PIC16(L)F1503 14-Pin Flash, 8-Bit Microcontrollers High-Performance RISC CPU: eXtreme Low-Power (XLP) Features • C Compiler Optimized Architecture (PIC16LF1503): • Only 49 Instructions • Sleep Current: • Operating Speed: - 20nA @ 1.8V, typical - DC – 20MHz clock input • Watchdog Timer Current: - DC – 200 ns instruction cycle - 260 nA @ 1.8V, typical • Interrupt Capability with Automatic Context • Operating Current: Saving - 30 A/MHz @ 1.8V, typical • 16-Level Deep Hardware Stack with Optional Overflow/Underflow Reset Peripheral Features: • Direct, Indirect and Relative Addressing modes: - Two full 16-bit File Select Registers (FSRs) • Analog-to-Digital Converter (ADC): - FSRs can read program and data memory - 10-bit resolution Flexible Oscillator Structure: - Eight external channels - Three internal channels: • 16 MHz Internal Oscillator Block: - Fixed Voltage Reference - Factory calibrated to ±1%, typical - Digital-to-Analog Converter (DAC) - Software selectable frequency range from - Temperature Indicator channel 16MHz to 31kHz - Auto acquisition capability • 31kHz Low-Power Internal Oscillator - Conversion available during Sleep • Three External Clock modes up to 20 MHz • 5-Bit Digital-to-Analog Converter (DAC): Special Microcontroller Features: - Output available externally • Operating Voltage Range: - Positive reference selection - 1.8V to 3.6V (PIC16LF1503) - Internal connections to comparators and ADC - 2.3V to 5.5V (PIC16F1503) • Two Comparators: • Self-Programmable under Software Control - Rail-to-rail inputs • Power-on Reset (POR) - Power mode control • Power-up Timer (PWRT) - Software controllable hysteresis • Programmable Low-Power Brown-out Reset • Voltage Reference: (LPBOR) - 1.024V Fixed Voltage Reference (FVR) with • Extended Watchdog Timer (WDT): 1x, 2x and 4x Gain output levels - Programmable period from 1 ms to 256s • 12 I/O Pins (1 Input-only Pin): • Programmable Code Protection - High current sink/source 25 mA/25 mA • In-Circuit Serial Programming™ (ICSP™) via Two - Individually programmable weak pull-ups Pins - Individually programmable • Enhanced Low-Voltage Programming (LVP) Interrupt-on-Change (IOC) pins • In-Circuit Debug (ICD) via Two Pins • Timer0: 8-Bit Timer/Counter with 8-Bit • Power-Saving Sleep mode: Programmable Prescaler - Low-Power Sleep mode • Enhanced Timer1: - Low-Power BOR (LPBOR) - 16-bit timer/counter with prescaler • Integrated Temperature Indicator - External Gate Input mode • 128 Bytes High-Endurance Flash • Timer2: 8-Bit Timer/Counter with 8-Bit Period - 100,000 write Flash endurance (minimum) Register, Prescaler and Postscaler Memory: • Four 10-bit PWM modules • Master Synchronous Serial Port (MSSP) with SPI • 2 Kwords Linear Program Memory Addressing and I2C with: • 128 bytes Linear Data Memory Addressing - 7-bit address masking • High-Endurance Flash Data Memory (HEF) - SMBus/PMBus™ compatibility - 128 bytes if nonvolatile data storage - 100k erase/write cycles  2011-2015 Microchip Technology Inc. DS40001607D-page 1

PIC16(L)F1503 Peripheral Features (Continued): - True linear frequency control - High-speed clock input • Two Configurable Logic Cell (CLC) modules: - Selectable Output modes - 16 selectable input source signals - Fixed Duty Cycle (FDC) mode - Four inputs per module - Pulse Frequency (PF) mode - Software control of combinational/sequential • Complementary Waveform Generator (CWG): logic/state/clock functions - Eight selectable signal sources - AND/OR/XOR/D Flop/D Latch/SR/JK - Selectable falling and rising edge dead-band - Inputs from external and internal sources control - Output available to pins and peripherals - Polarity control - Operation while in Sleep - Four auto-shutdown sources • Numerically Controlled Oscillator (NCO): - Multiple input sources: PWM, CLC, NCO - 20-bit accumulator - 16-bit increment PIC12(L)F1501/PIC16(L)F150X FAMILY TYPES x y Device Data Sheet Inde Program MemorFlash (words) Data SRAM(bytes) (2)I/O’s 10-bit ADC (ch) Comparators DAC Timers(8/16-bit) PWM EUSART 2MSSP (IC/SPI) CWG CLC NCO (1)Debug XLP PIC12(L)F1501 (1) 1024 64 6 4 1 1 2/1 4 — — 1 2 1 H — PIC16(L)F1503 (2) 2048 128 12 8 2 1 2/1 4 — 1 1 2 1 H — PIC16(L)F1507 (3) 2048 128 18 12 — — 2/1 4 — — 1 2 1 H — PIC16(L)F1508 (4) 4096 256 18 12 2 1 2/1 4 1 1 1 4 1 I/H Y PIC16(L)F1509 (4) 8192 512 18 12 2 1 2/1 4 1 1 1 4 1 I/H Y Note 1: Debugging Methods: (I) - Integrated on Chip; (H) - using Debug Header; (E) - using Emulation Header. 2: One pin is input-only. Data Sheet Index: (Unshaded devices are described in this document.) 1: DS40001615 PIC12(L)F1501 Data Sheet, 8-Pin Flash, 8-bit Microcontrollers. 2: DS40001607 PIC16(L)F1503 Data Sheet, 14-Pin Flash, 8-bit Microcontrollers. 3: DS40001586 PIC16(L)F1507 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers. 4: DS40001609 PIC16(L)F1508/9 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers. Note: For other small form-factor package availability and marking information, please visit http://www.microchip.com/packaging or contact your local sales office. DS40001607D-page 2  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 PIN DIAGRAMS 14-pin PDIP, SOIC, TSSOP VDD 1 14 VSS RA5 2 13 RA0/ICSPDAT 3 RA4 3 50 12 RA1/ICSPCLK 1 MCLR/VPP/RA3 4 )F 11 RA2 L RC5 5 6( 10 RC0 1 C RC4 6 PI 9 RC1 RC3 7 8 RC2 Note: See Table1 for location of all peripheral functions. 16-pin QFN, UQFN DD CC ss V NN V 16151413 RA5 1 12 RA0/ICSPDAT RA4 2 PIC16(L)F1503 11 RA1/ICSPCLK MCLR/VPP/RA3 3 10 RA2 RC5 4 9 RC0 5 6 7 8 4 321 C CCC R RRR Note 1: See Table1 for location of all peripheral functions. 2: It is recommended that the exposed bottom pad be connected to VSS.  2011-2015 Microchip Technology Inc. DS40001607D-page 3

PIC16(L)F1503 PIN ALLOCATION TABLE TABLE 1: 14-PIN ALLOCATION TABLE (PIC16(L)F1503) P O S N S F I/O PDIP/SOIC/T Pin QFN, UQ ADC Reference Comparator Timer CWG NCO CLC PWM MSSP Interrupt Pull-Up Basic Pin 16- 4- 1 RA0 13 12 AN0 DACOUT1 C1IN+ — — — — — — IOC Y ICSPDAT RA1 12 11 AN1 VREF+ C1IN0- — — — — — — IOC Y ICSPCLK C2IN0- RA2 11 10 AN2 DACOUT2 C1OUT T0CKI CWG1FLT — CLC1 PWM3 — INT Y — IOC RA3 4 3 — — — T1G(1) — — CLC1IN0 — SS(1) IOC Y MCLR VPP RA4 3 2 AN3 — — T1G — NCO1(1) — — SDO(1) IOC Y CLKOUT RA5 2 1 — — — T1CKI — NCO1CLK CLC1IN1 — — IOC Y CLKIN RC0 10 9 AN4 — C2IN+ — — — CLC2 — SCL — — — SCK RC1 9 8 AN5 — C1IN1- — — NCO1 — PWM4 SDA — — — C2IN1- SDI RC2 8 7 AN6 — C1IN2- — — — — — SDO — — — C2IN2- RC3 7 6 AN7 — C1IN3- — — — CLC2IN0 PWM2 SS — — — C2IN3- RC4 6 5 — — C2OUT — CWG1B — CLC2IN1 — — — — — RC5 5 4 — — — — CWG1A — CLC1(1) PWM1 — — — — VDD 1 16 — — — — — — — — — — — VDD VSS 14 13 — — — — — — — — — — — VSS Note 1: Alternate pin function selected with the APFCON (Register11-1) register. DS40001607D-page 4  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE OF CONTENTS 1.0 Device Overview..........................................................................................................................................................................7 2.0 Enhanced Mid-Range CPU........................................................................................................................................................11 3.0 Memory Organization.................................................................................................................................................................13 4.0 Device Configuration..................................................................................................................................................................37 5.0 Oscillator Module........................................................................................................................................................................42 6.0 Resets........................................................................................................................................................................................51 7.0 Interrupts....................................................................................................................................................................................59 8.0 Power-Down Mode (Sleep)........................................................................................................................................................72 9.0 Watchdog Timer (WDT).............................................................................................................................................................75 10.0 Flash Program Memory Control.................................................................................................................................................79 11.0 I/O Ports.....................................................................................................................................................................................95 12.0 Interrupt-On-Change................................................................................................................................................................104 13.0 Fixed Voltage Reference (FVR)...............................................................................................................................................108 14.0 Temperature Indicator Module.................................................................................................................................................111 15.0 Analog-to-Digital Converter (ADC) Module..............................................................................................................................113 16.0 5-Bit Digital-to-Analog Converter (DAC) Module......................................................................................................................127 17.0 Comparator Module..................................................................................................................................................................130 18.0 Timer0 Module.........................................................................................................................................................................137 19.0 Timer1 Module with Gate Control.............................................................................................................................................140 20.0 Timer2 Module.........................................................................................................................................................................151 21.0 Master Synchronous Serial Port (MSSP) Module....................................................................................................................154 22.0 Pulse-Width Modulation (PWM) Module..................................................................................................................................208 23.0 Configurable Logic Cell (CLC)..................................................................................................................................................214 24.0 Numerically Controlled Oscillator (NCO) Module.....................................................................................................................230 25.0 Complementary Waveform Generator (CWG) Module............................................................................................................237 26.0 In-Circuit Serial Programming™ (ICSP™)...............................................................................................................................249 27.0 Instruction Set Summary..........................................................................................................................................................251 28.0 Electrical Specifications............................................................................................................................................................265 29.0 DC and AC Characteristics Graphs and Charts.......................................................................................................................293 30.0 Development Support...............................................................................................................................................................328 31.0 Packaging Information..............................................................................................................................................................332 Appendix A: Data Sheet Revision History..........................................................................................................................................347 The Microchip Website......................................................................................................................................................................348 Customer Change Notification Service..............................................................................................................................................348 Customer Support..............................................................................................................................................................................348 Product Identification System............................................................................................................................................................349  2011-2015 Microchip Technology Inc. DS40001607D-page 5

PIC16(L)F1503 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Website; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products. DS40001607D-page 6  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 1.0 DEVICE OVERVIEW The block diagram of these devices are shown in Figure1-1, the available peripherals are shown in Table1-1, and the pinout descriptions are shown in Table1-2. TABLE 1-1: DEVICE PERIPHERAL SUMMARY 1 3 7 8 9 0 0 0 0 0 5 5 5 5 5 1 1 1 1 1 F F F F F Peripheral L) L) L) L) L) ( ( ( ( ( 2 6 6 6 6 1 1 1 1 1 C C C C C PI PI PI PI PI Analog-to-Digital Converter (ADC) ● ● ● ● ● Complementary Wave Generator (CWG) ● ● ● ● ● Digital-to-Analog Converter (DAC) ● ● ● ● Enhanced Universal ● ● Synchronous/Asynchronous Receiver/ Transmitter (EUSART) Fixed Voltage Reference (FVR) ● ● ● ● ● Numerically Controlled Oscillator (NCO) ● ● ● ● ● Temperature Indicator ● ● ● ● ● Comparators C1 ● ● ● ● C2 ● ● ● Configurable Logic Cell (CLC) CLC1 ● ● ● ● ● CLC2 ● ● ● ● ● CLC3 ● ● CLC4 ● ● Master Synchronous Serial Ports MSSP1 ● ● ● PWM Modules PWM1 ● ● ● ● ● PWM2 ● ● ● ● ● PWM3 ● ● ● ● ● PWM4 ● ● ● ● ● Timers Timer0 ● ● ● ● ● Timer1 ● ● ● ● ● Timer2 ● ● ● ● ●  2011-2015 Microchip Technology Inc. DS40001607D-page 7

PIC16(L)F1503 FIGURE 1-1: PIC16(L)F1503 BLOCK DIAGRAM Rev. 10-000039B 12/16/2013 Program Flash Memory RAM PORTA CLKOUT Timing Generation CPU CLKIN INTRC Oscillator (Note 3) PORTC MCLR Temp ADC MSSP1 TMR2 TMR1 TMR0 C2 C1 DAC FVR Indicator 10-bit CWG1 NCO1 CLC2 CLC1 PWM4 PWM3 PWM2 PWM1 Note 1: See applicable chapters for more information on peripherals. 2: See Table1-1 for peripherals on specific devices. 3: See Figure2-1. DS40001607D-page 8  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 1-2: PIC16(L)F1503 PINOUT DESCRIPTION Input Output Name Function Description Type Type RA0/AN0/C1IN+/DACOUT1/ RA0 TTL CMOS General purpose I/O. ICSPDAT AN0 AN — A/D Channel input. C1IN+ AN — Comparator C1 positive input. DACOUT1 — AN Digital-to-Analog Converter output. ICSPDAT ST CMOS ICSP™ Data I/O. RA1/AN1/VREF+/C1IN0-/C2IN0-/ RA1 TTL CMOS General purpose I/O. ICSPCLK AN1 AN — A/D Channel input. VREF+ AN — A/D Positive Voltage Reference input. C1IN0- AN — Comparator C1 negative input. C2IN0- AN — Comparator C2 negative input. ICSPCLK ST — Serial Programming Clock. RA2/AN2/C1OUT/DACOUT2/ RA2 ST CMOS General purpose I/O. T0CKI/INT/PWM3/CLC1(1)/ AN2 AN — A/D Channel input. CWG1FLT C1OUT — CMOS Comparator C1 output. DACOUT2 — AN Digital-to-Analog Converter output. T0CKI ST — Timer0 clock input. INT ST — External interrupt. PWM3 — CMOS Pulse Width Module source output. CLC1 — CMOS Configurable Logic Cell source output. CWG1FLT ST — Complementary Waveform Generator Fault input. RA3/CLC1IN0/VPP/T1G(1)/SS(1)/ RA3 TTL — General purpose input. MCLR CLC1IN0 ST — Configurable Logic Cell source input. VPP HV — Programming voltage. T1G ST — Timer1 Gate input. SS ST — Slave Select input. MCLR ST — Master Clear with internal pull-up. RA4/AN3/NCO1(1)/SDO(1)/ RA4 TTL CMOS General purpose I/O. CLKOUT/T1G(1) AN3 AN — A/D Channel input. NCO1 — CMOS Numerically Controlled Oscillator output. SDO — CMOS SPI data output. CLKOUT — CMOS FOSC/4 output. T1G ST — Timer1 Gate input. RA5/CLKIN/T1CKI/NCO1CLK/ RA5 TTL CMOS General purpose I/O. CLC1IN1 CLKIN CMOS — External clock input (EC mode). T1CKI ST — Timer1 clock input. NCO1CLK ST — Numerically Controlled Oscillator Clock source input. CLC1IN1 ST — CLC1 input. RC0/AN4/C2IN+/CLC2/SCL/ RC0 TTL CMOS General purpose I/O. SCK AN4 AN — A/D Channel input. C2IN+ AN — Comparator C2 positive input. CLC2 — CMOS Configurable Logic Cell source output. SCL I2C OD I2C™ clock. SCK ST CMOS SPI clock. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™= Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Alternate pin function selected with the APFCON (Register11-1) register.  2011-2015 Microchip Technology Inc. DS40001607D-page 9

PIC16(L)F1503 TABLE 1-2: PIC16(L)F1503 PINOUT DESCRIPTION (CONTINUED) Input Output Name Function Description Type Type RC1/AN5/C1IN1-/C2IN1-/PWM4/ RC1 TTL CMOS General purpose I/O. NCO1(1)/SDA/SDI AN5 AN — A/D Channel input. C1IN1- AN — Comparator C1 negative input. C2IN1- AN — Comparator C2 negative input. PWM4 — CMOS Pulse Width Module source output. NCO1 — CMOS Numerically Controlled Oscillator is source output. SDA I2C OD I2C data input/output. SDI CMOS — SPI data input. RC2/AN6/C1IN2-/C2IN2-/SDO(1) RC2 TTL CMOS General purpose I/O. AN6 AN — A/D Channel input. C1IN2- AN — Comparator C1 negative input. C2IN2- AN — Comparator C2 negative input. SDO — CMOS SPI data output. RC3/AN7/C1IN3-/C2IN3-/PWM2/ RC3 TTL CMOS General purpose I/O. CLC2IN0/SS AN7 AN — A/D Channel input. C1IN3- AN — Comparator C1 negative input. C2IN3- AN — Comparator C2 negative input. PWM2 — CMOS Pulse Width Module source output. CLC2IN0 ST — Configurable Logic Cell source input. SS ST — Slave Select input. RC4/C2OUT/CLC2IN1/CWG1B RC4 TTL CMOS General purpose I/O. C2OUT — CMOS Comparator C2 output. CLC2IN1 ST — Configurable Logic Cell source input. CWG1B — CMOS CWG complementary output. RC5/PWM1/CLC1(1)/ RC5 TTL CMOS General purpose I/O. CWG1A PWM1 — CMOS PWM output. CLC1 — CMOS Configurable Logic Cell source output. CWG1A — CMOS CWG primary output. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain TTL= TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™= Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Alternate pin function selected with the APFCON (Register11-1) register. DS40001607D-page 10  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. • Automatic Interrupt Context Saving • 16-level Stack with Overflow and Underflow • File Select Registers • Instruction Set FIGURE 2-1: CORE BLOCK DIAGRAM Rev.10-000055A 7/30/2013 15 Configuration 15 DataBus 8 ProgramCounter Flash X U Program M Memory 16-LevelStack RAM (15-bit) 14 Program ProgramMemory 12 RAMAddr Bus Read(PMR) AddrMUX InstructionReg Indirect DirectAddr 7 12 Addr 5 12 BSRReg 15 FSR0Reg 15 FSR1Reg STATUSReg 8 3 MUX Power-up Instruction Timer Decodeand Power-on Control Reset 8 ALU Watchdog CLKIN Timer Timing CLKOUT Generation BrRowesne-otut WReg Internal Oscillator VDD VSS Block  2011-2015 Microchip Technology Inc. DS40001607D-page 11

PIC16(L)F1503 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5“Automatic Context Saving”, for more information. 2.2 16-Level Stack with Overflow and Underflow These devices have a hardware stack memory 15 bits wide and 16 words deep. A Stack Overflow or Under- flow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled, will cause a soft- ware Reset. See Section 3.5“Stack” for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program mem- ory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose mem- ory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.6“Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section 27.0“Instruction Set Summary” for more details. DS40001607D-page 12  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.0 MEMORY ORGANIZATION The following features are associated with access and control of program memory and data memory: These devices contain the following types of memory: • PCL and PCLATH • Program Memory • Stack - Configuration Words • Indirect Addressing - Device ID - User ID 3.1 Program Memory Organization - Flash Program Memory The enhanced mid-range core has a 15-bit program • Data Memory counter capable of addressing a 32K x 14 program - Core Registers memory space. Table3-1 shows the memory sizes - Special Function Registers implemented. Accessing a location above these - General Purpose RAM boundaries will cause a wrap-around within the - Common RAM implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (See Figure3-1). 3.2 High-Endurance Flash This device has a 128 byte section of high-endurance program Flash memory (PFM) in lieu of data EEPROM. This area is especially well suited for nonvolatile data storage that is expected to be updated frequently over the life of the end product. See Section10.2 “Flash Program Memory Overview” for more information on writing data to PFM. See Section3.2.1.2 “Indirect Read with FSR” for more information about using the FSR registers to read byte data stored in PFM. TABLE 3-1: DEVICE SIZES AND ADDRESSES Program Memory Last Program Memory High-Endurance Flash Device Space (Words) Address Memory Address Range (1) PIC16LF1503 2,048 07FFh 0780h-07FFh PIC16F1503 Note1: High-endurance Flash applies to low byte of each address in the range.  2011-2015 Microchip Technology Inc. DS40001607D-page 13

PIC16(L)F1503 FIGURE 3-1: PROGRAM MEMORY MAP 3.2.1 READING PROGRAM MEMORY AS AND STACK FOR DATA PIC16(L)F1503 There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an Rev.10-000040C 7/30/2013 FSR to point to the program memory. PC<14:0> 3.2.1.1 RETLW Instruction CALL, CALLW RETURN, RETLW 15 The RETLW instruction can be used to provide access Interrupt,RETFIE to tables of constants. The recommended way to create such a table is shown in Example3-1. StackLevel0 StackLevel1 EXAMPLE 3-1: RETLW INSTRUCTION constants BRW ;Add Index in W to StackLevel15 ;program counter to ;select data RETLW DATA0 ;Index0 data ResetVector 0000h RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 InterruptVector 0004h On-chip 0005h my_function Program Page0 Memory 07FFh ;… LOTS OF CODE… MOVLW DATA_INDEX RollovertoPage0 0800h call constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used. RollovertoPage0 7FFFh DS40001607D-page 14  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.2.1.2 Indirect Read with FSR The program memory can be accessed as data by set- ting bit 7 of the FSRxH register and reading the match- ing INDFx register. The MOVIW instruction will place the lower eight bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the pro- gram memory via the FSR require one extra instruction cycle to complete. Example3-2 demonstrates access- ing the program memory via an FSR. The HIGH operator will set bit<7> if a label points to a location in program memory. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR constants DW DATA0 ;First constant DW DATA1 ;Second constant DW DATA2 DW DATA3 my_function ;… LOTS OF CODE… MOVLW DATA_INDEX ADDLW LOW constants MOVWF FSR1L MOVLW HIGH constants;MSb sets automatically MOVWF FSR1H BTFSC STATUS, C ;carry from ADDLW? INCF FSR1h, f ;yes MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W  2011-2015 Microchip Technology Inc. DS40001607D-page 15

PIC16(L)F1503 3.3 Data Memory Organization 3.3.1 CORE REGISTERS The data memory is partitioned in 32 memory banks The core registers contain the registers that directly with 128 bytes in a bank. Each bank consists of affect the basic operation. The core registers occupy (Figure3-2): the first 12 addresses of every data memory bank (addresses x00h/x08h through x0Bh/x8Bh). These • 12 core registers registers are listed below in Table3-2. For detailed • 20 Special Function Registers (SFR) information, see Table3-4. • Up to 80 bytes of General Purpose RAM (GPR) • 16 bytes of common RAM TABLE 3-2: CORE REGISTERS The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be Addresses BANKx accessed either directly (via instructions that use the x00h or x80h INDF0 file registers) or indirectly via the two File Select x01h or x81h INDF1 Registers (FSR). See Section 3.6“Indirect x02h or x82h PCL Addressing” for more information. x03h or x83h STATUS Data memory uses a 12-bit address. The upper five bits x04h or x84h FSR0L of the address define the Bank address and the lower x05h or x85h FSR0H seven bits select the registers/RAM in that bank. x06h or x86h FSR1L x07h or x87h FSR1H x08h or x88h BSR x09h or x89h WREG x0Ah or x8Ah PCLATH x0Bh or x8Bh INTCON DS40001607D-page 16  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.3.1.1 STATUS Register For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register The STATUS register, shown in Register3-1, contains: as ‘000u u1uu’ (where u = unchanged). • the arithmetic status of the ALU It is recommended, therefore, that only BCF, BSF, • the Reset status SWAPF and MOVWF instructions are used to alter the The STATUS register can be the destination for any STATUS register, because these instructions do not instruction, like any other register. If the STATUS affect any Status bits. For other instructions not register is the destination for an instruction that affects affecting any Status bits (Refer to Section the Z, DC or C bits, then the write to these three bits is 27.0“Instruction Set Summary”). disabled. These bits are set or cleared according to the Note1: The C and DC bits operate as Borrow device logic. Furthermore, the TO and PD bits are not and Digit Borrow out bits, respectively, in writable. Therefore, the result of an instruction with the subtraction. STATUS register as destination may be different than intended. REGISTER 3-1: STATUS: STATUS REGISTER U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u — — — TO PD Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register.  2011-2015 Microchip Technology Inc. DS40001607D-page 17

PIC16(L)F1503 3.3.2 SPECIAL FUNCTION REGISTER FIGURE 3-2: BANKED MEMORY PARTITIONING The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Rev.107-0/3000/024011A3 Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch 7-bitBankOffset MemoryRegion through x1Fh/x9Fh). The registers associated with the 00h operation of the peripherals are described in the appro- priate peripheral chapter of this data sheet. CoreRegisters (12bytes) 3.3.3 GENERAL PURPOSE RAM 0Bh 0Ch There are up to 80bytes of GPR in each data memory SpecialFunctionRegisters bank. The Special Function Registers occupy the 20 (20bytesmaximum) bytes after the core registers of every data memory 1Fh bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). 20h 3.3.3.1 Linear Access to GPR The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3.6.2“Linear Data Memory” for more information. GeneralPurposeRAM 3.3.4 COMMON RAM (80bytesmaximum) There are 16 bytes of common RAM accessible from all banks. 6Fh 70h CommonRAM (16bytes) 7Fh DS40001607D-page 18  2011-2015 Microchip Technology Inc.

 3.3.5 DEVICE MEMORY MAPS 2 01 The memory maps for Bank 0 through Bank 31 are shown in the tables in this section. 1 -2 0 1 TABLE 3-3: PIC16(L)F1503 MEMORY MAP 5 M BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7 ic ro 000h 080h 100h 180h 200h 280h 300h 380h ch Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers ip (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) T e 00Bh 08Bh 10Bh 18Bh 20Bh 28Bh 30Bh 38Bh c h 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch — 30Ch — 38Ch — n o 00Dh — 08Dh — 10Dh — 18Dh — 20Dh — 28Dh — 30Dh — 38Dh — lo g 00Eh PORTC 08Eh TRISC 10Eh LATC 18Eh ANSELC 20Eh — 28Eh — 30Eh — 38Eh — y Inc 0001F0hh —— 0089F0hh —— 1101F0hh —— 1189F0hh —— 2201F0hh —— 2289F0hh —— 3301F0hh —— 3389F0hh —— . 011h PIR1 091h PIE1 111h CM1CON0 191h PMADRL 211h SSP1BUF 291h — 311h — 391h IOCAP 012h PIR2 092h PIE2 112h CM1CON1 192h PMADRH 212h SSP1ADD 292h — 312h — 392h IOCAN 013h PIR3 093h PIE3 113h CM2CON0 193h PMDATL 213h SSP1MSK 293h — 313h — 393h IOCAF 014h — 094h — 114h CM2CON1 194h PMDATH 214h SSP1STAT 294h — 314h — 394h — 015h TMR0 095h OPTION_REG 115h CMOUT 195h PMCON1 215h SSP1CON1 295h — 315h — 395h — 016h TMR1L 096h PCON 116h BORCON 196h PMCON2 216h SSP1CON2 296h — 316h — 396h — 017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON 217h SSP1CON3 297h — 317h — 397h — 018h T1CON 098h — 118h DACCON0 198h — 218h — 298h — 318h — 398h — S 019h T1GCON 099h OSCCON 119h DACCON1 199h — 219h — 299h — 319h — 399h — tatu 01Ah TMR2 09Ah OSCSTAT 11Ah — 19Ah — 21Ah — 29Ah — 31Ah — 39Ah — s 01Bh PR2 09Bh ADRESL 11Bh — 19Bh — 21Bh — 29Bh — 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch — 21Ch — 29Ch — 31Ch — 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh — 21Dh — 29Dh — 31Dh — 39Dh — 01Eh — 09Eh ADCON1 11Eh — 19Eh — 21Eh — 29Eh — 31Eh — 39Eh — 01Fh — 09Fh ADCON2 11Fh — 19Fh — 21Fh — 29Fh — 31Fh — 39Fh — 020h 0A0h General 120h 1A0h 220h 2A0h 320h 3A0h Purpose Register General 0BFh 32 Bytes Purpose Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented 0C0h Register Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ P 80 Bytes Unimplemented Read as ‘0’ I C 06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh 070h 0F0h 170h 1F0h 270h 2F0h 370h 3F0h 1 Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses 6 D 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) ( S4 07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh L 0 00 Legend: = Unimplemented data memory locations, read as ‘0’ ) 1 F 6 07 1 D -p 5 ag 0 e 1 3 9

D TABLE 3-3: PIC16(L)F1503 MEMORY MAP (CONTINUED) P S 40 BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15 I 0 C 0 400h 480h 500h 580h 600h 680h 700h 780h 1 6 Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers 1 0 7D (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) 6 -p 40Bh 48Bh 50Bh 58Bh 60Bh 68Bh 70Bh 78Bh ( ag 40Ch — 48Ch — 50Ch — 58Ch — 60Ch — 68Ch — 70Ch — 78Ch — L e 40Dh — 48Dh — 50Dh — 58Dh — 60Dh — 68Dh — 70Dh — 78Dh — 20 40Eh — 48Eh — 50Eh — 58Eh — 60Eh — 68Eh — 70Eh — 78Eh — )F 40Fh — 48Fh — 50Fh — 58Fh — 60Fh — 68Fh — 70Fh — 78Fh — 410h — 490h — 510h — 590h — 610h — 690h — 710h — 790h — 1 411h — 491h — 511h — 591h — 611h PWM1DCL 691h CWG1DBR 711h — 791h — 5 412h — 492h — 512h — 592h — 612h PWM1DCH 692h CWG1DBF 712h — 792h — 0 413h — 493h — 513h — 593h — 613h PWM1CON 693h CWG1CON0 713h — 793h — 3 414h — 494h — 514h — 594h — 614h PWM2DCL 694h CWG1CON1 714h — 794h — 415h — 495h — 515h — 595h — 615h PWM2DCH 695h CWG1CON2 715h — 795h — 416h — 496h — 516h — 596h — 616h PWM2CON 696h — 716h — 796h — 417h — 497h — 517h — 597h — 617h PWM3DCL 697h — 717h — 797h — 418h — 498h NCO1ACCL 518h — 598h — 618h PWM3DCH 698h — 718h — 798h — 419h — 499h NCO1ACCH 519h — 599h — 619h PWM3CON 699h — 719h — 799h — 41Ah — 49Ah NCO1ACCU 51Ah — 59Ah — 61Ah PWM4DCL 69Ah — 71Ah — 79Ah — 41Bh — 49Bh NCO1INCL 51Bh — 59Bh — 61Bh PWM4DCH 69Bh — 71Bh — 79Bh — 41Ch — 49Ch NCO1INCH 51Ch — 59Ch — 61Ch PWM4CON 69Ch — 71Ch — 79Ch — 41Dh — 49Dh — 51Dh — 59Dh — 61Dh — 69Dh — 71Dh — 79Dh — 41Eh — 49Eh NCO1CON 51Eh — 59Eh — 61Eh — 69Eh — 71Eh — 79Eh — S ta 41Fh — 49Fh NCO1CLK 51Fh — 59Fh — 61Fh — 69Fh — 71Fh — 79Fh — tu 420h 4A0h 520h 5A0h 620h 6A0h 720h 7A0h s Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ 46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh 470h 4F0h 570h 5F0h 670h 6F0h 770h 7F0h Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh  BANK 16 BANK 17 BANK 18 BANK 19 BANK 20 BANK 21 BANK 22 BANK 23 2 0 800h 880h 900h 980h A00h A80h B00h B80h 1 1 Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers -2 (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) 0 15 80Bh 88Bh 90Bh 98Bh A0Bh A8Bh B0Bh B8Bh M 80Ch 88Ch 90Ch 98Ch A0Ch A8Ch B0Ch B8Ch icro Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented c Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ h ip 86Fh 8EFh 96Fh 9EFh A6Fh AEFh B6Fh BEFh Te 870h 8F0h 970h 9F0h A70h AF0h B70h BF0h c Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM hn (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses olog 87Fh 70h – 7Fh) 8FFh 70h – 7Fh) 97Fh 70h – 7Fh) 9FFh 70h – 7Fh) A7Fh 70h – 7Fh) AFFh 70h – 7Fh) B7Fh 70h – 7Fh) BFFh 70h – 7Fh) y In Legend: = Unimplemented data memory locations, read as ‘0’ c .

 TABLE 3-3: PIC16(L)F1503 MEMORY MAP (CONTINUED) 20 BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30 BANK 31 1 1 -2 C00h C80h D00h D80h E00h E80h F00h F80h 0 Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers Core Registers 1 5 (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) (Table3-2) M ic C0Bh C8Bh D0Bh D8Bh E0Bh E8Bh F0Bh F8Bh ro C0Ch — C8Ch — D0Ch — D8Ch — E0Ch — E8Ch — F0Ch F8Ch c h C0Dh — C8Dh — D0Dh — D8Dh — E0Dh — E8Dh — F0Dh F8Dh ip T C0Eh — C8Eh — D0Eh — D8Eh — E0Eh — E8Eh — F0Eh F8Eh ec C0Fh — C8Fh — D0Fh — D8Fh — E0Fh — E8Fh — F0Fh F8Fh h n C10h — C90h — D10h — D90h — E10h — E90h — F10h F90h o lo C11h — C91h — D11h — D91h — E11h — E91h — F11h F91h g y C12h — C92h — D12h — D92h — E12h — E92h — F12h F92h In C13h — C93h — D13h — D93h — E13h — E93h — F13h F93h c . C14h — C94h — D14h — D94h — E14h — E94h — F14h F94h C15h — C95h — D15h — D95h — E15h — E95h — F15h F95h C16h — C96h — D16h — D96h — E16h — E96h — F16h F96h C17h — C97h — D17h — D97h — E17h — E97h — F17h F97h See Table3-3 for See Table3-3 for C18h — C98h — D18h — D98h — E18h — E98h — F18h F98h register mapping register mapping C19h — C99h — D19h — D99h — E19h — E99h — F19h details F99h details C1Ah — C9Ah — D1Ah — D9Ah — E1Ah — E9Ah — F1Ah F9Ah C1Bh — C9Bh — D1Bh — D9Bh — E1Bh — E9Bh — F1Bh F9Bh C1Ch — C9Ch — D1Ch — D9Ch — E1Ch — E9Ch — F1Ch F9Ch S ta C1Dh — C9Dh — D1Dh — D9Dh — E1Dh — E9Dh — F1Dh F9Dh tus C1Eh — C9Eh — D1Eh — D9Eh — E1Eh — E9Eh — F1Eh F9Eh C1Fh — C9Fh — D1Fh — D9Fh — E1Fh — E9Fh — F1Fh F9Fh C20h CA0h D20h DA0h E20h EA0h F20h FA0h Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Unimplemented Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ Read as ‘0’ C6Fh CEFh D6Fh DEFh E6Fh EEFh F6Fh FEFh C70h CF0h D70h DF0h E70h EF0h F70h FF0h Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM Common RAM (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses (Accesses P 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) 70h – 7Fh) CFFh CFFh D7Fh DFFh E7Fh EFFh F7Fh FFFh I C Legend: = Unimplemented data memory locations, read as ‘0’. 1 6 D ( S 4 L 0 0 ) 0 1 F 6 07 1 D -p 5 ag 0 e 2 3 1

PIC16(L)F1503 TABLE 3-3: PIC16(L)F1503 MEMORY MAP (CONTINUED) Bank 30 Bank 31 F0Ch — F8Ch F0Dh — F0Eh — Unimplemented Read as ‘0’ F0Fh CLCDATA F10h CLC1CON FE3h F11h CLC1POL FE4h STATUS_SHAD F12h CLC1SEL0 FE5h WREG_SHAD F13h CLC1SEL1 FE6h BSR_SHAD F14h CLC1GLS0 FE7h PCLATH_SHAD F15h CLC1GLS1 F16h CLC1GLS2 FE8h FSR0L_SHAD F17h CLC1GLS3 FE9h FSR0H_SHAD F18h CLC2CON FEAh FSR1L_SHAD F19h CLC2POL FEBh FSR1H_SHAD F1Ah CLC2SEL0 FECh — F1Bh CLC2SEL1 FEDh STKPTR F1Ch CLC2GLS0 FEEh TOSL F1Dh CLC2GLS1 FEFh TOSH F1Eh CLC2GLS2 F1Fh CLC2GLS3 F20h Unimplemented Read as ‘0’ F6Fh Legend: = Unimplemented data memory locations, read as ‘0’. DS40001607D-page 22  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.3.6 CORE FUNCTION REGISTERS SUMMARY The Core Function registers listed in Table3-4 can be addressed from any Bank. TABLE 3-4: CORE FUNCTION REGISTERS SUMMARY Value on Value on all Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 POR, BOR other Resets Bank 0-31 x00h or Addressing this location uses contents of FSR0H/FSR0L to address data memory INDF0 xxxx xxxx uuuu uuuu x80h (not a physical register) x01h or Addressing this location uses contents of FSR1H/FSR1L to address data memory INDF1 xxxx xxxx uuuu uuuu x81h (not a physical register) x02h or PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x82h x03h or STATUS — — — TO PD Z DC C ---1 1000 ---q quuu x83h x04h or FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x84h x05h or FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x85h x06h or FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x86h x07h or FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x87h x08h or BSR — — — BSR<4:0> ---0 0000 ---0 0000 x88h x09h or WREG Working Register 0000 0000 uuuu uuuu x89h x0Ah or PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 x8Ah x0Bh or INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 x8Bh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’.  2011-2015 Microchip Technology Inc. DS40001607D-page 23

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 0 00Ch PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --xx xxxx 00Dh — Unimplemented — — 00Eh PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --xx xxxx 00Fh — Unimplemented — — 010h — Unimplemented — — 011h PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 00-- 0-00 00-- 0-00 012h PIR2 — C2IF C1IF — BCL1IF NCO1IF — — -00- 00-- -00- 00-- 013h PIR3 — — — — — — CLC2IF CLC1IF ---- --00 ---- --00 014h — Unimplemented — — 015h TMR0 Holding Register for the 8-bit Timer0 Count xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu 018h T1CON TMR1CS<1:0> T1CKPS<1:0> — T1SYNC — TMR1ON 0000 -0-0 uuuu -u-u 019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu DONE 01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000 01Bh PR2 Timer2 Period Register 1111 1111 1111 1111 01Ch T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 01Dh to — Unimplemented — — 01Fh Bank 1 08Ch TRISA — — TRISA5 TRISA4 —(2) TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 08Dh — Unimplemented — — 08Eh TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 --11 1111 --11 1111 08Fh — Unimplemented — — 090h — Unimplemented — — 091h PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 0000 0-00 0000 0-00 092h PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 000- 00-- 000- 00-- 093h PIE3 — — — — — — CLC2IE CLC1IE ---- --00 ---- --00 094h — Unimplemented — — 095h OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 1111 1111 1111 1111 096h PCON STKOVF STKUNF — RWDT RMCLR RI POR BOR 00-1 11qq qq-q qquu 097h WDTCON — — WDTPS<4:0> SWDTEN --01 0110 --01 0110 098h — Unimplemented — — 099h OSCCON — IRCF<3:0> — SCS<1:0> -011 1-00 -011 1-00 09Ah OSCSTAT — — — HFIOFR — — LFIOFR HFIOFS ---0 --00 ---q --qq 09Bh ADRESL ADC Result Register Low xxxx xxxx uuuu uuuu 09Ch ADRESH ADC Result Register High xxxx xxxx uuuu uuuu 09Dh ADCON0 — CHS<4:0> GO/DONE ADON -000 0000 -000 0000 09Eh ADCON1 ADFM ADCS<2:0> — — ADPREF<1:0> 0000 --00 0000 --00 09Fh ADCON2 TRIGSEL<3:0> — — — — 0000 ---- 0000 ---- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’. DS40001607D-page 24  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 2 10Ch LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 --xx -xxx --uu -uuu 10Dh — Unimplemented — — 10Eh LATC — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 --xx xxxx --uu uuuu 10Fh — Unimplemented — — 110h — Unimplemented — — 111h CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 0000 -100 0000 -100 112h to — Unimplemented — — 114h 115h CMOUT — — — — — — MC2OUT MC1OUT ---- --00 ---- --00 116h BORCON SBOREN BORFS — — — — — BORRDY 10-- ---q uu-- ---u 117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 0q00 0000 0q00 0000 118h DAC1CON0 DACEN — DACOE1 DACOE2 — DACPSS — — 0-00 -0-- 0-00 -0-- 119h DAC1CON1 — — — DACR<4:0> ---0 0000 ---0 0000 11Ah to — Unimplemented — — 11Ch 11Dh APFCON — — SDOSEL SSSEL T1GSEL — CLC1SEL NCO1SEL --00 0-00 --00 0-00 11Eh — Unimplemented — — 11Fh — Unimplemented — — Bank 3 18Ch ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 ---1 -111 ---1 -111 18Dh — Unimplemented — — 18Eh ANSELC — — — — ANSC3 ANSC2 ANSC1 ANSC0 ---- 1111 ---- 1111 18Fh — Unimplemented — — 190h — Unimplemented — — 191h PMADRL Flash Program Memory Address Register Low Byte 0000 0000 0000 0000 192h PMADRH —(2) Flash Program Memory Address Register High Byte 1000 0000 1000 0000 193h PMDATL Flash Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu 194h PMDATH — — Flash Program Memory Read Data Register High Byte --xx xxxx --uu uuuu 195h PMCON1 —(2) CFGS LWLO FREE WRERR WREN WR RD 1000 x000 1000 q000 196h PMCON2 Flash Program Memory Control Register 2 0000 0000 0000 0000 197h VREGCON(1) — — — — — — VREGPM Reserved ---- --01 ---- --01 198h to — Unimplemented — — 19Fh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 25

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 4 20Ch WPUA — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 --11 1111 --11 1111 20Dh to — Unimplemented — — 212h 213h SSP1MSK MSK<7:0> 1111 1111 1111 1111 214h SSP1STAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 215h SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 0000 0000 0000 0000 216h SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 217h SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 218h to — Unimplemented — — 21Fh Bank 5 28Ch to — Unimplemented — — 29Fh Bank 6 30Ch to — Unimplemented — — 31Fh Bank 7 38Ch to — Unimplemented — — 390h 391h IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 --00 0000 --00 0000 392h IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 --00 0000 --00 0000 393h IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 --00 0000 --00 0000 394h to — Unimplemented — — 39Fh Bank 8 40Ch to — Unimplemented — — 41Fh Bank 9 48Ch to — Unimplemented — — 497h 498h NCO1ACCL NCO1ACC<7:0> 0000 0000 0000 0000 499h NCO1ACCH NCO1ACC<15:8> 0000 0000 0000 0000 49Ah NCO1ACCU NCO1ACC<19:16> 0000 0000 0000 0000 49Bh NCO1INCL NCO1INC<7:0> 0000 0001 0000 0001 49Ch NCO1INCH NCO1INC<15:8> 0000 0000 0000 0000 49Dh — Unimplemented — — 49Eh NCO1CON N1EN N1OE N1OUT N1POL — — — N1PFM 0000 ---0 0000 ---0 49Fh NCO1CLK N1PWS<2:0> — — — N1CKS<1:0> 0000 --00 0000 --00 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’. DS40001607D-page 26  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 10 50Ch to — Unimplemented — — 51Fh Bank 11 58Ch to — Unimplemented — — 59Fh Bank 12 60Ch to — Unimplemented — — 610h 611h PWM1DCL PWM1DCL<7:6> — — — — — — 00-- ---- 00-- ---- 612h PWM1DCH PWM1DCH<7:0> xxxx xxxx uuuu uuuu 613h PWM1CON0 PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 0000 ---- 0000 ---- 614h PWM2DCL PWM2DCL<7:6> — — — — — — 00-- ---- 00-- ---- 615h PWM2DCH PWM2DCH<7:0> xxxx xxxx uuuu uuuu 616h PWM2CON0 PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 0000 ---- 0000 ---- 617h PWM3DCL PWM3DCL<7:6> — — — — — — 00-- ---- 00-- ---- 618h PWM3DCH PWM3DCH<7:0> xxxx xxxx uuuu uuuu 619h PWM3CON0 PWM3EN PWM3OE PWM3OUT PWM3POL — — — — 0000 ---- 0000 ---- 61Ah PWM4DCL PWM4DCL<7:6> — — — — — — 00-- ---- 00-- ---- 61Bh PWM4DCH PWM4DCH<7:0> xxxx xxxx uuuu uuuu 61Ch PWM4CON0 PWM4EN PWM4OE PWM4OUT PWM4POL — — — — 0000 ---- 0000 ---- 61Dh to — Unimplemented — — 61Fh Bank 13 68Ch to — Unimplemented — — 690h 691h CWG1DBR — — CWG1DBR<5:0> --00 0000 --00 0000 692h CWG1DBF — — CWG1DBF<5:0> --xx xxxx --xx xxxx 693h CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA — — G1CS0 0000 0--0 0000 0--0 694h CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — G1IS<2:0> 0000 -000 0000 -000 695h CWG1CON2 G1ASE G1ARSEN — — G1ASDSC2 G1ASDSC1 G1ASDSFLT G1ASDSCLC2 00-- 0000 00-- 0000 696h to — Unimplemented — — 69Fh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 27

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Banks 14-29 x0Ch/ — Unimplemented — — x8Ch — x1Fh/ x9Fh Bank 30 F0Ch to — Unimplemented — — F0Eh F0Fh CLCDATA — — — — — — MLC2OUT MLC1OUT ---- --00 ---- --00 F10h CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 0000 0000 0000 0000 F11h CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 0--- xxxx 0--- uuuu F12h CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> -xxx -xxx -uuu -uuu F13h CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> -xxx -xxx -uuu -uuu F14h CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N xxxx xxxx uuuu uuuu F15h CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N xxxx xxxx uuuu uuuu F16h CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N xxxx xxxx uuuu uuuu F17h CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N xxxx xxxx uuuu uuuu F18h CLC2CON LC2EN LC2OE LC2OUT LC2INTP LC2INTN LC2MODE<2:0> 0000 0000 0000 0000 F19h CLC2POL LC2POL — — — LC2G4POL LC2G3POL LC2G2POL LC2G1POL 0--- xxxx 0--- uuuu F1Ah CLC2SEL0 — LC2D2S<2:0> — LC2D1S<2:0> -xxx -xxx -uuu -uuu F1Bh CLC2SEL1 — LC2D4S<2:0> — LC2D3S<2:0> -xxx -xxx -uuu -uuu F1Ch CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N xxxx xxxx uuuu uuuu F1Dh CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N xxxx xxxx uuuu uuuu F1Eh CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N xxxx xxxx uuuu uuuu F1Fh CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N xxxx xxxx uuuu uuuu F20h to — Unimplemented — — F6Fh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’. DS40001607D-page 28  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Value on all Value on Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 other POR, BOR Resets Bank 31 F8Ch — Unimplemented — — — FE3h FE4h STATUS_ — — — — — Z_SHAD DC_SHAD C_SHAD ---- -xxx ---- -uuu SHAD FE5h WREG_ Working Register Shadow xxxx xxxx uuuu uuuu SHAD FE6h BSR_ — — — Bank Select Register Shadow ---x xxxx ---u uuuu SHAD FE7h PCLATH_ — Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu SHAD FE8h FSR0L_ Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu SHAD FE9h FSR0H_ Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu SHAD FEAh FSR1L_ Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu SHAD FEBh FSR1H_ Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu SHAD FECh — Unimplemented — — FEDh STKPTR — — — Current Stack Pointer ---1 1111 ---1 1111 FEEh TOSL Top-of-Stack Low byte xxxx xxxx uuuu uuuu FEFh TOSH — Top-of-Stack High byte -xxx xxxx -uuu uuuu Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC16F1503 only. 2: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 29

PIC16(L)F1503 3.4 PCL and PCLATH 3.4.2 COMPUTED GOTO The Program Counter (PC) is 15 bits wide. The low byte A computed GOTO is accomplished by adding an offset to comes from the PCL register, which is a readable and the program counter (ADDWF PCL). When performing a writable register. The high byte (PC<14:8>) is not directly table read using a computed GOTO method, care should readable or writable and comes from PCLATH. On any be exercised if the table location crosses a PCL memory Reset, the PC is cleared. Figure3-3 shows the five boundary (each 256-byte block). Refer to Application situations for the loading of the PC. Note AN556, “Implementing a Table Read” (DS00556). 3.4.3 COMPUTED FUNCTION CALLS FIGURE 3-3: LOADING OF PC IN DIFFERENT SITUATIONS A computed function CALL allows programs to maintain tables of functions and provide another way to execute Rev.10-000042A state machines or look-up tables. When performing a 7/30/2013 table read using a computed function CALL, care 14 PCH PCL 0 Instruction should be exercised if the table location crosses a PCL PC withPCLas memory boundary (each 256-byte block). Destination 6 7 0 8 If using the CALL instruction, the PCH<2:0> and PCL PCLATH ALUresult registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. 14 PCH PCL 0 GOTO, The CALLW instruction enables computed calls by com- PC CALL bining PCLATH and W to form the destination address. 4 11 A computed CALLW is accomplished by loading the W 6 0 PCLATH OPCODE<10:0> register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. 14 PCH PCL 0 PC CALLW 3.4.4 BRANCHING 6 7 0 8 The branching instructions add an offset to the PC. PCLATH W This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch 14 PCH PCL 0 PC BRW the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be 15 crossed. PC+W If using BRW, load the W register with the desired PC14 PCH PCL 0 BRA unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W. 15 If using BRA, the entire PC will be loaded with PC+1+, PC+OPCODE<8:0> the signed value of the operand of the BRA instruction. 3.4.1 MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper seven bits to the PCLATH register. When the lower eight bits are written to the PCL register, all 15 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. DS40001607D-page 30  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.5 Stack 3.5.1 ACCESSING THE STACK All devices have a 16-levelx15-bit wide hardware The stack is available through the TOSH, TOSL and stack (refer to Figures3-4 through3-7). The stack STKPTR registers. STKPTR is the current value of the space is not part of either program or data space. The Stack Pointer. TOSH:TOSL register pair points to the PC is PUSHed onto the stack when CALL or CALLW TOP of the stack. Both registers are read/writable. TOS instructions are executed or an interrupt causes a is split into TOSH and TOSL due to the 15-bit size of the branch. The stack is POPed in the event of a RETURN, PC. To access the stack, adjust the value of STKPTR, RETLW or a RETFIE instruction execution. PCLATH is which will position TOSH:TOSL, then read/write to not affected by a PUSH or POP operation. TOSH:TOSL. STKPTR is 5 bits to allow detection of overflow and underflow. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0‘ (Configuration Words). This Note: Care should be taken when modifying the means that after the stack has been PUSHed sixteen STKPTR while interrupts are enabled. times, the seventeenth PUSH overwrites the value that During normal program operation, CALL, CALLW and was stored from the first PUSH. The eighteenth PUSH Interrupts will increment STKPTR while RETLW, overwrites the second PUSH (and so on). The RETURN, and RETFIE will decrement STKPTR. At any STKOVF and STKUNF flag bits will be set on an Over- time STKPTR can be inspected to see how much stack flow/Underflow, regardless of whether the Reset is is left. The STKPTR always points at the currently used enabled. place on the stack. Therefore, a CALL or CALLW will Note1: There are no instructions/mnemonics increment the STKPTR and then write the PC, and a called PUSH or POP. These are actions return will unload the PC and then decrement the that occur from the execution of the STKPTR. CALL, CALLW, RETURN, RETLW and Reference Figure3-4 through Figure3-7 for examples RETFIE instructions or the vectoring to of accessing the stack. an interrupt address. FIGURE 3-4: ACCESSING THE STACK EXAMPLE 1 Rev.10-000043A 7/30/2013 StackResetDisabled TOSH:TOSL 0x0F STKPTR=0x1F (STVREN=0) 0x0E 0x0D 0x0C 0x0B InitialStackConfiguration: 0x0A AfterReset,thestackisempty.The 0x09 emptystackisinitializedsotheStack 0x08 Pointerispointingat0x1F.IftheStack Overflow/UnderflowResetisenabled,the 0x07 TOSH/TOSL register will return ‘0’.Ifthe 0x06 StackOverflow/UnderflowResetis disabled,theTOSH/TOSLregisterwill 0x05 returnthecontentsofstackaddress 0x04 0x0F. 0x03 0x02 0x01 0x00 StackResetEnabled TOSH:TOSL 0x1F 0x0000 STKPTR=0x1F (STVREN=1)  2011-2015 Microchip Technology Inc. DS40001607D-page 31

PIC16(L)F1503 FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2 Rev.10-000043B 7/30/2013 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 Thisfigureshowsthestackconfiguration afterthefirstCALL orasingleinterrupt. 0x08 IfaRETURNinstructionisexecuted,the 0x07 returnaddresswillbeplacedinthe ProgramCounterandtheStackPointer 0x06 decrementedtotheemptystate(0x1F). 0x05 0x04 0x03 0x02 0x01 TOSH:TOSL 0x00 ReturnAddress STKPTR=0x00 FIGURE 3-6: ACCESSING THE STACK EXAMPLE 3 Rev.10-000043C 7/30/2013 0x0F 0x0E 0x0D 0x0C AftersevenCALLsorsixCALLsandan 0x0B interrupt,thestacklookslikethefigureon theleft.AseriesofRETURNinstructionswill 0x0A repeatedlyplacethereturnaddressesinto 0x09 theProgramCounterandpopthestack. 0x08 0x07 TOSH:TOSL 0x06 ReturnAddress STKPTR=0x06 0x05 ReturnAddress 0x04 ReturnAddress 0x03 ReturnAddress 0x02 ReturnAddress 0x01 ReturnAddress 0x00 ReturnAddress DS40001607D-page 32  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4 Rev.10-000043D 7/30/2013 0x0F ReturnAddress 0x0E ReturnAddress 0x0D ReturnAddress 0x0C ReturnAddress 0x0B ReturnAddress 0x0A ReturnAddress Whenthestackisfull,thenextCALLor aninterruptwillsettheStackPointerto 0x09 ReturnAddress 0x10.Thisisidenticaltoaddress0x00so 0x08 ReturnAddress thestackwillwrapandoverwritethe returnaddressat0x00.IftheStack 0x07 ReturnAddress Overflow/UnderflowResetisenabled,a 0x06 ReturnAddress Resetwilloccurandlocation0x00will notbeoverwritten. 0x05 ReturnAddress 0x04 ReturnAddress 0x03 ReturnAddress 0x02 ReturnAddress 0x01 ReturnAddress TOSH:TOSL 0x00 ReturnAddress STKPTR=0x10 3.5.2 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Words is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.6 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory  2011-2015 Microchip Technology Inc. DS40001607D-page 33

PIC16(L)F1503 FIGURE 3-8: INDIRECT ADDRESSING Rev.10-000044A 7/30/2013 0x0000 0x0000 Traditional DataMemory 0x0FFF 0x0FFF 0x1000 Reserved 0x1FFF 0x2000 Linear DataMemory 0x29AF 0x29B0 Reserved 0x7FFF FSR 0x8000 Address 0x0000 Range Program FlashMemory 0xFFFF 0x7FFF Note: Notallmemoryregionsarecompletelyimplemented.Consultdevicememorytablesformemorylimits. DS40001607D-page 34  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 3.6.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-9: TRADITIONAL DATA MEMORY MAP Rev. 10-000056A 7/31/2013 Direct Addressing Indirect Addressing From Opcode 4 BSR 0 6 0 7 FSRxH 0 7 FSRxL 0 0000 Bank Select Location Select Bank Select Location Select 00000 00001 00010 11111 0x00 0x7F Bank 0 Bank 1 Bank 2 Bank 31  2011-2015 Microchip Technology Inc. DS40001607D-page 35

PIC16(L)F1503 3.6.2 LINEAR DATA MEMORY 3.6.3 PROGRAM FLASH MEMORY The linear data memory is the region from FSR To make constant data access easier, the entire address 0x2000 to FSR address 0x29AF. This region is program Flash memory is mapped to the upper half of a virtual region that points back to the 80-byte blocks of the FSR address space. When the MSb of FSRnH is GPR memory in all the banks. set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the Unimplemented memory reads as 0x00. Use of the lower eight bits of each memory location is accessible linear data memory region allows buffers to be larger via INDF. Writing to the program Flash memory cannot than 80 bytes because incrementing the FSR beyond be accomplished via the FSR/INDF interface. All one bank will go directly to the GPR memory of the next instructions that access program Flash memory via the bank. FSR/INDF interface will require one additional The 16 bytes of common memory are not included in instruction cycle to complete. the linear data memory region. FIGURE 3-11: PROGRAM FLASH FIGURE 3-10: LINEAR DATA MEMORY MEMORY MAP MAP Rev. 10-000057A Rev. 10-000058A 7/31/2013 7/31/2013 7 FSRnH 0 7 FSRnL 0 7 FSRnH 0 7 FSRnL 0 1 001 Location Select 0x8000 Location Select 0x2000 0x0000 0x020 Bank 0 0x06F 0x0A0 Bank 1 Program 0x0EF Flash 0x120 Memory Bank 2 (low 8 bits) 0x16F 0xF20 Bank 30 0x7FFF 0xF6F 0xFFFF 0x29AF DS40001607D-page 36  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 4.0 DEVICE CONFIGURATION Device configuration consists of Configuration Words, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. Note: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 37

PIC16(L)F1503 4.2 Register Definitions: Configuration Words REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 U-1 U-1 R/P-1 R/P-1 R/P-1 U-1 — — CLKOUTEN BOREN<1:0>(1) — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 R/P-1 R/P-1 CP(2) MCLRE PWRTE WDTE<1:0> — FOSC<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13-12 Unimplemented: Read as ‘1’ bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O function on the CLKOUT pin 0 = CLKOUT function is enabled on the CLKOUT pin bit 10-9 BOREN<1:0>: Brown-Out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled bit 8 Unimplemented: Read as ‘1’ bit 7 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 =MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 =MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA3 bit. bit 5 PWRTE: Power-Up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bits 11 =WDT enabled 10 =WDT enabled while running and disabled in Sleep 01 =WDT controlled by the SWDTEN bit in the WDTCON register 00 =WDT disabled bit 2 Unimplemented: Read as ‘1’ bit 1-0 FOSC<1:0>: Oscillator Selection bits 11 = ECH: External Clock, High-Power mode: on CLKIN pin 10 = ECM: External Clock, Medium Power mode: on CLKIN pin 01 = ECL: External Clock, Low-Power mode: on CLKIN pin 00 = INTOSC oscillator: I/O function on CLKIN pin Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: Once enabled, code-protect can only be disabled by bulk erasing the device. DS40001607D-page 38  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 U-1 R/P-1 R/P-1 R/P-1 U-1 LVP(1) — LPBOR BORV(2) STVREN — bit 13 bit 8 U-1 U-1 U-1 U-1 U-1 U-1 R/P-1 R/P-1 — — — — — — WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR must be used for programming bit 12 Unimplemented: Read as ‘1’ bit 11 LPBOR: Low-Power BOR Enable bit 1 = Low-Power Brown-out Reset is disabled 0 = Low-Power Brown-out Reset is enabled bit 10 BORV: Brown-Out Reset Voltage Selection bit(2) 1 = Brown-out Reset voltage (VBOR), low trip point selected 0 = Brown-out Reset voltage (VBOR), high trip point selected bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 2 kW Flash memory (PIC16(L)F1503 only): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified 01 = 000h to 3FFh write-protected, 400h to 7FFh may be modified 00 = 000h to 7FFh write-protected, no addresses may be modified Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. 2: See VBOR parameter for specific trip point voltages.  2011-2015 Microchip Technology Inc. DS40001607D-page 39

PIC16(L)F1503 4.3 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 4.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.4“Write Protection” for more information. 4.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Words define the size of the program memory block that is protected. 4.5 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 10.4“User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification” (DS41573). DS40001607D-page 40  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 4.6 Device ID and Revision ID The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section 10.4“User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. 4.7 Register Definitions: Device ID REGISTER 4-3: DEVID: DEVICE ID REGISTER R R R R R R DEV<8:3> bit 13 bit 8 R R R R R R R R DEV<2:0> REV<4:0> bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-5 DEV<8:0>: Device ID bits DEVID<13:0> Values Device DEV<8:0> REV<4:0> PIC16LF1503 10 1101 101 x xxxx PIC16F1503 10 1100 111 x xxxx bit 4-0 REV<4:0>: Revision ID bits These bits are used to identify the revision (see Table under DEV<8:0> above).  2011-2015 Microchip Technology Inc. DS40001607D-page 41

PIC16(L)F1503 5.0 OSCILLATOR MODULE The oscillator module can be configured in one of the following clock modes. 5.1 Overview 1. ECL – External Clock Low-Power mode (0MHz to 0.5MHz) The oscillator module has a wide variety of clock 2. ECM – External Clock Medium Power mode sources and selection features that allow it to be used (0.5MHz to 4MHz) in a wide range of applications while maximizing perfor- 3. ECH – External Clock High-Power mode mance and minimizing power consumption. Figure5-1 (4MHz to 20MHz) illustrates a block diagram of the oscillator module. 4. INTOSC – Internal oscillator (31kHz to 16 MHz) Clock sources can be supplied from an external clock or from one of two internal oscillators, with a choice of Clock Source modes are selected by the FOSC<1:0> speeds selectable via software. Additional clock features bits in the Configuration Words. The FOSC bits include: determine the type of oscillator that will be used when the device is first powered. • Selectable system clock source between external or internal sources via software. The ECH, ECM, and ECL clock modes rely on an external logic level signal as the device clock source. • Fast start-up oscillator allows internal circuits to power-up and stabilize before switching to the 16 The INTOSC internal oscillator block produces a low and MHz HFINTOSC high-frequency clock source, designated LFINTOSC and HFINTOSC. (See Internal Oscillator Block, Figure5-1). A wide selection of device clock frequencies may be derived from these two clock sources. DS40001607D-page 42  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 5-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM Rev.10-000030C 7/30/2013 Sleep (2) EC CLKIN FOSC(1) INTOSC toCPUand Peripherals IRCF<3:0> HFINTOSC 4 16MHz Start-up 8MHz ControlLogic 4MHz Clock Control 2MHz 16MHz Oscillator HFINTOSC(1) aler *5010MkHHzz 3 2 c s FastStart-up Pre *250kHz FOSC<2:0> SCS<1:0> Oscillator *125kHz 62.5kHz *31.25kHz *31kHz LFINTOSC 31kHz LFINTOSC(1) toWDT,PWRT,and Oscillator otherPeripherals FRC 600kHz FRC(1) toADCand Oscillator otherPeripherals *AvailablewithmorethanoneIRCFselection Note 1: See Section 5.2.2.4“Peripheral Clock Sources”. 2: ST Buffer is high speed type when using T1CKI.  2011-2015 Microchip Technology Inc. DS40001607D-page 43

PIC16(L)F1503 5.2 Clock Source Types FIGURE 5-2: EXTERNAL CLOCK (EC) MODE OPERATION Clock sources can be classified as external, internal or peripheral. Rev.10-000045A External clock sources rely on external circuitry for the 7/30/2013 clock source to function. Examples are: oscillator mod- ules (ECH, ECM, ECL modes). Clockfrom Internal clock sources are contained within the oscillator Ext.system OSC1/CLKIN module. The internal oscillator block has two internal PIC®MCU oscillators that are used to generate the internal system FOSC/4orI/O(1) OSC2/CLKOUT clock sources: the 16MHz High-Frequency Internal Oscillator (HFINTOSC) and the 31kHz Low-Frequency Internal Oscillator (LFINTOSC). Note1: OutputdependsupontheCLKOUTENbit The peripheral clock source is a nominal 600kHz oftheConfigurationWords. internal RC oscillator, FRC. The FRC is traditionally used with the ADC module, but is sometimes available to other peripherals. See Section 5.2.2.4“Peripheral Clock Sources”. The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section 5.3“Clock Switching” for additional information. 5.2.1 EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: • Program the FOSC<1:0> bits in the Configuration Words to select an external clock source that will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to: - Secondary oscillator during run-time, or - An external clock source determined by the value of the FOSC bits. See Section 5.3“Clock Switching” for more informa- tion. 5.2.1.1 EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. Figure5-2 shows the pin connections for EC mode. EC mode has three power modes to select from through the FOSC bits in the Configuration Words: • ECH – High power, 4-20MHz • ECM – Medium power, 0.5-4MHz • ECL – Low power, 0-0.5MHz DS40001607D-page 44  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 5.2.2 INTERNAL CLOCK SOURCES 5.2.2.2 LFINTOSC The device may be configured to use the internal oscil- The Low-Frequency Internal Oscillator (LFINTOSC) is lator block as the system clock by performing one of the a 31kHz internal clock source. following actions: The output of the LFINTOSC connects to a multiplexer • Program the FOSC<1:0> bits in Configuration (see Figure5-1). Select 31kHz, via software, using the Words to select the INTOSC clock source, which IRCF<3:0> bits of the OSCCON register. See Section will be used as the default system clock upon a 5.2.2.6“Internal Oscillator Clock Switch Timing” for device Reset. more information. The LFINTOSC is also the frequency • Write the SCS<1:0> bits in the OSCCON register for the Power-up Timer (PWRT) and the, Watchdog to switch the system clock source to the internal Timer (WDT). oscillator during run-time. See Section The LFINTOSC is enabled by selecting 31kHz 5.3“Clock Switching”for more information. (IRCF<3:0> bits of the OSCCON register=000) as the In INTOSC mode, CLKIN is available for general system clock source (SCS bits of the OSCCON purpose I/O. CLKOUT is available for general purpose register= 1x), or when any of the following are I/O or CLKOUT. enabled: The function of the CLKOUT pin is determined by the • Configure the IRCF<3:0> bits of the OSCCON CLKOUTEN bit in Configuration Words. register for the desired LF frequency, and • FOSC<1:0> = 00, or The internal oscillator block has two independent oscillators that provides the internal system clock • Set the System Clock Source (SCS) bits of the source. OSCCON register to ‘1x’. 1. The HFINTOSC (High-Frequency Internal Peripherals that use the LFINTOSC are: Oscillator) is factory calibrated and operates at • Power-up Timer (PWRT) 16MHz. • Watchdog Timer (WDT) 2. The LFINTOSC (Low-Frequency Internal The Low-Frequency Internal Oscillator Ready bit Oscillator) operates at 31kHz. (LFIOFR) of the OSCSTAT register indicates when the 5.2.2.1 HFINTOSC LFINTOSC is running. The High-Frequency Internal Oscillator (HFINTOSC) is 5.2.2.3 FRC a factory calibrated 16MHz internal clock source. The FRC clock is an uncalibrated, nominal 600kHz The output of the HFINTOSC connects to a postscaler peripheral clock source. and multiplexer (see Figure5-1). The frequency derived The FRC is automatically turned on by the peripherals from the HFINTOSC can be selected via software using requesting the FRC clock. the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.6“Internal Oscillator Clock Switch The FRC clock continues to run during Sleep. Timing” for more information. The HFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<1:0> = 00, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’. A fast start-up oscillator allows internal circuits to power-up and stabilize before switching to HFINTOSC. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running. The High-Frequency Internal Oscillator Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value.  2011-2015 Microchip Technology Inc. DS40001607D-page 45

PIC16(L)F1503 5.2.2.4 Peripheral Clock Sources 5.2.2.5 Internal Oscillator Frequency Selection The clock sources described in this chapter and the Timer’s are available to different peripherals. Table5-1 The system clock speed can be selected via software lists the clocks and timers available for each peripheral. using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register. TABLE 5-1: PERIPHERAL CLOCK The postscaled output of the 16MHz HFINTOSC and SOURCES 31kHz LFINTOSC connect to a multiplexer (see Figure5-1). The Internal Oscillator Frequency Select C C S S bits IRCF<3:0> of the OSCCON register (Register5-1) FOSC FRC FINTO FINTO TMR0 TMR1 TMR2 seNleoctt eth:e freFqoulloewncinyg o uatnpyu tR oef stehte, itnhtee rInRaCl Fos<c3i:l0la>to brsit.s H L of the OSCCON register are set to ‘0111’ ADC ● ● and the frequency selection is set to CLC ● ● ● ● ● ● ● 500kHz. The user can modify the IRCF COMP ● bits to select a different frequency. CWG ● ● The IRCF<3:0> bits of the OSCCON register allow MSSP ● ● duplicate selections for some frequencies. These dupli- cate choices can offer system design trade-offs. Lower NCO ● ● power consumption can be obtained when changing PWM ● ● oscillator sources for a given frequency. Faster transi- PWRT ● tion times can be obtained between frequency changes that use the same oscillator source. TMR0 ● TMR1 ● ● 5.2.2.6 Internal Oscillator Clock Switch TMR2 ● Timing WDT ● When switching between the HFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure5-3). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. IRCF<3:0> bits of the OSCCON register are modified. 2. If the new clock is shut down, a clock start-up delay is started. 3. Clock switch circuitry waits for a falling edge of the current clock. 4. The current clock is held low and the clock switch circuitry waits for a rising edge in the new clock. 5. The new clock is now active. 6. The OSCSTAT register is updated as required. 7. Clock switch is complete. See Figure5-3 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table5-2. Start-up delay specifications are located in Table28-8, “Oscillator Parameters”. DS40001607D-page 46  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 5-3: INTERNAL OSCILLATOR SWITCH TIMING HFINTOSC LFINTOSC (WDT disabled) HFINTOSC Oscillator Delay(1) 2-cycle Sync Running LFINTOSC IRCF <3:0> 0 0 System Clock HFINTOSC LFINTOSC (WDT enabled) HFINTOSC 2-cycle Sync Running LFINTOSC   IRCF <3:0> 0 0 System Clock LFINTOSC HFINTOSC LFINTOSC turns off unless WDT is enabled(2) LFINTOSC Oscillator Delay(1) 2-cycle Sync Running HFINTOSC IRCF <3:0> = 0  0 System Clock Note 1: See Table5-2, “Oscillator Switching Delays” for more information. 2: LFINTOSC will continue to run if a peripheral has selected it as the clock source. See Section5.2.2.4 “Peripheral Clock Sources”.  2011-2015 Microchip Technology Inc. DS40001607D-page 47

PIC16(L)F1503 5.3 Clock Switching bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always The system clock source can be switched between cleared. external and internal clock sources via software using When switching between clock sources, a delay is the System Clock Select (SCS) bits of the OSCCON required to allow the new clock to stabilize. These oscil- register. The following clock sources can be selected lator delays are shown in Table5-2. using the SCS bits: • Default system oscillator determined by FOSC 5.3.2 CLOCK SWITCHING BEFORE bits in Configuration Words SLEEP • Internal Oscillator Block (INTOSC) When clock switching from an old clock to a new clock is requested just prior to entering Sleep mode, it is 5.3.1 SYSTEM CLOCK SELECT (SCS) necessary to confirm that the switch is complete before BITS the SLEEP instruction is executed. Failure to do so may The System Clock Select (SCS) bits of the OSCCON result in an incomplete switch and consequential loss register selects the system clock source that is used for of the system clock altogether. Clock switching is the CPU and peripherals. confirmed by monitoring the clock status bits in the • When the SCS bits of the OSCCON register = 00, OSCSTAT register. Switch confirmation can be the system clock source is determined by value of accomplished by sensing that the ready bit for the new the FOSC<1:0> bits in the Configuration Words. clock is set or the ready bit for the old clock is cleared. For example, when switching between the internal • When the SCS bits of the OSCCON register = 01, oscillator with the PLL and the internal oscillator without the system clock source is the secondary the PLL, monitor the PLLR bit. When PLLR is set, the oscillator. switch to 32MHz operation is complete. Conversely, • When the SCS bits of the OSCCON register = 1x, when PPLR is cleared, the switch from 32MHz the system clock source is chosen by the internal operation to the selected internal clock is complete. oscillator frequency selected by the IRCF<3:0> TABLE 5-2: OSCILLATOR SWITCHING DELAYS Switch From Switch To Oscillator Delay LFINTOSC 1 cycle of each clock source Any clock source HFINTOSC 2s (approx.) ECH, ECM, ECL 2 cycles DS40001607D-page 48  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 5.4 Register Definitions: Oscillator Control REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER U-0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0 — IRCF<3:0> — SCS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 1111 = 16MHz 1110 = 8MHz 1101 = 4MHz 1100 = 2MHz 1011 = 1MHz 1010 = 500kHz(1) 1001 = 250kHz(1) 1000 = 125kHz(1) 0111 = 500kHz (default upon Reset) 0110 = 250kHz 0101 = 125kHz 0100 = 62.5kHz 001x = 31.25kHz 000x = 31kHz LF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Reserved 00 = Clock determined by FOSC<1:0> in Configuration Words. Note 1: Duplicate frequency derived from HFINTOSC.  2011-2015 Microchip Technology Inc. DS40001607D-page 49

PIC16(L)F1503 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER U-0 U-0 U-0 R-0/q U-0 U-0 R-0/q R-0/q — — — HFIOFR — — LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional bit 7-5 Unimplemented: Read as ‘0’ bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3-2 Unimplemented: Read as ‘0’ bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = HFINTOSC 16 MHz Oscillator is stable and is driving the INTOSC 0 = HFINTOSC 16 MHz is not stable, the Start-up Oscillator is driving INTOSC TABLE 5-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page OSCCON — IRCF<3:0> — SCS<1:0> 49 OSCSTAT — — — HFIOFR — — LFIOFR HFIOFS 50 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. TABLE 5-4: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — — CLKOUTEN BOREN<1:0> — CONFIG1 38 7:0 CP MCLRE PWRTE WDTE<1:0> — FOSC<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. DS40001607D-page 50  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 6.0 RESETS There are multiple ways to reset this device: • Power-on Reset (POR) • Brown-out Reset (BOR) • Low-Power Brown-out Reset (LPBOR) • MCLR Reset • WDT Reset • RESET instruction • Stack Overflow • Stack Underflow • Programming mode exit To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-chip Reset Circuit is shown in Figure6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Rev. 10-000006A 8/14/2013 ICSP™ Programming Mode Exit RESET Instruction Stack Underflow Stack Overlfow MCLRE VPP/MCLR Sleep WDT Time-out Device Reset Power-on Reset VDD BOR Active(1) Brown-out R Power-up Reset Timer LFINTOSC LPBOR PWRTE Reset Note 1: See Table6-1 for BOR active conditions.  2011-2015 Microchip Technology Inc. DS40001607D-page 51

PIC16(L)F1503 6.1 Power-On Reset (POR) 6.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has The BOR circuit holds the device in Reset when VDD reached an acceptable level for minimum operation. reaches a selectable minimum level. Between the Slow rising VDD, fast operating speeds or analog POR and BOR, complete voltage range coverage for performance may require greater than minimum VDD. execution protection can be implemented. The PWRT, BOR or MCLR features can be used to The Brown-out Reset module has four operating extend the start-up period until all device operation modes controlled by the BOREN<1:0> bits in Configu- conditions have been met. ration Words. The four operating modes are: 6.1.1 POWER-UP TIMER (PWRT) • BOR is always on • BOR is off when in Sleep The Power-up Timer provides a nominal 64ms time-out on POR or Brown-out Reset. • BOR is controlled by software • BOR is always off The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to Refer to Table6-1 for more information. rise to an acceptable level. The Power-up Timer is The Brown-out Reset voltage level is selectable by enabled by clearing the PWRTE bit in Configuration configuring the BORV bit in Configuration Words. Words. A VDD noise rejection filter prevents the BOR from The Power-up Timer starts after the release of the POR triggering on small events. If VDD falls below Vpor for a and BOR. duration greater than parameter TBORDC, the device For additional information, refer to Application Note will reset. See Figure6-2 for more information. AN607, “Power-up Trouble Shooting” (DS00607). TABLE 6-1: BOR OPERATING MODES Instruction Execution upon: BOREN<1:0> SBOREN Device Mode BOR Mode Release of POR or Wake-up from Sleep 11 X X Active Waits for BOR ready(1) (BORRDY = 1) Awake Active Waits for BOR ready 10 X (BORRDY = 1) Sleep Disabled 1 Active Waits for BOR ready(1) X 01 (BORRDY = 1) 0 X Disabled Begins immediately (BORRDY = x) 00 X X Disabled Note 1: In these specific cases, “release of POR” and “wake-up from Sleep,” there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. 6.2.1 BOR IS ALWAYS ON BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. When the BOREN bits of Configuration Words are pro- grammed to ‘11’, the BOR is always on. The device 6.2.3 BOR CONTROLLED BY SOFTWARE start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. When the BOREN bits of Configuration Words are programmed to ‘01’, the BOR is controlled by the BOR protection is active during Sleep. The BOR does SBOREN bit of the BORCON register. The device not delay wake-up from Sleep. start-up is not delayed by the BOR ready condition or 6.2.2 BOR IS OFF IN SLEEP the VDD level. BOR protection begins as soon as the BOR circuit is When the BOREN bits of Configuration Words are pro- ready. The status of the BOR circuit is reflected in the grammed to ‘10’, the BOR is on, except in Sleep. The BORRDY bit of the BORCON register. device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is unchanged by Sleep. DS40001607D-page 52  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 6-2: BROWN-OUT SITUATIONS VDD VBOR Internal Reset TPWRT(1) VDD VBOR Internal < TPWRT Reset TPWRT(1) VDD VBOR Internal Reset TPWRT(1) Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’. 6.3 Register Definitions: BOR Control REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN BORFS — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-Out Reset Enable bit If BOREN <1:0> in Configuration Words = 01: 1 = BOR Enabled 0 = BOR Disabled If BOREN <1:0> in Configuration Words  01: SBOREN is read/write, but has no effect on the BOR bit 6 BORFS: Brown-Out Reset Fast Start bit(1) If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control): 1 = Band gap is forced on always (covers sleep/wake-up/operating cases) 0 = Band gap operates normally, and may turn off If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off) BORFS is Read/Write, but has no effect. bit 5-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-Out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive Note 1: BOREN<1:0> bits are located in Configuration Words.  2011-2015 Microchip Technology Inc. DS40001607D-page 53

PIC16(L)F1503 6.4 Low-Power Brown-Out Reset 6.6 Watchdog Timer (WDT) Reset (LPBOR) The Watchdog Timer generates a Reset if the firmware The Low-Power Brown-out Reset (LPBOR) operates does not issue a CLRWDT instruction within the time-out like the BOR to detect low voltage conditions on the period. The TO and PD bits in the STATUS register are VDD pin. When too low of a voltage is detected, the changed to indicate the WDT Reset. See Section device is held in Reset. When this occurs, a register bit 9.0“Watchdog Timer (WDT)” for more information. (BOR) is changed to indicate that a BOR Reset has occurred. The BOR bit in PCON is used for both BOR 6.7 RESET Instruction and the LPBOR. Refer to Register6-2. A RESET instruction will cause a device Reset. The RI The LPBOR voltage threshold (Lapboard) has a wider bit in the PCON register will be set to ‘0’. See Table6-4 tolerance than the BOR (Vpor), but requires much less for default conditions after a RESET instruction has current (LPBOR current) to operate. The LPBOR is occurred. intended for use when the BOR is configured as dis- abled (BOREN=00) or disabled in Sleep mode 6.8 Stack Overflow/Underflow Reset (BOREN=10). The device can reset when the Stack Overflows or Refer to Figure6-1 to see how the LPBOR interacts Underflows. The STKOVF or STKUNF bits of the PCON with other modules. register indicate the Reset condition. These Resets are 6.4.1 ENABLING LPBOR enabled by setting the STVREN bit in Configuration Words. See Section 3.5.2“Overflow/Underflow The LPBOR is controlled by the LPBOR bit of Reset” for more information. Configuration Words. When the device is erased, the LPBOR module defaults to disabled. 6.9 Programming Mode Exit 6.5 MCLR Upon exit of Programming mode, the device will behave as if a POR had just occurred. The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the 6.10 Power-Up Timer MCLRE bit of Configuration Words and the LVP bit of Configuration Words (Table6-2). The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to TABLE 6-2: MCLR CONFIGURATION allow VDD to stabilize before allowing the device to start running. MCLRE LVP MCLR The Power-up Timer is controlled by the PWRTE bit of 0 0 Disabled Configuration Words. 1 0 Enabled 6.11 Start-up Sequence x 1 Enabled Upon the release of a POR or BOR, the following must 6.5.1 MCLR ENABLED occur before the device will begin executing: When MCLR is enabled and the pin is held low, the 1. Power-up Timer runs to completion (if enabled). device is held in Reset. The MCLR pin is connected to 2. MCLR must be released (if enabled). VDD through an internal weak pull-up. The total time-out will vary based on oscillator configu- The device has a noise filter in the MCLR Reset path. ration and Power-up Timer configuration. See Section The filter will detect and ignore small pulses. 5.0“Oscillator Module” for more information. Note: A Reset does not drive the MCLR pin low. The Power-up Timer runs independently of MCLR Reset. If MCLR is kept low long enough, the Power-up 6.5.2 MCLR DISABLED Timer will expire. Upon bringing MCLR high, the device When MCLR is disabled, the pin functions as a general will begin execution after 10 FOSS cycles (see purpose input and the internal weak pull-up is under Figure6-3). This is useful for testing purposes or to software control. See Section 11.3“PORTA Regis- synchronize more than one device operating in parallel. ters” for more information. DS40001607D-page 54  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 6-3: RESET START-UP SEQUENCE Rev.10-000032B VDD 7/30/2013 InternalPOR Power-upTimer TPWRT MCLR InternalRESET Int.Oscillator FOSC BeginExecution codeexecution(1) codeexecution(1) InternalOscillator,PWRTEN=0 InternalOscillator,PWRTEN=1 VDD InternalPOR Power-upTimer TPWRT MCLR InternalRESET Ext.Clock(EC) FOSC BeginExecution codeexecution(1) codeexecution(1) ExternalClock(ECmodes),PWRTEN=0 ExternalClock(ECmodes),PWRTEN=1 Note1: Codeexecutionbegins10FOSCcyclesaftertheFOSCclockisreleased.  2011-2015 Microchip Technology Inc. DS40001607D-page 55

PIC16(L)F1503 6.12 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON registers are updated to indicate the cause of the Reset. Table6-3 and Table6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RWDT RMCLR RI POR BOR TO PD Condition 0 0 1 1 1 0 x 1 1 Power-on Reset 0 0 1 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 1 0 x x 0 Illegal, PD is set on POR 0 0 u 1 1 u 0 1 1 Brown-out Reset u u 0 u u u u 0 u WDT Reset u u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u u 1 0 Interrupt Wake-up from Sleep u u u 0 u u u u u MCLR Reset during normal operation u u u 0 u u u 1 0 MCLR Reset during Sleep u u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS Program STATUS PCON Condition Counter Register Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u muumuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 muumuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0 Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-- uuuu RESET Instruction Executed 0000h ---u uuuu uu-- u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note1: When the wake-up is due to an interrupt and the Global Interrupt Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. DS40001607D-page 56  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 6.13 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-on Reset (POR) • Brown-out Reset (BOR) • Reset Instruction Reset (RI) • MCLR Reset (RMCLR) • Watchdog Timer Reset (RWDT) • Stack Underflow Reset (STKUNF) • Stack Overflow Reset (STKOVF) The PCON register bits are shown in Register6-2. 6.14 Register Definitions: Power Control REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u STKOVF STKUNF — RWDT RMCLR RI POR BOR bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or cleared by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or cleared by firmware bit 5 Unimplemented: Read as ‘0’ bit 4 RWDT: Watchdog Timer Reset Flag bit 1 = A Watchdog Timer Reset has not occurred or set by firmware 0 = A Watchdog Timer Reset has occurred (cleared by hardware) bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set by firmware 0 = A MCLR Reset has occurred (cleared by hardware) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set by firmware 0 = A RESET instruction has been executed (cleared by hardware) bit 1 POR: Power-On Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-Out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs)  2011-2015 Microchip Technology Inc. DS40001607D-page 57

PIC16(L)F1503 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page BORCON SBOREN BORFS — — — — — BORRDY 53 PCON STKOVF STKUNF — RWDT RMCLR RI POR BOR 57 STATUS — — — TO PD Z DC C 17 WDTCON — — WDTPS<4:0> SWDTEN 77 Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets. TABLE 6-6: SUMMARY OF CONFIGURATION WORD WITH RESETS Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — — CLKOUTEN BOREN<1:0> — CONFIG1 38 7:0 CP MCLRE PWRTE WDTE<1:0> — FOSC<1:0> 13:8 — — LVP DEBUG LPBOR BORV STVREN — CONFIG2 39 7:0 — — — — — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. DS40001607D-page 58  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: • Operation • Interrupt Latency • Interrupts During Sleep • INT Pin • Automatic Context Saving Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure7-1. FIGURE 7-1: INTERRUPT LOGIC Rev.10-000010A 1/13/2014 TMR0IF Wake-up TMR0IE (IfinSleepmode) INTF PeripheralInterrupts INTE (TMR1IF) PIR1<0> IOCIF (TMR1IE) PIE1<0> Interrupt IOCIE toCPU PEIE PIRn<7> GIE PIEn<7>  2011-2015 Microchip Technology Inc. DS40001607D-page 59

PIC16(L)F1503 7.1 Operation 7.2 Interrupt Latency Interrupts are disabled upon any device Reset. They Interrupt latency is defined as the time from when the are enabled by setting the following bits: interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous • GIE bit of the INTCON register interrupts is three or four instruction cycles. For • Interrupt Enable bit(s) for the specific interrupt asynchronous interrupts, the latency is three to five event(s) instruction cycles, depending on when the interrupt • PEIE bit of the INTCON register (if the Interrupt occurs. See Figure7-2 and Figure7-3 for more details. Enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See “Section 7.5“Automatic Context Saving”.”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. DS40001607D-page 60  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 7-2: INTERRUPT LATENCY Fosc Q1Q2 Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4 Q1Q2 Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3Q4Q1Q2Q3 Q4 Interrupt Sampled during Q1 Interrupt GIE PC PC-1 PC PC+1 0004h 0005h Execute 1-Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC+1/FSR New PC/ PC PC-1 PC ADDR PC+1 0004h 0005h Execute 2-Cycle Instruction at PC Inst(PC) NOP NOP Inst(0004h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3-Cycle Instruction at PC INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) Interrupt GIE PC PC-1 PC FSR ADDR PC+1 PC+2 0004h 0005h Execute 3-Cycle Instruction at PC INST(PC) NOP NOP NOP NOP Inst(0004h)  2011-2015 Microchip Technology Inc. DS40001607D-page 61

PIC16(L)F1503 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FOSC CLKOUT (3) INT pin (1) (1) (2) INTF (4) Interrupt Latency GIE INSTRUCTION FLOW PC PC PC + 1 PC + 1 0004h 0005h Instruction Fetched Inst (PC) Inst (PC + 1) — Inst (0004h) Inst (0005h) Instruction Inst (PC – 1) Inst (PC) Forced NOP Forced NOP Inst (0004h) Executed Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: For minimum width of INT pulse, refer to AC specifications in Section 28.0“Electrical Specifications”. 4: INTF is enabled to be set any time during the Q4-Q1 cycles. DS40001607D-page 62  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section 8.0“Power- Down Mode (Sleep)” for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the shadow registers: • W register • STATUS register (except for TO and PD) • BSR register • FSR registers • PCLATH register Upon exiting the Interrupt Service Routine, these regis- ters are automatically restored. Any modifications to these registers during the ISR will be lost. If modifica- tions to any of these registers are desired, the corre- sponding shadow register should be modified and the value will be restored when exiting the ISR. The shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s appli- cation, other registers may also need to be saved.  2011-2015 Microchip Technology Inc. DS40001607D-page 63

PIC16(L)F1503 7.6 Register Definitions: Interrupt Control REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE(1) PEIE(2) TMR0IE INTE IOCIE TMR0IF INTF IOCIF(3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit(1) 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit(2) 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(3) 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 3: The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCxF registers have been cleared by software. DS40001607D-page 64  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 gate acquisition interrupt 0 = Disables the Timer1 gate acquisition interrupt bit 6 ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5-4 Unimplemented: Read as ‘0’ bit 3 SSP1IE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2011-2015 Microchip Technology Inc. DS40001607D-page 65

PIC16(L)F1503 REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 — C2IE C1IE — BCL1IE NCO1IE — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 C2IE: Comparator C2 Interrupt Enable bit 1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4 Unimplemented: Read as ‘0’ bit 3 BCL1IE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 2 NCO1IE: Numerically Controlled Oscillator Interrupt Enable bit 1 = Enables the NCO interrupt 0 = Disables the NCO interrupt bit 1-0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. DS40001607D-page 66  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 — — — — — — CLC2IE CLC1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 CLC2IE: Configurable Logic Block 2 Interrupt Enable bit 1 = Enables the CLC 2 interrupt 0 = Disables the CLC 2 interrupt bit 0 CLC1IE: Configurable Logic Block 1 Interrupt Enable bit 1 = Enables the CLC 1 interrupt 0 = Disables the CLC 1 interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2011-2015 Microchip Technology Inc. DS40001607D-page 67

PIC16(L)F1503 REGISTER 7-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: ADC Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5-4 Unimplemented: Read as ‘0’ bit 3 SSP1IF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 Unimplemented: Read as ‘0’ bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001607D-page 68  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 7-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 — C2IF C1IF — BCL1IF NCO1IF — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 C2IF: Comparator C2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 C1IF: Comparator C1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 Unimplemented: Read as ‘0’ bit 3 BCL1IF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 NCO1IF: Numerically Controlled Oscillator Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1-0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.  2011-2015 Microchip Technology Inc. DS40001607D-page 69

PIC16(L)F1503 REGISTER 7-7: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 — — — — — — CLC2IF CLC1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 CLC2IF: Configurable Logic Block 2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 CLC1IF: Configurable Logic Block 1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001607D-page 70  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 139 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 66 PIE3 — — — — — — CLC2IE CLC1IE 67 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 68 PIR2 — C2IF C1IF — BCL1IF NCO1IF — — 69 PIR3 — — — — — — CLC2IF CLC1IF 70 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts.  2011-2015 Microchip Technology Inc. DS40001607D-page 71

PIC16(L)F1503 8.0 POWER-DOWN MODE (SLEEP) The first three events will cause a device Reset. The last three events are considered a continuation of pro- The Power-down mode is entered by executing a gram execution. To determine whether a device Reset SLEEP instruction. or wake-up event occurred, refer to Section Upon entering Sleep mode, the following conditions exist: 6.12“Determining the Cause of a Reset”. 1. WDT will be cleared but keeps running, if When the SLEEP instruction is being executed, the next enabled for operation during Sleep. instruction (PC + 1) is prefetched. For the device to 2. PD bit of the STATUS register is cleared. wake-up through an interrupt event, the corresponding 3. TO bit of the STATUS register is set. interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE 4. CPU clock is disabled. bit is disabled, the device continues execution at the 5. 31 kHz LFINTOSC is unaffected and peripherals instruction after the SLEEP instruction. If the GIE bit is that operate from it may continue operation in enabled, the device executes the instruction after the Sleep. SLEEP instruction, the device will then call the Interrupt 6. Timer1 and peripherals that operate from Service Routine. In cases where the execution of the Timer1 continue operation in Sleep when the instruction following SLEEP is not desirable, the user Timer1 clock source selected is: should have a NOP after the SLEEP instruction. • LFINTOSC The WDT is cleared when the device wakes up from • T1CKI Sleep, regardless of the source of wake-up. 7. ADC is unaffected, if the dedicated FRC oscillator is selected. 8.1.1 WAKE-UP USING INTERRUPTS 8. I/O ports maintain the status they had before When global interrupts are disabled (GIE cleared) and SLEEP was executed (driving high, low or high- any interrupt source has both its interrupt enable bit impedance). and interrupt flag bit set, one of the following will occur: 9. Resets other than WDT are not affected by • If the interrupt occurs before the execution of a Sleep mode. SLEEP instruction Refer to individual chapters for more details on - SLEEP instruction will execute as a NOP. peripheral operation during Sleep. - WDT and WDT prescaler will not be cleared To minimize current consumption, the following - TO bit of the STATUS register will not be set conditions should be considered: - PD bit of the STATUS register will not be • I/O pins should not be floating cleared. • External circuitry sinking current from I/O pins • If the interrupt occurs during or after the execu- • Internal circuitry sourcing current from I/O pins • Current draw from pins with internal weak pull-ups tion of a SLEEP instruction • Modules using 31 kHz LFINTOSC - SLEEP instruction will be completely • CWG, NCO and CLC modules using HFINTOSC executed I/O pins that are high-impedance inputs should be - Device will immediately wake-up from Sleep pulled to VDD or VSS externally to avoid switching - WDT and WDT prescaler will be cleared currents caused by floating inputs. - TO bit of the STATUS register will be set Examples of internal circuitry that might be sourcing - PD bit of the STATUS register will be cleared current include the FVR module. See Section Even if the flag bits were checked before executing a 13.0“Fixed Voltage Reference (FVR)” for more SLEEP instruction, it may be possible for flag bits to information on this module. become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test 8.1 Wake-up from Sleep the PD bit. If the PD bit is set, the SLEEP instruction The device can wake-up from Sleep through one of the was executed as a NOP. following events: 1. External Reset input on MCLR pin, if enabled 2. BOR Reset, if enabled 3. POR Reset 4. Watchdog Timer, if enabled 5. Any external interrupt 6. Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) DS40001607D-page 72  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN(1) CLKOUT(2) TOST(3) Interrupt flag Interrupt Latency(4) GIE bit Processor in (INTCON reg.) Sleep Instruction Flow PC PC PC + 1 PC + 2 PC + 2 PC + 2 0004h 0005h IFnesttcrhuectdion Inst(PC) = Sleep Inst(PC + 1) Inst(PC + 2) Inst(0004h) Inst(0005h) IEnxsetrcuuctteiodn Inst(PC - 1) Sleep Inst(PC + 1) Forced NOP Forced NOP Inst(0004h) Note 1: External clock. High, Medium, Low mode assumed. 2: CLKOUT is shown here for timing reference. 3: TOST = 1024 TOSC. This delay does not apply to EC, RC and INTOSC Oscillator modes. 4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. 8.2 Low-Power Sleep Mode 8.2.2 PERIPHERAL USAGE IN SLEEP This device contains an internal Low Dropout (LDO) Some peripherals that can operate in Sleep mode will voltage regulator, which allows the device I/O pins to not operate properly with the Low-Power Sleep mode operate at voltages up to 5.5V while the internal device selected. The LDO will remain in the Normal Power logic operates at a lower voltage. The LDO and its mode when those peripherals are enabled. The Low- associated reference circuitry must remain active when Power Sleep mode is intended for use with these the device is in Sleep mode. peripherals: Low-Power Sleep mode allows the user to optimize the • Brown-out Reset (BOR) operating current in Sleep. Low-Power Sleep mode can • Watchdog Timer (WDT) be selected by setting the VREGPM bit of the • External interrupt pin/Interrupt-on-change pins VREGCON register, putting the LDO and reference • Timer1 (with external clock source) circuitry in a low-power state whenever the device is in The Complementary Waveform Generator (CWG), the Sleep. Numerically Controlled Oscillator (NCO) and the Con- 8.2.1 SLEEP CURRENT VS. WAKE-UP figurable Logic Cell (CLC) modules can utilize the TIME HFINTOSC oscillator as either a clock source or as an input source. Under certain conditions, when the In the Default Operating mode, the LDO and reference HFINTOSC is selected for use with the CWG, NCO or circuitry remain in the normal configuration while in CLC modules, the HFINTOSC will remain active Sleep. The device is able to exit Sleep mode quickly during Sleep. This will have a direct effect on the since all circuits remain active. In Low-Power Sleep Sleep mode current. mode, when waking up from Sleep, an extra delay time Please refer to sections Section 23.5“Operation is required for these circuits to return to the normal con- During Sleep”, 24.7 “Operation In Sleep” and 25.10 figuration and stabilize. “Operation During Sleep” for more information. The Low-Power Sleep mode is beneficial for applica- tions that stay in Sleep mode for long periods of time. The Normal mode is beneficial for applications that Note: The PIC16LF1503 does not have a con- need to wake from Sleep quickly and frequently. figurable Low-Power Sleep mode. PIC16LF1503 is an unregulated device and is always in the lowest power state when in Sleep, with no wake-up time pen- alty. This device has a lower maximum VDD and I/O voltage than the PIC16F1503. See Section 28.0“Electrical Specifications” for more information.  2011-2015 Microchip Technology Inc. DS40001607D-page 73

PIC16(L)F1503 8.3 Register Definitions: Voltage Regulator Control REGISTER 8-1: VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1 — — — — — — VREGPM Reserved bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 VREGPM: Voltage Regulator Power Mode Selection bit 1 = Low-Power Sleep mode enabled in Sleep(2) Draws lowest current in Sleep, slower wake-up 0 = Normal Power mode enabled in Sleep(2) Draws higher current in Sleep, faster wake-up bit 0 Reserved: Read as ‘1’. Maintain this bit set. Note 1: PIC16F1503 only. 2: See Section 28.0“Electrical Specifications”. TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 106 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 106 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 106 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 66 PIE3 — — — — — — CLC2IE CLC1IE 67 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 67 PIR2 — C2IF C1IF — BCL1IF NCO1IF — — 67 PIR3 — — — — — — CLC2IF CLC1IF 70 STATUS — — — TO PD Z DC C 17 WDTCON — — WDTPS<4:0> SWDTEN 77 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode. DS40001607D-page 74  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 9.0 WATCHDOG TIMER (WDT) The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: • Independent clock source • Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (nominal) • Multiple Reset conditions • Operation during Sleep FIGURE 9-1: WATCHDOG TIMER BLOCK DIAGRAM Rev. 10-000141A 7/30/2013 WDTE<1:0> = 01 SWDTEN WDTE<1:0> = 11 LFINTOSC 23-(cid:37)it Programmable WDT Prescaler WDT Time-out WDTE<1:0> = 10 Sleep WDTPS<4:0>  2011-2015 Microchip Technology Inc. DS40001607D-page 75

PIC16(L)F1503 9.1 Independent Clock Source 9.3 Time-Out Period The WDT derives its time base from the 31kHz The WDTPS bits of the WDTCON register set the LFINTOSC internal oscillator. Time intervals in this time-out period from 1 ms to 256 seconds (nominal). chapter are based on a nominal interval of 1ms. See After a Reset, the default time-out period is two Section 28.0“Electrical Specifications” for the seconds. LFINTOSC tolerances. 9.4 Clearing the WDT 9.2 WDT Operating Modes The WDT is cleared when any of the following condi- The Watchdog Timer module has four operating modes tions occur: controlled by the WDTE<1:0> bits in Configuration • Any Reset Words. See Table9-1. • CLRWDT instruction is executed 9.2.1 WDT IS ALWAYS ON • Device enters Sleep • Device wakes up from Sleep When the WDTE bits of Configuration Words are set to ‘11’, the WDT is always on. • Oscillator fail • WDT is disabled WDT protection is active during Sleep. See Table9-2 for more information. 9.2.2 WDT IS OFF IN SLEEP When the WDTE bits of Configuration Words are set to 9.5 Operation During Sleep ‘10’, the WDT is on, except in Sleep. When the device enters Sleep, the WDT is cleared. If WDT protection is not active during Sleep. the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is 9.2.3 WDT CONTROLLED BY SOFTWARE cleared again. When the WDTE bits of Configuration Words are set to When a WDT time-out occurs while the device is in ‘01’, the WDT is controlled by the SWDTEN bit of the Sleep, no Reset is generated. Instead, the device WDTCON register. wakes up and resumes operation. The TO and PD bits WDT protection is unchanged by Sleep. See Table9-1 in the STATUS register are changed to indicate the for more details. event. The RWDT bit in the PCON register can also be used. See Section 3.0“Memory Organization” for TABLE 9-1: WDT OPERATING MODES more information. Device WDT WDTE<1:0> SWDTEN Mode Mode 11 X X Active Awake Active 10 X Sleep Disabled 1 X Active 01 0 X Disabled 00 X X Disabled TABLE 9-2: WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0>=00 WDTE<1:0>=01 and SWDTEN = 0 WDTE<1:0>=10 and enter Sleep Cleared CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = INTOSC, EXTCLK Change INTOSC divider (IRCF bits) Unaffected DS40001607D-page 76  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 9.6 Register Definitions: Watchdog Timer Control REGISTER 9-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 — — WDTPS<4:0> SWDTEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1) Bit Value = Prescale Rate 11111 = Reserved. Results in minimum interval (1:32) • • • 10011 = Reserved. Results in minimum interval (1:32) 10010 = 1:8388608 (223) (Interval 256s nominal) 10001 = 1:4194304 (222) (Interval 128s nominal) 10000 = 1:2097152 (221) (Interval 64s nominal) 01111 = 1:1048576 (220) (Interval 32s nominal) 01110 = 1:524288 (219) (Interval 16s nominal) 01101 = 1:262144 (218) (Interval 8s nominal) 01100 = 1:131072 (217) (Interval 4s nominal) 01011 = 1:65536 (Interval 2s nominal) (Reset value) 01010 = 1:32768 (Interval 1s nominal) 01001 = 1:16384 (Interval 512ms nominal) 01000 = 1:8192 (Interval 256ms nominal) 00111 = 1:4096 (Interval 128ms nominal) 00110 = 1:2048 (Interval 64ms nominal) 00101 = 1:1024 (Interval 32ms nominal) 00100 = 1:512 (Interval 16ms nominal) 00011 = 1:256 (Interval 8ms nominal) 00010 = 1:128 (Interval 4ms nominal) 00001 = 1:64 (Interval 2ms nominal) 00000 = 1:32 (Interval 1ms nominal) bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 1x: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 00: This bit is ignored. Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC.  2011-2015 Microchip Technology Inc. DS40001607D-page 77

PIC16(L)F1503 TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page OSCCON — IRCF<3:0> — SCS<1:0> 49 PCON STKOVF STKUNF — RWDT RMCLR RI POR BOR 57 STATUS — — — TO PD Z DC C 17 WDTCON — — WDTPS<4:0> SWDTEN 77 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. TABLE 9-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — — CLKOUTEN BOREN<1:0> — CONFIG1 38 7:0 CP MCLRE PWRTE WDTE<1:0> — FOSC<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer. DS40001607D-page 78  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 10.0 FLASH PROGRAM MEMORY Control bits RD and WR initiate read and write, CONTROL respectively. These bits cannot be cleared, only set, in software. They are cleared by hardware at completion The Flash program memory is readable and writable of the read or write operation. The inability to clear the during normal operation over the full VDD range. WR bit in software prevents the accidental, premature Program memory is indirectly addressed using Special termination of a write operation. Function Registers (SFRs). The SFRs used to access The WREN bit, when set, will allow a write operation to program memory are: occur. On power-up, the WREN bit is clear. The • PMCON1 WRERR bit is set when a write operation is interrupted • PMCON2 by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit • PMDATL and execute the appropriate error handling routine. • PMDATH The PMCON2 register is a write-only register. Attempting • PMADRL to read the PMCON2 register will return all ‘0’s. • PMADRH To enable writes to the program memory, a specific When accessing the program memory, the pattern (the unlock sequence), must be written to the PMDATH:PMDATL register pair forms a 2-byte word PMCON2 register. The required unlock sequence that holds the 14-bit data for read/write, and the prevents inadvertent writes to the program memory PMADRH:PMADRL register pair forms a 2-byte word write latches and Flash program memory. that holds the 15-bit address of the program memory location being read. 10.2 Flash Program Memory Overview The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge It is important to understand the Flash program memory pump rated to operate over the operating voltage range structure for erase and programming operations. Flash of the device. program memory is arranged in rows. A row consists of a fixed number of 14-bit program memory words. A row The Flash program memory can be protected in two is the minimum size that can be erased by user software. ways; by code protection (CP bit in Configuration Words) and write protection (WRT<1:0> bits in Configuration After a row has been erased, the user can reprogram Words). all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write Code protection (CP = 0)(1), disables access, reading latches. These write latches are not directly accessible and writing, to the Flash program memory via external to the user, but may be loaded via sequential writes to device programmers. Code protection does not affect the PMDATH:PMDATL register pair. the self-write and erase functionality. Code protection can only be reset by a device programmer performing Note: If the user wants to modify only a portion a Bulk Erase to the device, clearing all Flash program of a previously programmed row, then the memory, Configuration bits and User IDs. contents of the entire row must be read and saved in RAM prior to the erase. Write protection prohibits self-write and erase to a Then, new data and retained data can be portion or all of the Flash program memory, as defined written into the write latches to reprogram by the bits WRT<1:0>. Write protection does not affect the row of Flash program memory. How- a device programmers ability to read, write or erase the ever, any unprogrammed locations can be device. written without first erasing the row. In this Note 1: Code protection of the entire Flash case, it is not necessary to save and program memory array is enabled by rewrite the other previously programmed clearing the CP bit of Configuration Words. locations. See Table10-1 for Erase Row size and the number of 10.1 PMADRL and PMADRH Registers write latches for Flash program memory. The PMADRH:PMADRL register pair can address up to a maximum of 32K words of program memory. When TABLE 10-1: FLASH MEMORY selecting a program address value, the MSB of the ORGANIZATION BY DEVICE address is written to the PMADRH register and the LSB Write is written to the PMADRL register. Row Erase Device Latches (words) (words) 10.1.1 PMCON1 AND PMCON2 REGISTERS PIC16(L)F1503 16 16 PMCON1 is the control register for Flash program memory accesses.  2011-2015 Microchip Technology Inc. DS40001607D-page 79

PIC16(L)F1503 10.2.1 READING THE FLASH PROGRAM FIGURE 10-1: FLASH PROGRAM MEMORY MEMORY READ FLOWCHART To read a program memory location, the user must: 1. Write the desired address to the Rev.10-000046A 7/30/2013 PMADRH:PMADRL register pair. 2. Clear the CFGS bit of the PMCON1 register. Start 3. Then, set control bit RD of the PMCON1 register. ReadOperation Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction Select ProgramorConfigurationMemory immediately following the “BSF PMCON1,RD” instruction (CFGS) to be ignored. The data is available in the very next cycle, in the PMDATH:PMDATL register pair; therefore, it can be read as two bytes in the following instructions. Select PMDATH:PMDATL register pair will hold this value until WordAddress (PMADRH:PMADRL) another read or until it is written to by the user. Note: The two instructions following a program memory read are required to be NOPs. InitiateReadoperation This prevents the user from executing a (RD=1) 2-cycle instruction on the next instruction after the RD bit is set. Instructionfetchedignored NOP executionforced Instructionfetchedignored NOPexecutionforced Datareadnowin PMDATH:PMDATL End ReadOperation DS40001607D-page 80  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 10-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR PC PC + 1 PMADRH,PMADRL PPCC ++ 33 PC + 4 PC + 5 Flash Data INSTR (PC) INSTR (PC + 1) PMDATH,PMDATL INSTR (PC + 3) INSTR (PC + 4) INSTR(PC + 1) INSTR(PC + 2) INSTR(PC - 1) BSF PMCON1,RD instruction ignored instruction ignored INSTR(PC + 3) INSTR(PC + 4) executed here executed here Forced NOP Forced NOP executed here executed here executed here executed here RD bit PMDATH PMDATL Register EXAMPLE 10-1: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI : PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL PMADRL ; Select Bank for PMCON registers MOVLW PROG_ADDR_LO ; MOVWF PMADRL ; Store LSB of address MOVLW PROG_ADDR_HI ; MOVWF PMADRH ; Store MSB of address BCF PMCON1,CFGS ; Do not select Configuration Space BSF PMCON1,RD ; Initiate read NOP ; Ignored (Figure 10-2) NOP ; Ignored (Figure 10-2) MOVF PMDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF PMDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location  2011-2015 Microchip Technology Inc. DS40001607D-page 81

PIC16(L)F1503 10.2.2 FLASH MEMORY UNLOCK FIGURE 10-3: FLASH PROGRAM SEQUENCE MEMORY UNLOCK SEQUENCE FLOWCHART The unlock sequence is a mechanism that protects the Flash program memory from unintended self-write pro- Rev.10-000047A gramming or erasing. The sequence must be executed 7/30/2013 and completed without interruption to successfully complete any of the following operations: Start • Row Erase UnlockSequence • Load program memory write latches • Write of program memory write latches to program memory Write0x55to • Write of program memory write latches to User PMCON2 IDs The unlock sequence consists of the following steps: 1. Write 55h to PMCON2 Write0xAAto PMCON2 2. Write AAh to PMCON2 3. Set the WR bit in PMCON1 4. NOP instruction Initiate WriteorEraseoperation 5. NOP instruction (WR=1) Once the WR bit is set, the processor will always force two NOP instructions. When an Erase Row or Program Row operation is being performed, the processor will stall Instructionfetchedignored internal operations (typical 2 ms), until the operation is NOPexecutionforced complete and then resume with the next instruction. When the operation is loading the program memory write latches, the processor will always force the two NOP instructions and continue uninterrupted with the next Instructionfetchedignored instruction. NOP executionforced Since the unlock sequence must not be interrupted, global interrupts should be disabled prior to the unlock sequence and re-enabled after the unlock sequence is End completed. UnlockSequence DS40001607D-page 82  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 10.2.3 ERASING FLASH PROGRAM FIGURE 10-4: FLASH PROGRAM MEMORY MEMORY ERASE FLOWCHART While executing code, program memory can only be erased by rows. To erase a row: Rev.10-000048A 7/30/2013 1. Load the PMADRH:PMADRL register pair with any address within the row to be erased. Start 2. Clear the CFGS bit of the PMCON1 register. EraseOperation 3. Set the FREE and WREN bits of the PMCON1 register. 4. Write 55h, then AAh, to PMCON2 (Flash programming unlock sequence). DisableInterrupts (GIE=0) 5. Set control bit WR of the PMCON1 register to begin the erase operation. See Example10-2. Select After the “BSF PMCON1,WR” instruction, the processor ProgramorConfigurationMemory (CFGS) requires two cycles to set up the erase operation. The user must place two NOP instructions immediately following the WR bit set instruction. The processor will halt internal operations for the typical 2ms erase time. SelectRowAddress This is not Sleep mode as the clocks and peripherals (PMADRH:PMADRL) will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. SelectEraseOperation (FREE=1) EnableWrite/EraseOperation (WREN=1) UnlockSequence (SeeNote1) CPUstallswhile Eraseoperationcompletes (2mstypical) DisableWrite/EraseOperation (WREN=0) Re-enableInterrupts (GIE=1) End EraseOperation Note 1: See Figure10-3.  2011-2015 Microchip Technology Inc. DS40001607D-page 83

PIC16(L)F1503 EXAMPLE 10-2: ERASING ONE ROW OF PROGRAM MEMORY ; This row erase routine assumes the following: ; 1. A valid address within the erase row is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL PMADRL MOVF ADDRL,W ; Load lower 8 bits of erase address boundary MOVWF PMADRL MOVF ADDRH,W ; Load upper 6 bits of erase address boundary MOVWF PMADRH BCF PMCON1,CFGS ; Not configuration space BSF PMCON1,FREE ; Specify an erase operation BSF PMCON1,WREN ; Enable writes MOVLW 55h ; Start of required sequence to initiate erase MOVWF PMCON2 ; Write 55h RequiredSequence MMBOOSVVFLWWF 0PPAMMACChOO NN21 ,WR ;;; WSreitt eW RA Abhit to begin erase NOP ; NOP instructions are forced as processor starts NOP ; row erase of program memory. ; ; The processor stalls until the erase process is complete ; after erase processor continues with 3rd instruction BCF PMCON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts DS40001607D-page 84  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 10.2.4 WRITING TO FLASH PROGRAM The following steps should be completed to load the MEMORY write latches and program a row of program memory. These steps are divided into two parts. First, each write Program memory is programmed using the following latch is loaded with data from the PMDATH:PMDATL steps: using the unlock sequence with LWLO = 1. When the 1. Load the address in PMADRH:PMADRL of the last word to be loaded into the write latch is ready, the row to be programmed. LWLO bit is cleared and the unlock sequence 2. Load each write latch with data. executed. This initiates the programming operation, 3. Initiate a programming operation. writing all the latches into Flash program memory. 4. Repeat steps 1 through 3 until all data is written. Note: The special unlock sequence is required Before writing to program memory, the word(s) to be to load a write latch with data or initiate a written must be erased or previously unwritten. Pro- Flash programming operation. If the gram memory can only be erased one row at a time. No unlock sequence is interrupted, writing to automatic erase occurs upon the initiation of the write. the latches or program memory will not be initiated. Program memory can be written one or more words at a time. The maximum number of words written at one 1. Set the WREN bit of the PMCON1 register. time is equal to the number of write latches. See 2. Clear the CFGS bit of the PMCON1 register. Figure10-5 (row writes to program memory with 16 3. Set the LWLO bit of the PMCON1 register. write latches) for more details. When the LWLO bit of the PMCON1 register is The write latches are aligned to the Flash row address ‘1’, the write sequence will only load the write boundary defined by the upper 10-bits of latches and will not initiate the write to Flash PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:5>) program memory. with the lower five bits of PMADRL, (PMADRL<4:0>) 4. Load the PMADRH:PMADRL register pair with determining the write latch being loaded. Write opera- the address of the location to be written. tions do not cross these boundaries. At the completion 5. Load the PMDATH:PMDATL register pair with of a program memory write operation, the data in the the program memory data to be written. write latches is reset to contain 0x3FFF. 6. Execute the unlock sequence (Section 10.2.2“Flash Memory Unlock Sequence”). The write latch is now loaded. 7. Increment the PMADRH:PMADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the PMDATH:PMDATL register pair with the program memory data to be written. 11. Execute the unlock sequence (Section 10.2.2“Flash Memory Unlock Sequence”). The entire program memory latch content is now written to Flash program memory. Note: The program memory write latches are reset to the blank state (0x3FFF) at the completion of every write or erase operation. As a result, it is not necessary to load all the program memory write latches. Unloaded latches will remain in the blank state. An example of the complete write sequence is shown in Example10-3. The initial address is loaded into the PMADRH:PMADRL register pair; the data is loaded using indirect addressing.  2011-2015 Microchip Technology Inc. DS40001607D-page 85

 FIGURE 10-5: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES 2 0 1 1 -20 7 6 0 7 4 3 0 7 5 0 7 0 Rev.107-0/2050/020041B3 1 5 PMADRH PMADRL - - PMDATH PMDATL M icro - rA r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 c3 c2 c1 c0 6 8 c h ip T e c h n 14 o lo g y ProgramMemoryWriteLatches In 11 4 c . 14 14 14 14 WriteLatch#0 WriteLatch#1 WriteLatch#14 WriteLatch#15 00h 01h 0Eh 0Fh PMADRL<3:0> 14 14 14 14 S ta tu s Row Addr Addr Addr Addr 000h 0000h 0001h 000Eh 000Fh 001h 0010h 0011h 001Eh 001Fh 002h 0020h 0021h 002Eh 002Fh CFGS=0 P 7FEh 7FE0h 7FE1h 7FEEh 7FEFh I Row 7FFh 7FF0h 7FF1h 7FFEh 7FFFh C Address 1 PMADRH<6:0>: Decode FlashProgramMemory 6 PMADRL<7:4> D ( S 4 L 0 00 800h 8000h-8003h 8004h–8005h 8006h 8007h–8008h 8009h-801Fh ) 1 F 6 07D CFGS=1 USERID0-3 reserved DDEeVvIC/REeIvD ConWfigourdrastion reserved 1 -p 5 ag ConfigurationMemory 0 e 8 3 6

PIC16(L)F1503 FIGURE 10-6: FLASH MEMORY WRITE FLOWCHART Rev.10-000049A 7/30/2013 Start WriteOperation Determinenumberof wordstobewritteninto EnableWrite/Erase ProgramorConfiguration Operation(WREN=1) Memory.Thenumberof wordscannotexceedthe numberofwordsperrow (word_cnt) Loadthevaluetowrite (PMDATH:PMDATL) DisableInterrupts (GIE=0) Updatethewordcounter WriteLatchestoFlash (word_cnt--) (LWLO=0) Select ProgramorConfig. Memory(CFGS) UnlockSequence Lastwordto Yes (SeeNote1) write? SelectRowAddress (PMADRH:PMADRL) No CPUstallswhileWrite operationcompletes (2mstypical) UnlockSequence SelectWriteOperation (SeeNote1) (FREE=0) LoadWriteLatchesOnly Nodelaywhenwritingto DisableWrite/Erase (LWLO=1) ProgramMemoryLatches Operation(WREN=0) Re-enableInterrupts (GIE=1) IncrementAddress (PMADRH:PMADRL++) End WriteOperation Note 1: See Figure10-3.  2011-2015 Microchip Technology Inc. DS40001607D-page 87

PIC16(L)F1503 EXAMPLE 10-3: WRITING TO FLASH PROGRAM MEMORY (16 WRITE LATCHES) ; This write routine assumes the following: ; 1. 32 bytes of data are loaded, starting at the address in DATA_ADDR ; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, ; stored in little endian format ; 3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL ; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) ; BCF INTCON,GIE ; Disable ints so required sequences will execute properly BANKSEL PMADRH ; Bank 3 MOVF ADDRH,W ; Load initial address MOVWF PMADRH ; MOVF ADDRL,W ; MOVWF PMADRL ; MOVLW LOW DATA_ADDR ; Load initial data address MOVWF FSR0L ; MOVLW HIGH DATA_ADDR ; Load initial data address MOVWF FSR0H ; BCF PMCON1,CFGS ; Not configuration space BSF PMCON1,WREN ; Enable writes BSF PMCON1,LWLO ; Only Load Write Latches LOOP MOVIW FSR0++ ; Load first data byte into lower MOVWF PMDATL ; MOVIW FSR0++ ; Load second data byte into upper MOVWF PMDATH ; MOVF PMADRL,W ; Check if lower bits of address are '00000' XORLW 0x0F ; Check if we're on the last of 16 addresses ANDLW 0x0F ; BTFSC STATUS,Z ; Exit if last of 16 words, GOTO START_WRITE ; MOVLW 55h ; Start of required write sequence: MOVWF PMCON2 ; Write 55h MOVLW 0AAh ; MOVWF PMCON2 ; Write AAh BSF PMCON1,WR ; Set WR bit to begin write NOP ; NOP instructions are forced as processor ; loads program memory write latches NOP ; INCF PMADRL,F ; Still loading latches Increment address GOTO LOOP ; Write next latches START_WRITE BCF PMCON1,LWLO ; No more loading latches - Actually start Flash program ; memory write MOVLW 55h ; Start of required write sequence: MOVWF PMCON2 ; Write 55h RequiredSequence MMBNOOSOVVFPLW WF 0PPAMMACChOO NN21 ,WR ;;;; WSNreOitPt eWi RnA sAbthirtu cttoi obnesg ianr ew rfiotreced as processor writes ; all the program memory write latches simultaneously NOP ; to program memory. ; After NOPs, the processor ; stalls until the self-write process in complete ; after write processor continues with 3rd instruction BCF PMCON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts DS40001607D-page 88  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 10.3 Modifying Flash Program Memory FIGURE 10-7: FLASH PROGRAM MEMORY MODIFY When modifying existing data in a program memory FLOWCHART row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program Rev.10-000050A 7/30/2013 memory is modified using the following steps: 1. Load the starting address of the row to be Start modified. ModifyOperation 2. Read the existing data from the row into a RAM image. 3. Modify the RAM image to contain the new data ReadOperation to be written into program memory. (SeeNote1) 4. Load the starting address of the row to be rewritten. 5. Erase the program memory row. Animageoftheentirerow 6. Load the write latches with data from the RAM readmustbestoredinRAM image. 7. Initiate a programming operation. ModifyImage Thewordstobemodifiedare changedintheRAMimage EraseOperation (SeeNote2) WriteOperation UseRAMimage (SeeNote3) End ModifyOperation Note 1: See Figure10-2. 2: See Figure10-4. 3: See Figure10-5.  2011-2015 Microchip Technology Inc. DS40001607D-page 89

PIC16(L)F1503 10.4 User ID, Device ID and Configuration Word Access Instead of accessing program memory, the User ID’s, Device ID/Revision ID and Configuration Words can be accessed when CFGS=1 in the PMCON1 register. This is the region that would be pointed to by PC<15>=1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table10-2. When read access is initiated on an address outside the parameters listed in Table10-2, the PMDATH:PMDATL register pair is cleared, reading back ‘0’s. TABLE 10-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS=1) Address Function Read Access Write Access 8000h-8003h User IDs Yes Yes 8006h Device ID/Revision ID Yes No 8007h-8008h Configuration Words 1 and 2 Yes No EXAMPLE 10-4: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL PMADRL ; Select correct Bank MOVLW PROG_ADDR_LO ; MOVWF PMADRL ; Store LSB of address CLRF PMADRH ; Clear MSB of address BSF PMCON1,CFGS ; Select Configuration Space BCF INTCON,GIE ; Disable interrupts BSF PMCON1,RD ; Initiate read NOP ; Executed (See Figure 10-2) NOP ; Ignored (See Figure 10-2) BSF INTCON,GIE ; Restore interrupts MOVF PMDATL,W ; Get LSB of word MOVWF PROG_DATA_LO ; Store in user location MOVF PMDATH,W ; Get MSB of word MOVWF PROG_DATA_HI ; Store in user location DS40001607D-page 90  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 10.5 Write Verify It is considered good programming practice to verify that program memory writes agree with the intended value. Since program memory is stored as a full page then the stored program memory contents are compared with the intended data stored in RAM after the last write is complete. FIGURE 10-8: FLASH PROGRAM MEMORY VERIFY FLOWCHART Rev.10-000051A 7/30/2013 Start VerifyOperation Thisroutineassumesthatthelast rowofdatawrittenwasfroman imagesavedonRAM.Thisimage willbeusedtoverifythedata currentlystoredinFlashProgram Memory ReadOperation (SeeNote1) PMDAT= No RAMimage? Yes Fail VerifyOperation No Lastword? Yes End VerifyOperation Note 1: See Figure10-2.  2011-2015 Microchip Technology Inc. DS40001607D-page 91

PIC16(L)F1503 10.6 Register Definitions: Flash Program Memory Control REGISTER 10-1: PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMDAT<7:0>: Read/write value for Least Significant bits of program memory REGISTER 10-2: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — PMDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDAT<13:8>: Read/write value for Most Significant bits of program memory REGISTER 10-3: PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMADR<7:0>: Specifies the Least Significant bits for program memory address REGISTER 10-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 —(1) PMADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘1’ bit 6-0 PMADR<14:8>: Specifies the Most Significant bits for program memory address Note 1: Unimplemented, read as ‘1’. DS40001607D-page 92  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 10-5: PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER U-1 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-x/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 —(1) CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 Unimplemented: Read as ‘1’ bit 6 CFGS: Configuration Select bit 1 = Access Configuration, User ID and Device ID Registers 0 = Access Flash program memory bit 5 LWLO: Load Write Latches Only bit(3) 1 = Only the addressed program memory write latch is loaded/updated on the next WR command 0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches will be initiated on the next WR command bit 4 FREE: Program Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (hardware cleared upon completion) 0 = Performs a write operation on the next WR command bit 3 WRERR: Program/Erase Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit). 0 = The program or erase operation completed normally. bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash bit 1 WR: Write Control bit 1 = Initiates a program Flash program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash is complete and inactive. bit 0 RD: Read Control bit 1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash read. Note 1: Unimplemented bit, read as ‘1’. 2: The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1). 3: The LWLO bit is ignored during a program memory erase operation (FREE = 1).  2011-2015 Microchip Technology Inc. DS40001607D-page 93

PIC16(L)F1503 REGISTER 10-6: PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 Program Memory Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Flash Memory Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the PMCON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PMCON1 —(1) CFGS LWLO FREE WRERR WREN WR RD 93 PMCON2 Program Memory Control Register 2 94 PMADRL PMADRL<7:0> 92 PMADRH —(1) PMADRH<6:0> 92 PMDATL PMDATL<7:0> 92 PMDATH — — PMDATH<5:0> 92 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. Note 1: Unimplemented, read as ‘1’. TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH RESETS Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — — CLKOUTEN BOREN<1:0> — CONFIG1 38 7:0 CP MCLRE PWRTE WDTE<1:0> — FOSC<1:0> 13:8 — — LVP DEBUG LPBOR BORV STVREN — CONFIG2 39 7:0 — — — — — — WRT<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. DS40001607D-page 94  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 11.0 I/O PORTS FIGURE 11-1: GENERIC I/O PORT OPERATION Each port has three standard registers for its operation. These registers are: Rev.10-000052A 7/30/2013 • TRISx registers (data direction) ReadLATx • PORTx registers (reads the levels on the pins of the device) TRISx • LATx registers (output latch) Some ports may have one or more of the following D Q additional registers. These registers are: WriteLATx WritePORTx VDD • ANSELx (analog select) CK • WPUx (weak pull-up) DataRegister In general, when a peripheral is enabled on a port pin, Databus that pin cannot be used as a general purpose output. I/Opin However, the pin can still be read. ReadPORTx Todigitalperipherals TABLE 11-1: PORT AVAILABILITY PER ANSELx DEVICE Toanalogperipherals A B C T T T VSS Device R R R O O O P P P PIC16(L)F1503 ● ● The Data Latch (LATx registers) is useful for read-modify-write operations on the value that the I/O pins are driving. A write operation to the LATx register has the same effect as a write to the corresponding PORTx register. A read of the LATx register reads of the values held in the I/O PORT latches, while a read of the PORTx register reads the actual I/O pin value. Ports that support analog inputs have an associated ANSELx register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure11-1.  2011-2015 Microchip Technology Inc. DS40001607D-page 95

PIC16(L)F1503 11.1 Alternate Pin Function These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the The Alternate Pin Function Control (APFCON) register correct pin. The unselected pin will be unaffected. is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register11-1. For this device family, the following functions can be moved between different pins. • SS • T1G • CLC1 • NCO1 • SDOSEL 11.2 Register Definitions: Alternate Pin Function Control REGISTER 11-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 — — SDOSEL SSSEL T1GSEL — CLC1SEL NCO1SEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 SDOSEL: Pin Selection bit 1 = SDO function is on RA4 0 = SDO function is on RC2 bit 4 SSSEL: Pin Selection bit 1 = SS function is on RA3 0 = SS function is on RC3 bit 3 T1GSEL: Pin Selection bit 1 = T1G function is on RA3 0 = T1G function is on RA4 bit 2 Unimplemented: Read as ‘0’ bit 1 CLC1SEL: Pin Selection bit 1 = CLC1 function is on RC5 0 = CLC1 function is on RA2 bit 0 NCO1SEL: Pin Selection bit 1 = NCO1 function is on RA4 0 = NCO1 function is on RC1 DS40001607D-page 96  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 11.3 PORTA Registers 11.3.4 PORTA FUNCTIONS AND OUTPUT PRIORITIES 11.3.1 DATA REGISTER Each PORTA pin is multiplexed with other functions. The PORTA is a 6-bit wide, bidirectional port. The pins, their combined functions and their output priorities corresponding data direction register is TRISA are shown in Table11-2. (Register11-3). Setting a TRISA bit (= 1) will make the When multiple outputs are enabled, the actual pin corresponding PORTA pin an input (i.e., disable the control goes to the peripheral with the highest priority. output driver). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., enables Analog input functions, such as ADC and comparator output driver and puts the contents of the output latch inputs, are not shown in the priority lists. These inputs on the selected pin). The exception is RA3, which is are active when the I/O pin is set for Analog mode using input-only and its TRIS bit will always read as ‘1’. the ANSELx registers. Digital output functions may Example11-1 shows how to initialize an I/O port. control the pin when it is in Analog mode with the priority shown below in Table11-2. Reading the PORTA register (Register11-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write TABLE 11-2: PORTA OUTPUT PRIORITY operations. Therefore, a write to a port implies that the Pin Name Function Priority(1) port pins are read, this value is modified and then written to the PORT data latch (LATA). RA0 ICSPDAT DACOUT1 11.3.2 DIRECTION CONTROL RA0 RA1 RA1 The TRISA register (Register11-3) controls the PORTA pin output drivers, even when they are being RA2 DACOUT2 used as analog inputs. The user should ensure the bits CLC1(2) C1OUT in the TRISA register are maintained set when using PWM3 them as analog inputs. I/O pins configured as analog RA2 input always read ‘0’. RA3 None 11.3.3 ANALOG CONTROL RA4 CLKOUT NCO1(3) The ANSELA register (Register11-5) is used to SDO(3) configure the Input mode of an I/O pin to analog. RA4 Setting the appropriate ANSELA bit high will cause all RA5 RA5 digital reads on the pin to be read as ‘0’ and allow Note 1: Priority listed from highest to lowest. analog functions on the pin to operate correctly. 2: Default pin (see APFCON register). The state of the ANSELA bits has no effect on digital 3: Alternate pin (see APFCON register). output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. EXAMPLE 11-1: INITIALIZING PORTA BANKSEL PORTA ; CLRF PORTA ;Init PORTA BANKSEL LATA ;Data Latch CLRF LATA ; BANKSEL ANSELA ; CLRF ANSELA ;digital I/O BANKSEL TRISA ; MOVLW B'00111000' ;Set RA<5:3> as inputs MOVWF TRISA ;and set RA<2:0> as ;outputs  2011-2015 Microchip Technology Inc. DS40001607D-page 97

PIC16(L)F1503 11.4 Register Definitions: PORTA REGISTER 11-2: PORTA: PORTA REGISTER U-0 U-0 R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x — — RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RA<5:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 11-3: TRISA: PORTA TRI-STATE REGISTER U-0 U-0 R/W-1/1 R/W-1/1 U-1 R/W-1/1 R/W-1/1 R/W-1/1 — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 TRISA<5:4>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output bit 3 Unimplemented: Read as ‘1’ bit 2-0 TRISA<2:0>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note 1: Unimplemented, read as ‘1’. DS40001607D-page 98  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 11-4: LATA: PORTA DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — — LATA5 LATA4 — LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1) bit 3 Unimplemented: Read as ‘0’ bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 11-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 — — — ANSA4 — ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4 ANSA4: Analog Select between Analog or Digital Function on pins RA4, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. bit 3 Unimplemented: Read as ‘0’ bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on pins RA<2:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin.  2011-2015 Microchip Technology Inc. DS40001607D-page 99

PIC16(L)F1503 REGISTER 11-6: WPUA: WEAK PULL-UP PORTA REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(3) 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is configured as an output. 3: For the WPUA3 bit, when MCLRE = 1, weak pull-up is internally enabled, but not reported here. TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 APFCON — — SDOSEL SSSEL T1GSEL — CLC1SEL NCO1SEL 96 LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 99 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 139 PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 98 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 WPUA — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 100 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Note 1: Unimplemented, read as ‘1’. TABLE 11-4: SUMMARY OF CONFIGURATION WORD WITH PORTA Register Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 on Page 13:8 — — — — CLKOUTEN BOREN<1:0> — CONFIG1 38 7:0 CP MCLRE PWRTE WDTE<1:0> — FOSC<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. DS40001607D-page 100  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 11.5 PORTC Registers 11.5.4 PORTC FUNCTIONS AND OUTPUT PRIORITIES 11.5.1 DATA REGISTER Each PORTC pin is multiplexed with other functions. The PORTC is a 8-bit wide, bidirectional port. The pins, their combined functions and their output priorities corresponding data direction register is TRISC are shown in Table11-5. (Register11-8). Setting a TRISC bit (= 1) will make the When multiple outputs are enabled, the actual pin corresponding PORTC pin an input (i.e., disable the control goes to the peripheral with the highest priority. output driver). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., enable the Analog input and some digital input functions are not output driver and put the contents of the output latch included in the output priority list. These input functions on the selected pin). Example11-1 shows how to can remain active when the pin is configured as an initialize an I/O port. output. Certain digital input functions override other port functions and are included in the output priority list. Reading the PORTC register (Register11-7) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write TABLE 11-5: PORTC OUTPUT PRIORITY operations. Therefore, a write to a port implies that the Pin Name Function Priority(1) port pins are read, this value is modified and then written to the PORT data latch (LATC). RC0 CLC2 RC0 11.5.2 DIRECTION CONTROL RC1 NCO1(2) The TRISC register (Register11-8) controls the PORTC PWM4 pin output drivers, even when they are being used as RC1 analog inputs. The user should ensure the bits in the RC2 SDO(2) TRISC register are maintained set when using them as RC2 analog inputs. I/O pins configured as analog input always RC3 PWM2 read ‘0’. RC3 11.5.3 ANALOG CONTROL RC4 CWG1B C2OUT The ANSELC register (Register11-10) is used to RC4 configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELC bit high will cause all RC5 CWG1A digital reads on the pin to be read as ‘0’ and allow CLC1(3) analog functions on the pin to operate correctly. PWM1 RC5 The state of the ANSELC bits has no effect on digital out- put functions. A pin with TRIS clear and ANSELC set will Note 1: Priority listed from highest to lowest. still operate as a digital output, but the Input mode will be 2: Default pin (see APFCON register). analog. This can cause unexpected behavior when exe- 3: Alternate pin (see APFCON register). cuting read-modify-write instructions on the affected port. Note: The ANSELC bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software.  2011-2015 Microchip Technology Inc. DS40001607D-page 101

PIC16(L)F1503 11.6 Register Definitions: PORTC REGISTER 11-7: PORTC: PORTC REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RC<5:0>: PORTC General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 11-8: TRISC: PORTC TRI-STATE REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TRISC<5:0>: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output REGISTER 11-9: LATC: PORTC DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 LATC<5:0>: PORTC Output Latch Value bits(1) Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values. DS40001607D-page 102  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 11-10: ANSELC: PORTC ANALOG SELECT REGISTER U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — — — ANSC3 ANSC2 ANSC1 ANSC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ANSC<3:0>: Analog Select between Analog or Digital Function on pins RC<3:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 11-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELC — — — — ANSC3 ANSC2 ANSC1 ANSC0 103 LATC — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 102 PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 102 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC.  2011-2015 Microchip Technology Inc. DS40001607D-page 103

PIC16(L)F1503 12.0 INTERRUPT-ON-CHANGE 12.3 Interrupt Flags The PORTA pins can be configured to operate as The IOCAFx bits located in the IOCAF register are Interrupt-on-Change (IOC) pins. An interrupt can be status flags that correspond to the interrupt-on-change generated by detecting a signal that has either a rising pins of the associated port. If an expected edge is edge or a falling edge. Any individual port pin, or detected on an appropriately enabled pin, then the combination of port pins, can be configured to generate status flag for that pin will be set, and an interrupt will be an interrupt. The interrupt-on-change module has the generated if the IOCIE bit is set. The IOCIF bit of the following features: INTCON register reflects the status of all IOCAFx bits. • Interrupt-on-Change enable (Master Switch) 12.4 Clearing Interrupt Flags • Individual pin configuration • Rising and falling edge detection The individual status flags, (IOCAFx bits), can be • Individual pin interrupt flags cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated Figure12-1 is a block diagram of the IOC module. status flag will be set at the end of the sequence, regardless of the value actually being written. 12.1 Enabling the Module In order to ensure that no detected edge is lost while To allow individual port pins to generate an interrupt, the clearing flags, only AND operations masking out known IOCIE bit of the INTCON register must be set. If the changed bits should be performed. The following IOCIE bit is disabled, the edge detection on the pin will sequence is an example of what should be performed. still occur, but an interrupt will not be generated. EXAMPLE 12-1: CLEARING INTERRUPT 12.2 Individual Pin Configuration FLAGS (PORTA EXAMPLE) For each port pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a MOVLW 0xff rising edge, the associated bit of the IOCxP register is XORWF IOCAF, W set. To enable a pin to detect a falling edge, the ANDWF IOCAF, F associated bit of the IOCxN register is set. A pin can be configured to detect rising and falling 12.5 Operation in Sleep edges simultaneously by setting both associated bits of the IOCxP and IOCxN registers, respectively. The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCxF register will be updated prior to the first instruction executed out of Sleep. DS40001607D-page 104  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 12-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE) Rev. 10-000037A 6/2/2014 IOCANx D Q R Q4Q1 edge detect RAx to data bus IOCAPx D Q data bus = D S Q IOCAFx 0 or 1 write IOCAFx R IOCIE Q2 IOC interrupt to CPU core from all other IOCnFx individual pin detectors FOSC Q1 Q1 Q1 Q2 Q2 Q2 Q3 Q3 Q3 Q4 Q4 Q4 Q4Q1 Q4Q1 Q4Q1 Q4Q1  2011-2015 Microchip Technology Inc. DS40001607D-page 105

PIC16(L)F1503 12.6 Register Definitions: Interrupt-on-Change Control REGISTER 12-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAP<5:0>: Interrupt-on-Change PORTA Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 12-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAN<5:0>: Interrupt-on-Change PORTA Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 12-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAF<5:0>: Interrupt-on-Change PORTA Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCAPx=1 and a rising edge was detected on RAx, or when IOCANx=1 and a falling edge was detected on RAx. 0 = No change was detected, or the user cleared the detected change. DS40001607D-page 106  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 12-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 106 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 106 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 106 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 107

PIC16(L)F1503 13.0 FIXED VOLTAGE REFERENCE The ADFVR<1:0> bits of the FVRCON register are (FVR) used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Refer- The Fixed Voltage Reference (FVR) is a stable voltage ence Section 15.0“Analog-to-Digital Converter reference, independent of VDD, with a nominal output (ADC) Module” for additional information. level (VFVR) of 1.024V. The output of the FVR can be The CDAFVR<1:0> bits of the FVRCON register are configured to supply a reference voltage to the used to enable and configure the gain amplifier settings following: for the reference supplied to the comparator modules. • ADC input channel Reference Section 17.0“Comparator Module” for • Comparator positive input additional information. • Comparator negative input To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by The FVR can be enabled by setting the FVREN bit of clearing the Buffer Gain Selection bits. the FVRCON register. 13.2 FVR Stabilization Period 13.1 Independent Gain Amplifier When the Fixed Voltage Reference module is enabled, The output of the FVR supplied to the peripherals, (listed it requires time for the reference and amplifier circuits above), is routed through a programmable gain amplifier. to stabilize. Once the circuits stabilize and are ready for Each amplifier can be programmed for a gain of 1x, 2x or use, the FVRRDY bit of the FVRCON register will be 4x, to produce the three possible voltage levels. set. See the FVR Stabilization Period characterization graph, Figure29-52. FIGURE 13-1: VOLTAGE REFERENCE BLOCK DIAGRAM Rev. 10-000053A 8/6/2013 2 ADFVR<1:0> 1x FVR_buffer1 2x (To ADC Module) 4x 2 CDAFVR<1:0> 1x FVR_buffer2 2x (To Comparators) 4x FVREN + _ FVRRDY Note 1 Note1: Any peripheral requiring the Fixed Reference (see Table13-1). DS40001607D-page 108  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 13-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR) Peripheral Conditions Description HFINTOSC FOSC<2:0> = 010 and INTOSC is active and device is not in Sleep. IRCF<3:0> = 000x BOREN<1:0> = 11 BOR always enabled. BOR BOREN<1:0> = 10 and BORFS = 1 BOR disabled in Sleep mode, BOR Fast Start enabled. BOREN<1:0> = 01 and BORFS = 1 BOR under software control, BOR Fast Start enabled. LDO All PIC16F1503 devices, when The device runs off of the Low-Power Regulator when in Sleep VREGPM = 1 and not in Sleep mode.  2011-2015 Microchip Technology Inc. DS40001607D-page 109

PIC16(L)F1503 13.3 Register Definitions: FVR Control REGISTER 13-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 FVREN(1) FVRRDY(2) TSEN(3) TSRNG(3) CDAFVR<1:0>(1) ADFVR<1:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit(1) 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(2) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 CDAFVR<1:0>: Comparator FVR Buffer Gain Selection bits(1) 11 =Comparator FVR Buffer Gain is 4x, with output voltage = 4x VFVR (4.096V nominal)(4) 10 =Comparator FVR Buffer Gain is 2x, with output voltage = 2x VFVR (2.048V nominal)(4) 01 =Comparator FVR Buffer Gain is 1x, with output voltage = 1x VFVR (1.024V nominal) 00 =Comparator FVR Buffer is off bit 1-0 ADFVR<1:0>: ADC FVR Buffer Gain Selection bit(1) 11 =ADC FVR Buffer Gain is 4x, with output voltage = 4x VFVR (4.096V nominal)(4) 10 =ADC FVR Buffer Gain is 2x, with output voltage = 2x VFVR (2.048V nominal)(4) 01 =ADC FVR Buffer Gain is 1x, with output voltage = 1x VFVR (1.024V nominal) 00 =ADC FVR Buffer is off Note 1: To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clear- ing the Buffer Gain Selection bits. 2: FVRRDY is always ‘1’ for the PIC16F1503 devices. 3: See Section 14.0“Temperature Indicator Module” for additional information. 4: Fixed Voltage Reference output cannot exceed VDD. TABLE 13-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR>1:0> ADFVR<1:0> 110 Legend: Shaded cells are unused by the Fixed Voltage Reference module. DS40001607D-page 110  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 14.0 TEMPERATURE INDICATOR FIGURE 14-1: TEMPERATURE CIRCUIT MODULE DIAGRAM This family of devices is equipped with a temperature Rev. 10-000069A circuit designed to measure the operating temperature VDD 7/31/2013 of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The TSEN output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, TSRNG depending on the level of calibration performed. A one- point calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application VOUT Note AN1333, “Use and Calibration of the Internal To ADC Temp. Indicator Temperature Indicator” (DS01333) for more details regarding the calibration process. 14.1 Circuit Operation Figure14-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is 14.2 Minimum Operating VDD achieved by measuring the forward voltage drop across When the temperature circuit is operated in low range, multiple silicon junctions. the device may be operated at any operating voltage Equation14-1 describes the output characteristics of that is within specifications. the temperature indicator. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high EQUATION 14-1: VOUT RANGES enough to ensure that the temperature circuit is correctly biased. High Range: VOUT = VDD - 4VT Table14-1 shows the recommended minimum VDD vs. range setting. Low Range: VOUT = VDD - 2VT TABLE 14-1: RECOMMENDED VDD VS. RANGE The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 13.0“Fixed Voltage Reference (FVR)” for more 3.6V 1.8V information. The circuit is enabled by setting the TSEN bit of the 14.3 Temperature Output FVRCON register. When disabled, the circuit draws no current. The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for The circuit operates in either high or low range. The high the temperature circuit output. Refer to Section range, selected by setting the TSRNG bit of the 15.0“Analog-to-Digital Converter (ADC) Module” for FVRCON register, provides a wider output voltage. This detailed information. provides more resolution over the temperature range, but may be less consistent from part to part. This range 14.4 ADC Acquisition Time requires a higher bias voltage to operate and thus, a higher VDD is needed. To ensure accurate temperature measurements, the The low range is selected by clearing the TSRNG bit of user must wait at least 200s after the ADC input the FVRCON register. The low range generates a lower multiplexer is connected to the temperature indicator voltage drop and thus, a lower bias voltage is needed to output before the conversion is performed. In addition, operate the circuit. The low range is provided for low the user must wait 200s between sequential voltage operation. conversions of the temperature indicator output.  2011-2015 Microchip Technology Inc. DS40001607D-page 111

PIC16(L)F1503 TABLE 14-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR>1:0> ADFVR<1:0> 110 Legend: Shaded cells are unused by the temperature indicator module. DS40001607D-page 112  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 15.0 ANALOG-TO-DIGITAL approximation and stores the conversion result into the CONVERTER (ADC) MODULE ADC result registers (ADRESH:ADRESL register pair). Figure15-1 shows the block diagram of the ADC. The Analog-to-Digital Converter (ADC) allows The ADC voltage reference is software selectable to be conversion of an analog input signal to a 10-bit binary either internally generated or externally supplied. representation of that signal. This device uses analog The ADC can generate an interrupt upon completion of inputs, which are multiplexed into a single sample and a conversion. This interrupt can be used to wake-up the hold circuit. The output of the sample and hold is device from Sleep. connected to the input of the converter. The converter generates a 10-bit binary result via successive FIGURE 15-1: ADC BLOCK DIAGRAM VDD ADPREF Rev.10-000033A 7/30/2013 Positive VDD Reference Select VREF+pin ADCS<2:0> AN0 VSS ANa VRNEG VRPOS External . Channel . FOSC/nDFivoisdcer FOSC Inputs ADC ADC_clk . sampled Clock ANz input Select FRC FRC TempIndicator Internal Channel DACx_output ADCCLOCKSOURCE Inputs FVR_buffer1 ADC SampleCircuit CHS<4:0> ADFM setbitADIF 10 complete 10-bitResult Writetobit GO/DONE GO/DONE Q1 16 start Q4 ADRESH ADRESL Q2 Enable TriggerSelect TRIGSEL<3:0> ADON . . . VSS TriggerSources AUTOCONVERSION TRIGGER  2011-2015 Microchip Technology Inc. DS40001607D-page 113

PIC16(L)F1503 15.1 ADC Configuration 15.1.4 CONVERSION CLOCK When configuring and using the ADC the following The source of the conversion clock is software select- functions must be considered: able via the ADCS bits of the ADCON1 register. There are seven possible clock options: • Port configuration • FOSC/2 • Channel selection • FOSC/4 • ADC voltage reference selection • FOSC/8 • ADC conversion clock source • FOSC/16 • Interrupt control • FOSC/32 • Result formatting • FOSC/64 15.1.1 PORT CONFIGURATION • FRC (internal RC oscillator) The ADC can be used to convert both analog and The time to complete one bit conversion is defined as digital signals. When converting analog signals, the I/O TAD. One full 10-bit conversion requires 11.5 TAD pin should be configured for analog by setting the periods as shown in Figure15-2. associated TRIS and ANSEL bits. Refer to Section For correct conversion, the appropriate TAD specifica- 11.0“I/O Ports” for more information. tion must be met. Refer to the ADC conversion require- Note: Analog voltages on any pin that is defined ments in Section 28.0“Electrical Specifications” for as a digital input may cause the input more information. Table15-1 gives examples of buffer to conduct excess current. appropriate ADC clock selections. Note: Unless using the FRC, any changes in the 15.1.2 CHANNEL SELECTION system clock frequency will change the There are 11 channel selections available: ADC clock frequency, which may adversely affect the ADC result. • AN<7:0> pins • Temperature Indicator • FVR_buffer1 The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay (TACQ) is required before starting the next conversion. Refer to Section 15.2.6“ADC Conversion Procedure” for more infor- mation. 15.1.3 ADC VOLTAGE REFERENCE The ADC module uses a positive and a negative voltage reference. The positive reference is labeled ref+ and the negative reference is labeled ref-. The positive voltage reference (ref+) is selected by the ADPREF bits in the ADCON1 register. The positive voltage reference source can be: • VREF+ pin • VDD The negative voltage reference (ref-) source is: • VSS DS40001607D-page 114  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC ADCS<2:0 Clock 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz > Source Fosc/2 000 100 ns 125 ns 250 ns 500 ns 2.0 s Fosc/4 100 200 ns 250 ns 500 ns 1.0 s 4.0 s Fosc/8 001 400 ns 500 ns 1.0 s 2.0 s 8.0 s Fosc/16 101 800 ns 1.0 s 2.0 s 4.0 s 16.0 s Fosc/32 010 1.6 s 2.0 s 4.0 s 8.0 s 32.0 s Fosc/64 110 3.2 s 4.0 s 8.0 s 16.0 s 64.0 s FRC x11 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s Legend: Shaded cells are outside of recommended range. Note: The TAD period when using the FRC clock source can fall within a specified range, (see TAD parameter). The TAD period when using the FOSC-based clock source can be configured for a more precise TAD period. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES Rev.10-000035A 7/30/2013 TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 THCD ConversionStarts TACQ Holdingcapacitordisconnected Onthefollowingcycle: fromanaloginput(THCD). ADRESH:ADRESLisloaded, GObitiscleared, SetGObit ADIFbitisset, holdingcapacitorisreconnectedtoanaloginput. EnableADC (ADONbit) and Selectchannel(ACSbits)  2011-2015 Microchip Technology Inc. DS40001607D-page 115

PIC16(L)F1503 15.1.5 INTERRUPTS 15.1.6 RESULT FORMATTING The ADC module allows for the ability to generate an The 10-bit ADC conversion result can be supplied in interrupt upon completion of an Analog-to-Digital two formats, left justified or right justified. The ADFM bit conversion. The ADC Interrupt Flag is the ADIF bit in of the ADCON1 register controls the output format. the PIR1 register. The ADC Interrupt Enable is the Figure15-3 shows the two output formats. ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruc- tion is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execu- tion, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. FIGURE 15-3: 10-BIT ADC CONVERSION RESULT FORMAT Rev.10-000054A 7/30/2013 ADRESH ADRESL (ADFM=0) MSB LSB bit7 bit0 bit7 bit0 10-bitADCResult Unimplemented:Read as ‘0’ (ADFM=1) MSB LSB bit7 bit0 bit7 bit0 Unimplemented:Read as ‘0’ 10-bitADCResult DS40001607D-page 116  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 15.2 ADC Operation 15.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This 15.2.1 STARTING A CONVERSION requires the ADC clock source to be set to the FRC To enable the ADC module, the ADON bit of the option. Performing the ADC conversion during Sleep ADCON0 register must be set to a ‘1’. Setting the GO/ can reduce system noise. If the ADC interrupt is DONE bit of the ADCON0 register to a ‘1’ will start the enabled, the device will wake-up from Sleep when the Analog-to-Digital conversion. conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion com- Note: The GO/DONE bit should not be set in the pletes, although the ADON bit remains set. same instruction that turns on the ADC. Refer to Section 15.2.6“ADC Conver- When the ADC clock source is something other than sion Procedure”. FRC, a SLEEP instruction causes the present conver- sion to be aborted and the ADC module is turned off, 15.2.2 COMPLETION OF A CONVERSION although the ADON bit remains set. When the conversion is complete, the ADC module will: 15.2.5 AUTO-CONVERSION TRIGGER • Clear the GO/DONE bit The auto-conversion trigger allows periodic ADC mea- • Set the ADIF Interrupt Flag bit surements without software intervention. When a rising • Update the ADRESH and ADRESL registers with edge of the selected source occurs, the GO/DONE bit new conversion result is set by hardware. The auto-conversion trigger source is selected with the 15.2.3 TERMINATING A CONVERSION TRIGSEL<3:0> bits of the ADCON2 register. If a conversion must be terminated before completion, Using the auto-conversion trigger does not assure the GO/DONE bit can be cleared in software. The proper ADC timing. It is the user’s responsibility to ADRESH and ADRESL registers will be updated with ensure that the ADC timing requirements are met. the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit See Table15-2 for auto-conversion sources. converted. TABLE 15-2: AUTO-CONVERSION Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is SOURCES turned off and any pending conversion is Source Peripheral Signal Name terminated. Timer0 T0_overflow Timer1 T1_overflow Timer2 T2_match Comparator C1 C1OUT_sync Comparator C2 C2OUT_sync CLC1 LC1_out CLC2 LC2_out  2011-2015 Microchip Technology Inc. DS40001607D-page 117

PIC16(L)F1503 15.2.6 ADC CONVERSION PROCEDURE EXAMPLE 15-1: ADC CONVERSION This is an example procedure for using the ADC to ;This code block configures the ADC perform an Analog-to-Digital conversion: ;for polling, Vdd and Vss references, FRC 1. Configure Port: ;oscillator and AN0 input. ; • Disable pin output driver (Refer to the TRIS ;Conversion start & polling for completion register) ; are included. • Configure pin as analog (Refer to the ANSEL ; register) BANKSEL ADCON1 ; • Disable weak pull-ups either globally (Refer MOVLW B’11110000’ ;Right justify, FRC to the OPTION_REG register) or individually ;oscillator MOVWF ADCON1 ;Vdd and Vss Vref+ (Refer to the appropriate WPUx register). BANKSEL TRISA ; 2. Configure the ADC module: BSF TRISA,0 ;Set RA0 to input • Select ADC conversion clock BANKSEL ANSEL ; • Configure voltage reference BSF ANSEL,0 ;Set RA0 to analog BANKSEL WPUA • Select ADC input channel BCF WPUA,0 ;Disable weak • Turn on ADC module pull-up on RA0 3. Configure ADC interrupt (optional): BANKSEL ADCON0 ; MOVLW B’00000001’ ;Select channel AN0 • Clear ADC interrupt flag MOVWF ADCON0 ;Turn ADC On • Enable ADC interrupt CALL SampleTime ;Acquisiton delay • Enable peripheral interrupt BSF ADCON0,ADGO ;Start conversion • Enable global interrupt(1) BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again 4. Wait the required acquisition time(2). BANKSEL ADRESH ; 5. Start conversion by setting the GO/DONE bit. MOVF ADRESH,W ;Read upper 2 bits 6. Wait for ADC conversion to complete by one of MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; the following: MOVF ADRESL,W ;Read lower 8 bits • Polling the GO/DONE bit MOVWF RESULTLO ;Store in GPR space • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result. 8. Clear the ADC interrupt flag (required if interrupt is enabled). Note1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 15.4“ADC Acquisi- tion Requirements”. DS40001607D-page 118  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 15.3 Register Definitions: ADC Control REGISTER 15-1: ADCON0: ADC CONTROL REGISTER 0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CHS<4:0> GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = AN0 00001 = AN1 00010 = AN2 00011 = AN3 00100 = AN4 00101 = AN5 00110 = AN6 00111 = AN7 01000 = Reserved. No channel connected. • • • 11100 = Reserved. No channel connected. 11101 =Temperature Indicator(1) 11110 =DAC (Digital-to-Analog Converter)(3) 11111 =FVR (Fixed Voltage Reference) Buffer 1 Output(2) bit 1 GO/DONE: ADC Conversion Status bit 1 = ADC conversion cycle in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC conversion has completed. 0 = ADC conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: See Section 14.0“Temperature Indicator Module” for more information. 2: See Section 13.0“Fixed Voltage Reference (FVR)” for more information. 3: See Section 16.0“5-Bit Digital-to-Analog Converter (DAC) Module” for more information.  2011-2015 Microchip Technology Inc. DS40001607D-page 119

PIC16(L)F1503 REGISTER 15-2: ADCON1: ADC CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 ADFM ADCS<2:0> — — ADPREF<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: ADC Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded. bit 6-4 ADCS<2:0>: ADC Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC (clock supplied from an internal RC oscillator) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 111 = FRC (clock supplied from an internal RC oscillator) bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits 00 = VRPOS is connected to VDD 01 = Reserved 10 = VRPOS is connected to external VREF+ pin(1) 11 = Reserved Note 1: When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See Section 28.0“Electrical Specifications” for details. DS40001607D-page 120  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 15-3: ADCON2: ADC CONTROL REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 TRIGSEL<3:0>(1) — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1) 0000 = No auto-conversion trigger selected 0001 = Reserved 0010 = Reserved 0011 = Timer0 – T0_overflow(2) 0100 = Timer1 – T1_overflow(2) 0101 = Timer2 – T2_match 0110 = Comparator C1 – C1OUT_sync 0111 = Comparator C2 – C2OUT_sync 1000 = CLC1 – LC1_out 1001 = CLC2 – LC2_out 1010 = Reserved 1011 = Reserved 1100 = Reserved 1101 = Reserved 1110 = Reserved 1111 = Reserved bit 3-0 Unimplemented: Read as ‘0’ Note 1: This is a rising edge sensitive input for all sources. 2: Signal also sets its corresponding interrupt flag.  2011-2015 Microchip Technology Inc. DS40001607D-page 121

PIC16(L)F1503 REGISTER 15-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<9:2>: ADC Result Register bits Upper eight bits of 10-bit conversion result REGISTER 15-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<1:0> — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower two bits of 10-bit conversion result bit 5-0 Reserved: Do not use. DS40001607D-page 122  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 15-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper two bits of 10-bit conversion result REGISTER 15-7: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits Lower eight bits of 10-bit conversion result  2011-2015 Microchip Technology Inc. DS40001607D-page 123

PIC16(L)F1503 15.4 ADC Acquisition Requirements source impedance is decreased, the acquisition time may be decreased. After the analog input channel is For the ADC to meet its specified accuracy, the charge selected (or changed), an ADC acquisition must be holding capacitor (CHOLD) must be allowed to fully done before the conversion can be started. To calculate charge to the input channel voltage level. The Analog the minimum acquisition time, Equation15-1 may be Input model is shown in Figure15-4. The source used. This equation assumes that 1/2 LSb error is used impedance (RS) and the internal sampling switch (RSS) (1,024 steps for the ADC). The 1/2 LSb error is the impedance directly affect the time required to charge maximum error allowed for the ADC to meet its the capacitor CHOLD. The sampling switch (RSS) specified resolution. impedance varies over the device voltage (VDD), refer to Figure15-4. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 15-1: ACQUISITION TIME EXAMPLE Assumptions: Temperature = 50°C and external impedance of 10k 5.0V VDD TACQ = Amplifier Settling Time +Hold Capacitor Charging Time+Temperature Coefficient = TAMP+TC+TCOFF = 2µs+TC+Temperature - 25°C0.05µs/°C The value for TC can be approximated with the following equations:  1  VAPPLIED1– ------n----+----1------------ = VCHOLD ;[1] VCHOLD charged to within 1/2 lsb 2 –1 –TC  ---------- RC VAPPLIED1–e  = VCHOLD ;[2] VCHOLD charge response to VAPPLIED   –Tc  -R----C----  1  VAPPLIED1–e  = VAPPLIED1– ------n---+-----1------------ ;combining [1] and [2]   2  –1 Note: Where n = number of bits of the ADC. Solving for TC: TC = –CHOLDRIC+RSS+RS ln(1/2047) = –12.5pF1k+7k+10k ln(0.0004885) = 1.72µs Therefore: TACQ = 2µs+1.72µs+50°C- 25°C0.05µs/°C = 4.97µs Note1: The reference voltage (VRPOS) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10k. This is required to meet the pin leakage specification. DS40001607D-page 124  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 15-4: ANALOG INPUT MODEL Rev. 10-000070A 8/2/2013 VDD Sampling RS InApnuatl opgin VT (cid:167) 0.6V RIC (cid:148) 1K sSwSitchRSS ILEAKAGE(1) CHOLD = 10 pF VA CPIN VT (cid:167) 0.6V 5pF Ref- 6V Legend: CHOLD = Sample/Hold Capacitance 5V CPIN = Input Capacitance VDD 4V RSS ILEAKAGE = Leakage Current at the pin due to varies injunctions 3V 2V RIC = Interconnect Resistance RSS = Resistance of Sampling switch SS = Sampling Switch 5 6 7 8 91011 VT = Threshold Voltage Sampling Switch (k(cid:159) ) Note 1: Refer to Section 28.0“Electrical Specifications”. FIGURE 15-5: ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh 3FDh 3FCh e od 3FBh C ut p ut O C D 03h A 02h 01h 00h Analog Input Voltage 0.5 LSB 1.5 LSB Zero-Scale Ref- Transition Full-Scale Ref+ Transition  2011-2015 Microchip Technology Inc. DS40001607D-page 125

PIC16(L)F1503 TABLE 15-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ADCON0 — CHS<4:0> GO/DONE ADON 119 ADCON1 ADFM ADCS<2:0> — — ADPREF<1:0> 120 ADCON2 TRIGSEL<3:0> — — — — 121 ADRESH ADC Result Register High 122, 123 ADRESL ADC Result Register Low 122, 123 ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 ANSELC — — — — ANSC3 ANSC2 ANSC1 ANSC0 103 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 68 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 110 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module. Note 1: Unimplemented, read as ‘1’. DS40001607D-page 126  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 16.0 5-BIT DIGITAL-TO-ANALOG The output of the DAC (DACx_output) can be selected CONVERTER (DAC) MODULE as a reference voltage to the following: • Comparator positive input The Digital-to-Analog Converter supplies a variable • ADC input channel voltage reference, ratiometric with the input source, • DACxOUT1 pin with 32 selectable output levels. • DACxOUT2 pin The positive input source (VSOURCE+) of the DAC can be connected to: The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACxCON0 register. • External VREF+ pin • VDD supply voltage The negative input source (VSOURCE-) of the DAC can be connected to: • Vss FIGURE 16-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Rev.10-000026A 7/30/2013 VDD 0 VSOURCE+ VREF+ 1 DACR<4:0> 5 R DACPSS R DACEN R R X U 32 M DACx_output ToPeripherals Steps 1 o- 2-t 3 R DACxOUT1(1) R DACOE1 R DACxOUT2(1) VSOURCE- DACOE2 VSS Note1:TheunbufferedDACx_outputisprovidedontheDACxOUTpin(s).  2011-2015 Microchip Technology Inc. DS40001607D-page 127

PIC16(L)F1503 16.1 Output Voltage Selection Reading the DACxOUTn pin when it has been configured for DAC reference voltage output will The DAC has 32 voltage level ranges. The 32 levels always return a ‘0’. are set with the DACR<4:0> bits of the DACxCON1 register. Note: The unbuffered DAC output (DACxOUTn) is not intended to drive an external load. The DAC output voltage can be determined by using Equation16-1. 16.4 Operation During Sleep 16.2 Ratiometric Output Level When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of The DAC output value is derived using a resistor ladder the DACxCON0 register are not affected. To minimize with each end of the ladder tied to a positive and current consumption in Sleep mode, the voltage negative voltage reference input source. If the voltage reference should be disabled. of either input source fluctuates, a similar fluctuation will result in the DAC output value. 16.5 Effects of a Reset The value of the individual resistors within the ladder can be found in Table28-14. A device Reset affects the following: • DACx is disabled. 16.3 DAC Voltage Reference Output • DACX output voltage is removed from the The unbuffered DAC voltage can be output to the DACxOUTn pin(s). DACxOUTn pin(s) by setting the respective DACOEn • The DACR<4:0> range select bits are cleared. bit(s) of the DACxCON0 register. Selecting the DAC reference voltage for output on either DACxOUTn pin automatically overrides the digital output buffer, the weak pull-up and digital input threshold detector functions of that pin. EQUATION 16-1: DAC OUTPUT VOLTAGE IF DACEN = 1  DACR4:0 DACx_output = VSOURCE+–VSOURCE------------------------------ +VSOURCE-  5  2 Note: See the DACxCON0 register for the available VSOURCE+ and VSOURCE- selections. DS40001607D-page 128  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 16.6 Register Definitions: DAC Control REGISTER 16-1: DACxCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 U-0 DACEN — DACOE1 DACOE2 — DACPSS — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DACx is enabled 0 = DACx is disabled bit 6 Unimplemented: Read as ‘0’ bit 5 DACOE1: DAC Voltage Output Enable bit 1 = DACx voltage level is output on the DACxOUT1 pin 0 = DACx voltage level is disconnected from the DACxOUT1 pin bit 4 DACOE2: DAC Voltage Output Enable bit 1 = DACx voltage level is output on the DACxOUT2 pin 0 = DACx voltage level is disconnected from the DACxOUT2 pin bit 3 Unimplemented: Read as ‘0’ bit 2 DACPSS: DAC Positive Source Select bit 1 = VREF+ pin 0 = VDD bit 1-0 Unimplemented: Read as ‘0’ REGISTER 16-2: DACxCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — DACR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR<4:0>: DAC Voltage Output Select bits TABLE 16-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on page DAC1CON0 DACEN — DACOE1 DACOE2 — DACPSS — — 129 DAC1CON1 — — — DACR<4:0> 129 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.  2011-2015 Microchip Technology Inc. DS40001607D-page 129

PIC16(L)F1503 17.0 COMPARATOR MODULE 17.1 Comparator Overview Comparators are used to interface analog circuits to a A single comparator is shown in Figure17-2 along with digital circuit by comparing two analog voltages and the relationship between the analog input levels and providing a digital indication of their relative magnitudes. the digital output. When the analog voltage at VIN+ is Comparators are very useful mixed signal building less than the analog voltage at VIN-, the output of the blocks because they provide analog functionality comparator is a digital low level. When the analog independent of program execution. The analog voltage at VIN+ is greater than the analog voltage at comparator module includes the following features: VIN-, the output of the comparator is a digital high level. • Independent comparator control The comparators available for this device are listed in Table17-1. • Programmable input selection • Comparator output is available internally/externally • Programmable output polarity TABLE 17-1: AVAILABLE COMPARATORS • Interrupt-on-change Device C1 C2 • Wake-up from Sleep PIC16(L)F1503 ● ● • Programmable Speed/Power optimization • PWM shutdown • Programmable and fixed voltage reference FIGURE 17-1: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM Rev. 10-000027A 8/5/2013 CxNCH<2:0> 3 CxON(1) Interrupt CxINTP Rising CxIN0- 000 Edge set bit CxIF CxIN1- 001 Interrupt CxINTN CxIN2- 010 Falling CxON(1) Edge CxIN3- 011 FVR_buffer2 100 CxVN - CxOUT D Q MCxOUT Cx CxIN+ 00 CxVP + Q1 DAC_out 01 FVR_buffer2 10 CxSP CxHYS CxPOL CxOUT_async to peripherals 11 CxOUT_sync to CxPCH<1:0> CxON(1) 2 peripherals CxSYNC CxOE TRIS bit 0 CxOUT D Q 1 (From Timer1 Module) T1CLK DS40001607D-page 130  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 17-2: SINGLE COMPARATOR • CxIN+ analog pin • DAC1_output • FVR_buffer2 VIN+ + Output • VSS VIN- – See Section 13.0“Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section 16.0“5-Bit Digital-to-Analog Converter VIN- (DAC) Module” for more information on the DAC input VIN+ signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. 17.2.3 COMPARATOR NEGATIVE INPUT Output SELECTION The CxNCH<2:0> bits of the CMxCON0 register direct Note: The black areas of the output of the one of the input sources to the comparator inverting comparator represents the uncertainty input. due to input offsets and response time. Note: To use CxIN+ and CxINx- pins as analog input, the appropriate bits must be set in the ANSEL register and the correspond- 17.2 Comparator Control ing TRIS bits must also be set to disable the output drivers. Each comparator has two control registers: CMxCON0 and CMxCON1. 17.2.4 COMPARATOR OUTPUT The CMxCON0 registers (see Register17-1) contain SELECTION Control and Status bits for the following: The output of the comparator can be monitored by • Enable reading either the CxOUT bit of the CMxCON0 register • Output selection or the MCxOUT bit of the CMOUT register. In order to • Output polarity make the output available for an external connection, the following conditions must be true: • Speed/Power selection • Hysteresis enable • CxOE bit of the CMxCON0 register must be set • Output synchronization • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set The CMxCON1 registers (see Register17-2) contain Control bits for the following: The synchronous comparator output signal (CxOUT_sync) is available to the following peripheral(s): • Interrupt enable • Interrupt edge polarity • Configurable Logic Cell (CLC) • Positive input channel selection • Analog-to-Digital Converter (ADC) • Negative input channel selection • Timer1 The asynchronous comparator output signal 17.2.1 COMPARATOR ENABLE (CxOUT_async) is available to the following peripheral(s): Setting the CxON bit of the CMxCON0 register enables • Complementary Waveform Generator (CWG) the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. Note1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting 17.2.2 COMPARATOR POSITIVE INPUT the CxON bit of the CMxCON0 register SELECTION has no impact on the port override. Configuring the CxPCH<1:0> bits of the CMxCON1 2: The internal output of the comparator is register directs an internal voltage reference or an latched with each instruction cycle. analog pin to the non-inverting input of the comparator: Unless otherwise specified, external outputs are not latched.  2011-2015 Microchip Technology Inc. DS40001607D-page 131

PIC16(L)F1503 17.2.5 COMPARATOR OUTPUT POLARITY 17.3 Analog Input Connection Considerations Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The A simplified circuit for an analog input is shown in polarity of the comparator output can be inverted by Figure17-3. Since the analog input pins share their setting the CxPOL bit of the CMxCON0 register. connection with a digital input, they have reverse Clearing the CxPOL bit results in a non-inverted output. biased ESD protection diodes to VDD and VSS. The Table17-2 shows the output state versus input analog input, therefore, must be between VSS and VDD. conditions, including polarity control. If the input voltage deviates from this range by more TABLE 17-2: COMPARATOR OUTPUT than 0.6V in either direction, one of the diodes is for- STATE VS. INPUT CONDITIONS ward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended Input Condition CxPOL CxOUT for the analog sources. Also, any external component CxVN > CxVP 0 0 connected to an analog input pin, such as a capacitor or CxVN < CxVP 0 1 a Zener diode, should have very little leakage current to minimize inaccuracies introduced. CxVN > CxVP 1 1 CxVN < CxVP 1 0 Note1: When reading a PORT register, all pins 17.2.6 COMPARATOR SPEED/POWER configured as analog inputs will read as a SELECTION ‘0’. Pins configured as digital inputs will The trade-off between speed or power can be opti- convert as an analog input, according to mized during program execution with the CxSP control the input specification. bit. The default state for this bit is ‘1’ which selects the 2: Analog levels on any pin defined as a Normal-Speed mode. Device power consumption can digital input, may cause the input buffer to be optimized at the cost of slower comparator propaga- consume more current than is specified. tion delay by clearing the CxSP bit to ‘0’. FIGURE 17-3: ANALOG INPUT MODEL Rev. 10-000071A 8/2/2013 VDD Analog VT (cid:167) 0.6V RS < 10K Input pin RIC To Comparator ILEAKAGE(1) VA CPIN VT (cid:167) 0.6V 5pF VSS Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage VT = Threshold Voltage Note 1: See Section 28.0“Electrical Specifications”. DS40001607D-page 132  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 17.4 Comparator Hysteresis The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is A selectable amount of separation voltage can be detected while this flag is being cleared, the flag will still added to the input pins of each comparator to provide a be set at the end of the sequence. hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 Note: Although a comparator is disabled, an register. interrupt can be generated by changing the output polarity with the CxPOL bit of See Section 28.0“Electrical Specifications” for the CMxCON0 register, or by switching more information. the comparator on or off with the CxON bit of the CMxCON0 register. 17.5 Timer1 Gate Operation The output resulting from a comparator operation can 17.7 Comparator Response Time be used as a source for gate control of Timer1. See The comparator output is indeterminate for a period of Section 19.5“Timer1 Gate” for more information. time after the change of an input source or the selection This feature is useful for timing the duration or interval of a new reference voltage. This period is referred to as of an analog event. the response time. The response time of the comparator It is recommended that the comparator output be syn- differs from the settling time of the voltage reference. chronized to Timer1. This ensures that Timer1 does not Therefore, both of these times must be considered when increment while a change in the comparator is occur- determining the total response time to a comparator ring. input change. See the Comparator and Voltage Refer- ence Specifications in Section 28.0“Electrical Specifi- 17.5.1 COMPARATOR OUTPUT cations” for more details. SYNCHRONIZATION The output from the Cx comparator can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure17-2) and the Timer1 Block Diagram (Figure19-2) for more information. 17.6 Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a falling edge detector are present. When either edge detector is triggered and its associ- ated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. To enable the interrupt, you must set the following bits: • CxON, CxPOL and CxSP bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register  2011-2015 Microchip Technology Inc. DS40001607D-page 133

PIC16(L)F1503 17.8 Register Definitions: Comparator Control REGISTER 17-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled and consumes no active power bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator mode in normal power, higher speed 0 = Comparator mode in low-power, low-speed bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous DS40001607D-page 134  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 17-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 CxINTP CxINTN CxPCH<1:0> — CxNCH<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 11 = CxVP connects to VSS 10 = CxVP connects to FVR Voltage Reference 01 = CxVP connects to DAC Voltage Reference 00 = CxVP connects to CxIN+ pin bit 3 Unimplemented: Read as ‘0’ bit 2-0 CxNCH<2:0>: Comparator Negative Input Channel Select bits 111 = Reserved 110 = Reserved 101 = Reserved 100 = CxVN connects to FVR Voltage reference 011 = CxVN connects to CxIN3- pin 010 = CxVN connects to CxIN2- pin 001 = CxVN connects to CxIN1- pin 000 = CxVN connects to CxIN0- pin REGISTER 17-3: CMOUT: COMPARATOR OUTPUT REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 — — — — — — MC2OUT MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MC2OUT: Mirror Copy of C2OUT bit bit 0 MC1OUT: Mirror Copy of C1OUT bit  2011-2015 Microchip Technology Inc. DS40001607D-page 135

PIC16(L)F1503 TABLE 17-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 ANSELC — — — — ANSC3 ANSC2 ANSC1 ANSC0 103 CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 134 CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 134 CM1CON1 C1NTP C1INTN C1PCH<1:0> — C1NCH<2:0> 135 CM2CON1 C2NTP C2INTN C2PCH<1:0> — C2NCH<2:0> 135 CMOUT — — — — — — MC2OUT MC1OUT 135 DAC1CON0 DACEN — DACOE1 DACOE2 — DACPSS — — 129 DAC1CON1 — — — DACR<4:0> 129 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 110 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 66 PIR2 — C2IF C1IF — BCL1IF NCO1IF — — 69 PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 98 PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 102 LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 99 LATC — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 102 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module. Note 1: Unimplemented, read as ‘1’. DS40001607D-page 136  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 18.0 TIMER0 MODULE 18.1.2 8-BIT COUNTER MODE In 8-Bit Counter mode, the Timer0 module will increment The Timer0 module is an 8-bit timer/counter with the on every rising or falling edge of the T0CKI pin. following features: 8-Bit Counter mode using the T0CKI pin is selected by • 8-bit timer/counter register (TMR0) setting the TMR0CS bit in the OPTION_REG register to • 3-bit prescaler (independent of Watchdog Timer) ‘1’. • Programmable internal or external clock source The rising or falling transition of the incrementing edge • Programmable external clock edge selection for either input source is determined by the TMR0SE bit • Interrupt on overflow in the OPTION_REG register. • TMR0 can be used to gate Timer1 Figure18-1 is a block diagram of the Timer0 module. 18.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 18.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-bit Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. FIGURE 18-1: TIMER0 BLOCK DIAGRAM TMR0CS Rev. 10-080/50/021071A3 Fosc/4 PSA T0CKI(1) 0 1 T0CKI T0_overflow TMR0 1 Prescaler 0 FOSC/2 Sync Circuit Q1 write R to TMR0 TMR0SE PS<2:0> set bit TMR0IF Note 1: The T0CKI prescale output frequency should not exceed FOSC/8.  2011-2015 Microchip Technology Inc. DS40001607D-page 137

PIC16(L)F1503 18.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are eight prescaler options for the Timer0 mod- ule ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by set- ting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 18.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. 18.1.5 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section 28.0“Electrical Specifications”. 18.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. DS40001607D-page 138  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 18.2 Register Definitions: Option Register REGISTER 18-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value Timer0 Rate 000 1 : 2 001 1 : 4 010 1 : 8 011 1 : 16 100 1 : 32 101 1 : 64 110 1 : 128 111 1 : 256 TABLE 18-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ADCON2 TRIGSEL<3:0> — — — — 121 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 139 TMR0 Holding Register for the 8-bit Timer0 Count 137* TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 139

PIC16(L)F1503 19.0 TIMER1 MODULE WITH GATE • Interrupt on overflow CONTROL • Wake-up on overflow (external clock, Asynchronous mode only) The Timer1 module is a 16-bit timer/counter with the • ADC Auto-Conversion Trigger(s) following features: • Selectable Gate Source Polarity • 16-bit timer/counter register pair (TMR1H:TMR1L) • Gate Toggle mode • Programmable internal or external clock source • Gate Single-Pulse mode • 2-bit prescaler • Gate Value Status • Optionally synchronized comparator out • Gate Event Interrupt • Multiple Timer1 gate (count enable) sources Figure19-1 is a block diagram of the Timer1 module. FIGURE 19-1: TIMER1 BLOCK DIAGRAM T1GSS<1:0> Rev. 10-000018C 8/5/2013 T1GSPM T1G 00 T0_overflow 01 1 C1OUT_sync 10 0 Single Pulse D Q T1GVAL 0 C2OUT_sync 11 1 Acq. Control Q1 D Q T1GPOL T1GGO/DONE CK Q TMR1ON Interrupt set bit R T1GTM det TMR1GIF TMR1GE set flag bit TMR1IF TMR1ON EN TMR1(2) T1_overflow TMR1H TMR1L Q D 0 Synchronized Clock Input 1 T1CLK T1SYNC TMR1CS<1:0> LFINTOSC 11 (1) T1CKI 10 Prescaler Synchronize(3) Fosc 01 1,2,4,8 Internal Clock det 00 2 Fosc/4 Fosc/2 Internal Clock T1CKPS<1:0> Internal Sleep Clock Input Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. DS40001607D-page 140  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 19.1 Timer1 Operation 19.2 Clock Source Selection The Timer1 module is a 16-bit incrementing counter The TMR1CS<1:0> bits of the T1CON register are used which is accessed through the TMR1H:TMR1L register to select the clock source for Timer1. Table19-2 pair. Writes to TMR1H or TMR1L directly update the displays the clock source selections. counter. 19.2.1 INTERNAL CLOCK SOURCE When used with an internal clock source, the module is a timer and increments on every instruction cycle. When the internal clock source is selected, the When used with an external clock source, the module TMR1H:TMR1L register pair will increment on multiples can be used as either a timer or counter and incre- of FOSC as determined by the Timer1 prescaler. ments on every selected edge of the external source. When the FOSC internal clock source is selected, the Timer1 is enabled by configuring the TMR1ON and Timer1 register value will increment by four counts every TMR1GE bits in the T1CON and T1GCON registers, instruction clock cycle. Due to this condition, a 2LSB respectively. Table19-1 displays the Timer1 enable error in resolution will occur when reading the Timer1 selections. value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. TABLE 19-1: TIMER1 ENABLE The following asynchronous sources may be used: SELECTIONS • Asynchronous event on the T1G pin to Timer1 Timer1 TMR1ON TMR1GE gate Operation • C1 or C2 comparator input to Timer1 gate 0 0 Off 19.2.2 EXTERNAL CLOCK SOURCE 0 1 Off 1 0 Always On When the external clock source is selected, the Timer1 module may work as a timer or a counter. 1 1 Count Enabled When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI. The external clock source can be synchronized to the microcontroller system clock or it can run asynchronously. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: • Timer1 enabled after POR • Write to TMR1H or TMR1L • Timer1 is disabled • Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. TABLE 19-2: CLOCK SOURCE SELECTIONS TMR1CS<1:0> Clock Source 11 LFINTOSC 10 External Clocking on T1CKI Pin 01 System Clock (FOSC) 00 Instruction Clock (FOSC/4)  2011-2015 Microchip Technology Inc. DS40001607D-page 141

PIC16(L)F1503 19.3 Timer1 Prescaler When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock Timer1 has four prescaler options allowing 1, 2, 4 or 8 source. When Timer1 Gate Enable mode is disabled, divisions of the clock input. The T1CKPS bits of the no incrementing will occur and Timer1 will hold the T1CON register control the prescale counter. The current count. See Figure19-3 for timing details. prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. TABLE 19-3: TIMER1 GATE ENABLE SELECTIONS 19.4 Timer1 Operation in T1CLK T1GPOL T1G Timer1 Operation Asynchronous Counter Mode  0 0 Counts If control bit T1SYNC of the T1CON register is set, the  0 1 Holds Count external clock input is not synchronized. The timer  1 0 Holds Count increments asynchronously to the internal phase clocks. If the external clock source is selected then the  1 1 Counts timer will continue to run during Sleep and can 19.5.2 TIMER1 GATE SOURCE generate an interrupt on overflow, which will wake-up SELECTION the processor. However, special precautions in software are needed to read/write the timer (see Timer1 gate source selections are shown in Table19-4. Section 19.4.1“Reading and Writing Timer1 in Source selection is controlled by the T1GSS<1:0> bits Asynchronous Counter Mode”). of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled Note: When switching from synchronous to by the T1GPOL bit of the T1GCON register. asynchronous operation, it is possible to skip an increment. When switching from TABLE 19-4: TIMER1 GATE SOURCES asynchronous to synchronous operation, it is possible to produce an additional T1GSS Timer1 Gate Source increment. 00 Timer1 Gate pin (T1G) 19.4.1 READING AND WRITING TIMER1 IN 01 Overflow of Timer0 (T0_overflow) ASYNCHRONOUS COUNTER (TMR0 increments from FFh to 00h) MODE 10 Comparator 1 Output (C1OUT_sync)(1) Reading TMR1H or TMR1L while the timer is running 11 Comparator 2 Output (C2OUT_sync)(1) from an external asynchronous clock will ensure a valid Note 1: Optionally synchronized comparator output. read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. 19.5 Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 19.5.1 TIMER1 GATE ENABLE The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. DS40001607D-page 142  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 19.5.2.1 T1G Pin Gate Operation 19.5.5 TIMER1 GATE VALUE STATUS The T1G pin is one source for Timer1 gate control. It When Timer1 Gate Value Status is utilized, it is possible can be used to supply an external source to the Timer1 to read the most current level of the gate control value. gate circuitry. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 19.5.2.2 Timer0 Overflow Gate Operation gate is not enabled (TMR1GE bit is cleared). When Timer0 increments from FFh to 00h, a low-to- 19.5.6 TIMER1 GATE EVENT INTERRUPT high pulse will automatically be generated and inter- nally supplied to the Timer1 gate circuitry. When Timer1 Gate Event Interrupt is enabled, it is pos- sible to generate an interrupt upon the completion of a 19.5.3 TIMER1 GATE TOGGLE MODE gate event. When the falling edge of T1GVAL occurs, When Timer1 Gate Toggle mode is enabled, it is possi- the TMR1GIF flag bit in the PIR1 register will be set. If ble to measure the full-cycle length of a Timer1 gate the TMR1GIE bit in the PIE1 register is set, then an signal, as opposed to the duration of a single level interrupt will be recognized. pulse. The TMR1GIF flag bit operates even when the Timer1 The Timer1 gate source is routed through a flip-flop that gate is not enabled (TMR1GE bit is cleared). changes state on every incrementing edge of the sig- nal. See Figure19-4 for timing details. Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. 19.5.4 TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/ DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/ DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure19-5 for timing details. If the Single Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure19-6 for timing details.  2011-2015 Microchip Technology Inc. DS40001607D-page 143

PIC16(L)F1503 19.6 Timer1 Interrupt 19.7.1 ALTERNATE PIN LOCATIONS The Timer1 register pair (TMR1H:TMR1L) increments This module incorporates I/O pins that can be moved to to FFFFh and rolls over to 0000h. When Timer1 rolls other locations with the use of the alternate pin function over, the Timer1 interrupt flag bit of the PIR1 register is register, APFCON. To determine which pins can be set. To enable the interrupt on rollover, you must set moved and what their default locations are upon a these bits: Reset, see Section 11.1“Alternate Pin Function” for more information. • TMR1ON bit of the T1CON register • TMR1IE bit of the PIE1 register • PEIE bit of the INTCON register • GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. 19.7 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • TMR1ON bit of the T1CON register must be set • TMR1IE bit of the PIE1 register must be set • PEIE bit of the INTCON register must be set • T1SYNC bit of the T1CON register must be set • TMR1CS bits of the T1CON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. FIGURE 19-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. DS40001607D-page 144  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 19-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 FIGURE 19-4: TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8  2011-2015 Microchip Technology Inc. DS40001607D-page 145

PIC16(L)F1503 FIGURE 19-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM Cleared by hardware on T1GGO/ Set by software falling edge of T1GVAL DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 Cleared by TMR1GIF Cleared by software Set by hardware on software falling edge of T1GVAL DS40001607D-page 146  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 19-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM Cleared by hardware on T1GGO/ Set by software falling edge of T1GVAL DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL Timer1 N N + 1 N + 2 N + 3 N + 4 Set by hardware on Cleared by TMR1GIF Cleared by software falling edge of T1GVAL software  2011-2015 Microchip Technology Inc. DS40001607D-page 147

PIC16(L)F1503 19.8 Register Definitions: Timer1 Control REGISTER 19-1: T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u U-0 R/W-0/u TMR1CS<1:0> T1CKPS<1:0> — T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 =Timer1 clock source is LFINTOSC 10 =Timer1 clock source is T1CKI pin (on the rising edge) 01 =Timer1 clock source is system clock (FOSC) 00 =Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 =1:8 Prescale value 10 =1:4 Prescale value 01 =1:2 Prescale value 00 =1:1 Prescale value bit 3 Unimplemented: Read as ‘0’ bit 2 T1SYNC: Timer1 Synchronization Control bit 1 = Do not synchronize asynchronous clock input 0 = Synchronize asynchronous clock input with system clock (FOSC) bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop DS40001607D-page 148  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 19-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> DONE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Value Status bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 = Comparator 2 optionally synchronized output (C2OUT_sync) 10 = Comparator 1 optionally synchronized output (C1OUT_sync) 01 = Timer0 overflow output (T0_overflow) 00 = Timer1 gate pin (T1G)  2011-2015 Microchip Technology Inc. DS40001607D-page 149

PIC16(L)F1503 TABLE 19-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 APFCON — — SDOSEL SSSEL T1GSEL — CLC1SEL NCO1SEL 96 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 68 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count 144* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count 144* TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 T1CON TMR1CS<1:0> T1CKPS<1:0> — T1SYNC — TMR1ON 148 T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> 149 DONE Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information. Note 1: Unimplemented, read as ‘1’. DS40001607D-page 150  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 20.0 TIMER2 MODULE The Timer2 module incorporates the following features: • 8-bit Timer and Period registers (TMR2 and PR2, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4, 1:16, and 1:64) • Software programmable postscaler (1:1 to 1:16) • Interrupt on TMR2 match with PR2 See Figure20-1 for a block diagram of Timer2. FIGURE 20-1: TIMER2 BLOCK DIAGRAM Rev.10-000019A 7/30/2013 T2_match Fosc/4 1:1,1P:r4e,s1c:a1l6e,r1:64 TMR2 R ToPeripherals 2 Postscaler setbit T2CKPS<1:0> Comparator 1:1to1:16 TMR2IF 4 PR2 T2OUTPS<3:0> FIGURE 20-2: TIMER2 TIMING DIAGRAM Rev.10-000020A 7/30/2013 FOSC/4 1:4 Prescale 0x03 PR2 0x00 0x01 0x02 0x03 0x00 0x01 0x02 TMR2 T2_match PulseWidth(1) Note1: ThePulseWidthofT2_matchisequaltothescaledinputofTMR2.  2011-2015 Microchip Technology Inc. DS40001607D-page 151

PIC16(L)F1503 20.1 Timer2 Operation 20.3 Timer2 Output The clock input to the Timer2 module is the system The output of TMR2 is T2_match. T2_match is available instruction clock (FOSC/4). to the following peripherals: TMR2 increments from 00h on each clock edge. • Configurable Logic Cell (CLC) A 4-bit counter/prescaler on the clock input allows direct • Master Synchronous Serial Port (MSSP) input, divide-by-4 and divide-by-16 prescale options. • Numerically Controlled Oscillator (NCO) These options are selected by the prescaler control bits, • Pulse Width Modulator (PWM) T2CKPS<1:0> of the T2CON register. The value of The T2_match signal is synchronous with the system TMR2 is compared to that of the Period register, PR2, on clock. Figure20-3 shows two examples of the timing of each clock cycle. When the two values match, the the T2_match signal relative to FOSC and prescale comparator generates a match signal as the timer value, T2CKPS<1:0>. The upper diagram illustrates 1:1 output. This signal also resets the value of TMR2 to 00h prescale timing and the lower diagram, 1:X prescale on the next cycle and drives the output counter/ timing. postscaler (see Section 20.2“Timer2 Interrupt”). The TMR2 and PR2 registers are both directly readable FIGURE 20-3: T2_MATCH TIMING and writable. The TMR2 register is cleared on any DIAGRAM device Reset, whereas the PR2 register initializes to FFh. Both the prescaler and postscaler counters are Rev.10-000021A 7/30/2013 cleared on the following events: Q1 Q2 Q3 Q4 Q1 • a write to the TMR2 register • a write to the T2CON register FOSC • Power-on Reset (POR) TCY1 • Brown-out Reset (BOR) FOSC/4 • MCLR Reset • Watchdog Timer (WDT) Reset T2_match TMR2=PR2 TMR2=0 match • Stack Overflow Reset PRESCALE=1:1 • Stack Underflow Reset (T2CKPS<1:0>=00) • RESET Instruction Note: TMR2 is not cleared when T2CON is TCY1 TCY2 ... TCYX written. FOSC/4 ... ... 20.2 Timer2 Interrupt T2_match TMR2=PR2 TMR2=0 match Timer2 can also generate an optional device interrupt. The Timer2 output signal (T2_match) provides the input PRESCALE=1:X for the 4-bit counter/postscaler. This counter generates (T2CKPS<1:0>=01,10,11) the TMR2 match interrupt flag which is latched in TMR2IF of the PIR1 register. The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE of 20.4 Timer2 Operation During Sleep the PIE1 register. Timer2 cannot be operated while the processor is in A range of 16 postscale options (from 1:1 through 1:16 Sleep mode. The contents of the TMR2 and PR2 inclusive) can be selected with the postscaler control registers will remain unchanged while the processor is bits, T2OUTPS<3:0>, of the T2CON register. in Sleep mode. DS40001607D-page 152  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 20.5 Register Definitions: Timer2 Control REGISTER 20-1: T2CON: TIMER2 CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 =1:1 Postscaler 0001 =1:2 Postscaler 0010 =1:3 Postscaler 0011 =1:4 Postscaler 0100 =1:5 Postscaler 0101 =1:6 Postscaler 0110 =1:7 Postscaler 0111 =1:8 Postscaler 1000 =1:9 Postscaler 1001 =1:10 Postscaler 1010 =1:11 Postscaler 1011 =1:12 Postscaler 1100 =1:13 Postscaler 1101 =1:14 Postscaler 1110 =1:15 Postscaler 1111 =1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 =Prescaler is 1 01 =Prescaler is 4 10 =Prescaler is 16 11 =Prescaler is 64 TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 65 PR2 Timer2 Module Period Register 151* T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 153 TMR2 Holding Register for the 8-bit TMR2 Count 151* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information.  2011-2015 Microchip Technology Inc. DS40001607D-page 153

PIC16(L)F1503 21.0 MASTER SYNCHRONOUS The SPI interface supports the following modes and SERIAL PORT (MSSP) features: MODULE • Master mode • Slave mode 21.1 MSSP Module Overview • Clock Parity • Slave Select Synchronization (Slave mode only) The Master Synchronous Serial Port (MSSPx) module is a serial interface useful for communicating with other • Daisy-chain connection of slave devices peripheral or microcontroller devices. These peripheral Figure21-1 is a block diagram of the SPI interface devices may be serial EEPROMs, shift registers, dis- module. play drivers, A/D converters, etc. The MSSPx module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C™) FIGURE 21-1: MSSP BLOCK DIAGRAM (SPI MODE) Rev. 10-000076A 12/16/2013 Data bus Read Write 8 8 SSPxBUF 8 SDI SSPxSR SDO_out Bit 0 Shift clock SDO 2 (CKP, CKE) clock select SSx SSPM<3:0> Control 4 Enable Edge enable (T2_match) 2 SCK_out Edge Prescaler SCK TOSC enable 4, 16, 64 Baud Rate TRIS bit Generator (SSPxADD) DS40001607D-page 154  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 The I2C interface supports the following modes and features: Note1: In devices with more than one MSSP • Master mode module, it is very important to pay close • Slave mode attention to SSPxCONx register names. • Byte NACKing (Slave mode) SSPxCON1 and SSPxCON2 registers control different operational aspects of • Limited Multi-master support the same module, while SSPxCON1 and • 7-bit and 10-bit addressing SSP2CON1 control the same features for • Start and Stop interrupts two different modules. • Interrupt masking 2: Throughout this section, generic refer- • Clock stretching ences to an MSSPx module in any of its • Bus collision detection operating modes may be interpreted as • General call address matching being equally applicable to MSSPx or • Address masking MSSP2. Register names, module I/O sig- nals, and bit names may use the generic • Address Hold and Data Hold modes designator ‘x’ to indicate the use of a • Selectable SDAx hold times numeral to distinguish a particular mod- Figure21-2 is a block diagram of the I2C interface mod- ule when required. ule in Master mode. Figure21-3 is a diagram of the I2C interface module in Slave mode. FIGURE 21-2: MSSPX BLOCK DIAGRAM (I2C™ MASTER MODE) Rev.10-000077A 7/30/2013 Internaldata bus [SSPM<3:0>] Read Write 8 8 4 BaudRate SSPxBUF Generator (SSPxADD) SDAx 8 SDAxin Shiftclock SSPxSR ct e MSb LSb Cntl Ldet urce) (RCEN) Startbit,Stopbit, Clock ate/BCO clockso SCLx eiveEnable A(ScGSknePonxweCrlOaetdNeg2e) Clockarbitr (Holdoff c e R Startbitdetected SCLxin Stopbitdetected Set/Reset:S,P,SSPxSTAT, Writecollsiondetect WCOL,SSPOV Clockarbitration Buscollision ResetSEN,PEN(SSPxCON2) Statecounterforend SetSSPxIF,BCLxIF ofXMIT/RCV Addressmatchdetect  2011-2015 Microchip Technology Inc. DS40001607D-page 155

PIC16(L)F1503 FIGURE 21-3: MSSP BLOCK DIAGRAM (I2C™ SLAVE MODE) Rev.10-000078A 7/30/2013 Internaldatabus Read Write 8 8 SSPxBUF 8 8 SCLx Shiftclock SDAx SSPxSR MSb LSb 8 SSPxMSK 8 Matchdetect AddrMatch 8 SSPxADD StartandStop Set,ResetS,P bitDetect bits(SSPxSTAT) DS40001607D-page 156  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.2 SPI Mode Overview During each SPI clock cycle, a full-duplex data transmission occurs. This means that while the master The Serial Peripheral Interface (SPI) bus is a device is sending out the MSb from its shift register (on synchronous serial data communication bus that its SDOx pin) and the slave device is reading this bit operates in Full-Duplex mode. Devices communicate and saving it as the LSb of its shift register, that the in a master/slave environment where the master device slave device is also sending out the MSb from its shift initiates the communication. A slave device is register (on its SDOx pin) and the master device is controlled through a Chip Select known as Slave reading this bit and saving it as the LSb of its shift Select. register. The SPI bus specifies four signal connections: After eight bits have been shifted out, the master and • Serial Clock (SCKx) slave have exchanged register values. • Serial Data Out (SDOx) If there is more data to exchange, the shift registers are • Serial Data In (SDIx) loaded with new data and the process repeats itself. • Slave Select (SSx) Whether the data is meaningful or not (dummy data), Figure21-1 shows the block diagram of the MSSP depends on the application software. This leads to module when operating in SPI mode. three scenarios for data transmission: The SPI bus operates with a single master device and • Master sends useful data and slave sends dummy one or more slave devices. When multiple slave data. devices are used, an independent Slave Select con- • Master sends useful data and slave sends useful nection is required from the master device to each data. slave device. • Master sends dummy data and slave sends useful Figure21-4 shows a typical connection between a data. master device and multiple slave devices. Transmissions may involve any number of clock The master selects only one slave at a time. Most slave cycles. When there is no more data to be transmitted, devices have tri-state outputs so their output signal the master stops sending the clock signal and it dese- appears disconnected from the bus when they are not lects the slave. selected. Every slave device connected to the bus that has not Transmissions involve two shift registers, eight bits in been selected through its slave select line must disre- size, one in the master and one in the slave. With either gard the clock and transmission signals and must not the master or the slave device, data is always shifted transmit out any data of its own. out one bit at a time, with the Most Significant bit (MSb) shifted out first. At the same time, a new Least Significant bit (LSb) is shifted into the same register. Figure21-5 shows a typical connection between two processors configured as master and slave devices. Data is shifted out of both shift registers on the pro- grammed clock edge and latched on the opposite edge of the clock. The master device transmits information out on its SDOx output pin which is connected to, and received by, the slave’s SDIx input pin. The slave device trans- mits information out on its SDOx output pin, which is connected to, and received by, the master’s SDIx input pin. To begin communication, the master device first sends out the clock signal. Both the master and the slave devices should be configured for the same clock polar- ity. The master device starts a transmission by sending out the MSb from its shift register. The slave device reads this bit from that same line and saves it into the LSb position of its shift register.  2011-2015 Microchip Technology Inc. DS40001607D-page 157

PIC16(L)F1503 FIGURE 21-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION Rev. 10-000079A 8/1/2013 SCKx SCKx SPI Master SDOx SDIx SPI Slave SDIx SDOx #1 General I/O SSx General I/O General I/O SCKx SDIx SPI Slave SDOx #2 SSx SCKx SDIx SPI Slave SDOx #3 SSx 21.2.1 SPI MODE REGISTERS During transmission, the SSPxBUF is not buffered. A write to SSPxBUF will write to both SSPxBUF and The MSSP module has five registers for SPI mode SSPxSR. operation. These are: • MSSP STATUS register (SSPxSTAT) • MSSP Control Register 1 (SSPxCON1) • MSSP Control Register 3 (SSPxCON3) • MSSP Data Buffer register (SSPxBUF) • MSSP Address register (SSPxADD) • MSSP Shift register (SSPxSR) (Not directly accessible) SSPxCON1 and SSPxSTAT are the control and STATUS registers in SPI mode operation. The SSPxCON1 register is readable and writable. The lower six bits of the SSPxSTAT are read-only. The upper two bits of the SSPxSTAT are read/write. In SPI master mode, SSPxADD can be loaded with a value used in the Baud Rate Generator. More informa- tion on the Baud Rate Generator is available in Section21.7“Baud Rate Generator”. SSPxSR is the shift register used for shifting data in and out. SSPxBUF provides indirect access to the SSPxSR register. SSPxBUF is the buffer register to which data bytes are written, and from which data bytes are read. In receive operations, SSPxSR and SSPxBUF together create a buffered receiver. When SSPxSR receives a complete byte, it is transferred to SSPxBUF and the SSPxIF interrupt is set. DS40001607D-page 158  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.2.2 SPI MODE OPERATION When the application software is expecting to receive valid data, the SSPxBUF should be read before the When initializing the SPI, several options need to be next byte of data to transfer is written to the SSPxBUF. specified. This is done by programming the appropriate The Buffer Full bit, BF of the SSPxSTAT register, indi- control bits (SSPxCON1<5:0> and SSPxSTAT<7:6>). cates when SSPxBUF has been loaded with the These control bits allow the following to be specified: received data (transmission is complete). When the • Master mode (SCKx is the clock output) SSPxBUF is read, the BF bit is cleared. This data may • Slave mode (SCKx is the clock input) be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the • Clock Polarity (Idle state of SCKx) transmission/reception has completed. If the interrupt • Data Input Sample Phase (middle or end of data method is not going to be used, then software polling output time) can be done to ensure that a write collision does not • Clock Edge (output data on rising/falling edge of occur. SCKx) The SSPxSR is not directly readable or writable and • Clock Rate (Master mode only) can only be accessed by addressing the SSPxBUF • Slave Select mode (Slave mode only) register. Additionally, the SSPxSTAT register indicates To enable the serial port, SSP Enable bit, SSPEN of the the various Status conditions. SSPxCON1 register, must be set. To reset or reconfig- ure SPI mode, clear the SSPEN bit, re-initialize the SSPxCONx registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port func- tion, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDIx must have corresponding TRIS bit set • SDOx must have corresponding TRIS bit cleared • SCKx (Master mode) must have corresponding TRIS bit cleared • SCKx (Slave mode) must have corresponding TRIS bit set • SSx must have corresponding TRIS bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. The MSSP consists of a transmit/receive shift register (SSPxSR) and a buffer register (SSPxBUF). The SSPxSR shifts the data in and out of the device, MSb first. The SSPxBUF holds the data that was written to the SSPxSR until the received data is ready. Once the eight bits of data have been received, that byte is moved to the SSPxBUF register. Then, the Buffer Full Detect bit, BF of the SSPxSTAT register, and the interrupt flag bit, SSPxIF, are set. This double-buffering of the received data (SSPxBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPxBUF register during transmission/reception of data will be ignored and the write collision detect bit, WCOL of the SSPxCON1 register, will be set. User software must clear the WCOL bit to allow the following write(s) to the SSPxBUF register to complete successfully.  2011-2015 Microchip Technology Inc. DS40001607D-page 159

PIC16(L)F1503 FIGURE 21-5: SPI MASTER/SLAVE CONNECTION Rev.10-000080A 7/30/2013 SPIMasterSSPM<3:0>=00xx SPISlaveSSPM<3:0>=010x =1010 SDOx SDIx SerialInputBuffer SerialInputBuffer (SSPxBUF) (SSPxBUF) ShiftRegister SDIx SDOx ShiftRegister (SSPxSR) (SSPxSR) MSb LSb Serialclock MSb LSb SCKx SCKx SlaveSelect GeneralI/O SSx Processor1 (optional) Processor2 DS40001607D-page 160  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.2.3 SPI MASTER MODE The clock polarity is selected by appropriately programming the CKP bit of the SSPxCON1 register The master can initiate the data transfer at any time and the CKE bit of the SSPxSTAT register. This then, because it controls the SCKx line. The master would give waveforms for SPI communication as determines when the slave (Processor 2, Figure21-5) shown in Figure21-6, Figure21-8, Figure21-9 and is to broadcast data by the software protocol. Figure21-10, where the MSb is transmitted first. In In Master mode, the data is transmitted/received as Master mode, the SPI clock rate (bit rate) is user soon as the SSPxBUF register is written to. If the SPI programmable to be one of the following: is only going to receive, the SDOx output could be dis- • FOSC/4 (or TCY) abled (programmed as an input). The SSPxSR register will continue to shift in the signal present on the SDIx • FOSC/16 (or 4 * TCY) pin at the programmed clock rate. As each byte is • FOSC/64 (or 16 * TCY) received, it will be loaded into the SSPxBUF register as • Timer2 output/2 if a normal received byte (interrupts and Status bits • Fosc/(4 * (SSPxADD + 1)) appropriately set). Figure21-6 shows the waveforms for Master mode. When the CKE bit is set, the SDOx data is valid before there is a clock edge on SCKx. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPxBUF is loaded with the received data is shown. FIGURE 21-6: SPI MODE WAVEFORM (MASTER MODE) Write to SSPxBUF SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) 4 Clock Modes SCKx (CKP = 0 CKE = 1) SCKx (CKP = 1 CKE = 1) SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 1) SDIx (SMP = 0) bit 7 bit 0 Input Sample (SMP = 0) SDIx (SMP = 1) bit 7 bit 0 Input Sample (SMP = 1) SSPxIF SSPxSR to SSPxBUF  2011-2015 Microchip Technology Inc. DS40001607D-page 161

PIC16(L)F1503 21.2.4 SPI SLAVE MODE 21.2.5 SLAVE SELECT SYNCHRONIZATION In Slave mode, the data is transmitted and received as external clock pulses appear on SCKx. When the last The Slave Select can also be used to synchronize com- bit is latched, the SSPxIF interrupt flag bit is set. munication. The Slave Select line is held high until the Before enabling the module in SPI Slave mode, the clock master device is ready to communicate. When the line must match the proper Idle state. The clock line can Slave Select line is pulled low, the slave knows that a be observed by reading the SCKx pin. The Idle state is new transmission is starting. determined by the CKP bit of the SSPxCON1 register. If the slave fails to receive the communication properly, While in Slave mode, the external clock is supplied by it will be reset at the end of the transmission, when the the external clock source on the SCKx pin. This exter- Slave Select line returns to a high state. The slave is nal clock must meet the minimum high and low times then ready to receive a new transmission when the as specified in the electrical specifications. Slave Select line is pulled low again. If the Slave Select line is not used, there is a risk that the slave will even- While in Sleep mode, the slave can transmit/receive tually become out of sync with the master. If the slave data. The shift register is clocked from the SCKx pin misses a bit, it will always be one bit off in future trans- input and when a byte is received, the device will gen- missions. Use of the Slave Select line allows the slave erate an interrupt. If enabled, the device will wake-up and master to align themselves at the beginning of from Sleep. each transmission. 21.2.4.1 Daisy-Chain Configuration The SSx pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SSx pin control The SPI bus can sometimes be connected in a enabled (SSPxCON1<3:0> = 0100). daisy-chain configuration. The first slave output is con- nected to the second slave input, the second slave When the SSx pin is low, transmission and reception output is connected to the third slave input, and so on. are enabled and the SDOx pin is driven. The final slave output is connected to the master input. When the SSx pin goes high, the SDOx pin is no longer Each slave sends out, during a second group of clock driven, even if in the middle of a transmitted byte and pulses, an exact copy of what was received during the becomes a floating output. External pull-up/pull-down first group of clock pulses. The whole chain acts as resistors may be desirable depending on the applica- one large communication shift register. The tion. daisy-chain feature only requires a single Slave Select line from the master device. Note 1: When the SPI is in Slave mode with SSx pin control enabled (SSPxCON1<3:0> = Figure21-7 shows the block diagram of a typical 0100), the SPI module will reset if the SSx daisy-chain connection when operating in SPI mode. pin is set to VDD. In a daisy-chain configuration, only the most recent 2: When the SPI is used in Slave mode with byte on the bus is required by the slave. Setting the CKE set; the user must enable SSx pin BOEN bit of the SSPxCON3 register will enable writes control. to the SSPxBUF register, even if the previous byte has not been read. This allows the software to ignore data 3: While operated in SPI Slave mode the that may not apply to it. SMP bit of the SSPxSTAT register must remain clear. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SSx pin to a high level or clearing the SSPEN bit. DS40001607D-page 162  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-7: SPI DAISY-CHAIN CONNECTION Rev.10-000082A 7/30/2013 SCK SCK SPIMaster SDOx SDIx SPISlave #1 SDIx SDOx GeneralI/O SSx SCK SDIx SPISlave SDOx #2 SSx SCK SDIx SPISlave SDOx #3 SSx FIGURE 21-8: SLAVE SELECT SYNCHRONOUS WAVEFORM SSx SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) Write to SSPxBUF Shift register SSPxSR and bit count are reset SSPxBUF to SSPxSR SDOx bit 7 bit 6 bit 7 bit 6 bit 0 SDIx bit 0 bit 7 bit 7 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF  2011-2015 Microchip Technology Inc. DS40001607D-page 163

PIC16(L)F1503 FIGURE 21-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE=0) SSx Optional SCKx (CKP = 0 CKE = 0) SCKx (CKP = 1 CKE = 0) Write to SSPxBUF Valid SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDIx bit 7 bit 0 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF Write Collision detection active FIGURE 21-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SSx Not Optional SCKx (CKP = 0 CKE = 1) SCKx (CKP = 1 CKE = 1) Write to SSPxBUF Valid SDOx bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDIx bit 7 bit 0 Input Sample SSPxIF Interrupt Flag SSPxSR to SSPxBUF Write Collision detection active DS40001607D-page 164  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.2.6 SPI OPERATION IN SLEEP MODE In SPI Master mode, module clocks may be operating at a different speed than when in Full-Power mode; in the case of the Sleep mode, all clocks are halted. Special care must be taken by the user when the MSSP clock is much faster than the system clock. In Slave mode, when MSSP interrupts are enabled, after the master completes sending data, an MSSP interrupt will wake the controller from Sleep. If an exit from Sleep mode is not desired, MSSP inter- rupts should be disabled. In SPI Master mode, when the Sleep mode is selected, all module clocks are halted and the transmis- sion/reception will remain in that state until the device wakes. After the device returns to Run mode, the mod- ule will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in Sleep mode and data to be shifted into the SPI Transmit/Receive Shift register. When all eight bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 68 SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register 158* SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 204 SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 206 SSP1STAT SMP CKE D/A P S R/W UA BF 203 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode. * Page provides register information. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 165

PIC16(L)F1503 21.3 I2C MODE OVERVIEW FIGURE 21-11: I2C MASTER/ SLAVE CONNECTION The Inter-Integrated Circuit Bus (I2C) is a multi-master serial data communication bus. Devices communicate Rev.10-000085A 7/30/2013 in a master/slave environment where the master VDD devices initiate the communication. A slave device is controlled through addressing. The I2C bus specifies two signal connections: SCLx SCLx • Serial Clock (SCLx) VDD • Serial Data (SDAx) Master Slave Figure21-2 and Figure21-3 show the block diagrams of the MSSP module when operating in I2C mode. SDAx SDAx Both the SCLx and SDAx connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero and letting the line float is considered a The Acknowledge bit (ACK) is an active-low signal, logical one. which holds the SDAx line low to indicate to the trans- mitter that the slave device has received the transmit- Figure21-11 shows a typical connection between two ted data and is ready to receive more. processors configured as master and slave devices. The I2C bus can operate with one or more master The transition of a data bit is always performed while the SCLx line is held low. Transitions that occur while devices and one or more slave devices. the SCLx line is held high are used to indicate Start and There are four potential modes of operation for a given Stop bits. device: If the master intends to write to the slave, then it repeat- • Master Transmit mode edly sends out a byte of data, with the slave responding (master is transmitting data to a slave) after each byte with an ACK bit. In this example, the • Master Receive mode master device is in Master Transmit mode and the (master is receiving data from a slave) slave is in Slave Receive mode. • Slave Transmit mode If the master intends to read from the slave, then it (slave is transmitting data to a master) repeatedly receives a byte of data from the slave, and • Slave Receive mode responds after each byte with an ACK bit. In this exam- (slave is receiving data from the master) ple, the master device is in Master Receive mode and To begin communication, a master device starts out in the slave is Slave Transmit mode. Master Transmit mode. The master device sends out a On the last byte of data communicated, the master Start bit followed by the address byte of the slave it device may end the transmission by sending a Stop bit. intends to communicate with. This is followed by a sin- If the master device is in Receive mode, it sends the gle Read/Write bit, which determines whether the mas- Stop bit in place of the last ACK bit. A Stop bit is indi- ter intends to transmit to or receive data from the slave cated by a low-to-high transition of the SDAx line while device. the SCLx line is held high. If the requested slave exists on the bus, it will respond In some cases, the master may want to maintain con- with an Acknowledge bit, otherwise known as an ACK. trol of the bus and re-initiate another transmission. If The master then continues in either Transmit mode or so, the master device may send another Start bit in Receive mode and the slave continues in the comple- place of the Stop bit or last ACK bit when it is in receive ment, either in Receive mode or Transmit mode, mode. respectively. The I2C bus specifies three message protocols; A Start bit is indicated by a high-to-low transition of the • Single message where a master writes data to a SDAx line while the SCLx line is held high. Address and slave. data bytes are sent out, Most Significant bit (MSb) first. • Single message where a master reads data from The Read/Write bit is sent out as a logical one when the a slave. master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the • Combined message where a master initiates a slave. minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves. DS40001607D-page 166  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 When one device is transmitting a logical one, or letting 21.3.2 ARBITRATION the line float, and a second device is transmitting a log- Each master device must monitor the bus for Start and ical zero, or holding the line low, the first device can Stop bits. If the device detects that the bus is busy, it detect that the line is not a logical one. This detection, cannot begin a new message until the bus returns to an when used on the SCLx line, is called clock stretching. Idle state. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on However, two master devices may try to initiate a trans- the SDAx line, it is called arbitration. Arbitration mission on or about the same time. When this occurs, ensures that there is only one master device communi- the process of arbitration begins. Each transmitter cating at any single time. checks the level of the SDAx data line and compares it to the level that it expects to find. The first transmitter to 21.3.1 CLOCK STRETCHING observe that the two levels do not match, loses arbitra- tion, and must stop transmitting on the SDAx line. When a slave device has not completed processing data, it can delay the transfer of more data through the For example, if one transmitter holds the SDAx line to process of clock stretching. An addressed slave device a logical one (lets it float) and a second transmitter may hold the SCLx clock line low after receiving or holds it to a logical zero (pulls it low), the result is that sending a bit, indicating that it is not yet ready to con- the SDAx line will be low. The first transmitter then tinue. The master that is communicating with the slave observes that the level of the line is different than will attempt to raise the SCLx line in order to transfer expected and concludes that another transmitter is the next bit, but will detect that the clock line has not yet communicating. been released. Because the SCLx connection is The first transmitter to notice this difference is the one open-drain, the slave has the ability to hold that line low that loses arbitration and must stop driving the SDAx until it is ready to continue communicating. line. If this transmitter is also a master device, it also Clock stretching allows receivers that cannot keep up must stop driving the SCLx line. It then can monitor the with a transmitter to control the flow of incoming data. lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDAx line continues with its original transmission. It can do so without any compli- cations, because so far, the transmission appears exactly as expected with no other transmitter disturbing the message. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less com- mon. If two master devices are sending a message to two dif- ferent slave devices at the address stage, the master sending the lower slave address always wins arbitra- tion. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. Arbitration usually occurs very rarely, but it is a neces- sary process for proper multi-master support.  2011-2015 Microchip Technology Inc. DS40001607D-page 167

PIC16(L)F1503 21.4 I2C MODE OPERATION TABLE 21-2: I2C BUS TERMS All MSSP I2C communication is byte oriented and TERM Description shifted out MSb first. Six SFR registers and two Transmitter The device which shifts data out interrupt flags interface the module with the PIC® onto the bus. microcontroller and user software. Two pins, SDAx Receiver The device which shifts data in and SCLx, are exercised by the module to communi- from the bus. cate with other external I2C devices. Master The device that initiates a transfer, generates clock signals and termi- 21.4.1 BYTE FORMAT nates a transfer. All communication in I2C is done in 9-bit segments. A Slave The device addressed by the byte is sent from a master to a slave or vice-versa, master. followed by an Acknowledge bit sent back. After the Multi-master A bus with more than one device eighth falling edge of the SCLx line, the device output- that can initiate data transfers. ting data on the SDAx changes that pin to an input and Arbitration Procedure to ensure that only one reads in an acknowledge value on the next clock master at a time controls the bus. pulse. Winning arbitration ensures that The clock signal, SCLx, is provided by the master. the message is not corrupted. Data is valid to change while the SCLx signal is low, Synchronization Procedure to synchronize the and sampled on the rising edge of the clock. Changes clocks of two or more devices on on the SDAx line while the SCLx line is high define the bus. special conditions on the bus, explained below. Idle No master is controlling the bus, 21.4.2 DEFINITION OF I2C TERMINOLOGY and both SDAx and SCLx lines are high. There is language and terminology in the description Active Any time one or more master of I2C communication that have definitions specific to devices are controlling the bus. I2C. That word usage is defined below and may be Addressed Slave device that has received a used in the rest of this document without explanation. This table was adapted from the Philips I2CTM Slave matching address and is actively being clocked by a master. specification. Matching Address byte that is clocked into a 21.4.3 SDAX AND SCLX PINS Address slave that matches the value Selection of any I2C mode with the SSPEN bit set, stored in SSPxADD. forces the SCLx and SDAx pins to be open-drain. Write Request Slave receives a matching These pins should be set by the user to inputs by set- address with R/W bit clear, and is ting the appropriate TRIS bits. ready to clock in data. Read Request Master sends an address byte with Note: Data is tied to output zero when an I2C the R/W bit set, indicating that it mode is enabled. wishes to clock data out of the Slave. This data is the next and all 21.4.4 SDAX HOLD TIME following bytes until a Restart or The hold time of the SDAx pin is selected by the Stop. SDAHT bit of the SSPxCON3 register. Hold time is the Clock Stretching When a device on the bus hold time SDAx is held valid after the falling edge of SCLx. SCLx low to stall communication. Setting the SDAHT bit selects a longer 300ns mini- Bus Collision Any time the SDAx line is sampled mum hold time and may help on buses with large low by the module while it is out- capacitance. putting and expected high state. DS40001607D-page 168  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.4.5 START CONDITION 21.4.7 RESTART CONDITION The I2C specification defines a Start condition as a A Restart is valid any time that a Stop would be valid. transition of SDAx from a high to a low state while A master can issue a Restart if it wishes to hold the SCLx line is high. A Start condition is always gener- bus after terminating the current transfer. A Restart ated by the master and signifies the transition of the has the same effect on the slave that a Start would, bus from an Idle to an Active state. Figure21-12 resetting all slave logic and preparing it to clock in an shows wave forms for Start and Stop conditions. address. The master may want to address the same or another slave. Figure21-13 shows the wave form for a A bus collision can occur on a Start condition if the Restart condition. module samples the SDAx line low before asserting it low. This does not conform to the I2C Specification that In 10-bit Addressing Slave mode a Restart is required states no bus collision can occur on a Start. for the master to clock data out of the addressed slave. Once a slave has been fully addressed, match- 21.4.6 STOP CONDITION ing both high and low address bytes, the master can A Stop condition is a transition of the SDAx line from issue a Restart and the high address byte with the low-to-high state while the SCLx line is high. R/W bit set. The slave logic will then hold the clock and prepare to clock out data. Note: At least one SCLx low time must appear After a full match with R/W clear in 10-bit mode, a prior before a Stop is valid, therefore, if the SDAx match flag is set and maintained. Until a Stop condi- line goes low then high again while the SCLx tion, a high address with R/W clear, or high address line stays high, only the Start condition is match fails. detected. 21.4.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits of the SSPxCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. Slave modes where interrupt on Start and Stop detect are already enabled, these bits will have no effect. FIGURE 21-12: I2C START AND STOP CONDITIONS SDAx SCLx S P Change of Change of Data Allowed Data Allowed Start Stop Condition Condition FIGURE 21-13: I2C RESTART CONDITION Sr Change of Change of Data Allowed Data Allowed Restart Condition  2011-2015 Microchip Technology Inc. DS40001607D-page 169

PIC16(L)F1503 21.4.9 ACKNOWLEDGE SEQUENCE 21.5.1.1 I2C Slave 7-bit Addressing Mode The ninth SCLx pulse for any transferred byte in I2C is In 7-bit Addressing mode, the LSb of the received data dedicated as an Acknowledge. It allows receiving byte is ignored when determining if there is an address devices to respond back to the transmitter by pulling match. the SDAx line low. The transmitter must release con- 21.5.1.2 I2C Slave 10-bit Addressing Mode trol of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pull- In 10-bit Addressing mode, the first received byte is ing the SDAx line low indicated to the transmitter that compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 the device has received the transmitted data and is and A8 are the two MSbs of the 10-bit address and ready to receive more. stored in bits 2 and 1 of the SSPxADD register. The result of an ACK is placed in the ACKSTAT bit of After the acknowledge of the high byte the UA bit is set the SSPxCON2 register. and SCLx is held low until the user updates SSPxADD Slave software, when the AHEN and DHEN bits are with the low address. The low address byte is clocked set, allow the user to set the ACK value sent back to in and all eight bits are compared to the low address the transmitter. The ACKDT bit of the SSPxCON2 reg- value in SSPxADD. Even if there is not an address ister is set/cleared to determine the response. match; SSPxIF and UA are set, and SCLx is held low until SSPxADD is updated to receive a high byte Slave hardware will generate an ACK response if the again. When SSPxADD is updated the UA bit is AHEN and DHEN bits of the SSPxCON3 register are cleared. This ensures the module is ready to receive clear. the high address byte on the next communication. There are certain conditions where an ACK will not be A high and low address match as a write request is sent by the slave. If the BF bit of the SSPxSTAT regis- required at the start of all 10-bit addressing communi- ter or the SSPOV bit of the SSPxCON1 register are cation. A transmission can be initiated by issuing a set when a byte is received. Restart once the slave is addressed, and clocking in When the module is addressed, after the eighth falling the high address with the R/W bit set. The slave hard- edge of SCLx on the bus, the ACKTIM bit of the ware will then acknowledge the read request and pre- SSPxCON3 register is set. The ACKTIM bit indicates pare to clock out data. This is only valid for a slave the acknowledge time of the active bus. The ACKTIM after it has received a complete high and low address Status bit is only active when the AHEN bit or DHEN byte match. bit is enabled. 21.5.2 SLAVE RECEPTION 21.5 I2C Slave Mode Operation When the R/W bit of a matching received address byte is clear, the R/W bit of the SSPxSTAT register is The MSSP Slave mode operates in one of four modes cleared. The received address is loaded into the selected in the SSPM bits of SSPxCON1 register. The SSPxBUF register and acknowledged. modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing modes operate the same as When the overflow condition exists for a received 7-bit with some additional overhead for handling the address, then not Acknowledge is given. An overflow larger addresses. condition is defined as either bit BF of the SSPxSTAT register is set, or bit SSPOV of the SSPxCON1 register Modes with Start and Stop bit interrupts operate the is set. The BOEN bit of the SSPxCON3 register modi- same as the other modes with SSPxIF additionally fies this operation. For more information see getting set upon detection of a Start, Restart, or Stop Register21-4. condition. An MSSP interrupt is generated for each transferred 21.5.1 SLAVE MODE ADDRESSES data byte. Flag bit, SSPxIF, must be cleared by soft- The SSPxADD register (Register21-6) contains the ware. Slave mode address. The first byte received after a When the SEN bit of the SSPxCON2 register is set, Start or Restart condition is compared against the SCLx will be held low (clock stretch) following each value stored in this register. If the byte matches, the received byte. The clock must be released by setting value is loaded into the SSPxBUF register and an the CKP bit of the SSPxCON1 register, except interrupt is generated. If the value does not match, the sometimes in 10-bit mode. See Section21.2.3“SPI module goes idle and no indication is given to the soft- Master Mode” for more detail. ware that anything happened. 21.5.2.1 7-bit Addressing Reception The SSP Mask register (Register21-5) affects the address matching process. See Section21.5.9“SSPx This section describes a standard sequence of events Mask Register” for more information. for the MSSP module configured as an I2C slave in 7-bit Addressing mode. Figure21-14 and Figure21-15 are used as visual references for this description. DS40001607D-page 170  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 This is a step by step process of what typically must 21.5.2.2 7-bit Reception with AHEN and DHEN be done to accomplish I2C communication. Slave device reception with AHEN and DHEN set 1. Start bit detected. operate the same as without these options with extra 2. S bit of SSPxSTAT is set; SSPxIF is set if inter- interrupts and clock stretching added after the eighth rupt on Start detect is enabled. falling edge of SCLx. These additional interrupts allow 3. Matching address with R/W bit clear is received. the slave software to decide whether it wants to ACK 4. The slave pulls SDAx low sending an ACK to the the receive address or data byte, rather than the hard- master, and sets SSPxIF bit. ware. This functionality adds support for PMBus™ that was not present on previous versions of this module. 5. Software clears the SSPxIF bit. 6. Software reads received address from This list describes the steps that need to be taken by SSPxBUF clearing the BF flag. slave software to use these options for I2C communi- cation. Figure21-16 displays a module using both 7. If SEN=1; Slave software sets CKP bit to address and data holding. Figure21-17 includes the release the SCLx line. operation with the SEN bit of the SSPxCON2 register 8. The master clocks out a data byte. set. 9. Slave drives SDAx low sending an ACK to the 1. S bit of SSPxSTAT is set; SSPxIF is set if inter- master, and sets SSPxIF bit. rupt on Start detect is enabled. 10. Software clears SSPxIF. 2. Matching address with R/W bit clear is clocked 11. Software reads the received byte from in. SSPxIF is set and CKP cleared after the SSPxBUF clearing BF. eighth falling edge of SCLx. 12. Steps 8-12 are repeated for all received bytes 3. Slave clears the SSPxIF. from the Master. 4. Slave can look at the ACKTIM bit of the 13. Master sends Stop condition, setting P bit of SSPxCON3 register to determine if the SSPxIF SSPxSTAT, and the bus goes idle. was after or before the ACK. 5. Slave reads the address value from SSPxBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPxIF is set after an ACK, not after a NACK. 9. If SEN=1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPxIF. Note: SSPxIF is still set after the ninth falling edge of SCLx even if there is no clock stretching and BF has been cleared. Only if NACK is sent to master is SSPxIF not set 11. SSPxIF set and CKP cleared after eighth falling edge of SCLx for a received data byte. 12. Slave looks at ACKTIM bit of SSPxCON3 to determine the source of the interrupt. 13. Slave reads the received data from SSPxBUF clearing BF. 14. Steps 7-14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK=1, or the master sending a Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave will only know by polling the P bit of the SSPSTAT register.  2011-2015 Microchip Technology Inc. DS40001607D-page 171

PIC16(L)F1503 FIGURE 21-14: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=0, AHEN=0, DHEN=0) s endn 9th Bus Master sStop conditio 1 P SSPxIF set on falling edge of SCLx = K 9 C A D0 8 Master eceiving Data D4D3D2D1 4567 eared by software SSPOV set becauseSSPxBUF is still full. ACK is not sent. e to R D5 3 Cl v F From Sla D7D6K 12 First byte of data is available in SSPxBU C 9 A D0 8 D1 7 ad e a D2 6 ware F is r Receiving Dat D5D4D3 345 Cleared by soft SSPxBU D6 2 D7 1 K 9 C A 8 A1 7 2 6 A s s dre A3 5 d A ng A4 4 vi ecei A5 3 R A6 2 A7 1 S V F O x x xI P DA CL SP BF SS S S S DS40001607D-page 172  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-15: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=1, AHEN=0, DHEN=0) Bus Master sends Stop condition P SSPxIF set on 9thfalling edge of SCLx SCLx is not heldlow becauseACK=1 K C 9 A D0 8 Receive Data D7D6D5D4D3D2D1 1234567 Cleared by software First byte of data is available in SSPxBUF SSPOV set becauseSSPxBUF is still full. ACK is not sent. CKP is written to ‘’ in software, 1releasing SCLx N E S K AC 9 D0 8 ’1 o ‘ Data D2D1 67 KP is set t oftware, Receive D7D6D5D4D3 12345 Clock is held low until C Cleared by software SSPxBUF is read CKP is written to ‘’ in s1releasing SCLx N E S K C A 9 0 = W R/ 8 A1 7 2 6 A s s dre A3 5 d e A A4 4 v ei ec A5 3 R 6 2 A A7 1 S V F O P SDAx SCLx SSPxI BF SSP CK  2011-2015 Microchip Technology Inc. DS40001607D-page 173

PIC16(L)F1503 FIGURE 21-16: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN=0, AHEN=1, DHEN=1) Master sendsStop condition =1 P No interruptafter not ACKfrom Slave CK 9 A are T to Received DataCKD7D6D5D4D3D2D1D0 912345678 Cleared by software a is read from SSPxBUF Slave softwsets ACKDnot ACK CKP set by software, SCLx is released ACKTIM set by hardwareon 8th falling edge of SCLx A at D D0 8 g Receiving Data D6D5D4D3D2D1 234567 SPxIF is set on h falling edge of CLx, after ACK When DHEN=:1CKP is cleared byhardware on 8th fallinedge of SCLx KTIM cleared bydware in 9th ng edge of SCLx D7 1 S9tS ACharrisi K 9 ce C n A e Axqu De es SCK s sA Master Releato slave for Receiving Address A7A6A5A4A3A2A1 12345678 If AHEN=:1SSPxIF is set Address isread from SSBUF Slave softwareclears ACKDT to ACK the receivedbyte When AHEN=:1CKP is cleared by hardwareand SCLx is stretched ACKTIM set by hardwareon 8th falling edge of SCLx S M SDAx SCLx SSPxIF BF ACKDT CKP ACKTI S P DS40001607D-page 174  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-17: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN= 1, AHEN=1, DHEN=1) Master sendsStop condition P No interrupt afterif not ACKfrom Slave CKP is not clearedif not ACK K 9 C A D0 8 s d D1 7 enK Receive Data D6D5D4D3D2 23456 SSPxBUF can beread any time beforenext byte is loaded Slave snot AC Set by software,release SCLx D7 1 K C 9 A D0 8 F e CK sequence Receive Data D7D6D5D4D3D2D1 1245673 Cleared by software Received data isavailable on SSPxBU When DHEN = ;1on the 8th falling edgeof SCLx of a receiveddata byte, CKP is cleared ACKTIM is cleared by hardwaron 9th rising edge of SCLx A ster releasesAx to slave for ACK 9 aD MS 8 s R/W = 0 Receiving Address A7A6A5A4A3A2A1 3412567 Received address is loaded into SSPxBUF Slave software clearACKDT to ACKthe received byte When AHEN=;1on the 8th falling edgeof SCLx of an addressbyte, CKP is cleared ACKTIM is set by hardwareon 8th falling edge of SCLx S M TI SDAx SCLx SPxIF BF ACKDT CKP ACK S P S  2011-2015 Microchip Technology Inc. DS40001607D-page 175

PIC16(L)F1503 21.5.3 SLAVE TRANSMISSION 21.5.3.2 7-bit Transmission When the R/W bit of the incoming address byte is set A master device can transmit a read request to a and an address match occurs, the R/W bit of the slave, and then clock data out of the slave. The list SSPxSTAT register is set. The received address is below outlines what software for a slave will need to loaded into the SSPxBUF register, and an ACK pulse is do to accomplish a standard transmission. sent by the slave on the ninth bit. Figure21-18 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit 1. Master sends a Start condition on SDAx and and the SCLx pin is held low (see SCLx. Section21.5.6“Clock Stretching” for more detail). By 2. S bit of SSPxSTAT is set; SSPxIF is set if inter- stretching the clock, the master will be unable to assert rupt on Start detect is enabled. another clock pulse until the slave is done preparing 3. Matching address with R/W bit set is received by the transmit data. the slave setting SSPxIF bit. The transmit data must be loaded into the SSPxBUF 4. Slave hardware generates an ACK and sets register which also loads the SSPxSR register. Then SSPxIF. the SCLx pin should be released by setting the CKP bit 5. SSPxIF bit is cleared by user. of the SSPxCON1 register. The eight data bits are 6. Software reads the received address from shifted out on the falling edge of the SCLx input. This SSPxBUF, clearing BF. ensures that the SDAx signal is valid during the SCLx 7. R/W is set so CKP was automatically cleared high time. after the ACK. The ACK pulse from the master-receiver is latched on 8. The slave software loads the transmit data into the rising edge of the ninth SCLx input pulse. This ACK SSPxBUF. value is copied to the ACKSTAT bit of the SSPxCON2 9. CKP bit is set releasing SCLx, allowing the mas- register. If ACKSTAT is set (not ACK), then the data transfer is complete. In this case, when the not ACK is ter to clock the data out of the slave. latched by the slave, the slave goes idle and waits for 10. SSPxIF is set after the ACK response from the another occurrence of the Start bit. If the SDAx line was master is loaded into the ACKSTAT register. low (ACK), the next transmit data must be loaded into 11. SSPxIF bit is cleared. the SSPxBUF register. Again, the SCLx pin must be 12. The slave software checks the ACKSTAT bit to released by setting bit CKP. see if the master wants to clock out more data. An MSSP interrupt is generated for each data transfer Note 1: If the master ACKs the clock will be byte. The SSPxIF bit must be cleared by software and stretched. the SSPxSTAT register is used to determine the status 2: ACKSTAT is the only bit updated on the of the byte. The SSPxIF bit is set on the falling edge of rising edge of SCLx (ninth) rather than the the ninth clock pulse. falling. 21.5.3.1 Slave Mode Bus Collision 13. Steps 9-13 are repeated for each transmitted A slave receives a Read request and begins shifting byte. data out on the SDAx line. If a bus collision is detected 14. If the master sends a not ACK; the clock is not and the SBCDE bit of the SSPxCON3 register is set, held, but SSPxIF is still set. the BCLxIF bit of the PIRx register is set. Once a bus 15. The master sends a Restart condition or a Stop. collision is detected, the slave goes idle and waits to be 16. The slave is no longer addressed. addressed again. User software can use the BCLxIF bit to handle a slave bus collision. DS40001607D-page 176  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-18: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN=0) sn do enditi er scon P stp ao MSt K C 9 A Transmitting Data D7D6D5D4D3D2D1D0 12345678 BF is automatically cleared after 8th fallingedge of SCLx CKP is not held for not ACK Masters not ACKis copied to ACKSTAT c ati m o ut A K AC 9 D0 8 1 D 7 a Dat D2 6 F Transmitting D7D6D5D4D3 12345 Cleared by software Data to transmit isloaded into SSPxBU Set by software c ati m o ut A 1CK =A 9 W Receiving AddressR/A5A4A3A2A1 345678 Received addressis read from SSPxBUF When R/W is setSCLx is alwaysheld low after 9th SCLxfalling edge R/W is copied from the matching address byte Indicates an address has been received 6 A 2 7 A 1 S T A F T SDAx SCLx SSPxI BF CKP ACKS R/W D/A S P  2011-2015 Microchip Technology Inc. DS40001607D-page 177

PIC16(L)F1503 21.5.3.3 7-bit Transmission with Address Hold Enabled Setting the AHEN bit of the SSPxCON3 register enables additional clock stretching and interrupt gen- eration after the eighth falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPxIF inter- rupt is set. Figure21-19 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. Bus starts idle. 2. Master sends Start condition; the S bit of SSPxSTAT is set; SSPxIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the eighth falling edge of the SCLx line the CKP bit is cleared and SSPxIF interrupt is generated. 4. Slave software clears SSPxIF. 5. Slave software reads ACKTIM bit of SSPxCON3 register, and R/W and D/A of the SSPxSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPxBUF register clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK and sets the ACKDT bit of the SSPxCON2 register accordingly. 8. Slave sets the CKP bit releasing SCLx. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPxIF after the ACK if the R/W bit is set. 11. Slave software clears SSPxIF. 12. Slave loads value to transmit to the master into SSPxBUF setting the BF bit. Note: SSPxBUF cannot be loaded until after the ACK. 13. Slave sets the CKP bit, releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the ninth SCLx pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit of the SSPxCON2 register. 16. Steps 10-15 are repeated for each byte transmit- ted to the master from the slave. 17. If the master sends a not ACK the slave releases the bus allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCLx line to receive a Stop. DS40001607D-page 178  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-19: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN=1) endsdition sn ster p co P ao MSt K C A 9 0 D 8 Transmitting Data D5D4D3D2D1 34567 F is automatically eared after 8th fallingge of SCLx Master’s ACKresponse is copiedto SSPxSTAT CKP not cleared after not ACK D6 2 Bcled 7 D 1 c ati m o AutK C A 9 D0 8 1 a D 7 at D 2 DAxequence AutomaticTransmitting D7D6D5D4D3D 123456 Cleared by software Data to transmit isloaded into SSPxBUF Set by software,releases SCLx ACKTIM is clearedon 9th rising edge of SCLx Ss K Master releases to slave for ACK W=1AC 9 When R/W = ;1CKP is alwayscleared after ACK R/ 8 UF K Receiving Address A7A6A5A4A3A2A1 1234567 Received addressis read from SSPxB Slave clearsACKDT to ACaddress When AHEN = ;1CKP is cleared by hardwareafter receiving matchingaddress. ACKTIM is set on 8th fallingedge of SCLx S SDAx SCLx SPxIF BF CKDT STAT CKP KTIM R/W D/A S A K C C A A  2011-2015 Microchip Technology Inc. DS40001607D-page 179

PIC16(L)F1503 21.5.4 SLAVE MODE 10-BIT ADDRESS 21.5.5 10-BIT ADDRESSING WITH ADDRESS OR RECEPTION DATA HOLD This section describes a standard sequence of events Reception using 10-bit addressing with AHEN or for the MSSP module configured as an I2C slave in DHEN set is the same as with 7-bit modes. The only 10-bit Addressing mode. difference is the need to update the SSPxADD register using the UA bit. All functionality, specifically when the Figure21-20 is used as a visual reference for this CKP bit is cleared and SCLx line is held low are the description. same. Figure21-21 can be used as a reference of a This is a step by step process of what must be done by slave in 10-bit addressing with AHEN set. slave software to accomplish I2C communication. Figure21-22 shows a standard waveform for a slave 1. Bus starts idle. transmitter in 10-bit Addressing mode. 2. Master sends Start condition; S bit of SSPxSTAT is set; SSPxIF is set if interrupt on Start detect is enabled. 3. Master sends matching high address with R/W bit clear; UA bit of the SSPxSTAT register is set. 4. Slave sends ACK and SSPxIF is set. 5. Software clears the SSPxIF bit. 6. Software reads received address from SSPxBUF clearing the BF flag. 7. Slave loads low address into SSPxADD, releasing SCLx. 8. Master sends matching low address byte to the slave; UA bit is set. Note: Updates to the SSPxADD register are not allowed until after the ACK sequence. 9. Slave sends ACK and SSPxIF is set. Note: If the low address does not match, SSPxIF and UA are still set so that the slave soft- ware can set SSPxADD back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPxIF. 11. Slave reads the received matching address from SSPxBUF clearing BF. 12. Slave loads high address into SSPxADD. 13. Master clocks a data byte to the slave and clocks out the slaves ACK on the ninth SCLx pulse; SSPxIF is set. 14. If SEN bit of SSPxCON2 is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPxIF. 16. Slave reads the received byte from SSPxBUF clearing BF. 17. If SEN is set the slave sets CKP to release the SCLx. 18. Steps 13-17 repeat for each received byte. 19. Master sends Stop to end the transmission. DS40001607D-page 180  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-20: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN=1, AHEN=0, DHEN=0) endsdition er scon P stp ao MSt K C 9 A 0 8 D ata D1 7 dBUF Receive D D6D5D4D3D2 23456 SCLx is held lowwhile CKP = 0 Data is reafrom SSPx Set by software,releasing SCLxyte D7 1 d b e v K cei Receive Data D6D5D4D3D2D1D0AC 92345678 Cleared by software Receive address isread from SSPxBUF When SEN = ;1CKP is cleared after9th falling edge of re D7 1 K e AC 9 Byt A0 8 DD s A es A1 7 Px Receive Second Addr A6A5A4A3A2 23456 Software updates SSand releases SCLx A7 1 K C 9 ve First Address Byte A0A9A811 345678 Set by hardwareon 9th falling edge If address matchesSSPxADD it is loaded into SSPxBUF When UA = ;1SCLx is held low ei 1 2 c e R 1 1 S SDAx SCLx SPxIF BF UA CKP S  2011-2015 Microchip Technology Inc. DS40001607D-page 181

PIC16(L)F1503 FIGURE 21-21: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN=0, AHEN=1, DHEN=0) a Receive Data D7D6D5 12 Received datis read from SSPxBUF K C 9 A D0 8 D1 7 s D,se Receive Data D6D5D4D3D2 23456 eared by software Update of SSPxADclears UA and releaSCLx CKP with software ases SCLx D7 1 Cl Set rele A U K C 9 A A0 8 Receive Second Address Byte A7A6A5A4A3A2A1 3456712 Cleared by software SSPxBUF can beread anytime beforethe next received byte Update to SSPxADD isnot allowed until 9thfalling edge of SCLx A U K C 9 A 0 = W 8 eive First Address ByteR/ A9A8110 34567 Set by hardwareon 9th falling edge Slave software clearsACKDT to ACKthe received byte If when AHEN=;1on the 8th falling edgeof SCLx of an addressbyte, CKP is cleared ACKTIM is set by hardwareon 8th falling edge of SCLx ec 1 2 R 1 1 S F T M SDAx SCLx SSPxI BF ACKD UA CKP ACKTI DS40001607D-page 182  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-22: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN=0, AHEN=0, DHEN=0) ends dition er scon P MastStop K = 1 ds AC 9 en D0 8 K Master snot ACK Transmitting Data Byte D7D6D5D4D3D2D1 1723456 Data to transmit isloaded into SSPxBUF Set by softwarereleases SCLx Masters not ACis copied K C A 9 aster sends estart event Receive First Address Byte A9A811110 16782345Sr Set by hardware Received address isread from SSPxBUF High address is loadedback into SSPxADD When R/W = ;1CKP is cleared on9th falling edge of SCLx R/W is copied from thematching address byte MR K yte AC 9 eiving Second Address B A6A5A4A3A2A1A0 6782345 Cleared by software After SSPxADD isupdated, UA is clearedand SCLx is released c Re A7 1 K = 0 AC 9 W 8 Receiving AddressR/ A9A811110 1672345 Set by hardware SSPxBUF loadedwith received address UA indicates SSPxADDmust be updated Indicates an addresshas been received S AT T S SDAx SCLx SPxIF BF UA CKP ACK R/W D/A S  2011-2015 Microchip Technology Inc. DS40001607D-page 183

PIC16(L)F1503 21.5.6 CLOCK STRETCHING 21.5.6.2 10-bit Addressing Mode Clock stretching occurs when a device on the bus In 10-bit Addressing mode, when the UA bit is set, the holds the SCLx line low, effectively pausing communi- clock is always stretched. This is the only time the cation. The slave may stretch the clock to allow more SCLx is stretched without CKP being cleared. SCLx is time to handle data or prepare a response for the mas- released immediately after a write to SSPxADD. ter device. A master device is not concerned with Note: Previous versions of the module did not stretching as anytime it is active on the bus and not stretch the clock if the second address byte transferring data it is stretching. Any stretching done did not match. by a slave is invisible to the master software and han- dled by the hardware that generates SCLx. 21.5.6.3 Byte NACKing The CKP bit of the SSPxCON1 register is used to con- When the AHEN bit of SSPxCON3 is set; CKP is trol stretching in software. Any time the CKP bit is cleared by hardware after the eighth falling edge of cleared, the module will wait for the SCLx line to go SCLx for a received matching address byte. When the low and then hold it. Setting CKP will release SCLx DHEN bit of SSPxCON3 is set, CKP is cleared after and allow more communication. the eighth falling edge of SCLx for received data. 21.5.6.1 Normal Clock Stretching Stretching after the eighth falling edge of SCLx allows Following an ACK if the R/W bit of SSPxSTAT is set, a the slave to look at the received address or data and read request, the slave hardware will clear CKP. This decide if it wants to ACK the received data. allows the slave time to update SSPxBUF with data to 21.5.7 CLOCK SYNCHRONIZATION AND transfer to the master. If the SEN bit of SSPxCON2 is THE CKP BIT set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready, CKP Any time the CKP bit is cleared, the module will wait is set by software and communication resumes. for the SCLx line to go low and then hold it. However, clearing the CKP bit will not assert the SCLx output Note 1: The BF bit has no effect on if the clock will low until the SCLx output is already sampled low. be stretched or not. This is different than Therefore, the CKP bit will not assert the SCLx line previous versions of the module that until an external I2C master device has already would not stretch the clock, clear CKP, if asserted the SCLx line. The SCLx output will remain SSPxBUF was read before the ninth fall- low until the CKP bit is set and all other devices on the ing edge of SCLx. I2C bus have released SCLx. This ensures that a write 2: Previous versions of the module did not to the CKP bit will not violate the minimum high time stretch the clock for a transmission if requirement for SCLx (see Figure21-23). SSPxBUF was loaded before the ninth falling edge of SCLx. It is now always cleared for read requests. FIGURE 21-23: CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDAx DX DX ‚ – 1 SCLx Master device CKP asserts clock Master device releases clock WR SSPxCON1 DS40001607D-page 184  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.5.8 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave The addressing procedure for the I2C bus is such that will prepare to receive the second byte as data, just as the first byte after the Start condition usually deter- it would in 7-bit mode. mines which device will be the slave addressed by the master device. The exception is the general call If the AHEN bit of the SSPxCON3 register is set, just address which can address all devices. When this as with any other address reception, the slave hard- address is used, all devices should, in theory, respond ware will stretch the clock after the eighth falling edge with an acknowledge. of SCLx. The slave must then set its ACKDT value and release the clock with communication progressing as it The general call address is a reserved address in the would normally. I2C protocol, defined as address 0x00. When the GCEN bit of the SSPxCON2 register is set, the slave module will automatically ACK the reception of this address regardless of the value stored in SSPxADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPxBUF and respond. Figure21-24 shows a General Call reception sequence. FIGURE 21-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt R/W = 0 Receiving Data ACK SDAx General Call Address ACK D7 D6 D5 D4 D3 D2 D1 D0 SCLx 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 S SSPxIF BF (SSPxSTAT<0>) Cleared by software SSPxBUF is read GCEN (SSPxCON2<7>) ’1’ 21.5.9 SSPx MASK REGISTER An SSPx Mask (SSPxMSK) register (Register21-5) is available in I2C Slave mode as a mask for the value held in the SSPxSR register during an address comparison operation. A zero (‘0’) bit in the SSPxMSK register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSPx operation until written with a mask value. The SSPx Mask register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0> only. The SSPx mask has no effect during the reception of the first (high) byte of the address.  2011-2015 Microchip Technology Inc. DS40001607D-page 185

PIC16(L)F1503 21.6 I2C MASTER MODE 21.6.1 I2C MASTER MODE OPERATION Master mode is enabled by setting and clearing the The master device generates all of the serial clock appropriate SSPM bits in the SSPxCON1 register and pulses and the Start and Stop conditions. A transfer is by setting the SSPEN bit. In Master mode, the SDAx ended with a Stop condition or with a Repeated Start and SCKx pins must be configured as inputs. The condition. Since the Repeated Start condition is also MSSP peripheral hardware will override the output the beginning of the next serial transfer, the I2C bus will not be released. driver TRIS controls when necessary to drive the pins low. In Master Transmitter mode, serial data is output through SDAx, while SCLx outputs the serial clock. The Master mode of operation is supported by interrupt first byte transmitted contains the slave address of the generation on the detection of the Start and Stop con- ditions. The Stop (P) and Start (S) bits are cleared from receiving device (seven bits) and the Read/Write (R/W) a Reset or when the MSSPx module is disabled. Con- bit. In this case, the R/W bit will be logic ‘0’. Serial data trol of the I2C bus may be taken when the P bit is set, is transmitted eight bits at a time. After each byte is or the bus is idle. transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning In Firmware Controlled Master mode, user code and the end of a serial transfer. conducts all I2C bus operations based on Start and Stop bit condition detection. Start and Stop condition In Master Receive mode, the first byte transmitted detection is the only active circuitry in this mode. All contains the slave address of the transmitting device other communication is done by the user software (seven bits) and the R/W bit. In this case, the R/W bit directly manipulating the SDAx and SCLx lines. will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive The following events will cause the SSPx Interrupt Flag bit. Serial data is received via SDAx, while SCLx out- bit, SSPxIF, to be set (SSPx interrupt, if enabled): puts the serial clock. Serial data is received eight bits at a time. After each byte is received, an Acknowledge bit • Start condition detected is transmitted. Start and Stop conditions indicate the • Stop condition detected beginning and end of transmission. • Data transfer byte transmitted/received A Baud Rate Generator is used to set the clock • Acknowledge transmitted/received frequency output on SCLx. See Section21.7“Baud • Repeated Start generated Rate Generator” for more detail. Note 1: The MSSPx module, when configured in I2C Master mode, does not allow queue- ing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPxBUF register to initiate transmission before the Start condition is complete. In this case, the SSPxBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPxBUF did not occur 2: When in Master mode, Start/Stop detec- tion is masked and an interrupt is gener- ated when the SEN/PEN bit is cleared and the generation is complete. DS40001607D-page 186  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.6.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCLx pin (SCLx allowed to float high). When the SCLx pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCLx pin is actually sampled high. When the SCLx pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPxADD<7:0> and begins counting. This ensures that the SCLx high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure21-25). FIGURE 21-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDAx DX DX ‚ – 1 SCLx deasserted but slave holds SCLx allowed to transition high SCLx low (clock arbitration) SCLx BRG decrements on Q2 and Q4 cycles BRG 03h 02h 01h 00h (hold off) 03h 02h Value SCLx is sampled high, reload takes place and BRG starts its count BRG Reload 21.6.3 WCOL STATUS FLAG If the user writes the SSPxBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set it indicates that an action on SSPxBUF was attempted while the module was not idle. Note: Because queuing of events is not allowed, writing to the lower five bits of SSPxCON2 is disabled until the Start condition is complete.  2011-2015 Microchip Technology Inc. DS40001607D-page 187

PIC16(L)F1503 21.6.4 I2C MASTER MODE START by hardware; the Baud Rate Generator is suspended, CONDITION TIMING leaving the SDAx line held low and the Start condition is complete. To initiate a Start condition (Figure21-26), the user sets the Start Enable bit, SEN bit of the SSPxCON2 Note 1: If at the beginning of the Start condition, register. If the SDAx and SCLx pins are sampled high, the SDAx and SCLx pins are already sam- the Baud Rate Generator is reloaded with the contents pled low, or if during the Start condition, of SSPxADD<7:0> and starts its count. If SCLx and the SCLx line is sampled low before the SDAx are both sampled high when the Baud Rate SDAx line is driven low, a bus collision Generator times out (TBRG), the SDAx pin is driven occurs, the Bus Collision Interrupt Flag, low. The action of the SDAx being driven low while BCLxIF, is set, the Start condition is SCLx is high is the Start condition and causes the S bit aborted and the I2C module is reset into of the SSPxSTAT1 register to be set. Following this, its Idle state. the Baud Rate Generator is reloaded with the contents 2: The Philips I2C Specification states that a of SSPxADD<7:0> and resumes its count. When the bus collision cannot occur on a Start. Baud Rate Generator times out (TBRG), the SEN bit of the SSPxCON2 register will be automatically cleared FIGURE 21-26: FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPxSTAT<3>) At completion of Start bit, SDAx = 1, hardware clears SEN bit SCLx = 1 and sets SSPxIF bit TBRG TBRG Write to SSPxBUF occurs here SDAx 1st bit 2nd bit TBRG SCLx S TBRG DS40001607D-page 188  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.6.5 I2C MASTER MODE REPEATED automatically cleared and the Baud Rate Generator will START CONDITION TIMING not be reloaded, leaving the SDAx pin held low. As soon as a Start condition is detected on the SDAx and A Repeated Start condition (Figure21-27) occurs when SCLx pins, the S bit of the SSPxSTAT register will be the RSEN bit of the SSPxCON2 register is pro- set. The SSPxIF bit will not be set until the Baud Rate grammed high and the master state machine is no lon- Generator has timed out. ger active. When the RSEN bit is set, the SCLx pin is asserted low. When the SCLx pin is sampled low, the Note1: If RSEN is programmed while any other Baud Rate Generator is loaded and begins counting. event is in progress, it will not take effect. The SDAx pin is released (brought high) for one Baud 2: A bus collision during the Repeated Start Rate Generator count (TBRG). When the Baud Rate condition occurs if: Generator times out, if SDAx is sampled high, the SCLx • SDAx is sampled low when SCLx pin will be deasserted (brought high). When SCLx is goes from low-to-high. sampled high, the Baud Rate Generator is reloaded and begins counting. SDAx and SCLx must be sam- • SCLx goes low before SDAx is pled high for one TBRG. This action is then followed by asserted low. This may indicate assertion of the SDAx pin (SDAx=0) for one TBRG that another master is attempting to while SCLx is high. SCLx is asserted low. Following transmit a data ‘1’. this, the RSEN bit of the SSPxCON2 register will be FIGURE 21-27: REPEAT START CONDITION WAVEFORM S bit set by hardware Write to SSPxCON2 occurs here At completion of Start bit, SDAx = 1, SDAx = 1, hardware clears RSEN bit SCLx (no change) SCLx = 1 and sets SSPxIF TBRG TBRG TBRG SDAx 1st bit Write to SSPxBUF occurs here TBRG SCLx Sr TBRG Repeated Start  2011-2015 Microchip Technology Inc. DS40001607D-page 189

PIC16(L)F1503 21.6.6 I2C MASTER MODE TRANSMISSION 21.6.6.3 ACKSTAT Status Flag Transmission of a data byte, a 7-bit address or the In Transmit mode, the ACKSTAT bit of the SSPxCON2 other half of a 10-bit address is accomplished by simply register is cleared when the slave has sent an Acknowl- writing a value to the SSPxBUF register. This action will edge (ACK=0) and is set when the slave does not set the Buffer Full flag bit, BF, and allow the Baud Rate Acknowledge (ACK=1). A slave sends an Acknowl- Generator to begin counting and start the next trans- edge when it has recognized its address (including a mission. Each bit of address/data will be shifted out general call), or when the slave has properly received onto the SDAx pin after the falling edge of SCLx is its data. asserted. SCLx is held low for one Baud Rate Genera- 21.6.6.4 Typical transmit sequence: tor rollover count (TBRG). Data should be valid before SCLx is released high. When the SCLx pin is released 1. The user generates a Start condition by setting high, it is held that way for TBRG. The data on the SDAx the SEN bit of the SSPxCON2 register. pin must remain stable for that duration and some hold 2. SSPxIF is set by hardware on completion of the time after the next falling edge of SCLx. After the eighth Start. bit is shifted out (the falling edge of the eighth clock), 3. SSPxIF is cleared by software. the BF flag is cleared and the master releases SDAx. 4. The MSSPx module will wait the required start This allows the slave device being addressed to time before any other operation takes place. respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received prop- 5. The user loads the SSPxBUF with the slave erly. The status of ACK is written into the ACKSTAT bit address to transmit. on the rising edge of the ninth clock. If the master 6. Address is shifted out the SDAx pin until all eight receives an Acknowledge, the Acknowledge Status bit, bits are transmitted. Transmission begins as ACKSTAT, is cleared. If not, the bit is set. After the ninth soon as SSPxBUF is written to. clock, the SSPxIF bit is set and the master clock (Baud 7. The MSSPx module shifts in the ACK bit from Rate Generator) is suspended until the next data byte the slave device and writes its value into the is loaded into the SSPxBUF, leaving SCLx low and ACKSTAT bit of the SSPxCON2 register. SDAx unchanged (Figure21-28). 8. The MSSPx module generates an interrupt at After the write to the SSPxBUF, each bit of the address the end of the ninth clock cycle by setting the will be shifted out on the falling edge of SCLx until all SSPxIF bit. seven address bits and the R/W bit are completed. On 9. The user loads the SSPxBUF with eight bits of the falling edge of the eighth clock, the master will data. release the SDAx pin, allowing the slave to respond 10. Data is shifted out the SDAx pin until all eight with an Acknowledge. On the falling edge of the ninth bits are transmitted. clock, the master will sample the SDAx pin to see if the 11. The MSSPx module shifts in the ACK bit from address was recognized by a slave. The status of the the slave device and writes its value into the ACK bit is loaded into the ACKSTAT Status bit of the ACKSTAT bit of the SSPxCON2 register. SSPxCON2 register. Following the falling edge of the ninth clock transmission of the address, the SSPxIF is 12. Steps 8-11 are repeated for all transmitted data set, the BF flag is cleared and the Baud Rate Generator bytes. is turned off until another write to the SSPxBUF takes 13. The user generates a Stop or Restart condition place, holding SCLx low and allowing SDAx to float. by setting the PEN or RSEN bits of the SSPxCON2 register. Interrupt is generated once 21.6.6.1 BF Status Flag the Stop/Restart condition is complete. In Transmit mode, the BF bit of the SSPxSTAT register is set when the CPU writes to SSPxBUF and is cleared when all eight bits are shifted out. 21.6.6.2 WCOL Status Flag If the user writes the SSPxBUF when a transmit is already in progress (i.e., SSPxSR is still shifting out a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. DS40001607D-page 190  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-28: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) ACKSTAT in SSPxCON2 = 1 P ared by software K e C 9 Cl A > 6 2< D0 8 e N n slave, clear ACKSTAT bit SSPxCO Transmitting Data or Second Halfof 10-bit Address D6D5D4D3D2D1 234567 Cleared by software service routifrom SSP interrupt SSPxBUF is written by software om D7 1 xIF Fr ow SP CK = 0 SCLx held lwhile CPUresponds to S = 0 A W 9 are R/W A1 ess and R/ 78 d by hardw ave A2 addr 6 eare PxCON2<0> SEN = 1dition begins SEN = 0 Transmit Address to Sl A7A6A5A4A3 SSPxBUF written with 7-bit start transmit 12345 Cleared by software SSPxBUF written After Start condition, SEN cl Sn Write SStart co S T<0>) A T S x F SP SDAx SCLx SSPxI BF (S SEN PEN R/W  2011-2015 Microchip Technology Inc. DS40001607D-page 191

PIC16(L)F1503 21.6.7 I2C MASTER MODE RECEPTION 21.6.7.4 Typical Receive Sequence: Master mode reception (Figure21-29) is enabled by 1. The user generates a Start condition by setting programming the Receive Enable bit, RCEN bit of the the SEN bit of the SSPxCON2 register. SSPxCON2 register. 2. SSPxIF is set by hardware on completion of the Note: The MSSPx module must be in an Idle Start. state before the RCEN bit is set or the 3. SSPxIF is cleared by software. RCEN bit will be disregarded. 4. User writes SSPxBUF with the slave address to transmit and the R/W bit set. The Baud Rate Generator begins counting and on each rollover, the state of the SCLx pin changes 5. Address is shifted out the SDAx pin until all eight (high-to-low/low-to-high) and data is shifted into the bits are transmitted. Transmission begins as SSPxSR. After the falling edge of the eighth clock, the soon as SSPxBUF is written to. receive enable flag is automatically cleared, the con- 6. The MSSP module shifts in the ACK bit from the tents of the SSPxSR are loaded into the SSPxBUF, the slave device and writes its value into the BF flag bit is set, the SSPxIF flag bit is set and the Baud ACKSTAT bit of the SSPxCON2 register. Rate Generator is suspended from counting, holding 7. The MSSP module generates an interrupt at the SCLx low. The MSSP is now in Idle state awaiting the end of the ninth clock cycle by setting the next command. When the buffer is read by the CPU, SSPxIF bit. the BF flag bit is automatically cleared. The user can 8. User sets the RCEN bit of the SSPxCON2 regis- then send an Acknowledge bit at the end of reception ter and the master clocks in a byte from the slave. by setting the Acknowledge Sequence Enable, ACKEN 9. After the eighth falling edge of SCLx, SSPxIF bit of the SSPxCON2 register. and BF are set. 21.6.7.1 BF Status Flag 10. Master clears SSPxIF and reads the received byte from SSPxBUF, clears BF. In receive operation, the BF bit is set when an address 11. Master sets ACK value sent to slave in ACKDT or data byte is loaded into SSPxBUF from SSPxSR. It bit of the SSPxCON2 register and initiates the is cleared when the SSPxBUF register is read. ACK by setting the ACKEN bit. 21.6.7.2 SSPOV Status Flag 12. Masters ACK is clocked out to the slave and SSPxIF is set. In receive operation, the SSPOV bit is set when eight bits are received into the SSPxSR and the BF flag bit is 13. User clears SSPxIF. already set from a previous reception. 14. Steps 8-13 are repeated for each received byte from the slave. 21.6.7.3 WCOL Status Flag 15. Master sends a not ACK or Stop to end If the user writes the SSPxBUF when a receive is communication. already in progress (i.e., SSPxSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). DS40001607D-page 192  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-29: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) pt Write to SSPxCON2<4>to start Acknowledge sequenceSDAx = ACKDT (SSPxCON2<5>) = 0 Set ACKEN, start Acknowledge sequenceACK from MasterMaster configured as a receiverSDAx = ACKDT = SDAx = ACKDT = 10by programming SSPxCON2<3> (RCEN = )1PEN bit = 1RCEN = , startRCEN cleared1RCEN clearedwritten hereom Slavenext receiveautomaticallyautomatically Receiving Data from SlaveReceiving Data from SlaveACKD0D2D5D2D5D3D4D6D7D3D4D6D7D1D1ACKD0WACK Bus masterACK is not sentterminatestransfer9967895876512343124PSet SSPxIF at endData shifted in on falling edge of CLKof receiveSet SSPxIF interruat end of Acknow-Set SSPxIF interruptSet SSPxIF interruptledge sequenceat end of receiveat end of Acknowledgesequence Set P bit Cleared by softwareCleared by softwareCleared by software(SSPxSTAT<4>)Cleared insoftwareand SSPxIF Last bit is shifted into SSPxSR andcontents are unloaded into SSPxBUF SSPOV is set becauseSSPxBUF is still full Master configured as a receiverRCEN clearedACK from MasterRCEN clearedSDAx = ACKDT = automatically0by programming SSPxCON2<3> (RCEN = )automatically1 K fr R/ 8 AC A1 7 e, Write to SSPxCON2<0>(SEN = ),1begin Start condition SEN = 0Write to SSPxBUF occurs herstart XMIT Transmit Address to Slave A7A6A5A4A3A2SDAx 631245SCLxS SSPxIF Cleared by softwareSDAx = , SCLx = 01while CPU responds to SSPxIF BF (SSPxSTAT<0>) SSPOV ACKEN RCEN  2011-2015 Microchip Technology Inc. DS40001607D-page 193

PIC16(L)F1503 21.6.8 ACKNOWLEDGE SEQUENCE 21.6.9 STOP CONDITION TIMING TIMING A Stop bit is asserted on the SDAx pin at the end of a An Acknowledge sequence is enabled by setting the receive/transmit by setting the Stop Sequence Enable Acknowledge Sequence Enable bit, ACKEN bit of the bit, PEN bit of the SSPxCON2 register. At the end of a SSPxCON2 register. When this bit is set, the SCLx pin is receive/transmit, the SCLx line is held low after the pulled low and the contents of the Acknowledge data bit falling edge of the ninth clock. When the PEN bit is set, are presented on the SDAx pin. If the user wishes to the master will assert the SDAx line low. When the generate an Acknowledge, then the ACKDT bit should SDAx line is sampled low, the Baud Rate Generator is be cleared. If not, the user should set the ACKDT bit reloaded and counts down to ‘0’. When the Baud Rate before starting an Acknowledge sequence. The Baud Generator times out, the SCLx pin will be brought high Rate Generator then counts for one rollover period and one TBRG (Baud Rate Generator rollover count) (TBRG) and the SCLx pin is deasserted (pulled high). later, the SDAx pin will be deasserted. When the SDAx When the SCLx pin is sampled high (clock arbitration), pin is sampled high while SCLx is high, the P bit of the the Baud Rate Generator counts for TBRG. The SCLx pin SSPxSTAT register is set. A TBRG later, the PEN bit is is then pulled low. Following this, the ACKEN bit is auto- cleared and the SSPxIF bit is set (Figure21-31). matically cleared, the Baud Rate Generator is turned off 21.6.9.1 WCOL Status Flag and the MSSP module then goes into Idle mode (Figure21-30). If the user writes the SSPxBUF when a Stop sequence is in progress, then the WCOL bit is set and the 21.6.8.1 WCOL Status Flag contents of the buffer are unchanged (the write does If the user writes the SSPxBUF when an Acknowledge not occur). sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 21-30: ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, ACKEN automatically cleared write to SSPxCON2 ACKEN = 1, ACKDT = 0 TBRG TBRG SDAx D0 ACK SCLx 8 9 SSPxIF Cleared in SSPxIF set at Cleared in software the end of receive software SSPxIF set at the end of Acknowledge sequence Note: TBRG = one Baud Rate Generator period. DS40001607D-page 194  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 21-31: STOP CONDITION RECEIVE OR TRANSMIT MODE Write to SSPxCON2, SCLx = 1 for TBRG, followed by SDAx = 1 for TBRG set PEN after SDAx sampled high. P bit (SSPxSTAT<4>) is set. Falling edge of PEN bit (SSPxCON2<2>) is cleared by 9th clock hardware and the SSPxIF bit is set TBRG SCLx SDAx ACK P TBRG TBRG TBRG SCLx brought high after TBRG SDAx asserted low before rising edge of clock to setup Stop condition Note: TBRG = one Baud Rate Generator period. 21.6.10 SLEEP OPERATION 21.6.13 MULTI -MASTER COMMUNICATION, While in Sleep mode, the I2C slave module can receive BUS COLLISION AND BUS ARBITRATION addresses or data and when an address match or complete byte transfer occurs, wake the processor Multi-Master mode support is achieved by bus arbitra- from Sleep (if the MSSP interrupt is enabled). tion. When the master outputs address/data bits onto the SDAx pin, arbitration takes place when the master 21.6.11 EFFECTS OF A RESET outputs a ‘1’ on SDAx, by letting SDAx float high and A Reset disables the MSSP module and terminates the another master asserts a ‘0’. When the SCLx pin floats current transfer. high, data should be stable. If the expected data on SDAx is a ‘1’ and the data sampled on the SDAx pin is 21.6.12 MULTI-MASTER MODE ‘0’, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLxIF and reset In Multi-Master mode, the interrupt generation on the the I2C port to its Idle state (Figure21-32). detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and If a transmit was in progress when the bus collision Start (S) bits are cleared from a Reset or when the occurred, the transmission is halted, the BF flag is MSSP module is disabled. Control of the I2C bus may cleared, the SDAx and SCLx lines are deasserted and be taken when the P bit of the SSPxSTAT register is the SSPxBUF can be written to. When the user ser- set, or the bus is idle, with both the S and P bits clear. vices the bus collision Interrupt Service Routine and if When the bus is busy, enabling the SSP interrupt will the I2C bus is free, the user can resume communica- generate the interrupt when the Stop condition occurs. tion by asserting a Start condition. In Multi-Master mode, the SDAx line must be monitored If a Start, Repeated Start, Stop or Acknowledge condi- for arbitration to see if the signal level is the expected tion was in progress when the bus collision occurred, the output level. This check is performed by hardware with condition is aborted, the SDAx and SCLx lines are deas- the result placed in the BCLxIF bit. serted and the respective control bits in the SSPxCON2 register are cleared. When the user services the bus col- The states where arbitration can be lost are: lision Interrupt Service Routine and if the I2C bus is free, • Address Transfer the user can resume communication by asserting a Start • Data Transfer condition. • A Start Condition The master will continue to monitor the SDAx and SCLx • A Repeated Start Condition pins. If a Stop condition occurs, the SSPxIF bit will be set. • An Acknowledge Condition A write to the SSPxBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the deter- mination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPxSTAT register, or the bus is idle and the S and P bits are cleared.  2011-2015 Microchip Technology Inc. DS40001607D-page 195

PIC16(L)F1503 FIGURE 21-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Sample SDAx. While SCLx is high, Data changes SDAx line pulled low data does not match what is driven while SCLx = 0 by another source by the master. Bus collision has occurred. SDAx released by master SDAx SCLx Set bus collision interrupt (BCLxIF) BCLxIF DS40001607D-page 196  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.6.13.1 Bus Collision During a Start If the SDAx pin is sampled low during this count, the Condition BRG is reset and the SDAx line is asserted early (Figure21-35). If, however, a ‘1’ is sampled on the SDA During a Start condition, a bus collision occurs if: pin, the SDA pin is asserted low at the end of the BRG a) SDA or SCL are sampled low at the beginning of count. The Baud Rate Generator is then reloaded and the Start condition (Figure21-33). counts down to zero; if the SCL pin is sampled as ‘0’ b) SCL is sampled low before SDAx is asserted during this time, a bus collision does not occur. At the low (Figure21-34). end of the BRG count, the SCL pin is asserted low. During a Start condition, both the SDAx and the SCL Note: The reason that bus collision is not a fac- pins are monitored. tor during a Start condition is that no two bus masters can assert a Start condition If the SDA pin is already low, or the SCL pin is already at the exact same time. Therefore, one low, then all of the following occur: master will always assert SDAx before the • the Start condition is aborted, other. This condition does not cause a bus • the BCL1IF flag is set and collision because the two masters must be • the MSSP module is reset to its Idle state allowed to arbitrate the first address fol- (Figure21-33). lowing the Start condition. If the address is The Start condition begins with the SDAx and SCLx the same, arbitration must be allowed to pins deasserted. When the SDAx pin is sampled high, continue into the data portion, Repeated the Baud Rate Generator is loaded and counts down. If Start or Stop conditions. the SCLx pin is sampled low while SDAx is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. FIGURE 21-33: BUS COLLISION DURING START CONDITION (SDAX ONLY) SDAx goes low before the SEN bit is set. Set BCLxIF, S bit and SSPxIF set because SDAx = 0, SCLx = 1. SDAx SCLx Set SEN, enable Start SEN cleared automatically because of bus collision. condition if SDAx = 1, SCLx = 1 SSP module reset into Idle state. SEN SDAx sampled low before Start condition. Set BCLxIF. S bit and SSPxIF set because BCLxIF SDAx = 0, SCLx = 1. SSPxIF and BCLxIF are cleared by software S SSPxIF SSPxIF and BCLxIF are cleared by software  2011-2015 Microchip Technology Inc. DS40001607D-page 197

PIC16(L)F1503 FIGURE 21-34: BUS COLLISION DURING START CONDITION (SCLX=0) SDAx = 0, SCLx = 1 TBRG TBRG SDAx Set SEN, enable Start SCLx sequence if SDAx = 1, SCLx = 1 SCLx = 0 before SDAx = 0, bus collision occurs. Set BCLxIF. SEN SCLx = 0 before BRG time-out, bus collision occurs. Set BCLxIF. BCLxIF Interrupt cleared by software S ‘0’ ‘0’ SSPxIF ‘0’ ‘0’ FIGURE 21-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDAx = 0, SCLx = 1 Set S Set SSPxIF Less than TBRG TBRG SDAx SDAx pulled low by other master. Reset BRG and assert SDAx. SCLx S SCLx pulled low after BRG time-out SEN Set SEN, enable Start sequence if SDAx = 1, SCLx = 1 BCLxIF ‘0’ S SSPxIF SDAx = 0, SCLx = 1, Interrupts cleared set SSPxIF by software DS40001607D-page 198  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.6.13.2 Bus Collision During a Repeated If SDAx is low, a bus collision has occurred (i.e., another Start Condition master is attempting to transmit a data ‘0’, Figure21-36). If SDAx is sampled high, the BRG is reloaded and During a Repeated Start condition, a bus collision begins counting. If SDAx goes from high-to-low before occurs if: the BRG times out, no bus collision occurs because no a) A low level is sampled on SDAx when SCLx two masters can assert SDAx at exactly the same time. goes from low level to high level (Case 1). If SCLx goes from high-to-low before the BRG times b) SCLx goes low before SDAx is asserted low, out and SDAx has not already been asserted, a bus indicating that another master is attempting to collision occurs. In this case, another master is transmit a data ‘1’ (Case 2). attempting to transmit a data ‘1’ during the Repeated When the user releases SDAx and the pin is allowed to Start condition, see Figure21-37. float high, the BRG is loaded with SSPxADD and If, at the end of the BRG time-out, both SCLx and SDAx counts down to zero. The SCLx pin is then deasserted are still high, the SDAx pin is driven low and the BRG and when sampled high, the SDAx pin is sampled. is reloaded and begins counting. At the end of the count, regardless of the status of the SCLx pin, the SCLx pin is driven low and the Repeated Start condition is complete. FIGURE 21-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDAx SCLx Sample SDAx when SCLx goes high. If SDAx = 0, set BCLxIF and release SDAx and SCLx. RSEN BCLxIF Cleared by software S ‘0’ SSPxIF ‘0’ FIGURE 21-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) TBRG TBRG SDAx SCLx SCLx goes low before SDAx, BCLxIF set BCLxIF. Release SDAx and SCLx. Interrupt cleared by software RSEN ‘0’ S SSPxIF  2011-2015 Microchip Technology Inc. DS40001607D-page 199

PIC16(L)F1503 21.6.13.3 Bus Collision During a Stop The Stop condition begins with SDAx asserted low. Condition When SDAx is sampled low, the SCLx pin is allowed to float. When the pin is sampled high (clock arbitration), Bus collision occurs during a Stop condition if: the Baud Rate Generator is loaded with SSPxADD and a) After the SDAx pin has been deasserted and counts down to 0. After the BRG times out, SDAx is allowed to float high, SDAx is sampled low after sampled. If SDAx is sampled low, a bus collision has the BRG has timed out (Case 1). occurred. This is due to another master attempting to b) After the SCLx pin is deasserted, SCLx is drive a data ‘0’ (Figure21-38). If the SCLx pin is sampled low before SDAx goes high (Case 2). sampled low before SDAx is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure21-39). FIGURE 21-38: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG TBRG SDAx sampled low after TBRG, set BCLxIF SDAx SDAx asserted low SCLx PEN BCLxIF P ‘0’ SSPxIF ‘0’ FIGURE 21-39: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG TBRG TBRG SDAx SCLx goes low before SDAx goes high, Assert SDAx set BCLxIF SCLx PEN BCLxIF P ‘0’ SSPxIF ‘0’ DS40001607D-page 200  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 21-3: SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ OPERATION Reset Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Values on Page: INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE1 TMR1GIE ADIE — — SSP1IE — TMR2IE TMR1IE 65 PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 66 PIR1 TMR1GIF ADIF — — SSP1IF — TMR2IF TMR1IF 68 PIR2 — C2IF C1IF — BCL1IF NCO1IF — — 69 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 SSP1ADD ADD<7:0> 207 SSP1BUF MSSP Receive Buffer/Transmit Register 158* SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 204 SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 205 SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 206 SSP1MSK MSK<7:0> 207 SSP1STAT SMP CKE D/A P S R/W UA BF 203 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C™ mode. * Page provides register information. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 201

PIC16(L)F1503 21.7 BAUD RATE GENERATOR module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is The MSSP module has a Baud Rate Generator avail- being operated in. able for clock generation in both I2C and SPI Master Table21-4 demonstrates clock rates based on modes. The Baud Rate Generator (BRG) reload value instruction cycles and the BRG value loaded into is placed in the SSPxADD register (Register21-6). SSPxADD. When a write occurs to SSPxBUF, the Baud Rate Gen- erator will automatically begin counting down. EQUATION 21-1: Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will FOSC remain in its last state. FCLOCK = ------------------------------------------------- SSPxADD+14 An internal signal “Reload” in Figure21-40 triggers the value from SSPxADD to be loaded into the BRG counter. This occurs twice for each oscillation of the FIGURE 21-40: BAUD RATE GENERATOR BLOCK DIAGRAM Rev.10-000112A 7/30/2013 4 SSPM<3:0> SSPxADD<7:0> 8 4 SSPM<3:0> Reload SCLx Control Reload 8 FOSC/2 BRGDownCounter SSPxCLK Note: Values of 0x00, 0x01 and 0x02 are not valid for SSPxADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 21-4: MSSP CLOCK RATE W/BRG FCLOCK FOSC FCY BRG Value (Two Rollovers of BRG) 16 MHz 4 MHz 09h 400 kHz 16 MHz 4 MHz 0Ch 308 kHz 16 MHz 4 MHz 27h 100 kHz 4 MHz 1 MHz 09h 100 kHz Note: Refer to the I/O port electrical and timing specifications in Table28-9 and Figure28-7 to ensure the system is designed to support the I/O timing requirements. DS40001607D-page 202  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 21.8 Register Definitions: MSSP Control REGISTER 21-1: SSPxSTAT: SSP STATUS REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SMP: SPI Data Input Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode In I 2 C Master or Slave mode: 1 = Slew rate control disabled 0 = Slew rate control enabled bit 6 CKE: SPI Clock Edge Select bit (SPI mode only) In SPI Master or Slave mode: 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state In I 2 C™ mode only: 1 = Enable input logic so that thresholds are compliant with SMBus specification 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit (I2C mode only) 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information (I2C mode only) This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I 2 C Slave mode: 1 = Read 0 = Write In I 2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPxADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit Receive (SPI and I 2 C modes): 1 = Receive complete, SSPxBUF is full 0 = Receive not complete, SSPxBUF is empty Transmit (I 2 C mode only): 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPxBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPxBUF is empty  2011-2015 Microchip Technology Inc. DS40001607D-page 203

PIC16(L)F1503 REGISTER 21-2: SSPxCON1: SSP CONTROL REGISTER 1 R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 WCOL SSPOV(1) SSPEN CKP SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPxBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPxBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) In SPI mode: 1 = A new byte is received while the SSPxBUF register is still holding the previous data. In case of overflow, the data in SSPxSR is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPxBUF, even if only transmitting data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPxBUF register (must be cleared in software). 0 = No overflow In I 2 C mode: 1 = A byte is received while the SSPxBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output In SPI mode: 1 = Enables serial port and configures SCKx, SDOx, SDIx and SSx as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins In I 2 C mode: 1 = Enables the serial port and configures the SDAx and SCLx pins as the source of the serial port pins(3) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In SPI mode: 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level In I 2 C Slave mode: SCLx release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I 2 C Master mode: Unused in this mode bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = SPI Master mode, clock = FOSC/4 0001 = SPI Master mode, clock = FOSC/16 0010 = SPI Master mode, clock = FOSC/64 0011 = SPI Master mode, clock = T2_match/2 0100 = SPI Slave mode, clock = SCKx pin, SS pin control enabled 0101 = SPI Slave mode, clock = SCKx pin, SS pin control disabled, SSx can be used as I/O pin 0110 = I2C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2C Master mode, clock = FOSC/(4 * (SSPxADD+1))(4) 1001 = Reserved 1010 = SPI Master mode, clock = FOSC/(4 * (SSPxADD+1))(5) 1011 = I2C firmware controlled Master mode (Slave idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPxBUF register. 2: When enabled, these pins must be properly configured as input or output. 3: When enabled, the SDAx and SCLx pins must be configured as inputs. 4: SSPxADD values of 0, 1 or 2 are not supported for I2C mode. 5: SSPxADD value of ‘0’ is not supported. Use SSPM = 0000 instead. DS40001607D-page 204  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 21-3: SSPxCON2: SSP CONTROL REGISTER 2(1) R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPxSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDAx and SCLx pins, and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only) 1 = Enables Receive mode for I2C 0 = Receive idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only) SCKx Release Control: 1 = Initiate Stop condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Stop condition idle bit 1 RSEN: Repeated Start Condition Enable bit (in I2C Master mode only) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Repeated Start condition idle bit 0 SEN: Start Condition Enable/Stretch Enable bit In Master mode: 1 = Initiate Start condition on SDAx and SCLx pins. Automatically cleared by hardware. 0 = Start condition idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPxBUF may not be written (or writes to the SSPxBUF are disabled).  2011-2015 Microchip Technology Inc. DS40001607D-page 205

PIC16(L)F1503 REGISTER 21-4: SSPxCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM(3) PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ACKTIM: Acknowledge Time Status bit (I2C mode only)(3) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on eighth falling edge of SCLx clock 0 = Not an Acknowledge sequence, cleared on ninth rising edge of SCLx clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(2) bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(2) bit 4 BOEN: Buffer Overwrite Enable bit In SPI Slave mode:(1) 1 = SSPxBUF updates every time that a new data byte is shifted in ignoring the BF bit 0 = If new byte is received with BF bit of the SSPxSTAT register already set, SSPOV bit of the SSPxCON1 register is set, and the buffer is not updated In I2C Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPxBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPxBUF is only updated when SSPOV is clear bit 3 SDAHT: SDAx Hold Time Selection bit (I2C mode only) 1 = Minimum of 300ns hold time on SDAx after the falling edge of SCLx 0 = Minimum of 100ns hold time on SDAx after the falling edge of SCLx bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If on the rising edge of SCLx, SDAx is sampled low when the module is outputting a high state, the BCLxIF bit of the PIR2 register is set, and bus goes idle 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the eighth falling edge of SCLx for a matching received address byte, CKP bit of the SSPxCON1 register will be cleared and the SCLx will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the eighth falling edge of SCLx for a received data byte, slave hardware clears the CKP bit of the SSPxCON1 register and SCLx is held low. 0 = Data holding is disabled Note 1: For daisy-chained SPI operation, allows the user to ignore all but the last received byte. SSPOV is still set when a new byte is received and BF=1, but hardware continues to write the most recent byte to SSPxBUF. 2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled. 3: The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set. DS40001607D-page 206  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 21-5: SSPxMSK: SSP MASK REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPxADD<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPxADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 21-6: SSPxADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2C MODE) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCLx pin clock period = ((ADD<7:0> + 1) *4)/FOSC 10-Bit Slave mode – Most Significant Address Byte: bit 7-3 Not used: Unused for Most Significant Address Byte. Bit state of this register is a “don’t care”. Bit pat- tern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode – Least Significant Address Byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”.  2011-2015 Microchip Technology Inc. DS40001607D-page 207

PIC16(L)F1503 22.0 PULSE-WIDTH MODULATION Figure22-1 shows a simplified block diagram of PWM (PWM) MODULE operation. For a step-by-step procedure on how to set up this The PWM module generates a Pulse-Width Modulated module for PWM operation, refer to Section signal determined by the duty cycle, period, and reso- 22.1.9“Setup for PWM Operation using PWMx lution that are configured by the following registers: Pins”. • PR2 • T2CON • PWMxDCH • PWMxDCL • PWMxCON FIGURE 22-1: SIMPLIFIED PWM BLOCK DIAGRAM Rev. 10-000022A 8/5/2013 Duty cycle registers PWMxDCL<7:6> PWMxDCH PWMx_out To Peripherals 10-bit Latch (Not visible to user) PWMxOE Comparator R Q 0 PWMx 1 S Q TMR2 Module TRIS Control TMR2 R (1) PWMxPOL Comparator T2_match PR2 Note 1: 8-bit timer is concatenated with two bits generated by Fosc or two bits of the internal prescaler to create 10-bit time-base. DS40001607D-page 208  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 22.1 PWMx Pin Configuration When TMR2 is equal to PR2, the following three events occur on the next increment cycle: All PWM outputs are multiplexed with the PORT data • TMR2 is cleared latch. The user must configure the pins as outputs by clearing the associated TRIS bits. • The PWM output is active. (Exception: When the PWM duty cycle=0%, the PWM output will Note: Clearing the PWMxOE bit will relinquish remain inactive.) control of the PWMx pin. • The PWMxDCH and PWMxDCL register values are latched into the buffers. 22.1.1 FUNDAMENTAL OPERATION Note: The Timer2 postscaler has no effect on The PWM module produces a 10-bit resolution output. the PWM operation. Timer2 and PR2 set the period of the PWM. The PWMxDCL and PWMxDCH registers configure the 22.1.4 PWM DUTY CYCLE duty cycle. The period is common to all PWM modules, whereas the duty cycle is independently controlled. The PWM duty cycle is specified by writing a 10-bit value to the PWMxDCH and PWMxDCL register pair. Note: The Timer2 postscaler is not used in the The PWMxDCH register contains the eight MSbs and determination of the PWM frequency. The the PWMxDCL<7:6>, the two LSbs. The PWMxDCH postscaler could be used to have a servo and PWMxDCL registers can be written to at any time. update rate at a different frequency than the PWM output. Equation22-2 is used to calculate the PWM pulse width. Equation22-3 is used to calculate the PWM duty cycle All PWM outputs associated with Timer2 are set when ratio. TMR2 is cleared. Each PWMx is cleared when TMR2 is equal to the value specified in the corresponding EQUATION 22-2: PULSE WIDTH PWMxDCH (8MSb) and PWMxDCL<7:6> (2LSb) reg- isters. When the value is greater than or equal to PR2, the PWM output is never cleared (100% duty cycle). Pulse Width = PWMxDCH:PWMxDCL<7:6>  Note: The PWMxDCH and PWMxDCL registers TOSC  (TMR2 Prescale Value) are double buffered. The buffers are updated when Timer2 matches PR2. Care Note: TOSC = 1/FOSC should be taken to update both registers before the timer match occurs. EQUATION 22-3: DUTY CYCLE RATIO 22.1.2 PWM OUTPUT POLARITY PWMxDCH:PWMxDCL<7:6> The output polarity is inverted by setting the PWMxPOL Duty Cycle Ratio = ----------------------------------------------------------------------------------- 4PR2+1 bit of the PWMxCON register. 22.1.3 PWM PERIOD The 8-bit timer TMR2 register is concatenated with the The PWM period is specified by the PR2 register of two Least Significant bits of 1/FOSC, adjusted by the Timer2. The PWM period can be calculated using the Timer2 prescaler to create the 10-bit time base. The formula of Equation22-1. system clock is used if the Timer2 prescaler is set to 1:1. Figure22-2 shows a waveform of the PWM signal when EQUATION 22-1: PWM PERIOD the duty cycle is set for the smallest possible pulse. PWM Period = PR2+14TOSC FIGURE 22-2: PWM OUTPUT (TMR2 Prescale Value) Q1 Q2 Q3 Q4 Rev.10-000023A 7/30/2013 Note: TOSC = 1/FOSC FOSC PulseWidth PWM TMR2=0 TMR2=PWMxDC TMR2=PR2  2011-2015 Microchip Technology Inc. DS40001607D-page 209

PIC16(L)F1503 22.1.5 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolu- tion will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is ten bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation22-4. EQUATION 22-4: PWM RESOLUTION log4PR2+1 Resolution = ------------------------------------------ bits log2 Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. TABLE 22-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency 0.31 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescale 64 4 1 1 1 1 PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 TABLE 22-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency 0.31 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz Timer Prescale 64 4 1 1 1 1 PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09 Maximum Resolution (bits) 8 8 8 6 5 5 22.1.6 OPERATION IN SLEEP MODE In Sleep mode, the TMR2register will not increment and the state of the module will not change. If the PWMx pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 22.1.7 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency (FOSC). Any changes in the system clock frequency will result in changes to the PWM frequency. Refer to Section 5.0“Oscillator Module” for additional details. 22.1.8 EFFECTS OF RESET Any Reset will force all ports to Input mode and the PWM registers to their Reset states. DS40001607D-page 210  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 22.1.9 SETUP FOR PWM OPERATION USING PWMx PINS The following steps should be taken when configuring the module for PWM operation using the PWMx pins: 1. Disable the PWMx pin output driver(s) by setting the associated TRIS bit(s). 2. Clear the PWMxCON register. 3. Load the PR2 register with the PWM period value. 4. Clear the PWMxDCH register and bits <7:6> of the PWMxDCL register. 5. Configure and start Timer2: • Clear the TMR2IF interrupt flag bit of the PIR1 register. See note below. • Configure the T2CKPS bits of the T2CON register with the Timer2 prescale value. • Enable Timer2 by setting the TMR2ON bit of the T2CON register. 6. Enable PWM output pin and wait until Timer2 overflows, TMR2IF bit of the PIR1 register is set. See note below. 7. Enable the PWMx pin output driver(s) by clear- ing the associated TRIS bit(s) and setting the PWMxOE bit of the PWMxCON register. 8. Configure the PWM module by loading the PWMxCON register with the appropriate values. Note1: In order to send a complete duty cycle and period on the first PWM output, the above steps must be followed in the order given. If it is not critical to start with a complete PWM signal, then move Step 8 to replace Step 4. 2: For operation with other peripherals only, disable PWMx pin outputs.  2011-2015 Microchip Technology Inc. DS40001607D-page 211

PIC16(L)F1503 22.2 Register Definitions: PWM Control REGISTER 22-1: PWMxCON: PWM CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 U-0 PWMxEN PWMxOE PWMxOUT PWMxPOL — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PWMxEN: PWM Module Enable bit 1 = PWM module is enabled 0 = PWM module is disabled bit 6 PWMxOE: PWM Module Output Enable bit 1 = Output to PWMx pin is enabled 0 = Output to PWMx pin is disabled bit 5 PWMxOUT: PWM Module Output Value bit bit 4 PWMxPOL: PWMx Output Polarity Select bit 1 = PWM output is active-low 0 = PWM output is active-high bit 3-0 Unimplemented: Read as ‘0’ DS40001607D-page 212  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 22-2: PWMxDCH: PWM DUTY CYCLE HIGH BITS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PWMxDCH<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits These bits are the MSbs of the PWM duty cycle. The two LSbs are found in the PWMxDCL register. REGISTER 22-3: PWMxDCL: PWM DUTY CYCLE LOW BITS R/W-x/u R/W-x/u U-0 U-0 U-0 U-0 U-0 U-0 PWMxDCL<7:6> — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits These bits are the LSbs of the PWM duty cycle. The MSbs are found in the PWMxDCH register. bit 5-0 Unimplemented: Read as ‘0’ TABLE 22-3: SUMMARY OF REGISTERS ASSOCIATED WITH PWM Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page PR2 Timer2 module Period Register 151* PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 212 PWM1DCH PWM1DCH<7:0> 213 PWM1DCL PWM1DCL<7:6> — — — — — — 213 PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 212 PWM2DCH PWM2DCH<7:0> 213 PWM2DCL PWM2DCL<7:6> — — — — — — 213 PWM3CON PWM3EN PWM3OE PWM3OUT PWM3POL — — — — 212 PWM3DCH PWM3DCH<7:0> 213 PWM3DCL PWM3DCL<7:6> — — — — — — 213 PWM4CON PWM4EN PWM4OE PWM4OUT PWM4POL — — — — 212 PWM4DCH PWM4DCH<7:0> 213 PWM4DCL PWM4DCL<7:6> — — — — — — 213 T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 153 TMR2 Timer2 module Register 151* TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM. * Page provides register information. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 213

PIC16(L)F1503 23.0 CONFIGURABLE LOGIC CELL Refer to Figure23-1 for a simplified diagram showing (CLC) signal flow through the CLCx. Possible configurations include: The Configurable Logic Cell (CLCx) provides program- • Combinatorial Logic mable logic that operates outside the speed limitations of software execution. The logic cell takes up to 16 - AND input signals, and through the use of configurable - NAND gates, reduces the 16 inputs to four logic lines that drive - AND-OR one of eight selectable single-output logic functions. - AND-OR-INVERT Input sources are a combination of the following: - OR-XOR • I/O pins - OR-XNOR • Internal clocks • Latches • Peripherals - S-R • Register bits - Clocked D with Set and Reset The output can be directed internally to peripherals and - Transparent D with Set and Reset to an output pin. - Clocked J-K with Reset FIGURE 23-1: CONFIGURABLE LOGIC CELL BLOCK DIAGRAM Rev. 10-000025A 8/1/2013 LCxOUT D Q MLCxOUT Q1 LCx_in[0] LCx_in[1] to Peripherals LCx_in[2] LCx_in[3] (1)s LCx_in[4] ate LCxEN LCxOE LLLCCCxxx___iiinnn[[[567]]] ction G llccxxgg21 Logic lcxq LCx_out TRIS Control LCx_in[8] Sele lcxg3 Fun(c2)tion CLCx LCx_in[9] a lcxg4 LCx_in[10] at D LCxPOL LCx_in[11] ut LCx_in[12] p n LCxMODE<2:0> Interrupt LCx_in[13] I LCx_in[14] det LCx_in[15] LCXINTP set bit LCXINTN CLCxIF Interrupt det Note 1: See Figure23-2. 2: See Figure23-3. DS40001607D-page 214  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 23.1 CLCx Setup each case, paired with a different group. This arrange- ment makes possible selection of up to two from a Programming the CLCx module is performed by config- group without precluding a selection from another uring the four stages in the logic signal flow. The four group. stages are: Data selection is through four multiplexers as indicated • Data selection on the left side of Figure23-2. Data inputs in the figure • Data gating are identified by a generic numbered input name. • Logic function selection Table23-1 correlates the generic input name to the • Output polarity actual signal for each CLC module. The columns labeled Each stage is setup at run time by writing to the corre- lcxd1 through lcxd4 indicate the MUX output for the sponding CLCx Special Function Registers. This has selected data input. D1S through D4S are abbreviations the added advantage of permitting logic reconfiguration for the MUX select input codes: LCxD1S<2:0> through on-the-fly during program execution. LCxD4S<2:0>, respectively. Selecting a data input in a column excludes all other inputs in that column. 23.1.1 DATA SELECTION Data inputs are selected with CLCxSEL0 and There are 16 signals available as inputs to the configu- CLCxSEL1 registers (Register23-3 and Register23-5, rable logic. Four 8-input multiplexers are used to select respectively). the inputs to pass on to the next stage. The 16 inputs to Note: Data selections are undefined at power-up. the multiplexers are arranged in groups of four. Each group is available to two of the four multiplexers, in TABLE 23-1: CLCx DATA INPUT SELECTION lcxd1 lcxd2 lcxd3 lcxd4 Data Input CLC 1 CLC 2 D1S D2S D3S D4S LCx_in[0] 000 — — 100 CLC1IN0 CLC2IN0 LCx_in[1] 001 — — 101 CLC1IN1 CLC2IN1 LCx_in[2] 010 — — 110 C1OUT_sync C1OUT_sync LCx_in[3] 011 — — 111 C2OUT_sync C2OUT_sync LCx_in[4] 100 000 — — FOSC FOSC LCx_in[5] 101 001 — — T0_overflow T0_overflow LCx_in[6] 110 010 — — T1_overflow T1_overflow LCx_in[7] 111 011 — — T2_match T2_match LCx_in[8] — 100 000 — LC1_out LC1_out LCx_in[9] — 101 001 — LC2_out LC2_out LCx_in[10] — 110 010 — Reserved Reserved LCx_in[11] — 111 011 — Reserved Reserved LCx_in[12] — — 100 000 NCO1_out LFINTOSC LCx_in[13] — — 101 001 HFINTOSC FRC LCx_in[14] — — 110 010 PWM3_out PWM1_out LCx_in[15] — — 111 011 PWM4_out PWM2_out  2011-2015 Microchip Technology Inc. DS40001607D-page 215

PIC16(L)F1503 23.1.2 DATA GATING Data gating is indicated in the right side of Figure23-2. Only one gate is shown in detail. The remaining three Outputs from the input multiplexers are directed to the gates are configured identically with the exception that desired logic function input through the data gating the data enables correspond to the enables for that stage. Each data gate can direct any combination of the gate. four selected inputs. Note: Data gating is undefined at power-up. 23.1.3 LOGIC FUNCTION The gate stage is more than just signal direction. The There are eight available logic functions including: gate can be configured to direct each input signal as • AND-OR inverted or non-inverted data. Directed signals are • OR-XOR ANDed together in each gate. The output of each gate • AND can be inverted before going on to the logic function • S-R Latch stage. • D Flip-Flop with Set and Reset The gating is in essence a 1-to-4 input • D Flip-Flop with Reset AND/NAND/OR/NOR gate. When every input is inverted and the output is inverted, the gate is an OR of • J-K Flip-Flop with Reset all enabled data inputs. When the inputs and output are • Transparent Latch with Set and Reset not inverted, the gate is an AND or all enabled inputs. Logic functions are shown in Figure23-3. Each logic Table23-2 summarizes the basic logic that can be function has four inputs and one output. The four inputs are the four data gate outputs of the previous stage. obtained in gate 1 by using the gate logic select bits. The output is fed to the inversion stage and from there The table shows the logic of four input variables, but to other peripherals, an output pin, and back to the each gate can be configured to use less than four. If CLCx itself. no inputs are selected, the output will be zero or one, depending on the gate output polarity bit. 23.1.4 OUTPUT POLARITY TABLE 23-2: DATA GATING LOGIC The last stage in the configurable logic cell is the output polarity. Setting the LCxPOL bit of the CLCxCON reg- CLCxGLS0 LCxG1POL Gate Logic ister inverts the output signal from the logic stage. Changing the polarity while the interrupts are enabled 0x55 1 AND will cause an interrupt for the resulting output transition. 0x55 0 NAND 0xAA 1 NOR 0xAA 0 OR 0x00 0 Logic 0 0x00 1 Logic 1 It is possible (but not recommended) to select both the true and negated values of an input. When this is done, the gate output is zero, regardless of the other inputs, but may emit logic glitches (transient-induced pulses). If the output of the channel must be zero or one, the recommended method is to set all gate bits to zero and use the gate polarity bit to set the desired level. Data gating is configured with the logic gate select registers as follows: • Gate 1: CLCxGLS0 (Register23-5) • Gate 2: CLCxGLS1 (Register23-6) • Gate 3: CLCxGLS2 (Register23-7) • Gate 4: CLCxGLS3 (Register23-8) Register number suffixes are different than the gate numbers because other variations of this module have multiple gate selections in the same register. DS40001607D-page 216  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 23.1.5 CLCx SETUP STEPS 23.2 CLCx Interrupts The following steps should be followed when setting up An interrupt will be generated upon a change in the the CLCx: output value of the CLCx when the appropriate interrupt • Disable CLCx by clearing the LCxEN bit. enables are set. A rising edge detector and a falling • Select desired inputs using CLCxSEL0 and edge detector are present in each CLC for this purpose. CLCxSEL1 registers (See Table23-3). The CLCxIF bit of the associated PIR registers will be • Clear any associated ANSEL bits. set when either edge detector is triggered and its asso- • Set all TRIS bits associated with inputs. ciated enable bit is set. The LCxINTP enables rising • Clear all TRIS bits associated with outputs. edge interrupts and the LCxINTN bit enables falling edge interrupts. Both are located in the CLCxCON • Enable the chosen inputs through the four gates register. using CLCxGLS0, CLCxGLS1, CLCxGLS2, and CLCxGLS3 registers. To fully enable the interrupt, set the following bits: • Select the gate output polarities with the • LCxON bit of the CLCxCON register LCxPOLy bits of the CLCxPOL register. • CLCxIE bit of the associated PIE registers • Select the desired logic function with the • LCxINTP bit of the CLCxCON register (for a rising LCxMODE<2:0> bits of the CLCxCON register. edge detection) • Select the desired polarity of the logic output with • LCxINTN bit of the CLCxCON register (for a the LCxPOL bit of the CLCxPOL register. (This falling edge detection) step may be combined with the previous gate • PEIE and GIE bits of the INTCON register output polarity step). The CLCxIF bit of the associated PIR registers, must • If driving a device, set the LCxOE bit in the be cleared in software as part of the interrupt service. If CLCxCON register and also clear the TRIS bit another edge is detected while this flag is being corresponding to that output. cleared, the flag will still be set at the end of the • If interrupts are desired, configure the following sequence. bits: - Set the LCxINTP bit in the CLCxCON register 23.3 Output Mirror Copies for rising event. - Set the LCxINTN bit in the CLCxCON Mirror copies of all LCxCON output bits are contained register or falling event. in the CLCxDATA register. Reading this register reads - Set the CLCxIE bit of the associated PIE the outputs of all CLCs simultaneously. This prevents registers. any reading skew introduced by testing or reading the CLCxOUT bits in the individual CLCxCON registers. - Set the GIE and PEIE bits of the INTCON register. 23.4 Effects of a Reset • Enable the CLCx by setting the LCxEN bit of the CLCxCON register. The CLCxCON register is cleared to zero as the result of a Reset. All other selection and gating values remain unchanged. 23.5 Operation During Sleep The CLC module operates independently from the system clock and will continue to run during Sleep, provided that the input sources selected remain active. The HFINTOSC remains active during Sleep when the CLC module is enabled and the HFINTOSC is selected as an input source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and as a CLC input source, when the CLC is enabled, the CPU will go idle during Sleep, but the CLC will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current.  2011-2015 Microchip Technology Inc. DS40001607D-page 217

PIC16(L)F1503 FIGURE 23-2: INPUT DATA SELECTION AND GATING Data Selection LCx_in[0] 00000 Data GATE 1 lcxd1T LCxD1G1T lcxd1N LCxD1G1N LCx_in[31] 11111 LCxD2G1T LCxD1S<4:0> LCxD2G1N lcxg1 LCx_in[0] 00000 LCxD3G1T LCxG1POL lcxd2T LCxD3G1N lcxd2N LCxD4G1T LCx_in[31] 11111 LCxD2S<4:0> LCxD4G1N LCx_in[0] 00000 Data GATE 2 lcxg2 lcxd3T (Same as Data GATE 1) lcxd3N Data GATE 3 LCx_in[31] 11111 lcxg3 LCxD3S<4:0> (Same as Data GATE 1) LCx_in[0] 00000 Data GATE 4 lcxg4 lcxd4T (Same as Data GATE 1) lcxd4N LCx_in[31] 11111 LCxD4S<4:0> Note: All controls are undefined at power-up. DS40001607D-page 218  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 23-3: PROGRAMMABLE LOGIC FUNCTIONS Rev.10-000122A 7/30/2013 AND-OR OR-XOR lcxg1 lcxg1 lcxg2 lcxg2 lcxq lcxq lcxg3 lcxg3 lcxg4 lcxg4 LCxMODE<2:0>=000 LCxMODE<2:0>=001 4-inputAND S-RLatch lcxg1 lcxg1 S Q lcxq lcxg2 lcxg2 lcxq lcxg3 lcxg3 R lcxg4 lcxg4 LCxMODE<2:0>=010 LCxMODE<2:0>=011 1-InputDFlip-FlopwithSandR 2-InputDFlip-FlopwithR lcxg4 lcxg4 S lcxg2 D Q lcxq D Q lcxq lcxg2 lcxg1 lcxg1 R R lcxg3 lcxg3 LCxMODE<2:0>=100 LCxMODE<2:0>=101 J-KFlip-FlopwithR 1-InputTransparentLatchwithSandR lcxg4 lcxg2 J Q lcxq S lcxg2 D Q lcxq lcxg1 lcxg4 K R lcxg3 LE R lcxg3 lcxg1 LCxMODE<2:0>=110 LCxMODE<2:0>=111  2011-2015 Microchip Technology Inc. DS40001607D-page 219

PIC16(L)F1503 23.6 Register Definitions: CLC Control REGISTER 23-1: CLCxCON: CONFIGURABLE LOGIC CELL CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 LCxEN LCxOE LCxOUT LCxINTP LCxINTN LCxMODE<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxEN: Configurable Logic Cell Enable bit 1 = Configurable logic cell is enabled and mixing input signals 0 = Configurable logic cell is disabled and has logic zero output bit 6 LCxOE: Configurable Logic Cell Output Enable bit 1 = Configurable logic cell port pin output enabled 0 = Configurable logic cell port pin output disabled bit 5 LCxOUT: Configurable Logic Cell Data Output bit Read-only: logic cell output data, after LCxPOL; sampled from lcx_out wire. bit 4 LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a rising edge occurs on lcx_out 0 = CLCxIF will not be set bit 3 LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit 1 = CLCxIF will be set when a falling edge occurs on lcx_out 0 = CLCxIF will not be set bit 2-0 LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits 111 = Cell is 1-input transparent latch with S and R 110 = Cell is J-K flip-flop with R 101 = Cell is 2-input D flip-flop with R 100 = Cell is 1-input D flip-flop with S and R 011 = Cell is S-R latch 010 = Cell is 4-input AND 001 = Cell is OR-XOR 000 = Cell is AND-OR DS40001607D-page 220  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 23-2: CLCxPOL: SIGNAL POLARITY CONTROL REGISTER R/W-0/0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxPOL — — — LCxG4POL LCxG3POL LCxG2POL LCxG1POL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxPOL: LCOUT Polarity Control bit 1 = The output of the logic cell is inverted 0 = The output of the logic cell is not inverted bit 6-4 Unimplemented: Read as ‘0’ bit 3 LCxG4POL: Gate 4 Output Polarity Control bit 1 = The output of gate 4 is inverted when applied to the logic cell 0 = The output of gate 4 is not inverted bit 2 LCxG3POL: Gate 3 Output Polarity Control bit 1 = The output of gate 3 is inverted when applied to the logic cell 0 = The output of gate 3 is not inverted bit 1 LCxG2POL: Gate 2 Output Polarity Control bit 1 = The output of gate 2 is inverted when applied to the logic cell 0 = The output of gate 2 is not inverted bit 0 LCxG1POL: Gate 1 Output Polarity Control bit 1 = The output of gate 1 is inverted when applied to the logic cell 0 = The output of gate 1 is not inverted  2011-2015 Microchip Technology Inc. DS40001607D-page 221

PIC16(L)F1503 REGISTER 23-3: CLCxSEL0: MULTIPLEXER DATA 1 AND 2 SELECT REGISTER U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — LCxD2S<2:0>(1) — LCxD1S<2:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 LCxD2S<2:0>: Input Data 2 Selection Control bits(1) 111 = LCx_in[11] is selected for lcxd2 110 = LCx_in[10] is selected for lcxd2 101 = LCx_in[9] is selected for lcxd2 100 = LCx_in[8] is selected for lcxd2 011 = LCx_in[7] is selected for lcxd2 010 = LCx_in[6] is selected for lcxd2 001 = LCx_in[5] is selected for lcxd2 000 = LCx_in[4] is selected for lcxd2 bit 3 Unimplemented: Read as ‘0’ bit 2-0 LCxD1S<2:0>: Input Data 1 Selection Control bits(1) 111 = LCx_in[7] is selected for lcxd1 110 = LCx_in[6] is selected for lcxd1 101 = LCx_in[5] is selected for lcxd1 100 = LCx_in[4] is selected for lcxd1 011 = LCx_in[3] is selected for lcxd1 010 = LCx_in[2] is selected for lcxd1 001 = LCx_in[1] is selected for lcxd1 000 = LCx_in[0] is selected for lcxd1 Note 1: See Table23-1 for signal names associated with inputs. DS40001607D-page 222  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 23-4: CLCxSEL1: MULTIPLEXER DATA 3 AND 4 SELECT REGISTER U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — LCxD4S<2:0>(1) — LCxD3S<2:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 LCxD4S<2:0>: Input Data 4 Selection Control bits(1) 111 = LCx_in[3] is selected for lcxd4 110 = LCx_in[2] is selected for lcxd4 101 = LCx_in[1] is selected for lcxd4 100 = LCx_in[0] is selected for lcxd4 011 = LCx_in[15] is selected for lcxd4 010 = LCx_in[14] is selected for lcxd4 001 = LCx_in[13] is selected for lcxd4 000 = LCx_in[12] is selected for lcxd4 bit 3 Unimplemented: Read as ‘0’ bit 2-0 LCxD3S<2:0>: Input Data 3 Selection Control bits(1) 111 = LCx_in[15] is selected for lcxd3 110 = LCx_in[14] is selected for lcxd3 101 = LCx_in[13] is selected for lcxd3 100 = LCx_in[12] is selected for lcxd3 011 = LCx_in[11] is selected for lcxd3 010 = LCx_in[10] is selected for lcxd3 001 = LCx_in[9] is selected for lcxd3 000 = LCx_in[8] is selected for lcxd3 Note 1: See Table23-1 for signal names associated with inputs.  2011-2015 Microchip Technology Inc. DS40001607D-page 223

PIC16(L)F1503 REGISTER 23-5: CLCxGLS0: GATE 1 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG1D4T LCxG1D4N LCxG1D3T LCxG1D3N LCxG1D2T LCxG1D2N LCxG1D1T LCxG1D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg1 0 = lcxd4T is not gated into lcxg1 bit 6 LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg1 0 = lcxd4N is not gated into lcxg1 bit 5 LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg1 0 = lcxd3T is not gated into lcxg1 bit 4 LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg1 0 = lcxd3N is not gated into lcxg1 bit 3 LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg1 0 = lcxd2T is not gated into lcxg1 bit 2 LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg1 0 = lcxd2N is not gated into lcxg1 bit 1 LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg1 0 = lcxd1T is not gated into lcxg1 bit 0 LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg1 0 = lcxd1N is not gated into lcxg1 DS40001607D-page 224  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 23-6: CLCxGLS1: GATE 2 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG2D4T LCxG2D4N LCxG2D3T LCxG2D3N LCxG2D2T LCxG2D2N LCxG2D1T LCxG2D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg2 0 = lcxd4T is not gated into lcxg2 bit 6 LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg2 0 = lcxd4N is not gated into lcxg2 bit 5 LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg2 0 = lcxd3T is not gated into lcxg2 bit 4 LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg2 0 = lcxd3N is not gated into lcxg2 bit 3 LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg2 0 = lcxd2T is not gated into lcxg2 bit 2 LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg2 0 = lcxd2N is not gated into lcxg2 bit 1 LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg2 0 = lcxd1T is not gated into lcxg2 bit 0 LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg2 0 = lcxd1N is not gated into lcxg2  2011-2015 Microchip Technology Inc. DS40001607D-page 225

PIC16(L)F1503 REGISTER 23-7: CLCxGLS2: GATE 3 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG3D4T LCxG3D4N LCxG3D3T LCxG3D3N LCxG3D2T LCxG3D2N LCxG3D1T LCxG3D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg3 0 = lcxd4T is not gated into lcxg3 bit 6 LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg3 0 = lcxd4N is not gated into lcxg3 bit 5 LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg3 0 = lcxd3T is not gated into lcxg3 bit 4 LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg3 0 = lcxd3N is not gated into lcxg3 bit 3 LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg3 0 = lcxd2T is not gated into lcxg3 bit 2 LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg3 0 = lcxd2N is not gated into lcxg3 bit 1 LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg3 0 = lcxd1T is not gated into lcxg3 bit 0 LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg3 0 = lcxd1N is not gated into lcxg3 DS40001607D-page 226  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 23-8: CLCxGLS3: GATE 4 LOGIC SELECT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LCxG4D4T LCxG4D4N LCxG4D3T LCxG4D3N LCxG4D2T LCxG4D2N LCxG4D1T LCxG4D1N bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit 1 = lcxd4T is gated into lcxg4 0 = lcxd4T is not gated into lcxg4 bit 6 LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit 1 = lcxd4N is gated into lcxg4 0 = lcxd4N is not gated into lcxg4 bit 5 LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit 1 = lcxd3T is gated into lcxg4 0 = lcxd3T is not gated into lcxg4 bit 4 LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit 1 = lcxd3N is gated into lcxg4 0 = lcxd3N is not gated into lcxg4 bit 3 LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit 1 = lcxd2T is gated into lcxg4 0 = lcxd2T is not gated into lcxg4 bit 2 LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit 1 = lcxd2N is gated into lcxg4 0 = lcxd2N is not gated into lcxg4 bit 1 LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit 1 = lcxd1T is gated into lcxg4 0 = lcxd1T is not gated into lcxg4 bit 0 LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit 1 = lcxd1N is gated into lcxg4 0 = lcxd1N is not gated into lcxg4  2011-2015 Microchip Technology Inc. DS40001607D-page 227

PIC16(L)F1503 REGISTER 23-9: CLCDATA: CLC DATA OUTPUT U-0 U-0 U-0 U-0 U-0 U-0 R-0 R-0 — — — — — — MLC2OUT MLC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MLC2OUT: Mirror copy of LC2OUT bit bit 0 MLC1OUT: Mirror copy of LC1OUT bit DS40001607D-page 228  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 23-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLCx Register Name Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 Bit1 Bit0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 ANSELC — — — — ANSC3 ANSC2 ANSC1 ANSC0 103 CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 220 CLCDATA — — — — — MLC3OUT MLC2OUT MLC1OUT 228 CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N 224 CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N 225 CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N 226 CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N 227 CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 221 CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> 222 CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> 223 CLC2CON LC2EN LC2OE LC2OUT LC2INTP LC2INTN LC2MODE<2:0> 220 CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N 224 CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N 225 CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N 226 CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N 227 CLC2POL LC2POL — — — LC2G4POL LC2G3POL LC2G2POL LC2G1POL 221 CLC2SEL0 — LC2D2S<2:0> — LC2D1S<2:0> 222 CLC2SEL1 — LC2D4S<2:0> — LC2D3S<2:0> 223 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 PIE3 — — — — — — CLC2IE CLC1IE 67 PIR3 — — — — — — CLC2IF CLC1IF 70 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: — = unimplemented read as ‘0’,. Shaded cells are not used for CLC module. Note 1: Unimplemented, read as ‘1’.  2011-2015 Microchip Technology Inc. DS40001607D-page 229

PIC16(L)F1503 24.0 NUMERICALLY CONTROLLED 24.1.2 ACCUMULATOR OSCILLATOR (NCO) MODULE The accumulator is a 20-bit register. Read and write access to the accumulator is available through three The Numerically Controlled Oscillator (NCOx) module registers: is a timer that uses the overflow from the addition of an • NCOxACCL increment value to divide the input frequency. The • NCOxACCH advantage of the addition method over simple counter • NCOxACCU driven timer is that the resolution of division does not vary with the divider value. The NCOx is most useful for 24.1.3 ADDER applications that require frequency accuracy and fine resolution at a fixed duty cycle. The NCOx adder is a full adder, which operates independently from the system clock. The addition of the Features of the NCOx include: previous result and the increment value replaces the • 16-bit increment function accumulator value on the rising edge of each input clock. • Fixed Duty Cycle (FDC) mode • Pulse Frequency (PF) mode 24.1.4 INCREMENT REGISTERS • Output pulse width control The increment value is stored in two 8-bit registers • Multiple clock input sources making up a 16-bit increment. In order of LSB to MSB • Output polarity control they are: • Interrupt capability • NCOxINCL Figure24-1 is a simplified block diagram of the NCOx • NCOxINCH module. When the NCO module is enabled, the NCOxINCH 24.1 NCOx Operation should be written first, then the NCOxINCL register. The NCOx operates by repeatedly adding a fixed value Writing to the NCOxINCL register initiates the incre- to an accumulator. Additions occur at the input clock rate. ment buffer registers to be loaded simultaneously on The accumulator will overflow with a carry periodically, the second rising edge of the NCOx_clk signal. which is the raw NCOx output (NCO_overflow). This The registers are readable and writable. The increment effectively reduces the input clock by the ratio of the registers are double-buffered to allow value changes to addition value to the maximum accumulator value. See be made without first disabling the NCOx module. Equation24-1. When the NCO module is disabled, the increment The NCOx output can be further modified by stretching buffers are loaded immediately after a write to the the pulse or toggling a flip-flop. The modified NCOx increment registers. output is then distributed internally to other peripherals Note: The increment buffer registers are not and optionally output to a pin. The accumulator user-accessible. overflow also generates an interrupt (NCO_interrupt). The NCOx period changes in discrete steps to create an average frequency. This output depends on the ability of the receiving circuit (i.e., CWG or external resonant converter circuitry) to average the NCOx output to reduce uncertainty. 24.1.1 NCOx CLOCK SOURCES Clock sources available to the NCOx include: • HFINTOSC • FOSC • LC1_out • CLKIN pin The NCOx clock source is selected by configuring the NxCKS<2:0> bits in the NCOxCLK register. EQUATION 24-1: NCO Clock Frequency Increment Value FOVERFLOW= ---------------------------------------------------------------------------------------------------------------- n 2 n = Accumulator width in bits DS40001607D-page 230  2011-2015 Microchip Technology Inc.

D FIGURE 24-1: NUMERICALLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM P S 40 I 0 C 0 1 NCOxINCH NCOxINCL 6 Rev.10-000028A 1 0 16 7/30/2013 7D (1) 6 -p INCBUFH INCBUFL ( ag 16 L e 20 2 ) 3 F 1 1 NCO_overflow Adder HFINTOSC 00 5 20 0 FOSC 01 NCOx_clk NCOxACCU NCOxACCH NCOxACCL 3 LCx_out 10 20 NCO1CLK 11 NCO_interrupt setbit NxCKS<1:0> 2 NCOxIF FixedDuty CycleMode Circuitry NxOE D Q D Q 0 TRISbit S tatu _ 1 NCOx s Q NxPFM NxPOL NCOx_out ToPeripherals EN S Q _ D Q NxOUT  Ripple 2 Counter R Q 0 1 1 Q1 -2 Pulse 0 R Frequency 15 3 ModeCircuitry M NxPWS<2:0> ic ro c hip Note1: Theincrementregistersaredouble-bufferedtoallowforvaluechangestobemadewithoutfirstdisablingtheNCOmodule.Thefullincrementvalueisloadedintothebufferregistersonthe T secondrisingedgeoftheNCOx_clksignalthatoccursimmediatelyafterawritetoNCOxINCLregister.Thebuffersarenotuser-accessibleandareshownhereforreference. e c h n o lo g y In c .

PIC16(L)F1503 24.2 Fixed Duty Cycle (FDC) Mode 24.5 Interrupts In Fixed Duty Cycle (FDC) mode, every time the When the accumulator overflows (NCO_overflow), the accumulator overflows (NCO_overflow), the output is NCOx Interrupt Flag bit, NCOxIF, of the PIRx register is toggled. This provides a 50% duty cycle, provided that set. To enable the interrupt event (NCO_interrupt), the the increment value remains constant. For more following bits must be set: information, see Figure24-2. • NxEN bit of the NCOxCON register The FDC mode is selected by clearing the NxPFM bit • NCOxIE bit of the PIEx register in the NCOxCON register. • PEIE bit of the INTCON register • GIE bit of the INTCON register 24.3 Pulse Frequency (PF) Mode The interrupt must be cleared by software by clearing the NCOxIF bit in the Interrupt Service Routine. In Pulse Frequency (PF) mode, every time the accumu- lator overflows (NCO_overflow), the output becomes 24.6 Effects of a Reset active for one or more clock periods. Once the clock period expires, the output returns to an inactive state. All of the NCOx registers are cleared to zero as the This provides a pulsed output. result of a Reset. The output becomes active on the rising clock edge immediately following the overflow event. For more 24.7 Operation In Sleep information, see Figure24-2. The NCO module operates independently from the The value of the active and inactive states depends on the polarity bit, NxPOL in the NCOxCON register. system clock and will continue to run during Sleep, provided that the clock source selected remains The PF mode is selected by setting the NxPFM bit in active. the NCOxCON register. The HFINTOSC remains active during Sleep when the 24.3.1 OUTPUT PULSE WIDTH CONTROL NCO module is enabled and the HFINTOSC is When operating in PF mode, the active state of the out- selected as the clock source, regardless of the system put can vary in width by multiple clock periods. Various clock source selected. pulse widths are selected with the NxPWS<2:0> bits in In other words, if the HFINTOSC is simultaneously the NCOxCLK register. selected as the system clock and the NCO clock When the selected pulse width is greater than the source, when the NCO is enabled, the CPU will go idle accumulator overflow time frame, the output of the during Sleep, but the NCO will continue to operate and NCOx operation is indeterminate. the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. 24.4 Output Polarity Control The last stage in the NCOx module is the output polar- 24.8 Alternate Pin Locations ity. The NxPOL bit in the NCOxCON register selects the output polarity. Changing the polarity while the inter- This module incorporates I/O pins that can be moved to rupts are enabled will cause an interrupt for the result- other locations with the use of the alternate pin function ing output transition. register, APFCON. To determine which pins can be moved and what their default locations are upon a The NCOx output can be used internally by source Reset, see Section 11.1“Alternate Pin Function” for code or other peripherals. Accomplish this by reading more information. the NxOUT (read-only) bit of the NCOxCON register. The NCOx output signal is available to the following peripherals: • CLC • CWG DS40001607D-page 232  2011-2015 Microchip Technology Inc.

D FIGURE 24-2: NCO – FIXED DUTY CYCLE (FDC) AND PULSE FREQUENCY MODE (PFM) OUTPUT OPERATION DIAGRAM P S 40 Rev. 10-000029A I 0 11/7/2013 C 0 x 1 60 k 1 7D e 6 -p ( ag L e 2 ) 33 x F ent 4000h 4000h 4000h 1 e 5 0 3 x ator 00000h 04000h 08000h FC000h 00000h 04000h 08000h FC000h 00000h 04000h 08000h e erflow S ta tu s errupt utput  ode 2 0 1 1 -2 0 1 5 M utput ic de ro WS = c h ip T e c hn utput o lo de g y WS = In c .

PIC16(L)F1503 24.9 Register Definitions: NCOx Control Registers REGISTER 24-1: NCOxCON: NCOx CONTROL REGISTER R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 NxEN NxOE NxOUT NxPOL — — — NxPFM bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 NxEN: NCOx Enable bit 1 = NCOx module is enabled 0 = NCOx module is disabled bit 6 NxOE: NCOx Output Enable bit 1 = NCOx output pin is enabled 0 = NCOx output pin is disabled bit 5 NxOUT: NCOx Output bit 1 = NCOx output is high 0 = NCOx output is low bit 4 NxPOL: NCOx Polarity bit 1 = NCOx output signal is active low (inverted) 0 = NCOx output signal is active high (non-inverted) bit 3-1 Unimplemented: Read as ‘0’ bit 0 NxPFM: NCOx Pulse Frequency Mode bit 1 = NCOx operates in Pulse Frequency mode 0 = NCOx operates in Fixed Duty Cycle mode REGISTER 24-2: NCOxCLK: NCOx INPUT CLOCK CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 NxPWS<2:0>(1, 2) — — — NxCKS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2) 111 = 128 NCOx clock periods 110 = 64 NCOx clock periods 101 = 32 NCOx clock periods 100 = 16 NCOx clock periods 011 = 8 NCOx clock periods 010 = 4 NCOx clock periods 001 = 2 NCOx clock periods 000 = 1 NCOx clock periods bit 4-2 Unimplemented: Read as ‘0’ bit 1-0 NxCKS<1:0>: NCOx Clock Source Select bits 11 = NCO1CLK pin 10 = LC1_out 01 = FOSC 00 = HFINTOSC (16 MHz) Note 1: NxPWS applies only when operating in Pulse Frequency mode. 2: If NCOx pulse width is greater than NCO_overflow period, operation is indeterminate. DS40001607D-page 234  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 24-3: NCOxACCL: NCOx ACCUMULATOR REGISTER – LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxACC<7:0>: NCOx Accumulator, Low Byte REGISTER 24-4: NCOxACCH: NCOx ACCUMULATOR REGISTER – HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxACC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxACC<15:8>: NCOx Accumulator, High Byte REGISTER 24-5: NCOxACCU: NCOx ACCUMULATOR REGISTER – UPPER BYTE U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — NCOxACC<19:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 NCOxACC<19:16>: NCOx Accumulator, Upper Byte  2011-2015 Microchip Technology Inc. DS40001607D-page 235

PIC16(L)F1503 REGISTER 24-6: NCOxINCL: NCOx INCREMENT REGISTER – LOW BYTE(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 NCOxINC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxINC<7:0>: NCOx Increment, Low Byte Note 1: Write the NCOxINCH register first, then the NCOxINCL register. See 24.1.4 “Increment Registers” for more information. REGISTER 24-7: NCOxINCH: NCOx INCREMENT REGISTER – HIGH BYTE(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 NCOxINC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 NCOxINC<15:8>: NCOx Increment, High Byte Note 1: Write the NCOxINCH register first, then the NCOxINCL register. See 24.1.4 “Increment Registers” for more information. TABLE 24-1: SUMMARY OF REGISTERS ASSOCIATED WITH NCOx Register on Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page APFCON — — SDOSEL SSSEL T1GSEL — CLC1SEL NCO1SEL 96 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64 NCO1ACCH NCO1ACC<15:8> 235 NCO1ACCL NCO1ACC<7:0> 235 NCO1ACCU — NCO1ACC<19:16> 235 NCO1CLK N1PWS<2:0> — — — N1CKS<1:0> 234 NCO1CON N1EN N1OE N1OUT N1POL — — — N1PFM 234 NCO1INCH NCO1INC<15:8> 236 NCO1INCL NCO1INC<7:0> 236 PIE2 — C2IE C1IE — BCL1IE NCO1IE — — 66 PIR2 — C2IF C1IF — BCL1IF NCO1IF — — 69 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for NCOx module. Note 1: Unimplemented, read as ‘1’. DS40001607D-page 236  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 25.0 COMPLEMENTARY WAVEFORM 25.3 Selectable Input Sources GENERATOR (CWG) MODULE The CWG generates the output waveforms from the input sources in Table25-1. The Complementary Waveform Generator (CWG) produces a complementary waveform with dead-band delay from a selection of input sources. TABLE 25-1: SELECTABLE INPUT The CWG module has the following features: SOURCES • Selectable dead-band clock source control Source Peripheral Signal Name • Selectable input sources Comparator C1 C1OUT_sync • Output enable control Comparator C2 C2OUT_sync • Output polarity control PWM1 PWM1_out • Dead-band control with independent 6-bit rising PWM2 PWM2_out and falling edge dead-band counters PWM3 PWM3_out • Auto-shutdown control with: - Selectable shutdown sources PWM4 PWM4_out - Auto-restart enable NCO1 NCO1_out - Auto-shutdown pin override control CLC1 LC1_out The input sources are selected using the GxIS<2:0> 25.1 Fundamental Operation bits in the CWGxCON1 register (Register25-2). The CWG generates two output waveforms from the 25.4 Output Control selected input source. The off-to-on transition of each output can be delayed Immediately after the CWG module is enabled, the from the on-to-off transition of the other output, thereby, complementary drive is configured with both CWGxA creating a time delay immediately where neither output and CWGxB drives cleared. is driven. This is referred to as dead time and is covered in Section 25.5“Dead-Band Control”. A typical 25.4.1 OUTPUT ENABLES operating waveform, with dead band, generated from a Each CWG output pin has individual output enable single input signal is shown in Figure25-2. control. Output enables are selected with the GxOEA It may be necessary to guard against the possibility of and GxOEB bits of the CWGxCON0 register. When an circuit faults or a feedback event arriving too late or not output enable control is cleared, the module asserts no at all. In this case, the active drive must be terminated control over the pin. When an output enable is set, the before the Fault condition causes damage. This is override value or active PWM waveform is applied to referred to as auto-shutdown and is covered in Section the pin per the port priority selection. The output pin 25.9“Auto-Shutdown Control”. enables are dependent on the module enable bit, GxEN. When GxEN is cleared, CWG output enables 25.2 Clock Source and CWG drive levels have no effect. The CWG module allows the following clock sources 25.4.2 POLARITY CONTROL to be selected: The polarity of each CWG output can be selected • Fosc (system clock) independently. When the output polarity bit is set, the • HFINTOSC (16 MHz only) corresponding output is active-high. Clearing the output polarity bit configures the corresponding output as The clock sources are selected using the G1CS0 bit of the CWGxCON0 register (Register25-1). active-low. However, polarity does not affect the override levels. Output polarity is selected with the GxPOLA and GxPOLB bits of the CWGxCON0 register.  2011-2015 Microchip Technology Inc. DS40001607D-page 237

D FIGURE 25-1: SIMPLIFIED CWG BLOCK DIAGRAM P S 40 I 0 C 0 1 6 1 0 7D Rev. 10-070/90/122031A5 6 -p 2 ( ag GxASDLA L e 2 ) 3 F 8 00 xCS 1 ‘0' 10 GxASDLA = 01 15 ‘1' 11 0 CWGxDBR FOSC cwg_clock 3 6 OSC CWGxA 1 3 EN GxIS = 0 R TRISx sync S Q GxPOLA GxOEA sync Input Source CWGxDBF _out _out R Q 6 _out S ta _out tu _out GxOEB s _out EN = TRISx 0 R 1 GxPOLB CWGxB pin) SFLT 00 sync  SC1 ‘0' 10 2011 sSyCn2c AutoS-Sohuurctdeown S GxsAhSuEtdown ‘1' 11 -2 S Q D Q 0 _out 2 15 M LC2 GxASDLB GxASDLB = 01 ic GxASE Data Bit R Q ro WRITE ch GxARSEN set dominate ip T e c h n o lo g y In c .

PIC16(L)F1503 FIGURE 25-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN) cwg_clock PWM1 CWGxA Rising Edge Rising Edge Rising Edge Dead Band Falling Edge Dead Band Falling Edge Dead Band Dead Band Dead Band CWGxB 25.5 Dead-Band Control 25.7 Falling Edge Dead Band Dead-band control provides for non-overlapping output The falling edge dead band delays the turn-on of the signals to prevent shoot-through current in power CWGxB output from when the CWGxA output is turned switches. The CWG contains two 6-bit dead-band off. The falling edge dead-band time starts when the counters. One dead-band counter is used for the rising falling edge of the input source goes true. When this edge of the input source control. The other is used for happens, the CWGxA output is immediately turned off the falling edge of the input source control. and the falling edge dead-band delay time starts. When the falling edge dead-band delay time is reached, the Dead band is timed by counting CWG clock periods CWGxB output is turned on. from zero up to the value in the rising or falling dead- band counter registers. See CWGxDBR and The CWGxDBF register sets the duration of the dead- CWGxDBF registers (Register25-4 and Register25-5, band interval on the falling edge of the input source sig- respectively). nal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input 25.6 Rising Edge Dead Band source signal. A count of 0 (zero), indicates that no dead band is present. The rising edge dead-band delays the turn-on of the CWGxA output from when the CWGxB output is turned If the input source signal is not present for enough time off. The rising edge dead-band time starts when the for the count to be completed, no output will be seen on rising edge of the input source signal goes true. When the respective output. this happens, the CWGxB output is immediately turned Refer to Figure25-3 and Figure25-4 for examples. off and the rising edge dead-band delay time starts. When the rising edge dead-band delay time is reached, the CWGxA output is turned on. The CWGxDBR register sets the duration of the dead- band interval on the rising edge of the input source signal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input source signal. A count of 0 (zero), indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output.  2011-2015 Microchip Technology Inc. DS40001607D-page 239

 FIGURE 25-3: DEAD-BAND OPERATION, CWGxDBR = 01H, CWGxDBF = 02H 2 0 1 1 -2 0 1 5 M cwg_clock ic ro c h ip Input Source T e c h n CWGxA o lo g y In CWGxB c . FIGURE 25-4: DEAD-BAND OPERATION, CWGxDBR = 03H, CWGxDBF = 04H, SOURCE SHORTER THAN DEAD BAND S ta cwg_clock tu s Input Source CWGxA CWGxB source shorter than dead band P I C 1 6 D S ( 40 L 0 0 ) 1 6 F 0 7D 1 -p 5 a ge 0 24 3 0

PIC16(L)F1503 25.8 Dead-Band Uncertainty 25.9 Auto-Shutdown Control When the rising and falling edges of the input source Auto-shutdown is a method to immediately override the triggers the dead-band counters, the input may be asyn- CWG output levels with specific overrides that allow for chronous. This will create some uncertainty in the dead- safe shutdown of the circuit. The shutdown state can be band time delay. The maximum uncertainty is equal to either cleared automatically or held until cleared by one CWG clock period. Refer to Equation25-1 for more software. detail. 25.9.1 SHUTDOWN EQUATION 25-1: DEAD-BAND The shutdown state can be entered by either of the UNCERTAINTY following two methods: • Software generated • External Input 1 TDEADBAND_UNCERTAINTY = ----------------------------- Fcwg_clock 25.9.1.1 Software Generated Shutdown Setting the GxASE bit of the CWGxCON2 register will force the CWG into the shutdown state. When auto-restart is disabled, the shutdown state will Example: persist as long as the GxASE bit is set. When auto-restart is enabled, the GxASE bit will clear automatically and resume operation on the next rising Fcwg_clock = 16 MHz edge event. See Figure25-6. 25.9.1.2 External Input Source External shutdown inputs provide the fastest way to Therefore: safely suspend CWG operation in the event of a Fault condition. When any of the selected shutdown inputs goes active, the CWG outputs will immediately go to 1 TDEADBAND_UNCERTAINTY = ----------------------------- the selected override levels without software delay. Any Fcwg_clock combination of two input sources can be selected to cause a shutdown condition. The sources are: 1 • Comparator C1 – C1OUT_async = ------------------- • Comparator C2 – C2OUT_async 16 MHz • CLC2 – LC2_out = 62.5ns • CWG1FLT Shutdown inputs are selected in the CWGxCON2 register. (Register25-3). Note: Shutdown inputs are level sensitive, not edge sensitive. The shutdown state can- not be cleared, except by disabling auto- shutdown, as long as the shutdown input level persists.  2011-2015 Microchip Technology Inc. DS40001607D-page 241

PIC16(L)F1503 25.10 Operation During Sleep 25.11.1 PIN OVERRIDE LEVELS The levels driven to the output pins, while the shutdown The CWG module operates independently from the input is true, are controlled by the GxASDLA and system clock and will continue to run during Sleep, GxASDLB bits of the CWGxCON1 register provided that the clock and input sources selected (Register25-3). GxASDLA controls the CWG1A remain active. override level and GxASDLB controls the CWG1B The HFINTOSC remains active during Sleep, provided override level. The control bit logic level corresponds to the output logic drive level while in the shutdown state. that the CWG module is enabled, the input source is The polarity control does not apply to the override level. active, and the HFINTOSC is selected as the clock source, regardless of the system clock source 25.11.2 AUTO-SHUTDOWN RESTART selected. After an auto-shutdown event has occurred, there are In other words, if the HFINTOSC is simultaneously two ways to have resume operation: selected as the system clock and the CWG clock • Software controlled source, when the CWG is enabled and the input • Auto-restart source is active, the CPU will go idle during Sleep, but the CWG will continue to operate and the HFINTOSC The restart method is selected with the GxARSEN bit of the CWGxCON2 register. Waveforms of software will remain active. controlled and automatic restarts are shown in This will have a direct effect on the Sleep mode current. Figure25-5 and Figure25-6. 25.11 Configuring the CWG 25.11.2.1 Software Controlled Restart The following steps illustrate how to properly configure When the GxARSEN bit of the CWGxCON2 register is the CWG to ensure a synchronous start: cleared, the CWG must be restarted after an auto-shut- down event by software. 1. Ensure that the TRIS control bits corresponding to CWGxA and CWGxB are set so that both are Clearing the shutdown state requires all selected shut- configured as inputs. down inputs to be low, otherwise the GxASE bit will remain set. The overrides will remain in effect until the 2. Clear the GxEN bit, if not already cleared. first rising edge event after the GxASE bit is cleared. 3. Set desired dead-band times with the CWGxDBR The CWG will then resume operation. and CWGxDBF registers. 4. Setup the following controls in CWGxCON2 25.11.2.2 Auto-Restart auto-shutdown register: When the GxARSEN bit of the CWGxCON2 register is • Select desired shutdown source. set, the CWG will restart from the auto-shutdown state • Select both output overrides to the desired automatically. levels (this is necessary even if not using The GxASE bit will clear automatically when all shut- auto-shutdown because start-up will be from down sources go low. The overrides will remain in a shutdown state). effect until the first rising edge event after the GxASE • Set the GxASE bit and clear the GxARSEN bit is cleared. The CWG will then resume operation. bit. 5. Select the desired input source using the CWGxCON1 register. 6. Configure the following controls in CWGxCON0 register: • Select desired clock source. • Select the desired output polarities. • Set the output enables for the outputs to be used. 7. Set the GxEN bit. 8. Clear TRIS control bits corresponding to CWGxA and CWGxB to be used to configure those pins as outputs. 9. If auto-restart is to be used, set the GxARSEN bit and the GxASE bit will be cleared automati- cally. Otherwise, clear the GxASE bit to start the CWG. DS40001607D-page 242  2011-2015 Microchip Technology Inc.

D FIGURE 25-5: SHUTDOWN FUNCTIONALITY, AUTO-RESTART DISABLED (GxARSEN = 0,GxASDLA = 01, GxASDLB = 01) P S 40 I 0 C 01 Shutdown Event Ceases GxASE Cleared by Software 6 1 0 7D 6 -page CWGS oInuprcuet (L 2 ) 43 Shutdown Source F 1 5 GxASE 0 3 CWG1A Tri-State (No Pulse) CWG1B Tri-State (No Pulse) No Shutdown Shutdown Output Resumes S ta tu FIGURE 25-6: SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1,GxASDLA = 01, GxASDLB = 01) s Shutdown Event Ceases GxASE auto-cleared by hardware CWG Input Source Shutdown Source  2 0 1 1 -2 GxASE 0 1 5 M ic CWG1A Tri-State (No Pulse) ro c h ip T CWG1B Tri-State (No Pulse) e c h No Shutdown n o lo Shutdown Output Resumes g y In c .

PIC16(L)F1503 25.12 Register Definitions: CWG Control REGISTER 25-1: CWGxCON0: CWG CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 GxEN GxOEB GxOEA GxPOLB GxPOLA — — GxCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxEN: CWGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 GxOEB: CWGxB Output Enable bit 1 = CWGxB is available on appropriate I/O pin 0 = CWGxB is not available on appropriate I/O pin bit 5 GxOEA: CWGxA Output Enable bit 1 = CWGxA is available on appropriate I/O pin 0 = CWGxA is not available on appropriate I/O pin bit 4 GxPOLB: CWGxB Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 3 GxPOLA: CWGxA Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 2-1 Unimplemented: Read as ‘0’ bit 0 GxCS0: CWGx Clock Source Select bit 1 = HFINTOSC 0 = FOSC DS40001607D-page 244  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 25-2: CWGxCON1: CWG CONTROL REGISTER 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u U-0 R/W-0/0 R/W-0/0 R/W-0/0 GxASDLB<1:0> GxASDLA<1:0> — GxIS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB When an auto shutdown event is present (GxASE=1): 11 = CWGxB pin is driven to ‘1’, regardless of the setting of the GxPOLB bit. 10 = CWGxB pin is driven to ‘0’, regardless of the setting of the GxPOLB bit. 01 = CWGxB pin is tri-stated 00 = CWGxB pin is driven to its inactive state after the selected dead-band interval. GxPOLB still will control the polarity of the output. bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA When an auto shutdown event is present (GxASE=1): 11 = CWGxA pin is driven to ‘1’, regardless of the setting of the GxPOLA bit. 10 = CWGxA pin is driven to ‘0’, regardless of the setting of the GxPOLA bit. 01 = CWGxA pin is tri-stated 00 = CWGxA pin is driven to its inactive state after the selected dead-band interval. GxPOLA still will control the polarity of the output. bit 3 Unimplemented: Read as ‘0’ bit 2-0 GxIS<2:0>: CWGx Input Source Select bits 111 = CLC1 – LC1_out 110 = NCO1 – NCO1_out 101 = PWM4 – PWM4_out 100 = PWM3 – PWM3_out 011 = PWM2 – PWM2_out 010 = PWM1 – PWM1_out 001 = Comparator C2– C2OUT_async 000 = Comparator C1 – C1OUT_async  2011-2015 Microchip Technology Inc. DS40001607D-page 245

PIC16(L)F1503 REGISTER 25-3: CWGxCON2: CWG CONTROL REGISTER 2 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 GxASE GxARSEN — — GxASDSC2 GxASDSC1 GxASDSFLT GxASDSCLC2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxASE: Auto-Shutdown Event Status bit 1 = An auto-shutdown event has occurred 0 = No auto-shutdown event has occurred bit 6 GxARSEN: Auto-Restart Enable bit 1 = Auto-restart is enabled 0 = Auto-restart is disabled bit 5-4 Unimplemented: Read as ‘0’ bit 3 GxASDSC2: CWG Auto-shutdown on Comparator C2 Enable bit 1 = Shutdown when Comparator C2 output (C2OUT_async) is high 0 = Comparator C2 output has no effect on shutdown bit 2 GxASDSC1: CWG Auto-shutdown on Comparator C1 Enable bit 1 = Shutdown when Comparator C1 output (C1OUT_async) is high 0 = Comparator C1 output has no effect on shutdown bit 1 GxASDSFLT: CWG Auto-shutdown on FLT Enable bit 1 = Shutdown when CWG1FLT input is low 0 = CWG1FLT input has no effect on shutdown bit 0 GxASDSCLC2: CWG Auto-shutdown on CLC2 Enable bit 1 = Shutdown when CLC2 output (LC2_out) is high 0 = CLC2 output has no effect on shutdown DS40001607D-page 246  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 REGISTER 25-4: CWGxDBR: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) RISING DEAD-BAND COUNT REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — CWGxDBR<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising Counts 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band    00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band REGISTER 25-5: CWGxDBF: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) FALLING DEAD-BAND COUNT REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — CWGxDBF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling Counts 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band    00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band. Dead-band generation is bypassed.  2011-2015 Microchip Technology Inc. DS40001607D-page 247

PIC16(L)F1503 TABLE 25-2: SUMMARY OF REGISTERS ASSOCIATED WITH CWG Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99 CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA — — G1CS0 244 CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> 245 CWG1CON2 G1ASE G1ARSEN — — G1ASDSC2 G1ASDSC1 G1ASDSFLT G1ASDSCLC2 246 CWG1DBF — — CWG1DBF<5:0> 247 CWG1DBR — — CWG1DBR<5:0> 247 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98 TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 102 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by CWG. Note 1: Unimplemented, read as ‘1’. DS40001607D-page 248  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 26.0 IN-CIRCUIT SERIAL 26.3 Common Programming Interfaces PROGRAMMING™ (ICSP™) Connection to a target device is typically done through an ICSP™ header. A commonly found connector on ICSP™ programming allows customers to manufacture development tools is the RJ-11 in the 6P6C (6-pin, circuit boards with unprogrammed devices. Programming 6-connector) configuration. See Figure26-1. can be done after the assembly process allowing the device to be programmed with the most recent firmware FIGURE 26-1: ICD RJ-11 STYLE or a custom firmware. Five pins are needed for ICSP™ programming: CONNECTOR INTERFACE • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS ICSPDAT 2 4 6 NC In Program/Verify mode the program memory, user IDs VDD ICSPCLK and the Configuration Words are programmed through 1 3 5 Target serial communications. The ICSPDAT pin is a bidirec- VPP/MCLR VSS PC Board tional I/O used for transferring the serial data and the Bottom Side ICSPCLK pin is the clock input. For more information on ICSP™ refer to the “PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification” (DS41573). Pin Description* 1 = VPP/MCLR 26.1 High-Voltage Programming Entry 2 = VDD Target Mode 3 = VSS (ground) The device is placed into High-Voltage Programming 4 = ICSPDAT Entry mode by holding the ICSPCLK and ICSPDAT 5 = ICSPCLK pins low then raising the voltage on MCLR/VPP to VIHH. 6 = No Connect 26.2 Low-Voltage Programming Entry Another connector often found in use with the PICkit™ Mode programmers is a standard 6-pin header with 0.1inch spacing. Refer to Figure26-2. The Low-Voltage Programming Entry mode allows the PIC® Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Words is set to ‘1’, the ICSP Low-Voltage Programming Entry mode is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. MCLR is brought to VIL. 2. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section 6.5“MCLR” for more information. The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode.  2011-2015 Microchip Technology Inc. DS40001607D-page 249

PIC16(L)F1503 FIGURE 26-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE Rev.10-000128A 7/30/2013 Pin1Indicator PinDescription* 1=VPP/MCLR 1 2=VDDTarget 2 3 4 3=VSS(ground) 5 6 4=ICSPDAT 5=ICSPCLK 6=Noconnect * The6-pinheader(0.100"spacing)accepts0.025"squarepins For additional interface recommendations, refer to your It is recommended that isolation devices be used to specific device programmer manual prior to PCB separate the programming pins from other circuitry. design. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure26-3 for more information. FIGURE 26-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING Rev.10-000129A 7/30/2013 External Devicetobe Programming VDD Programmed Signals VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * ToNormalConnections * Isolationdevices(asrequired). DS40001607D-page 250  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 27.0 INSTRUCTION SET SUMMARY 27.1 Read-Modify-Write Operations Each instruction is a 14-bit word containing the opera- Any instruction that specifies a file register as part of tion code (opcode) and all required operands. The the instruction performs a Read-Modify-Write (R-M-W) opcodes are broken into three broad categories. operation. The register is read, the data is modified, and the result is stored according to either the instruc- • Byte Oriented tion, or the destination designator ‘d’. A read operation • Bit Oriented is performed on a register even if the instruction writes • Literal and Control to that register. The literal and control category contains the most varied instruction word format. TABLE 27-1: OPCODE FIELD DESCRIPTIONS Table27-3 lists the instructions recognized by the MPASMTM assembler. Field Description All instructions are executed within a single instruction f Register file address (0x00 to 0x7F) cycle, with the following exceptions, which may take W Working register (accumulator) two or three cycles: b Bit address within an 8-bit file register • Subroutine takes two cycles (CALL, CALLW) • Returns from interrupts or subroutines take two k Literal field, constant data or label cycles (RETURN, RETLW, RETFIE) x Don’t care location (= 0 or 1). • Program branching takes two cycles (GOTO, BRA, The assembler will generate code with x = 0. BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) It is the recommended form of use for • One additional instruction cycle will be used when compatibility with all Microchip software tools. any instruction references an indirect file register d Destination select; d = 0: store result in W, and the file select register is pointing to program d = 1: store result in file register f. memory. Default is d = 1. One instruction cycle consists of 4 oscillator cycles; for n FSR or INDF number. (0-1) an oscillator frequency of 4 MHz, this gives a nominal mm Pre-post increment-decrement mode instruction execution rate of 1 MHz. selection All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a TABLE 27-2: ABBREVIATION hexadecimal digit. DESCRIPTIONS Field Description PC Program Counter TO Time-Out bit C Carry bit DC Digit Carry bit Z Zero bit PD Power-Down bit  2011-2015 Microchip Technology Inc. DS40001607D-page 251

PIC16(L)F1503 FIGURE 27-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 0 OPCODE d f (FILE #) d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value MOVLP instruction only 13 7 6 0 OPCODE k (literal) k = 7-bit immediate value MOVLB instruction only 13 5 4 0 OPCODE k (literal) k = 5-bit immediate value BRA instruction only 13 9 8 0 OPCODE k (literal) k = 9-bit immediate value FSR Offset instructions 13 7 6 5 0 OPCODE n k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 3 2 1 0 OPCODE n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE DS40001607D-page 252  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 27-3: ENHANCED MID-RANGE INSTRUCTION SET Mnemonic, 14-Bit Opcode Status Description Cycles Notes Operands MSb LSb Affected BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF f, d Add W and f 1 00 0111 dfff ffff C, DC, Z 2 ADDWFC f, d Add with Carry W and f 1 11 1101 dfff ffff C, DC, Z 2 ANDWF f, d AND W with f 1 00 0101 dfff ffff Z 2 ASRF f, d Arithmetic Right Shift 1 11 0111 dfff ffff C, Z 2 LSLF f, d Logical Left Shift 1 11 0101 dfff ffff C, Z 2 LSRF f, d Logical Right Shift 1 11 0110 dfff ffff C, Z 2 CLRF f Clear f 1 00 0001 lfff ffff Z 2 CLRW – Clear W 1 00 0001 0000 00xx Z COMF f, d Complement f 1 00 1001 dfff ffff Z 2 DECF f, d Decrement f 1 00 0011 dfff ffff Z 2 INCF f, d Increment f 1 00 1010 dfff ffff Z 2 IORWF f, d Inclusive OR W with f 1 00 0100 dfff ffff Z 2 MOVF f, d Move f 1 00 1000 dfff ffff Z 2 MOVWF f Move W to f 1 00 0000 1fff ffff 2 RLF f, d Rotate Left f through Carry 1 00 1101 dfff ffff C 2 RRF f, d Rotate Right f through Carry 1 00 1100 dfff ffff C 2 SUBWF f, d Subtract W from f 1 00 0010 dfff ffff C, DC, Z 2 SUBWFB f, d Subtract with Borrow W from f 1 11 1011 dfff ffff C, DC, Z 2 SWAPF f, d Swap nibbles in f 1 00 1110 dfff ffff 2 XORWF f, d Exclusive OR W with f 1 00 0110 dfff ffff Z 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ f, d Decrement f, Skip if 0 1(2) 00 1011 dfff ffff 1, 2 INCFSZ f, d Increment f, Skip if 0 1(2) 00 1111 dfff ffff 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF f, b Bit Clear f 1 01 00bb bfff ffff 2 BSF f, b Bit Set f 1 01 01bb bfff ffff 2 BIT-ORIENTED SKIP OPERATIONS BTFSC f, b Bit Test f, Skip if Clear 1 (2) 01 10bb bfff ffff 1, 2 BTFSS f, b Bit Test f, Skip if Set 1 (2) 01 11bb bfff ffff 1, 2 LITERAL OPERATIONS ADDLW k Add literal and W 1 11 1110 kkkk kkkk C, DC, Z ANDLW k AND literal with W 1 11 1001 kkkk kkkk Z IORLW k Inclusive OR literal with W 1 11 1000 kkkk kkkk Z MOVLB k Move literal to BSR 1 00 0000 001k kkkk MOVLP k Move literal to PCLATH 1 11 0001 1kkk kkkk MOVLW k Move literal to W 1 11 0000 kkkk kkkk SUBLW k Subtract W from literal 1 11 1100 kkkk kkkk C, DC, Z XORLW k Exclusive OR literal with W 1 11 1010 kkkk kkkk Z Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle.  2011-2015 Microchip Technology Inc. DS40001607D-page 253

PIC16(L)F1503 TABLE 27-3: ENHANCED MID-RANGE INSTRUCTION SET (CONTINUED) Mnemonic, 14-Bit Opcode Status Description Cycles Notes Operands MSb LSb Affected CONTROL OPERATIONS BRA k Relative Branch 2 11 001k kkkk kkkk BRW – Relative Branch with W 2 00 0000 0000 1011 CALL k Call Subroutine 2 10 0kkk kkkk kkkk CALLW – Call Subroutine with W 2 00 0000 0000 1010 GOTO k Go to address 2 10 1kkk kkkk kkkk RETFIE k Return from interrupt 2 00 0000 0000 1001 RETLW k Return with literal in W 2 11 0100 kkkk kkkk RETURN – Return from Subroutine 2 00 0000 0000 1000 INHERENT OPERATIONS CLRWDT – Clear Watchdog Timer 1 00 0000 0110 0100 TO, PD NOP – No Operation 1 00 0000 0000 0000 OPTION – Load OPTION_REG register with W 1 00 0000 0110 0010 RESET – Software device Reset 1 00 0000 0000 0001 SLEEP – Go into Standby mode 1 00 0000 0110 0011 TO, PD TRIS f Load TRIS register with W 1 00 0000 0110 0fff C-COMPILER OPTIMIZED ADDFSR n, k Add Literal k to FSRn 1 11 0001 0nkk kkkk MOVIW n mm Move Indirect FSRn to W with pre/post inc/dec 1 00 0000 0001 0nmm Z 2, 3 modifier, mm kkkk k[n] Move INDFn to W, Indexed Indirect. 1 11 1111 0nkk 1nmm Z 2 MOVWI n mm Move W to Indirect FSRn with pre/post inc/dec 1 00 0000 0001 kkkk 2, 3 modifier, mm k[n] Move W to INDFn, Indexed Indirect. 1 11 1111 1nkk 2 Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions. DS40001607D-page 254  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 27.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW k Operands: -32  k  31 Operands: 0  k  255 n  [ 0, 1] Operation: (W) .AND. (k)  (W) Operation: FSR(n) + k  FSR(n) Status Affected: Z Status Affected: None Description: The contents of W register are Description: The signed 6-bit literal ‘k’ is added to AND’ed with the 8-bit literal ‘k’. The the contents of the FSRnH:FSRnL result is placed in the W register. register pair. FSRn is limited to the range 0000h - FFFFh. Moving beyond these bounds will cause the FSR to wrap-around. ADDLW Add literal and W ANDWF AND W with f Syntax: [ label ] ADDLW k Syntax: [ label ] ANDWF f,d Operands: 0  k  255 Operands: 0  f  127 d 0,1 Operation: (W) + k  (W) Operation: (W) .AND. (f)  (destination) Status Affected: C, DC, Z Status Affected: Z Description: The contents of the W register are added to the 8-bit literal ‘k’ and the Description: AND the W register with register ‘f’. If result is placed in the W register. ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWF Add W and f ASRF Arithmetic Right Shift Syntax: [ label ] ADDWF f,d Syntax: [ label ] ASRF f {,d} Operands: 0  f  127 Operands: 0  f  127 d 0,1 d [0,1] Operation: (W) + (f)  (destination) Operation: (f<7>) dest<7> (f<7:1>)  dest<6:0>, Status Affected: C, DC, Z (f<0>)  C, Description: Add the contents of the W register Status Affected: C, Z with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the Description: The contents of register ‘f’ are shifted result is stored back in register ‘f’. one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWFC ADD W and CARRY bit to f register f C Syntax: [ label ] ADDWFC f {,d} Operands: 0  f  127 d [0,1] Operation: (W) + (f) + (C)  dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data mem- ory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’.  2011-2015 Microchip Technology Inc. DS40001607D-page 255

PIC16(L)F1503 BCF Bit Clear f BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BCF f,b Syntax: [ label ] BTFSC f,b Operands: 0  f  127 Operands: 0  f  127 0  b  7 0  b  7 Operation: 0  (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label Syntax: [ label ] BTFSS f,b [ label ] BRA $+k Operands: 0  f  127 Operands: -256label-PC+1255 0  b < 7 -256  k  255 Operation: skip if (f<b>) = 1 Operation: (PC) + 1 + k  PC Status Affected: None Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next Description: Add the signed 9-bit literal ‘k’ to the instruction is executed. PC. Since the PC will have incre- If bit ‘b’ is ‘1’, then the next mented to fetch the next instruction, instruction is discarded and a NOP is the new address will be PC+1+k. executed instead, making this a This instruction is a 2-cycle instruc- 2-cycle instruction. tion. This branch has a limited range. BRW Relative Branch with W Syntax: [ label ] BRW Operands: None Operation: (PC) + (W)  PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incre- mented to fetch the next instruction, the new address will be PC+1+(W). This instruction is a 2-cycle instruc- tion. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0  f  127 0  b  7 Operation: 1  (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. DS40001607D-page 256  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 CALL Call Subroutine CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0  k  2047 Operands: None Operation: (PC)+ 1 TOS, Operation: 00h  WDT k  PC<10:0>, 0  WDT prescaler, (PCLATH<6:3>)  PC<14:11> 1  TO Status Affected: None 1  PD Description: Call Subroutine. First, return address Status Affected: TO, PD (PC + 1) is pushed onto the stack. Description: CLRWDT instruction resets the Watch- The 11-bit immediate address is dog Timer. It also resets the prescaler loaded into PC bits <10:0>. The upper of the WDT. bits of the PC are loaded from Status bits TO and PD are set. PCLATH. CALL is a 2-cycle instruc- tion. CALLW Subroutine Call With W COMF Complement f Syntax: [ label ] CALLW Syntax: [ label ] COMF f,d Operands: None Operands: 0  f  127 d  [0,1] Operation: (PC) +1  TOS, (W)  PC<7:0>, Operation: (f)  (destination) (PCLATH<6:0>) PC<14:8> Status Affected: Z Description: The contents of register ‘f’ are com- Status Affected: None plemented. If ‘d’ is ‘0’, the result is Description: Subroutine call with W. First, the stored in W. If ‘d’ is ‘1’, the result is return address (PC + 1) is pushed stored back in register ‘f’. onto the return stack. Then, the con- tents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a 2-cycle instruction. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF f Syntax: [ label ] DECF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] Operation: 00h  (f) 1  Z Operation: (f) - 1  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared Description: Decrement register ‘f’. If ‘d’ is ‘0’, the and the Z bit is set. result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W) 1  Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set.  2011-2015 Microchip Technology Inc. DS40001607D-page 257

PIC16(L)F1503 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] INCFSZ f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) - 1  (destination); Operation: (f) + 1  (destination), skip if result = 0 skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decre- Description: The contents of register ‘f’ are incre- mented. If ‘d’ is ‘0’, the result is placed mented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. is placed back in register ‘f’. If the result is ‘1’, the next instruction is If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a executed. If the result is ‘0’, a NOP is NOP is executed instead, making it a executed instead, making it a 2-cycle 2-cycle instruction. instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] GOTO k Syntax: [ label ] IORLW k Operands: 0  k  2047 Operands: 0  k  255 Operation: k  PC<10:0> Operation: (W) .OR. k  (W) PCLATH<6:3>  PC<14:11> Status Affected: Z Status Affected: None Description: The contents of the W register are Description: GOTO is an unconditional branch. The OR’ed with the 8-bit literal ‘k’. The 11-bit immediate value is loaded into result is placed in the W register. PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a 2-cycle instruction. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] INCF f,d Syntax: [ label ] IORWF f,d Operands: 0  f  127 Operands: 0  f  127 d  [0,1] d  [0,1] Operation: (f) + 1  (destination) Operation: (W) .OR. (f)  (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incre- Description: Inclusive OR the W register with regis- mented. If ‘d’ is ‘0’, the result is placed ter ‘f’. If ‘d’ is ‘0’, the result is placed in in the W register. If ‘d’ is ‘1’, the result the W register. If ‘d’ is ‘1’, the result is is placed back in register ‘f’. placed back in register ‘f’. DS40001607D-page 258  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 LSLF Logical Left Shift MOVF Move f Syntax: [ label ] LSLF f {,d} Syntax: [ label ] MOVF f,d Operands: 0  f  127 Operands: 0  f  127 d [0,1] d  [0,1] Operation: (f<7>)  C Operation: (f)  (dest) (f<6:0>)  dest<7:1> Status Affected: Z 0  dest<0> Description: The contents of register f is moved to Status Affected: C, Z a destination dependent upon the Description: The contents of register ‘f’ are shifted status of d. If d = 0, one bit to the left through the Carry flag. destination is W register. If d = 1, the A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’, destination is file register f itself. d = 1 the result is placed in W. If ‘d’ is ‘1’, the is useful to test a file register since result is stored back in register ‘f’. status flag Z is affected. Words: 1 C register f 0 Cycles: 1 Example: MOVF FSR, 0 After Instruction LSRF Logical Right Shift W = value in FSR register Syntax: [ label ] LSRF f {,d} Z = 1 Operands: 0  f  127 d [0,1] Operation: 0  dest<7> (f<7:1>)  dest<6:0>, (f<0>)  C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. A ‘0’ is shifted into the MSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 0 register f C  2011-2015 Microchip Technology Inc. DS40001607D-page 259

PIC16(L)F1503 MOVIW Move INDFn to W MOVLP Move literal to PCLATH Syntax: [ label ] MOVIW ++FSRn Syntax: [ label ] MOVLP k [ label ] MOVIW --FSRn Operands: 0  k  127 [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-- Operation: k  PCLATH [ label ] MOVIW k[FSRn] Status Affected: None Operands: n  [0,1] Description: The 7-bit literal ‘k’ is loaded into the mm  [00,01, 10, 11] PCLATH register. -32  k  31 Operation: INDFn  W Effective address is determined by MOVLW Move literal to W • FSR + 1 (preincrement) Syntax: [ label ] MOVLW k • FSR - 1 (predecrement) • FSR + k (relative offset) Operands: 0  k  255 After the Move, the FSR value will be Operation: k  (W) either: • FSR + 1 (all increments) Status Affected: None • FSR - 1 (all decrements) Description: The 8-bit literal ‘k’ is loaded into W reg- • Unchanged ister. The “don’t cares” will assemble as Status Affected: Z ‘0’s. Words: 1 Mode Syntax mm Cycles: 1 Preincrement ++FSRn 00 Example: MOVLW 0x5A Predecrement --FSRn 01 After Instruction W = 0x5A Postincrement FSRn++ 10 Postdecrement FSRn-- 11 MOVWF Move W to f Syntax: [ label ] MOVWF f Description: This instruction is used to move data between W and one of the indirect Operands: 0  f  127 registers (INDFn). Before/after this Operation: (W)  (f) move, the pointer (FSRn) is updated by Status Affected: None pre/post incrementing/decrementing it. Description: Move data from W register to register Note: The INDFn registers are not ‘f’. physical registers. Any instruction that Words: 1 accesses an INDFn register actually accesses the register at the address Cycles: 1 specified by the FSRn. Example: MOVWF OPTION_REG Before Instruction FSRn is limited to the range 0000h - OPTION_REG = 0xFF FFFFh. Incrementing/decrementing it W = 0x4F beyond these bounds will cause it to After Instruction wrap-around. OPTION_REG = 0x4F W = 0x4F MOVLB Move literal to BSR Syntax: [ label ] MOVLB k Operands: 0  k  31 Operation: k  BSR Status Affected: None Description: The 5-bit literal ‘k’ is loaded into the Bank Select Register (BSR). DS40001607D-page 260  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 MOVWI Move W to INDFn NOP No Operation Syntax: [ label ] NOP Syntax: [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn Operands: None [ label ] MOVWI FSRn++ Operation: No operation [ label ] MOVWI FSRn-- [ label ] MOVWI k[FSRn] Status Affected: None Operands: n  [0,1] Description: No operation. mm  [00,01, 10, 11] Words: 1 -32  k  31 Cycles: 1 Operation: W  INDFn Example: NOP Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be Load OPTION_REG Register either: OPTION with W • FSR + 1 (all increments) • FSR - 1 (all decrements) Syntax: [ label ] OPTION Unchanged Operands: None Status Affected: None Operation: (W)  OPTION_REG Status Affected: None Mode Syntax mm Description: Move data from W register to Preincrement ++FSRn 00 OPTION_REG register. Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 RESET Software Reset Syntax: [ label ] RESET Description: This instruction is used to move data between W and one of the indirect Operands: None registers (INDFn). Before/after this Operation: Execute a device Reset. Resets the move, the pointer (FSRn) is updated by nRI flag of the PCON register. pre/post incrementing/decrementing it. Status Affected: None Note: The INDFn registers are not Description: This instruction provides a way to physical registers. Any instruction that execute a hardware Reset by soft- accesses an INDFn register actually ware. accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h - FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap-around. The increment/decrement operation on FSRn WILL NOT affect any Status bits.  2011-2015 Microchip Technology Inc. DS40001607D-page 261

PIC16(L)F1503 RETFIE Return from Interrupt RETURN Return from Subroutine Syntax: [ label ] RETFIE Syntax: [ label ] RETURN Operands: None Operands: None Operation: TOS  PC, Operation: TOS  PC 1  GIE Status Affected: None Status Affected: None Description: Return from subroutine. The stack is Description: Return from Interrupt. Stack is POPed POPed and the top of the stack (TOS) and Top-of-Stack (TOS) is loaded in is loaded into the program counter. the PC. Interrupts are enabled by This is a 2-cycle instruction. setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a 2-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = TOS GIE = 1 RETLW Return with literal in W RLF Rotate Left f through Carry Syntax: [ label ] RETLW k Syntax: [ label ] RLF f,d Operands: 0  k  255 Operands: 0  f  127 Operation: k  (W); d  [0,1] TOS  PC Operation: See description below Status Affected: None Status Affected: C Description: The W register is loaded with the 8-bit literal ‘k’. The program counter is Description: The contents of register ‘f’ are rotated loaded from the top of the stack (the one bit to the left through the Carry return address). This is a 2-cycle flag. If ‘d’ is ‘0’, the result is placed in instruction. the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Words: 1 C Register f Cycles: 2 Example: CALL TABLE;W contains table Words: 1 ;offset value Cycles: 1 • ;W now has table value TABLE • Example: RLF REG1,0 • Before Instruction ADDWF PC ;W = offset REG1 = 1110 0110 RETLW k1 ;Begin table C = 0 RETLW k2 ; After Instruction • REG1 = 1110 0110 • W = 1100 1100 • C = 1 RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W = value of k8 DS40001607D-page 262  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 SUBLW Subtract W from literal RRF Rotate Right f through Carry Syntax: [ label ] SUBLW k Syntax: [ label ] RRF f,d Operands: 0 k 255 Operands: 0  f  127 d  [0,1] Operation: k - (W) W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: The W register is subtracted (2’s com- plement method) from the 8-bit literal Description: The contents of register ‘f’ are rotated ‘k’. The result is placed in the W regis- one bit to the right through the Carry ter. flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is C = 0 W  k placed back in register ‘f’. C = 1 W  k C Register f DC = 0 W<3:0>  k<3:0> DC = 1 W<3:0>  k<3:0> SUBWF Subtract W from f SLEEP Enter Sleep mode Syntax: [ label ] SLEEP Syntax: [ label ] SUBWF f,d Operands: None Operands: 0 f 127 d  [0,1] Operation: 00h  WDT, 0  WDT prescaler, Operation: (f) - (W) destination) 1  TO, Status Affected: C, DC, Z 0  PD Description: Subtract (2’s complement method) W Status Affected: TO, PD register from register ‘f’. If ‘d’ is ‘0’, the Description: The power-down Status bit, PD is result is stored in the W cleared. Time-out Status bit, TO is register. If ‘d’ is ‘1’, the result is stored set. Watchdog Timer and its pres- back in register ‘f. caler are cleared. The processor is put into Sleep mode C = 0 W  f with the oscillator stopped. C = 1 W  f DC = 0 W<3:0>  f<3:0> DC = 1 W<3:0>  f<3:0> SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d} Operands: 0  f  127 d  [0,1] Operation: (f) – (W) – (B) dest Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register ‘f’ (2’s comple- ment method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2011-2015 Microchip Technology Inc. DS40001607D-page 263

PIC16(L)F1503 SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W Syntax: [ label ] SWAPF f,d Syntax: [ label ] XORLW k Operands: 0  f  127 Operands: 0 k 255 d  [0,1] Operation: (W) .XOR. k W) Operation: (f<3:0>)  (destination<7:4>), Status Affected: Z (f<7:4>)  (destination<3:0>) Description: The contents of the W register are Status Affected: None XOR’ed with the 8-bit Description: The upper and lower nibbles of regis- literal ‘k’. The result is placed in the ter ‘f’ are exchanged. If ‘d’ is ‘0’, the W register. result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. TRIS Load TRIS Register with W XORWF Exclusive OR W with f Syntax: [ label ] TRIS f Syntax: [ label ] XORWF f,d Operands: 5  f  7 Operands: 0  f  127 d  [0,1] Operation: (W)  TRIS register ‘f’ Operation: (W) .XOR. (f) destination) Status Affected: None Status Affected: Z Description: Move data from W register to TRIS register. Description: Exclusive OR the contents of the W When ‘f’ = 5, TRISA is loaded. register with register ‘f’. If ‘d’ is ‘0’, the When ‘f’ = 6, TRISB is loaded. result is stored in the W register. If ‘d’ When ‘f’ = 7, TRISC is loaded. is ‘1’, the result is stored back in regis- ter ‘f’. DS40001607D-page 264  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 28.0 ELECTRICAL SPECIFICATIONS 28.1 Absolute Maximum Ratings(†) Ambient temperature under bias...................................................................................................... -40°C to +125°C Storage temperature........................................................................................................................ -65°C to +150°C Voltage on pins with respect to VSS on VDD pin PIC16F1503 .............................................................................................................. -0.3V to +6.5V PIC16LF1503 ............................................................................................................ -0.3V to +4.0V on MCLR pin ........................................................................................................................... -0.3V to +9.0V on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V) Maximum current on VSS pin(1) -40°C  TA  +85°C .............................................................................................................. 250 mA +85°C  TA  +125°C ............................................................................................................. 85 mA on VDD pin(1) -40°C  TA  +85°C .............................................................................................................. 250 mA +85°C  TA  +125°C ............................................................................................................. 85 mA Sunk by any standard I/O pin ............................................................................................................... 50 mA Sourced by any standard I/O pin .......................................................................................................... 50 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA Total power dissipation(2)...............................................................................................................................800 mW Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see Table28-6 to calculate device specifications. 2: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.  2011-2015 Microchip Technology Inc. DS40001607D-page 265

PIC16(L)F1503 28.2 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: VDDMIN VDD VDDMAX Operating Temperature: TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC16LF1503 VDDMIN (Fosc  16 MHz).......................................................................................................... +1.8V VDDMIN (16 MHz < Fosc  20 MHz)......................................................................................... +2.5V VDDMAX.................................................................................................................................... +3.6V PIC16F1503 VDDMIN (Fosc  16 MHz).......................................................................................................... +2.3V VDDMIN (16 MHz < Fosc  20 MHz)......................................................................................... +2.5V VDDMAX.................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................... +85°C Extended Temperature TA_MIN...................................................................................................................................... -40°C TA_MAX.................................................................................................................................. +125°C Note 1: See Parameter D001, DC Characteristics: Supply Voltage. DS40001607D-page 266  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-1: VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C, PIC16F1503 ONLY Rev. 10-000130A 8/6/2013 5.5 V) (D D V 2.5 2.3 0 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table28-8 for each Oscillator mode’s supported frequencies. FIGURE 28-2: VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C, PIC16LF1503 ONLY Rev. 10-000131A 8/5/2013 3.6 V) (D D V 2.5 1.8 0 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table28-8 for each Oscillator mode’s supported frequencies.  2011-2015 Microchip Technology Inc. DS40001607D-page 267

PIC16(L)F1503 28.3 DC Characteristics TABLE 28-1: SUPPLY VOLTAGE PIC16LF1503 Standard Operating Conditions (unless otherwise stated) PIC16F1503 Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. D001 VDD Supply Voltage VDDMIN VDDMAX 1.8 — 3.6 V FOSC  16MHz 2.5 — 3.6 V FOSC  20MHz D001 2.3 — 5.5 V FOSC  16MHz 2.5 — 5.5 V FOSC  20MHz D002* VDR RAM Data Retention Voltage(1) 1.5 — — V Device in Sleep mode D002* 1.7 — — V Device in Sleep mode D002A* VPOR Power-on Reset Release Voltage(2) — 1.6 — V D002A* — 1.6 — V D002B* VPORR* Power-on Reset Rearm Voltage(2) — 0.8 — V D002B* — 1.5 — V D003 VFVR Fixed Voltage Reference Voltage 1x gain (1.024V nominal) VDD 2.5V, -40°C  TA  +85°C 2x gain (2.048V nominal) -4 — +4 % VDD 2.5V, -40°C  TA  +85°C 4x gain (4.096V nominal) -3 — +7 % VDD 4.75V, -40°C  TA  +85°C D004* SVDD VDD Rise Rate(2) 0.05 — — V/ms Ensures that the Power-on Reset signal is released properly. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: See Figure28-3, POR and POR REARM with Slow Rising VDD. DS40001607D-page 268  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-3: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR SVDD VSS NPOR(1) POR REARM VSS TVLOW(3) TPOR(2) Note 1: When NPOR is low, the device is held in Reset. 2: TPOR 1s typical. 3: TVLOW 2.7s typical.  2011-2015 Microchip Technology Inc. DS40001607D-page 269

PIC16(L)F1503 TABLE 28-2: SUPPLY CURRENT (IDD)(1,2) PIC16LF1503 Standard Operating Conditions (unless otherwise stated) PIC16F1503 Conditions Param. Device Min. Typ† Max. Units No. Characteristics VDD Note D013 — 30 65 A 1.8 FOSC = 1MHz, External Clock (ECM), — 55 100 A 3.0 Medium Power mode D013 — 65 110 A 2.3 FOSC = 1MHz, — 85 140 A 3.0 External Clock (ECM), Medium Power mode — 115 190 A 5.0 D014 — 115 190 A 1.8 FOSC = 4MHz, External Clock (ECM), — 210 310 A 3.0 Medium Power mode D014 — 180 270 A 2.3 FOSC = 4MHz, — 240 365 A 3.0 External Clock (ECM), Medium Power mode — 295 460 A 5.0 D015 — 3.2 12 A 1.8 FOSC = 31kHz, — 5.4 20 A 3.0 LFINTOSC, -40°C  TA  +85°C D015 — 13 28 A 2.3 FOSC = 31kHz, — 15 30 A 3.0 LFINTOSC, -40°C  TA  +85°C — 17 36 A 5.0 D016 — 215 360 A 1.8 FOSC = 500 kHz, — 275 480 A 3.0 HFINTOSC D016 — 270 450 A 2.3 FOSC = 500 kHz, — 300 500 A 3.0 HFINTOSC — 350 620 A 5.0 D017* — 410 660 A 1.8 FOSC = 8MHz, — 630 970 A 3.0 HFINTOSC D017* — 530 750 A 2.3 FOSC = 8MHz, — 660 1100 A 3.0 HFINTOSC — 730 1200 A 5.0 D018 — 600 940 A 1.8 FOSC = 16MHz, — 970 1400 A 3.0 HFINTOSC D018 — 780 1200 A 2.3 FOSC = 16MHz, HFINTOSC — 1000 1550 A 3.0 — 1090 1700 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. DS40001607D-page 270  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 28-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC16LF1503 Standard Operating Conditions (unless otherwise stated) PIC16F1503 Conditions Param. Device Min. Typ† Max. Units No. Characteristics VDD Note D019C — 1030 1500 A 3.0 FOSC = 20 MHz, External Clock (ECH), High-Power mode D019C — 1060 1600 A 3.0 FOSC = 20 MHz, — 1220 1800 A 5.0 External Clock (ECH), High-Power mode D019A — 6 16 A 1.8 FOSC = 32 kHz, — 8 22 A 3.0 External Clock (ECL), Low-Power mode D019A — 13 28 A 2.3 FOSC = 32 kHz, — 15 31 A 3.0 External Clock (ECL), Low-Power mode — 16 36 A 5.0 D019B — 19 35 A 1.8 FOSC = 500 kHz, External Clock (ECL), — 32 55 A 3.0 Low-Power mode D019B — 31 52 A 2.3 FOSC = 500 kHz, — 38 65 A 3.0 External Clock (ECL), Low-Power mode — 44 74 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.  2011-2015 Microchip Technology Inc. DS40001607D-page 271

PIC16(L)F1503 TABLE 28-3: POWER-DOWN CURRENTS (IPD)(1,2) Operating Conditions: (unless otherwise stated) PIC16LF1503 Low-Power Sleep Mode PIC16F1503 Low-Power Sleep Mode, VREGPM = 1 Conditions Param. Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note D022 Base IPD — 0.020 1.0 8.0 A 1.8 WDT, BOR, FVR and SOSC — 0.025 2.0 9.0 A 3.0 disabled, all Peripherals inactive D022 Base IPD — 0.25 3.0 10 A 2.3 WDT, BOR, FVR and SOSC — 0.30 4.0 12 A 3.0 disabled, all Peripherals inactive, Low-Power Sleep mode — 0.40 6.0 15 A 5.0 D022A Base IPD — 9.8 16 18 A 2.3 WDT, BOR, FVR and SOSC — 10.3 18 20 A 3.0 disabled, all Peripherals inactive, Normal-Power Sleep mode, — 11.5 21 26 A 5.0 VREGPM = 0 D023 — 0.26 2.0 9.0 A 1.8 WDT Current — 0.44 3.0 10 A 3.0 D023 — 0.43 6.0 15 A 2.3 WDT Current — 0.53 7.0 20 A 3.0 — 0.64 8.0 22 A 5.0 D023A — 15 28 30 A 1.8 FVR Current — 18 30 33 A 3.0 D023A — 18 33 35 A 2.3 FVR Current — 19 35 37 A 3.0 — 20 37 39 A 5.0 D024 — 6.0 17 20 A 3.0 BOR Current D024 — 7.0 17 30 A 3.0 BOR Current — 8.0 20 40 A 5.0 D24A — 0.1 4.0 10 A 3.0 LPBOR Current D24A — 0.35 5.0 14 A 3.0 LPBOR Current — 0.45 8.0 17 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral  current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. 3: ADC clock source is FRC. DS40001607D-page 272  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 28-3: POWER-DOWN CURRENTS (IPD)(1,2) (CONTINUED) Operating Conditions: (unless otherwise stated) PIC16LF1503 Low-Power Sleep Mode PIC16F1503 Low-Power Sleep Mode, VREGPM = 1 Conditions Param. Max. Max. Device Characteristics Min. Typ† Units No. +85°C +125°C VDD Note D026 — 0.11 1.5 9.0 A 1.8 ADC Current (Note 3), — 0.12 2.7 12 A 3.0 No conversion in progress D026 — 0.30 4.0 11 A 2.3 ADC Current (Note 3), — 0.35 5.0 13 A 3.0 No conversion in progress — 0.45 8.0 16 A 5.0 D026A* — 250 — — A 1.8 ADC Current (Note 3), — 250 — — A 3.0 Conversion in progress D026A* — 280 — — A 2.3 ADC Current (Note 3), — 280 — — A 3.0 Conversion in progress — 280 — — A 5.0 D027 — 7 22 25 A 1.8 Comparator, — 8 23 27 A 3.0 CxSP = 0 D027 — 17 35 37 A 2.3 Comparator, — 18 37 38 A 3.0 CxSP = 0 — 19 38 40 A 5.0 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral  current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. 3: ADC clock source is FRC.  2011-2015 Microchip Technology Inc. DS40001607D-page 273

PIC16(L)F1503 TABLE 28-4: I/O PORTS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. VIL Input Low Voltage I/O PORT: D030 with TTL buffer — — 0.8 V 4.5V  VDD  5.5V D030A — — 0.15VDD V 1.8V  VDD  4.5V D031 with Schmitt Trigger buffer — — 0.2VDD V 2.0V  VDD  5.5V with I2C™ levels — — 0.3VDD V with SMbus levels — — 0.8 V 2.7V  VDD  5.5V D032 MCLR — — 0.2VDD V VIH Input High Voltage I/O PORT: D040 with TTL buffer 2.0 — — V 4.5V  VDD 5.5V D040A 0.25VDD + — — V 1.8V  VDD  4.5V 0.8 D041 with Schmitt Trigger buffer 0.8VDD — — V 2.0V  VDD  5.5V with I2C™ levels 0.7VDD — — V with SMbus levels 2.1 — — V 2.7V  VDD  5.5V D042 MCLR 0.8VDD — — V IIL Input Leakage Current(1) D060 I/O Ports — ± 5 ± 125 nA VSS  VPIN  VDD, Pin at high-impedance, 85°C — ± 5 ± 1000 nA VSS  VPIN  VDD, Pin at high-impedance, 125°C D061 MCLR(2) — ± 50 ± 200 nA VSS  VPIN  VDD, Pin at high-impedance, 85°C IPUR Weak Pull-up Current D070* 25 100 200 A VDD = 3.3V, VPIN = VSS 25 140 300 A VDD = 5.0V, VPIN = VSS VOL Output Low Voltage D080 I/O Ports IOL = 8 mA, VDD = 5V — — 0.6 V IOL = 6 mA, VDD = 3.3V IOL = 1.8 mA, VDD = 1.8V VOH Output High Voltage D090 I/O Ports IOH = 3.5 mA, VDD = 5V VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V IOH = 1 mA, VDD = 1.8V Capacitive Loading Specifications on Output Pins D101A* CIO All I/O pins — — 50 pF * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. DS40001607D-page 274  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 28-5: MEMORY PROGRAMMING SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2) D112 VPBE VDD for Bulk Erase 2.7 — VDDMAX V D113 VPEW VDD for Write or Row Erase VDDMIN — VDDMAX V D114 IPPPGM Current on MCLR/VPP during — 1.0 — mA Erase/Write D115 IDDPGM Current on VDD during — 5.0 — mA Erase/Write Program Flash Memory D121 EP Cell Endurance 10K — — E/W -40C  TA  +85C (Note 1) D122 VPRW VDD for Read/Write VDDMIN — VDDMAX V D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated D125 EHEFC High-Endurance Flash Cell 100K — — E/W 0C  TA  +60°C, lower byte last 128 addresses † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Required only if single-supply programming is disabled. TABLE 28-6: THERMAL CONSIDERATIONS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param Sym. Characteristic Typ. Units Conditions No. TH01 JA Thermal Resistance Junction to Ambient 70 C/W 14-pin PDIP package 95.3 C/W 14-pin SOIC package 100 C/W 14-pin TSSOP package 55.3 C/W 16-pin QFN 3X3X0.9mm package 52.3 C/W 16-pin UQFN 3X3X0.5mm package TH02 JC Thermal Resistance Junction to Case 32.75 C/W 14-pin PDIP package 31 C/W 14-pin SOIC package 24.4 C/W 14-pin TSSOP package 10 C/W 16-pin QFN 3X3X0.9mm package 11 C/W 16-pin UQFN 3X3X0.5mm package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2) Note 1:IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: TJ = Junction Temperature.  2011-2015 Microchip Technology Inc. DS40001607D-page 275

PIC16(L)F1503 28.4 AC Characteristics Timing Parameter Symbology has been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc CLKIN ck CLKOUT rd RD cs CS rw RD or WR di SDIx sc SCKx do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance FIGURE 28-4: LOAD CONDITIONS Rev. 10-000133A 8/1/2013 Load Condition Pin CL VSS Legend: CL=50 pF for all pins DS40001607D-page 276  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-5: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS02 OS12 OS11 OS03 CLKOUT (CLKOUT mode) Note: See Table28-9. TABLE 28-7: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz External Clock (ECL) DC — 4 MHz External Clock (ECM) DC — 20 MHz External Clock (ECH) OS02 TOSC External CLKIN Period(1) 50 —  ns External Clock (EC) OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con- sumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.  2011-2015 Microchip Technology Inc. DS40001607D-page 277

PIC16(L)F1503 TABLE 28-8: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. Freq. Sym. Characteristic Min. Typ† Max. Units Conditions No. Tolerance OS08 HFOSC Internal Calibrated HFINTOSC ±2% — 16.0 — MHz VDD = 3.0V, TA = 25°C, Frequency(1) (Note 2) OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz (Note 3) OS10* TIOSC ST HFINTOSC — — 5 15 s Wake-up from Sleep Start-up Time OS10A* TLFOSC ST LFINTOSC — — 0.5 — ms -40°C  TA  +125°C Wake-up from Sleep Start-up Time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. 2: See Figure28-6: “HFINTOSC Frequency Accuracy over Device VDD and Temperature”, Figure29-60: “HFINTOSC Accuracy Over Temperature, VDD = 1.8V, PIC16LF1503 Only”, and Figure29-61: “HFINTOSC Accuracy Over Temperature, 2.3V  VDD 5.5V”. 3: See Figure29-58: “LFINTOSC Frequency over VDD and Temperature, PIC16LF1503 Only”, and Figure29-59: “LFINTOSC Frequency over VDD and Temperature, PIC16F1503”. FIGURE 28-6: HFINTOSC FREQUENCY ACCURACY OVER VDD AND TEMPERATURE Rev.10-000135A 7/30/2013 125 ±12% 85 -4.5%to+7% C) (° 60 e ur at mper 25 ±4.5% e T 0 ±12% -40 1.8 2.3 5.5 VDD(V) Note: See Figure29-60: “HFINTOSC Accuracy Over Temperature, VDD = 1.8V, PIC16LF1503 Only”, and Figure29-61: “HFINTOSC Accuracy Over Temperature, 2.3V VDD  5.5V”. DS40001607D-page 278  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-7: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS11 OS12 OS20 CLKOUT OS21 OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS15 OS14 I/O pin Old Value New Value (Output) OS18, OS19 TABLE 28-9: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. OS11 TosH2ckL FOSC to CLKOUT(1) — — 70 ns 3.3V  VDD 5.0V OS12 TosH2ckH FOSC to CLKOUT(1) — — 72 ns 3.3V  VDD 5.0V OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns 3.3V  VDD 5.0V OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid 50 — — ns 3.3V  VDD 5.0V (I/O in setup time) OS17 TioV2osH Port input valid to Fosc(Q2 cycle) 20 — — ns (I/O in setup time) OS18* TioR Port output rise time — 40 72 ns VDD = 1.8V — 15 32 3.3V  VDD 5.0V OS19* TioF Port output fall time — 28 55 ns VDD = 1.8V — 15 30 3.3V  VDD 5.0V OS20* Tinp INT pin input high or low time 25 — — ns OS21* Tioc Interrupt-on-change new input level time 25 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC.  2011-2015 Microchip Technology Inc. DS40001607D-page 279

PIC16(L)F1503 FIGURE 28-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note 1:Asserted low. DS40001607D-page 280  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 28-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. 30 TMCL MCLR Pulse Width (low) 2 — — s 31 TWDTLP Low-Power Watchdog Timer 10 16 27 ms VDD = 3.3V-5V, Time-out Period 1:512 Prescaler used 33* TPWRT Power-up Timer Period 40 65 140 ms PWRTE=0 34* TIOZ I/O high-impedance from MCLR Low — — 2.0 s or Watchdog Timer Reset 35 VBOR Brown-out Reset Voltage(1) 2.55 2.70 2.85 V BORV = 0 2.35 2.45 2.58 V BORV = 1 (PIC16F1503) 1.80 1.90 2.05 V BORV = 1 (PIC16LF1503) 36* VHYST Brown-out Reset Hysteresis 0 25 75 mV -40°C  TA  +85°C 37* TBORDC Brown-out Reset DC Response Time 1 16 35 s VDD  VBOR 38 VLPBOR Low-Power Brown-Out Reset Voltage 1.8 2.1 2.5 V LPBOR = 1 * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1F and 0.01F values in parallel are recommended. FIGURE 28-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33 (due to BOR)  2011-2015 Microchip Technology Inc. DS40001607D-page 281

PIC16(L)F1503 FIGURE 28-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 47 49 TMR0 or TMR1 TABLE 28-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* TT0P T0CKI Period Greater of: — — ns N = prescale value 20 or TCY + 40 N 45* TT1H T1CKI High Synchronous, No Prescaler 0.5 TCY + 20 — — ns Time Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 46* TT1L T1CKI Low Synchronous, No Prescaler 0.5 TCY + 20 — — ns Time Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* TT1P T1CKI Input Synchronous Greater of: — — ns N = prescale value Period 30 or TCY + 40 N Asynchronous 60 — — ns 49* TCKEZTMR1 Delay from External Clock Edge to Timer 2 TOSC — 7 TOSC — Timers in Sync Increment mode * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40001607D-page 282  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-11: CLC PROPAGATION TIMING Rev.10-000031A 7/30/2013 CLC LCx_in[n](1) CLC CLC CLCxINn CLCx Inputtime Module LCx_out(1) Outputtime CLC CLC CLC CLCxINn CLCx Inputtime LCx_in[n](1) Module LCx_out(1) Outputtime CLC01 CLC02 CLC03 Note 1: See FIGURE 23-1:, Configurable Logic Cell Block Diagram, to identify specific CLC signals. TABLE 28-12: CONFIGURATION LOGIC CELL (CLC) CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. CLC01* TCLCIN CLC input time — 7 — ns CLC02* TCLC CLC module input to output propagation time — 24 — ns VDD = 1.8V — 12 — ns VDD > 3.6V CLC03* TCLCOUT CLC output time Rise Time — OS18 — — (Note 1) Fall Time — OS19 — — (Note 1) CLC04* FCLCMAX CLC maximum switching frequency — 45 — MHz * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note1:See Table28-9 for OS18 and OS19 rise and fall times.  2011-2015 Microchip Technology Inc. DS40001607D-page 283

PIC16(L)F1503 TABLE 28-13: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. AD01 NR Resolution — — 10 bit AD02 EIL Integral Error — ±1 ±1.7 LSb VREF = 3.0V AD03 EDL Differential Error — ±1 ±1 LSb No missing codes VREF = 3.0V AD04 EOFF Offset Error — ±1 ±2.5 LSb VREF = 3.0V AD05 EGN Gain Error — ±1 ±2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage 1.8 — VDD V VREF = (VRPOS - VRNEG) (Note 4) AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of — — 10 k Can go higher if external 0.01F capacitor is Analog Voltage Source present on input pin. * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1:Total Absolute Error includes integral, differential, offset and gain errors. 2: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes. 3: See Section 29.0“DC and AC Characteristics Graphs and Charts” for operating characterization. 4: ADC VREF is selected by ADPREF<0> bit. DS40001607D-page 284  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-12: ADC CONVERSION TIMING (ADC CLOCK FOSC-BASED) BSF ADCON0, GO 1 TCY AD133 AD131 Q4 AD130 ADC_clk ADC Data 9 8 7 6 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 TCY GO DONE Sampling Stopped AD132 Sample FIGURE 28-13: ADC CONVERSION TIMING (ADC CLOCK FROM FRC) BSF ADCON0, GO AD133 1 TCY AD131 Q4 AD130 ADC_clk ADC Data 9 8 7 6 3 2 1 0 ADRES OLD_DATA NEW_DATA ADIF 1 TCY GO DONE Sampling Stopped AD132 Sample Note 1:If the ADC clock source is selected as FRC, a time of TCY is added before the ADC clock starts. This allows the SLEEP instruction to be executed.  2011-2015 Microchip Technology Inc. DS40001607D-page 285

PIC16(L)F1503 TABLE 28-14: ADC CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. Characteristic Min. Typ† Max. Units Conditions No. AD130* TAD ADC Clock Period (TADC) 1.0 — 6.0 s FOSC-based ADC Internal FRC Oscillator Period (TFRC) 1.0 2.0 6.0 s ADCS<2:0> = x11 (ADC FRC mode) AD131 TCNV Conversion Time — 11 — TAD Set GO/DONE bit to conversion (not including Acquisition Time)(1) complete AD132* TACQ Acquisition Time — 5.0 — s AD133* THCD Holding Capacitor Disconnect Time — 1/2 TAD — FOSC-based — 1/2 TAD + 1TCY — ADCS<2:0> = x11 (ADC FRC mode) * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. TABLE 28-15: COMPARATOR SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. Sym. Characteristics Min. Typ. Max. Units Comments No. CM01 VIOFF Input Offset Voltage — ±7.5 ±60 mV CxSP = 1, VICM = VDD/2 CM02 VICM Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ration — 50 — dB CM04A Response Time Rising Edge — 400 800 ns CxSP = 1 CM04B Response Time Falling Edge — 200 400 ns CxSP = 1 TRESP(2) CM04C Response Time Rising Edge — 1200 — ns CxSP = 0 CM04D Response Time Falling Edge — 550 — ns CxSP = 0 CM05* TMC2OV Comparator Mode Change to — — 10 s Output Valid CM06 CHYSTER Comparator Hysteresis — 25 — mV CxHYS = 1, CxSP = 1 * These parameters are characterized but not tested. Note 1: See Section 29.0“DC and AC Characteristics Graphs and Charts” for operating characterization. 2: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to VDD. DS40001607D-page 286  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 TABLE 28-16: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. Sym. Characteristics Min. Typ. Max. Units Comments No. DAC01* CLSB Step Size — VDD/32 — V DAC02* CACC Absolute Accuracy — —  1/2 LSb DAC03* CR Unit Resistor Value (R) — 5K —  DAC04* CST Settling Time(2) — — 10 s * These parameters are characterized but not tested. Note 1: See Section 29.0“DC and AC Characteristics Graphs and Charts” for operating characterization. 2: Settling time measured while DACR<4:0> transitions from ‘00000’ to ‘01111’.  2011-2015 Microchip Technology Inc. DS40001607D-page 287

PIC16(L)F1503 FIGURE 28-14: SPI MASTER MODE TIMING (CKE=0, SMP = 0) SS SP81 SCK (CKP = 0) SP71 SP72 SP78 SP79 SCK (CKP = 1) SP79 SP78 SP80 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure28-4 for load conditions. FIGURE 28-15: SPI MASTER MODE TIMING (CKE=1, SMP = 1) SS SP81 SCK (CKP = 0) SP71 SP72 SP79 SP73 SCK (CKP = 1) SP80 SP78 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure28-4 for load conditions. DS40001607D-page 288  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-16: SPI SLAVE MODE TIMING (CKE=0) SS SP70 SCK SP83 (CKP = 0) SP71 SP72 SP78 SP79 SCK (CKP = 1) SP79 SP78 SP80 SDO MSb bit 6 - - - - - -1 LSb SP75, SP76 SP77 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure28-4 for load conditions. FIGURE 28-17: SPI SLAVE MODE TIMING (CKE=1) SP82 SS SP70 SCK SP83 (CKP = 0) SP71 SP72 SCK (CKP = 1) SP80 SDO MSb bit 6 - - - - - -1 LSb SP77 SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure28-4 for load conditions.  2011-2015 Microchip Technology Inc. DS40001607D-page 289

PIC16(L)F1503 TABLE 28-17: SPI MODE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Symbol Characteristic Min. Typ† Max. Units Conditions No. SP70* TSSL2SCH, SS to SCK or SCK input 2.25 TCY — — ns TSSL2SCL SP71* TSCH SCK input high time (Slave mode) 1 TCY + 20 — — ns SP72* TSCL SCK input low time (Slave mode) 1 TCY + 20 — — ns SP73* TDIV2SCH, Setup time of SDI data input to SCK 100 — — ns TDIV2SCL edge SP74* TSCH2DIL, Hold time of SDI data input to SCK 100 — — ns TSCL2DIL edge SP75* TDOR SDO data output rise time — 10 25 ns 3.0V  VDD  5.5V — 25 50 ns 1.8V  VDD  5.5V SP76* TDOF SDO data output fall time — 10 25 ns SP77* TSSH2DOZ SS to SDO output high-impedance 10 — 50 ns SP78* TSCR SCK output rise time — 10 25 ns 3.0V  VDD  5.5V (Master mode) — 25 50 ns 1.8V  VDD  5.5V SP79* TSCF SCK output fall time (Master mode) — 10 25 ns SP80* TSCH2DOV, SDO data output valid after SCK — — 50 ns 3.0V  VDD  5.5V TSCL2DOV edge — — 145 ns 1.8V  VDD  5.5V SP81* TDOV2SCH, SDO data output setup to SCK edge 1 Tcy — — ns TDOV2SCL SP82* TSSL2DOV SDO data output valid after SS — — 50 ns edge SP83* TSCH2SSH, SS after SCK edge 1.5 TCY + 40 — — ns TSCL2SSH * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40001607D-page 290  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 28-18: I2C BUS START/STOP BITS TIMING SCL SP91 SP93 SP90 SP92 SDA Start Stop Condition Condition Note: Refer to Figure28-4 for load conditions. TABLE 28-18: I2C BUS START/STOP BITS REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Symbol Characteristic Min. Typ Max. Units Conditions No. SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated Setup time 400 kHz mode 600 — — Start condition SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first Hold time 400 kHz mode 600 — — clock pulse is generated SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — SP93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — * These parameters are characterized but not tested. FIGURE 28-19: I2C BUS DATA TIMING SP103 SP100 SP102 SP101 SCL SP90 SP106 SP107 SP91 SP92 SDA In SP110 SP109 SP109 SDA Out Note: Refer to Figure28-4 for load conditions.  2011-2015 Microchip Technology Inc. DS40001607D-page 291

PIC16(L)F1503 I2C BUS DATA REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Symbol Characteristic Min. Max. Units Conditions No. SP100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s Device must operate at a minimum of 10 MHz SSP module 1.5TCY — SP101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s Device must operate at a minimum of 10 MHz SSP module 1.5TCY — SP102* TR SDA and SCL rise 100 kHz mode — 1000 ns time 400 kHz mode 20 + 0.1CB 300 ns CB is specified to be from 10-400 pF SP103* TF SDA and SCL fall 100 kHz mode — 250 ns time 400 kHz mode 20 + 0.1CB 250 ns CB is specified to be from 10-400 pF SP106* THD:DAT Data input hold time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s SP107* TSU:DAT Data input setup 100 kHz mode 250 — ns (Note 2) time 400 kHz mode 100 — ns SP109* TAA Output valid from 100 kHz mode — 3500 ns (Note 1) clock 400 kHz mode — — ns SP110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free before a new transmission 400 kHz mode 1.3 — s can start SP111 CB Bus capacitive loading — 400 pF * These parameters are characterized but not tested. Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system, but the requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line TR max. + TSU:DAT=1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. DS40001607D-page 292  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 29.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.” represents (mean+3) or (mean-3) respectively, where  is a standard deviation, over each temperature range.  2011-2015 Microchip Technology Inc. DS40001607D-page 293

PIC16(L)F1503 FIGURE 29-1: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz, PIC16LF1503 ONLY 14 Max. 12 10 Typical 8 A) µ ( D D 6 I 4 Max: 85°C + 3(cid:305) 2 Typical: 25°C 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-2: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz, PIC16F1503 ONLY 25 Max. 20 Typical A) 15 µ ( D D I 10 Max: 85°C + 3(cid:305) 5 Typical: 25°C 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001607D-page 294  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-3: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz, PIC16LF1503 ONLY 50 45 Max: 85°C + 3(cid:305) Typical: 25°C 40 Max. 35 30 A) Typical µ 25 ( D D I 20 15 10 5 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-4: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz, PIC16F1503 ONLY 60 Max. 50 40 Typical A) µ ( D 30 D I 20 Max: 85°C + 3(cid:305) 10 Typical: 25°C 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 295

PIC16(L)F1503 FIGURE 29-5: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE, PIC16LF1503 ONLY 300 250 Typical: 25°C 4 MHz 200 A) µ 150 ( D D I 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-6: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE, PIC16LF1503 ONLY 350 300 Max: 85°C + 3(cid:305) 250 4 MHz A) 200 µ ( D D 150 I 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) DS40001607D-page 296  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-7: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE, PIC16F1503 ONLY 350 4 MHz 300 Typical: 25°C 250 A) 200 µ ( D D I 150 1 MHz 100 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-8: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE, PIC16F1503 ONLY 400 4 MHz 350 Max: 85°C + 3(cid:305) 300 250 A) µ ( 200 D D I 1 MHz 150 100 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 297

PIC16(L)F1503 FIGURE 29-9: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE, PIC16LF1503 ONLY 1.4 20 MHz 1.2 Typical: 25°C 1.0 16 MHz A) 0.8 m ( D D 0.6 I 8 MHz 0.4 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-10: IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE, PIC16LF1503 ONLY ( ) 1.6 20 MHz 1.4 Max: 85°C + 3(cid:305) 1.2 16 MHz 1.0 A) m 0.8 ( D D 8 MHz I 0.6 0.4 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) DS40001607D-page 298  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-11: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE, PIC16F1503 ONLY 1.4 20 MHz 1.2 Typical: 25°C 16 MHz 1.0 0.8 A) m ( 8 MHz D 0.6 D I 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-12: IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE, PIC16F1503 ONLY 1.6 20 MHz Max: 85°C + 3(cid:305) 1.4 1.2 16 MHz 1.0 A) m 0.8 ( 8 MHz D D I 0.6 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 299

PIC16(L)F1503 FIGURE 29-13: IDD, LFINTOSC, FOSC = 31 kHz, PIC16LF1503 ONLY 12 Max. Max: 85°C + 3(cid:305) 10 Typical: 25°C 8 A) µ ( D 6 Typical D I 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-14: IDD, LFINTOSC, FOSC = 31 kHz, PIC16F1503 ONLY 25 Max. 20 Typical A) 15 µ ( D D I 10 Max: 85°C + 3(cid:305) 5 Typical: 25°C 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001607D-page 300  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-15: IDD, MFINTOSC, FOSC = 500 kHz, PIC16LF1503 ONLY 400 Max: 85°C + 3(cid:305) 350 Typical: 25°C Max. 300 250 Typical A) µ 200 ( D D I 150 100 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-16: IDD, MFINTOSC, FOSC = 500 kHz, PIC16F1503 ONLY 450 Max: 85°C + 3(cid:305) Max. 400 Typical: 25°C 350 Typical 300 A) 250 µ ( D D 200 I 150 100 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 301

PIC16(L)F1503 FIGURE 29-17: IDD TYPICAL, HFINTOSC, PIC16LF1503 ONLY 1.4 Typical: 25°C 1.2 16 MHz 1.0 A) 0.8 m 8 MHz ( D D 0.6 I 4 MHz 0.4 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-18: IDD MAXIMUM, HFINTOSC, PIC16LF1503 ONLY 1.6 1.4 Max: 85°C + 3(cid:305) 16 MHz 1.2 1.0 A) 8 MHz m ( 0.8 D D I 4 MHz 0.6 0.4 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) DS40001607D-page 302  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-19: IDD TYPICAL, HFINTOSC, PIC16F1503 ONLY 1.2 1.0 16 MHz 0.8 A) 8 MHz m 0.6 ( D D I 4 MHz 0.4 0.2 Typical: 25°C 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-20: IDD MAXIMUM, HFINTOSC, PIC16F1503 ONLY 1.4 1.2 16 MHz 1.0 A) 0.8 8 MHz m ( D 0.6 D I 4 MHz 0.4 0.2 Max: 85°C + 3(cid:305) 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 303

PIC16(L)F1503 FIGURE 29-21: IPD BASE, LOW-POWER SLEEP MODE, PIC16LF1503 ONLY 445500 MMax: 8855°°CC + 33(cid:305) 400 Typical: 25°C Max. 350 300 A)A) 225500 nn (( DD P 200 I 150 100 Typical 50 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 29-22: IPD BASE, LOW-POWER SLEEP MODE, VREGPM = 1, PIC16F1503 ONLY 660000 MMaaxx.. Max: 85°C + 3(cid:305) 500 Typical: 25°C 400 A)A) nn (( 330000 DD PP I Typical 200 100 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001607D-page 304  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-23: IPD, WATCHDOG TIMER (WDT), PIC16LF1503 ONLY 22..00 1.8 Max: 85°C + 3(cid:305) Typical: 25°C 1.6 Max. 1.4 1.2 A)A µµ 11..00 (( DD IIPP 00.88 0.6 Typical 0.4 00..22 00..00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 29-24: IPD, WATCHDOG TIMER (WDT), PIC16F1503 ONLY 11..44 MMaaxx. 1.2 1.0 A)A 0.8 µµ (( TTyyppiiccaall DD IIPP 00..66 0.4 Max: 85°C + 3(cid:305) 0.2 Typical: 25°C 00..00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 305

PIC16(L)F1503 FIGURE 29-25: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16LF1503 ONLY 4455 MMaaxx:: 8855°°CC ++ 33(cid:305)(cid:305) 40 Typical: 25°C 35 Max. 30 Typical A)A 25 µµ (( DD 2200 PP II 15 10 5 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 29-26: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16F1503 ONLY 3300 Max. 25 20 A) Typical µµ (( 1155 DD PP II 10 Max: 85°C + 3(cid:305) 5 Typical: 25°C 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001607D-page 306  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-27: IPD, BROWN-OUT RESET (BOR), BORV = 0, PIC16LF1503 ONLY 1100 MMaaxx.. 9 Max: 85°C + 3(cid:305) 8 Typical: 25°C 7 Typical 6 A)A) 55 µµ (( DD 44 P I 3 2 11 00 11.66 11.88 22.00 22.22 22.44 22.66 22.88 33.00 33.22 33.44 33.66 33.88 VDD(V) FIGURE 29-28: IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC16LF1503 ONLY 1122 Max. Max: 85°C + 3(cid:305) 10 Typical: 25°C 8 TTyyppiiccaall A)A) 66 µµ ( D P I 4 2 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 307

PIC16(L)F1503 FIGURE 29-29: IPD, BROWN-OUT RESET (BOR), BORV = 0, PIC16F1503 ONLY 1122 MMax. Max: 85°C + 3(cid:305) 10 Typical: 25°C 8 Typical A)A) 66 µµ (( DD PP II 4 2 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) FIGURE 29-30: IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC16F1503 ONLY 1144 MMaaxx. 12 Max: 85°C + 3(cid:305) Typical: 25°C 10 Typical 8 A)A) µµ (( DD 66 PP II 4 2 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001607D-page 308  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-31: IPD, COMPARATOR, LOW-POWER MODE (CxSP = 0), PIC16LF1503 ONLY 1144 12 Max. 10 A) 8 µ ( DD PP TTyyppiiccaall II 66 4 Max: 85°C + 3(cid:305) 2 Typical: 25°C 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 29-32: IPD, COMPARATOR, LOW-POWER MODE (CxSP = 0), PIC16F1503 ONLY 3300 25 Max. 20 A) Tyyppical µµ (( 1155 DD PP II 10 5 Max: 85°C + 3(cid:305) Typical: 25°C 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 309

PIC16(L)F1503 FIGURE 29-33: IPD, COMPARATOR, NORMAL POWER MODE (CxSP = 1), PIC16LF1503 ONLY 4400 35 Max. 30 25 A)A ((µµ 2200 TTyyppiiccaall DD PP II 1155 10 Max: 85°C + 3(cid:305) 5 TTyyppiiccaall:: 2255°CC 00 11..66 11..88 22..00 22..22 22..44 22..66 22..88 33..00 33..22 33..44 33..66 33..88 VDD(V) FIGURE 29-34: IPD, COMPARATOR, NORMAL POWER MODE (CxSP = 1), PIC16F1503 ONLY 6600 50 Max. 40 A)A µµ 3300 (( TTyyppiiccaall DD PP II 20 Max: 85°C + 3(cid:305) 10 Typical: 25°C 00 22..00 22..55 33..00 33..55 44..00 44..55 55..00 55..55 66..00 VDD(V) DS40001607D-page 310  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-35: VOH vs. IOH OVER TEMPERATURE, VDD = 5.5V, PIC16F1503 ONLY 6 Max: 125°C+ 3(cid:305) 5 Typical: 25°C Min: -40°C-3(cid:305) 4 V) Min. (-40°C) (H 3 O V Typical (25°C) 2 Max. (125°C) 1 0 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 IOH(mA) FIGURE 29-36: VOL vs. IOL OVER TEMPERATURE, VDD = 5.5V, PIC16F1503 ONLY 5 Max: 125°C+ 3(cid:305) Max. (125°C) 4 Typical: 25°C Min: -40°C-3(cid:305) Typical (25°C) 3 V) ( L O V Min. (-40°C) 2 1 0 0 10 20 30 40 50 60 70 80 90 100 IOL(mA)  2011-2015 Microchip Technology Inc. DS40001607D-page 311

PIC16(L)F1503 FIGURE 29-37: VOH vs. IOH OVER TEMPERATURE, VDD = 3.0V 3.5 Max: 125°C+ 3(cid:305) 3.0 Typical: 25°C Min: -40°C-3(cid:305) 2.5 V) 2.0 ( H O V 1.5 1.0 Min. (-40°C) Typical (25°C) Max. (125°C) 0.5 0.0 -15 -13 -11 -9 -7 -5 -3 -1 IOH(mA) FIGURE 29-38: VOL vs. IOL OVER TEMPERATURE, VDD = 3.0V 3.0 Max: 125°C+ 3(cid:305) 2.5 Typical: 25°C Min: -40°C-3(cid:305) 2.0 V) Max. (125°C) Typical (25°C) Min. (-40°C) ( 1.5 L O V 1.0 0.5 0.0 0 5 10 15 20 25 30 35 40 IOL(mA) DS40001607D-page 312  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-39: VOH vs. IOH OVER TEMPERATURE, VDD = 1.8V, PIC16LF1503 ONLY 2.0 1.8 Max: 125°C+ 3(cid:305) Typical: 25°C 1.6 Min: -40°C-3(cid:305) 1.4 1.2 V) Min. (-40°C) Typical (25°C) Max. (125°C) (H 1.0 O V 0.8 0.6 0.4 0.2 0.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 IOH(mA) FIGURE 29-40: VOL vs. IOL OVER TEMPERATURE, VDD = 1.8V, PIC16LF1503 ONLY 1.8 1.6 Max: 125°C+ 3(cid:305) Typical: 25°C 1.4 Min: -40°C-3(cid:305) 1.2 V) 1.0 ( L O V 0.8 Max. (125°C) Typical (25°C) Min. (-40°C) 0.6 0.4 0.2 0.0 0 1 2 3 4 5 6 7 8 9 10 IOL(mA)  2011-2015 Microchip Technology Inc. DS40001607D-page 313

PIC16(L)F1503 FIGURE 29-41: POR RELEASE VOLTAGE 1.70 1.68 Max. 1.66 1.64 Typical ) 1.62 V ge ( 1.60 Min. a t ol 1.58 V 1.56 1.54 Max: Typical + 3(cid:305) Typical: 25°C 1.52 Min: Typical -3(cid:305) 1.50 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-42: POR REARM VOLTAGE, PIC16F1503 ONLY 1.54 1.52 Max: Typical + 3(cid:305) Typical: 25°C 1.50 Min: Typical -3(cid:305) Max. 1.48 ) 1.46 V e ( g 1.44 a Typical t ol 1.42 V 1.40 Min. 1.38 1.36 1.34 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS40001607D-page 314  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-43: BROWN-OUT RESET VOLTAGE, BORV = 1, PIC16LF1503 ONLY 2.00 Max. 1.95 ) V ge ( 1.90 Typical a t ol V 1.85 Min. Max: Typical + 3(cid:305) Min: Typical -3(cid:305) 1.80 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-44: BROWN-OUT RESET HYSTERESIS, BORV = 1, PIC16LF1503 ONLY 60 50 Max. Max: Typical + 3(cid:305) 40 Typical: 25°C Min: Typical -3(cid:305) ) V m Typical e ( 30 g a t ol V 20 Min. 10 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C)  2011-2015 Microchip Technology Inc. DS40001607D-page 315

PIC16(L)F1503 FIGURE 29-45: BROWN-OUT RESET VOLTAGE, BORV = 1, PIC16F1503 ONLY 2.60 2.55 Max. 2.50 ) Typical V ge ( 2.45 a t ol V Min. 2.40 Max: Typical + 3(cid:305) 2.35 Min: Typical -3(cid:305) 2.30 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-46: BROWN-OUT RESET HYSTERESIS, BORV = 1, PIC16F1503 ONLY 70 Max. 60 Max: Typical + 3(cid:305) 50 Typical: 25°C Min: Typical -3(cid:305) ) V 40 m Typical e ( g a 30 t ol V 20 Min. 10 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS40001607D-page 316  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-47: BROWN-OUT RESET VOLTAGE, BORV = 0 2.80 2.75 Max. ) 2.70 V e ( Typical g a t ol 2.65 V Min. Max: Typical + 3(cid:305) 2.60 Min: Typical -3(cid:305) 2.55 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C)  2011-2015 Microchip Technology Inc. DS40001607D-page 317

PIC16(L)F1503 FIGURE 29-48: LOW-POWER BROWN-OUT RESET VOLTAGE, LPBOR = 0 2.50 Max. Max: Typical + 3(cid:305) 2.40 Min: Typical -3(cid:305) 2.30 Typical ) V 2.20 e ( g a olt 2.10 V 2.00 Min. 1.90 1.80 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-49: LOW-POWER BROWN-OUT RESET HYSTERESIS, LPBOR = 0 45 40 Max: Typical + 3(cid:305) Max. Typical: 25°C 35 Min: Typical -3(cid:305) Typical 30 ) V m 25 Min. e ( g 20 a t ol V 15 10 5 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS40001607D-page 318  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-50: WDT TIME-OUT PERIOD 24 22 Max. 20 ) s 18 m Typical e ( m 16 Ti Min. 14 Max: Typical + 3(cid:305)(-40°C to +125°C) 12 Typical: statistical mean @ 25°C Min: Typical -3(cid:305)(-40°C to +125°C) 10 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-51: PWRT PERIOD 100 Max: Typical + 3(cid:305)(-40°C to +125°C) Typical: statistical mean @ 25°C 90 Min: Typical -3(cid:305)(-40°C to +125°C) Max. 80 ) s m e ( 70 Typical m Ti 60 Min. 50 40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 319

PIC16(L)F1503 FIGURE 29-52: FVR STABILIZATION PERIOD 60 Max: Typical + 3(cid:305) 50 Typical: statistical mean @ 25°C Max. 40 ) Typical s u e ( 30 m Ti 20 Note: The FVR Stabilization Period applies when: 1) coming out of RESET or exiting Sleep mode for PIC12/16LFxxxx devices. 10 2) when exiting sleep mode with VREGPM = 1for PIC12/16Fxxxx devices In all other cases, the FVR is stable when released from RESET. 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) DS40001607D-page 320  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-53: COMPARATOR HYSTERESIS, NORMAL POWER MODE (CxSP = 1, CxHYS = 1) 40 35 Max. 30 ) V m 25 ( Typical s si 20 e r e t ys 15 H Min. 10 Max: Typical + 3(cid:305) Typical: 25°C 5 Min: Typical -3(cid:305) 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-54: COMPARATOR HYSTERESIS, LOW-POWER MODE (CxSP = 0, CxHYS = 1) 8 7 Max. 6 ) V m 5 ( Typical s si 4 e r e t s 3 y H 2 Max: Typical + 3(cid:305) Min. 1 Typical: 25°C Min: Typical -3(cid:305) 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 321

PIC16(L)F1503 FIGURE 29-55: COMPARATOR RESPONSE TIME, NORMAL POWER MODE (CxSP = 1) 350 300 250 Max. s) 200 n e ( Typical m 150 Ti 100 Max: Typical + 3(cid:305) 50 Typical: 25°C 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-56: COMPARATOR RESPONSE TIME OVER TEMPERATURE, NORMAL POWER MODE (CxSP = 1) 400 350 Max: 125°C+ 3(cid:305) Typical: 25°C 300 Min: -45°C-3(cid:305) 250 ) ns Max. (125°C) e ( 200 m Ti 150 Typical (25°C) 100 Min. (-40°C) 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001607D-page 322  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-57: COMPARATOR INPUT OFFSET AT 25°C, NORMAL POWER MODE (CxSP = 1), PIC16F1503 ONLY 50 40 30 Max. 20 ) V 10 m Typical e ( 0 g ta Min. ol -10 V et -20 s f Of -30 Max: Typical + 3(cid:305) Typical: 25°C -40 Min: Typical -3(cid:305) -50 0.0 1.0 2.0 3.0 4.0 5.0 Common Mode Voltage (V)  2011-2015 Microchip Technology Inc. DS40001607D-page 323

PIC16(L)F1503 FIGURE 29-58: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC16LF1503 ONLY 36 34 Max. 32 30 ) Typical z H (k 28 y c n e 26 Min. u q e Fr 24 Max: Typical + 3(cid:305)(-40°C to +125°C) 22 Typical: statistical mean @ 25°C Min: Typical -3(cid:305)(-40°C to +125°C) 20 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) FIGURE 29-59: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC16F1503 ONLY 36 34 Max. 32 30 z) Typical H k ( 28 y c n ue 26 Min. q e r F 24 Max: Typical + 3(cid:305)(-40°C to +125°C) 22 Typical: statistical mean @ 25°C Min: Typical -3(cid:305)(-40°C to +125°C) 20 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) DS40001607D-page 324  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-60: HFINTOSC ACCURACY OVER TEMPERATURE, VDD = 1.8V, PIC16LF1503 ONLY 8% 6% Max: Typical + 3(cid:305) Typical: statistical mean Max. 4% Min: Typical -3(cid:305) 2% %) ( cy 0% Typical a r u -2% c c A -4% -6% Min. -8% -10% -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-61: HFINTOSC ACCURACY OVER TEMPERATURE, 2.3V  VDD 5.5V 8% 6% Max: Typical + 3(cid:305) Typical: statistical mean 4% Min: Typical -3(cid:305) Max. %) 2% ( Typical y c 0% a r u c -2% Min. c A -4% -6% -8% -10% -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C)  2011-2015 Microchip Technology Inc. DS40001607D-page 325

PIC16(L)F1503 FIGURE 29-62: SLEEP MODE, WAKE PERIOD WITH HFINTOSC SOURCE, PIC16LF1503 ONLY 5.0 4.5 Max. 4.0 3.5 Typical ) 3.0 s u e ( 2.5 m Ti 2.0 1.5 Max: 85°C + 3(cid:305) 1.0 Typical: 25°C 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD(V) DS40001607D-page 326  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 FIGURE 29-63: LOW-POWER SLEEP MODE, WAKE PERIOD WITH HFINTOSC SOURCE, VREGPM = 1, PIC16F1503 ONLY 35 Max. 30 Typical 25 ) s 20 u e ( m Ti 15 10 5 Max: 85°C + 3(cid:305) Typical: 25°C 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 29-64: SLEEP MODE, WAKE PERIOD WITH HFINTOSC SOURCE, VREGPM = 0, PIC16F1503 ONLY 12 Max. 10 8 ) s Typical u e ( 6 m Ti 4 2 Max: 85°C + 3(cid:305) Typical: 25°C 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V)  2011-2015 Microchip Technology Inc. DS40001607D-page 327

PIC16(L)F1503 30.0 DEVELOPMENT SUPPORT 30.1 MPLAB X Integrated Development Environment Software The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range The MPLAB X IDE is a single, unified graphical user of software and hardware development tools: interface for Microchip and third-party software, and • Integrated Development Environment hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, - MPLAB® X IDE Software MPLAB X IDE is an entirely new IDE with a host of free • Compilers/Assemblers/Linkers software components and plug-ins for high- - MPLAB XC Compiler performance application development and debugging. - MPASMTM Assembler Moving between tools and upgrading from software - MPLINKTM Object Linker/ simulators to hardware debugging and programming MPLIBTM Object Librarian tools is simple with the seamless user interface. - MPLAB Assembler/Linker/Librarian for With complete project management, visual call graphs, Various Device Families a configurable watch window and a feature-rich editor • Simulators that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new - MPLAB X SIM Software Simulator users. With the ability to support multiple tools on • Emulators multiple projects with simultaneous debugging, MPLAB - MPLAB REAL ICE™ In-Circuit Emulator X IDE is also suitable for the needs of experienced • In-Circuit Debuggers/Programmers users. - MPLAB ICD 3 Feature-Rich Editor: - PICkit™ 3 • Color syntax highlighting • Device Programmers • Smart code completion makes suggestions and - MPLAB PM3 Device Programmer provides hints as you type • Low-Cost Demonstration/Development Boards, • Automatic code formatting based on user-defined Evaluation Kits and Starter Kits rules • Third-party development tools • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • Multiple projects • Multiple tools • Multiple configurations • Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker DS40001607D-page 328  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 30.2 MPLAB XC Compilers 30.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU The MPLINK Object Linker combines relocatable and DSC devices. These compilers provide powerful objects created by the MPASM Assembler. It can link integration capabilities, superior code optimization and relocatable objects from precompiled libraries, using ease of use. MPLAB XC Compilers run on Windows, directives from a linker script. Linux or MAC OS X. The MPLIB Object Librarian manages the creation and For easy source level debugging, the compilers provide modification of library files of precompiled code. When debug information that is optimized to the MPLAB X a routine from a library is called from a source file, only IDE. the modules that contain that routine will be linked in The free MPLAB XC Compiler editions support all with the application. This allows large libraries to be devices and commands, with no time or memory used efficiently in many different applications. restrictions, and offer sufficient code optimization for The object linker/library features include: most applications. • Efficient linking of single libraries instead of many MPLAB XC Compilers include an assembler, linker and smaller files utilities. The assembler generates relocatable object • Enhanced code maintainability by grouping files that can then be archived or linked with other relo- related modules together catable object files and archives to create an execut- • Flexible creation of libraries with easy module able file. MPLAB XC Compiler uses the assembler to listing, replacement, deletion and extraction produce its object file. Notable features of the assem- bler include: 30.5 MPLAB Assembler, Linker and • Support for the entire device instruction set Librarian for Various Device • Support for fixed-point and floating-point data Families • Command-line interface • Rich directive set MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, • Flexible macro language PIC32 and dsPIC DSC devices. MPLAB XC Compiler • MPLAB X IDE compatibility uses the assembler to produce its object file. The assembler generates relocatable object files that can 30.3 MPASM Assembler then be archived or linked with other relocatable object files and archives to create an executable file. Notable The MPASM Assembler is a full-featured, universal features of the assembler include: macro assembler for PIC10/12/16/18 MCUs. • Support for the entire device instruction set The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX • Support for fixed-point and floating-point data files, MAP files to detail memory usage and symbol • Command-line interface reference, absolute LST files that contain source lines • Rich directive set and generated machine code, and COFF files for • Flexible macro language debugging. • MPLAB X IDE compatibility The MPASM Assembler features include: • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process  2011-2015 Microchip Technology Inc. DS40001607D-page 329

PIC16(L)F1503 30.6 MPLAB X SIM Software Simulator 30.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulat- The MPLAB ICD 3 In-Circuit Debugger System is ing the PIC MCUs and dsPIC DSCs on an instruction Microchip’s most cost-effective, high-speed hardware level. On any given instruction, the data areas can be debugger/programmer for Microchip Flash DSC and examined or modified and stimuli can be applied from MCU devices. It debugs and programs PIC Flash a comprehensive stimulus controller. Registers can be microcontrollers and dsPIC DSCs with the powerful, logged to files for further run-time analysis. The trace yet easy-to-use graphical user interface of the MPLAB buffer and logic analyzer display extend the power of IDE. the simulator to record and track program execution, The MPLAB ICD 3 In-Circuit Debugger probe is actions on I/O, most peripherals and internal registers. connected to the design engineer’s PC using a high- The MPLAB X SIM Software Simulator fully supports speed USB 2.0 interface and is connected to the target symbolic debugging using the MPLAB XCCompilers, with a connector compatible with the MPLAB ICD 2 or and the MPASM and MPLAB Assemblers. The soft- MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 ware simulator offers the flexibility to develop and supports all MPLAB ICD 2 headers. debug code outside of the hardware laboratory envi- ronment, making it an excellent, economical software 30.9 PICkit 3 In-Circuit Debugger/ development tool. Programmer 30.7 MPLAB REAL ICE In-Circuit The MPLAB PICkit 3 allows debugging and program- Emulator System ming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user The MPLAB REAL ICE In-Circuit Emulator System is interface of the MPLAB IDE. The MPLAB PICkit 3 is Microchip’s next generation high-speed emulator for connected to the design engineer’s PC using a full- Microchip Flash DSC and MCU devices. It debugs and speed USB interface and can be connected to the tar- programs all 8, 16 and 32-bit MCU, and DSC devices get via a Microchip debug (RJ-11) connector (compati- with the easy-to-use, powerful graphical user interface of ble with MPLAB ICD 3 and MPLAB REAL ICE). The the MPLAB X IDE. connector uses two device I/O pins and the Reset line The emulator is connected to the design engineer’s to implement in-circuit debugging and In-Circuit Serial PC using a high-speed USB 2.0 interface and is Programming™ (ICSP™). connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) 30.10 MPLAB PM3 Device Programmer or with the new high-speed, noise tolerant, Low- The MPLAB PM3 Device Programmer is a universal, Voltage Differential Signal (LVDS) interconnection CE compliant device programmer with programmable (CAT5). voltage verification at VDDMIN and VDDMAX for The emulator is field upgradable through future firmware maximum reliability. It features a large LCD display downloads in MPLAB X IDE. MPLAB REAL ICE offers (128 x 64) for menus and error messages, and a mod- significant advantages over competitive emulators ular, detachable socket assembly to support various including full-speed emulation, run-time variable package types. The ICSP cable assembly is included watches, trace analysis, complex breakpoints, logic as a standard item. In Stand-Alone mode, the MPLAB probes, a ruggedized probe interface and long (up to PM3 Device Programmer can read, verify and program three meters) interconnection cables. PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS40001607D-page 330  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 30.11 Demonstration/Development 30.12 Third-Party Development Tools Boards, Evaluation Kits, and Microchip also offers a great collection of tools from Starter Kits third-party vendors. These tools are carefully selected to offer good value and unique functionality. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC • Device Programmers and Gang Programmers DSCs allows quick application development on fully from companies, such as SoftLog and CCS functional systems. Most boards include prototyping • Software Tools from companies, such as Gimpel areas for adding custom circuitry and provide applica- and Trace Systems tion firmware and source code for examination and • Protocol Analyzers from companies, such as modification. Saleae and Total Phase The boards support a variety of features, including LEDs, • Demonstration Boards from companies, such as temperature sensors, switches, speakers, RS-232 MikroElektronika, Digilent® and Olimex interfaces, LCD displays, potentiometers and additional • Embedded Ethernet Solutions from companies, EEPROM memory. such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstra- tion software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2011-2015 Microchip Technology Inc. DS40001607D-page 331

PIC16(L)F1503 31.0 PACKAGING INFORMATION 31.1 Package Marking Information 14-Lead PDIP Example XXXXXXXXXXXXXX PIC16F1503 XXXXXXXXXXXXXX -I/P e3 YYWWNNN 1110017 14-Lead SOIC (.150”) Example XXXXXXXXXXX PIC16F1503 XXXXXXXXXXX -I/SLe3 YYWWNNN 1110017 14-Lead TSSOP Example XXXXXXXX F1503IST YYWW 1110 NNN 017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS40001607D-page 332  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 31.1 Package Marking Information (Continued) 16-Lead QFN (3x3x0.9 mm) Example XXXX MGDX XYYW X111 WNNN 1017 16-Lead UQFN (3x3x0.5 mm) Example XXXX AADX XYYW X111 WNNN 1017 TABLE 31-1: 16-LEAD 3x3x0.9 QFN (MG) TOP MARKING Part Number Marking PIC16F1503(T)-I/MG MGA PIC16F1503(T)-E/MG MGB PIC16LF1503(T)-I/MG MGC PIC16LF1503(T)-E/MG MGD TABLE 31-2: 16-LEAD 3x3x0.5 UQFN (MV) TOP MARKING Part Number Marking PIC16F1503(T)-I/NL AAB PIC16F1503(T)-E/NL AAA PIC16LF1503(T)-I/NL AAD PIC16LF1503(T)-E/NL AAC  2011-2015 Microchip Technology Inc. DS40001607D-page 333

PIC16(L)F1503 31.2 Package Details The following sections give the technical details of the packages. (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:11)(cid:7)(cid:12)(cid:13)(cid:14)(cid:15)(cid:9)(cid:16)(cid:17)(cid:7)(cid:11)(cid:9)(cid:18)(cid:19)(cid:4)(cid:5)(cid:14)(cid:19)(cid:6)(cid:9)(cid:20)(cid:10)(cid:21)(cid:9)(cid:22)(cid:9)(cid:23)(cid:24)(cid:24)(cid:9)(cid:25)(cid:14)(cid:11)(cid:9)(cid:26)(cid:27)(cid:8)(cid:28)(cid:9)(cid:29)(cid:10)(cid:16)(cid:18)(cid:10)(cid:30) (cid:31)(cid:27)(cid:13)(cid:6) 5(cid:11)(cid:10)(cid:3)’(cid:12)(cid:15)(cid:3)((cid:11)"’(cid:3)(cid:9)#(cid:10)(cid:10)(cid:15)(cid:16)’(cid:3)(cid:13)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:15)(cid:3)$(cid:10)(cid:29)+(cid:8)(cid:16)(cid:18)")(cid:3)(cid:13)(cid:17)(cid:15)(cid:29)"(cid:15)(cid:3)"(cid:15)(cid:15)(cid:3)’(cid:12)(cid:15)(cid:3)(cid:7)(cid:8)(cid:9)(cid:10)(cid:11)(cid:9)(cid:12)(cid:8)(cid:13)(cid:3)(cid:31)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:8)(cid:16)(cid:18)(cid:3)(cid:23)(cid:13)(cid:15)(cid:9)(cid:8)&(cid:8)(cid:9)(cid:29)’(cid:8)(cid:11)(cid:16)(cid:3)(cid:17)(cid:11)(cid:9)(cid:29)’(cid:15)$(cid:3)(cid:29)’(cid:3) (cid:12)’’(cid:13)477+++(cid:21)((cid:8)(cid:9)(cid:10)(cid:11)(cid:9)(cid:12)(cid:8)(cid:13)(cid:21)(cid:9)(cid:11)(7(cid:13)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:8)(cid:16)(cid:18) N NOTE1 E1 1 2 3 D E A A2 L c A1 b1 b e eB 8(cid:16)(cid:8)’" (cid:20)9-:/(cid:23) (cid:22)(cid:8)((cid:15)(cid:16)"(cid:8)(cid:11)(cid:16)(cid:3);(cid:8)((cid:8)’" (cid:7)(cid:20)9 9<(cid:7) (cid:7)(cid:26)= 9#(*(cid:15)(cid:10)(cid:3)(cid:11)&(cid:3)(cid:31)(cid:8)(cid:16)" 9 (cid:30)(cid:24) (cid:31)(cid:8)’(cid:9)(cid:12) (cid:15) (cid:21)(cid:30)(cid:5)(cid:5)(cid:3)3(cid:23)- (cid:14)(cid:11)(cid:13)(cid:3)’(cid:11)(cid:3)(cid:23)(cid:15)(cid:29)’(cid:8)(cid:16)(cid:18)(cid:3)(cid:31)(cid:17)(cid:29)(cid:16)(cid:15) (cid:26) > > (cid:21)(cid:4)(cid:30)(cid:5) (cid:7)(cid:11)(cid:17)$(cid:15)$(cid:3)(cid:31)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:15)(cid:3)(cid:14)(cid:12)(cid:8)(cid:9)6(cid:16)(cid:15)"" (cid:26)(cid:4) (cid:21)(cid:30)(cid:30)2 (cid:21)(cid:30).(cid:5) (cid:21)(cid:30)(cid:25)2 3(cid:29)"(cid:15)(cid:3)’(cid:11)(cid:3)(cid:23)(cid:15)(cid:29)’(cid:8)(cid:16)(cid:18)(cid:3)(cid:31)(cid:17)(cid:29)(cid:16)(cid:15) (cid:26)(cid:30) (cid:21)(cid:5)(cid:30)2 > > (cid:23)(cid:12)(cid:11)#(cid:17)$(cid:15)(cid:10)(cid:3)’(cid:11)(cid:3)(cid:23)(cid:12)(cid:11)#(cid:17)$(cid:15)(cid:10)(cid:3)?(cid:8)$’(cid:12) / (cid:21)(cid:4)(cid:25)(cid:5) (cid:21).(cid:30)(cid:5) (cid:21).(cid:4)2 (cid:7)(cid:11)(cid:17)$(cid:15)$(cid:3)(cid:31)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:15)(cid:3)?(cid:8)$’(cid:12) /(cid:30) (cid:21)(cid:4)(cid:24)(cid:5) (cid:21)(cid:4)2(cid:5) (cid:21)(cid:4)@(cid:5) <!(cid:15)(cid:10)(cid:29)(cid:17)(cid:17)(cid:3);(cid:15)(cid:16)(cid:18)’(cid:12) (cid:22) (cid:21)(cid:6).2 (cid:21)(cid:6)2(cid:5) (cid:21)(cid:6)(cid:6)2 (cid:14)(cid:8)(cid:13)(cid:3)’(cid:11)(cid:3)(cid:23)(cid:15)(cid:29)’(cid:8)(cid:16)(cid:18)(cid:3)(cid:31)(cid:17)(cid:29)(cid:16)(cid:15) ; (cid:21)(cid:30)(cid:30)2 (cid:21)(cid:30).(cid:5) (cid:21)(cid:30)2(cid:5) ;(cid:15)(cid:29)$(cid:3)(cid:14)(cid:12)(cid:8)(cid:9)6(cid:16)(cid:15)"" (cid:9) (cid:21)(cid:5)(cid:5)@ (cid:21)(cid:5)(cid:30)(cid:5) (cid:21)(cid:5)(cid:30)2 8(cid:13)(cid:13)(cid:15)(cid:10)(cid:3);(cid:15)(cid:29)$(cid:3)?(cid:8)$’(cid:12) *(cid:30) (cid:21)(cid:5)(cid:24)2 (cid:21)(cid:5)B(cid:5) (cid:21)(cid:5)(cid:6)(cid:5) ;(cid:11)+(cid:15)(cid:10)(cid:3);(cid:15)(cid:29)$(cid:3)?(cid:8)$’(cid:12) * (cid:21)(cid:5)(cid:30)(cid:24) (cid:21)(cid:5)(cid:30)@ (cid:21)(cid:5)(cid:4)(cid:4) <!(cid:15)(cid:10)(cid:29)(cid:17)(cid:17)(cid:3)(cid:27)(cid:11)+(cid:3)(cid:23)(cid:13)(cid:29)(cid:9)(cid:8)(cid:16)(cid:18)(cid:3)(cid:3), (cid:15)3 > > (cid:21)(cid:24).(cid:5) (cid:31)(cid:27)(cid:13)(cid:6)(cid:12) (cid:30)(cid:21) (cid:31)(cid:8)(cid:16)(cid:3)(cid:30)(cid:3)!(cid:8)"#(cid:29)(cid:17)(cid:3)(cid:8)(cid:16)$(cid:15)%(cid:3)&(cid:15)(cid:29)’#(cid:10)(cid:15)(cid:3)((cid:29)(cid:19)(cid:3)!(cid:29)(cid:10)(cid:19))(cid:3)*#’(cid:3)(#"’(cid:3)*(cid:15)(cid:3)(cid:17)(cid:11)(cid:9)(cid:29)’(cid:15)$(cid:3)+(cid:8)’(cid:12)(cid:3)’(cid:12)(cid:15)(cid:3)(cid:12)(cid:29)’(cid:9)(cid:12)(cid:15)$(cid:3)(cid:29)(cid:10)(cid:15)(cid:29)(cid:21) (cid:4)(cid:21) ,(cid:3)(cid:23)(cid:8)(cid:18)(cid:16)(cid:8)&(cid:8)(cid:9)(cid:29)(cid:16)’(cid:3)-(cid:12)(cid:29)(cid:10)(cid:29)(cid:9)’(cid:15)(cid:10)(cid:8)"’(cid:8)(cid:9)(cid:21) .(cid:21) (cid:22)(cid:8)((cid:15)(cid:16)"(cid:8)(cid:11)(cid:16)"(cid:3)(cid:22)(cid:3)(cid:29)(cid:16)$(cid:3)/(cid:30)(cid:3)$(cid:11)(cid:3)(cid:16)(cid:11)’(cid:3)(cid:8)(cid:16)(cid:9)(cid:17)#$(cid:15)(cid:3)((cid:11)(cid:17)$(cid:3)&(cid:17)(cid:29)"(cid:12)(cid:3)(cid:11)(cid:10)(cid:3)(cid:13)(cid:10)(cid:11)’(cid:10)#"(cid:8)(cid:11)(cid:16)"(cid:21)(cid:3)(cid:7)(cid:11)(cid:17)$(cid:3)&(cid:17)(cid:29)"(cid:12)(cid:3)(cid:11)(cid:10)(cid:3)(cid:13)(cid:10)(cid:11)’(cid:10)#"(cid:8)(cid:11)(cid:16)"(cid:3)"(cid:12)(cid:29)(cid:17)(cid:17)(cid:3)(cid:16)(cid:11)’(cid:3)(cid:15)%(cid:9)(cid:15)(cid:15)$(cid:3)(cid:21)(cid:5)(cid:30)(cid:5)0(cid:3)(cid:13)(cid:15)(cid:10)(cid:3)"(cid:8)$(cid:15)(cid:21) (cid:24)(cid:21) (cid:22)(cid:8)((cid:15)(cid:16)"(cid:8)(cid:11)(cid:16)(cid:8)(cid:16)(cid:18)(cid:3)(cid:29)(cid:16)$(cid:3)’(cid:11)(cid:17)(cid:15)(cid:10)(cid:29)(cid:16)(cid:9)(cid:8)(cid:16)(cid:18)(cid:3)(cid:13)(cid:15)(cid:10)(cid:3)(cid:26)(cid:23)(cid:7)/(cid:3)1(cid:30)(cid:24)(cid:21)2(cid:7)(cid:21) 3(cid:23)-4(cid:3)3(cid:29)"(cid:8)(cid:9)(cid:3)(cid:22)(cid:8)((cid:15)(cid:16)"(cid:8)(cid:11)(cid:16)(cid:21)(cid:3)(cid:14)(cid:12)(cid:15)(cid:11)(cid:10)(cid:15)’(cid:8)(cid:9)(cid:29)(cid:17)(cid:17)(cid:19)(cid:3)(cid:15)%(cid:29)(cid:9)’(cid:3)!(cid:29)(cid:17)#(cid:15)(cid:3)"(cid:12)(cid:11)+(cid:16)(cid:3)+(cid:8)’(cid:12)(cid:11)#’(cid:3)’(cid:11)(cid:17)(cid:15)(cid:10)(cid:29)(cid:16)(cid:9)(cid:15)"(cid:21) (cid:7)(cid:8)(cid:9)(cid:10)(cid:11)(cid:9)(cid:12)(cid:8)(cid:13)(cid:14)(cid:15)(cid:9)(cid:12)(cid:16)(cid:11)(cid:17)(cid:11)(cid:18)(cid:19)(cid:22)(cid:10)(cid:29)+(cid:8)(cid:16)(cid:18)-(cid:5)(cid:24)(cid:28)(cid:5)(cid:5)23 DS40001607D-page 334  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001607D-page 335

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001607D-page 336  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 (cid:31)(cid:27)(cid:13)(cid:6) 5(cid:11)(cid:10)(cid:3)’(cid:12)(cid:15)(cid:3)((cid:11)"’(cid:3)(cid:9)#(cid:10)(cid:10)(cid:15)(cid:16)’(cid:3)(cid:13)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:15)(cid:3)$(cid:10)(cid:29)+(cid:8)(cid:16)(cid:18)")(cid:3)(cid:13)(cid:17)(cid:15)(cid:29)"(cid:15)(cid:3)"(cid:15)(cid:15)(cid:3)’(cid:12)(cid:15)(cid:3)(cid:7)(cid:8)(cid:9)(cid:10)(cid:11)(cid:9)(cid:12)(cid:8)(cid:13)(cid:3)(cid:31)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:8)(cid:16)(cid:18)(cid:3)(cid:23)(cid:13)(cid:15)(cid:9)(cid:8)&(cid:8)(cid:9)(cid:29)’(cid:8)(cid:11)(cid:16)(cid:3)(cid:17)(cid:11)(cid:9)(cid:29)’(cid:15)$(cid:3)(cid:29)’(cid:3) (cid:12)’’(cid:13)477+++(cid:21)((cid:8)(cid:9)(cid:10)(cid:11)(cid:9)(cid:12)(cid:8)(cid:13)(cid:21)(cid:9)(cid:11)(7(cid:13)(cid:29)(cid:9)6(cid:29)(cid:18)(cid:8)(cid:16)(cid:18)  2011-2015 Microchip Technology Inc. DS40001607D-page 337

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001607D-page 338  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001607D-page 339

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001607D-page 340  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001607D-page 341

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001607D-page 342  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001607D-page 343

PIC16(L)F1503 16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C A1 C A SEATING PLANE (A3) 0.08 C SIDE VIEW 0.10 C A B D2 0.10 C A B K E2 2 1 L NOTE 1 N 16 X b 0.07 C A B e 0.05 C BOTTOM VIEW Microchip Technology Drawing C04-211A Sheet 1 of 2 DS40001607D-page 344  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 16 Pitch e 0.50 BSC Overall Height A 0.45 0.50 0.55 Standoff A1 0.00 0.02 0.05 Terminal Thickness (A3) 0.15 REF Overall Width E 3.00 BSC Exposed Pad Width E2 1.50 1.60 1.70 Overall Length D 3.00 BSC Exposed Pad Length D2 1.50 1.60 1.70 Terminal Width b 0.20 0.25 0.30 Terminal Length L 0.25 0.35 0.45 Terminal-to-Exposed-Pad K 0.20 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-211A Sheet 2 of 2  2011-2015 Microchip Technology Inc. DS40001607D-page 345

PIC16(L)F1503 16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C2 X2 C2 Y2 E X1 Y1 SILK SCREEN RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width X2 1.70 Optional Center Pad Length Y2 1.70 Contact Pad Spacing C1 2.90 Contact Pad Spacing C2 2.90 Contact Pad Width (X16) X1 0.30 Contact Pad Length (X16) Y1 0.80 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2211A DS40001607D-page 346  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (9/2011) Original release. Revision B (8/2013) Removed “Preliminary” status. Revision C (02/2014) Updated Electrical Specifications and added Charac- terization Data. Revision D (10/2015) Added Section 3.2 High Endurance Flash. Updated Equation 15-1; Figure 25-1; Register 25-3; Sections 23.1.5, 25.9.1.2, 25.11.1, and 28.1; and Table 25-2.  2011-2015 Microchip Technology Inc. DS40001607D-page 347

PIC16(L)F1503 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at Users of Microchip products can receive assistance www.microchip.com. This website is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the website contains the following information: • Field Application Engineer (FAE) • Product Support – Data sheets and errata, • Technical Support application notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, documents, latest software releases and archived representative or Field Application Engineer (FAE) for software support. Local sales offices are also available to help • General Technical Support – Frequently Asked customers. A listing of sales offices and locations is Questions (FAQ), technical support requests, included in the back of this document. online discussion groups, Microchip consultant Technical support is available through the website program member listing at: http://www.microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS40001607D-page 348  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) - X /XX XXX Examples: Device Tape and Reel Temperature Package Pattern a) PIC16LF1503T - I/SL Option Range Tape and Reel, Industrial temperature, SOIC package b) PIC16F1503 - I/P Device: PIC16LF1503, PIC16F1503 Industrial temperature PDIP package c) PIC16F1503 - E/MG 298 Tape and Reel Blank = Standard packaging (tube or tray) Extended temperature, Option: T = Tape and Reel(1) QFN package QTP pattern #298 Temperature I = -40C to +85C (Industrial) Range: E = -40C to +125C (Extended) Package: MG = Micro Lead Frame (QFN) 3x3x0.9 MV = Ultra Thin Micro Lead Frame (UQFN) 3x3x0.5 P = Plastic DIP Note1: Tape and Reel identifier only appears in the SL = SOIC catalog part number description. This ST = TSSOP identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package Pattern: QTP, SQTP, Code or Special Requirements availability with the Tape and Reel option. (blank otherwise) 2: For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office.  2011-2015 Microchip Technology Inc. DS40001607D-page 349

PIC16(L)F1503 NOTES: DS40001607D-page 350  2011-2015 Microchip Technology Inc.

PIC16(L)F1503 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, ensure that your application meets with your specifications. LANCheck, MediaLB, MOST, MOST logo, MPLAB, MICROCHIP MAKES NO REPRESENTATIONS OR OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated arising from this information and its use. Use of Microchip in the U.S.A. devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB conveyed, implicitly or otherwise, under any Microchip Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, intellectual property rights unless otherwise stated. Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-916-8 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2011-2015 Microchip Technology Inc. DS40001607D-page 351

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: PIC16F1503-E/P PIC16F1503-E/SL PIC16F1503-E/ST PIC16F1503-I/MG PIC16F1503-I/SL PIC16F1503-I/ST PIC16F1503T-I/MG PIC16F1503T-I/SL PIC16LF1503-E/MG PIC16LF1503-E/P PIC16LF1503-E/SL PIC16LF1503- E/ST PIC16LF1503-I/MG PIC16LF1503-I/SL PIC16LF1503-I/ST PIC16LF1503T-I/MG PIC16LF1503T-I/SL PIC16LF1503T-I/ST PIC16LF1503-I/P PIC16F1503-E/MG PIC16F1503-I/P PIC16F1503T-I/ST PIC16F1503-I/MV PIC16F1503T-I/MV PIC16LF1503-I/MV PIC16LF1503T-I/MV PIC16LF1503-E/MV PIC16F1503-E/MV