Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PESDxS1UL series Unidirectional ESD protection diodes Rev. 3 — 25 October 2011 Product data sheet 1. Product profile 1.1 General description Unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882 leadless ultra small Surface Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. 1.2 Features and benefits  Ultra small SMD plastic package  Ultra low leakage current: I <700nA RM  ESD protection of one line  ESD protection up to 30kV  Max. peak pulse power: P =150W  IEC61000-4-2; level4 (ESD) PP  Low clamping voltage: V =20V  IEC61000-4-5; (surge); I up to 15A CL PP  AEC-Q101 qualified 1.3 Applications  Computers and peripherals  Communication systems  Audio and video equipment  High-speed data lines  Parallel ports 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V reverse standoff voltage RWM PESD3V3S1UL - - 3.3 V PESD5V0S1UL - - 5.0 V PESD12VS1UL - - 12 V PESD15VS1UL - - 15 V PESD24VS1UL - - 24 V C diode capacitance f=1MHz; V =0V d R PESD3V3S1UL - 207 300 pF PESD5V0S1UL - 152 200 pF PESD12VS1UL - 38 75 pF PESD15VS1UL - 32 70 pF PESD24VS1UL - 23 50 pF

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 1 2 2 anode 1 2 sym035 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PESD3V3S1UL - leadless ultra small plastic package; 2terminals; SOD882 body 1.00.60.5mm PESD5V0S1UL PESD12VS1UL PESD15VS1UL PESD24VS1UL 4. Marking Table 4. Marking codes Type number Marking code PESD3V3S1UL G1 PESD5V0S1UL G2 PESD12VS1UL G3 PESD15VS1UL G4 PESD24VS1UL G5 PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 2 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit P peak pulse power t =8/20s [1] - 150 W PP p I peak pulse current t =8/20s [1] PP p PESD3V3S1UL - 15 A PESD5V0S1UL - 15 A PESD12VS1UL - 5 A PESD15VS1UL - 5 A PESD24VS1UL - 3 A T junction temperature - 150 C j T ambient temperature 65 +150 C amb T storage temperature 65 +150 C stg [1] Non-repetitive current pulse 8/20s exponential decay waveform according to IEC61000-4-5. T able 6. ESD maximum ratings Symbol Parameter Conditions Min Max Unit V electrostatic discharge voltage IEC61000-4-2 [1] ESD (contact discharge) PESD3V3S1UL - 30 kV PESD5V0S1UL - 30 kV PESD12VS1UL - 30 kV PESD15VS1UL - 30 kV PESD24VS1UL - 23 kV PESDxS1UL series MIL-STD-883 - 10 kV (human body model) [1] Device stressed with ten non-repetitive ESD pulses. T able 7. ESD standards compliance Standard Conditions IEC61000-4-2; level4 (ESD) >15kV (air); >8kV (contact) MIL-STD-883; class3B (human body model) >8kV PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 3 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 001aaa631 001aaa630 IPP 120 100 % IPP 100 % IPP; 8 μs 90 % (%) 80 e−t 50 % IPP; 20 μs 40 10 % tr = 0.7 ns to 1 ns t 0 0 10 20 30 40 30 ns t (μs) 60 ns Fig 1. 8/20s pulse waveform according to Fig 2. ESD pulse waveform according to IEC61000-4-5 IEC61000-4-2 6. Characteristics Table 8. Characteristics T =25C unless otherwise specified amb Symbol Parameter Conditions Min Typ Max Unit V reverse standoff voltage RWM PESD3V3S1UL - - 3.3 V PESD5V0S1UL - - 5.0 V PESD12VS1UL - - 12 V PESD15VS1UL - - 15 V PESD24VS1UL - - 24 V I reverse leakage current RM PESD3V3S1UL V =3.3V - 0.7 2 A RWM PESD5V0S1UL V =5.0V - 0.1 1 A RWM PESD12VS1UL V =12V - <1 50 nA RWM PESD15VS1UL V =15V - <1 50 nA RWM PESD24VS1UL V =24V - <1 50 nA RWM V breakdown voltage I =5mA [1] BR R PESD3V3S1UL 5.2 5.6 6.0 V PESD5V0S1UL 6.4 6.8 7.2 V PESD12VS1UL 14.7 15.0 15.3 V PESD15VS1UL 17.6 18.0 18.4 V PESD24VS1UL 26.5 27.0 27.5 V PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 4 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes Table 8. Characteristics …continued T =25C unless otherwise specified amb Symbol Parameter Conditions Min Typ Max Unit C diode capacitance f=1MHz; V =0V d R PESD3V3S1UL - 207 300 pF PESD5V0S1UL - 152 200 pF PESD12VS1UL - 38 75 pF PESD15VS1UL - 32 70 pF PESD24VS1UL - 23 50 pF V clamping voltage [2] CL PESD3V3S1UL I =1A - - 8 V PP I =15A - - 20 V PP PESD5V0S1UL I =1A - - 9 V PP I =15A - - 20 V PP PESD12VS1UL I =1A - - 19 V PP I =5A - - 35 V PP PESD15VS1UL I =1A - - 23 V PP I =5A - - 40 V PP PESD24VS1UL I =1A - - 36 V PP I =3A - - 70 V PP r differential resistance dif PESD3V3S1UL I =1mA - - 400  R PESD5V0S1UL I =1mA - - 80  R PESD12VS1UL I =1mA - - 200  R PESD15VS1UL I =1mA - - 225  R PESD24VS1UL I =0.5mA - - 300  R [1] Pulse test: tp300s; duty cycle0.02. [2] Non-repetitive current pulse 8/20s exponential decay waveform according to IEC61000-4-5. PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 5 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 104 001aaa726 1.2 001aaa193 PPP PPP (W) PPP(25°C) 103 0.8 102 0.4 10 0 1 10 102 103 0 50 100 150 200 tp (μs) Tj (°C) Tamb=25C Fig 3. Peak pulse power as a function of exponential Fig 4. Relative variation of peak pulse power as a pulse duration; typical values function of junction temperature; typical values 001aaa727 001aaa728 240 50 Cd Cd (pF) (pF) 200 40 160 30 (1) 120 20 (2) (1) (2) 80 10 (3) 40 0 0 1 2 3 4 5 0 5 10 15 20 25 VR (V) VR (V) f=1MHz; Tamb=25C f=1MHz; Tamb=25C (1) PESD3V3S1UL; V =3.3V (1) PESD12VS1UL; V =12V RWM RWM (2) PESD5V0S1UL; VRWM=5.0V (2) PESD15VS1UL; VRWM=15V (3) PESD24VS1UL; VRWM=24V Fig 5. Diode capacitance as a function of reverse Fig 6. Diode capacitance as a function of reverse voltage; typical values voltage; typical values PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 6 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes I 001aaa729 10 IRM IRM(25°C) (1) (2) −VCL−VBR −VRWM V 1 −−IIRRM − + P-N 10−1 −IPP −100 −50 0 50 100 150 Tj (°C) 006aaa407 (1) PESD3V3S1UL; V =3.3V RWM (2) PESD5V0S1UL; VRWM=5.0V IR is less than 15nA at 150C for: PESD12VS1UL; V =12V RWM PESD15VS1UL; VRWM=15V PESD24VS1UL; VRWM=24V Fig 7. Relative variation of reverse leakage current Fig 8. V-I characteristics for a unidirectional ESD as a function of junction temperature; typical protection diode values PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 7 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes ESD TESTER RG 223/U 4 GHz DIGITAL Rd 450 Ω 50 Ω coax 10× OSCILLOSCOPE ATTENUATOR Cs 50 Ω note 1 D.U.T. (DEVICE UNDER TEST) Note 1: IEC 61000-4-2 network Cs = 150 pF; Rd = 330 Ω vertical scale = 200 V/div vertical scale = 20 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div PESD24VS1UL GND PESD15VS1UL GND PESD12VS1UL GND GND PESD5V0S1UL GND GND PESD3V3S1UL unclamped +1 kV ESD voltage waveform clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) GND GND vertical scale = 200 V/div vertical scale = 10 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform clamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) 006aaa682 Fig 9. ESD clamping test setup and waveforms PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 8 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 7. Application information The PESDxS1UL series is designed for protection of one unidirectional data line from the damage caused by ESD and surge pulses. The PESDxS1UL series may be used on lines where the signal polarities are either positive or negative with respect to ground. The PESDxS1UL series provides a surge capability of 150W for an 8/20s waveform. line to be protected line to be protected (positive signal polarity) (negative signal polarity) PESDxS1UL PESDxS1UL ground ground unidirectional protection of one line 006aaa681 Fig 10. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESDxS1UL as close to the input terminal or connector as possible. 2. The path length between the PESDxS1UL and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 9 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 9. Package outline 0.62 0.50 0.55 0.46 0.30 2 0.22 1.02 0.65 0.95 0.30 0.22 1 0.55 cathode marking on top side (if applicable) 0.47 Dimensions in mm 03-04-17 Fig 11. Package outline SOD882 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 PESD3V3S1UL SOD882 4mm pitch, 8mm tape and reel -315 PESD5V0S1UL PESD12VS1UL PESD15VS1UL PESD24VS1UL [1] For further information and the availability of packing methods, see Section14. PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 10 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 11. Soldering 1.3 0.7 R0.05 (8×) solder lands 0.6 0.7 0.8 solder resist 0.9 (2×) (2×) (2×) solder paste occupied area 0.3 (2×) Dimensions in mm 0.4 (2×) 0.5 (2×) sod882_fr Reflow soldering is the only recommended soldering method. Fig 12. Reflow soldering footprint SOD882 PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 11 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESDXS1UL_SERv.3 20111025 Product data sheet - PESDXS1UL_SERv.2 Modifications: • Section 1.2 “Features and benefits”: updated • Table7: updated • Table8: added pulse conditions for breakdown voltage V BR • Section 8 “Test information”: added • Section 11 “Soldering”: added • Section 13 “Legal information”: updated PESDXS1UL_SERv.2 20090820 Product data sheet - PESDXS1UL_SERv.1 PESDXS1UL_SERv.1 20060331 Product data sheet - - PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 12 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 13.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. NXP Semiconductors and its customer, unless NXP Semiconductors and NXP Semiconductors does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the NXP Semiconductors product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and 13.3 Disclaimers the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall NXP Semiconductors be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities. PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 13 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes Quick reference data — The Quick reference data is an extract of the 13.4 Trademarks product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PESDXS1UL_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 25 October 2011 14 of 15

PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 9 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 October 2011 Document identifier: PESDXS1UL_SER