Restart is valid any time that a Stop would be valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart FIGURE 24-12: I2C START AND STOP CONDITIONS SDAx SCLx S P Change of Change of Data Allowed Data Allowed Start Stop Condition Condition FIGURE 24-13: I2C RESTART CONDITION Sr Change of Change of Data Allowed Data Allowed Restart Condition  2010-2016 Microchip Technology Inc. DS40001414E-page 247

PIC16(L)F1946/47 24.4.9 ACKNOWLEDGE SEQUENCE 24.5 I2C SLAVE MODE OPERATION The 9th SCLx pulse for any transferred byte in I2C is The MSSPx Slave mode operates in one of four dedicated as an Acknowledge. It allows receiving modes selected in the SSPM bits of SSPxCON1 devices to respond back to the transmitter by pulling register. The modes can be divided into 7-bit and the SDAx line low. The transmitter must release con- 10-bit Addressing mode. 10-bit Addressing modes trol of the line during this time to shift in the response. operate the same as 7-bit with some additional The Acknowledge (ACK) is an active-low signal, pull- overhead for handling the larger addresses. ing the SDAx line low indicated to the transmitter that Modes with Start and Stop bit interrupts operated the the device has received the transmitted data and is same as the other modes with SSPxIF additionally ready to receive more. getting set upon detection of a Start, Restart, or Stop The result of an ACK is placed in the ACKSTAT bit of condition. the SSPxCON2 register. 24.5.1 SLAVE MODE ADDRESSES Slave software, when the AHEN and DHEN bits are set, allows the user to set the ACK value sent back to The SSPxADD register (Register24-6) contains the the transmitter. The ACKDT bit of the SSPxCON2 Slave mode address. The first byte received after a register is set/cleared to determine the response. Start or Restart condition is compared against the Slave hardware will generate an ACK response if the value stored in this register. If the byte matches, the AHEN and DHEN bits of the SSPxCON3 register are value is loaded into the SSPxBUF register and an clear. interrupt is generated. If the value does not match, the module goes idle and no indication is given to the soft- An ACK will not be sent by the slave when an overflow ware that anything happened. condition is detected. An overflow condition is defined by either the SSPxSTAT register bit BF being set, or by The SSPx Mask register (Register24-5) affects the the SSPxCON1 register bit SSPOV being set. address matching process. See Section24.5.9 “SSPx Mask Register” for more information. When the module is addressed, after the eighth falling edge of SCLx on the bus, the ACKTIM bit of the 24.5.1.1 I2C Slave 7-bit Addressing Mode SSPxCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM In 7-bit Addressing mode, the LSb of the received data Status bit is only active when the AHEN bit or DHEN byte is ignored when determining if there is an address bit is enabled. match. 24.5.1.2 I2C Slave 10-bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 and A8 are the two MSb of the 10-bit address and stored in bits 2 and 1 of the SSPxADD register. After the acknowledge of the high byte, the UA bit is set and SCLx is held low until the user updates SSPxADD with the low address. The low address byte is clocked in and all eight bits are compared to the low address value in SSPxADD. Even if there is not an address match, SSPxIF and UA are set, and SCLx is held low until SSPxADD is updated to receive a high byte again. When SSPxADD is updated, the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hardware will then acknowledge the read request and prepare to clock out data. This is only valid for a slave after it has received a complete high and low address byte match. DS40001414E-page 248  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.5.2 SLAVE RECEPTION 24.5.2.2 7-bit Reception with AHEN and DHEN When the R/W bit of a matching received address byte Slave device reception with AHEN and DHEN set is clear, the R/W bit of the SSPxSTAT register is operates the same as without these options with extra cleared. The received address is loaded into the interrupts and clock stretching added after the eighth SSPxBUF register and acknowledged. falling edge of SCLx. These additional interrupts allow the slave software to decide whether it wants to ACK When the overflow condition exists for a received the receive address or data byte, rather than the hard- address, then NACK is given. An overflow condition is ware. This functionality adds support for the PMBus™ defined by either the SSPxSTAT register bit BF being that was not present on previous versions of this mod- set, or by the SSPxCON1 register bit SSPOV being set. ule. The BOEN bit of the SSPxCON3 register modifies this operation. For more information see Register24-4. This list describes the steps that need to be taken by the slave software to use these options for I2C com- An MSSPx interrupt is generated for each transferred munication. Figure24-15 displays a module using data byte. Flag bit, SSPxIF, must be cleared by both address and data holding. Figure24-16 includes software. the operation with the SEN bit of the SSPxCON2 reg- When the SEN bit of the SSPxCON2 register is set, ister set. SCLx will be held low (clock stretch) following each 1. The S bit of SSPxSTAT is set; SSPxIF is set if received byte. The clock must be released by setting interrupt on Start detect is enabled. the CKP bit of the SSPxCON1 register, except in 10-bit mode, when the SSPxSTAT register bit UA is set. See 2. Matching address with R/W bit clear is clocked Section24.5.6.2 “10-bit Addressing Mode” for more in. SSPxIF is set and CKP cleared after the details. eighth falling edge of SCLx. 3. Slave clears the SSPxIF. 24.5.2.1 7-bit Addressing Reception 4. Slave can look at the ACKTIM bit of the This section describes a standard sequence of events SSPxCON3 register to determine if the SSPxIF for the MSSPx module configured as an I2C Slave in was after or before the ACK. 7-bit Addressing mode. Figure24-13 and Figure24-14 5. Slave reads the address value from SSPxBUF, are used as visual references for this description. clearing the BF flag. This is a step by step process of what typically must 6. Slave sets ACK value clocked out to the master be done to accomplish I2C communication. by setting ACKDT. 7. Slave releases the clock by setting CKP. 1. Start bit detected. 8. SSPxIF is set after an ACK, not after a NACK. 2. S bit of SSPxSTAT is set; SSPxIF is set if inter- rupt on Start detect is enabled. 9. If SEN=1, the slave hardware will stretch the clock after the ACK. 3. Matching address with R/W bit clear is received. 10. Slave clears SSPxIF. 4. The slave pulls SDAx low sending an ACK to the master, and sets the SSPxIF bit. Note: SSPxIF is still set after the ninth falling edge 5. Software clears the SSPxIF bit. of SCLx even if there is no clock stretching and BF has been cleared. SSPxIF is not set 6. Software reads received address from only when a NACK was sent to the SSPxBUF, clearing the BF flag. MASTER. 7. If SEN=1; Slave software sets CKP bit to release the SCLx line. 11. SSPxIF is set and CKP cleared after eighth fall- 8. The master clocks out a data byte. ing edge of SCLx for a received data byte. 9. Slave drives SDAx low, sending an ACK to the 12. Slave looks at the ACKTIM bit of SSPxCON3 to master, and sets SSPxIF bit. determine the source of the interrupt. 10. Software clears SSPxIF. 13. Slave reads the received data from SSPxBUF, 11. Software reads the received byte from clearing BF. SSPxBUF clearing BF. 14. Steps 7-14 are the same for each received data 12. Steps 8-12 are repeated for all received bytes byte. from the Master. 15. Communication is ended by either the slave 13. Master sends Stop condition, setting P bit of sending an ACK=1, or the master sending a SSPxSTAT, and the bus goes Idle. Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave must poll the P bit of the SSTSTAT register to know that the Stop condition was received.  2010-2016 Microchip Technology Inc. DS40001414E-page 249

PIC16(L)F1946/47 FIGURE 24-14: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=0, AHEN=0, DHEN=0) s endn 9th Bus Master sStop conditio 1 P SSPxIF set on falling edge of SCLx = K 9 C A D0 8 Master eceiving Data D4D3D2D1 4567 eared by software SSPOV set becauseSSPxBUF is still full. ACK is not sent. e to R D5 3 Cl From Slav D7D6K 12 First byte of data is available in SSPxBUF C 9 A D0 8 D1 7 ad e a D2 6 ware F is r Receiving Dat D5D4D3 345 Cleared by soft SSPxBU D6 2 D7 1 K 9 C A 8 A1 7 2 6 A s s dre A3 5 d A ng A4 4 vi ecei A5 3 R A6 2 A7 1 S V F O x x xI P DA CL SP BF SS S S S DS40001414E-page 250  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-15: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=1, AHEN=0, DHEN=0) Bus Master sends Stop condition P SSPxIF set on 9thfalling edge of SCLx SCLx is not heldlow becauseACK=1 K C 9 A D0 8 Receive Data D7D6D5D4D3D2D1 1234567 Cleared by software First byte of data is available in SSPxBUF SSPOV set becauseSSPxBUF is still full. ACK is not sent. CKP is written to 1 in software, releasing SCLx N E S K AC 9 D0 8 ’1 o ‘ Data D2D1 67 KP is set t oftware, Receive D7D6D5D4D3 12345 Clock is held low until C Cleared by software SSPxBUF is read CKP is written to ‘’ in s1releasing SCLx N E S K C A 9 0 = W R/ 8 A1 7 2 6 A s s dre A3 5 d e A A4 4 v ei ec A5 3 R 6 2 A A7 1 S V F O P SDAx SCLx SSPxI BF SSP CK  2010-2016 Microchip Technology Inc. DS40001414E-page 251

PIC16(L)F1946/47 FIGURE 24-16: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=0, AHEN=1, DHEN=1) Master sendsStop condition =1 P No interruptafter not ACKfrom Slave CK 9 A are T to Received DataCKD7D6D5D4D3D2D1D0 912345678 Cleared by software a is read from SSPxBUF Slave softwsets ACKDnot ACK CKP set by software, SCLx is released ACKTIM set by hardwareon 8th falling edge of SCLx A at D D0 8 g Receiving Data D6D5D4D3D2D1 234567 SPxIF is set on h falling edge of CLx, after ACK When DHEN=:1CKP is cleared byhardware on 8th fallinedge of SCLx KTIM cleared bydware in 9th ng edge of SCLx D7 1 S9tS ACharrisi K 9 ce C n A e Axqu De es SCK s sA Master Releato slave for Receiving Address A7A6A5A4A3A2A1 12345678 If AHEN=:1SSPxIF is set Address isread from SSBUF Slave softwareclears ACKDT to ACK the receivedbyte When AHEN=:1CKP is cleared by hardwareand SCLx is stretched ACKTIM set by hardwareon 8th falling edge of SCLx S M SDAx SCLx SSPxIF BF ACKDT CKP ACKTI S P DS40001414E-page 252  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-17: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN= 1, AHEN=1, DHEN=1) Master sendsStop condition P No interrupt afterif not ACKfrom Slave CKP is not clearedif not ACK K 9 C A D0 8 s d D1 7 enK Receive Data D6D5D4D3D2 23456 SSPxBUF can beread any time beforenext byte is loaded Slave snot AC Set by software,release SCLx D7 1 K C 9 A D0 8 F e CK sequence Receive Data D7D6D5D4D3D2D1 1245673 Cleared by software Received data isavailable on SSPxBU When DHEN = ;1on the 8th falling edgeof SCLx of a receiveddata byte, CKP is cleared ACKTIM is cleared by hardwaron 9th rising edge of SCLx A er releasesx to slave for ACK 9 stA aD MS 8 s R/W = 0 Receiving Address A6A5A4A3A2A1 342567 Received address is loaded into SSPxBUF Slave software clearACKDT to ACKthe received byte When AHEN=;1on the 8th falling edgeof SCLx of an addressbyte, CKP is cleared KTIM is set by hardware8th falling edge of SCLx A7 1 ACon S M TI SDAx SCLx SSPxIF BF ACKDT CKP ACK S P  2010-2016 Microchip Technology Inc. DS40001414E-page 253

PIC16(L)F1946/47 24.5.3 SLAVE TRANSMISSION 24.5.3.2 7-bit Transmission When the R/W bit of the incoming address byte is set A master device can transmit a read request to a and an address match occurs, the R/W bit of the slave, and then clock data out of the slave. The list SSPxSTAT register is set. The received address is below outlines what software for a slave will need to loaded into the SSPxBUF register, and an ACK pulse is do to accomplish a standard transmission. sent by the slave on the ninth bit. Figure24-17 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit 1. Master sends a Start condition on SDAx and and the SCLx pin is held low (see Section24.5.6 SCLx. “Clock Stretching” for more details). By stretching the 2. S bit of SSPxSTAT is set; SSPxIF is set if inter- clock, the master will be unable to assert another clock rupt on Start detect is enabled. pulse until the slave is done, preparing the transmit 3. Matching address with R/W bit set is received by data. the Slave setting SSPxIF bit. The transmit data must be loaded into the SSPxBUF 4. Slave hardware generates an ACK and sets register which also loads the SSPxSR register. Then, SSPxIF. the SCLx pin should be released by setting the CKP bit 5. SSPxIF bit is cleared by the user. of the SSPxCON1 register. The eight data bits are 6. Software reads the received address from shifted out on the falling edge of the SCLx input. This SSPxBUF, clearing BF. ensures that the SDAx signal is valid during the SCLx 7. R/W is set so CKP is automatically cleared after high time. the ACK. The ACK pulse from the master-receiver is latched on 8. The slave software loads the transmit data into the rising edge of the ninth SCLx input pulse. This ACK SSPxBUF. value is copied to the ACKSTAT bit of the SSPxCON2 register. If ACKSTAT is set (not ACK), then the data 9. CKP bit is set releasing SCLx, allowing the transfer is complete. In this case, when the not ACK is master to clock the data out of the slave. latched by the slave, the slave goes Idle and waits for 10. SSPxIF is set after the ACK response from the another occurrence of the Start bit. If the SDAx line was master is loaded into the ACKSTAT register. low (ACK), the next transmit data must be loaded into 11. SSPxIF bit is cleared. the SSPxBUF register. Again, the SCLx pin must be 12. The slave software checks the ACKSTAT bit to released by setting bit CKP. see if the master wants to clock out more data. An MSSPx interrupt is generated for each data transfer Note 1: If the master ACKs, the clock will be byte. The SSPxIF bit must be cleared by software and stretched. the SSPxSTAT register is used to determine the status 2: ACKSTAT is the only bit updated on the of the byte. The SSPxIF bit is set on the falling edge of rising edge of SCLx (9th) rather than on the ninth clock pulse. the falling. 24.5.3.1 Slave Mode Bus Collision 13. Steps 9-13 are repeated for each transmitted A slave receives a Read request and begins shifting byte. data out on the SDAx line. If a bus collision is detected 14. If the master sends a not ACK; the clock is not and the SBCDE bit of the SSPxCON3 register is set, held, but SSPxIF is still set. the BCLxIF bit of the PIRx register is set. Once a bus 15. The master sends a Restart condition or a Stop. collision is detected, the slave goes Idle and waits to be 16. The slave is no longer addressed. addressed again. User software can use the BCLxIF bit to handle a slave bus collision. DS40001414E-page 254  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-18: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN=0) sn do enditi er scon P stp ao MSt K C 9 A Transmitting Data D7D6D5D4D3D2D1D0 12345678 BF is automatically cleared after 8th fallingedge of SCLx CKP is not held for not ACK Masters not ACKis copied to ACKSTAT c ati m o ut A K AC 9 D0 8 1 D 7 a Dat D2 6 F Transmitting D7D6D5D4D3 12345 Cleared by software Data to transmit isloaded into SSPxBU Set by software c ati m o ut A 1CK =A 9 W eceiving AddressR/A5A4A3A2A1 345678 Received addressis read from SSPxBUF When R/W is setSCLx is alwaysheld low after 9th SCLxfalling edge R/W is copied from the matching address byte Indicates an address has been received R 6 A 2 7 A 1 S T F TA SDAx SCLx SSPxI BF CKP ACKS R/W D/A S P  2010-2016 Microchip Technology Inc. DS40001414E-page 255

PIC16(L)F1946/47 24.5.3.3 7-bit Transmission with Address Hold Enabled Setting the AHEN bit of the SSPxCON3 register enables additional clock stretching and interrupt gen- eration after the eighth falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPxIF inter- rupt is set. Figure24-18 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. Bus starts Idle. 2. Master sends Start condition; the S bit of SSPxSTAT is set; SSPxIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the eighth falling edge of the SCLx line the CKP bit is cleared and SSPxIF interrupt is generated. 4. Slave software clears SSPxIF. 5. Slave software reads the ACKTIM bit of the SSPxCON3 register, and R/W and D/A of the SSPxSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPxBUF register clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK and sets the ACKDT bit of the SSPxCON2 register accordingly. 8. Slave sets the CKP bit releasing SCLx. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPxIF after the ACK if the R/W bit is set. 11. Slave software clears SSPxIF. 12. Slave loads value to transmit to the master into SSPxBUF setting the BF bit. Note: SSPxBUF cannot be loaded until after the ACK. 13. Slave sets the CKP bit, releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the ninth SCLx pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit of the SSPxCON2 register. 16. Steps 10-15 are repeated for each byte transmit- ted to the master from the slave. 17. If the master sends a not ACK, the slave releases the bus allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCLx line to receive a Stop. DS40001414E-page 256  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-19: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN=1) endsdition sn aster op co P MSt K C A 9 0 D 8 Transmitting Data D5D4D3D2D1 34567 F is automatically eared after 8th fallingge of SCLx Master’s ACKresponse is copiedto SSPxSTAT CKP not cleared after not ACK D6 2 Bcled 7 D 1 c ati m o AutK C A 9 D0 8 1 a D 7 at D 2 DAxequence AutomaticTransmitting D7D6D5D4D3D 123456 Cleared by software Data to transmit isloaded into SSPxBUF Set by software,releases SCLx ACKTIM is clearedon 9th rising edge of SCLx Ss K Master releases to slave for ACK W=1AC 9 When R/W = ;1CKP is alwayscleared after ACK R/ 8 F U K Receiving Address A7A6A5A4A3A2A1 1234567 Received addressis read from SSPxB Slave clearsACKDT to ACaddress When AHEN = ;1CKP is cleared by hardwareafter receiving matchingaddress. ACKTIM is set on 8th fallingedge of SCLx S SDAx SCLx SPxIF BF CKDT STAT CKP KTIM R/W D/A S A K C C A A  2010-2016 Microchip Technology Inc. DS40001414E-page 257

PIC16(L)F1946/47 24.5.4 SLAVE MODE 10-BIT ADDRESS 24.5.5 10-BIT ADDRESSING WITH ADDRESS RECEPTION OR DATA HOLD This section describes a standard sequence of events Reception using 10-bit addressing with AHEN or for the MSSPx module configured as an I2C Slave in DHEN set is the same as with 7-bit modes. The only 10-bit Addressing mode. difference is the need to update the SSPxADD register using the UA bit. All functionality, specifically when the Figure24-19 is used as a visual reference for this CKP bit is cleared and SCLx line is held low are the description. same. Figure24-20 can be used as a reference of a This is a step by step process of what must be done by slave in 10-bit addressing with AHEN set. slave software to accomplish I2C communication. Figure24-21 shows a standard waveform for a slave 1. Bus starts Idle. transmitter in 10-bit Addressing mode. 2. Master sends Start condition; S bit of SSPxSTAT is set; SSPxIF is set if interrupt on Start detect is enabled. 3. Master sends matching high address with R/W bit clear; UA bit of the SSPxSTAT register is set. 4. Slave sends ACK and SSPxIF is set. 5. Software clears the SSPxIF bit. 6. Software reads received address from SSPxBUF clearing the BF flag. 7. Slave loads low address into SSPxADD, releasing SCLx. 8. Master sends matching low address byte to the Slave; UA bit is set. Note: Updates to the SSPxADD register are not allowed until after the ACK sequence. 9. Slave sends ACK and SSPxIF is set. Note: If the low address does not match, SSPxIF and UA are still set so that the slave soft- ware can set SSPxADD back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPxIF. 11. Slave reads the received matching address from SSPxBUF clearing BF. 12. Slave loads high address into SSPxADD. 13. Master clocks a data byte to the slave and clocks out the slaves ACK on the ninth SCLx pulse; SSPxIF is set. 14. If SEN bit of SSPxCON2 is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPxIF. 16. Slave reads the received byte from SSPxBUF clearing BF. 17. If SEN is set, the slave sets CKP to release the SCLx. 18. Steps 13-17 repeat for each received byte. 19. Master sends Stop to end the transmission. DS40001414E-page 258  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-20: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN=1, AHEN=0, DHEN=0) endsdition er scon P stp ao MSt K C 9 A 0 8 D ata D1 7 dBUF Receive D D6D5D4D3D2 23456 SCLx is held lowwhile CKP = 0 Data is reafrom SSPx Set by software,releasing SCLxyte D7 1 d b e v K cei Receive Data D6D5D4D3D2D1D0AC 92345678 Cleared by software Receive address isread from SSPxBUF When SEN = ;1CKP is cleared after9th falling edge of re D7 1 K C e A 9 Byt A0 8 DD s A es A1 7 Px Receive Second Addr A6A5A4A3A2 23456 Software updates SSand releases SCLx A7 1 K C 9 ve First Address Byte A0A9A811 345678 Set by hardwareon 9th falling edge If address matchesSSPxADD it is loaded into SSPxBUF When UA = ;1SCLx is held low ei 1 2 c e R 1 1 S SDAx SCLx SPxIF BF UA CKP S  2010-2016 Microchip Technology Inc. DS40001414E-page 259

PIC16(L)F1946/47 FIGURE 24-21: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN=0, AHEN=1, DHEN=0) a Receive Data D7D6D5 12 Received datis read from SSPxBUF K C 9 A D0 8 D1 7 s D,se Receive Data D6D5D4D3D2 23456 eared by software Update of SSPxADclears UA and releaSCLx CKP with software ases SCLx D7 1 Cl Set rele A U K C 9 A 0 A 8 Receive Second Address Byte A6A5A4A3A2A1 345672 ed by software SSPxBUF can beread anytime beforethe next received byte ate to SSPxADD isallowed until 9thng edge of SCLx A7 1 Clear Updnot falli A U K C 9 A 0 = W 8 eive First Address ByteR/ A9A8110 34567 Set by hardwareon 9th falling edge Slave software clearsACKDT to ACKthe received byte If when AHEN=;1on the 8th falling edgeof SCLx of an addressbyte, CKP is cleared ACKTIM is set by hardwareon 8th falling edge of SCLx ec 1 2 R 1 1 S F T M SDAx SCLx SSPxI BF ACKD UA CKP ACKTI DS40001414E-page 260  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-22: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN=0, AHEN=0, DHEN=0) ends dition er scon P MastStop K = 1 ds AC 9 en D0 8 K Master snot ACK Transmitting Data Byte D7D6D5D4D3D2D1 1723456 Data to transmit isloaded into SSPxBUF Set by softwarereleases SCLx Masters not ACis copied K C A 9 aster sends estart event Receive First Address Byte A9A811110 16782345Sr Set by hardware Received address isread from SSPxBUF High address is loadedback into SSPxADD When R/W = ;1CKP is cleared on9th falling edge of SCLx R/W is copied from thematching address byte MR K yte AC 9 eiving Second Address B A6A5A4A3A2A1A0 6782345 Cleared by software After SSPxADD isupdated, UA is clearedand SCLx is released c Re A7 1 K = 0 AC 9 W 8 Receiving AddressR/ A9A811110 1672345 Set by hardware SSPxBUF loadedwith received address UA indicates SSPxADDmust be updated Indicates an addresshas been received S AT T S SDAx SCLx SPxIF BF UA CKP ACK R/W D/A S  2010-2016 Microchip Technology Inc. DS40001414E-page 261

PIC16(L)F1946/47 24.5.6 CLOCK STRETCHING 24.5.6.2 10-bit Addressing Mode Clock stretching occurs when a device on the bus In 10-bit Addressing mode, when the UA bit is set, the holds the SCLx line low effectively, pausing clock is always stretched. This is the only time the communication. The slave may stretch the clock to SCLx is stretched without CKP being cleared. SCLx is allow more time to handle data or prepare a response released immediately after a write to SSPxADD. for the master device. A master device is not Note: Previous versions of the module did not concerned with stretching as anytime it is active on the stretch the clock if the second address byte bus and not transferring data it is stretching. Any did not match. stretching done by a slave is invisible to the master software and by the hardware that generates SCLx. 24.5.6.3 Byte NACKing The CKP bit of the SSPxCON1 register is used to con- When AHEN bit of SSPxCON3 is set, CKP is cleared trol stretching in software. Any time the CKP bit is by hardware after the eighth falling edge of SCLx for a cleared, the module will wait for the SCLx line to go received matching address byte. When the DHEN bit low and then hold it. Setting CKP will release SCLx of SSPxCON3 is set, CKP is cleared after the eighth and allow more communication. falling edge of SCLx for received data. 24.5.6.1 Normal Clock Stretching Stretching after the eighth falling edge of SCLx allows Following an ACK, if the R/W bit of SSPxSTAT is set, the slave to look at the received address or data and the slave hardware will clear CKP. This allows the decide if it wants to ACK the received data. slave time to update SSPxBUF with data to transfer to 24.5.7 CLOCK SYNCHRONIZATION AND the master. If the SEN bit of SSPxCON2 is set, the THE CKP BIT slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready, CKP is set by Any time the CKP bit is cleared, the module will wait software and communication resumes. for the SCLx line to go low and then hold it. However, clearing the CKP bit will not assert the SCLx output Note 1: The BF bit has no effect if the clock will be low until the SCLx output is already sampled low. stretched or not. The previous version of Therefore, the CKP bit will not assert the SCLx line the module did not stretch the clock if until an external I2C master device has already SSPxBUF was read before the 9th falling asserted the SCLx line. The SCLx output will remain edge of SCLx. low until the CKP bit is set and all other devices on the 2: The previous versions of the module did I2C bus have released SCLx. This ensures that a write not stretch the clock for a transmission if to the CKP bit will not violate the minimum high time SSPxBUF was loaded before the 9th fall- requirement for SCLx (see Figure24-23). ing edge of SCLx. It is now always cleared for read requests. FIGURE 24-23: CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDAx DX DX ‚ – 1 SCLx Master device CKP asserts clock Master device releases clock WR SSPxCON1 DS40001414E-page 262  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.5.8 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave The addressing procedure for the I2C bus is such that will prepare to receive the second byte as data, just as the first byte after the Start condition usually deter- it would in 7-bit mode. mines which device will be the slave addressed by the If the AHEN bit of the SSPxCON3 register is set, just master device. The exception is the general call as with any other address reception, the slave hard- address which can address all devices. When this ware will stretch the clock after the eighth falling edge address is used, all devices should, in theory, respond of SCLx. The slave must then set its ACKDT value and with an acknowledge. release the clock with communication, progressing as The general call address is a reserved address in the it would normally. I2C protocol, defined as address 0x00. When the GCEN bit of the SSPxCON2 register is set, the slave module will automatically ACK the reception of this address, regardless of the value stored in SSPxADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPxBUF and respond. Figure24-23 shows a general call reception sequence. FIGURE 24-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt R/W = 0 Receiving Data ACK SDAx General Call Address ACK D7 D6 D5 D4 D3 D2 D1 D0 SCLx 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 S SSPxIF BF (SSPxSTAT<0>) Cleared by software SSPxBUF is read GCEN (SSPxCON2<7>) ’1’ 24.5.9 SSPx MASK REGISTER An SSPx Mask (SSPxMSK) register (Register24-5) is available in I2C Slave mode as a mask for the value held in the SSPxSR register during an address comparison operation. A zero (‘0’) bit in the SSPxMSK register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSPx operation until written with a mask value. The SSPx Mask register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0>, only. The SSPx mask has no effect during the reception of the first (high) byte of the address.  2010-2016 Microchip Technology Inc. DS40001414E-page 263

PIC16(L)F1946/47 24.6 I2C MASTER MODE 24.6.1 I2C MASTER MODE OPERATION Master mode is enabled by setting and clearing the The master device generates all of the serial clock appropriate SSPM bits in the SSPxCON1 register and pulses and the Start and Stop conditions. A transfer is by setting the SSPEN bit. In Master mode, the SDAx ended with a Stop condition or with a Repeated Start and SCKx pins must be configured as inputs. The condition. Since the Repeated Start condition is also MSSP peripheral hardware will override the output the beginning of the next serial transfer, the I2C bus will driver TRIS controls when necessary to drive the pins not be released. low. In Master Transmitter mode, serial data is output Master mode of operation is supported by interrupt through SDAx, while SCLx outputs the serial clock. The generation on the detection of the Start and Stop first byte transmitted contains the slave address of the conditions. The Stop (P) and Start (S) bits are cleared receiving device (seven bits) and the Read/Write (R/W) from a Reset or when the MSSPx module is disabled. bit. In this case, the R/W bit will be logic ‘0’. Serial data Control of the I2C bus may be taken when the P bit is is transmitted eight bits at a time. After each byte is set, or the bus is Idle. transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning In Firmware Controlled Master mode, user code and the end of a serial transfer. conducts all I2C bus operations based on Start and Stop bit condition detection. Start and Stop condition In Master Receive mode, the first byte transmitted detection is the only active circuitry in this mode. All contains the slave address of the transmitting device other communication is done by the user software (sevenbits) and the R/W bit. In this case, the R/W bit directly manipulating the SDAx and SCLx lines. will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive The following events will cause the SSPx Interrupt Flag bit. Serial data is received via SDAx, while SCLx bit, SSPxIF, to be set (SSPx interrupt, if enabled): outputs the serial clock. Serial data is received eight • Start condition detected bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop • Stop condition detected conditions indicate the beginning and end of • Data transfer byte transmitted/received transmission. • Acknowledge transmitted/received A Baud Rate Generator is used to set the clock • Repeated Start generated frequency output on SCLx. See Section24.7 “Baud Rate Generator” for more details. Note 1: The MSSPx module, when configured in I2C Master mode, does not allow queuing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPxBUF register to initiate transmission before the Start condition is complete. In this case, the SSPxBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPxBUF did not occur. 2: Master mode suspends Start/Stop detection when sending the Start/Stop condition by means of the SEN/PEN control bits. The SSPxIF bit is set at the end of the Start/Stop generation when hardware clears the control bit. DS40001414E-page 264  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.6.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCLx pin (SCLx allowed to float high). When the SCLx pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCLx pin is actually sampled high. When the SCLx pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPxADD<7:0> and begins counting. This ensures that the SCLx high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure24-25). FIGURE 24-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDAx DX DX ‚ – 1 SCLx deasserted but slave holds SCLx allowed to transition high SCLx low (clock arbitration) SCLx BRG decrements on Q2 and Q4 cycles BRG 03h 02h 01h 00h (hold off) 03h 02h Value SCLx is sampled high, reload takes place and BRG starts its count BRG Reload 24.6.3 WCOL STATUS FLAG If the user writes the SSPxBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set, it indicates that an action on SSPxBUF was attempted while the module was not Idle. Note: Because queuing of events is not allowed, writing to the lower five bits of SSPxCON2 is disabled until the Start condition is complete.  2010-2016 Microchip Technology Inc. DS40001414E-page 265

PIC16(L)F1946/47 24.6.4 I2C MASTER MODE START by hardware; the Baud Rate Generator is suspended, CONDITION TIMING leaving the SDAx line held low and the Start condition is complete. To initiate a Start condition, the user sets the Start Enable bit, SEN bit of the SSPxCON2 register. If the Note 1: If, at the beginning of the Start condition, SDAx and SCLx pins are sampled high, the Baud Rate the SDAx and SCLx pins are already sam- Generator is reloaded with the contents of pled low, or if during the Start condition, SSPxADD<7:0> and starts its count. If SCLx and the SCLx line is sampled low before the SDAx are both sampled high when the Baud Rate SDAx line is driven low, a bus collision Generator times out (TBRG), the SDAx pin is driven occurs. The Bus Collision Interrupt Flag, low. The action of the SDAx being driven low while BCLxIF, is set, the Start condition is SCLx is high is the Start condition and causes the S bit aborted and the I2C module is reset into of the SSPxSTAT1 register to be set. Following this, its Idle state. the Baud Rate Generator is reloaded with the contents 2: The Philips I2C Specification states that a of SSPxADD<7:0> and resumes its count. When the bus collision cannot occur on a Start. Baud Rate Generator times out (TBRG), the SEN bit of the SSPxCON2 register will be automatically cleared FIGURE 24-26: FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPxSTAT<3>) At completion of Start bit, SDAx = 1, hardware clears SEN bit SCLx = 1 and sets SSPxIF bit TBRG TBRG Write to SSPxBUF occurs here SDAx 1st bit 2nd bit TBRG SCLx S TBRG DS40001414E-page 266  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.6.5 I2C MASTER MODE REPEATED SSPxCON2 register will be automatically cleared and START CONDITION TIMING the Baud Rate Generator will not be reloaded, leaving the SDAx pin held low. As soon as a Start condition is A Repeated Start condition occurs when the RSEN bit detected on the SDAx and SCLx pins, the S bit of the of the SSPxCON2 register is programmed high and the SSPxSTAT register will be set. The SSPxIF bit will not Master state machine is no longer active. When the be set until the Baud Rate Generator has timed out. RSEN bit is set, the SCLx pin is asserted low. When the SCLx pin is sampled low, the Baud Rate Generator is Note1: If RSEN is programmed while any other event is in progress, it will not take effect. loaded and begins counting. The SDAx pin is released (brought high) for one Baud Rate Generator count 2: A bus collision during the Repeated Start (TBRG). When the Baud Rate Generator times out, if condition occurs if: SDAx is sampled high, the SCLx pin will be deasserted • SDAx is sampled low when SCLx (brought high). When SCLx is sampled high, the Baud goes from low-to-high. Rate Generator is reloaded and begins counting. SDAx • SCLx goes low before SDAx is and SCLx must be sampled high for one TBRG. This asserted low. This may indicate action is then followed by assertion of the SDAx pin that another master is attempting to (SDAx=0) for one TBRG while SCLx is high. SCLx is transmit a data ‘1’. asserted low. Following this, the RSEN bit of the FIGURE 24-27: REPEAT START CONDITION WAVEFORM S bit set by hardware Write to SSPxCON2 occurs here At completion of Start bit, SDAx = 1, SDAx = 1, hardware clears RSEN bit SCLx (no change) SCLx = 1 and sets SSPxIF TBRG TBRG TBRG SDAx 1st bit Write to SSPxBUF occurs here TBRG SCLx Sr TBRG Repeated Start  2010-2016 Microchip Technology Inc. DS40001414E-page 267

PIC16(L)F1946/47 24.6.6 I2C MASTER MODE TRANSMISSION 24.6.6.3 ACKSTAT Status Flag Transmission of a data byte, a 7-bit address or the In Transmit mode, the ACKSTAT bit of the SSPxCON2 other half of a 10-bit address is accomplished by simply register is cleared when the slave has sent an Acknowl- writing a value to the SSPxBUF register. This action will edge (ACK=0) and is set when the slave does not set the Buffer Full flag bit, BF, and allow the Baud Rate Acknowledge (ACK=1). A slave sends an Acknowl- edge when it has recognized its address (including a Generator to begin counting and start the next trans- general call), or when the slave has properly received mission. Each bit of address/data will be shifted out onto the SDAx pin after the falling edge of SCLx is its data. asserted. SCLx is held low for one Baud Rate Genera- 24.6.6.4 Typical transmit sequence: tor rollover count (TBRG). Data should be valid before SCLx is released high. When the SCLx pin is released 1. The user generates a Start condition by setting high, it is held that way for TBRG. The data on the SDAx the SEN bit of the SSPxCON2 register. pin must remain stable for that duration and some hold 2. SSPxIF is set by hardware on completion of the time after the next falling edge of SCLx. After the eighth Start. bit is shifted out (the falling edge of the eighth clock), 3. SSPxIF is cleared by software. the BF flag is cleared and the master releases SDAx. 4. The MSSPx module will wait the required start This allows the slave device being addressed to time before any other operation takes place. respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received prop- 5. The user loads the SSPxBUF with the slave erly. The status of ACK is written into the ACKSTAT bit address to transmit. on the rising edge of the ninth clock. If the master 6. Address is shifted out the SDAx pin until all eight receives an Acknowledge, the Acknowledge Status bit, bits are transmitted. Transmission begins as ACKSTAT, is cleared. If not, the bit is set. After the ninth soon as SSPxBUF is written to. clock, the SSPxIF bit is set and the master clock (Baud 7. The MSSPx module shifts in the ACK bit from Rate Generator) is suspended until the next data byte the slave device and writes its value into the is loaded into the SSPxBUF, leaving SCLx low and ACKSTAT bit of the SSPxCON2 register. SDAx unchanged (Figure24-27). 8. The MSSPx module generates an interrupt at After the write to the SSPxBUF, each bit of the address the end of the ninth clock cycle by setting the will be shifted out on the falling edge of SCLx until all SSPxIF bit. seven address bits and the R/W bit are completed. On 9. The user loads the SSPxBUF with eight bits of the falling edge of the eighth clock, the master will data. release the SDAx pin, allowing the slave to respond 10. Data is shifted out the SDAx pin until all eight with an Acknowledge. On the falling edge of the ninth bits are transmitted. clock, the master will sample the SDAx pin to see if the 11. The MSSPx module shifts in the ACK bit from address was recognized by a slave. The status of the the slave device and writes its value into the ACK bit is loaded into the ACKSTAT Status bit of the ACKSTAT bit of the SSPxCON2 register. SSPxCON2 register. Following the falling edge of the ninth clock transmission of the address, the SSPxIF is 12. Steps 8-11 are repeated for all transmitted data set, the BF flag is cleared and the Baud Rate Generator bytes. is turned off until another write to the SSPxBUF takes 13. The user generates a Stop or Restart condition place, holding SCLx low and allowing SDAx to float. by setting the PEN or RSEN bits of the SSPxCON2 register. Interrupt is generated once 24.6.6.1 BF Status Flag the Stop/Restart condition is complete. In Transmit mode, the BF bit of the SSPxSTAT register is set when the CPU writes to SSPxBUF and is cleared when all eight bits are shifted out. 24.6.6.2 WCOL Status Flag If the user writes the SSPxBUF when a transmit is already in progress (i.e., SSPxSR is still shifting out a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. DS40001414E-page 268  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-28: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) 1 e ACKSTAT in SSPxCON2 = P ared by softwar K e C 9 Cl A > 6 2< D0 8 e N n slave, clear ACKSTAT bit SSPxCO Transmitting Data or Second Halfof 10-bit Address D6D5D4D3D2D1 234567 Cleared by software service routifrom SSPx interrupt SSPxBUF is written by software om D7 1 xIF Fr ow SP = 0 SCLx held lwhile CPUsponds to S CK re = 0 A W 9 are R/W A1 ess and R/ 78 d by hardw ave A2 addr 6 eare PxCON2<0> SEN = 1dition begins SEN = 0 Transmit Address to Sl A7A6A5A4A3 SSPxBUF written with 7-bit start transmit 12345 Cleared by software SSPxBUF written After Start condition, SEN cl Sn Write SStart co S T<0>) A T S x F SP SDAx SCLx SSPxI BF (S SEN PEN R/W  2010-2016 Microchip Technology Inc. DS40001414E-page 269

PIC16(L)F1946/47 24.6.7 I2C MASTER MODE RECEPTION 24.6.7.4 Typical Receive Sequence Master mode reception is enabled by programming the 1. The user generates a Start condition by setting Receive Enable bit, RCEN bit of the SSPxCON2 the SEN bit of the SSPxCON2 register. register. 2. SSPxIF is set by hardware on completion of the Note: The MSSPx module must be in an Idle Start. state before the RCEN bit is set or the 3. SSPxIF is cleared by software. RCEN bit will be disregarded. 4. User writes SSPxBUF with the slave address to The Baud Rate Generator begins counting and on each transmit and the R/W bit set. rollover, the state of the SCLx pin changes 5. Address is shifted out the SDAx pin until all eight (high-to-low/low-to-high) and data is shifted into the bits are transmitted. Transmission begins as SSPxSR. After the falling edge of the eighth clock, the soon as SSPxBUF is written to. receive enable flag is automatically cleared, the con- 6. The MSSPx module shifts in the ACK bit from tents of the SSPxSR are loaded into the SSPxBUF, the the slave device and writes its value into the BF flag bit is set, the SSPxIF flag bit is set and the Baud ACKSTAT bit of the SSPxCON2 register. Rate Generator is suspended from counting, holding 7. The MSSPx module generates an interrupt at SCLx low. The MSSPx is now in Idle state awaiting the the end of the ninth clock cycle by setting the next command. When the buffer is read by the CPU, SSPxIF bit. the BF flag bit is automatically cleared. The user can 8. User sets the RCEN bit of the SSPxCON2 then send an Acknowledge bit at the end of reception register and the Master clocks in a byte from the by setting the Acknowledge Sequence Enable, ACKEN slave. bit of the SSPxCON2 register. 9. After the eighth falling edge of SCLx, SSPxIF 24.6.7.1 BF Status Flag and BF are set. 10. Master clears SSPxIF and reads the received In receive operation, the BF bit is set when an address byte from SSPxUF, clears BF. or data byte is loaded into SSPxBUF from SSPxSR. It is cleared when the SSPxBUF register is read. 11. Master sets ACK value sent to slave in ACKDT bit of the SSPxCON2 register and initiates the 24.6.7.2 SSPOV Status Flag ACK by setting the ACKEN bit. In receive operation, the SSPOV bit is set when eight 12. Masters ACK is clocked out to the Slave and bits are received into the SSPxSR and the BF flag bit is SSPxIF is set. already set from a previous reception. 13. User clears SSPxIF. 14. Steps 8-13 are repeated for each received byte 24.6.7.3 WCOL Status Flag from the slave. If the user writes the SSPxBUF when a receive is 15. Master sends a not ACK or Stop to end already in progress (i.e., SSPxSR is still shifting in a communication. data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). DS40001414E-page 270  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-29: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) pt Write to SSPxCON2<4>to start Acknowledge sequenceSDAx = ACKDT (SSPxCON2<5>) = 0 Set ACKEN, start Acknowledge sequenceACK from MasterMaster configured as a receiverSDAx = ACKDT = SDAx = ACKDT = 10by programming SSPxCON2<3> (RCEN = )1PEN bit = 1RCEN = , startRCEN cleared1RCEN clearedwritten hereom Slavenext receiveautomaticallyautomatically Receiving Data from SlaveReceiving Data from SlaveACKD0D2D5D2D5D3D4D6D7D3D4D6D7D1D1ACKD0WACK Bus masterACK is not sentterminatestransfer9967895876512343124PSet SSPxIF at endData shifted in on falling edge of CLKof receiveSet SSPxIF interruat end of Acknow-Set SSPxIF interruptSet SSPxIF interruptledge sequenceat end of receiveat end of Acknowledgesequence Set P bit Cleared by softwareCleared by softwareCleared by software(SSPxSTAT<4>)Cleared insoftwareand SSPxIF Last bit is shifted into SSPxSR andcontents are unloaded into SSPxBUF SSPOV is set becauseSSPxBUF is still full Master configured as a receiverRCEN clearedACK from MasterRCEN clearedSDAx = ACKDT = automatically0by programming SSPxCON2<3> (RCEN = )automatically1 K fr R/ 8 AC A1 7 e, Write to SSPxCON2<0>(SEN = ),1begin Start condition SEN = 0Write to SSPxBUF occurs herstart XMIT Transmit Address to Slave A7A6A5A4A3A2SDAx 631245SCLxS SSPxIF Cleared by softwareSDAx = , SCLx = 01while CPU responds to SSPxIF BF (SSPxSTAT<0>) SSPOV ACKEN RCEN  2010-2016 Microchip Technology Inc. DS40001414E-page 271

PIC16(L)F1946/47 24.6.8 ACKNOWLEDGE SEQUENCE 24.6.9 STOP CONDITION TIMING TIMING A Stop bit is asserted on the SDAx pin at the end of a An Acknowledge sequence is enabled by setting the receive/transmit by setting the Stop Sequence Enable Acknowledge Sequence Enable bit, ACKEN bit of the bit, PEN bit of the SSPxCON2 register. At the end of a SSPxCON2 register. When this bit is set, the SCLx pin is receive/transmit, the SCLx line is held low after the pulled low and the contents of the Acknowledge data bit falling edge of the ninth clock. When the PEN bit is set, are presented on the SDAx pin. If the user wishes to the master will assert the SDAx line low. When the generate an Acknowledge, then the ACKDT bit should SDAx line is sampled low, the Baud Rate Generator is be cleared. If not, the user should set the ACKDT bit reloaded and counts down to ‘0’. When the Baud Rate before starting an Acknowledge sequence. The Baud Generator times out, the SCLx pin will be brought high Rate Generator then counts for one rollover period and one TBRG (Baud Rate Generator rollover count) (TBRG) and the SCLx pin is deasserted (pulled high). later, the SDAx pin will be deasserted. When the SDAx When the SCLx pin is sampled high (clock arbitration), pin is sampled high while SCLx is high, the P bit of the the Baud Rate Generator counts for TBRG. The SCLx pin SSPxSTAT register is set. A TBRG later, the PEN bit is is then pulled low. Following this, the ACKEN bit is auto- cleared and the SSPxIF bit is set (Figure24-30). matically cleared, the Baud Rate Generator is turned off 24.6.9.1 WCOL Status Flag and the MSSPx module then goes into Idle mode (Figure24-29). If the user writes the SSPxBUF when a Stop sequence is in progress, then the WCOL bit is set and the 24.6.8.1 WCOL Status Flag contents of the buffer are unchanged (the write does If the user writes the SSPxBUF when an Acknowledge not occur). sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 24-30: ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, ACKEN automatically cleared write to SSPxCON2 ACKEN = 1, ACKDT = 0 TBRG TBRG SDAx D0 ACK SCLx 8 9 SSPxIF Cleared in SSPxIF set at Cleared in software the end of receive software SSPxIF set at the end of Acknowledge sequence Note: TBRG = one Baud Rate Generator period. DS40001414E-page 272  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 24-31: STOP CONDITION RECEIVE OR TRANSMIT MODE Write to SSPxCON2, SCLx = 1 for TBRG, followed by SDAx = 1 for TBRG set PEN after SDAx sampled high. P bit (SSPxSTAT<4>) is set. Falling edge of PEN bit (SSPxCON2<2>) is cleared by 9th clock hardware and the SSPxIF bit is set TBRG SCLx SDAx ACK P TBRG TBRG TBRG SCLx brought high after TBRG SDAx asserted low before rising edge of clock to setup Stop condition Note: TBRG = One Baud Rate Generator period. 24.6.10 SLEEP OPERATION 24.6.13 MULTI -MASTER COMMUNICATION, While in Sleep mode, the I2C Slave module can receive BUS COLLISION AND BUS ARBITRATION addresses or data and when an address match or complete byte transfer occurs, or wake the processor Multi-Master mode support is achieved by bus from Sleep (if the MSSPx interrupt is enabled). arbitration. When the master outputs address/data bits onto the SDAx pin, arbitration takes place when the 24.6.11 EFFECTS OF A RESET master outputs a ‘1’ on SDAx, by letting SDAx float high A Reset disables the MSSPx module and terminates and another master asserts a ‘0’. When the SCLx pin the current transfer. floats high, data should be stable. If the expected data on SDAx is a ‘1’ and the data sampled on the SDAx pin 24.6.12 MULTI-MASTER MODE is ‘0’, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLxIF, and In Multi-Master mode, the interrupt generation on the reset the I2C port to its Idle state (Figure24-31). detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and If a transmit was in progress when the bus collision Start (S) bits are cleared from a Reset or when the occurred, the transmission is halted, the BF flag is MSSPx module is disabled. Control of the I2C bus may cleared, the SDAx and SCLx lines are deasserted and be taken when the P bit of the SSPxSTAT register is the SSPxBUF can be written to. When the user set, or the bus is Idle, with both the S and P bits clear. services the bus collision Interrupt Service Routine and When the bus is busy, enabling the SSPx interrupt will if the I2C bus is free, the user can resume generate the interrupt when the Stop condition occurs. communication by asserting a Start condition. In multi-master operation, the SDAx line must be If a Start, Repeated Start, Stop or Acknowledge monitored for arbitration to see if the signal level is the condition was in progress when the bus collision expected output level. This check is performed by occurred, the condition is aborted, the SDAx and SCLx hardware with the result placed in the BCLxIF bit. lines are deasserted and the respective control bits in the SSPxCON2 register are cleared. When the user The states where arbitration can be lost are: services the bus collision Interrupt Service Routine and • Address Transfer if the I2C bus is free, the user can resume • Data Transfer communication by asserting a Start condition. • A Start Condition The master will continue to monitor the SDAx and SCLx • A Repeated Start Condition pins. If a Stop condition occurs, the SSPxIF bit will be set. • An Acknowledge Condition A write to the SSPxBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the deter- mination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPxSTAT register, or the bus is Idle and the S and P bits are cleared.  2010-2016 Microchip Technology Inc. DS40001414E-page 273

PIC16(L)F1946/47 FIGURE 24-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Sample SDAx. While SCLx is high, Data changes SDAx line pulled low data does not match what is driven while SCLx = 0 by another source by the master. Bus collision has occurred. SDAx released by master SDAx SCLx Set bus collision interrupt (BCLxIF) BCLxIF DS40001414E-page 274  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.6.13.1 Bus Collision During a Start If the SDAx pin is sampled low during this count, the Condition BRG is reset and the SDAx line is asserted early (Figure24-34). If, however, a ‘1’ is sampled on the During a Start condition, a bus collision occurs if: SDAx pin, the SDAx pin is asserted low at the end of a) SDAx or SCLx are sampled low at the beginning the BRG count. The Baud Rate Generator is then of the Start condition (Figure24-32). reloaded and counts down to zero; if the SCLx pin is b) SCLx is sampled low before SDAx is asserted sampled as ‘0’ during this time, a bus collision does not low (Figure24-33). occur. At the end of the BRG count, the SCLx pin is asserted low. During a Start condition, both the SDAx and the SCLx pins are monitored. Note: The reason that bus collision is not a factor during a Start condition is that no If the SDAx pin is already low, or the SCLx pin is already low, then all of the following occur: two bus masters can assert a Start condition at the exact same time. • the Start condition is aborted Therefore, one master will always assert • the BCLxIF flag is set and SDAx before the other. This condition • the MSSPx module is reset to its Idle state does not cause a bus collision because (Figure24-32). the two masters must be allowed to The Start condition begins with the SDAx and SCLx arbitrate the first address following the pins deasserted. When the SDAx pin is sampled high, Start condition. If the address is the same, the Baud Rate Generator is loaded and counts down. If arbitration must be allowed to continue the SCLx pin is sampled low while SDAx is high, a bus into the data portion, Repeated Start or collision occurs because it is assumed that another Stop conditions. master is attempting to drive a data ‘1’ during the Start condition. FIGURE 24-33: BUS COLLISION DURING START CONDITION (SDAx ONLY) SDAx goes low before the SEN bit is set. Set BCLxIF, S bit and SSPxIF set because SDAx = 0, SCLx = 1. SDAx SCLx Set SEN, enable Start SEN cleared automatically because of bus collision. condition if SDAx = 1, SCLx = 1 SSPx module reset into Idle state. SEN SDAx sampled low before Start condition. Set BCLxIF. S bit and SSPxIF set because BCLxIF SDAx = 0, SCLx = 1. SSPxIF and BCLxIF are cleared by software S SSPxIF SSPxIF and BCLxIF are cleared by software  2010-2016 Microchip Technology Inc. DS40001414E-page 275

PIC16(L)F1946/47 FIGURE 24-34: BUS COLLISION DURING START CONDITION (SCLx=0) SDAx = 0, SCLx = 1 TBRG TBRG SDAx Set SEN, enable Start SCLx sequence if SDAx = 1, SCLx = 1 SCLx = 0 before SDAx = 0, bus collision occurs. Set BCLxIF. SEN SCLx = 0 before BRG time-out, bus collision occurs. Set BCLxIF. BCLxIF Interrupt cleared by software S ’0’ ’0’ SSPxIF ’0’ ’0’ FIGURE 24-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDAx = 0, SCLx = 1 Set S Set SSPxIF Less than TBRG TBRG SDAx SDAx pulled low by other master. Reset BRG and assert SDAx. SCLx S SCLx pulled low after BRG time-out SEN Set SEN, enable Start sequence if SDAx = 1, SCLx = 1 BCLxIF ’0’ S SSPxIF SDAx = 0, SCLx = 1, Interrupts cleared set SSPxIF by software DS40001414E-page 276  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.6.13.2 Bus Collision During a Repeated If SDAx is low, a bus collision has occurred (i.e., another Start Condition master is attempting to transmit a data ‘0’, Figure24-35). If SDAx is sampled high, the BRG is reloaded and During a Repeated Start condition, a bus collision begins counting. If SDAx goes from high-to-low before occurs if: the BRG times out, no bus collision occurs because no a) A low level is sampled on SDAx when SCLx two masters can assert SDAx at exactly the same time. goes from low level to high level. If SCLx goes from high-to-low before the BRG times b) SCLx goes low before SDAx is asserted low, out and SDAx has not already been asserted, a bus indicating that another master is attempting to collision occurs. In this case, another master is transmit a data ‘1’. attempting to transmit a data ‘1’ during the Repeated When the user releases SDAx and the pin is allowed to Start condition, see Figure24-36. float high, the BRG is loaded with SSPxADD and If, at the end of the BRG timeout, both SCLx and SDAx counts down to zero. The SCLx pin is then deasserted are still high, the SDAx pin is driven low and the BRG and when sampled high, the SDAx pin is sampled. is reloaded and begins counting. At the end of the count, regardless of the status of the SCLx pin, the SCLx pin is driven low and the Repeated Start condition is complete. FIGURE 24-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDAx SCLx Sample SDAx when SCLx goes high. If SDAx = 0, set BCLxIF and release SDAx and SCLx. RSEN BCLxIF Cleared by software S ’0’ SSPxIF ’0’ FIGURE 24-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) TBRG TBRG SDAx SCLx SCLx goes low before SDAx, BCLxIF set BCLxIF. Release SDAx and SCLx. Interrupt cleared by software RSEN ’0’ S SSPxIF  2010-2016 Microchip Technology Inc. DS40001414E-page 277

PIC16(L)F1946/47 24.6.13.3 Bus Collision During a Stop The Stop condition begins with SDAx asserted low. Condition When SDAx is sampled low, the SCLx pin is allowed to float. When the pin is sampled high (clock arbitration), Bus collision occurs during a Stop condition if: the Baud Rate Generator is loaded with SSPxADD and a) After the SDAx pin has been deasserted and counts down to zero. After the BRG times out, SDAx is allowed to float high, SDAx is sampled low after sampled. If SDAx is sampled low, a bus collision has the BRG has timed out. occurred. This is due to another master attempting to b) After the SCLx pin is deasserted, SCLx is drive a data ‘0’ (Figure24-37). If the SCLx pin is sampled low before SDAx goes high. sampled low before SDAx is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure24-38). FIGURE 24-38: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG TBRG SDAx sampled low after TBRG, set BCLxIF SDAx SDAx asserted low SCLx PEN BCLxIF P ’0’ SSPxIF ’0’ FIGURE 24-39: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG TBRG TBRG SDAx SCLx goes low before SDAx goes high, Assert SDAx set BCLxIF SCLx PEN BCLxIF P ’0’ SSPxIF ’0’ DS40001414E-page 278  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 24-3: SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION Reset Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Values on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 91 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE(1) 92 PIE4(1) — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 95 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF(1) 96 PIR4(1) — — RC2IF TX2IF — — BCL2IF SSP2IF 98 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 134 SSP1ADD ADD<7:0> 286 SSP1BUF MSSPx Receive Buffer/Transmit Register 236* SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 282 SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 284 SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 285 SSP1MSK MSK<7:0> 286 SSP1STAT SMP CKE D/A P S R/W UA BF 281 SSP2ADD ADD<7:0> 286 SSP2BUF MSSP2 Receive Buffer/Transmit Register 236* SSP2CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 282 SSP2CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 284 SSP2CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 285 SSP2MSK MSK<7:0> 286 SSP2STAT SMP CKE D/A P S R/W UA BF 281 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C mode. * Page provides register information. Note 1: PIC16F1947 only.  2010-2016 Microchip Technology Inc. DS40001414E-page 279

PIC16(L)F1946/47 24.7 BAUD RATE GENERATOR module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSPx is The MSSPx module has a Baud Rate Generator being operated in. available for clock generation in both I2C and SPI Table24-4 demonstrates clock rates based on Master modes. The Baud Rate Generator (BRG) instruction cycles and the BRG value loaded into reload value is placed in the SSPxADD register SSPxADD. (Register24-6). When a write occurs to SSPxBUF, the Baud Rate Generator will automatically begin counting EQUATION 24-1: MSSP CLOCK down. FREQUENCY Once the given operation is complete, the internal clock CALCULATION will automatically stop counting and the clock pin will remain in its last state. FOSC FCLOCK = ------------------------------------------------- An internal signal “Reload” in Figure24-39 triggers the SSPxADD+14 value from SSPxADD to be loaded into the BRG counter. This occurs twice for each oscillation of the FIGURE 24-40: BAUD RATE GENERATOR BLOCK DIAGRAM SSPM<3:0> SSPxADD<7:0> SSPM<3:0> Reload Reload SCLx Control SSPxCLK BRG Down Counter FOSC/2 Note: Values of 0x00, 0x01 and 0x02 are not valid for SSPxADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 24-4: MSSPx CLOCK RATE W/BRG FCLOCK FOSC FCY BRG Value (2 Rollovers of BRG) 32 MHz 8 MHz 13h 400 kHz(1) 32 MHz 8 MHz 19h 308 kHz 32 MHz 8 MHz 4Fh 100 kHz 16 MHz 4 MHz 09h 400 kHz(1) 16 MHz 4 MHz 0Ch 308 kHz 16 MHz 4 MHz 27h 100 kHz 4 MHz 1 MHz 09h 100 kHz Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100kHz) in all details, but may be used with care where higher rates are required by the application. DS40001414E-page 280  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 24.8 Register Definitions: MSSP Control REGISTER 24-1: SSPxSTAT: SSPx STATUS REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SMP: SPI Data Input Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode In I 2 C Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high speed mode (400 kHz) bit 6 CKE: SPI Clock Edge Select bit (SPI mode only) In SPI Master or Slave mode: 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state In I 2 C mode only: 1 = Enable input logic so that thresholds are compliant with SMBus specification 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit (I2C mode only) 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (I2C mode only. This bit is cleared when the MSSPx module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (I2C mode only. This bit is cleared when the MSSPx module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information (I2C mode only) This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I 2 C Slave mode: 1 = Read 0 = Write In I 2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSPx is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPxADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit Receive (SPI and I 2 C modes): 1 = Receive complete, SSPxBUF is full 0 = Receive not complete, SSPxBUF is empty Transmit (I 2 C mode only): 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPxBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPxBUF is empty  2010-2016 Microchip Technology Inc. DS40001414E-page 281

PIC16(L)F1946/47 REGISTER 24-2: SSPxCON1: SSPx CONTROL REGISTER 1 R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 WCOL SSPOV SSPEN CKP SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPxBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPxBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) In SPI mode: 1 = A new byte is received while the SSPxBUF register is still holding the previous data. In case of overflow, the data in SSPxSR is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPxBUF, even if only transmitting data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new recep- tion (and transmission) is initiated by writing to the SSPxBUF register (must be cleared in software). 0 = No overflow In I 2 C mode: 1 = A byte is received while the SSPxBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output In SPI mode: 1 = Enables serial port and configures SCKx, SDOx, SDIx and SSx as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins In I 2 C mode: 1 = Enables the serial port and configures the SDAx and SCLx pins as the source of the serial port pins(3) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In SPI mode: 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level In I 2 C Slave mode: SCLx release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I 2 C Master mode: Unused in this mode DS40001414E-page 282  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 24-2: SSPxCON1: SSPx CONTROL REGISTER 1 (CONTINUED) bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = SPI Master mode, clock = FOSC/4 0001 = SPI Master mode, clock = FOSC/16 0010 = SPI Master mode, clock = FOSC/64 0011 = SPI Master mode, clock = TMR2 output/2 0100 = SPI Slave mode, clock = SCKx pin, SSx pin control enabled 0101 = SPI Slave mode, clock = SCKx pin, SSx pin control disabled, SSx can be used as I/O pin 0110 = I2C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2C Master mode, clock = FOSC / (4 * (SSPxADD+1))(4) 1001 = Reserved 1010 = SPI Master mode, clock = FOSC/(4 * (SSPxADD+1))(5) 1011 = I2C firmware controlled Master mode (Slave idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPxBUF register. 2: When enabled, these pins must be properly configured as input or output. 3: When enabled, the SDAx and SCLx pins must be configured as inputs. 4: SSPxADD values of 0, 1 or 2 are not supported for I2C Mode. Use SSPM = 0000 instead of SSPxADD = 0 to set the SPI Master mode clock to FOSC/4.  2010-2016 Microchip Technology Inc. DS40001414E-page 283

PIC16(L)F1946/47 REGISTER 24-3: SSPxCON2: SSPx CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPxSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)(1) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDAx and SCLx pins, and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only)(1) 1 = Enables Receive mode for I2C 0 = Receive idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only)(1) SCKx Release Control: 1 = Initiate Stop condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enable bit (in I2C Master mode only)(1) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable bit(1) In Master mode: 1 = Initiate Start condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in Idle mode, this bit may not be set (no spooling) and the SSPxBUF may not be written (or writes to the SSPxBUF are disabled). DS40001414E-page 284  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 24-4: SSPxCON3: SSPx CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ACKTIM: Acknowledge Time Status bit (I2C mode only)(3) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8TH falling edge of SCLx clock 0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCLx clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C Slave mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(2) bit 5 SCIE: Start Condition Interrupt Enable bit (I2C Slave mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(2) bit 4 BOEN: Buffer Overwrite Enable bit In SPI Slave mode:(1) 1 = SSPxBUF updates every time that a new data byte is shifted in ignoring the BF bit 0 = If new byte is received with BF bit of the SSPxSTAT register already set, SSPOV bit of the SSPxCON1 register is set, and the buffer is not updated In I2C Master mode and SPI Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPxBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPxBUF is only updated when SSPOV is clear bit 3 SDAHT: SDAx Hold Time Selection bit (I2C mode only) 1 = Minimum of 300ns hold time on SDAx after the falling edge of SCLx 0 = Minimum of 100ns hold time on SDAx after the falling edge of SCLx bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If on the rising edge of SCLx, SDAx is sampled low when the module is outputting a high state, the BCLxIF bit of the PIR2 register is set, and bus goes Idle 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCLx for a matching received address byte; CKP bit of the SSPxCON1 register will be cleared and the SCLx will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCLx for a received data byte; slave hardware clears the CKP bit of the SSPxCON1 register and SCLx is held low. 0 = Data holding is disabled Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPOV is still set when a new byte is received and BF=1, but hardware continues to write the most recent byte to SSPxBUF. 2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled. 3: The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.  2010-2016 Microchip Technology Inc. DS40001414E-page 285

PIC16(L)F1946/47 REGISTER 24-5: SSPxMSK: SSPx MASK REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPxADD<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPxADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 24-6: SSPxADD: MSSPx ADDRESS AND BAUD RATE REGISTER (I2C MODE) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCLx pin clock period = ((ADD<7:0> + 1) *4)/FOSC 10-Bit Slave mode – Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode – Least Significant Address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. DS40001414E-page 286  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.0 ENHANCED UNIVERSAL These devices typically do not have internal clocks for SYNCHRONOUS baud rate generation and require the external clock signal provided by a master synchronous device. ASYNCHRONOUS RECEIVER The EUSART module includes the following capabilities: TRANSMITTER (EUSART) • Full-duplex asynchronous transmit and receive • Two-character input buffer Note: The PIC16(L)F1946/47 devices have two • One-character output buffer EUSARTs. Therefore, all information in • Programmable 8-bit or 9-bit character length this section refers to both EUSART 1 and • Address detection in 9-bit mode EUSART 2. • Input buffer overrun error detection • Received character framing error detection The Enhanced Universal Synchronous Asynchronous • Half-duplex synchronous master Receiver Transmitter (EUSART) module is a serial I/O • Half-duplex synchronous slave communications peripheral. It contains all the clock • Programmable clock polarity in synchronous generators, shift registers and data buffers necessary modes to perform an input or output serial data transfer • Sleep operation independent of device program execution. The EUSART, also known as a Serial Communications The EUSART module implements the following Interface (SCI), can be configured as a full-duplex additional features, making it ideally suited for use in asynchronous system or half-duplex synchronous Local Interconnect Network (LIN) bus systems: system. Full-Duplex mode is useful for • Automatic detection and calibration of the baud rate communications with peripheral systems, such as CRT • Wake-up on Break reception terminals and personal computers. Half-Duplex • 13-bit Break character transmit Synchronous mode is intended for communications with peripheral devices, such as A/D or D/A integrated The block diagrams of the EUSART transmitter and circuits, serial EEPROMs or other microcontrollers. receiver are shown in Figure25-1 and Figure25-2. FIGURE 25-1: EUSART TRANSMIT BLOCK DIAGRAM Data Bus TXxIE Interrupt TXxREG Register TXxIF 8 MSb LSb TXx/CKx pin (8) • • • 0 Pin Buffer and Control Transmit Shift Register (TSR) TXEN TRMT Baud Rate Generator FOSC ÷ n TX9 BRG16 n + 1 Multiplier x4 x16 x64 TX9D SYNC 1 X 0 0 0 SPxBRGH SPxBRGL BRGH X 1 1 0 0 BRG16 X 1 0 1 0  2010-2016 Microchip Technology Inc. DS40001414E-page 287

PIC16(L)F1946/47 FIGURE 25-2: EUSART RECEIVE BLOCK DIAGRAM CREN OERR RCIDL RXx/DTx pin MSb RSR Register LSb Panind BCuoffnetrrol DRaectaovery Stop (8) 7 • • • 1 0 START Baud Rate Generator FOSC RX9 ÷ n BRG16 n + 1 Multiplier x4 x16 x64 SYNC 1 X 0 0 0 FIFO SPxBRGH SPxBRGL BRGH X 1 1 0 0 FERR RX9D RCxREG Register BRG16 X 1 0 1 0 8 Data Bus RCxIF Interrupt RCxIE The operation of the EUSART module is controlled through three registers: • Transmit Status and Control (TXxSTA) • Receive Status and Control (RCxSTA) • Baud Rate Control (BAUDxCON) These registers are detailed in Register25-1, Register25-2 and Register25-3, respectively. For all modes of the EUSART operation, the TRIS control bits corresponding to the RXx/DTx and TXx/CKx pins should be set to ‘1’. The EUSART control will automatically reconfigure the pin from input to output, as needed. When the receiver or transmitter section is not enabled, then the corresponding RXx/DTx or TXx/CKx pin may be used for general purpose input and output. DS40001414E-page 288  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.1 EUSART Asynchronous Mode 25.1.1.2 Transmitting Data The EUSART transmits and receives data using the A transmission is initiated by writing a character to the standard non-return-to-zero (NRZ) format. NRZ is TXxREG register. If this is the first character, or the implemented with two levels: a VOH Mark state which previous character has been completely flushed from represents a ‘1’ data bit, and a VOL Space state which the TSR, the data in the TXxREG is immediately represents a ‘0’ data bit. NRZ refers to the fact that transferred to the TSR register. If the TSR still contains consecutively transmitted data bits of the same value all or part of a previous character, the new character stay at the output level of that bit without returning to a data is held in the TXxREG until the Stop bit of the neutral level between each bit transmission. An NRZ previous character has been transmitted. The pending transmission port idles in the Mark state. Each character character in the TXxREG is then transferred to the TSR transmission consists of one Start bit followed by eight in one TCY immediately following the Stop bit transmission. The transmission of the Start bit, data bits or nine data bits and is always terminated by one or and Stop bit sequence commences immediately more Stop bits. The Start bit is always a space and the Stop bits are always marks. The most common data following the transfer of the data to the TSR from the format is eight bits. Each transmitted bit persists for a TXxREG. period of 1/(Baud Rate). An on-chip dedicated 25.1.1.3 Transmit Data Polarity 8-bit/16-bit Baud Rate Generator is used to derive standard baud rate frequencies from the system The polarity of the transmit data can be controlled with oscillator. See Table25-5 for examples of baud rate the SCKP bit of the BAUDxCON register. The default configurations. state of this bit is ‘0’ which selects high true transmit idle and data bits. Setting the SCKP bit to ‘1’ will invert The EUSART transmits and receives the LSb first. The the transmit data resulting in low true idle and data bits. EUSART’s transmitter and receiver are functionally The SCKP bit controls transmit data polarity only in independent, but share the same data format and baud Asynchronous mode. In Synchronous mode the SCKP rate. Parity is not supported by the hardware, but can bit has a different function. See Section25.5.1.2 be implemented in software and stored as the ninth “Clock Polarity”. data bit. 25.1.1.4 Transmit Interrupt Flag 25.1.1 EUSART ASYNCHRONOUS TRANSMITTER The TXxIF interrupt flag bit of the PIR1/PIR3 register is set whenever the EUSART transmitter is enabled and The EUSART transmitter block diagram is shown in no character is being held for transmission in the Figure25-1. The heart of the transmitter is the serial TXxREG. In other words, the TXxIF bit is only clear Transmit Shift Register (TSR), which is not directly when the TSR is busy with a character and a new accessible by software. The TSR obtains its data from character has been queued for transmission in the the transmit buffer, which is the TXxREG register. TXxREG. The TXxIF flag bit is not cleared immediately 25.1.1.1 Enabling the Transmitter upon writing TXxREG. TXxIF becomes valid in the second instruction cycle following the write execution. The EUSART transmitter is enabled for asynchronous Polling TXxIF immediately following the TXxREG write operations by configuring the following three control will return invalid results. The TXxIF bit is read-only, it bits: cannot be set or cleared by software. • TXEN = 1 The TXxIF interrupt can be enabled by setting the • SYNC = 0 TXxIE interrupt enable bit of the PIE1/PIE4 register. • SPEN = 1 However, the TXxIF flag bit will be set whenever the TXxREG is empty, regardless of the state of the TXxIE All other EUSART control bits are assumed to be in enable bit. their default state. To use interrupts when transmitting data, set the TXxIE Setting the TXEN bit of the TXxSTA register enables the bit only when there is more data to send. Clear the transmitter circuitry of the EUSART. Clearing the SYNC TXxIE interrupt enable bit upon writing the last bit of the TXxSTA register configures the EUSART for character of the transmission to the TXxREG. asynchronous operation. Setting the SPEN bit of the RCxSTA register enables the EUSART. The program- mer must set the corresponding TRIS bit to configure the TXx/CKx I/O pin as an output. If the TXx/CKx pin is shared with an analog peripheral, the analog I/O function must be disabled by clearing the corresponding ANSEL bit. Note: The TXxIF transmitter interrupt flag is set when the TXEN enable bit is set.  2010-2016 Microchip Technology Inc. DS40001414E-page 289

PIC16(L)F1946/47 25.1.1.5 TSR Status 25.1.1.7 Asynchronous Transmission Setup: The TRMT bit of the TXxSTA register indicates the 1. Initialize the SPxBRGH:SPxBRGL register pair status of the TSR register. This is a read-only bit. The and the BRGH and BRG16 bits to achieve the TRMT bit is set when the TSR register is empty and is desired baud rate (see Section25.4 “EUSART cleared when a character is transferred to the TSR Baud Rate Generator (BRG)”). register from the TXxREG. The TRMT bit remains clear 2. Set the RXx/DTx and TXx/CKx TRIS controls to until all bits have been shifted out of the TSR register. ‘1’. No interrupt logic is tied to this bit, so the user needs to 3. Enable the asynchronous serial port by clearing poll this bit to determine the TSR status. the SYNC bit and setting the SPEN bit. Note: The TSR register is not mapped in data 4. If 9-bit transmission is desired, set the TX9 memory, so it is not available to the user. control bit. A set ninth data bit will indicate that the eight Least Significant data bits are an 25.1.1.6 Transmitting 9-Bit Characters address when the receiver is set for address The EUSART supports 9-bit character transmissions. detection. When the TX9 bit of the TXxSTA register is set the 5. Set the SCKP control bit if inverted transmit data EUSART will shift nine bits out for each character trans- polarity is desired. mitted. The TX9D bit of the TXxSTA register is the 6. Enable the transmission by setting the TXEN ninth, and Most Significant, data bit. When transmitting control bit. This will cause the TXxIF interrupt bit 9-bit data, the TX9D data bit must be written before to be set. writing the eight Least Significant bits into the TXxREG. 7. If interrupts are desired, set the TXxIE interrupt All nine bits of data will be transferred to the TSR shift enable bit. An interrupt will occur immediately register immediately after the TXxREG is written. provided that the GIE and PEIE bits of the A special 9-bit Address mode is available for use with INTCON register are also set. multiple receivers. See Section25.1.2.7 “Address 8. If 9-bit transmission is selected, the ninth bit Detection” for more information on the Address mode. should be loaded into the TX9D data bit. 9. Load 8-bit data into the TXxREG register. This will start the transmission. FIGURE 25-3: ASYNCHRONOUS TRANSMISSION Write to TXxREG Word 1 BRG Output (Shift Clock) TXx/CKxpin Start bit bit 0 bit 1 bit 7/8 Stop bit Word 1 TXxIF bit (Transmit Buffer 1 TCY Reg. Empty Flag) Word 1 TRMT bit Transmit Shift Reg (Transmit Shift Reg. Empty Flag) DS40001414E-page 290  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 25-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK) Write to TXxREG Word 1 Word 2 BRG Output (Shift Clock) TXx/CKx pin Start bit bit 0 bit 1 bit 7/8 Stop bit Start bit bit 0 TXxIF bit 1 TCY Word 1 Word 2 (Interrupt Reg. Flag) 1 TCY TRMT bit Word 1 Word 2 Reg(T. rEamnspmtyi tF Slahgif)t Transmit Shift Reg Transmit Shift Reg Note: This timing diagram shows two consecutive transmissions. TABLE 25-1: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TX1REG EUSART1 Transmit Register 292* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2REG EUSART2 Transmit Register 292* TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for asynchronous transmission. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 291

PIC16(L)F1946/47 25.1.2 EUSART ASYNCHRONOUS 25.1.2.2 Receiving Data RECEIVER The receiver data recovery circuit initiates character The Asynchronous mode would typically be used in reception on the falling edge of the first bit. The first bit, RS-232 systems. The receiver block diagram is shown also known as the Start bit, is always a zero. The data in Figure25-2. The data is received on the RXx/DTx recovery circuit counts one-half bit time to the center of pin and drives the data recovery block. The data the Start bit and verifies that the bit is still a zero. If it is recovery block is actually a high-speed shifter not a zero then the data recovery circuit aborts operating at 16 times the baud rate, whereas the serial character reception, without generating an error, and Receive Shift Register (RSR) operates at the bit rate. resumes looking for the falling edge of the Start bit. If When all eight or nine bits of the character have been the Start bit zero verification succeeds then the data shifted in, they are immediately transferred to a two recovery circuit counts a full bit time to the center of the character First-In-First-Out (FIFO) memory. The FIFO next bit. The bit is then sampled by a majority detect buffering allows reception of two complete characters circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR. and the start of a third character before software must This repeats until all data bits have been sampled and start servicing the EUSART receiver. The FIFO and shifted into the RSR. One final bit time is measured and RSR registers are not directly accessible by software. the level sampled. This is the Stop bit, which is always Access to the received data is made via the RCxREG a ‘1’. If the data recovery circuit samples a ‘0’ in the register. Stop bit position then a framing error is set for this character, otherwise the framing error is cleared for this 25.1.2.1 Enabling the Receiver character. See Section25.1.2.4 “Receive Framing Error” for more information on framing errors. The EUSART receiver is enabled for asynchronous operation by configuring the following three control bits: Immediately after all data bits and the Stop bit have been received, the character in the RSR is transferred • CREN = 1 to the EUSART receive FIFO and the RCxIF interrupt • SYNC = 0 flag bit of the PIR1/PIR3 register is set. The top charac- • SPEN = 1 ter in the FIFO is transferred out of the FIFO by reading All other EUSART control bits are assumed to be in the RCxREG register. their default state. Note: If the receive FIFO is overrun, no additional Setting the CREN bit of the RCxSTA register enables characters will be received until the overrun the receiver circuitry of the EUSART. Clearing the SYNC condition is cleared. See Section25.1.2.5 bit of the TXxSTA register configures the EUSART for “Receive Overrun Error” for more asynchronous operation. Setting the SPEN bit of the information on overrun errors. RCxSTA register enables the EUSART. The programmer must set the corresponding TRIS bit to configure the RXx/DTx I/O pin as an input. Note1: If the RX/DT function is on an analog pin, the corresponding ANSEL bit must be cleared for the receiver to function. If the RXx/DTx pin is shared with an analog peripheral, the analog I/O function must be disabled by clearing the corresponding ANSEL bit. DS40001414E-page 292  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.1.2.3 Receive Interrupts 25.1.2.6 Receiving 9-bit Characters The RCxIF interrupt flag bit of the PIR1/PIR3 register is The EUSART supports 9-bit character reception. When set whenever the EUSART receiver is enabled and the RX9 bit of the RCxSTA register is set, the EUSART there is an unread character in the receive FIFO. The will shift nine bits into the RSR for each character RCxIF interrupt flag bit is read-only, it cannot be set or received. The RX9D bit of the RCxSTA register is the cleared by software. ninth and Most Significant data bit of the top unread character in the receive FIFO. When reading 9-bit data RCxIF interrupts are enabled by setting the following from the receive FIFO buffer, the RX9D data bit must bits: be read before reading the eight Least Significant bits • RCxIE interrupt enable bit of the PIE1/PIE4 from the RCxREG. register • PEIE peripheral interrupt enable bit of the INTCON 25.1.2.7 Address Detection register A special Address Detection mode is available for use • GIE global interrupt enable bit of the INTCON when multiple receivers share the same transmission register line, such as in RS-485 systems. Address detection is enabled by setting the ADDEN bit of the RCxSTA The RCxIF interrupt flag bit will be set when there is an register. unread character in the FIFO, regardless of the state of interrupt enable bits. Address detection requires 9-bit character reception. When address detection is enabled, only characters 25.1.2.4 Receive Framing Error with the ninth data bit set will be transferred to the Each character in the receive FIFO buffer has a receive FIFO buffer, thereby setting the RCxIF interrupt corresponding framing error Status bit. A framing error bit. All other characters will be ignored. indicates that a Stop bit was not seen at the expected Upon receiving an address character, user software time. The framing error status is accessed via the determines if the address matches its own. Upon FERR bit of the RCxSTA register. The FERR bit address match, user software must disable address represents the status of the top unread character in the detection by clearing the ADDEN bit before the next receive FIFO. Therefore, the FERR bit must be read Stop bit occurs. When user software detects the end of before reading the RCxREG. the message, determined by the message protocol The FERR bit is read-only and only applies to the top used, software places the receiver back into the unread character in the receive FIFO. A framing error Address Detection mode by setting the ADDEN bit. (FERR = 1) does not preclude reception of additional characters. It is not necessary to clear the FERR bit. Reading the next character from the FIFO buffer will advance the FIFO to the next character and the next corresponding framing error. The FERR bit can be forced clear by clearing the SPEN bit of the RCxSTA register which resets the EUSART. Clearing the CREN bit of the RCxSTA register does not affect the FERR bit. A framing error by itself does not generate an interrupt. Note: If all receive characters in the receive FIFO have framing errors, repeated reads of the RCxREG will not clear the FERR bit. 25.1.2.5 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated If a third character, in its entirety, is received before the FIFO is accessed. When this happens the OERR bit of the RCxSTA register is set. The characters already in the FIFO buffer can be read but no additional characters will be received until the error is cleared. The error must be cleared by either clearing the CREN bit of the RCxSTA register or by resetting the EUSART by clearing the SPEN bit of the RCxSTA register.  2010-2016 Microchip Technology Inc. DS40001414E-page 293

PIC16(L)F1946/47 25.1.2.8 Asynchronous Reception Set-up: 25.1.2.9 9-bit Address Detection Mode Set-up 1. Initialize the SPxBRGH:SPxBRGL register pair This mode would typically be used in RS-485 systems. and the BRGH and BRG16 bits to achieve the To set up an Asynchronous Reception with Address desired baud rate (see Section25.4 “EUSART Detect Enable: Baud Rate Generator (BRG)”). 1. Initialize the SPxBRGH, SPxBRGL register pair 2. Set the RXx/DTx and TXx/CKx TRIS controls to and the BRGH and BRG16 bits to achieve the ‘1’. desired baud rate (see Section25.4 “EUSART 3. Enable the serial port by setting the SPEN bit Baud Rate Generator (BRG)”). and the RXx/DTx pin TRIS bit. The SYNC bit 2. Set the RXx/DTx and TXx/CKx TRIS controls to must be clear for asynchronous operation. ‘1’. 4. If interrupts are desired, set the RCxIE interrupt 3. Enable the serial port by setting the SPEN bit. enable bit and set the GIE and PEIE bits of the The SYNC bit must be clear for asynchronous INTCON register. operation. 5. If 9-bit reception is desired, set the RX9 bit. 4. If interrupts are desired, set the RCxIE interrupt 6. Enable reception by setting the CREN bit. enable bit and set the GIE and PEIE bits of the 7. The RCxIF interrupt flag bit will be set when a INTCON register. character is transferred from the RSR to the 5. Enable 9-bit reception by setting the RX9 bit. receive buffer. An interrupt will be generated if 6. Enable address detection by setting the ADDEN the RCxIE interrupt enable bit was also set. bit. 8. Read the RCxSTA register to get the error flags 7. Enable reception by setting the CREN bit. and, if 9-bit data reception is enabled, the ninth 8. The RCxIF interrupt flag bit will be set when a data bit. character with the ninth bit set is transferred 9. Get the received eight Least Significant data bits from the RSR to the receive buffer. An interrupt from the receive buffer by reading the RCxREG will be generated if the RCxIE interrupt enable register. bit was also set. 10. If an overrun occurred, clear the OERR flag by 9. Read the RCxSTA register to get the error flags. clearing the CREN receiver enable bit. The ninth data bit will always be set. 10. Get the received eight Least Significant data bits from the receive buffer by reading the RCxREG register. Software determines if this is the device’s address. 11. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and generate interrupts. FIGURE 25-5: ASYNCHRONOUS RECEPTION Start Start Start RXx/DTx pin bit bit 0 bit 1 bit 7/8 Stop bit bit 0 bit 7/8 Stop bit bit 7/8 Stop bit bit bit Rcv Shift Reg Rcv Buffer Reg Word 1 Word 2 RCxREG RCxREG RCIDL Read Rcv Buffer Reg RCxREG RCxIF (Interrupt Flag) OERR bit CREN Note: This timing diagram shows three words appearing on the RXx/DTx input. The RCxREG (receive buffer) is read after the third word, causing the OERR (overrun) bit to be set. DS40001414E-page 294  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 25-2: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1REG EUSART1 Receive Register 292* RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2REG EUSART2 Receive Register 292* RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 292 TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for asynchronous reception. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 295

PIC16(L)F1946/47 25.2 Clock Accuracy with Asynchronous Operation The factory calibrates the internal oscillator block output (HFINTOSC). However, the HFINTOSC frequency may drift as VDD or temperature changes, and this directly affects the asynchronous baud rate. Two methods may be used to adjust the baud rate clock, but both require a reference clock source of some kind. The first (preferred) method uses the OSCTUNE register to adjust the HFINTOSC output. Adjusting the value in the OSCTUNE register allows for fine resolution changes to the system clock source. See Section5.2 “Clock Source Types” for more information. The other method adjusts the value in the Baud Rate Generator. This can be done automatically with the Auto-Baud Detect feature (see Section25.4.1 “Auto-Baud Detect”). There may not be fine enough resolution when adjusting the Baud Rate Generator to compensate for a gradual change in the peripheral clock frequency. DS40001414E-page 296  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.3 Register Definitions: EUSART Control REGISTER 25-1: TXxSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: Ninth bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode.  2010-2016 Microchip Technology Inc. DS40001414E-page 297

PIC16(L)F1946/47 REGISTER 25-2: RCxSTA: RECEIVE STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RXx/DTx and TXx/CKx pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave Don’t care bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 8-bit (RX9 = 0): Don’t care bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCxREG register and receive next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: Ninth bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware. DS40001414E-page 298  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 25-3: BAUDxCON: BAUD RATE CONTROL REGISTER R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ABDOVF: Auto-Baud Detect Overflow bit Asynchronous mode: 1 = Auto-baud timer overflowed 0 = Auto-baud timer did not overflow Synchronous mode: Don’t care bit 6 RCIDL: Receive Idle Flag bit Asynchronous mode: 1 = Receiver is Idle 0 = Start bit has been received and the receiver is receiving Synchronous mode: Don’t care bit 5 Unimplemented: Read as ‘0’ bit 4 SCKP: Synchronous Clock Polarity Select bit Asynchronous mode: 1 = Transmit inverted data to the TXx/CKx pin 0 = Transmit non-inverted data to the TXx/CKx pin Synchronous mode: 1 = Data is clocked on rising edge of the clock 0 = Data is clocked on falling edge of the clock bit 3 BRG16: 16-bit Baud Rate Generator bit 1 = 16-bit Baud Rate Generator is used 0 = 8-bit Baud Rate Generator is used bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE will automatically clear after RCIF is set. 0 = Receiver is operating normally Synchronous mode: Don’t care bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete) 0 = Auto-Baud Detect mode is disabled Synchronous mode: Don’t care  2010-2016 Microchip Technology Inc. DS40001414E-page 299

PIC16(L)F1946/47 25.4 EUSART Baud Rate Generator If the system clock is changed during an active receive (BRG) operation, a receive error or data loss may result. To avoid this problem, check the status of the RCIDL bit to The Baud Rate Generator (BRG) is an 8-bit or 16-bit make sure that the receive operation is Idle before timer that is dedicated to the support of both the changing the system clock. asynchronous and synchronous EUSART operation. By default, the BRG operates in 8-bit mode. Setting the EXAMPLE 25-1: CALCULATING BAUD BRG16 bit of the BAUDxCON register selects 16-bit RATE ERROR mode. For a device with FOSC of 16 MHz, desired baud rate The SPxBRGH:SPxBRGL register pair determines the of 9600, Asynchronous mode, 8-bit BRG: period of the free running baud rate timer. In Asynchronous mode, the multiplier of the baud rate Desired Baud Rate = -------------------------------F----O----S--C--------------------------------- 64[SPxBRGH:SPxBRG]+1 period is determined by both the BRGH bit of the TXxSTA register and the BRG16 bit of the BAUDxCON Solving for SPxBRGH:SPxBRGL: register. In Synchronous mode, the BRGH bit is ignored. FOSC --------------------------------------------- Example25-1 provides a sample calculation for Desired Baud Rate SPxBRGH: SPxBRGL = ---------------------------------------------–1 determining the desired baud rate, actual baud rate, 64 and baud rate % error. 16000000 ------------------------ Typical baud rates and error values for various 9600 = ------------------------–1 asynchronous modes have been computed for your 64 convenience and are shown in Table25-5. It may be = 25.042 = 25 advantageous to use the high baud rate (BRGH = 1), or the 16-bit BRG (BRG16 = 1) to reduce the baud rate ActualBaudRate = --1---6---0---0---0---0---0---0---- 6425+1 error. The 16-bit BRG mode is used to achieve slow baud rates for fast oscillator frequencies. = 9615 Writing a new value to the SPxBRGH, SPxBRGL register pair causes the BRG timer to be reset (or Baud Rate % Error =C--- --a--l--c---.- --B---a---u----d-- --R----a---t-e-----–----D----e---s--i--r--e---d--- --B---a---u---d--- --R---a---t--e--- Desired Baud Rate cleared). This ensures that the BRG does not wait for a timer overflow before outputting the new baud rate. 9615–9600 = ---------------------------------- = 0.16% 9600 TABLE 25-3: BAUD RATE FORMULAS Configuration Bits BRG/EUSART Mode Baud Rate Formula SYNC BRG16 BRGH 0 0 0 8-bit/Asynchronous FOSC/[64 (n+1)] 0 0 1 8-bit/Asynchronous FOSC/[16 (n+1)] 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous FOSC/[4 (n+1)] 1 1 x 16-bit/Synchronous Legend: x = Don’t care, n = value of SPxBRGH, SPxBRGL register pair DS40001414E-page 300  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 25-4: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR Reset Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Values on page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 292 TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented, read as ‘0’. Shaded bits are not used by the BRG. * Page provides register information. TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES SYNC = 0, BRGH = 0, BRG16 = 0 BAUD FOSC = 32.000 MHz FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz RATE SPxBRGL SPxBRGL SPxBRGL SPxBRGL Actual % Actual % Actual % Actual % value value value value Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 — — — — — — — — — — — — 1200 — — — 1200 0.00 239 1202 0.16 207 1200 0.00 143 2400 2404 0.16 207 2400 0.00 119 2404 0.16 103 2400 0.00 71 9600 9615 0.16 51 9600 0.00 29 9615 0.16 25 9600 0.00 17 10417 10417 0.00 47 10286 -1.26 27 10417 0.00 23 10165 -2.42 16 19.2k 19.23k 0.16 25 19.20k 0.00 14 19.23k 0.16 12 19.20k 0.00 8 57.6k 55.55k -3.55 3 57.60k 0.00 7 — — — 57.60k 0.00 2 115.2k — — — — — — — — — — — — SYNC = 0, BRGH = 0, BRG16 = 0 BAUD FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz RATE SPxBRGL SPxBRGL SPxBRGL SPxBRGL Actual % Actual % Actual % Actual % value value value value Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 — — — 300 0.16 207 300 0.00 191 300 0.16 51 1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12 2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — — 9600 9615 0.16 12 — — — 9600 0.00 5 — — — 10417 10417 0.00 11 10417 0.00 5 — — — — — — 19.2k — — — — — — 19.20k 0.00 2 — — — 57.6k — — — — — — 57.60k 0.00 0 — — — 115.2k — — — — — — — — — — — —  2010-2016 Microchip Technology Inc. DS40001414E-page 301

PIC16(L)F1946/47 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 1, BRG16 = 0 BAUD FOSC = 32.000 MHz FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz RATE SPxBRGL SPxBRGL SPxBRGL SPxBRGL Actual % Actual % Actual % Actual % value value value value Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 — — — — — — — — — — — — 1200 — — — — — — — — — — — — 2400 — — — — — — — — — — — — 9600 9615 0.16 207 9600 0.00 119 9615 0.16 103 9600 0.00 71 10417 10417 0.00 191 10378 -0.37 110 10417 0.00 95 10473 0.53 65 19.2k 19.23k 0.16 103 19.20k 0.00 59 19.23k 0.16 51 19.20k 0.00 35 57.6k 57.14k -0.79 34 57.60k 0.00 19 58.82k 2.12 16 57.60k 0.00 11 115.2k 117.64k 2.12 16 115.2k 0.00 9 111.1k -3.55 8 115.2k 0.00 5 SYNC = 0, BRGH = 1, BRG16 = 0 BAUD FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz RATE SPxBRGL SPxBRGL SPxBRGL SPxBRGL Actual % Actual % Actual % Actual % value value value value Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 — — — — — — — — — 300 0.16 207 1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — SYNC = 0, BRGH = 0, BRG16 = 1 BAUD FOSC = 32.000 MHz FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz RATE SPxBRGH: SPxBRGH: SPxBRGH: SPxBRGH: Actual % Actual % Actual % Actual % SPxBRGL SPxBRGL SPxBRGL SPxBRGL Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 300.0 0.00 6666 300.0 0.00 3839 300.03 0.01 3332 300.0 0.00 2303 1200 1200.1 0.02 3332 1200 0.00 959 1200.5 0.04 832 1200 0.00 575 2400 2401 -0.04 832 2400 0.00 479 2398 -0.08 416 2400 0.00 287 9600 9615 0.16 207 9600 0.00 119 9615 0.16 103 9600 0.00 71 10417 10417 0.00 191 10378 -0.37 110 10417 0.00 95 10473 0.53 65 19.2k 19.23k 0.16 103 19.20k 0.00 59 19.23k 0.16 51 19.20k 0.00 35 57.6k 57.14k -0.79 34 57.60k 0.00 19 58.82k 2.12 16 57.60k 0.00 11 115.2k 117.6k 2.12 16 115.2k 0.00 9 111.11k -3.55 8 115.2k 0.00 5 DS40001414E-page 302  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 0, BRG16 = 1 BAUD FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz RATE SPxBRGH: SPxBRGH: SPxBRGH: SPxBRGH: Actual % Actual % Actual % Actual % SPxBRGL SPxBRGL SPxBRGL SPxBRGL Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207 1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD FOSC = 32.000 MHz FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz RATE SPxBRGH: SPxBRGH: SPxBRGH: SPxBRGH: Actual % Actual % Actual % Actual % SPxBRGL SPxBRGL SPxBRGL SPxBRGL Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 300 0.00 26666 300.0 0.00 15359 300.0 0.00 13332 300.0 0.00 9215 1200 1200 0.00 6666 1200 0.00 3839 1200.1 0.01 3332 1200 0.00 2303 2400 2400 0.01 3332 2400 0.00 1919 2399.5 -0.02 1666 2400 0.00 1151 9600 9604 0.04 832 9600 0.00 479 9592 -0.08 416 9600 0.00 287 10417 10417 0.00 767 10425 0.08 441 10417 0.00 383 10433 0.16 264 19.2k 19.18k -0.08 416 19.20k 0.00 239 19.23k 0.16 207 19.20k 0.00 143 57.6k 57.55k -0.08 138 57.60k 0.00 79 57.97k 0.64 68 57.60k 0.00 47 115.2k 115.9 0.64 68 115.2k 0.00 39 114.29k -0.79 34 115.2k 0.00 23 SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz RATE SPxBRGH: SPxBRGH: SPxBRGH: SPxBRGH: Actual % Actual % Actual % Actual % SPxBRGL SPxBRGL SPxBRGL SPxBRGL Rate Error Rate Error Rate Error Rate Error (decimal) (decimal) (decimal) (decimal) 300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832 1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207 2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103 9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25 10417 10417 0.00 191 10417 0.00 95 10473 0.53 87 10417 0.00 23 19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12 57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — — 115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — —  2010-2016 Microchip Technology Inc. DS40001414E-page 303

PIC16(L)F1946/47 25.4.1 AUTO-BAUD DETECT the BRG base clock rate. The resulting byte measurement is the average bit time when clocked at The EUSART module supports automatic detection full speed. and calibration of the baud rate. In the Auto-Baud Detect (ABD) mode, the clock to the Note1: If the WUE bit is set with the ABDEN bit, the auto-baud detection will occur on the BRG is reversed. Rather than the BRG clocking the incoming RXx signal, the RXx signal is timing the BRG. byte following the Break character (see The Baud Rate Generator is used to time the period of Section25.4.3 “Auto-Wake-up on a received 55h (ASCII “U”) which is the Sync character Break”). for the LIN bus. The unique feature of this character is 2: It is up to the user to determine that the that it has five rising edges including the Stop bit edge. incoming character baud rate is within the Setting the ABDEN bit of the BAUDxCON register range of the selected BRG clock source. starts the auto-baud calibration sequence Some combinations of oscillator frequency and EUSART baud rates are not possible. (Figure25.4.2). While the ABD sequence takes place, the EUSART state machine is held in Idle. On the first 3: During the auto-baud process, the rising edge of the receive line, after the Start bit, the auto-baud counter starts counting at 1. SPxBRGL begins counting up using the BRG counter Upon completion of the auto-baud clock as shown in Table25-6. The fifth rising edge will sequence, to achieve maximum occur on the RXx/DTx pin at the end of the eighth bit accuracy, subtract 1 from the period. At that time, an accumulated value totaling the SPxBRGH:SPxBRGL register pair. proper BRG period is left in the SPxBRGH:SPxBRGL register pair, the ABDEN bit is automatically cleared, TABLE 25-6: BRG COUNTER CLOCK and the RCxIF interrupt flag is set. A read operation on RATES the RCxREG needs to be performed to clear the RCxIF interrupt. RCxREG content should be discarded. When BRG Base BRG ABD calibrating for modes that do not use the SPxBRGH BRG16 BRGH Clock Clock register the user can verify that the SPxBRGL register did not overflow by checking for 00h in the SPxBRGH 0 0 FOSC/64 FOSC/512 register. 0 1 FOSC/16 FOSC/128 The BRG auto-baud clock is determined by the BRG16 1 0 FOSC/16 FOSC/128 and BRGH bits as shown in Table25-6. During ABD, both the SPxBRGH and SPxBRGL registers are used 1 1 FOSC/4 FOSC/32 as a 16-bit counter, independent of the BRG16 bit Note: During the ABD sequence, SPxBRGL and setting. While calibrating the baud rate period, the SPxBRGH registers are both used as a SPxBRGH and SPxBRGL registers are clocked at 1/8th 16-bit counter, independent of BRG16 setting. FIGURE 25-6: AUTOMATIC BAUD RATE CALIBRATION BRG Value XXXXh 0000h 001Ch Edge #1 Edge #2 Edge #3 Edge #4 Edge #5 RXx/DTx pin Start bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 Stop bit BRG Clock Set by User Auto Cleared ABDEN bit RCIDL RCxIF bit (Interrupt) Read RCxREG SPxBRGL XXh 1Ch SPxBRGH XXh 00h Note1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode. DS40001414E-page 304  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.4.2 AUTO-BAUD OVERFLOW 25.4.3.1 Special Considerations During the course of automatic baud detection, the Break Character ABDOVF bit of the BAUDxCON register will be set if the To avoid character errors or character fragments during baud rate counter overflows before the fifth rising edge a wake-up event, the wake-up character must be all is detected on the RX pin. The ABDOVF bit indicates zeros. that the counter has exceeded the maximum count that can fit in the 16 bits of the SPxBRGH:SPxBRGL When the wake-up is enabled the function works register pair. After the ABDOVF bit has been set, the independent of the low time on the data stream. If the counter continues to count until the fifth rising edge is WUE bit is set and a valid non-zero character is detected on the RXx/DTx pin. Upon detecting the fifth received, the low time from the Start bit to the first rising RXx/DTx edge, the hardware will set the RCxIF inter- edge will be interpreted as the wake-up event. The rupt flag and clear the ABDEN bit of the BAUDxCON remaining bits in the character will be received as a register. The RCxIF flag can be subsequently cleared fragmented character and subsequent characters can by reading the RCxREG. The ABDOVF flag can be result in framing or overrun errors. cleared by software directly. Therefore, the initial character in the transmission must To terminate the auto-baud process before the RCxIF be all ‘0’s. This must be ten or more bit times, 13-bit flag is set, clear the ABDEN bit then clear the ABDOVF times recommended for LIN bus, or any number of bit bit. The ABDOVF bit will remain set if the ABDEN bit is times for standard RS-232 devices. not cleared first. Oscillator Startup Time Oscillator start-up time must be considered, especially 25.4.3 AUTO-WAKE-UP ON BREAK in applications using oscillators with longer start-up During Sleep mode, all clocks to the EUSART are intervals (i.e., LP, XT or HS/PLL mode). The Sync suspended. Because of this, the Baud Rate Generator Break (or wake-up signal) character must be of is inactive and a proper character reception cannot be sufficient length, and be followed by a sufficient performed. The Auto-Wake-up feature allows the interval, to allow enough time for the selected oscillator controller to wake-up due to activity on the RXx/DTx to start and provide proper initialization of the EUSART. line. This feature is available only in Asynchronous WUE Bit mode. The wake-up event causes a receive interrupt by The Auto-Wake-up feature is enabled by setting the setting the RCxIF bit. The WUE bit is cleared by WUE bit of the BAUDxCON register. Once set, the hardware by a rising edge on RXx/DTx. The interrupt normal receive sequence on RXx/DTx is disabled, and condition is then cleared by software by reading the the EUSART remains in an Idle state, monitoring for a RCxREG register and discarding its contents. wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the To ensure that no actual data is lost, check the RCIDL RXx/DTx line. (This coincides with the start of a Sync bit to verify that a receive operation is not in process Break or a wake-up signal character for the LIN before setting the WUE bit. If a receive operation is not protocol.) occurring, the WUE bit may then be set just prior to entering the Sleep mode. The EUSART module generates an RCxIF interrupt coincident with the wake-up event. The interrupt is generated synchronously to the Q clocks in normal CPU operating modes (Figure25-7), and asynchronously if the device is in Sleep mode (Figure25-8). The interrupt condition is cleared by reading the RCxREG register. The WUE bit is automatically cleared by the low-to-high transition on the RXx line at the end of the Break. This signals to the user that the Break event is over. At this point, the EUSART module is in Idle mode waiting to receive the next character.  2010-2016 Microchip Technology Inc. DS40001414E-page 305

PIC16(L)F1946/47 FIGURE 25-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4 OSC1 Bit set by user Auto Cleared WUE bit RXx/DTx Line RCxIF Cleared due to User Read of RCxREG Note1: The EUSART remains in Idle while the WUE bit is set. FIGURE 25-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4 Q1 Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4 OSC1 Bit Set by User Auto Cleared WUE bit RXx/DTx Line Note 1 RCxIF Cleared due to User Read of RCxREG Sleep Command Executed Sleep Ends Note1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set. DS40001414E-page 306  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.4.4 BREAK CHARACTER SEQUENCE When the TXxREG becomes empty, as indicated by the TXxIF, the next data byte can be written to TXxREG. The EUSART module has the capability of sending the special Break character sequences that are required by 25.4.5 RECEIVING A BREAK CHARACTER the LIN bus standard. A Break character consists of a Start bit, followed by 12 ‘0’ bits and a Stop bit. The Enhanced EUSART module can receive a Break character in two ways. To send a Break character, set the SENDB and TXEN bits of the TXxSTA register. The Break character trans- The first method to detect a Break character uses the mission is then initiated by a write to the TXxREG. The FERR bit of the RCxSTA register and the Received value of data written to TXxREG will be ignored and all data as indicated by RCxREG. The Baud Rate ‘0’s will be transmitted. Generator is assumed to have been initialized to the expected baud rate. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user A Break character has been received when; to preload the transmit FIFO with the next transmit byte • RCxIF bit is set following the Break character (typically, the Sync • FERR bit is set character in the LIN specification). • RCxREG = 00h The TRMT bit of the TXxSTA register indicates when the The second method uses the Auto-Wake-up feature transmit operation is active or Idle, just as it does during described in Section25.4.3 “Auto-Wake-up on normal transmission. See Figure25-9 for the timing of Break”. By enabling this feature, the EUSART will the Break character sequence. sample the next two transitions on RXx/DTx, cause an 25.4.4.1 Break and Sync Transmit Sequence RCxIF interrupt, and receive the next data byte followed by another interrupt. The following sequence will start a message frame header made up of a Break, followed by an auto-baud Note that following a Break character, the user will Sync byte. This sequence is typical of a LIN bus typically want to enable the Auto-Baud Detect feature. master. For both methods, the user can set the ABDEN bit of the BAUDxCON register before placing the EUSART in 1. Configure the EUSART for the desired mode. Sleep mode. 2. Set the TXEN and SENDB bits to enable the Break sequence. 3. Load the TXxREG with a dummy character to initiate transmission (the value is ignored). 4. Write ‘55h’ to TXxREG to load the Sync charac- ter into the transmit FIFO buffer. 5. After the Break has been sent, the SENDB bit is reset by hardware and the Sync character is then transmitted. FIGURE 25-9: SEND BREAK CHARACTER SEQUENCE Write to TXxREG Dummy Write BRG Output (Shift Clock) TXx/CKx (pin) Start bit bit 0 bit 1 bit 11 Stop bit Break TXxIF bit (Transmit interrupt Flag) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB Sampled Here Auto Cleared SENDB (send Break control bit)  2010-2016 Microchip Technology Inc. DS40001414E-page 307

PIC16(L)F1946/47 25.5 EUSART Synchronous Mode 25.5.1.2 Clock Polarity Synchronous serial communications are typically used A clock polarity option is provided for Microwire in systems with a single master and one or more compatibility. Clock polarity is selected with the SCKP slaves. The master device contains the necessary bit of the BAUDxCON register. Setting the SCKP bit circuitry for baud rate generation and supplies the clock sets the clock Idle state as high. When the SCKP bit is for all devices in the system. Slave devices can take set, the data changes on the falling edge of each clock advantage of the master clock by eliminating the and is sampled on the rising edge of each clock. internal clock generation circuitry. Clearing the SCKP bit sets the Idle state as low. When the SCKP bit is cleared, the data changes on the rising There are two signal lines in Synchronous mode: a edge of each clock and is sampled on the falling edge bidirectional data line and a clock line. Slaves use the of each clock. external clock supplied by the master to shift the serial data into and out of their respective receive and 25.5.1.3 Synchronous Master Transmission transmit shift registers. Since the data line is Data is transferred out of the device on the RXx/DTx bidirectional, synchronous operation is half-duplex pin. The RXx/DTx and TXx/CKx pin output drivers are only. Half-duplex refers to the fact that master and automatically enabled when the EUSART is configured slave devices can receive and transmit data but not for synchronous master transmit operation. both simultaneously. The EUSART can operate as either a master or slave device. A transmission is initiated by writing a character to the TXxREG register. If the TSR still contains all or part of Start and Stop bits are not used in synchronous a previous character the new character data is held in transmissions. the TXxREG until the last bit of the previous character 25.5.1 SYNCHRONOUS MASTER MODE has been transmitted. If this is the first character, or the previous character has been completely flushed from The following bits are used to configure the EUSART the TSR, the data in the TXxREG is immediately trans- for Synchronous Master operation: ferred to the TSR. The transmission of the character • SYNC = 1 commences immediately following the transfer of the • CSRC = 1 data to the TSR from the TXxREG. • SREN = 0 (for transmit); SREN = 1 (for receive) Each data bit changes on the leading edge of the • CREN = 0 (for transmit); CREN = 1 (for receive) master clock and remains valid until the subsequent leading clock edge. • SPEN = 1 Setting the SYNC bit of the TXxSTA register configures Note: The TSR register is not mapped in data memory, so it is not available to the user. the device for synchronous operation. Setting the CSRC bit of the TXxSTA register configures the device as a master. Clearing the SREN and CREN bits of the RCxSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCxSTA register enables the EUSART. If the RXx/DTx or TXx/CKx pins are shared with an analog peripheral the analog I/O functions must be disabled by clearing the corresponding ANSEL bits. The TRIS bits corresponding to the RXx/DTx and TXx/CKx pins should be set. 25.5.1.1 Master Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a master transmits the clock on the TXx/CKx line. The TXx/CKx pin output driver is automatically enabled when the EUSART is configured for synchronous transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are generated as there are data bits. DS40001414E-page 308  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.5.1.4 Synchronous Master Transmission 4. Disable Receive mode by clearing bits SREN Set-up: and CREN. 5. Enable Transmit mode by setting the TXEN bit. 1. Initialize the SPxBRGH, SPxBRGL register pair and the BRGH and BRG16 bits to achieve the 6. If 9-bit transmission is desired, set the TX9 bit. desired baud rate (see Section25.4 “EUSART 7. If interrupts are desired, set the TXxIE, GIE and Baud Rate Generator (BRG)”). PEIE interrupt enable bits. 2. Set the RXx/DTx and TXx/CKx TRIS controls to 8. If 9-bit transmission is selected, the ninth bit ‘1’. should be loaded in the TX9D bit. 3. Enable the synchronous master serial port by 9. Start transmission by loading data to the setting bits SYNC, SPEN and CSRC. Set the TXxREG register. TRIS bits corresponding to the RXx/DTx and TXx/CKx I/O pins. FIGURE 25-10: SYNCHRONOUS TRANSMISSION RXx/DTx pin bit 0 bit 1 bit 2 bit 7 bit 0 bit 1 bit 7 Word 1 Word 2 TXx/CKx pin (SCKP = 0) TXx/CKx pin (SCKP = 1) Write to TXxREG Reg Write Word 1 Write Word 2 TXxIF bit (Interrupt Flag) TRMT bit ‘1’ ‘1’ TXEN bit Note: Sync Master mode, SPxBRGL = 0, continuous transmission of two 8-bit words. FIGURE 25-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) RXx/DTx pin bit 0 bit 1 bit 2 bit 6 bit 7 TXx/CKx pin Write to TXxREG reg TXxIF bit TRMT bit TXEN bit  2010-2016 Microchip Technology Inc. DS40001414E-page 309

PIC16(L)F1946/47 TABLE 25-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TX1REG EUSART1 Transmit Register 292* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2REG EUSART2 Transmit Register 292* TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous master transmission. * Page provides register information. DS40001414E-page 310  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.5.1.5 Synchronous Master Reception If the overrun occurred when the CREN bit is set then the error condition is cleared by either clearing the Data is received at the RXx/DTx pin. The RXx/DTx pin CREN bit of the RCxSTA register or by clearing the output driver must be disabled by setting the SPEN bit which resets the EUSART. corresponding TRIS bits when the EUSART is configured for synchronous master receive operation. 25.5.1.8 Receiving 9-bit Characters In Synchronous mode, reception is enabled by setting The EUSART supports 9-bit character reception. When either the Single Receive Enable bit (SREN of the the RX9 bit of the RCxSTA register is set the EUSART RCxSTA register) or the Continuous Receive Enable will shift 9-bits into the RSR for each character bit (CREN of the RCxSTA register). received. The RX9D bit of the RCxSTA register is the When SREN is set and CREN is clear, only as many ninth, and Most Significant, data bit of the top unread clock cycles are generated as there are data bits in a character in the receive FIFO. When reading 9-bit data single character. The SREN bit is automatically cleared from the receive FIFO buffer, the RX9D data bit must at the completion of one character. When CREN is set, be read before reading the eight Least Significant bits clocks are continuously generated until CREN is from the RCxREG. cleared. If CREN is cleared in the middle of a character the CK clock stops immediately and the partial charac- 25.5.1.9 Synchronous Master Reception ter is discarded. If SREN and CREN are both set, then Setup: SREN is cleared at the completion of the first character 1. Initialize the SPxBRGH, SPxBRGL register pair and CREN takes precedence. for the appropriate baud rate. Set or clear the To initiate reception, set either SREN or CREN. Data is BRGH and BRG16 bits, as required, to achieve sampled at the RXx/DTx pin on the trailing edge of the the desired baud rate. TXx/CKx clock pin and is shifted into the Receive Shift 2. Set the RXx/DTx and TXx/CKx TRIS controls to Register (RSR). When a complete character is ‘1’. received into the RSR, the RCxIF bit is set and the 3. Enable the synchronous master serial port by character is automatically transferred to the two setting bits SYNC, SPEN and CSRC. Disable character receive FIFO. The Least Significant eight bits RXx/DTx and TXx/CKx output drivers by setting of the top character in the receive FIFO are available in the corresponding TRIS bits. RCxREG. The RCxIF bit remains set as long as there 4. Ensure bits CREN and SREN are clear. are un-read characters in the receive FIFO. 5. If using interrupts, set the GIE and PEIE bits of 25.5.1.6 Slave Clock the INTCON register and set RCxIE. Synchronous data transfers use a separate clock line, 6. If 9-bit reception is desired, set bit RX9. which is synchronous with the data. A device configured 7. Start reception by setting the SREN bit or for as a slave receives the clock on the TXx/CKx line. The continuous reception, set the CREN bit. TXx/CKx pin output driver must be disabled by setting 8. Interrupt flag bit RCxIF will be set when recep- the associated TRIS bit when the device is configured tion of a character is complete. An interrupt will for synchronous slave transmit or receive operation. be generated if the enable bit RCxIE was set. Serial data bits change on the leading edge to ensure 9. Read the RCxSTA register to get the ninth bit (if they are valid at the trailing edge of each clock. One data enabled) and determine if any error occurred bit is transferred for each clock cycle. Only as many during reception. clock cycles should be received as there are data bits. 10. Read the 8-bit received data by reading the RCxREG register. 25.5.1.7 Receive Overrun Error 11. If an overrun error occurs, clear the error by The receive FIFO buffer can hold two characters. An either clearing the CREN bit of the RCxSTA overrun error will be generated if a third character, in its register or by clearing the SPEN bit which resets entirety, is received before RCxREG is read to access the EUSART. the FIFO. When this happens the OERR bit of the RCxSTA register is set. Previous data in the FIFO will not be overwritten. The two characters in the FIFO buffer can be read, however, no additional characters will be received until the error is cleared. The OERR bit can only be cleared by clearing the overrun condition. If the overrun error occurred when the SREN bit is set and CREN is clear then the error is cleared by reading RCxREG.  2010-2016 Microchip Technology Inc. DS40001414E-page 311

PIC16(L)F1946/47 FIGURE 25-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) RXx/DTx pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 TXx/CKx pin (SCKP = 0) TXx/CKx pin (SCKP = 1) Write to bit SREN SREN bit CREN bit ‘0’ ‘0’ RCxIF bit (Interrupt) Read RCxREG Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TABLE 25-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1REG EUSART1 Receive Register 292* RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2REG EUSART2 Receive Register 292* RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous master reception. * Page provides register information. DS40001414E-page 312  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.5.2 SYNCHRONOUS SLAVE MODE If two words are written to the TXxREG and then the SLEEP instruction is executed, the following will occur: The following bits are used to configure the EUSART for Synchronous slave operation: 1. The first character will immediately transfer to the TSR register and transmit. • SYNC = 1 2. The second word will remain in TXxREG • CSRC = 0 register. • SREN = 0 (for transmit); SREN = 1 (for receive) 3. The TXxIF bit will not be set. • CREN = 0 (for transmit); CREN = 1 (for receive) 4. After the first character has been shifted out of • SPEN = 1 TSR, the TXxREG register will transfer the Setting the SYNC bit of the TXxSTA register configures second character to the TSR and the TXxIF bit the device for synchronous operation. Clearing the will now be set. CSRC bit of the TXxSTA register configures the device as 5. If the PEIE and TXxIE bits are set, the interrupt a slave. Clearing the SREN and CREN bits of the will wake the device from Sleep and execute the RCxSTA register ensures that the device is in the next instruction. If the GIE bit is also set, the Transmit mode, otherwise the device will be configured to program will call the Interrupt Service Routine. receive. Setting the SPEN bit of the RCxSTA register enables the EUSART. If the RXx/DTx or TXx/CKx pins 25.5.2.2 Synchronous Slave Transmission are shared with an analog peripheral the analog I/O Set-up: functions must be disabled by clearing the corresponding 1. Set the SYNC and SPEN bits and clear the ANSEL bits. CSRC bit. RXx/DTx and TXx/CKx pin output drivers must be 2. Set the RXx/DTx and TXx/CKx TRIS controls to disabled by setting the corresponding TRIS bits. ‘1’. 25.5.2.1 EUSART Synchronous Slave 3. Clear the CREN and SREN bits. Transmit 4. If using interrupts, ensure that the GIE and PEIE bits of the INTCON register are set and set the The operation of the Synchronous Master and Slave TXxIE bit. modes are identical (see Section25.5.1.3 5. If 9-bit transmission is desired, set the TX9 bit. “Synchronous Master Transmission”), except in the case of the Sleep mode. 6. Enable transmission by setting the TXEN bit. 7. If 9-bit transmission is selected, insert the Most Significant bit into the TX9D bit. 8. Start transmission by writing the Least Significant eight bits to the TXxREG register.  2010-2016 Microchip Technology Inc. DS40001414E-page 313

PIC16(L)F1946/47 TABLE 25-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 131 TX1REG EUSART1 Transmit Register 292* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2REG EUSART2 Transmit Register 292* TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous slave transmission. * Page provides register information. DS40001414E-page 314  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 25.5.2.3 EUSART Synchronous Slave 25.5.2.4 Synchronous Slave Reception Reception Setup: The operation of the Synchronous Master and Slave 1. Set the SYNC and SPEN bits and clear the modes is identical (Section25.5.1.5 “Synchronous CSRC bit. Master Reception”), with the following exceptions: 2. Set the RXx/DTx and TXx/CKx TRIS controls to • Sleep ‘1’. • CREN bit is always set, therefore the receiver is 3. If using interrupts, ensure that the GIE and PEIE never Idle bits of the INTCON register are set and set the RCxIE bit. • SREN bit, which is a “don’t care” in Slave mode 4. If 9-bit reception is desired, set the RX9 bit. A character may be received while in Sleep mode by 5. Set the CREN bit to enable reception. setting the CREN bit prior to entering Sleep. Once the word is received, the RSR register will transfer the data 6. The RCxIF bit will be set when reception is to the RCxREG register. If the RCxIE enable bit is set, complete. An interrupt will be generated if the the interrupt generated will wake the device from Sleep RCxIE bit was set. and execute the next instruction. If the GIE bit is also 7. If 9-bit mode is enabled, retrieve the Most set, the program will branch to the interrupt vector. Significant bit from the RX9D bit of the RCxSTA register. 8. Retrieve the eight Least Significant bits from the receive FIFO by reading the RCxREG register. 9. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCxSTA register or by clearing the SPEN bit which resets the EUSART. TABLE 25-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BAUD1CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 BAUD2CON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 299 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 PIE1 — ADIE RC1IE TX1IE SSP1IE CCP1IE TMR2IE TMR1IE 91 PIE4 — — RC2IE TX2IE — — BCL2IE SSP2IE 94 PIR1 — ADIF RC1IF TX1IF SSP1IF CCP1IF TMR2IF TMR1IF 95 PIR4 — — RC2IF TX2IF — — BCL2IF SSP2IF 98 RC1REG EUSART1 Receive Register 292* RC1STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 RC2REG EUSART2 Receive Register 292* RC2STA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 298 SP1BRGL EUSART1 Baud Rate Generator, Low Byte 300* SP1BRGH EUSART1 Baud Rate Generator, High Byte 300* SP2BRGL EUSART2 Baud Rate Generator, Low Byte 300* SP2BRGH EUSART2 Baud Rate Generator, High Byte 300* TX1STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 TX2STA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 297 Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous slave reception. * Page provides register information.  2010-2016 Microchip Technology Inc. DS40001414E-page 315

PIC16(L)F1946/47 26.0 CAPACITIVE SENSING (CPS) MODULE The Capacitive Sensing (CPS) module allows for an interaction with an end user without a mechanical interface. In a typical application, the CPS module is attached to a pad on a Printed Circuit Board (PCB), which is electrically isolated from the end user. When the end user places their finger over the PCB pad, a capacitive load is added, causing a frequency shift in the CPS module. The CPS module requires software and at least one timer resource to determine the change in frequency. Key features of this module include: • Analog MUX for monitoring multiple inputs • Capacitive sensing oscillator • Multiple power modes • Multiple current ranges • Multiple voltage reference modes • Software control • Operation during Sleep FIGURE 26-1: CAPACITIVE SENSING BLOCK DIAGRAM Timer0 Module CPSCH<3:0> Set CPSON(1) T0XCS TMR0CS TMR0IF CPS0 FOSC/4 0 Overflow CPS1 T0CKI 0 TMR0 1 CPS2 1 CPS3 CPSRNG<1:0> CPS4 CPSON CPS5 CPS6 Capacitive CPS7 Sensing Timer1 Module CPS8 Oscillator TMR1CS<1:0> CPS9 CPSOSC CPS10 FOSC CPS11 0 Int. CPSCLK FOSC/4 CPS12 Ref- Ref. T1OSC/ EN TMR1H:TMR1L CPS13 1 DAC T1CKI Output CPS14 0 T1GSEL<1:0> CPS15 Ref+ CPSOUT T1G 1 FVR CPS16 Timer1 Gate sync_C1OUT Control Logic sync_C2OUT CPSRM Note 1: If CPSON=0, disabling capacitive sensing, no channel is selected. DS40001414E-page 316  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 26-2: CAPACITIVE SENSING OSCILLATOR BLOCK DIAGRAM Oscillator Module VDD (1) (2) + - S Q CPSCLK CPSx Analog Pin (1) (2) R - + Internal References 0 0 Ref- Ref+ 1 DAC 1 FVR CPSRM Note 1: Module Enable and Power mode selections are not shown. 2: Comparators remain active in Noise Detection mode.  2010-2016 Microchip Technology Inc. DS40001414E-page 317

PIC16(L)F1946/47 26.1 Analog MUX 26.2.1 VOLTAGE REFERENCE MODES The CPS module can monitor up to 16 inputs. The The capacitive sensing oscillator uses voltage capacitive sensing inputs are defined as CPS<15:0>. references to provide two voltage thresholds for To determine if a frequency change has occurred, the oscillation. The upper voltage threshold is referred to user must: as Ref+ and the lower voltage threshold is referred to as Ref-. • Select the appropriate CPS pin by setting the appropriate CPSCH bits of the CPSCON1 The user can elect to use fixed voltage references, register. which are internal to the capacitive sensing oscillator, or variable voltage references, which are supplied by • Set the corresponding ANSEL bit. the Fixed Voltage Reference (FVR) module and the • Set the corresponding TRIS bit. Digital-to-Analog Converter (DAC) module. • Run the software algorithm. When the fixed voltage references are used, the VSS Selection of the CPSx pin while the module is enabled voltage determines the lower threshold level (Ref-) and will cause the capacitive sensing oscillator to be on the the VDD voltage determines the upper threshold level CPSx pin. Failure to set the corresponding ANSEL and (Ref+). TRIS bits can cause the capacitive sensing oscillator to When the variable voltage references are used, the stop, leading to false frequency readings. DAC voltage determines the lower threshold level (Ref-) and the FVR voltage determines the upper 26.2 Capacitive Sensing Oscillator threshold level (Ref+). An advantage of using these The capacitive sensing oscillator consists of a constant reference sources is that oscillation frequency remains current source and a constant current sink, to produce constant with changes in VDD. a triangle waveform. The CPSOUT bit of the Different oscillation frequencies can be obtained CPSCON0 register shows the status of the capacitive through the use of these variable voltage references. sensing oscillator, whether it is a sinking or sourcing The more the upper voltage reference level is lowered current. The oscillator is designed to drive a capacitive and the more the lower voltage reference level is load (single PCB pad) and at the same time, be a clock raised, the higher the capacitive sensing oscillator source to either Timer0 or Timer1. The oscillator has frequency becomes. three different current settings as defined by Selection between the voltage references is controlled CPSRNG<1:0> of the CPSCON0 register. The different by the CPSRM bit of the CPSCON0 register. Setting current settings for the oscillator serve two purposes: this bit selects the variable voltage references and • Maximize the number of counts in a timer for a clearing this bit selects the fixed voltage references. fixed time base. See Section14.0 “Fixed Voltage Reference (FVR)” • Maximize the count differential in the timer during and Section17.0 “Digital-to-Analog Converter (DAC) a change in frequency. Module” for more information on configuring the variable voltage levels. DS40001414E-page 318  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 26.2.2 CURRENT RANGES The remaining mode is a Noise Detection mode that resides within the high range. The Noise Detection The capacitive sensing oscillator can operate in one of mode is unique in that it disables the sinking and sourc- seven different power modes. The power modes are ing of current on the analog pin but leaves the rest of separated into two ranges: the low range and the high the oscillator circuitry active. This reduces the oscilla- range. tion frequency on the analog pin to zero and also When the oscillator’s low range is selected, the fixed greatly reduces the current consumed by the oscillator internal voltage references of the capacitive sensing module. oscillator are being used. When the oscillator’s high When noise is introduced onto the pin, the oscillator is range is selected, the variable voltage references driven at the frequency determined by the noise. This supplied by the FVR and DAC modules are being used. produces a detectable signal at the comparator output, Selection between the voltage references is controlled indicating the presence of activity on the pin. by the CPSRM bit of the CPSCON0 register. See Section26.2.1 “Voltage Reference Modes” for more Figure26-2 shows a more detailed drawing of the information. current sources and comparators associated with the oscillator. Within each range there are three distinct power modes: low, medium and high. Current consumption is dependent upon the range and mode selected. Selecting Power modes within each range is accomplished by configuring the CPSRNG <1:0> bits in the CPSCON0 register. See Table for proper power mode selection. TABLE 26-1: POWER MODE SELECTION CPSRM Range CPSRNG<1:0> Current Range(1) 00 Noise Detection 01 Low 1 High 10 Medium 11 High 00 Off 01 Low 0 Low 10 Medium 11 High Note 1: See Power-Down Currents (IPD) in Section30.0 “Electrical Specifications” for more information. 26.2.3 TIMER RESOURCES 26.2.4.1 Timer0 To measure the change in frequency of the capacitive To select Timer0 as the timer resource for the CPS sensing oscillator, a fixed time base is required. For the module: period of the fixed time base, the capacitive sensing • Set the T0XCS bit of the CPSCON0 register. oscillator is used to clock either Timer0 or Timer1. The • Clear the TMR0CS bit of the OPTION_REG frequency of the capacitive sensing oscillator is equal register. to the number of counts in the timer divided by the period of the fixed time base. When Timer0 is chosen as the timer resource, the capacitive sensing oscillator will be the clock source for 26.2.4 FIXED TIME BASE Timer0. Refer to Section20.0 “Timer0 Module” for additional information. To measure the frequency of the capacitive sensing oscillator, a fixed time base is required. Any timer resource or software loop can be used to establish the fixed time base. It is up to the end user to determine the method in which the fixed time base is generated. Note: The fixed time base can not be generated by the timer resource that the capacitive sensing oscillator is clocking.  2010-2016 Microchip Technology Inc. DS40001414E-page 319

PIC16(L)F1946/47 26.2.4.2 Timer1 26.2.5.2 Reduced Frequency (additional capacitive load) To select Timer1 as the timer resource for the CPS module, set the TMR1CS<1:0> of the T1CON register The extra capacitive load will cause the frequency of the to ‘11’. When Timer1 is chosen as the timer resource, capacitive sensing oscillator to decrease. To determine the capacitive sensing oscillator will be the clock the reduced frequency of the capacitive sensing source for Timer1. Because the Timer1 module has a oscillator: gate control, developing a time base for the frequency • Add a typical capacitive load on the selected measurement can be simplified by using the Timer0 CPSx pin. overflow flag. • Use the same fixed time base as the nominal It is recommended that the Timer0 overflow flag, in frequency measurement. conjunction with the Toggle mode of the Timer1 Gate, be • At the start of the fixed time base, clear the timer used to develop the fixed time base required by the soft- resource. ware portion of the CPS module. Refer to Section21.11 • At the end of the fixed time base save the value in “Register Definitions: Timer1 Control” for additional the timer resource. information. The value of the timer resource is the number of oscillations of the capacitive sensing oscillator, with an TABLE 26-3: TIMER1 ENABLE FUNCTION additional capacitive load. The frequency of the TMR1ON TMR1GE Timer1 Operation capacitive sensing oscillator is equal to the number of counts in the timer divided by the period of the fixed 0 0 Off time base. This frequency should be lower than the 0 1 Off value obtained during the nominal frequency 1 0 On measurement. 1 1 Count Enabled by input 26.2.5.3 Frequency Threshold 26.2.5 SOFTWARE CONTROL The frequency threshold should be placed midway between the value of the nominal frequency and the The software portion of the CPS module is required to reduced frequency of the capacitive sensing oscillator. determine the change in frequency of the capacitive Refer to Application Note AN1103, Software Handling sensing oscillator. This is accomplished by the for Capacitive Sensing (DS01103) for more detailed following: information on the software required for CPS module. • Setting a fixed time base to acquire counts on Note: For more information on general capacitive Timer0 or Timer1. sensing refer to Application Notes: • Establishing the nominal frequency for the • AN1101, Introduction to Capacitive capacitive sensing oscillator. Sensing (DS01101) • Establishing the reduced frequency for the • AN1102, Layout and Physical Design capacitive sensing oscillator due to an additional Guidelines for Capacitive Sensing capacitive load. (DS01102) • Set the frequency threshold. 26.2.5.1 Nominal Frequency (No Capacitive Load) To determine the nominal frequency of the capacitive sensing oscillator: • Remove any extra capacitive load on the selected CPSx pin. • At the start of the fixed time base, clear the timer resource. • At the end of the fixed time base save the value in the timer resource. The value of the timer resource is the number of oscillations of the capacitive sensing oscillator for the given time base. The frequency of the capacitive sensing oscillator is equal to the number of counts on in the timer divided by the period of the fixed time base. DS40001414E-page 320  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 26.3 Operation during Sleep The capacitive sensing oscillator will continue to run as long as the module is enabled, independent of the part being in Sleep. In order for the software to determine if a frequency change has occurred, the part must be awake. However, the part does not have to be awake when the timer resource is acquiring counts. Note: Timer0 does not operate in Sleep, and therefore cannot be used for capacitive sense measurements in Sleep.  2010-2016 Microchip Technology Inc. DS40001414E-page 321

PIC16(L)F1946/47 26.4 Register Definitions: Capacitive Sensing Control REGISTER 26-2: CPSCON0: CAPACITIVE SENSING CONTROL REGISTER 0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CPSON: CPS Module Enable bit 1 = CPS module is enabled 0 = CPS module is disabled bit 6 CPSRM: Capacitive Sensing Reference Mode bit 1 = CPS module is in high range. DAC and FVR provide oscillator voltage references. 0 = CPS module is in the low range. Internal oscillator voltage references are used. bit 5-4 Unimplemented: Read as ‘0’ bit 3-2 CPSRNG<1:0>: Capacitive Sensing Current Range bits If CPSRM = 0 (low range): 11 = Oscillator is in High Range. Charge/Discharge Current is nominally 18µA 10 = Oscillator is in Medium Range. Charge/Discharge Current is nominally 1.2µA 01 = Oscillator is in Low Range. Charge/Discharge Current is nominally 0.1µA 00 = Oscillator is off If CPSRM = 1 (high range): 11 = Oscillator is in High Range. Charge/Discharge Current is nominally 100µA 10 = Oscillator is in Medium Range. Charge/Discharge Current is nominally 30µA 01 = Oscillator is in Low Range. Charge/Discharge Current is nominally 9µA 00 = Oscillator is on. Noise Detection mode. No Charge/Discharge current is supplied. bit 1 CPSOUT: Capacitive Sensing Oscillator Status bit 1 = Oscillator is sourcing current (Current flowing out of the pin) 0 = Oscillator is sinking current (Current flowing into the pin) bit 0 T0XCS: Timer0 External Clock Source Select bit If TMR0CS = 1: The T0XCS bit controls which clock external to the core/Timer0 module supplies Timer0: 1 = Timer0 clock source is the capacitive sensing oscillator 0 = Timer0 clock source is the T0CKI pin If TMR0CS = 0: Timer0 clock source is controlled by the core/Timer0 module and is FOSC/4 DS40001414E-page 322  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 26-3: CPSCON1: CAPACITIVE SENSING CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — CPSCH<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 CPSCH<4:0>: Capacitive Sensing Channel Select bits If CPSON = 0: These bits are ignored. No channel is selected. If CPSON = 1: 00000 =channel 0, (CPS0) 00001 =channel 1, (CPS1) 00010 =channel 2, (CPS2) 00011 =channel 3, (CPS3) 00100 =channel 4, (CPS4) 00101 =channel 5, (CPS5) 00110 =channel 6, (CPS6) 00111 =channel 7, (CPS7) 01000 =channel 8, (CPS8) 01001 =channel 9, (CPS9) 01010 =channel 10, (CPS10) 01011 =channel 11, (CPS11) 01100 =channel 12, (CPS12) 01101 =channel 13, (CPS13) 01110 =channel 14, (CPS14) 01111 =channel 15, (CPS15) 10000 =channel 16, (CPS16) 10001 =Reserved. Do not use. . . . 11111 =Reserved. Do not use. TABLE 26-1: SUMMARY OF REGISTERS ASSOCIATED WITH CAPACITIVE SENSING Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 126 CPSCON0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS 322 CPSCON1 — — — CPSCH<4:0> 323 OPTION_RE WPUEN INTEDG TMR0CS TMR0SE PSA PS2 PS1 PS0 188 G T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 125 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 128 TRISD TRISD<7:0> 134 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the CPS module.  2010-2016 Microchip Technology Inc. DS40001414E-page 323

PIC16(L)F1946/47 27.0 LIQUID CRYSTAL DISPLAY 27.1 LCD Registers (LCD) DRIVER MODULE The module contains the following registers: The Liquid Crystal Display (LCD) driver module • LCD Control register (LCDCON) generates the timing control to drive a static or • LCD Phase register (LCDPS) multiplexed LCD panel. In the PIC16(L)F1946/47 • LCD Reference Ladder register (LCDRL) device, the module drives the panels of up to four • LCD Contrast Control register (LCDCST) commons and up to 46 segments. The LCD module also provides control of the LCD pixel data. • LCD Reference Voltage Control register (LCDREF) The LCD driver module supports: • Up to six LCD Segment Enable registers • Direct driving of LCD panel (LCDSEn) • Three LCD clock sources with selectable prescaler • Up to 24 LCD data registers (LCDDATAn) • Up to four common pins: - Static (one common) - 1/2 multiplex (two commons) - 1/3 multiplex (three commons) - 1/4 multiplex (four commons) • Segment pins up to: - 64 (PIC16(L)F1946/47) • Static, 1/2 or 1/3 LCD Bias FIGURE 27-1: LCD DRIVER MODULE BLOCK DIAGRAM LCDDATAx SEG<23:0> Data Bus MUX To I/O Pads(1) Registers Timing Control LCDCON COM<3:0> LCDPS To I/O Pads(1) LCDSEn FOSC/256 Clock Source T1OSC Select and Prescaler LFINTOSC Note 1: These are not directly connected to the I/O pads, but may be tri-stated, depending on the configuration of the LCD module. DS40001414E-page 324  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 27-1: LCD SEGMENT AND DATA REGISTERS # of LCD Registers Device Segment Data Enable PIC16(L)F1946/47 6 24 The LCDCON register (Register27-1) controls the operation of the LCD driver module. The LCDPS register (Register27-2) configures the LCD clock source prescaler and the type of waveform; Type-A or Type-B. The LCDSEn registers (Register27-5) configure the functions of the port pins. The following LCDSEn registers are available: • LCDSE0 SE<7:0> • LCDSE1 SE<15:8> • LCDSE2 SE<23:16>(1) • LCDSE3 SE<31:24> • LCDSE4 SE<39:32> • LCDSE5 SE<45:40> Once the module is initialized for the LCD panel, the individual bits of the LCDDATAn registers are cleared/set to represent a clear/dark pixel, respectively: • LCDDATA0 SEG<7:0>COM0 • LCDDATA1 SEG<15:8>COM0 • LCDDATA2 SEG<23:16>COM0 • LCDDATA3 SEG<7:0>COM1 • LCDDATA4 SEG<15:8>COM1 • LCDDATA5 SEG<23:16>COM1 • LCDDATA6 SEG<7:0>COM2 • LCDDATA7 SEG<15:8>COM2 • LCDDATA8 SEG<23:16>COM2 • LCDDATA9 SEG<7:0>COM3 • LCDDATA10 SEG<15:8>COM3 • LCDDATA11 SEG<23:16>COM3 • LCDDATA12 SEG<31:24>COM0 • LCDDATA13 SEG<39:32>COM0 • LCDDATA14 SEG<45:40>COM0 • LCDDATA15 SEG<31:24>COM1 • LCDDATA16 SEG<39:32>COM1 • LCDDATA17 SEG<45:40>COM1 • LCDDATA18 SEG<31:24>COM2 • LCDDATA19 SEG<39:32>COM2 • LCDDATA20 SEG<45:40>COM2 • LCDDATA21 SEG<31:24>COM3 • LCDDATA22 SEG<39:32>COM3 • LCDDATA23 SEG<45:40>COM3 As an example, LCDDATAn is detailed in Register27-6. Once the module is configured, the LCDEN bit of the LCDCON register is used to enable or disable the LCD module. The LCD panel can also operate during Sleep by clearing the SLPEN bit of the LCDCON register.  2010-2016 Microchip Technology Inc. DS40001414E-page 325

PIC16(L)F1946/47 27.2 Register Definitions: Liquid Crystal Display (LCD) Control REGISTER 27-1: LCDCON: LIQUID CRYSTAL DISPLAY (LCD) CONTROL REGISTER R/W-0/0 R/W-0/0 R/C-0/0 U-0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDEN: LCD Driver Enable bit 1 = LCD driver module is enabled 0 = LCD driver module is disabled bit 6 SLPEN: LCD Driver Enable in Sleep Mode bit 1 = LCD driver module is disabled in Sleep mode 0 = LCD driver module is enabled in Sleep mode bit 5 WERR: LCD Write Failed Error bit 1 = LCDDATAn register written while the WA bit of the LCDPS register = 0 (must be cleared in software) 0 = No LCD write error bit 4 Unimplemented: Read as ‘0’ bit 3-2 CS<1:0>: Clock Source Select bits 00 = FOSC/256 01 = T1OSC (Timer1) 1x = LFINTOSC (31 kHz) bit 1-0 LMUX<1:0>: Commons Select bits Maximum Number of Pixels LMUX<1:0> Multiplex Bias PIC16F1946/47/ PIC16LF1946/47 00 Static (COM0) 46 Static 01 1/2 (COM<1:0>) 92 1/2 or 1/3 10 1/3 (COM<2:0>) 138 1/2 or 1/3 11 1/4 (COM<3:0>) 184 1/3 DS40001414E-page 326  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 27-2: LCDPS: LCD PHASE REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 WFT BIASMD LCDA WA LP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 WFT: Waveform Type bit 1 = Type-B phase changes on each frame boundary 0 = Type-A phase changes within each common type bit 6 BIASMD: Bias Mode Select bit When LMUX<1:0> = 00: 0 = Static Bias mode (do not set this bit to ‘1’) When LMUX<1:0> = 01: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX<1:0> = 10: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX<1:0> = 11: 0 = 1/3 Bias mode (do not set this bit to ‘1’) bit 5 LCDA: LCD Active Status bit 1 = LCD driver module is active 0 = LCD driver module is inactive bit 4 WA: LCD Write Allow Status bit 1 = Writing to the LCDDATAn registers is allowed 0 = Writing to the LCDDATAn registers is not allowed bit 3-0 LP<3:0>: LCD Prescaler Selection bits 1111 = 1:16 1110 = 1:15 1101 = 1:14 1100 = 1:13 1011 = 1:12 1010 = 1:11 1001 = 1:10 1000 = 1:9 0111 = 1:8 0110 = 1:7 0101 = 1:6 0100 = 1:5 0011 = 1:4 0010 = 1:3 0001 = 1:2 0000 = 1:1  2010-2016 Microchip Technology Inc. DS40001414E-page 327

PIC16(L)F1946/47 REGISTER 27-3: LCDREF: LCD REFERENCE VOLTAGE CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDIRE: LCD Internal Reference Enable bit 1 = Internal LCD Reference is enabled and connected to the Internal Contrast Control circuit 0 = Internal LCD Reference is disabled bit 6 LCDIRS: LCD Internal Reference Source bit If LCDIRE = 1: 0 = Internal LCD Contrast Control is powered by VDD 1 = Internal LCD Contrast Control is powered by a 3.072V output of the FVR. If LCDIRE=0: Internal LCD Contrast Control is unconnected. LCD bandgap buffer is disabled. bit 5 LCDIRI: LCD Internal Reference Ladder Idle Enable bit Allows the Internal FVR buffer to shut down when the LCD Reference Ladder is in power mode ‘B’ 1 = When the LCD Reference Ladder is in power mode ‘B’, the LCD Internal FVR buffer is disabled. 0 = The LCD Internal FVR Buffer ignores the LCD Reference Ladder Power mode. bit 4 Unimplemented: Read as ‘0’ bit 3 VLCD3PE: VLCD3 Pin Enable bit 1 = The VLCD3 pin is connected to the internal bias voltage LCDBIAS3(1) 0 = The VLCD3 pin is not connected bit 2 VLCD2PE: VLCD2 Pin Enable bit 1 = The VLCD2 pin is connected to the internal bias voltage LCDBIAS2(1) 0 = The VLCD2 pin is not connected bit 1 VLCD1PE: VLCD1 Pin Enable bit 1 = The VLCD1 pin is connected to the internal bias voltage LCDBIAS1(1) 0 = The VLCD1 pin is not connected bit 0 Unimplemented: Read as ‘0’ Note 1: Normal pin controls of TRISx and ANSELx are unaffected. DS40001414E-page 328  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 REGISTER 27-4: LCDCST: LCD CONTRAST CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — — LCDCST<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 LCDCST<2:0>: LCD Contrast Control bits Selects the resistance of the LCD contrast control resistor ladder Bit Value=Resistor ladder 000 = Minimum resistance (maximum contrast). Resistor ladder is shorted. 001 = Resistor ladder is at 1/7th of maximum resistance 010 = Resistor ladder is at 2/7th of maximum resistance 011 = Resistor ladder is at 3/7th of maximum resistance 100 = Resistor ladder is at 4/7th of maximum resistance 101 = Resistor ladder is at 5/7th of maximum resistance 110 = Resistor ladder is at 6/7th of maximum resistance 111 = Resistor ladder is at maximum resistance (minimum contrast).  2010-2016 Microchip Technology Inc. DS40001414E-page 329

PIC16(L)F1946/47 REGISTER 27-5: LCDSEn: LCD SEGMENT ENABLE REGISTERS R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SEn SEn SEn SEn SEn SEn SEn SEn bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEn: Segment Enable bits 1 = Segment function of the pin is enabled 0 = I/O function of the pin is enabled REGISTER 27-6: LCDDATAn: LCD DATA REGISTERS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEGx-COMy: Pixel On bits 1 = Pixel ON (dark) 0 = Pixel OFF (clear) DS40001414E-page 330  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 27.3 LCD Clock Source Selection Using bits CS<1:0> of the LCDCON register can select any of these clock sources. The LCD module has three possible clock sources: 27.3.1 LCD PRESCALER • FOSC/256 • T1OSC A 4-bit counter is available as a prescaler for the LCD • LFINTOSC clock. The prescaler is not directly readable or writable; its value is set by the LP<3:0> bits of the LCDPS register, The first clock source is the system clock divided by which determine the prescaler assignment and prescale 256 (FOSC/256). This divider ratio is chosen to provide ratio. about 1 kHz output when the system clock is 8MHz. The divider is not programmable. Instead, the LCD The prescale values are selectable from 1:1 through prescaler bits LP<3:0> of the LCDPS register are used 1:16. to set the LCD frame clock rate. The second clock source is the T1OSC. This also gives about 1 kHz when a 32.768 kHz crystal is used with the Timer1 oscillator. To use the Timer1 oscillator as a clock source, the T1OSCEN bit of the T1CON register should be set. The third clock source is the 31kHz LFINTOSC, which provides approximately 1 kHz output. The second and third clock sources may be used to continue running the LCD while the processor is in Sleep. FIGURE 27-2: LCD CLOCK GENERATION 0 12 3 FOSC ÷256 To Ladder M MM M O OO O Power Control C CC C ÷4 Static T1OSC 32 kHz Crystal Osc. ÷2 1/2 4-bit Prog ÷ 32 Segment ÷1, 2, 3, 4 Prescaler Clock Ring Counter Counter 1/3, LFINTOSC 1/4 Nominal=31kHz LP<3:0> CS<1:0> LMUX<1:0>  2010-2016 Microchip Technology Inc. DS40001414E-page 331

PIC16(L)F1946/47 27.4 LCD Bias Voltage Generation TABLE 27-2: LCD BIAS VOLTAGES The LCD module can be configured for one of three bias types: Static Bias 1/2 Bias 1/3 Bias • Static Bias (two-voltage levels: VSS and VLCD) LCD Bias 0 VSS VSS VSS • 1/2 Bias (three-voltage levels: VSS, 1/2VLCD and LCD Bias 1 — 1/2 VDD 1/3 VDD VLCD) LCD Bias 2 — 1/2 VDD 2/3 VDD • 1/3 Bias (four voltage levels: VSS, 1/3VLCD, LCD Bias 3 VLCD3 VLCD3 VLCD3 2/3VLCD and VLCD) The internal contrast control and an internal reference ladder are provided internally to the PIC16(L)F1946/47 so that the user is not forced to place external components and use up to three pins for bias voltage generation. Both of these features may be used in conjunction with the external VLCD<3:1> pins, to provide maximum flexibility. Refer to Figure27-3. FIGURE 27-3: LCD BIAS VOLTAGE GENERATION BLOCK DIAGRAM LCDIRE VDD LCDIRS LCDA 1.024V from FVR 3.072V x 3 Power Mode Switching LCDIRE (LRLAP or LRLBP) LCDIRS A 2 LCDA 2 B 2 LCDCST<2:0> VLCD3PE LCDA VLCD3 lcdbias3 VLCD2PE VLCD2 lcdbias2 BIASMD VLCD1PE VLCD1 lcdbias1 lcdbias0 DS40001414E-page 332  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 27.5 LCD Bias Internal Reference 27.5.2 POWER MODES Ladder The internal reference ladder may be operated in one of three power modes. This allows the user to trade off LCD The internal reference ladder can be used to divide the contrast for power in the specific application. The larger LCD bias voltage two or three equally spaced voltages the LCD glass, the more capacitance is present on a that will be supplied to the LCD segment pins. To create physical LCD segment, requiring more current to this, the reference ladder consists of three matched maintain the same contrast level. resistors. Refer to Figure27-3. Three different power modes are available, LP, MP and 27.5.1 BIAS MODE INTERACTION HP. The internal reference ladder can also be turned off for applications that wish to provide an external ladder When in 1/2 Bias mode (BIASMD = 1), the middle or to minimize power consumption. Disabling the resistor of the ladder is shorted out so that only two internal reference ladder results in all of the ladders voltages are generated. The current consumption of the being disconnected, allowing external voltages to be ladder is higher in this mode, with the one resistor supplied. removed. Whenever the LCD module is inactive (LCDA=0), the internal reference ladder will be turned off. TABLE 27-3: LCD INTERNAL LADDER POWER MODES (1/3 BIAS) Power Nominal Resistance of Nominal Mode Entire Ladder IDD Low 3Mohm 1µA Medium 300kohm 10µA High 30kohm 100µA  2010-2016 Microchip Technology Inc. DS40001414E-page 333

PIC16(L)F1946/47 27.5.3 AUTOMATIC POWER MODE The LCDRL register allows switching between two SWITCHING power modes, designated ‘A’ and ‘B’. ‘A’ Power mode is active for a programmable time, beginning at the As an LCD segment is electrically only a capacitor, time when the LCD segments transition. ‘B’ Power current is drawn only during the interval where the mode is the remaining time before the segments or voltage is switching. To minimize total device current, commons change again. The LRLAT<2:0> bits select the LCD internal reference ladder can be operated in a how long, if any, that the ‘A’ Power mode is active. different power mode for the transition portion of the Refer to Figure27-4. duration. This is controlled by the LCDRL Register (Register27-7). To implement this, the 5-bit prescaler used to divide the 32kHz clock down to the LCD controller’s 1kHz base rate is used to select the power mode. FIGURE 27-4: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A Single Segment Time 32 kHz Clock Ladder Power ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F ‘H00 ‘H01 Control Segment Clock LRLAT<2:0> ‘H3 Segment Data LRLAT<2:0> Power Mode Power Mode A Power Mode B Mode A V COM0 1 V 0 V 1 SEG0 V 0 V 1 COM0-SEG0 V0 -V 1 DS40001414E-page 334  2010-2016 Microchip Technology Inc.

D FIGURE 27-5: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A WAVEFORM (1/2 MUX, 1/2 BIAS P S 4 DRIVE) 0 I 0 C 0 1 4 1 1 4E Single Segment Time Single Segment Time 6 -p ag ( e 32 kHz Clock L 3 35 ) F Ladder Power Control ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F 1 9 Segment Clock 4 6 Segment Data / 4 7 Power Mode Power Mode A Power Mode B Power Mode A Power Mode B LRLAT<2:0> = 011 LRLAT<2:0> = 011 V 2 V 1 COM0-SEG0 V0 -V 1 -V 2  2 0 1 0 -2 0 1 6 M ic ro c h ip T e c h n o lo g y In c .

 FIGURE 27-6: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE B WAVEFORM (1/2 MUX, 1/2 BIAS 20 DRIVE) 1 0 -2 0 1 6 M Single Segment Time Single Segment Time Single Segment Time Single Segment Time ic ro ch 32 kHz Clock ip T e c Ladder Power hn Control ‘H00 ‘H01 ‘H02 ‘H03 ‘H0E ‘H0F ‘H10 ‘H11 ‘H12 ‘H13 ‘H1E ‘H1F ‘H00 ‘H01 ‘H02 ‘H03 ‘H0E ‘H0F ‘H10 ‘H11 ‘H12 ‘H13 ‘H1E ‘H1F o lo g y Segment Clock In c . Segment Data Power Mode Power Mode A Power Mode B Power Mode A Power Mode B Power Mode A Power Mode B Power Mode A Power Mode B LRLAT<2:0> = 011 LRLAT<2:0> = 011 LRLAT<2:0> = 011 LRLAT<2:0> = 011 V 2 V 1 COM0-SEG0 V0 P -V 1 I C -V2 1 6 ( L ) F D S 4 1 0 00 9 1 4 4 1 4 E 6 -p a / g 4 e 3 7 3 6

PIC16(L)F1946/47 27.6 Register Definitions: LCD Ladder Control REGISTER 27-7: LCDRL: LCD REFERENCE LADDER CONTROL REGISTERS R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 LRLAP<1:0>: LCD Reference Ladder A Time Power Control bits During Time interval A (Refer to Figure27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 5-4 LRLBP<1:0>: LCD Reference Ladder B Time Power Control bits During Time interval B (Refer to Figure27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 3 Unimplemented: Read as ‘0’ bit 2-0 LRLAT<2:0>: LCD Reference Ladder A Time interval control bits Sets the number of 32 kHz clocks that the A Time interval power mode is active For type A waveforms (WFT = 0): 000 = Internal LCD Reference Ladder is always in ‘B’ Power mode 001 = Internal LCD Reference Ladder is in ‘A’ Power mode for one clock and ‘B’ Power mode for 15 clocks 010 = Internal LCD Reference Ladder is in ‘A’ Power mode for two clocks and ‘B’ Power mode for 14 clocks 011 = Internal LCD Reference Ladder is in ‘A’ Power mode for three clocks and ‘B’ Power mode for 13 clocks 100 = Internal LCD Reference Ladder is in ‘A’ Power mode for four clocks and ‘B’ Power mode for 12 clocks 101 = Internal LCD Reference Ladder is in ‘A’ Power mode for five clocks and ‘B’ Power mode for 11 clocks 110 = Internal LCD Reference Ladder is in ‘A’ Power mode for six clocks and ‘B’ Power mode for 10 clocks 111 = Internal LCD Reference Ladder is in ‘A’ Power mode for seven clocks and ‘B’ Power mode for nine clocks For type B waveforms (WFT = 1): 000 = Internal LCD Reference Ladder is always in ‘B’ Power mode. 001 = Internal LCD Reference Ladder is in ‘A’ Power mode for one clock and ‘B’ Power mode for 31 clocks 010 = Internal LCD Reference Ladder is in ‘A’ Power mode for two clocks and ‘B’ Power mode for 30 clocks 011 = Internal LCD Reference Ladder is in ‘A’ Power mode for three clocks and ‘B’ Power mode for 29 clocks 100 = Internal LCD Reference Ladder is in ‘A’ Power mode for four clocks and ‘B’ Power mode for 28 clocks 101 = Internal LCD Reference Ladder is in ‘A’ Power mode for five clocks and ‘B’ Power mode for 27 clocks 110 = Internal LCD Reference Ladder is in ‘A’ Power mode for six clocks and ‘B’ Power mode for 26 clocks 111 = Internal LCD Reference Ladder is in ‘A’ Power mode for seven clocks and ‘B’ Power mode for 25 clocks  2010-2016 Microchip Technology Inc. DS40001414E-page 337

PIC16(L)F1946/47 27.6.1 CONTRAST CONTROL The contrast control circuit is used to decrease the output voltage of the signal source by a total of The LCD contrast control circuit consists of a approximately 10%, when LCDCST=111. seven-tap resistor ladder, controlled by the LCDCST bits. Refer to Figure27-7. Whenever the LCD module is inactive (LCDA=0), the contrast control ladder will be turned off (open). FIGURE 27-7: INTERNAL REFERENCE AND CONTRAST CONTROL BLOCK DIAGRAM VDDIO Seven Stages R R R R 3.072V Analog From FVR MUX Buffer 7 To top of Reference Ladder 0 LCDCST<2:0> 3 Internal Reference Contrast control 27.6.2 INTERNAL REFERENCE 27.6.3 VLCD<3:1> PINS Under firmware control, an internal reference for the The VLCD<3:1> pins provide the ability for an external LCD bias voltages can be enabled. When enabled, the LCD bias network to be used instead of the internal source of this voltage can be either VDDIO or a voltage ladder. Use of the VLCD<3:1> pins does not prevent threetimes the main fixed voltage reference (3.072V). use of the internal ladder. Each VLCD pin has an When no internal reference is selected, the LCD independent control in the LCDREF register contrast control circuit is disabled and LCD bias must (Register27-3), allowing access to any or all of the be provided externally. LCD Bias signals. This architecture allows for maximum flexibility in different applications. Whenever the LCD module is inactive (LCDA=0), the internal reference will be turned off. For example, the VLCD<3:1> pins may be used to add capacitors to the internal reference ladder, increasing When the internal reference is enabled and the Fixed the drive capacity. Voltage Reference is selected, the LCDIRI bit can be used to minimize power consumption by tying into the For applications where the internal contrast control is LCD reference ladder automatic power mode switching. insufficient, the firmware can choose to only enable the When LCDIRI=1 and the LCD reference ladder is in VLCD3 pin, allowing an external contrast control circuit Power mode ‘B’, the LCD internal FVR buffer is to use the internal reference divider. disabled. Note: The LCD module automatically turns on the Fixed Voltage Reference when needed. DS40001414E-page 338  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 27.7 LCD Multiplex Types 27.9 Pixel Control The LCD driver module can be configured into one of The LCDDATAx registers contain bits which define the four multiplex types: state of each pixel. Each bit defines one unique pixel. • Static (only COM0 is used) Register27-6 shows the correlation of each bit in the • 1/2 multiplex (COM<1:0> are used) LCDDATAx registers to the respective common and segment signals. • 1/3 multiplex (COM<2:0> are used) • 1/4 multiplex (COM<3:0> are used) Any LCD pixel location not being used for display can be used as general purpose RAM. The LMUX<1:0> bit setting of the LCDCON register decides which of the LCD common pins are used (see 27.10 LCD Frame Frequency Table27-4 for details). If the pin is a digital I/O, the corresponding TRIS bit The rate at which the COM and SEG outputs change is controls the data direction. If the pin is a COM drive, called the LCD frame frequency. then the TRIS setting of that pin is overridden. TABLE 27-5: FRAME FREQUENCY TABLE 27-4: COMMON PIN USAGE FORMULAS LMUX Multiplex Frame Frequency(2) = Multiplex COM3 COM2 COM1 COM0 <1:0> Static Clock source/(4 x (LCD Prescaler) x 32 x 1)) Static 00 Unused Unused Unused Active 1/2 Clock source/(2 x (LCD Prescaler) x 32 x 2)) 1/2 01 Unused Unused Active Active 1/3 Clock source/(1 x (LCD Prescaler) x 32 x 3)) 1/3 10 Unused Active Active Active 1/4 Clock source/(1 x (LCD Prescaler) x 32 x 4)) 1/4 11 Active Active Active Active Note 1: Clock source is FOSC/256, T1OSC or LFINTOSC. 27.8 Segment Enables 2: See Figure27-2. The LCDSEn registers are used to select the pin function for each segment pin. The selection allows TABLE 27-6: APPROXIMATE FRAME each pin to operate as either an LCD segment driver or FREQUENCY (IN Hz) USING as one of the pin’s alternate functions. To configure the pin as a segment pin, the corresponding bits in the FOSC @ 8 MHz, TIMER1 @ 32.768 kHz OR LFINTOSC LCDSEn registers must be set to ‘1’. If the pin is a digital I/O, the corresponding TRIS bit LP<3:0> Static 1/2 1/3 1/4 controls the data direction. Any bit set in the LCDSEn 2 122 122 162 122 registers overrides any bit settings in the corresponding TRIS register. 3 81 81 108 81 4 61 61 81 61 Note: On a Power-on Reset, these pins are configured as normal I/O, not LCD pins. 5 49 49 65 49 6 41 41 54 41 7 35 35 47 35  2010-2016 Microchip Technology Inc. DS40001414E-page 339

PIC16(L)F1946/47 TABLE 27-7: LCD SEGMENT MAPPING WORKSHEET LCD COM0 COM1 COM2 COM3 Function LCDDATAx LCD LCDDATAx LCD LCDDATAx LCD LCDDATAx LCD Address Segment Address Segment Address Segment Address Segment SEG0 LCDDATA0, 0 LCDDATA3, 0 LCDDATA6, 0 LCDDATA9, 0 SEG1 LCDDATA0, 1 LCDDATA3, 1 LCDDATA6, 1 LCDDATA9, 1 SEG2 LCDDATA0, 2 LCDDATA3, 2 LCDDATA6, 2 LCDDATA9, 2 SEG3 LCDDATA0, 3 LCDDATA3, 3 LCDDATA6, 3 LCDDATA9, 3 SEG4 LCDDATA0, 4 LCDDATA3, 4 LCDDATA6, 4 LCDDATA9, 4 SEG5 LCDDATA0, 5 LCDDATA3, 5 LCDDATA6, 5 LCDDATA9, 5 SEG6 LCDDATA0, 6 LCDDATA3, 6 LCDDATA6, 6 LCDDATA9, 6 SEG7 LCDDATA0, 7 LCDDATA3, 7 LCDDATA6, 7 LCDDATA9, 7 SEG8 LCDDATA1, 0 LCDDATA4, 0 LCDDATA7, 0 LCDDATA10, 0 SEG9 LCDDATA1, 1 LCDDATA4, 1 LCDDATA7, 1 LCDDATA10, 1 SEG10 LCDDATA1, 2 LCDDATA4, 2 LCDDATA7, 2 LCDDATA10, 2 SEG11 LCDDATA1, 3 LCDDATA4, 3 LCDDATA7, 3 LCDDATA10, 3 SEG12 LCDDATA1, 4 LCDDATA4, 4 LCDDATA7, 4 LCDDATA10, 4 SEG13 LCDDATA1, 5 LCDDATA4, 5 LCDDATA7, 5 LCDDATA10, 5 SEG14 LCDDATA1, 6 LCDDATA4, 6 LCDDATA7, 6 LCDDATA10, 6 SEG15 LCDDATA1, 7 LCDDATA4, 7 LCDDATA7, 7 LCDDATA10, 7 SEG16 LCDDATA2, 0 LCDDATA5, 0 LCDDATA8, 0 LCDDATA11, 0 SEG17 LCDDATA2, 1 LCDDATA5, 1 LCDDATA8, 1 LCDDATA11, 1 SEG18 LCDDATA2, 2 LCDDATA5, 2 LCDDATA8, 2 LCDDATA11, 2 SEG19 LCDDATA2, 3 LCDDATA5, 3 LCDDATA8, 3 LCDDATA11, 3 SEG20 LCDDATA2, 4 LCDDATA5, 4 LCDDATA8, 4 LCDDATA11, 4 SEG21 LCDDATA2, 5 LCDDATA5, 5 LCDDATA8, 5 LCDDATA11, 5 SEG22 LCDDATA2, 6 LCDDATA5, 6 LCDDATA8, 6 LCDDATA11, 6 SEG23 LCDDATA2, 7 LCDDATA5, 7 LCDDATA8, 7 LCDDATA11, 7 SEG24 LCDDATA12, 0 LCDDATA15, 0 LCDDATA18, 0 LCDDATA21, 0 SEG25 LCDDATA12, 1 LCDDATA15, 1 LCDDATA18, 1 LCDDATA21, 1 SEG26 LCDDATA12, 2 LCDDATA15, 2 LCDDATA18, 2 LCDDATA21, 2 SEG27 LCDDATA12, 3 LCDDATA15, 3 LCDDATA18, 3 LCDDATA21, 3 SEG28 LCDDATA12, 4 LCDDATA15, 4 LCDDATA18, 4 LCDDATA21, 4 SEG29 LCDDATA12, 5 LCDDATA15, 5 LCDDATA18, 5 LCDDATA21, 5 SEG30 LCDDATA12, 6 LCDDATA15, 6 LCDDATA18, 6 LCDDATA21, 6 SEG31 LCDDATA12, 7 LCDDATA15, 7 LCDDATA18, 7 LCDDATA21, 7 SEG32 LCDDATA13, 0 LCDDATA16, 0 LCDDATA19, 0 LCDDATA22, 0 SEG33 LCDDATA13, 1 LCDDATA16, 1 LCDDATA19, 1 LCDDATA22, 1 SEG34 LCDDATA13, 2 LCDDATA16, 2 LCDDATA19, 2 LCDDATA22, 2 SEG35 LCDDATA13, 3 LCDDATA16, 3 LCDDATA19, 3 LCDDATA22, 3 SEG36 LCDDATA13, 4 LCDDATA16, 4 LCDDATA19, 4 LCDDATA22, 4 SEG37 LCDDATA13, 5 LCDDATA16, 5 LCDDATA19, 5 LCDDATA22, 5 SEG38 LCDDATA13, 6 LCDDATA16, 6 LCDDATA19, 6 LCDDATA22, 6 SEG39 LCDDATA13, 7 LCDDATA16, 7 LCDDATA19, 7 LCDDATA22, 7 SEG40 LCDDATA14, 0 LCDDATA17, 0 LCDDATA20, 0 LCDDATA23, 0 SEG41 LCDDATA14, 1 LCDDATA17, 1 LCDDATA20, 1 LCDDATA23, 1 SEG42 LCDDATA14, 2 LCDDATA17, 2 LCDDATA20, 2 LCDDATA23, 2 SEG43 LCDDATA14, 3 LCDDATA17, 3 LCDDATA20, 3 LCDDATA23, 3 SEG44 LCDDATA14, 4 LCDDATA17, 4 LCDDATA20, 4 LCDDATA23, 4 SEG45 LCDDATA14, 5 LCDDATA17, 5 LCDDATA20, 5 LCDDATA23, 5 DS40001414E-page 340  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 27.11 LCD Waveform Generation The LCDs can be driven by two types of waveforms: Type-A and Type-B. In Type-A waveform, the phase LCD waveforms are generated so that the net AC changes within each common type, whereas in Type-B voltage across the dark pixel should be maximized and waveform, the phase changes on each frame the net AC voltage across the clear pixel should be boundary. Thus, Type-A waveform maintains 0VDC minimized. The net DC voltage across any pixel should over a single frame, whereas Type-B waveform takes be zero. two frames. The COM signal represents the time slice for each Note1: If Sleep has to be executed with LCD common, while the SEG contains the pixel data. Sleep disabled (LCDCON<SLPEN> is The pixel signal (COM-SEG) will have no DC ‘1’), then care must be taken to execute component and it can take only one of the two RMS Sleep only when VDC on all the pixels is values. The higher RMS value will create a dark pixel ‘0’. and a lower RMS value will create a clear pixel. 2: When the LCD clock source is FOSC/256, As the number of commons increases, the delta if Sleep is executed, irrespective of the between the two RMS values decreases. The delta LCDCON<SLPEN> setting, the LCD represents the maximum contrast that the display can immediately goes into Sleep. Thus, take have. care to see that VDC on all pixels is ‘0’ when Sleep is executed. Figure27-8 through Figure27-18 provide waveforms for static, half-multiplex, 1/3-multiplex and 1/4-multiplex drives for Type-A and Type-B waveforms. FIGURE 27-8: TYPE-A/TYPE-B WAVEFORMS IN STATIC DRIVE V 1 COM0 pin V COM0 0 V 1 SEG0 pin V 0 V 1 SEG1 pin V 0 V 1 COM0-SEG0 V0 segment voltage (active) -V1 COM0-SEG1 V 0 segment voltage 1 Frame (inactive) 76543 2 10 GGGGG G GG EEEEE E EE SSSSS S SS  2010-2016 Microchip Technology Inc. DS40001414E-page 341

PIC16(L)F1946/47 FIGURE 27-9: TYPE-A WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V 2 COM0 pin V COM1 1 V 0 V 2 COM1 pin V COM0 1 V 0 V 2 SEG0 pin V1 V 0 V 2 SEG1 pin V1 V 0 3 2 1 0 V G G G G 2 E E E E S S S S V 1 COM0-SEG0 V0 segment voltage (active) -V1 -V 2 V 2 V 1 COM0-SEG1 V0 segment voltage -V (inactive) 1 -V 2 1 Frame 1 Segment Time Note: 1 Frame = 2 single-segment times. DS40001414E-page 342  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-10: TYPE-B WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V COM1 2 COM0 pin V 1 V 0 COM0 V 2 COM1 pin V 1 V 0 V 2 SEG0 pin V 1 V 0 V 2 EG3 EG2 EG1 EG0SEG1 pin V1 S S S S V 0 V 2 V 1 COM0-SEG0 V0 segment voltage (active) -V1 -V 2 V 2 V 1 COM0-SEG1 V0 segment voltage -V (inactive) 1 -V 2 2 Frames 1 Segment Time Note: 1 Frame = 2 single-segment times.  2010-2016 Microchip Technology Inc. DS40001414E-page 343

PIC16(L)F1946/47 FIGURE 27-11: TYPE-A WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V 3 V 2 COM1 COM0 pin V 1 V 0 V 3 COM0 V 2 COM1 pin V 1 V 0 V 3 V 2 SEG0 pin V 1 V 0 V 3 V 2 3 2 1 0 SEG1 pin G G G G V E E E E 1 S S S S V 0 V 3 V 2 V 1 COM0-SEG0 V0 segment voltage (active) -V1 -V 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V0 segment voltage -V (inactive) 1 -V 2 1 Frame -V 3 1 Segment Time Note: 1 Frame = 2 single-segment times. DS40001414E-page 344  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-12: TYPE-B WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V 3 V COM1 2 COM0 pin V 1 V 0 V 3 COM0 V 2 COM1 pin V 1 V 0 V 3 V 2 SEG0 pin V 1 V 0 V 3 V 2 3 2 1 0 SEG1 pin G G G G V E E E E 1 S S S S V 0 V 3 V 2 V 1 COM0-SEG0 V0 segment voltage (active) -V1 -V 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V0 segment voltage -V (inactive) 1 2 Frames -V2 -V 3 1 Segment Time Note: 1 Frame = 2 single-segment times.  2010-2016 Microchip Technology Inc. DS40001414E-page 345

PIC16(L)F1946/47 FIGURE 27-13: TYPE-A WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V 2 COM0 pin V 1 V 0 V 2 COM2 COM1 pin V 1 V 0 COM1 V 2 COM0 COM2 pin V 1 V 0 V 2 SEG0 and V SEG2 pins 1 V 0 V 2 SEG1 pin V 1 2 1 0 V G G G 0 E E E S S S V 2 V 1 COM0-SEG0 V 0 segment voltage -V (inactive) 1 -V 2 V 2 V 1 COM0-SEG1 V 0 segment voltage -V (active) 1 -V 2 1 Frame 1 Segment Time Note: 1 Frame = 2 single-segment times. DS40001414E-page 346  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-14: TYPE-B WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V 2 COM0 pin V 1 V 0 COM2 V 2 COM1 pin V 1 COM1 V COM0 0 V 2 COM2 pin V 1 V 0 V 2 SEG0 pin V 1 V 2 1 0 0 G G G E E E S S S V 2 SEG1 pin V 1 V 0 V 2 V 1 COM0-SEG0 V 0 segment voltage -V (inactive) 1 -V 2 V 2 V 1 COM0-SEG1 V 0 segment voltage -V (active) 1 -V 2 2 Frames 1 Segment Time Note: 1 Frame = 2 single-segment times.  2010-2016 Microchip Technology Inc. DS40001414E-page 347

PIC16(L)F1946/47 FIGURE 27-15: TYPE-A WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V 3 V 2 COM0 pin V 1 V 0 COM2 V3 V 2 COM1 pin V 1 COM1 V COM0 0 V 3 V 2 COM2 pin V 1 V 0 V 3 V 2 SEG0 and V SEG2 pins 1 V 2 1 0 0 G G G E E E V S S S 3 V 2 SEG1 pin V 1 V 0 V 3 V 2 V 1 COM0-SEG0 V 0 segment voltage -V (inactive) 1 -V 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V 0 segment voltage -V (active) 1 -V 2 -V 3 1 Frame 1 Segment Time Note: 1 Frame = 2 single-segment times. DS40001414E-page 348  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-16: TYPE-B WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V 3 V 2 COM0 pin V 1 V 0 COM2 V3 V 2 COM1 pin V 1 COM1 V COM0 0 V 3 V 2 COM2 pin V 1 V 0 V 3 V 2 SEG0 pin V 1 V 2 1 0 0 G G G E E E V S S S 3 V 2 SEG1 pin V 1 V 0 V 3 V 2 V 1 COM0-SEG0 V 0 segment voltage -V (inactive) 1 -V 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V 0 segment voltage -V (active) 1 -V 2 -V 3 2 Frames 1 Segment Time Note: 1 Frame = 2 single-segment times.  2010-2016 Microchip Technology Inc. DS40001414E-page 349

PIC16(L)F1946/47 FIGURE 27-17: TYPE-A WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE COM3 V 3 V COM0 pin 2 V COM2 1 V 0 V 3 V COM1 pin 2 COM1 V1 V 0 COM0 V 3 V COM2 pin 2 V 1 V 0 V 3 V COM3 pin 2 V 1 V 0 V 3 V SEG0 pin 2 V 1 V 0 V 3 1 0 V EG EG SEG1 pin V21 S S V 0 V 3 V 2 V 1 COM0-SEG0 V0 segment voltage -V1 -V (active) 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V0 segment voltage -V1 -V (inactive) 2 -V 3 1 Frame 1 Segment Time Note: 1 Frame = 2 single-segment times. DS40001414E-page 350  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-18: TYPE-B WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE COM3 V 3 V COM0 pin 2 V 1 COM2 V 0 V 3 V COM1 pin 2 COM1 V1 V 0 COM0 V 3 V COM2 pin 2 V 1 V 0 V 3 V COM3 pin 2 V 1 V 0 V 3 V SEG0 pin 2 V 1 V 0 V 3 EG1 EG0 SEG1 pin VV21 S S V 0 V 3 V 2 V 1 COM0-SEG0 V0 segment voltage -V1 -V (active) 2 -V 3 V 3 V 2 V 1 COM0-SEG1 V0 segment voltage -V1 -V (inactive) 2 -V 2 Frames 3 1 Segment Time Note: 1 Frame = 2 single-segment times.  2010-2016 Microchip Technology Inc. DS40001414E-page 351

PIC16(L)F1946/47 27.12 LCD Interrupts The LCD module provides an interrupt in two cases. An interrupt when the LCD controller goes from active to inactive controller. An interrupt also provides unframed boundaries for Type B waveform. The LCD timing generation provides an interrupt that defines the LCD frame timing. 27.12.1 LCD INTERRUPT ON MODULE SHUTDOWN An LCD interrupt is generated when the module completes shutting down (LCDA goes from ‘1’ to ‘0’). 27.12.2 LCD FRAME INTERRUPTS A new frame is defined to begin at the leading edge of the COM0 common signal. The interrupt will be set immediately after the LCD controller completes access- ing all pixel data required for a frame. This will occur at a fixed interval before the frame boundary (TFINT), as shown in Figure27-19. The LCD controller will begin to access data for the next frame within the interval from the interrupt to when the controller begins to access data after the interrupt (TFWR). New data must be writ- ten within TFWR, as this is when the LCD controller will begin to access the data for the next frame. When the LCD driver is running with Type-B waveforms and the LMUX<1:0> bits are not equal to ‘00’ (static drive), there are some additional issues that must be addressed. Since the DC voltage on the pixel takes two frames to maintain zero volts, the pixel data must not change between subsequent frames. If the pixel data were allowed to change, the waveform for the odd frames would not necessarily be the complement of the waveform generated in the even frames and a DC component would be introduced into the panel. Therefore, when using Type-B waveforms, the user must synchronize the LCD pixel updates to occur within a subframe after the frame interrupt. To correctly sequence writing while in Type-B, the interrupt will only occur on complete phase intervals. If the user attempts to write when the write is disabled, the WERR bit of the LCDCON register is set and the write does not occur. Note: The LCD frame interrupt is not generated when the Type-A waveform is selected and when the Type-B with no multiplex (static) is selected. DS40001414E-page 352  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-19: WAVEFORMS AND INTERRUPT TIMING IN QUARTER-DUTY CYCLE DRIVE (EXAMPLE – TYPE-B, NON-STATIC) LCD Controller Accesses Interrupt Next Frame Data Occurs V 3 V 2 COM0 V 1 V 0 V 3 V 2 COM1 V 1 V 0 V 3 V 2 COM2 V 1 V 0 COM3 V3 V 2 V 1 V 0 2 Frames TFINT Frame Frame TFWR Frame Boundary Boundary Boundary TFWR = TFRAME/2*(LMUX<1:0> + 1) + TCY/2 TFINT = (TFWR/2 – (2 TCY + 40 ns)) minimum =1.5(TFRAME/4) – (2 TCY + 40 ns) (TFWR/2 – (1 TCY + 40 ns)) maximum=1.5(TFRAME/4) – (1 TCY + 40 ns)  2010-2016 Microchip Technology Inc. DS40001414E-page 353

PIC16(L)F1946/47 27.13 Operation During Sleep Table27-8 shows the status of the LCD module during a Sleep while using each of the three available clock The LCD module can operate during Sleep. The sources. selection is controlled by bit SLPEN of the LCDCON register. Setting the SLPEN bit allows the LCD module Note: When the LCDEN bit is cleared, the LCD to go to Sleep. Clearing the SLPEN bit allows the module will be disabled at the completion module to continue to operate during Sleep. of frame. At this time, the port pins will revert to digital functionality. To minimize If a SLEEP instruction is executed and SLPEN = 1, the power consumption due to floating digital LCD module will cease all functions and go into a very inputs, the LCD pins should be driven low low-current Consumption mode. The module will stop using the PORT and TRIS registers. operation immediately and drive the minimum LCD voltage on both segment and common lines. Figure27-20 shows this operation. If a SLEEP instruction is executed and SLPEN = 0, the The LCD module can be configured to operate during module will continue to display the current contents of Sleep. The selection is controlled by bit SLPEN of the the LCDDATA registers. To allow the module to LCDCON register. Clearing SLPEN and correctly con- continue operation while in Sleep, the clock source figuring the LCD module clock will allow the LCD mod- must be either the LFINTOSC or T1OSC external ule to operate during Sleep. Setting SLPEN and oscillator. While in Sleep, the LCD data cannot be correctly executing the LCD module shutdown will changed. The LCD module current consumption will disable the LCD module during Sleep and save power. not decrease in this mode; however, the overall consumption of the device will be lower due to shut If a SLEEP instruction is executed and SLPEN = 1, the down of the core and other peripheral functions. LCD module will immediately cease all functions, drive the outputs to VSS and go into a very low-current mode. Table27-8 below shows the status of the LCD module The SLEEP instruction should only be executed after during Sleep, using each of the three available clock the LCD module has been disabled and the current sources. cycle completed, thus ensuring that there are no DC voltages on the glass. To disable the LCD module, TABLE 27-8: LCD MODULE STATUS clear the LCDEN bit. The LCD module will complete the DURING SLEEP disabling process after the current frame, clear the LCDA bit and optionally cause an interrupt. Operational Clock Source SLPEN The steps required to properly enter Sleep with the During Sleep LCD disabled are: 0 Yes T1OSC • Clear LCDEN 1 No • Wait for LCDA = 0 either by polling or by interrupt 0 Yes LFINTOSC • Execute SLEEP 1 No If SLPEN = 0 and SLEEP is executed while the LCD 0 No module clock source is FOSC/4, then the LCD module FOSC/4 1 No will halt with the pin driving the last LCD voltage pat- tern. Prolonged exposure to a fixed LCD voltage pat- tern will cause damage to the LCD glass. To prevent Note: The LFINTOSC or external T1OSC LCD glass damage, either perform the proper LCD oscillator must be used to operate the module shutdown prior to Sleep, or change the LCD LCD module during Sleep. module clock to allow the LCD module to continue operation during Sleep. If LCD interrupts are being generated (Type-B waveform with a multiplex mode not static) and If a SLEEP instruction is executed and SLPEN = 0 and LCDIE = 1, the device will awaken from Sleep on the the LCD module clock is either T1OSC or LFINTOSC, next frame boundary. the module will continue to display the current contents of the LCDDATA registers. While in Sleep, the LCD data cannot be changed. If the LCDIE bit is set, the device will wake from Sleep on the next LCD frame boundary. The LCD module current consumption will not decrease in this mode; however, the overall device power consumption will be lower due to the shutdown of the CPU and other peripherals. DS40001414E-page 354  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 27-20: SLEEP ENTRY/EXIT WHEN SLPEN = 1 V 3 V 2 V 1 COM0 V 0 V 3 V 2 V 1 COM1 V0 V 3 V 2 V 1 COM2 V0 V 3 V 2 V 1 SEG0 V 0 2 Frames SLEEP Instruction Execution Wake-up  2010-2016 Microchip Technology Inc. DS40001414E-page 355

PIC16(L)F1946/47 27.14 Configuring the LCD Module 27.16 LCD Current Consumption The following is the sequence of steps to configure the When using the LCD module, the current consumption LCD module. consists of the following three factors: 1. Select the frame clock prescale using bits • Oscillator Selection LP<3:0> of the LCDPS register. • LCD Bias Source 2. Configure the appropriate pins to function as • Capacitance of the LCD segments segment drivers using the LCDSEn registers. The current consumption of the LCD module only can 3. Configure the LCD module for the following be considered negligible compared to these other using the LCDCON register: factors. - Multiplex and Bias mode, bits LMUX<1:0> - Timing source, bits CS<1:0> 27.16.1 OSCILLATOR SELECTION - Sleep mode, bit SLPEN The current consumed by the clock source selected 4. Write initial values to pixel data registers, must be considered when using the LCD module. See LCDDATA0 through LCDDATA23. Section30.0 “Electrical Specifications” for oscillator 5. Clear LCD Interrupt Flag, LCDIF bit of the PIR2 current consumption information. register and if desired, enable the interrupt by 27.16.2 LCD BIAS SOURCE setting bit LCDIE of the PIE2 register. 6. Configure bias voltages by setting the LCDRL, The LCD bias source, internal or external, can LCDREF and the associated ANSELx contribute significantly to the current consumption. Use registers as needed. the highest possible resistor values while maintaining contrast to minimize current. 7. Enable the LCD module by setting bit LCDEN of the LCDCON register. 27.16.3 CAPACITANCE OF THE LCD SEGMENTS 27.15 Disabling the LCD Module The LCD segments which can be modeled as To disable the LCD module, write all ‘0’s to the capacitors must be both charged and discharged every LCDCON register. frame. The size of the LCD segment and its technology determine the segment’s capacitance. DS40001414E-page 356  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 27-9: SUMMARY OF REGISTERS ASSOCIATED WITH LCD OPERATION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 90 LCDCON LCDEN SLPEN WERR — CS<1:0> LMUX<1:0> 326 LCDCST — — — — — LCDCST<2:0> 329 LCDDATA0 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 330 COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA1 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 330 COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA2 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 330 COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA3 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 330 COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA4 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 330 COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA5 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 330 COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA6 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 330 COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA7 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 330 COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA8 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 330 COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA9 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 330 COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 LCDDATA10 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 330 COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 LCDDATA11 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 330 COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 LCDDATA12 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 330 COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA13 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 330 COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA14 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 330 COM0 COM0 COM0 COM0 COM0 COM0 LCDDATA15 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 330 COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA16 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 330 COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA17 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 330 COM1 COM1 COM1 COM1 COM1 COM1 LCDDATA18 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 330 COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA19 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 330 COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA20 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 330 COM2 COM2 COM2 COM2 COM2 COM2 LCDDATA21 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 330 COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the LCD module.  2010-2016 Microchip Technology Inc. DS40001414E-page 357

PIC16(L)F1946/47 TABLE 27-9: SUMMARY OF REGISTERS ASSOCIATED WITH LCD OPERATION (CONTINUED) Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page LCDDATA22 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 330 COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3 LCDDATA23 — — SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 330 COM3 COM3 COM3 COM3 COM3 COM3 LCDPS WFT BIASMD LCDA WA LP<3:0> 327 LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — 328 LCDRL LRLAP<1:0> LRLBP<1:0> — LRLAT<2:0> 337 LCDSE0 SE<7:0> 330 LCDSE1 SE<15:8> 330 LCDSE2 SE<23:16> 330 LCDSE3 SE<31:24> 330 LCDSE4 SE<39:32> 330 LCDSE5 — — SE<45:40> 330 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE C3IE CCP2IE 92 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF C3IF CCP2IF 96 T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC — TMR1ON 197 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the LCD module. DS40001414E-page 358  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 28.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) ICSP™ programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP™ programming: • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS In Program/Verify mode the program memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSP™ refer to the PIC16F193X/LF193X/PIC16F194X/LF194X/PIC16LF 190X Memory Programming Specification (DS41397). 28.1 High-Voltage Programming Entry Mode The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low then raising the voltage on MCLR/VPP to VIHH. Some programmers produce VPP greater than VIHH (9.0V), an external circuit is required to limit the VPP voltage. See Figure28-1 for example circuit. FIGURE 28-1: VPP LIMITER EXAMPLE CIRCUIT RJ11-6PIN 1 6 VPP 2 5 VDD 3 4 VSS 4 3 ICSP_DATA 5 2 ICSP_CLOCK 6 1 NC RJ11-6PIN R1 To MPLAB® ICD 2 To Target Board 270 Ohm LM431BCMX 23 A U1 K1 A 6 A NC4 7 A NC5 VREF 8 R2 R3 10k 1% 24k 1% Note: The MPLAB® ICD 2 produces a VPP voltage greater than the maximum VPP specification of the PIC16(L)F1946/47.  2010-2016 Microchip Technology Inc. DS40001414E-page 359

PIC16(L)F1946/47 28.2 Low-Voltage Programming Entry FIGURE 28-2: ICD RJ-11 STYLE Mode CONNECTOR INTERFACE The Low-Voltage Programming Entry mode allows the PIC® Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Words is set to ‘1’, the low-voltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP ICSPDAT mode, the LVP bit must be programmed to ‘0’. VDD 2 4 6 NC ICSPCLK Entry into the Low-Voltage Programming Entry mode 1 3 5 Target requires the following steps: VPP/MCLR VSS PC Board 1. MCLR is brought to VIL. Bottom Side 2. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Pin Description* Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be 1 = VPP/MCLR maintained. 2 = VDD Target If low-voltage programming is enabled (LVP = 1), the 3 = VSS (ground) MCLR Reset function is automatically enabled and 4 = ICSPDAT cannot be disabled. See Section6.4 “MCLR” for more 5 = ICSPCLK information. 6 = No Connect The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. Another connector often found in use with the PICkit™ 28.3 Common Programming Interfaces programmers is a standard 6-pin header with 0.1inch spacing. Refer to Figure28-3. Connection to a target device is typically done through an ICSP™ header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6-pin, 6 connector) configuration. See Figure28-2. FIGURE 28-3: PICKit™ PROGRAMMER STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 1 = VPP/MCLR 2 2 = VDD Target 3 4 3 = VSS (ground) 5 4 = ICSPDAT 6 5 = ICSPCLK 6 = No Connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins. DS40001414E-page 360  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure28-4 for more information. FIGURE 28-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING External Programming VDD Device to be Signals Programmed VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required).  2010-2016 Microchip Technology Inc. DS40001414E-page 361

PIC16(L)F1946/47 29.0 INSTRUCTION SET SUMMARY 29.1 Read-Modify-Write Operations Each instruction is a 14-bit word containing the Any instruction that specifies a file register as part of operation code (opcode) and all required operands. the instruction performs a Read-Modify-Write (R-M-W) The opcodes are broken into three broad categories. operation. The register is read, the data is modified, and the result is stored according to either the instruc- • Byte Oriented tion, or the destination designator ‘d’. A read operation • Bit Oriented is performed on a register even if the instruction writes • Literal and Control to that register. The literal and control category contains the most varied instruction word format. TABLE 29-1: OPCODE FIELD Table29-3 lists the instructions recognized by the DESCRIPTIONS MPASMTM assembler. Field Description All instructions are executed within a single instruction f Register file address (0x00 to 0x7F) cycle, with the following exceptions, which may take two or three cycles: W Working register (accumulator) • Subroutine takes two cycles (CALL, CALLW) b Bit address within an 8-bit file register • Returns from interrupts or subroutines take two k Literal field, constant data or label cycles (RETURN, RETLW, RETFIE) x Don’t care location (= 0 or 1). • Program branching takes two cycles (GOTO, BRA, The assembler will generate code with x = 0. BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) It is the recommended form of use for • One additional instruction cycle will be used when compatibility with all Microchip software tools. any instruction references an indirect file register and the file select register is pointing to program d Destination select; d = 0: store result in W, memory. d = 1: store result in file register f. Default is d = 1. One instruction cycle consists of four oscillator cycles; n FSR or INDF number. (0-1) for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. mm Pre-post increment-decrement mode selection All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. TABLE 29-2: ABBREVIATION DESCRIPTIONS Field Description PC Program Counter TO Time-out bit C Carry bit DC Digit carry bit Z Zero bit PD Power-down bit DS40001414E-page 362  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 29-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 0 OPCODE d f (FILE #) d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value MOVLP instruction only 13 7 6 0 OPCODE k (literal) k = 7-bit immediate value MOVLB instruction only 13 5 4 0 OPCODE k (literal) k = 5-bit immediate value BRA instruction only 13 9 8 0 OPCODE k (literal) k = 9-bit immediate value FSR Offset instructions 13 7 6 5 0 OPCODE n k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 3 2 1 0 OPCODE n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE  2010-2016 Microchip Technology Inc. DS40001414E-page 363

PIC16(L)F1946/47 TABLE 29-3: PIC16(L)F1946/47 INSTRUCTION SET 14-Bit Opcode Mnemonic, Status Description Cycles Notes Operands Affected MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF f, d Add W and f 1 00 0111 dfff ffff C, DC, Z 2 ADDWFC f, d Add with Carry W and f 1 11 1101 dfff ffff C, DC, Z 2 ANDWF f, d AND W with f 1 00 0101 dfff ffff Z 2 ASRF f, d Arithmetic Right Shift 1 11 0111 dfff ffff C, Z 2 LSLF f, d Logical Left Shift 1 11 0101 dfff ffff C, Z 2 LSRF f, d Logical Right Shift 1 11 0110 dfff ffff C, Z 2 CLRF f Clear f 1 00 0001 lfff ffff Z 2 CLRW – Clear W 1 00 0001 0000 00xx Z COMF f, d Complement f 1 00 1001 dfff ffff Z 2 DECF f, d Decrement f 1 00 0011 dfff ffff Z 2 INCF f, d Increment f 1 00 1010 dfff ffff Z 2 IORWF f, d Inclusive OR W with f 1 00 0100 dfff ffff Z 2 MOVF f, d Move f 1 00 1000 dfff ffff Z 2 MOVWF f Move W to f 1 00 0000 1fff ffff 2 RLF f, d Rotate Left f through Carry 1 00 1101 dfff ffff C 2 RRF f, d Rotate Right f through Carry 1 00 1100 dfff ffff C 2 SUBWF f, d Subtract W from f 1 00 0010 dfff ffff C, DC, Z 2 SUBWFB f, d Subtract with Borrow W from f 1 11 1011 dfff ffff C, DC, Z 2 SWAPF f, d Swap nibbles in f 1 00 1110 dfff ffff 2 XORWF f, d Exclusive OR W with f 1 00 0110 dfff ffff Z 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ f, d Decrement f, Skip if 0 1(2) 00 1011 dfff ffff 1, 2 INCFSZ f, d Increment f, Skip if 0 1(2) 00 1111 dfff ffff 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF f, b Bit Clear f 1 01 00bb bfff ffff 2 BSF f, b Bit Set f 1 01 01bb bfff ffff 2 BIT-ORIENTED SKIP OPERATIONS BTFSC f, b Bit Test f, Skip if Clear 1 (2) 01 10bb bfff ffff 1, 2 BTFSS f, b Bit Test f, Skip if Set 1 (2) 01 11bb bfff ffff 1, 2 LITERAL OPERATIONS ADDLW k Add literal and W 1 11 1110 kkkk kkkk C, DC, Z ANDLW k AND literal with W 1 11 1001 kkkk kkkk Z IORLW k Inclusive OR literal with W 1 11 1000 kkkk kkkk Z MOVLB k Move literal to BSR 1 00 0000 001k kkkk MOVLP k Move literal to PCLATH 1 11 0001 1kkk kkkk MOVLW k Move literal to W 1 11 0000 kkkk kkkk SUBLW k Subtract W from literal 1 11 1100 kkkk kkkk C, DC, Z XORLW k Exclusive OR literal with W 1 11 1010 kkkk kkkk Z Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. DS40001414E-page 364  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 29-3: PIC16(L)F1946/47 ENHANCED INSTRUCTION SET (CONTINUED) Mnemonic, 14-Bit Opcode Status Description Cycles Notes Operands MSb LSb Affected CONTROL OPERATIONS BRA k Relative Branch 2 11 001k kkkk kkkk BRW – Relative Branch with W 2 00 0000 0000 1011 CALL k Call Subroutine 2 10 0kkk kkkk kkkk CALLW – Call Subroutine with W 2 00 0000 0000 1010 GOTO k Go to address 2 10 1kkk kkkk kkkk RETFIE k Return from interrupt 2 00 0000 0000 1001 RETLW k Return with literal in W 2 11 0100 kkkk kkkk RETURN – Return from Subroutine 2 00 0000 0000 1000 INHERENT OPERATIONS CLRWDT – Clear Watchdog Timer 1 00 0000 0110 0100 TO, PD NOP – No Operation 1 00 0000 0000 0000 OPTION – Load OPTION_REG register with W 1 00 0000 0110 0010 RESET – Software device Reset 1 00 0000 0000 0001 SLEEP – Go into Standby mode 1 00 0000 0110 0011 TO, PD TRIS f Load TRIS register with W 1 00 0000 0110 0fff C-COMPILER OPTIMIZED ADDFSR n, k Add Literal k to FSRn 1 11 0001 0nkk kkkk MOVIW n mm Move Indirect FSRn to W with pre/post inc/dec 1 00 0000 0001 0nmm Z 2, 3 modifier, mm k[n] Move INDFn to W, Indexed Indirect. 1 11 1111 0nkk kkkk Z 2 MOVWI n mm Move W to Indirect FSRn with pre/post inc/dec 1 00 0000 0001 1nmm 2, 3 modifier, mm k[n] Move W to INDFn, Indexed Indirect. 1 11 1111 1nkk kkkk 2 Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions.  2010-2016 Microchip Technology Inc. DS40001414E-page 365

PIC16(L)F1946/47 29.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW k Operands: -32  k  31 Operands: 0  k  255 n  [ 0, 1] Operation: (W) .AND. (k)  (W) Operation: FSR(n) + k  FSR(n) Status Affected: Z Status Affected: None Description: The contents of W register are Description: The signed 6-bit literal ‘k’ is added to AND’ed with the 8-bit literal ‘k’. The the contents of the FSRnH:FSRnL result is placed in the W register. register pair. FSRn is limited to the range 0000h - FFFFh. Moving beyond these bounds will cause the FSR to wrap around. ADDLW Add literal and W ANDWF AND W with f Syntax: [ label ] ADDLW k Syntax: [ label ] ANDWF f,d Operands: 0  k  255 Operands: 0  f  127 d 0,1 Operation: (W) + k  (W) Operation: (W) .AND. (f)  (destination) Status Affected: C, DC, Z Status Affected: Z Description: The contents of the W register are added to the 8-bit literal ‘k’ and the Description: AND the W register with register ‘f’. If result is placed in the W register. ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWF Add W and f ASRF Arithmetic Right Shift Syntax: [ label ] ADDWF f,d Syntax: [ label ] ASRF f {,d} Operands: 0  f  127 Operands: 0  f  127 d 0,1 d [0,1] Operation: (W) + (f)  (destination) Operation: (f<7>) dest<7> (f<7:1>)  dest<6:0>, Status Affected: C, DC, Z (f<0>)  C, Description: Add the contents of the W register Status Affected: C, Z with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the Description: The contents of register ‘f’ are shifted result is stored back in register ‘f’. one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in reg- ister ‘f’. ADDWFC ADD W and CARRY bit to f register f C Syntax: [ label ] ADDWFC f {,d} Operands: 0  f  127 d [0,1] Operation: (W) + (f) + (C)  dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data mem- ory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. DS40001414E-page 366  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 BCF Bit Clear f BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BCF f,b Syntax: [ label ] BTFSC f,b Operands: 0  f  127 Operands: 0  f  127 0  b  7 0  b  7 Operation: 0  (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label Syntax: [ label ] BTFSS f,b [ label ] BRA $+k Operands: 0  f  127 Operands: -256label-PC+1255 0  b < 7 -256  k  255 Operation: skip if (f<b>) = 1 Operation: (PC) + 1 + k  PC Status Affected: None Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next Description: Add the signed 9-bit literal ‘k’ to the instruction is executed. PC. Since the PC will have incre- If bit ‘b’ is ‘1’, then the next mented to fetch the next instruction, instruction is discarded and a NOP is the new address will be PC+1+k. executed instead, making this a This instruction is a 2-cycle instruc- 2-cycle instruction. tion. This branch has a limited range. BRW Relative Branch with W Syntax: [ label ] BRW Operands: None Operation: (PC) + (W)  PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incre- mented to fetch the next instruction, the new address will be PC+1+(W). This instruction is a 2-cycle instruc- tion. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0  f  127 0  b  7 Operation: 1  (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set.  2010-2016 Microchip Technology Inc. DS40001414E-page 367

PIC16(L)F1946/47 CALL Call Subroutine CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0  k  2047 Operands: None Operation: (PC)+ 1 TOS, Operation: 00h  WDT k  PC<10:0>, 0  WDT prescaler, (PCLATH<6:3>)  PC<14:11> 1  TO Status Affected: None 1  PD Description: Call Subroutine. First, return address Status Affected: TO, PD (PC + 1) is pushed onto the stack. Description: CLRWDT instruction resets the Watch- The 11-bit immediate address is dog Timer. It also resets the prescaler loaded into PC bits <10:0>. The upper of the WDT. bits of the PC are loaded from Status bits TO and PD are set. PCLATH. CALL is a 2-cycle instruc- tion. CALLW Subroutine Call With W COMF Complement f Syntax: [ label ] CALLW Syntax: [ label ] COMF f,d Operands: None Operands: 0  f  127 d  [0,1] Operation: (PC) +1  TOS, (W)  PC<7:0>, Operation: (f)  (destination) (PCLATH<6:0>) PC<14:8> Status Affected: Z Description: The contents of register ‘f’ are com- Status Affected: None plemented. If ‘d’ is ‘0’, the result is Description: Subroutine call with W. First, the stored in W. If ‘d’ is ‘1’, the result is return address (PC + 1) is pushed stored back in register ‘f’. onto the return stack. Then, the con- tents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a 2-cycle instruction. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF f Syntax: [ label ] DECF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] Operation: 00h  (f) 1  Z Operation: (f) - 1  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared Description: Decrement register ‘f’. If ‘d’ is ‘0’, the and the Z bit is set. result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W) 1  Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS40001414E-page 368  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] INCFSZ f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) - 1  (destination); Operation: (f) + 1  (destination), skip if result = 0 skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decre- Description: The contents of register ‘f’ are incre- mented. If ‘d’ is ‘0’, the result is placed mented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. is placed back in register ‘f’. If the result is ‘1’, the next instruction is If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a executed. If the result is ‘0’, a NOP is NOP is executed instead, making it a executed instead, making it a 2-cycle 2-cycle instruction. instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] GOTO k Syntax: [ label ] IORLW k Operands: 0  k  2047 Operands: 0  k  255 Operation: k  PC<10:0> Operation: (W) .OR. k  (W) PCLATH<6:3>  PC<14:11> Status Affected: Z Status Affected: None Description: The contents of the W register are Description: GOTO is an unconditional branch. The OR’ed with the 8-bit literal ‘k’. The 11-bit immediate value is loaded into result is placed in the W register. PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a 2-cycle instruction. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] INCF f,d Syntax: [ label ] IORWF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) + 1  (destination) Operation: (W) .OR. (f)  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incre- Description: Inclusive OR the W register with regis- mented. If ‘d’ is ‘0’, the result is placed ter ‘f’. If ‘d’ is ‘0’, the result is placed in in the W register. If ‘d’ is ‘1’, the result the W register. If ‘d’ is ‘1’, the result is is placed back in register ‘f’. placed back in register ‘f’.  2010-2016 Microchip Technology Inc. DS40001414E-page 369

PIC16(L)F1946/47 LSLF Logical Left Shift MOVF Move f Syntax: [ label ] LSLF f {,d} Syntax: [ label ] MOVF f,d Operands: 0  f  127 Operands: 0  f  127 d [0,1] d  [0,1] Operation: (f<7>)  C Operation: (f)  (dest) (f<6:0>)  dest<7:1> Status Affected: Z 0  dest<0> Description: The contents of register f is moved to Status Affected: C, Z a destination dependent upon the Description: The contents of register ‘f’ are shifted status of d. If d = 0, one bit to the left through the Carry flag. destination is W register. If d = 1, the A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’, destination is file register f itself. d = 1 the result is placed in W. If ‘d’ is ‘1’, the is useful to test a file register since result is stored back in register ‘f’. status flag Z is affected. Words: 1 C register f 0 Cycles: 1 Example: MOVF FSR, 0 After Instruction LSRF Logical Right Shift W = value in FSR register Syntax: [ label ] LSRF f {,d} Z = 1 Operands: 0  f  127 d [0,1] Operation: 0  dest<7> (f<7:1>)  dest<6:0>, (f<0>)  C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. A ‘0’ is shifted into the MSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 0 register f C DS40001414E-page 370  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 MOVIW Move INDFn to W MOVLP Move literal to PCLATH Syntax: [ label ] MOVIW ++FSRn Syntax: [ label ] MOVLP k [ label ] MOVIW --FSRn Operands: 0  k  127 [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-- Operation: k  PCLATH [ label ] MOVIW k[FSRn] Status Affected: None Operands: n  [0,1] Description: The 7-bit literal ‘k’ is loaded into the mm  [00,01, 10, 11] PCLATH register. -32  k  31 Operation: INDFn  W Effective address is determined by MOVLW Move literal to W • FSR + 1 (preincrement) Syntax: [ label ] MOVLW k • FSR - 1 (predecrement) • FSR + k (relative offset) Operands: 0  k  255 After the Move, the FSR value will be Operation: k  (W) either: • FSR + 1 (all increments) Status Affected: None • FSR - 1 (all decrements) Description: The 8-bit literal ‘k’ is loaded into W reg- • Unchanged ister. The “don’t cares” will assemble as Status Affected: Z ‘0’s. Words: 1 Mode Syntax mm Cycles: 1 Preincrement ++FSRn 00 Example: MOVLW 0x5A Predecrement --FSRn 01 After Instruction W = 0x5A Postincrement FSRn++ 10 Postdecrement FSRn-- 11 MOVWF Move W to f Syntax: [ label ] MOVWF f Description: This instruction is used to move data between W and one of the indirect Operands: 0  f  127 registers (INDFn). Before/after this Operation: (W)  (f) move, the pointer (FSRn) is updated by Status Affected: None pre/post incrementing/decrementing it. Description: Move data from W register to register Note: The INDFn registers are not ‘f’. physical registers. Any instruction that Words: 1 accesses an INDFn register actually accesses the register at the address Cycles: 1 specified by the FSRn. Example: MOVWF OPTION_REG Before Instruction FSRn is limited to the range 0000h - OPTION_REG = 0xFF FFFFh. Incrementing/decrementing it W = 0x4F beyond these bounds will cause it to wrap After Instruction around. OPTION_REG = 0x4F W = 0x4F MOVLB Move literal to BSR Syntax: [ label ] MOVLB k Operands: 0  k  15 Operation: k  BSR Status Affected: None Description: The 5-bit literal ‘k’ is loaded into the Bank Select Register (BSR).  2010-2016 Microchip Technology Inc. DS40001414E-page 371

PIC16(L)F1946/47 MOVWI Move W to INDFn NOP No Operation Syntax: [ label ] NOP Syntax: [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn Operands: None [ label ] MOVWI FSRn++ Operation: No operation [ label ] MOVWI FSRn-- [ label ] MOVWI k[FSRn] Status Affected: None Operands: n  [0,1] Description: No operation. mm  [00,01, 10, 11] Words: 1 -32  k  31 Cycles: 1 Operation: W  INDFn Example: NOP Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be Load OPTION_REG Register either: OPTION with W • FSR + 1 (all increments) • FSR - 1 (all decrements) Syntax: [ label ] OPTION Unchanged Operands: None Status Affected: None Operation: (W)  OPTION_REG Status Affected: None Mode Syntax mm Description: Move data from W register to Preincrement ++FSRn 00 OPTION_REG register. Predecrement --FSRn 01 Postincrement FSRn++ 10 Words: 1 Postdecrement FSRn-- 11 Cycles: 1 Example: OPTION Description: This instruction is used to move data Before Instruction between W and one of the indirect OPTION_REG = 0xFF registers (INDFn). Before/after this W = 0x4F move, the pointer (FSRn) is updated by After Instruction pre/post incrementing/decrementing it. OPTION_REG = 0x4F W = 0x4F Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually RESET Software Reset accesses the register at the address specified by the FSRn. Syntax: [ label ] RESET Operands: None FSRn is limited to the range 0000h - FFFFh. Incrementing/decrementing it Operation: Execute a device Reset. Resets the beyond these bounds will cause it to wrap nRI flag of the PCON register. around. Status Affected: None Description: This instruction provides a way to The increment/decrement operation on execute a hardware Reset by soft- FSRn WILL NOT affect any Status bits. ware. DS40001414E-page 372  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 RETFIE Return from Interrupt RETURN Return from Subroutine Syntax: [ label ] RETFIE Syntax: [ label ] RETURN Operands: None Operands: None Operation: TOS  PC, Operation: TOS  PC 1  GIE Status Affected: None Status Affected: None Description: Return from subroutine. The stack is Description: Return from Interrupt. Stack is POPed POPed and the top of the stack (TOS) and Top-of-Stack (TOS) is loaded in is loaded into the program counter. the PC. Interrupts are enabled by This is a 2-cycle instruction. setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a 2-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = TOS GIE = 1 RETLW Return with literal in W RLF Rotate Left f through Carry Syntax: [ label ] RETLW k Syntax: [ label ] RLF f,d Operands: 0  k  255 Operands: 0  f  127 Operation: k  (W); d  [0,1] TOS  PC Operation: See description below Status Affected: None Status Affected: C Description: The W register is loaded with the 8-bit literal ‘k’. The program counter is Description: The contents of register ‘f’ are rotated loaded from the top of the stack (the one bit to the left through the Carry return address). This is a 2-cycle flag. If ‘d’ is ‘0’, the result is placed in instruction. the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Words: 1 C Register f Cycles: 2 Example: CALL TABLE;W contains table Words: 1 ;offset value Cycles: 1 • ;W now has table value TABLE • Example: RLF REG1,0 • Before Instruction ADDWF PC ;W = offset REG1 = 1110 0110 RETLW k1 ;Begin table C = 0 RETLW k2 ; After Instruction • REG1 = 1110 0110 • W = 1100 1100 • C = 1 RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W = value of k8  2010-2016 Microchip Technology Inc. DS40001414E-page 373

PIC16(L)F1946/47 SUBLW Subtract W from literal RRF Rotate Right f through Carry Syntax: [ label ] SUBLW k Syntax: [ label ] RRF f,d Operands: 0 k 255 Operands: 0  f  127 d  [0,1] Operation: k - (W) W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: The W register is subtracted (2’s com- plement method) from the 8-bit literal Description: The contents of register ‘f’ are rotated ‘k’. The result is placed in the W regis- one bit to the right through the Carry ter. flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is C = 0 W  k placed back in register ‘f’. C = 1 W  k C Register f DC = 0 W<3:0>  k<3:0> DC = 1 W<3:0>  k<3:0> SLEEP Enter Sleep mode SUBWF Subtract W from f Syntax: [ label ] SLEEP Syntax: [ label ] SUBWF f,d Operands: None Operands: 0 f 127 d  [0,1] Operation: 00h  WDT, 0  WDT prescaler, Operation: (f) - (W) destination) 1  TO, Status Affected: C, DC, Z 0  PD Description: Subtract (2’s complement method) W Status Affected: TO, PD register from register ‘f’. If ‘d’ is ‘0’, the Description: The power-down Status bit, PD is result is stored in the W cleared. Time-out Status bit, TO is register. If ‘d’ is ‘1’, the result is stored set. Watchdog Timer and its pres- back in register ‘f. caler are cleared. The processor is put into Sleep mode C = 0 W  f with the oscillator stopped. C = 1 W  f DC = 0 W<3:0>  f<3:0> DC = 1 W<3:0>  f<3:0> SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d} Operands: 0  f  127 d  [0,1] Operation: (f) – (W) – (B) dest Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register ‘f’ (2’s comple- ment method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS40001414E-page 374  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W Syntax: [ label ] SWAPF f,d Syntax: [ label ] XORLW k Operands: 0  f  127 Operands: 0 k 255 d  [0,1] Operation: (W) .XOR. k W) Operation: (f<3:0>)  (destination<7:4>), Status Affected: Z (f<7:4>)  (destination<3:0>) Description: The contents of the W register are Status Affected: None XOR’ed with the 8-bit Description: The upper and lower nibbles of regis- literal ‘k’. The result is placed in the ter ‘f’ are exchanged. If ‘d’ is ‘0’, the W register. result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. TRIS Load TRIS Register with W XORWF Exclusive OR W with f Syntax: [ label ] TRIS f Syntax: [ label ] XORWF f,d Operands: 5  f  7 Operands: 0  f  127 d  [0,1] Operation: (W)  TRIS register ‘f’ Operation: (W) .XOR. (f) destination) Status Affected: None Status Affected: Z Description: Move data from W register to TRIS register. Description: Exclusive OR the contents of the W When ‘f’ = 5, TRISA is loaded. register with register ‘f’. If ‘d’ is ‘0’, the When ‘f’ = 6, TRISB is loaded. result is stored in the W register. If ‘d’ When ‘f’ = 7, TRISC is loaded. is ‘1’, the result is stored back in regis- ter ‘f’.  2010-2016 Microchip Technology Inc. DS40001414E-page 375

PIC16(L)F1946/47 30.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias.......................................................................................................-40°C to +125°C Storage temperature........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS, PIC16F1946/47 ........................................................................ -0.3V to +6.5V Voltage on VCAP pin with respect to VSS..............................................................................................-0.3V to +4.0V Voltage on VDD with respect to VSS, PIC16LF1946/47 ...................................................................... -0.3V to +4.0V Voltage on MCLR with respect to Vss .................................................................................................-0.3V to +9.0V Voltage on all other pins with respect to VSS ............................................................................-0.3V to (VDD + 0.3V) Total power dissipation(1)...............................................................................................................................800 mW Maximum current out of VSS pin, -40°C  TA  +85°C for industrial............................................................... 350 mA Maximum current out of VSS pin, -40°C  TA  +125°C for extended............................................................ 120 mA Maximum current into VDD pin, -40°C  TA  +85°C for industrial.................................................................. 350 mA Maximum current into VDD pin, -40°C  TA  +125°C for extended............................................................... 120 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA Maximum output current sunk by any I/O pin....................................................................................................50 mA Maximum output current sourced by any I/O pin...............................................................................................50 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DS40001414E-page 376  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.1 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: VDDMIN VDD VDDMAX Operating Temperature: TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC16LF1946/47 VDDMIN (FOSC  16 MHz)......................................................................................................... +1.8V VDDMIN (FOSC  32 MHz)......................................................................................................... +2.5V VDDMAX ................................................................................................................................... +3.6V PIC16F1946/47 VDDMIN (FOSC  16 MHz)......................................................................................................... +2.3V VDDMIN (FOSC  32 MHz)......................................................................................................... +2.5V VDDMAX ................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................... +85°C Extended Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................. +125°C Note 1: See Parameter D001, DS Characteristics: Supply Voltage.  2010-2016 Microchip Technology Inc. DS40001414E-page 377

PIC16(L)F1946/47 FIGURE 30-1: PIC16F1946/47 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C 5.5 ) V ( D D V 2.5 1.8 0 4 10 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table30-1 for each Oscillator mode’s supported frequencies. FIGURE 30-2: PIC16LF1946/47 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C V) 3.6 ( D D V 2.5 1.8 0 4 10 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table30-1 for each Oscillator mode’s supported frequencies. DS40001414E-page 378  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 30-3: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE 125 ± 5% 85 ± 3% C) ° 60 ( e r u at r e p 25 ± 2% m e T 0 -20 ± 5% -40 1.8 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2010-2016 Microchip Technology Inc. DS40001414E-page 379

PIC16(L)F1946/47 30.2 DC Characteristics: PIC16(L)F1946/47-I/E (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. D001 VDD Supply Voltage (VDDMIN, VDDMAX) PIC16LF1946/47 1.8 — 3.6 V FOSC  16MHz 2.5 — 3.6 V FOSC  32MHz (NOTE 2) D001 PIC16F1946/47 1.8 — 5.5 V FOSC  16MHz 2.5 — 5.5 V FOSC  32MHz (NOTE 2) D002* VDR RAM Data Retention Voltage(1) PIC16LF1946/47 1.5 — — V Device in Sleep mode PIC16F1946/47 1.7 — — V Device in Sleep mode D002A* VPOR* Power-on Reset Release Voltage PIC16LF1946/47 — 1.6 — V PIC16F1946/47 — 1.6 — V D002B* VPORR* Power-on Reset Rearm Voltage PIC16LF1946/47 — 0.8 — V Device in Sleep mode PIC16F1946/47 — 1.5 — V Device in Sleep mode D003 VADFVR Fixed Voltage Reference Voltage -8 — 6 % 1.024V, VDD  2.5V for ADC 2.048V, VDD  2.5V 4.096V, VDD  4.75V D003A VCDAFVR Fixed Voltage Reference Voltage -11 — 7 % 1.024V, VDD  2.5V for Comparator and DAC 2.048V, VDD  2.5V 4.096V, VDD  4.75V D003B VLCDFVR Fixed Voltage Reference Voltage -11 — 10 % 3.072V, VDD  3.6V for LCD Bias, Initial Accuracy D004* SVDD VDD Rise Rate to ensure internal 0.05 — — V/ms See Section6.1 “Power-on Reset Power-on Reset signal (POR)” for details. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: PLL required for 32 MHz operation. DS40001414E-page 380  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 30-4: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS NPOR(1) POR REARM VSS TVLOW(2) TPOR(3) Note 1: When NPOR is low, the device is held in Reset. 2: TPOR 1s typical. 3: TVLOW 2.7s typical.  2010-2016 Microchip Technology Inc. DS40001414E-page 381

PIC16(L)F1946/47 30.3 DC Characteristics: PIC16(L)F1946/47-I/E (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Device Min. Typ† Max. Units No. Characteristics VDD Note Supply Current (IDD)(1, 2) D009 LDO Regulator — 350 — A — HS, EC OR HFINTOSC Clock modes with VCAP pin disabled — 30 — A — — 5 — A — LP/LFINTOSC Clock mode or Sleep (requires FVR and BOR to be disabled) D010 — 5.0 11 A 1.8 FOSC = 32kHz — 6.0 13 A 3.0 LP Oscillator mode (Note 4), -40°C  TA  +85°C D010 — 24 53 A 1.8 FOSC = 32kHz — 30 58 A 3.0 LP Oscillator mode (Note 4, 5), -40°C  TA  +85°C — 32 63 A 5.0 D010A — 7.0 23 A 1.8 FOSC = 32kHz — 9.0 27 A 3.0 LP Oscillator mode (Note 4) -40°C  TA  +125°C D010A — 24 68 A 1.8 FOSC = 32kHz — 30 88 A 3.0 LP Oscillator mode (Note 4, 5) -40°C  TA  +125°C — 32 95 A 5.0 D011 — 60 105 A 1.8 FOSC = 1MHz XT Oscillator mode — 120 190 A 3.0 D011 — 95 130 A 1.8 FOSC = 1MHz XT Oscillator mode (Note 5) — 170 220 A 3.0 — 190 270 A 5.0 D012 — 160 300 A 1.8 FOSC = 4MHz XT Oscillator mode — 300 500 A 3.0 D012 — 200 330 A 1.8 FOSC = 4MHz XT Oscillator mode (Note 5) — 300 500 A 3.0 — 400 650 A 5.0 Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2 REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1F capacitor on VCAP (RF0). 6: 8 MHz crystal oscillator with 4x PLL enabled. DS40001414E-page 382  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.3 DC Characteristics: PIC16(L)F1946/47-I/E (Industrial, Extended) (Continued) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Device Min. Typ† Max. Units No. Characteristics VDD Note Supply Current (IDD)(1, 2) D013 — 15 40 A 1.8 FOSC = 500kHz EC Oscillator Low-Power mode — 30 75 A 3.0 D013 — 30 60 A 1.8 FOSC = 500kHz EC Oscillator Low-Power mode (Note 5) — 45 85 A 3.0 — 50 90 A 5.0 D014 — 140 250 A 1.8 FOSC = 4MHz — 270 400 A 3.0 EC Oscillator mode Medium-Power mode D014 — 160 270 A 1.8 FOSC = 4MHz — 270 430 A 3.0 EC Oscillator mode (Note 5) Medium-Power mode — 320 500 A 5.0 D015 — 2.0 3.2 mA 3.0 FOSC = 32MHz EC Oscillator High-Power mode — 2.3 3.9 mA 3.6 D015 — 2.0 3.2 mA 3.0 FOSC = 32MHz EC Oscillator High-Power mode (Note 5) — 2.2 3.9 mA 5.0 D016 — 3.0 11 A 1.8 FOSC = 32kHz, LFINTOSC mode (Note 4) — 5.0 13 A 3.0 -40°C  TA  +85°C D016 — 24 40 A 1.8 FOSC = 32kHz, LFINTOSC mode (Note 4, 5) — 30 48 A 3.0 -40°C  TA  +85°C — 32 58 A 5.0 Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2 REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1F capacitor on VCAP (RF0). 6: 8 MHz crystal oscillator with 4x PLL enabled.  2010-2016 Microchip Technology Inc. DS40001414E-page 383

PIC16(L)F1946/47 30.3 DC Characteristics: PIC16(L)F1946/47-I/E (Industrial, Extended) (Continued) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Device Min. Typ† Max. Units No. Characteristics VDD Note Supply Current (IDD)(1, 2) D017 — 100 200 A 1.8 FOSC = 500kHz MFINTOSC mode — 120 230 A 3.0 D017 — 110 210 A 1.8 FOSC = 500kHz — 120 240 A 3.0 MFINTOSC mode (Note 5) — 160 290 A 5.0 D018 — 0.5 1.1 mA 1.8 FOSC = 8MHz HFINTOSC mode — 0.8 1.6 mA 3.0 D018 — 0.5 1.2 mA 1.8 FOSC = 8MHz — 0.8 1.7 mA 3.0 HFINTOSC mode (Note 5) — 0.9 1.8 mA 5.0 D019 — 0.8 1.5 mA 1.8 FOSC = 16MHz HFINTOSC mode — 1.2 2.3 mA 3.0 D019 — 0.8 1.6 mA 1.8 FOSC = 16MHz — 1.2 2.4 mA 3.0 HFINTOSC mode (Note 5) — 1.4 2.5 mA 5.0 — 2.1 3.6 mA 3.0 FOSC = 32MHz HFINTOSC mode — 2.3 4.3 mA 3.6 — 2.1 3.7 mA 3.0 FOSC = 32MHz — 2.2 4.1 mA 5.0 HFINTOSC mode D020 — 150 300 A 1.8 FOSC = 4MHz EXTRC mode (Note 3) — 270 500 A 3.0 D020 — 170 330 A 1.8 FOSC = 4MHz — 290 500 A 3.0 EXTRC mode (Note 3, Note 5) — 320 650 A 5.0 D021 — 2.1 3.6 mA 3.0 FOSC = 32MHz HS Oscillator mode (Note 6) — 2.3 4.3 mA 3.6 D021 — 2.1 3.7 mA 3.0 FOSC = 32MHz — 2.2 4.1 mA 5.0 HS Oscillator mode (Note 5, Note 6) Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2 REXT (mA) with REXT in k 4: FVR and BOR are disabled. 5: 0.1F capacitor on VCAP (RF0). 6: 8 MHz crystal oscillator with 4x PLL enabled. DS40001414E-page 384  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.4 DC Characteristics: PIC16(L)F1946/47-I/E (Power-Down) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note Power-down Base Current (IPD)(2) D023 — 0.06 1.0 8.0 A 1.8 WDT, BOR, FVR, and T1OSC — 0.08 2.0 9.0 A 3.0 disabled, all Peripherals Inactive D023 — 21 55 63 A 1.8 WDT, BOR, FVR, and T1OSC — 25 58 78 A 3.0 disabled, all Peripherals Inactive — 27 60 88 A 5.0 D024 — 0.5 6.0 9.0 A 1.8 LPWDT Current (Note 1) — 0.8 7.0 10 A 3.0 D024 — 23 57 65 A 1.8 LPWDT Current (Note 1) — 26 59 80 A 3.0 — 28 61 90 A 5.0 D025 — 15 28 30 A 1.8 FVR current — 15 30 33 A 3.0 D025 — 38 96 100 A 1.8 FVR current (Note 4) — 45 110 120 A 3.0 — 90 140 155 A 5.0 D026 — 13 16 20 A 3.0 BOR Current (Note 1) D026 — 40 110 120 A 3.0 BOR Current (Note 1, Note 4) — 87 140 155 A 5.0 D027 — 0.6 6.0 9.0 A 1.8 T1OSC Current (Note 1) — 1.8 10 12 A 3.0 D027 — 22 57 60 A 1.8 T1OSC Current (Note 1) — 29 62 70 A 3.0 — 35 66 85 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC. 4: 0.1F capacitor on VCAP (RF0).  2010-2016 Microchip Technology Inc. DS40001414E-page 385

PIC16(L)F1946/47 30.4 DC Characteristics: PIC16(L)F1946/47-I/E (Power-Down) (Continued) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note Power-down Base Current (IPD)(2) D028 — 0.1 5.0 8.0 A 1.8 A/D Current (Note 1, Note 3), no — 0.1 6.0 9.0 A 3.0 conversion in progress D028 — 22 56 63 A 1.8 A/D Current (Note 1, Note 3), no — 26 58 78 A 3.0 conversion in progress — 27 61 88 A 5.0 D029 — 250 — — A 1.8 A/D Current (Note 1, Note 3), — 250 — — A 3.0 conversion in progress D029 — 280 — — A 1.8 A/D Current (Note 1, Note 3, — 280 — — A 3.0 Note 4), conversion in progress — 280 — — A 5.0 D030 — 1 — — A 3.0 LCD Bias Ladder, Low-power — 10 — — A 3.0 LCD Bias Ladder, Medium-power — 75 — — A 3.0 LCD Bias Ladder, High-power D030 — 1 — — A 5.0 LCD Bias Ladder, Low-power — 10 — — A 5.0 LCD Bias Ladder, Medium-power — 75 — — A 5.0 LCD Bias Ladder, High-power D031 — 7.6 22 25 A 1.8 Comparator, Low-Power mode — 8.0 23 27 A 3.0 D031 — 24 55 65 A 1.8 Comparator, Low-Power mode — 26 58 80 A 3.0 — 28 60 90 A 5.0 D032A* — 2.0 — — A 1.8 Cap Sense, Low-Power mode, — 3.0 — — A 3.0 CPSRM=0 D032A* — 23 — — A 1.8 Cap Sense, Low-Power mode, — 28 — — A 3.0 CPSRM=0 — 30 — — A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC. 4: 0.1F capacitor on VCAP (RF0). DS40001414E-page 386  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.4 DC Characteristics: PIC16(L)F1946/47-I/E (Power-Down) (Continued) Standard Operating Conditions (unless otherwise stated) PIC16LF1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Standard Operating Conditions (unless otherwise stated) PIC16F1946/47 Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Conditions Param Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note Power-down Base Current (IPD)(2) D032B* — 80 — — A 1.8 Cap Sense, Low Power mode, — 90 — — A 3.0 CPSRM = 1, includes FVR and DAC current D032B* — 110 — — A 1.8 Cap Sense, Low-Power mode, — 120 — — A 3.0 CPSRM = 1, includes FVR and DAC current — 130 — — A 5.0 D032C* — 4.0 — — A 1.8 Cap Sense, Medium-Power — 6.0 — — A 3.0 mode, CPSRM = 0 D032C* — 25 — — A 1.8 Cap Sense, Medium-Power — 30 — — A 3.0 mode, CPSRM = 0 — 32 — — A 5.0 D032D* — 90 — — A 1.8 Cap Sense, Medium-Power — 120 — — A 3.0 mode, CPSRM = 1, includes FVR and DAC current D032D* — 120 — — A 1.8 Cap Sense, Medium-Power — 140 — — A 3.0 mode, CPSRM = 1, includes FVR and DAC current — 150 — — A 5.0 D032E* — 12 — — A 1.8 Cap Sense, High-Power mode, — 31 — — A 3.0 CPSRM = 0 D032E* — 33 — — A 1.8 Cap Sense, High-Power mode, — 52 — — A 3.0 CPSRM = 0 — 62 — — A 5.0 D032F* — 120 — — A 1.8 Cap Sense, High-Power mode, — 160 — — A 3.0 CPSRM = 1, includes FVR and DAC current D032F* — 150 — — A 1.8 Cap Sense, High-Power mode, — 180 — — A 3.0 CPSRM = 1, includes FVR and DAC current — 190 — — A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: A/D oscillator source is FRC. 4: 0.1F capacitor on VCAP (RF0).  2010-2016 Microchip Technology Inc. DS40001414E-page 387

PIC16(L)F1946/47 30.5 DC Characteristics: PIC16(L)F1946/47-I/E Standard Operating Conditions (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param Sym. Characteristic Min. Typ† Max. Units Conditions No. VIL Input Low Voltage I/O PORT: D032 with TTL buffer — — 0.8 V 4.5V  VDD  5.5V D032A — — 0.15VDD V 1.8V  VDD  4.5V D033 with Schmitt Trigger buffer — — 0.2VDD V 2.0V  VDD  5.5V with I2C levels — — 0.3VDD V with SMBus levels — — 0.8 V 2.7V  VDD  5.5V D034 MCLR, OSC1 (RC mode)(1) — — 0.2VDD V D034A OSC1 (HS mode) — — 0.3VDD V VIH Input High Voltage I/O ports: D040 with TTL buffer 2.0 — — V 4.5V  VDD 5.5V D040A 0.25VDD + — — V 1.8V  VDD  4.5V 0.8 D041 with Schmitt Trigger buffer 0.8VDD — — V 2.0V  VDD  5.5V with I2C levels 0.7VDD — — V with SMBus levels 2.1 — — V 2.7V  VDD  5.5V D042 MCLR 0.8VDD — — V D043A OSC1 (HS mode) 0.7VDD — — V D043B OSC1 (RC mode) 0.9VDD — — V (Note 1) VDD  2.0V IIL Input Leakage Current(2) D060 I/O ports — ± 5 ± 125 nA VSS  VPIN  VDD, Pin at high-imped- ance @ 85°C ± 5 ± 1000 nA 125°C D061 MCLR(3) — ± 50 ± 200 nA VSS  VPIN  VDD @ 85°C IPUR Weak Pull-up Current D070* 25 100 200 VDD = 3.3V, VPIN = VSS 25 140 300 A VDD = 5.0V, VPIN = VSS VOL Output Low Voltage(4) D080 I/O ports IOL = 8mA, VDD = 5V — — 0.6 V IOL = 6mA, VDD = 3.3V IOL = 1.8mA, VDD = 1.8V VOH Output High Voltage(4) D090 I/O ports IOH = 3.5mA, VDD = 5V VDD - 0.7 — — V IOH = 3mA, VDD = 3.3V IOH = 1mA, VDD = 1.8V Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when exter- nal clock is used to drive OSC1 D101A* CIO All I/O pins — — 50 pF VCAP Capacitor Charging D102 Charging current — 200 — A D102A Source/sink capability when — 0.0 — mA charging complete * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: Including OSC2 in CLKOUT mode. DS40001414E-page 388  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.6 Memory Programming Requirements Standard Operating Conditions (unless otherwise stated) DC CHARACTERISTICS Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 3, Note 4) D111 IDDP Supply Current during Programming — — 10 mA D112 VPBE VDD for Bulk Erase 2.7 — VDDMAX V D113 VPEW VDD for Write or Row Erase VDDMIN — VDDMAX V D114 IPPPGM Current on MCLR/VPP during Erase/ — — 1.0 mA Write D115 IDDPGM Current on VDD during Erase/Write — 5.0 mA Data EEPROM Memory D116 ED Byte Endurance 100K — — E/W -40C to +85C D117 VDRW VDD for Read/Write VDDMIN — VDDMAX V D118 TDEW Erase/Write Cycle Time — 4.0 5.0 ms D119 TRETD Characteristic Retention — 40 — Year -40°C to +55°C Provided no other specifications are violated D120 TREF Number of Total Erase/Write Cycles 1M 10M — E/W -40°C to +85°C before Refresh(2) Program Flash Memory D121 EP Cell Endurance 10K — — E/W -40C to +85C (Note 1) D122 VPRW VDD for Read/Write VDDMIN — VDDMAX V D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Refer to Section11.2 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance. 3: Required only if single-supply programming is disabled. 4: The MPLAB® ICD 2 does not support variable VPP output. Circuitry to limit the MPLAB ICD 2 VPP voltage must be placed between the MPLAB ICD 2 and target system when programming or debugging with the MPLAB ICD 2.  2010-2016 Microchip Technology Inc. DS40001414E-page 389

PIC16(L)F1946/47 30.7 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Typ. Units Conditions No. TH01 JA Thermal Resistance Junction to Ambient 48.3 C/W 64-pin TQFP package 28 C/W 64-pin QFN package TH02 JC Thermal Resistance Junction to Case 26.1 C/W 64-pin TQFP package 0.24 C/W 64-pin QFN package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2),(3) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature DS40001414E-page 390  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 30.8 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance FIGURE 30-5: LOAD CONDITIONS Load Condition Pin CL VSS Legend: CL = 50 pF for all pins, 15 pF for OSC2 output  2010-2016 Microchip Technology Inc. DS40001414E-page 391

PIC16(L)F1946/47 30.9 AC Characteristics: PIC16(L)F1946/47-I/E FIGURE 30-6: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1/CLKIN OS02 OS04 OS04 OS03 OSC2/CLKOUT (LP,XT,HS Modes) OSC2/CLKOUT (CLKOUT Mode) TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz EC Oscillator mode (low) DC — 4 MHz EC Oscillator mode (medium) DC — 20 MHz EC Oscillator mode (high) Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode 0.1 — 4 MHz XT Oscillator mode 1 — 4 MHz HS Oscillator mode 1 — 20 MHz HS Oscillator mode, VDD > 2.7V DC — 4 MHz RC Oscillator mode, VDD > 2.0V OS02 TOSC External CLKIN Period(1) 27 —  s LP Oscillator mode 250 —  ns XT Oscillator mode 50 —  ns HS Oscillator mode 50 —  ns EC Oscillator mode Oscillator Period(1) — 30.5 — s LP Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 1,000 ns HS Oscillator mode 250 — — ns RC Oscillator mode OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC OS04* TosH, External CLKIN High, 2 — — s LP oscillator TosL External CLKIN Low 100 — — ns XT oscillator 20 — — ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. DS40001414E-page 392  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS (CONTINUED) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. OS05* TosR, External CLKIN Rise, 0 —  ns LP oscillator TosF External CLKIN Fall 0 —  ns XT oscillator 0 —  ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. TABLE 30-2: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param Freq. Sym. Characteristic Min. Typ† Max. Units Conditions No. Tolerance OS08 HFOSC Internal-Calibrated HFINTOSC 2% — 16.0 — MHz 0°C  TA  +60°C, VDD  2.5V Frequency(1) 3% — 16.0 — MHz 60°C  TA  +85°C, VDD  2.5V 5% — 16.0 — MHz -40°C  TA  +125°C OS08A MFOSC Internal-Calibrated MFINTOSC 2% — 500 — kHz 0°C  TA  +60°C, VDD  2.5V Frequency(1) 3% — 500 — kHz 60°C  TA  +85°C, VDD  2.5V 5% — 500 — kHz -40°C  TA  +125°C OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz -40°C  TA  +125°C OS10* TIOSC ST HFINTOSC — — 3.2 8 s Wake-up from Sleep Start-up Time MFINTOSC — — 24 35 s Wake-up from Sleep Start-up Time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. TABLE 30-3: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.7V TO 5.5V) Param Sym. Characteristic Min. Typ† Max. Units Conditions No. F10 FOSC Oscillator Frequency Range 4 — 8 MHz F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz F12 TRC PLL Start-up Time (Lock Time) — — 2 ms F13* CLK CLKOUT Stability (Jitter) -0.25% — +0.25% % * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.  2010-2016 Microchip Technology Inc. DS40001414E-page 393

PIC16(L)F1946/47 FIGURE 30-7: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS11 OS12 OS20 CLKOUT OS21 OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS15 OS14 I/O pin Old Value New Value (Output) OS18, OS19 TABLE 30-4: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. OS11 TosH2ckL FOSC to CLKOUT (1) — — 70 ns VDD = 3.3-5.0V OS12 TosH2ckH FOSC to CLKOUT (1) — — 72 ns VDD = 3.3-5.0V OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV FOSC (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V OS16 TosH2ioI FOSC (Q2 cycle) to Port input invalid 50 — — ns VDD = 3.3-5.0V (I/O in hold time) OS17 TioV2osH Port input valid to Fosc(Q2 cycle) 20 — — ns (I/O in setup time) OS18 TioR Port output rise time — 40 72 ns VDD = 1.8V — 15 32 VDD = 3.3-5.0V OS19 TioF Port output fall time — 28 55 ns VDD = 1.8V — 15 30 VDD = 3.3-5.0V OS20* Tinp INT pin input high or low time 25 — — ns OS21* Tioc Interrupt-on-change new input level 25 — — ns time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. DS40001414E-page 394  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 30-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Start-Up Time Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note 1: Asserted low. FIGURE 30-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33(1) (due to BOR) Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’. 2ms delay if PWRTE = 0 and VREGEN=1.  2010-2016 Microchip Technology Inc. DS40001414E-page 395

PIC16(L)F1946/47 TABLE 30-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Para m Sym. Characteristic Min. Typ† Max. Units Conditions No. 30 TMCL MCLR Pulse Width (low) 2 — — s 31 TWDTLP Watchdog Timer Time-out Period 10 16 27 ms VDD = 3.3V-5V, 1:512 Prescaler used 32 TOST Oscillator Start-up Timer Period(1) — 1024 — TOSC 33* TPWRT Power-up Timer Period, 40 65 140 ms PWRTE=0 34* TIOZ I/O high-impedance from MCLR — — 2.0 s Low or Watchdog Timer Reset 35 VBOR Brown-out Reset Voltage(2) 2.55 2.70 2.85 V BORV = 0 1.80 1.90 2.11 V BORV = 1 36* VHYST Brown-out Reset Hysteresis 0 25 50 mV -40°C to +85°C 37* TBORDC Brown-out Reset DC Response 1 3 35 s VDD  VBOR Time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note1: By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency. 2: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. FIGURE 30-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 47 49 TMR0 or TMR1 DS40001414E-page 396  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. 40* TT0H T0CKI High-Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Pres- 10 — — ns caler 41* TT0L T0CKI Low-Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Pres- 10 — — ns caler 42* TT0P T0CKI Period Greater of: — — ns N = prescale value 20 or TCY + 40 (2, 4, ..., 256) N 45* TT1H T1CKI High Synchronous, No Prescaler 0.5 TCY + 20 — — ns Time Synchronous, 15 — — ns with Prescaler Asynchronous 30 — — ns 46* TT1L T1CKI Low Synchronous, No Prescaler 0.5 TCY + 20 — — ns Time Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* TT1P T1CKI Input Synchronous Greater of: — — ns N = prescale value Period 30 or TCY + 40 (1, 2, 4, 8) N Asynchronous 60 — — ns 48 FT1 Timer1 Oscillator Input Frequency Range 32.4 32.76 33.1 kHz (oscillator enabled by setting bit T1OSCEN) 8 49* TCKEZTMR1 Delay from External Clock Edge to Timer 2 TOSC — 7 TOSC — Timers in Sync Increment mode * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-11: CAPTURE/COMPARE/PWM TIMINGS (CCP) CCPx (Capture mode) CC01 CC02 CC03 Note: Refer to Figure30-5 for load conditions.  2010-2016 Microchip Technology Inc. DS40001414E-page 397

PIC16(L)F1946/47 TABLE 30-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C  TA  +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. CC01* TccL CCPx Input Low Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC02* TccH CCPx Input High Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC03* TccP CCPx Input Period 3TCY + 40 — — ns N = prescale value (1, 4 or 16) N * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 30-8: PIC16(L)F1946/47 A/D CONVERTER (ADC) CHARACTERISTICS(1,2,3) Standard Operating Conditions (unless otherwise stated) Operating temperature TA 25°C Para Unit m Sym. Characteristic Min. Typ† Max. Conditions s No. AD01 NR Resolution — — 10 bit AD02 EIL Integral Error — — ±1.7 LSb VREF = 3.0V AD03 EDL Differential Error — — ±1 LSb No missing codes VREF = 3.0V AD04 EOFF Offset Error — — ±2.5 LSb VREF = 3.0V AD05 EGN Gain Error — — ±2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage(4) 1.8 — VDD V VREF = (VREF+ minus VREF-) AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of — — 10 k Can go higher if external 0.01 F capacitor is Analog Voltage Source present on input pin. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: When ADC is OFF, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. 4: ADC Reference Voltage (Ref+) is the selected reference input, VREF+ pin, VDD pin or the FVR Buffer1. When the FVR is selected as the reference input, the FVR Buffer1 output selection must be 2.048V or 4.096V, (ADFVR<1:0> = 1x). DS40001414E-page 398  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-9: PIC16(L)F1946/47 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Min. Typ† Max. Units Conditions No. AD130* TAD A/D Clock Period 1.0 — 9.0 s TOSC-based A/D Internal RC Oscillator 1.0 2.5 6.0 s ADCS<1:0> = 11 (ADRC mode) Period AD131 TCNV Conversion Time (not including — 11 — TAD Set GO/DONE bit to conversion Acquisition Time)(1) complete AD132* TACQ Acquisition Time — 5.0 — s * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. FIGURE 30-12: PIC16(L)F1946/47 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO AD134 (TOSC/2(1)) 1 TCY AD131 Q4 AD130 A/D CLK A/D Data 7 6 5 4 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 TCY GO DONE Sampling Stopped AD132 Sample Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed.  2010-2016 Microchip Technology Inc. DS40001414E-page 399

PIC16(L)F1946/47 FIGURE 30-13: PIC16(L)F1946/47 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO AD134 (TOSC/2 + TCY(1)) 1 TCY AD131 Q4 AD130 A/D CLK A/D Data 7 6 5 4 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 TCY GO DONE Sampling Stopped AD132 Sample Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. DS40001414E-page 400  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-10: COMPARATOR SPECIFICATIONS Standard Operating Conditions: 1.8V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated). Param Sym. Characteristics Min. Typ. Max. Units Comments No. CM01 VIOFF Input Offset Voltage(1) — ±7.5 ±60 mV High-Power mode VICM = VDD/2 CM02 VICM Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ratio — 50 — dB CM04A Response Time Rising Edge — 400 800 ns High-Power mode CM04B Response Time Falling Edge — 200 400 ns High-Power mode TRESP CM04C Response Time Rising Edge — 1200 — ns Low-Power mode CM04D Response Time Falling Edge — 550 — ns Low-Power mode CM05 TMC2OV Comparator Mode Change to Output — — 10 s Valid* CM06 CHYSTER Comparator Hysteresis(2) — 45 — mV CxHYS = 1 * These parameters are characterized but not tested. Note 1: High power only. 2: Comparator Hysteresis is available when the CxHYS bit of the CMxCON0 register is enabled. TABLE 30-11: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS Standard Operating Conditions: 2.5V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated). Param Sym. Characteristics Min. Typ. Max. Units Comments No. DAC01* CLSB Step Size — VDD/32 — V DAC02* CACC Absolute Accuracy — —  1/2 LSb DAC03* CR Unit Resistor Value (R) — 5K —  DAC04* CST Settling Time(1) — — 10 s * These parameters are characterized but not tested. Note 1: Settling time measured while DACR<4:0> transitions from ‘0000’ to ‘1111’. FIGURE 30-14: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING CK US121 US121 DT US120 US122 Note: Refer to Figure30-5 for load conditions.  2010-2016 Microchip Technology Inc. DS40001414E-page 401

PIC16(L)F1946/47 TABLE 30-12: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. Symbol Characteristic Min. Max. Units Conditions No. US120 TCKH2DTV SYNC XMIT (Master and Slave) 3.0-5.5V — 80 ns Clock high to data-out valid 1.8-5.5V — 100 ns US121 TCKRF Clock out rise time and fall time 3.0-5.5V — 45 ns (Master mode) 1.8-5.5V — 50 ns US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns FIGURE 30-15: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING CK US125 DT US126 Note: Refer to Figure30-5 for load conditions. TABLE 30-13: USART SYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. Symbol Characteristic Min. Max. Units Conditions No. US125 TDTV2CKL SYNC RCV (Master and Slave) Data-hold before CK  (DT hold time) 10 — ns US126 TCKL2DTL Data-hold after CK  (DT hold time) 15 — ns DS40001414E-page 402  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 30-16: SPI MASTER MODE TIMING (CKE=0, SMP = 0) SS SP70 SCK (CKP = 0) SP71 SP72 SP78 SP79 SCK (CKP = 1) SP79 SP78 SP80 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure30-5 for load conditions. FIGURE 30-17: SPI MASTER MODE TIMING (CKE=1, SMP = 1) SS SP81 SCK (CKP = 0) SP71 SP72 SP79 SP73 SCK (CKP = 1) SP80 SP78 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure30-5 for load conditions.  2010-2016 Microchip Technology Inc. DS40001414E-page 403

PIC16(L)F1946/47 FIGURE 30-18: SPI SLAVE MODE TIMING (CKE=0) SS SP70 SCK SP83 (CKP = 0) SP71 SP72 SP78 SP79 SCK (CKP = 1) SP79 SP78 SP80 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SP77 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure30-5 for load conditions. FIGURE 30-19: SPI SLAVE MODE TIMING (CKE=1) SP82 SS SP70 SCK SP83 (CKP = 0) SP71 SP72 SCK (CKP = 1) SP80 SDO MSb bit 6 - - - - - -1 LSb SP77 SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure30-5 for load conditions. DS40001414E-page 404  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-14: SPI MODE REQUIREMENTS Param Symbol Characteristic Min. Typ† Max. Units Conditions No. SP70* TSSL2SCH, SS to SCK or SCK input 2.25 TCY — — ns TSSL2SCL SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns SP73* TDIV2SCH, Setup time of SDI data input to SCK edge 100 — — ns TDIV2SCL SP74* TSCH2DIL, Hold time of SDI data input to SCK edge 100 — — ns TSCL2DIL SP75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP76* TDOF SDO data output fall time — 10 25 ns SP77* TSSH2DOZ SS to SDO output high-impedance 10 — 50 ns SP78* TSCR SCK output rise time 3.0-5.5V — 10 25 ns (Master mode) 1.8-5.5V — 25 50 ns SP79* TSCF SCK output fall time (Master mode) — 10 25 ns SP80* TSCH2DOV, SDO data output valid after 3.0-5.5V — — 50 ns TSCL2DOV SCK edge 1.8-5.5V — — 145 ns SP81* TDOV2SCH SDO data output setup to SCK edge TCY — — ns , TDOV2SCL SP82* TSSL2DOV SDO data output valid after SS edge — — 50 ns SP83* TSCH2SSH, SS after SCK edge 1.5 TCY + — — ns TSCL2SSH 40 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-20: I2C BUS START/STOP BITS TIMING SCL SP91 SP93 SP90 SP92 SDA Start Stop Condition Condition Note: Refer to Figure30-5 for load conditions.  2010-2016 Microchip Technology Inc. DS40001414E-page 405

PIC16(L)F1946/47 TABLE 30-15: I2C BUS START/STOP BITS REQUIREMENTS Param Symbol Characteristic Min. Typ Max. Units Conditions No. SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated Setup time 400 kHz mode 600 — — Start condition SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first Hold time 400 kHz mode 600 — — clock pulse is generated SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — SP93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — * These parameters are characterized but not tested. FIGURE 30-21: I2C BUS DATA TIMING SP103 SP100 SP102 SP101 SCL SP90 SP106 SP107 SP91 SP92 SDA In SP110 SP109 SP109 SDA Out Note: Refer to Figure30-5 for load conditions. DS40001414E-page 406  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 TABLE 30-16: I2C BUS DATA REQUIREMENTS Param. Symbol Characteristic Min. Max. Units Conditions No. SP100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s Device must operate at a minimum of 10 MHz SSP module 1.5 TCY — SP101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s Device must operate at a minimum of 10 MHz SSP module 1.5 TCY — SP102* TR SDA and SCL rise 100 kHz mode — 1000 ns time 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10-400 pF SP103* TF SDA and SCL fall 100 kHz mode — 250 ns time 400 kHz mode 20 + 0.1 CB 250 ns CB is specified to be from 10-400 pF SP106* THD:DAT Data input hold 100 kHz mode 0 — ns time 400 kHz mode 0 0.9 s SP107* TSU:DAT Data input setup 100 kHz mode 250 — ns (Note 2) time 400 kHz mode 100 — ns SP109* TAA Output valid from 100 kHz mode — 3500 ns (Note 1) clock 400 kHz mode — — ns SP110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free 400 kHz mode 1.3 — s before a new transmis- sion can start SP111 CB Bus capacitive loading — 400 pF * These parameters are characterized but not tested. Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system, but the requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line TR max. + TSU:DAT=1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released.  2010-2016 Microchip Technology Inc. DS40001414E-page 407

PIC16(L)F1946/47 TABLE 30-17: CAP SENSE OSCILLATOR SPECIFICATIONS Param. Symbol Characteristic Min. Typ† Max. Units Conditions No. CS01* ISRC Current Source High — -8 — A Medium — -1.5 — A Low — -0.3 — A CS02* ISNK Current Sink High — 7.5 — A Medium — 1.5 — A Low — 0.25 — A CS03* VCTH Cap Threshold — 0.8 — V CS04* VCTL Cap Threshold — 0.4 — V CS05* VCHYST Cap Hysteresis High — 525 — mV (VCTH-VCTL) Medium — 375 — mV Low — 300 — mV * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-22: CAP SENSE OSCILLATOR VCTH VCTL ISRC ISNK Enabled Enabled DS40001414E-page 408  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 31.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.” represents (mean+3) or (mean-3) respectively, where  is a standard deviation, over each temperature range.  2010-2016 Microchip Technology Inc. DS40001414E-page 409

PIC16(L)F1946/47 FIGURE 31-1: IDD, LP OSCILLATOR MODE, FOSC = 32 kHz, PIC16LF1946/47 ONLY 14 Max: 85°C + 3(cid:305) Max. 12 Typical: 25°C 10 A) 8 Typical μ ( D D 6 I 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-2: IDD, LP OSCILLATOR MODE, FOSC = 32 kHz, PIC16F1946/47 ONLY 60 Max: 85°C + 3(cid:305) Typical: 25°C 50 Max. 40 Typical A) (μ 30 D D I 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 410  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-3: IDD TYPICAL, XT AND EXTRC OSCILLATOR, PIC16LF1946/47 ONLY 450 Typical: 25°C 4 MHz XT 400 350 4 MHz EXTRC 300 A) 250 μ ( D 200 D I 150 1 MHz XT 100 50 1 MHz EXTRC 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-4: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC16LF1946/47 ONLY 550 500 Max: 85°C + 3(cid:305) 4 MHz XT 450 400 4 MHz EXTRC 350 A) 300 μ ( D 250 D I 200 150 1 MHz XT 100 50 1 MHz EXTRC 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 411

PIC16(L)F1946/47 FIGURE 31-5: IDD TYPICAL, XT AND EXTRC OSCILLATOR, PIC16F1946/47 ONLY 500 Typical: 25°C 4 MHz XT 4 MHz EXTRC 400 300 A) μ ( DD 200 1 MHz XT I 100 1 MHz EXTRC 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 31-6: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC16F1946/47 ONLY 600 Max: 85°C + 3(cid:305) 4 MHz XT 500 4 MHz EXTRC 400 A) 300 μ ( D 1 MHz XT D I 200 1 MHz EXTRC 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 412  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-7: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 32 kHz, PIC16LF1946/47 ONLY 12 Max: 85°C + 3(cid:305) 10 Typical: 25°C Max. 8 A) μ 6 ( D D Typical I 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-8: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 32 kHz, PIC16F1946/47 ONLY 50 Max: 85°C + 3(cid:305) 45 Max. Typical: 25°C 40 35 Typical A) 30 μ (D 25 D I 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 413

PIC16(L)F1946/47 FIGURE 31-9: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC16LF1946/47 ONLY 60 Max: 85°C + 3(cid:305) Max. 50 Typical: 25°C 40 A) μ 30 ( D D I 20 Typical 10 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-10: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC16F1946/47 ONLY 90 Max. Max: 85°C + 3(cid:305) 80 Typical: 25°C 70 60 Typical A) μ 50 ( D ID 40 30 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 414  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-11: IDD TYPICAL, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16LF1946/47 ONLY 450 Typical: 25°C 400 4 MHz 350 300 A) 250 μ ( D 200 D I 150 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-12: IDD MAXIMUM, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16LF1946/47 ONLY 500 Max: 85°C + 3(cid:305) 450 4 MHz 400 350 300 A) (μ 250 D D I 200 150 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 415

PIC16(L)F1946/47 FIGURE 31-13: IDD TYPICAL, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16F1946/47 ONLY 450 Typical: 25°C 400 4 MHz 350 300 A) 250 μ ( D D 200 I 1 MHz 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 31-14: IDD MAXIMUM, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16F1946/47 ONLY 500 450 Max: 85°C + 3(cid:305) 4 MHz 400 350 300 A) μ ( 250 D D I 200 1 MHz 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 416  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-15: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC16LF1946/47 ONLY 3.5 Typical: 25°C 3.0 2.5 32 MHz (PLL) 2.0 A) 1.5 16 MHz μ ( D D 1.0 I 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-16: IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC16LF1946/47 ONLY 4.0 Max: 85°C + 3(cid:305) 3.5 3.0 32 MHz (PLL) 2.5 2.0 A) 16 MHz μ 1.5 ( D D I 1.0 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 417

PIC16(L)F1946/47 FIGURE 31-17: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC16F1946/47 ONLY 3.5 Typical: 25°C 3.0 32 MHz (PLL) 2.5 2.0 A) μ 16 MHz ( DD 1.5 I 1.0 8 MHz 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 31-18: IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC16F1946/47 ONLY 3.5 Max: 85°C + 3(cid:305) 3.0 32 MHz (PLL) 2.5 A) 2.0 16 MHz μ ( D D 1.5 I 8 MHz 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 418  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-19: IDD, LFINTOSC MODE, FOSC = 32 kHz, PIC16LF1946/47 ONLY 12 Max: 85°C + 3(cid:305) Typical: 25°C 10 Max. 8 A) μ ( D 6 D I Typical 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-20: IDD, LFINTOSC MODE, FOSC = 32 kHz, PIC16F1946/47 ONLY 50 45 Max: 85°C + 3(cid:305) Max. Typical: 25°C 40 35 Typical A) 30 μ ( D 25 D I 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 419

PIC16(L)F1946/47 FIGURE 31-21: IDD, MFINTOSC MODE, FOSC = 500 kHz, PIC16LF1946/47 ONLY 180 Max: 85°C + 3(cid:305) 160 Max. Typical: 25°C 140 120 Typical A) 100 μ ( D 80 D I 60 40 20 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-22: IDD, MFINTOSC MODE, FOSC = 500 kHz, PIC16F1946/47 ONLY 300 Max: 85°C + 3(cid:305) Max. Typical: 25°C 250 Typical 200 A) (μ 150 D D I 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 420  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-23: IDD TYPICAL, HFINTOSC MODE, PIC16LF1946/47 ONLY 4000 Typical: 25°C 32 MHz (PLL) 3500 3000 2500 A) μ ( 2000 D D 16 MHz I 1500 1000 8 MHz 500 4 MHz 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-24: IDD MAXIMUM, HFINTOSC MODE, PIC16LF1946/47 ONLY 4500 Max: 85°C + 3(cid:305) 4000 32 MHz (PLL) 3500 3000 A) 2500 μ ( D D 2000 I 16 MHz 1500 8 MHz 1000 500 4 MHz 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 421

PIC16(L)F1946/47 FIGURE 31-25: IDD TYPICAL, HFINTOSC MODE, PIC16F1946/47 ONLY 3500 3000 Typical: 25°C 32 MHz (PLL) 2500 2000 A) 16 MHz μ ( D D 1500 I 8 MHz 1000 4 MHz 500 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 31-26: IDD MAXIMUM, HFINTOSC MODE, PIC16F1946/47 ONLY 4000 Max: 85°C + 3(cid:305) 32 MHz (PLL) 3500 3000 2500 A) μ 2000 16 MHz ( D D I 1500 8 MHz 1000 4 MHz 500 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 422  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-27: IDD TYPICAL, HS OSCILLATOR, PIC16LF1946/47 ONLY 4500 Max: 85°C + 3(cid:305) 4000 32 MHz (PLL) Typical: 25°C 3500 3000 A) 2500 μ 20 MHz ( D 2000 D I 1500 1000 8 MHz 500 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 31-28: IDD MAXIMUM, HS OSCILLATOR, PIC16LF1946/47 ONLY 5000 Max: 85°C + 3(cid:305) 4500 32 MHz (PLL) Typical: 25°C 4000 3500 3000 A) 2500 μ 20 MHz ( D D 2000 I 1500 8 MHz 1000 500 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 423

PIC16(L)F1946/47 FIGURE 31-29: IDD TYPICAL, HS OSCILLATOR, PIC16F1946/47 ONLY 3500 Typical: 25°C 3000 32 MHz (PLL) 2500 20 MHz 2000 A) μ ( 1500 D D I 8 MHz 1000 500 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 31-30: IDD MAXIMUM, HS OSCILLATOR, PIC16F1946/47 ONLY 3500 Max: 85°C + 3(cid:305) 3000 32 MHz (PLL) 2500 20 MHz 2000 A) μ ( DD 1500 I 8 MHz 1000 500 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001414E-page 424  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-31: IPD BASE, PIC16LF1946/47 ONLY 11220000 Max. Max: 85°C + 3(cid:305) 1000 Typical: 25°C 800 A)A nn (( 660000 DD PP II 400 200 Typical 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-32: IPD BASE, PIC16F1946/47 ONLY 45 Max. 40 Max: 85°C + 3(cid:305) Typical: 25°C 35 3300 TTyyppiiccaall A)A) 2255 μμ ( D IP 20 15 10 55 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 425

PIC16(L)F1946/47 FIGURE 31-33: IPD, WATCHDOG TIMER (WDT), PIC16LF1946/47 ONLY 22550000 Max: 85°C + 3(cid:305) Typical: 25°C 2000 1500 MMaaxx.. )) AA nn (( DD P 1000 I Typical 500 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-34: IPD, WATCHDOG TIMER (WDT), PIC16F1946/47 ONLY 4455 Max: 85°C + 3(cid:305) 40 Typical: 25°C Max. 35 30 Typical A)A 2255 μμ (( DD PP 2200 II 15 10 5 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001414E-page 426  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-35: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16LF1946/47 ONLY 1144 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 13 Typical: 25°C 12 Max. 11 10 A)A) TTyyppiiccaall μμ 99 (( DD IPP 88 7 6 5 44 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-36: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16F1946/47 ONLY 112200 Max: 85°C + 3(cid:305) Max. 100 Typical: 25°C Typical 80 A)A μμ (( 6600 DD PP II 40 20 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 427

PIC16(L)F1946/47 FIGURE 31-37: IPD, BROWN-OUT RESET (BOR), PIC16LF1946/47 ONLY 1122 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) MMax. 11 Typical: 25°C 10 A) 9 μμ (( DD 88 TTyyppiiccaall PP II 7 6 5 44 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-38: IPD, BROWN-OUT RESET (BOR), PIC16F1946/47 ONLY 5500 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 4455 Max. Typical: 25°C 40 35 Typical 30 A)A) 2255 μμ (( DD PP 2200 I 15 10 5 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001414E-page 428  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-39: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC16LF1946/47 ONLY 1144 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 12 Typical: 25°C 10 Max. 8 A)A μμ (( DD 66 PP II 4 Typical 2 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-40: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC16F1946/47 ONLY 6600 Max: 85°C + 3(cid:305) 50 Typical: 25°C Max. 40 A)A TTyyppiiccaall μμ (( 3300 DD PP II 20 10 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 429

PIC16(L)F1946/47 FIGURE 31-41: IPD, CAPACITIVE SENSING (CPS) MODULE, LOW-CURRENT RANGE, CPSRM = 0, PIC16LF1946/47 ONLY 88 Max: 85°C + 3(cid:305) MMax. 7 Typical: 25°C 6 5 A)A (μ(μ 44 TTyyppiiccaall DD PP II 3 2 1 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-42: IPD, CAPACITIVE SENSING (CPS) MODULE, LOW-CURRENT RANGE, CPSRM = 0, PIC16F1946/47 ONLY 4455 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 40 Max. Typical: 25°C 35 30 Typical A)A 2255 μμ (( DD 2200 PP II 15 10 5 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001414E-page 430  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-43: IPD, CAPACITIVE SENSING (CPS) MODULE, MEDIUM-CURRENT RANGE, CPSRM = 0, PIC16LF1946/47 ONLY 1144 MMax: 8855°°CC + 33(cid:305) 12 Typical: 25°C Max. 10 88 A)A) TTyyppiiccaall μμ (( PDPD 66 I 4 2 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-44: IPD, CAPACITIVE SENSING (CPS) MODULE, MEDIUM-CURRENT RANGE, CPSRM = 0, PIC16F1946/47 ONLY 6600 MMax: 8855°°CC + 33(cid:305) 50 Typical: 25°C Max. 40 Tyyppical A)A (μ(μ 3300 DD PP II 20 10 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 431

PIC16(L)F1946/47 FIGURE 31-45: IPD, CAPACITIVE SENSING (CPS) MODULE, HIGH-CURRENT RANGE, CPSRM = 0, PIC16LF1946/47 ONLY 7700 Max: 85°C + 3(cid:305) 60 Typical: 25°C Max. 50 4400 A)A) μμ TTyyppiiccaall (( DD PP 3300 I 20 10 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-46: IPD, CAPACITIVE SENSING (CPS) MODULE, HIGH-CURRENT RANGE, CPSRM = 0, PIC16F1946/47 ONLY 114400 Max: 85°C + 3(cid:305) Max. 120 Typical: 25°C 100 8800 A)A) μμ TTyyppiiccaall (( DD 6600 PP I 40 20 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001414E-page 432  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-47: IPD, COMPARATOR, LOW-POWER MODE, PIC16LF1946/47 ONLY 3300 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) MMaaxx. Typical: 25°C 25 20 Typical A) μμ (( DD 1155 PP II 10 5 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-48: IPD, COMPARATOR, LOW-POWER MODE, PIC16F1946/47 ONLY 6600 Max: 85°C + 3(cid:305) 50 Typical: 25°C Max. 40 Typical A)A μμ (( 3300 DD PP II 20 10 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 433

PIC16(L)F1946/47 FIGURE 31-49: IPD, COMPARATOR, HIGH-POWER MODE, PIC16LF1946/47 ONLY 6600 MMax: 8855°°CC + 33(cid:305) Typical: 25°C 50 Max. 40 A)A TTyyppiiccaall (μ(μ 3300 DD PP II 20 10 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 31-50: IPD, COMPARATOR, HIGH-POWER MODE, PIC16F1946/47 ONLY 8800 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 70 Typical: 25°C Max. 60 50 Typical A)A) μμ 4400 (( DD PP I 30 20 10 00 11..55 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001414E-page 434  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-51: VOH VS. IOH OVER TEMPERATURE, VDD = 5.0V, PIC16F1946/47 ONLY 6 Graph represents 5 3(cid:305)Limits 4 V) -40°C (H 3 O V 125°C 2 Typical 1 0 -30 -25 -20 -15 -10 -5 0 IOH(mA) FIGURE 31-52: VOL VS. IOL OVER TEMPERATURE, VDD = 5.0V, PIC16F1946/47 ONLY 5 Graph represents 4 3(cid:305)Limits 3 V) ( L -40°C O V 2 Typical 125°C 1 0 0 10 20 30 40 50 60 70 80 IOL(mA)  2010-2016 Microchip Technology Inc. DS40001414E-page 435

PIC16(L)F1946/47 FIGURE 31-53: VOH VS. IOH OVER TEMPERATURE, VDD = 3.0V 3.5 Graph represents 3.0 3(cid:305)Limits 2.5 V) 2.0 ( H O V 1.5 125°C Typical 1.0 -40°C 0.5 0.0 -14 -12 -10 -8 -6 -4 -2 0 IOH(mA) FIGURE 31-54: VOL VS. IOL OVER TEMPERATURE, VDD = 3.0V 3.0 Graph represents 2.5 3(cid:305)Limits 2.0 V) -40°C ( 1.5 Typical L O V 125°C 1.0 0.5 0.0 0 5 10 15 20 25 30 IOL(mA) DS40001414E-page 436  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-55: VOH VS. IOH OVER TEMPERATURE, VDD = 1.8V 2.0 1.8 Graph represents 3(cid:305)Limits 1.6 1.4 1.2 V) ( 1.0 125°C H O V 0.8 Typical -40°C 0.6 0.4 0.2 0.0 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 IOH(mA) FIGURE 31-56: VOL VS. IOL OVER TEMPERATURE, VDD = 1.8V 1.8 Graph represents 1.6 3(cid:305)Limits 1.4 1.2 ) 1 V ol ( 125°C Typical V 0.8 -40°C 0.6 0.4 0.2 0 0 1 2 3 4 5 6 7 8 9 10 IOL(mA)  2010-2016 Microchip Technology Inc. DS40001414E-page 437

PIC16(L)F1946/47 FIGURE 31-57: BROWN-OUT RESET VOLTAGE, BORV = 1 2.10 2.05 Max: Typical + 3(cid:305) Min: Typical -3(cid:305) 2.00 Max. 1.95 ) V ge ( 1.90 a t ol V 1.85 Min. 1.80 1.75 1.70 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 31-58: BROWN-OUT RESET HYSTERESIS, BORV = 1 70 Max. 60 50 Typical ) V 40 m e ( ag 30 t ol V Min. 20 Max: Typical + 3(cid:305) 10 Typical: 25°C Min: Typical -3(cid:305) 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS40001414E-page 438  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-59: BROWN-OUT RESET VOLTAGE, BORV = 0 2.90 2.85 Max: Typical + 3(cid:305) Min: Typical -3(cid:305) 2.80 Max. 2.75 ) 2.70 V ge ( 2.65 ta Min. ol 2.60 V 2.55 2.50 2.45 2.40 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 31-60: BROWN-OUT RESET HYSTERESIS, BORV = 0 90 80 Max. 70 60 ) V m 50 Typical e ( g 40 a t ol V 30 20 Max: Typical + 3(cid:305) Min. Typical: 25°C 10 Min: Typical -3(cid:305) 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C)  2010-2016 Microchip Technology Inc. DS40001414E-page 439

PIC16(L)F1946/47 FIGURE 31-61: COMPARATOR HYSTERESIS, HIGH-POWER MODE 120 Max: Typical + 3(cid:305) Typical: 25°C 100 Min: Typical -3(cid:305) Max. V) 80 m ( s si 60 Typical e r e t s y H 40 Min. 20 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VDD(V) FIGURE 31-62: COMPARATOR HYSTERESIS, LOW-POWER MODE 25 Max: Typical + 3(cid:305) Typical: 25°C Min: Typical -3(cid:305) 20 Max. ) V m 15 ( s si e r Typical e st 10 y H Min. 5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VDD(V) DS40001414E-page 440  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 FIGURE 31-63: COMPARATOR RESPONSE TIME, HIGH-POWER MODE 390 Max: Typical + 3(cid:305) 340 Typical: 25°C 290 ) S n e ( 240 m Max. Ti 190 Typical 140 90 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VDD(V) FIGURE 31-64: COMPARATOR RESPONSE TIME OVER TEMPERATURE, HIGH-POWER MODE 260 Graph represents 240 3(cid:305)Limits 220 ) S n e ( 200 m Ti 180 125°C 160 Typical -40°C 140 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VDD(V)  2010-2016 Microchip Technology Inc. DS40001414E-page 441

PIC16(L)F1946/47 FIGURE 31-65: COMPARATOR INPUT OFFSET AT 25°C, HIGH-POWER MODE, PIC16F1946/47 ONLY 60 40 Max. 20 ) V e ( Typical g a 0 t ol V Min. t e -20 s f Of Max: Typical + 3(cid:305) -40 Typical: 25°C Min: Typical -3(cid:305) -60 0 1 2 3 4 5 Common Mode Voltage (V) DS40001414E-page 442  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 32.0 DEVELOPMENT SUPPORT 32.1 MPLAB X Integrated Development Environment Software The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range The MPLAB X IDE is a single, unified graphical user of software and hardware development tools: interface for Microchip and third-party software, and • Integrated Development Environment hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, - MPLAB® X IDE Software MPLAB X IDE is an entirely new IDE with a host of free • Compilers/Assemblers/Linkers software components and plug-ins for high- - MPLAB XC Compiler performance application development and debugging. - MPASMTM Assembler Moving between tools and upgrading from software - MPLINKTM Object Linker/ simulators to hardware debugging and programming MPLIBTM Object Librarian tools is simple with the seamless user interface. - MPLAB Assembler/Linker/Librarian for With complete project management, visual call graphs, Various Device Families a configurable watch window and a feature-rich editor • Simulators that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new - MPLAB X SIM Software Simulator users. With the ability to support multiple tools on • Emulators multiple projects with simultaneous debugging, MPLAB - MPLAB REAL ICE™ In-Circuit Emulator X IDE is also suitable for the needs of experienced • In-Circuit Debuggers/Programmers users. - MPLAB ICD 3 Feature-Rich Editor: - PICkit™ 3 • Color syntax highlighting • Device Programmers • Smart code completion makes suggestions and - MPLAB PM3 Device Programmer provides hints as you type • Low-Cost Demonstration/Development Boards, • Automatic code formatting based on user-defined Evaluation Kits and Starter Kits rules • Third-party development tools • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • Multiple projects • Multiple tools • Multiple configurations • Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker  2010-2016 Microchip Technology Inc. DS40001414E-page 443

PIC16(L)F1946/47 32.2 MPLAB XC Compilers 32.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU The MPLINK Object Linker combines relocatable and DSC devices. These compilers provide powerful objects created by the MPASM Assembler. It can link integration capabilities, superior code optimization and relocatable objects from precompiled libraries, using ease of use. MPLAB XC Compilers run on Windows, directives from a linker script. Linux or MAC OS X. The MPLIB Object Librarian manages the creation and For easy source level debugging, the compilers provide modification of library files of precompiled code. When debug information that is optimized to the MPLAB X a routine from a library is called from a source file, only IDE. the modules that contain that routine will be linked in The free MPLAB XC Compiler editions support all with the application. This allows large libraries to be devices and commands, with no time or memory used efficiently in many different applications. restrictions, and offer sufficient code optimization for The object linker/library features include: most applications. • Efficient linking of single libraries instead of many MPLAB XC Compilers include an assembler, linker and smaller files utilities. The assembler generates relocatable object • Enhanced code maintainability by grouping files that can then be archived or linked with other relo- related modules together catable object files and archives to create an execut- • Flexible creation of libraries with easy module able file. MPLAB XC Compiler uses the assembler to listing, replacement, deletion and extraction produce its object file. Notable features of the assem- bler include: 32.5 MPLAB Assembler, Linker and • Support for the entire device instruction set Librarian for Various Device • Support for fixed-point and floating-point data Families • Command-line interface • Rich directive set MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, • Flexible macro language PIC32 and dsPIC DSC devices. MPLAB XC Compiler • MPLAB X IDE compatibility uses the assembler to produce its object file. The assembler generates relocatable object files that can 32.3 MPASM Assembler then be archived or linked with other relocatable object files and archives to create an executable file. Notable The MPASM Assembler is a full-featured, universal features of the assembler include: macro assembler for PIC10/12/16/18 MCUs. • Support for the entire device instruction set The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX • Support for fixed-point and floating-point data files, MAP files to detail memory usage and symbol • Command-line interface reference, absolute LST files that contain source lines • Rich directive set and generated machine code, and COFF files for • Flexible macro language debugging. • MPLAB X IDE compatibility The MPASM Assembler features include: • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process DS40001414E-page 444  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 32.6 MPLAB X SIM Software Simulator 32.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulat- The MPLAB ICD 3 In-Circuit Debugger System is ing the PIC MCUs and dsPIC DSCs on an instruction Microchip’s most cost-effective, high-speed hardware level. On any given instruction, the data areas can be debugger/programmer for Microchip Flash DSC and examined or modified and stimuli can be applied from MCU devices. It debugs and programs PIC Flash a comprehensive stimulus controller. Registers can be microcontrollers and dsPIC DSCs with the powerful, logged to files for further run-time analysis. The trace yet easy-to-use graphical user interface of the MPLAB buffer and logic analyzer display extend the power of IDE. the simulator to record and track program execution, The MPLAB ICD 3 In-Circuit Debugger probe is actions on I/O, most peripherals and internal registers. connected to the design engineer’s PC using a high- The MPLAB X SIM Software Simulator fully supports speed USB 2.0 interface and is connected to the target symbolic debugging using the MPLAB XCCompilers, with a connector compatible with the MPLAB ICD 2 or and the MPASM and MPLAB Assemblers. The soft- MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 ware simulator offers the flexibility to develop and supports all MPLAB ICD 2 headers. debug code outside of the hardware laboratory envi- ronment, making it an excellent, economical software 32.9 PICkit 3 In-Circuit Debugger/ development tool. Programmer 32.7 MPLAB REAL ICE In-Circuit The MPLAB PICkit 3 allows debugging and program- Emulator System ming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user The MPLAB REAL ICE In-Circuit Emulator System is interface of the MPLAB IDE. The MPLAB PICkit 3 is Microchip’s next generation high-speed emulator for connected to the design engineer’s PC using a full- Microchip Flash DSC and MCU devices. It debugs and speed USB interface and can be connected to the tar- programs all 8, 16 and 32-bit MCU, and DSC devices get via a Microchip debug (RJ-11) connector (compati- with the easy-to-use, powerful graphical user interface of ble with MPLAB ICD 3 and MPLAB REAL ICE). The the MPLAB X IDE. connector uses two device I/O pins and the Reset line The emulator is connected to the design engineer’s to implement in-circuit debugging and In-Circuit Serial PC using a high-speed USB 2.0 interface and is Programming™ (ICSP™). connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) 32.10 MPLAB PM3 Device Programmer or with the new high-speed, noise tolerant, Low- The MPLAB PM3 Device Programmer is a universal, Voltage Differential Signal (LVDS) interconnection CE compliant device programmer with programmable (CAT5). voltage verification at VDDMIN and VDDMAX for The emulator is field upgradable through future firmware maximum reliability. It features a large LCD display downloads in MPLAB X IDE. MPLAB REAL ICE offers (128 x 64) for menus and error messages, and a mod- significant advantages over competitive emulators ular, detachable socket assembly to support various including full-speed emulation, run-time variable package types. The ICSP cable assembly is included watches, trace analysis, complex breakpoints, logic as a standard item. In Stand-Alone mode, the MPLAB probes, a ruggedized probe interface and long (up to PM3 Device Programmer can read, verify and program three meters) interconnection cables. PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications.  2010-2016 Microchip Technology Inc. DS40001414E-page 445

PIC16(L)F1946/47 32.11 Demonstration/Development 32.12 Third-Party Development Tools Boards, Evaluation Kits, and Microchip also offers a great collection of tools from Starter Kits third-party vendors. These tools are carefully selected to offer good value and unique functionality. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC • Device Programmers and Gang Programmers DSCs allows quick application development on fully from companies, such as SoftLog and CCS functional systems. Most boards include prototyping • Software Tools from companies, such as Gimpel areas for adding custom circuitry and provide applica- and Trace Systems tion firmware and source code for examination and • Protocol Analyzers from companies, such as modification. Saleae and Total Phase The boards support a variety of features, including LEDs, • Demonstration Boards from companies, such as temperature sensors, switches, speakers, RS-232 MikroElektronika, Digilent® and Olimex interfaces, LCD displays, potentiometers and additional • Embedded Ethernet Solutions from companies, EEPROM memory. such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstra- tion software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS40001414E-page 446  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 33.0 PACKAGING INFORMATION 33.1 Package Marking Information 64-Lead QFN (9x9x0.9 mm) Example PIN 1 PIN 1 XXXXXXXXXXX PIC16F1947 XXXXXXXXXXX -I/MR e3 XXXXXXXXXXX 1110017 YYWWNNN 64-Lead TQFP (10x10x1 mm) Example XXXXXXXXXX PIC16F1947 XXXXXXXXXX -I/PT e3 XXXXXXXXXX 1110017 YYWWNNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2010-2016 Microchip Technology Inc. DS40001414E-page 447

PIC16(L)F1946/47 33.2 Package Details The following sections give the technical details of the packages. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001414E-page 448  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010-2016 Microchip Technology Inc. DS40001414E-page 449

PIC16(L)F1946/47 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001414E-page 450  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 D1/2 D NOTE 2 E1/2 A B E1 E A A SEE DETAIL 1 N 4X N/4 TIPS 0.20 C A-B D 1 3 2 4X NOTE 1 0.20 H A-B D TOP VIEW A2 A C 0.05 SEATING PLANE A1 64 X b 0.08 C 0.08 C A-B D e SIDE VIEW Microchip Technology Drawing C04-085C Sheet 1 of 2  2010-2016 Microchip Technology Inc. DS40001414E-page 451

PIC16(L)F1946/47 64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging H c (cid:69) L (cid:84) (L1) X=A—B OR D SECTION A-A X e/2 DETAIL 1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 64 Lead Pitch e 0.50 BSC Overall Height A - - 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 - 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle (cid:73) 0° 3.5° 7° Overall Width E 12.00 BSC Overall Length D 12.00 BSC Molded Package Width E1 10.00 BSC Molded Package Length D1 10.00 BSC Lead Thickness c 0.09 - 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top (cid:68) 11° 12° 13° Notes: Mold Draft Angle Bottom (cid:69) 11° 12° 13° 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-085C Sheet 2 of 2 DS40001414E-page 452  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 E C2 G Y1 X1 RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Contact Pad Spacing C1 11.40 Contact Pad Spacing C2 11.40 Contact Pad Width (X28) X1 0.30 Contact Pad Length (X28) Y1 1.50 Distance Between Pads G 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2085B Sheet 1 of 1  2010-2016 Microchip Technology Inc. DS40001414E-page 453

PIC16(L)F1946/47 NOTES: DS40001414E-page 454  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 APPENDIX A: DATA SHEET APPENDIX B: MIGRATING FROM REVISION HISTORY OTHER PIC® DEVICES Revision A (3/2010) This shows a comparison of features in the migration Original release. from the PIC16F917 device to the PIC16F1946 family of devices. Revision B (9/2010) B.1 PIC16F917 to PIC16F1946 Updated with current electrical specifications; Added Temperature Indicator Module section; Other minor TABLE B-1: FEATURE COMPARISON corrections. Feature PIC16F917 PIC16F1946 Revision C (5/2011) Max. Operating Speed 20MHz 32MHz Max. Program 8K 8K Updated the EUSART section; Updated the Electrical Memory (Words) Specifications section; Updated Table 3-8, Figure 13-1 Max. SRAM (Bytes) 368 512 and Equation 16-1. A/D Resolution 10-bit 10-bit Revision D (02/2012) Timers (8/16-bit) 2/1 4/1 Oscillator Modes 4 8 Updated Electrical Specifications and added Characterization Graphs. Brown-out Reset Y Y Internal Pull-ups RB<7:0> RB<7:0> Revision E (11/2016) Interrupt-on-change RB<7:4> RB<7:0> Updated Electrical Specification; Updated Table 1-2, Comparator 2 2 Example 3-2, Figure 5-7, Added Section 5.3.5, AUSART/EUSART 1/0 0/2 Updated Table 5-1, Figure 6-1, Table 12-1, Table 12-3, Extended WDT Y Y Table 12-5, Table 12-7, Table 12-9, Table 12-11, Table Software Control N Y 12-14, Table 12-17, Added Section 15-4, Updated Option of WDT/BOR Figure 16-1, Example 16-1, Table 16-3, Table 19-2; Other minor corrections. INTOSC Frequencies 30kHz - 31kHz - 8MHz 16MHz Clock Switching Y Y Capacitive Sensing N Y CCP/ECCP 2/0 2/3 Enhanced PIC16 CPU N Y MSSP/SSP 0/1 2/0 LCD Y Y  2010-2016 Microchip Technology Inc. DS40001414E-page 455

PIC16(L)F1946/47 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This website is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the website contains the following information: • Field Application Engineer (FAE) • Product Support – Data sheets and errata, • Technical Support application notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, documents, latest software releases and archived representative or Field Application Engineer (FAE) for software support. Local sales offices are also available to help • General Technical Support – Frequently Asked customers. A listing of sales offices and locations is Questions (FAQ), technical support requests, included in the back of this document. online discussion groups, Microchip consultant Technical support is available through the website program member listing at: http://microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS40001414E-page 456  2010-2016 Microchip Technology Inc.

PIC16(L)F1946/47 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) X /XX XXX Examples: Device Tape and Reel Temperature Package Pattern a) PIC16LF1946 - I/MR 301 = Industrial temp., Option Range PLCC package, Extended VDD limits, QTP pat- tern #301. b) PIC16LF1947 - I/PT = Industrial temp., TQFP package, Extended VDD limits. Device: PIC16F1946, PIC16LF1946, PIC16F1947, PIC16LF1947 Tape and Reel Blank = Standard packaging (tube or tray) Option: T = Tape and Reel(1) Temperature I = -40C to +85C (Industrial) Range: E = -40C to +125C (Extended) Package: PT = TQFP (Thin Quad Flatpack) MR = QFN Note1: Tape and Reel identifier only appears in the catalog part number description. This identi- fier is used for ordering purposes and is not Pattern: QTP, SQTP, Code or Special Requirements printed on the device package. Check with (blank otherwise) your Microchip Sales Office for package availability with the Tape and Reel option.  2010-2016 Microchip Technology Inc. DS40001414E-page 457

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, AnyRate, and may be superseded by updates. It is your responsibility to dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, ensure that your application meets with your specifications. KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MICROCHIP MAKES NO REPRESENTATIONS OR MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, WARRANTIES OF ANY KIND WHETHER EXPRESS OR RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O IMPLIED, WRITTEN OR ORAL, STATUTORY OR are registered trademarks of Microchip Technology OTHERWISE, RELATED TO THE INFORMATION, Incorporated in the U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR ClockWorks, The Embedded Control Solutions Company, FITNESS FOR PURPOSE. Microchip disclaims all liability ETHERSYNCH, Hyper Speed Control, HyperLight Load, arising from this information and its use. Use of Microchip IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are devices in life support and/or safety applications is entirely at registered trademarks of Microchip Technology Incorporated the buyer’s risk, and the buyer agrees to defend, indemnify and in the U.S.A. hold harmless Microchip from any and all damages, claims, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, suits, or expenses resulting from such use. No licenses are BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, conveyed, implicitly or otherwise, under any Microchip dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, intellectual property rights unless otherwise stated. EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Silicon Storage Technology is a registered trademark of Tempe, Arizona; Gresham, Oregon and design centers in California Microchip Technology Inc. in other countries. and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping GestIC is a registered trademark of Microchip Technology devices, Serial EEPROMs, microperipherals, nonvolatile memory and Germany II GmbH & Co. KG, a subsidiary of Microchip analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. QUALITY MANAGEMENT SYSTEM © 2010-2016, Microchip Technology Incorporated, Printed in CERTIFIED BY DNV the U.S.A., All Rights Reserved. ISBN: 978-1-5224-1072-0 == ISO/TS 16949 == DS40001414E-page 458  2010-2016 Microchip Technology Inc.

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