PHP www.vishay.com Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES • High purity ceramic substrate • Power rating to 2.5 W • Resistance range 10  to 30.1 k • Resistor tolerance to ± 0.1 % • TCR to ± 25 ppm/°C • Flame resistant UL 94 V-0 APPLICATIONS ADDITIONAL RESOURCES • Power supplies 3DDD 333D • Power switching • Braking system 3D Models • Test and measurement equipment PHP series chip resistors are designed with enlarge d • Motor deflection circuits backside terminations to reduce the thermal resistanc e between the topside resistor layer and the solder joint on the TYPICAL PERFORMANCE end users circuit board. ABSOLUTE Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor th e TCR 25 ability to remove the generated heat is critical to the overall TOL. 0.1 performance of the device. STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Nichrome - Resistance Range 10  to 30.1 k - 25 ppm/°C, 50 ppm/°C (standard) TCR: Absolute -55 °C to +125 °C and, 100 ppm/°C Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % +25 °C Power Rating: Resistor 0.375 W - 2.5 W (1) Maximum at +70 °C Stability: Absolute R 0.1 % 2000 h at +70 °C Stability: Ratio Not applicable - Voltage Coefficient < 0.1 ppm/V - Working Voltage 75 V to 200 V - Operating Temperature Range -55 °C to +155 °C - Storage Temperature Range -55 °C to +155 °C - Noise < -30 dB - Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () 0603 375 (1) 75 10 to 30.1K 0805 625 (1) 100 10 to 30.1K 1206 1000 (1) 200 10 to 30.1K 2512 2500 (1) 200 10 to 30.1K Note (1) Dependent on component mounting by user ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) LIMITS MIL-PRF-55342 ENVIRONMENTAL TEST TYPICAL VISHAY PERFORMANCE CHARACTERISTIC “E” Resistance Temperature Characteristic ± 25 ppm/°C ± 15 ppm/°C Maximum Ambient Temperature at Rated Wattage +70 °C +70 °C Maximum Ambient Temperature at Power Derating +150 °C +150 °C Thermal Shock ± 0.1 % ± 0.04 % Low Temperature Operation ± 0.1 % ± 0.001 % Short Time Overload ± 0.1 % ± 0.003 % High Temperature Exposure ± 0.1 % ± 0.030 % Resistance to Soldering Heat ± 0.2 % ± 0.007 % Moisture Resistance ± 0.2 % ± 0.002 % Life at +70 °C for 2000 h ± 0.5 % ± 0.100 % Revision: 23-Oct-2019 1 Document Number: 60076 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches D W T E L WIDTH THICKNESS TOP PAD BOTTOM PAD CASE SIZE LENGTH W (± 0.005) MIN./MAX. D (± 0.005) E (± 0.005) 0603 0.064 ± 0.006 0.032 0.020 max. 0.012 0.021 0805 0.080 ± 0.006 0.050 0.015/0.033 0.016 0.025 1206 0.126 ± 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040 2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 LAND PATTERN DIMENSIONS in inches 0603 Land Pattern 1206 Land Pattern 0.0920 0.1730 0.0340 0.0710 0.0140 0.0390 0.0220 0.0755 0805 Land Pattern 2512 Land Pattern 0.1050 0.2910 0.0520 0.1260 0.0200 0.0425 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al O ) 2 3 Terminations (Tin/Lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier Revision: 23-Oct-2019 2 Document Number: 60076 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP www.vishay.com Vishay Dale Thin Film PHP CHIP TEMP. VS. APPLIED POWER PHP CHIP TEMP. VS. APPLIED POWER 5.00 5.00 4.50 0603 - 100 Ω 4.50 0805 - 100 Ω 0603 - 5 kΩ 0805 - 5 kΩ W) 4.00 0603 - 18.8 kΩ W) 4.00 0805 - 20 kΩ er ( 3.50 er ( 3.50 w 3.00 w 3.00 Po 2.50 Po 2.50 d 2.00 d 2.00 e e pli 1.50 pli 1.50 Ap 1.00 Ap 1.00 0.50 0.50 0.00 0.00 70 150 200 70 150 200 Chip Surface Temperature (°C) Chip Surface Temperature (°C) Note Note • Chip surface temperature measured using FLIR SC645 thermal • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface imaging system with an approximate test card surfac e temperature of 85 °C temperature of 85 °C PHP CHIP TEMP. VS. APPLIED POWER PHP CHIP TEMP. VS. APPLIED POWER 5.00 10.00 4.50 1206 - 100 Ω 9.00 2512 - 10 Ω 1206 - 5 kΩ 2512 - 10 kΩ W) 4.00 1206 - 10 kΩ W) 8.00 2512 - 30 kΩ er ( 3.50 er ( 7.00 w 3.00 w 6.00 Po 2.50 Po 5.00 d 2.00 d 4.00 e e pli 1.50 pli 3.00 Ap 1.00 Ap 2.00 0.50 1.00 0.00 0.00 70 150 200 70 150 200 Chip Surface Temperature (°C) Chip Surface Temperature (°C) Notes Notes • Chip surface temperature measured using FLIR A40 thermal • Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface imaging system with an approximate test card surfac e temperature of 25 °C temperature of 25 °C • Thermal imaging was conducted under ambient condition s Case Size 2512 2512 2512 resulting in a steady state test card surface temperature of 85 ° C Resistance over the full range of power levels Up to 10  Up to 10 k Up to 30 k Value • Thermal imaging and load life testing was conducted mounting Temperature Power (W) one device to 2" x 3" test cards with 2.5 mil copper plating on both surfaces. Thermal vias on 120 mil centers were utilized for 70 2.44 1.81 1.87 heat transfer between surfaces of the test card 150 6.82 4.89 5.19 200 9.33 6.63 7.09 Revision: 23-Oct-2019 3 Document Number: 60076 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PHP www.vishay.com Vishay Dale Thin Film SINGLE PULSE CURVES 1000 100 Ω - 2512 100 Ω - 1206 W)100 er ( w o 10 P e s Pul 1 100 Ω - 0805 100 Ω - 0603 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Duration (s) DERATING CURVE 100 wer 80 o P ed 60 at R of 40 nt e c er 20 P 0 0 70 125 155 Ambient Temperature °C GLOBAL PART NUMBER INFORMATION P H P 0 1 2 0 6 E 1 0 0 2 B B T 1 GLOBAL CASE SUBSTRATE TCR RESISTANCE TOLERANCE TERMINATION PACKAGING MODEL SIZE PHP 0 = alumina 0603 E = The first 3 digits B = ± 0.1 % B =wraparound BS = BULK 0805 ± 25 ppm/°C are significant D = ± 0.5 % Sn/Pb solder 100 min., 1 mult. 1206 H = figures and the F = ± 1.0 % w/nickel barrier WS = WAFFLE 2512 ± 50 ppm/°C last digit G = ± 2.0 %  100 min., 1 mult. K = specifies the J = ± 5.0 % S = wraparound WI = WAFFLE  ± 100 ppm/°C number of lead (Pb)-free solder  (item single lot zeros to follow. SAC-305 day code) “R” designates RoHS-compliant - e1 100 min., 1 mult. the decimal  point. TAPE AND REEL T1 = 1000 min.,  Example: 1000 mult. 10R0 = 10  T3 = 300 min., 300 mult. 1000 = 100  T5 = 500 min., 500 mult. 1001 = 1 k TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult.  (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date) Revision: 23-Oct-2019 4 Document Number: 60076 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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