PESD5V0U1BA; PESD5V0U1BB; PESD5V0U1BL Ultra low capacitance bidirectional ESD protection diodes Rev. 01 — 25 April 2007 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect one data line from the damage caused by ESD. Table 1. Product overview Type number Package Package configuration NXP JEITA PESD5V0U1BA SOD323 SC-76 very small PESD5V0U1BB SOD523 SC-79 flat lead ultra small PESD5V0U1BL SOD882 - leadless ultra small 1.2 Features n Bidirectional ESD protection of one line n Ultra low leakage current: I =5nA RM n Ultralowdiodecapacitance:C =2.9pF n ESD protection of up to 10kV d n IEC61000-4-2; level4(ESD) 1.3 Applications n Computers and peripherals n Communication systems n Audio and video equipment n Portable electronics n Cellular handsets and accessories n Subscriber Identity Module (SIM) card protection n 10/100/1000Ethernet n FireWire n Local Area Network (LAN) equipment n High-speed data lines 1.4 Quick reference data Table 2. Quick reference data T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit Per diode V reverse standoff voltage - - 5 V RWM C diode capacitance f=1MHz; V =0V - 2.9 3.5 pF d R

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol SOD323; SOD523 1 cathode1 [1] 2 cathode2 1 2 1 2 sym045 001aab540 SOD882 1 cathode1 [1] 2 cathode2 1 2 1 2 sym045 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PESD5V0U1BA SC-76 plastic surface-mounted package; 2leads SOD323 PESD5V0U1BB SC-79 plastic surface-mounted package; 2leads SOD523 PESD5V0U1BL - leadless ultra small plastic package; 2terminals; SOD882 body1.0· 0.6· 0.5mm 4. Marking Table 5. Marking codes Type number Marking code PESD5V0U1BA AA PESD5V0U1BB B3 PESD5V0U1BL AN PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 2 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per device T junction temperature - 150 (cid:176) C j T ambient temperature - 65 +150 (cid:176) C amb T storage temperature - 65 +150 (cid:176) C stg Table 7. ESD maximum ratings Symbol Parameter Conditions Min Max Unit Per diode V electrostatic discharge IEC61000-4-2 [1][2] - 10 kV ESD voltage (contactdischarge) MIL-STD-883(human - 8 kV body model) [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin1 to pin2. Table 8. ESD standards compliance Standard Conditions Per diode IEC61000-4-2; level4(ESD) >15kV(air); >8kV(contact) MIL-STD-883; class3 (human body model) >4kV 001aaa631 IPP 100 % 90 % 10 % tr = 0.7 ns to 1 ns t 30 ns 60 ns Fig 1. ESDpulse waveform according to IEC61000-4-2 PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 3 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 6. Characteristics Table 9. Characteristics T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit Per diode V reverse standoff voltage - - 5 V RWM I reverse leakage current V =5V - 5 100 nA RM RWM V breakdown voltage I =5mA 5.5 7 9.5 V BR R C diode capacitance f=1MHz d V =0V - 2.9 3.5 pF R V =5V - 1.9 - pF R r differential resistance I =1mA - - 100 W dif R 006aab036 3.0 IPP Cd (pF) 2.6 IR - VCL- VBR - VRWM IRM - IRM VRWM VBR VCL - IR 2.2 - + 1.80 1 2 3 4 5 - IPP VR (V) 006aaa676 f=1MHz; T =25(cid:176) C amb Fig 2. Diode capacitance as a function of reverse Fig 3. V-Icharacteristics for a bidirectional ESD voltage; typical values protection diode PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 4 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes ESD TESTER 4 GHz DIGITAL RG 223/U OSCILLOSCOPE RZ 450 W 50 W coax 10· ATTENUATOR CZ 50 W DUT (DEVICE IEC 61000-4-2 network UNDER CZ = 150 pF; RZ = 330 W TEST) vertical scale = 10 A/div vertical scale = 10 V/div horizontal scale = 15 ns/div horizontal scale = 100 ns/div GND GND unclamped +8 kV ESD pulse waveform clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin 1 to 2 vertical scale = 10 A/div horizontal scale = 15 ns/div GND GND vertical scale = 10 V/div horizontal scale = 100 ns/div unclamped - 8 kV ESD pulse waveform clamped - 8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin 1 to 2 006aab037 Fig 4. ESD clamping test setup and waveforms PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 5 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 7. Application information The PESD5V0U1Bx series is designed for the bidirectional protection of one signal line from the damage caused by ESD pulses. The PESD5V0U1Bx series may be used on lines where the signal polarities are either positive or negative with respect to ground. signal line PESD5V0U1Bx GND 006aab038 Fig 5. Bidirectional protection of one line Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESD5V0U1Bx as close to the input terminal or connector as possible. 2. The path length between the PESD5V0U1Bx and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 6 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 8. Package outline 1.35 1.1 0.85 0.65 1.15 0.8 0.75 0.58 1 0.45 1 0.15 2.7 1.8 1.65 1.25 2.3 1.6 1.55 1.15 2 2 0.40 0.25 0.34 0.17 0.25 0.10 0.26 0.11 Dimensions in mm 03-12-17 Dimensions in mm 02-12-13 Fig 6. Package outline SOD323(SC-76) Fig 7. Package outline SOD523(SC-79) 0.62 0.50 0.55 0.46 0.30 2 0.22 1.02 0.65 0.95 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm 03-04-17 Fig 8. Package outline SOD882 PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 7 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 8000 10000 PESD5V0U1BA SOD323 4mm pitch, 8mm tape and reel -115 - -135 PESD5V0U1BB SOD523 2mm pitch, 8mm tape and reel - -315 - 4mm pitch, 8mm tape and reel -115 - -135 PESD5V0U1BL SOD882 2mm pitch, 8mm tape and reel - - -315 [1] For further information and the availability of packing methods, seeSection13. 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2· ) msa433 Dimensions in mm Fig 9. Reflow soldering footprint SOD323(SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 10. Wave soldering footprint SOD323(SC-76) PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 8 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 2.15 1.20 0.50 0.60 solder lands solder paste 0.30 solder resist 0.40 1.80 occupied area 1.90 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 11. Reflow soldering footprint SOD523(SC-79) 1.30 R = 0.05 (8· ) 0.30 R = 0.05 (8· ) 0.60 0.70 0.80 0.90 (2· ) (2· ) (2· ) solder lands 0.30 (2· ) solder paste 0.40 (2· ) solder resist 0.50 (2· ) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 12. Reflow soldering footprint SOD882 PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 9 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD5V0U1BA_BB_BL_1 20070425 Product data sheet - - PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 10 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nxp.com. 12.2 Definitions malfunctionofaNXPSemiconductorsproductcanreasonablybeexpectedto result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Draft —The document is a draft version only. The content is still under Semiconductors products in such equipment or applications and therefore internal review and subject to formal approval, which may result in such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications —Applications that are described herein for any of these informationincludedhereinandshallhavenoliabilityfortheconsequencesof products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet —A short data sheet is an extract from a full data sheet withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended Limiting values —Stress above one or more limiting values (as defined in forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent full information. For detailed and full information see the relevant full data damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof sheet, which is available on request via the local NXP Semiconductors sales the device at these or any other conditions above those given in the office. In case of any inconsistency or conflict with the short data sheet, the Characteristics sections of this document is not implied. Exposure to limiting full data sheet shall prevail. values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold 12.3 Disclaimers subjecttothegeneraltermsandconditionsofcommercialsale,aspublished athttp://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless General —Information in this document is believed to be accurate and explicitly otherwise agreed to in writing by NXP Semiconductors. In case of reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsor any inconsistency or conflict between information in this document and such warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch terms and conditions, the latter will prevail. information and shall have no liability for the consequences of use of such No offer to sell or license —Nothing in this document may be interpreted information. or construed as an offer to sell products that is open for acceptance or the Right to make changes —NXPSemiconductorsreservestherighttomake grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents changes to information published in this document, including without or other industrial or intellectual property rights. limitation specifications and product descriptions, at any time and without notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior to the publication hereof. 12.4 Trademarks Suitability for use —NXP Semiconductors products are not designed, Notice:Allreferencedbrands,productnames,servicenamesandtrademarks authorized or warranted to be suitable for use in medical, military, aircraft, are the property of their respective owners. space or life support equipment, nor in applications where failure or 13. Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com PESD5V0U1BA_BB_BL_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 25 April 2007 11 of 12

PESD5V0U1BA/BB/BL NXP Semiconductors Ultra low capacitance bidirectional ESD protection diodes 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Contact information. . . . . . . . . . . . . . . . . . . . . 11 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 April 2007 Document identifier: PESD5V0U1BA_BB_BL_1