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  • 制造商: NXP Semiconductors
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PESD3V3V4UW,115产品简介:

ICGOO电子元器件商城为您提供PESD3V3V4UW,115由NXP Semiconductors设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 PESD3V3V4UW,115价格参考。NXP SemiconductorsPESD3V3V4UW,115封装/规格:TVS - 二极管, 。您可以下载PESD3V3V4UW,115参考资料、Datasheet数据手册功能说明书,资料中有PESD3V3V4UW,115 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

电路保护

描述

TVS DIODE 3.3VWM 11VC SOT665

产品分类

TVS - 二极管

品牌

NXP Semiconductors

数据手册

点击此处下载产品Datasheet

产品图片

产品型号

PESD3V3V4UW,115

PCN封装

点击此处下载产品Datasheet

PCN设计/规格

点击此处下载产品Datasheet

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

-

不同频率时的电容

15pF @ 1MHz

供应商器件封装

SOT-665

其它名称

568-7343-1

功率-峰值脉冲

16W

包装

剪切带 (CT)

单向通道

1

双向通道

-

安装类型

表面贴装

封装/外壳

SOT-665

工作温度

-65°C ~ 150°C

应用

通用

标准包装

1

电压-击穿(最小值)

5.3V

电压-反向关态(典型值)

3.3V (最小值)

电压-箝位(最大值)@Ipp

11V

电流-峰值脉冲(10/1000µs)

1.5A (8/20µs)

电源线路保护

类型

齐纳

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PDF Datasheet 数据手册内容提取

PESDxV4UF; PESDxV4UG; PESDxV4UW Very low capacitance unidirectional quadruple ESD protection diode arrays Rev. 03 — 28 January 2008 Product data sheet 1. Product profile 1.1 General description Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients. Table 1. Product overview Type number Package Package configuration Nexperia JEITA JEDEC PESD3V3V4UF SOT886 - MO-252 leadless ultra small PESD5V0V4UF SOT886 - MO-252 leadless ultra small PESD3V3V4UG SOT353 SC-88A - very small PESD5V0V4UG SOT353 SC-88A - very small PESD3V3V4UW SOT665 - - ultra small and flat lead PESD5V0V4UW SOT665 - - ultra small and flat lead 1.2 Features n ESD protection of up to four lines n Ultra low leakage current: I =25nA RM n Very low diode capacitance n ESD protection up to12kV n Max. peak pulse power: P =16W n IEC61000-4-2; level4 (ESD) PP n Low clamping voltage: V =11V n IEC61000-4-5 (surge); I =1.5A CL PP 1.3 Applications n Computers and peripherals n Communication systems n Audio and video equipment n Portable electronics n Cellular handsets and accessories n Subscriber Identity Module (SIM) card protection

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 1.4 Quick reference data Table 2. Quick reference data T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit Per diode V reverse standoff voltage RWM PESD3V3V4UF - - 3.3 V PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF - - 5.0 V PESD5V0V4UG PESD5V0V4UW C diode capacitance f=1MHz; V =0V d R PESD3V3V4UF - 15 18 pF PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF - 12 15 pF PESD5V0V4UG PESD5V0V4UW 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol PESD3V3V4UF; PESD5V0V4UF 1 cathode (diode1) 1 2 3 2 common anode 1 6 3 cathode (diode2) 2 5 4 cathode (diode3) 3 4 5 common anode 006aaa156 6 5 4 6 cathode (diode4) bottom view PESD3V3V4UG; PESD5V0V4UG 1 cathode (diode1) 5 4 2 common anode 1 5 3 cathode (diode2) 2 4 cathode (diode3) 3 4 5 cathode (diode4) 1 2 3 006aaa157 PESD3V3V4UW; PESD5V0V4UW 1 cathode (diode1) 5 4 2 common anode 1 5 3 cathode (diode2) 2 4 cathode (diode3) 3 4 5 cathode (diode4) 1 2 3 006aaa157 PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 2 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PESD3V3V4UF XSON6 plastic extremely thin small outline package; SOT886 noleads; 6terminals; body 1· 1.45· 0.5mm PESD5V0V4UF PESD3V3V4UG SC-88A plastic surface-mounted package; 5leads SOT353 PESD5V0V4UG PESD3V3V4UW - plastic surface-mounted package; 5leads SOT665 PESD5V0V4UW 4. Marking Table 5. Marking codes Type number Marking code[1] PESD3V3V4UF A7 PESD5V0V4UF A8 PESD3V3V4UG V1* PESD5V0V4UG V2* PESD3V3V4UW W1 PESD5V0V4UW W2 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode P peak pulse power t =8/20ms [1][2][3] - 16 W PP p I peak pulse current t =8/20ms [1][2][3] - 1.5 A PP p Per device T junction temperature - 150 (cid:176)C j T ambient temperature -65 +150 (cid:176)C amb T storage temperature -65 +150 (cid:176)C stg [1] Non-repetitive current pulse 8/20ms exponential decay waveform according to IEC61000-4-5. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin2 or5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin2. PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 3 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays Table 7. ESD maximum ratings T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Max Unit Per diode V electrostatic discharge voltage IEC61000-4-2 [1][2][3] - 12 kV ESD (contact discharge) MIL-STD-883(human - 10 kV body model) [1] Device stressed with ten non-repetitive ESDpulses. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin2 or5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin2. Table 8. ESD standards compliance Standard Conditions Per diode IEC61000-4-2; level4 (ESD) >8kV(contact) MIL-STD-883; class3 (human body model) >4kV 001aaa631 001aaa630 IPP 120 100 % IPP 100 % IPP; 8 ms 90 % (%) 80 e-t 50 % IPP; 20 ms 40 10 % tr = 0.7 ns to 1 ns t 0 0 10 20 30 40 30 ns t (ms) 60 ns Fig 1. 8/20m s pulse waveform according to Fig 2. ESD pulse waveform according to IEC61000-4-5 IEC61000-4-2 PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 4 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 6. Characteristics Table 9. Characteristics T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit Per diode V reverse standoff voltage RWM PESD3V3V4UF - - 3.3 V PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF - - 5.0 V PESD5V0V4UG PESD5V0V4UW I reverse leakage current RM PESD3V3V4UF V =3.3V - 40 300 nA RWM PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF V =5.0V - 3 25 nA RWM PESD5V0V4UG PESD5V0V4UW V breakdown voltage I =1mA BR R PESD3V3V4UF 5.3 5.6 5.9 V PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF 6.4 6.8 7.2 V PESD5V0V4UG PESD5V0V4UW C diode capacitance f=1MHz d PESD3V3V4UF V =0V - 15 18 pF R PESD3V3V4UG PESD3V3V4UW PESD3V3V4UF V =3.3V - 9 12 pF R PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF V =0V - 12 15 pF R PESD5V0V4UG PESD5V0V4UW PESD5V0V4UF V =5V - 6 9 pF R PESD5V0V4UG PESD5V0V4UW PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 5 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays Table 9. Characteristics …continued T =25(cid:176) C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V clamping voltage [1][2][3] CL PESD3V3V4UF I =1A - - 9 V PP PESD3V3V4UG PESD3V3V4UW PESD3V3V4UF I =2A - - 11 V PP PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF I =1A - - 11 V PP PESD5V0V4UG PESD5V0V4UW PESD5V0V4UF I =1.7A - - 13 V PP PESD5V0V4UG PESD5V0V4UW r differential resistance I =1mA dif R PESD3V3V4UF - - 200 W PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF - - 100 W PESD5V0V4UG PESD5V0V4UW [1] Non-repetitive current pulse 8/20ms exponential decay waveform according to IEC61000-4-5. [2] For PESDxV4UF measured from pin 1, 3, 4 or 6 to pin2 or5. [3] For PESDxV4UG and PESDxV4UW measured from pin 1, 3, 4 or 5 to pin2. 102 006aaa261 1.2 001aaa633 PPP PPP PPP(25(cid:176)C) (W) 0.8 10 0.4 1 0 1 10 102 103 104 0 50 100 150 200 tp (ms) Tj ((cid:176)C) T =25(cid:176)C amb Fig 3. Peak pulse power as a function of exponential Fig 4. Relative variation of peak pulse power as a pulse duration; typical values function of junction temperature; typical values PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 6 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 006aaa262 006aaa263 16 10 Cd (pF) 14 IRM IRM(25 (cid:176)C) 12 1 (1) 10 (2) 8 6 10-1 0 1 2 3 4 5 -100 -50 0 50 100 150 VR (V) Tj ((cid:176)C) f=1MHz; T =25(cid:176)C amb (1) PESD3V3V4UF; PESD3V3V4UG; PESD3V3V4UW (2) PESD5V0V4UF; PESD5V0V4UG; PESD5V0V4UW Fig 5. Diode capacitance as a function of reverse Fig 6. Relativevariationofreverseleakagecurrentas voltage; typical values a function of junction temperature; typical values I -V CL-V BR -V RWM V -I RM -I R - + P-N -I PP 006aaa407 Fig 7. V-Icharacteristics for a unidirectional ESDprotection diode PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 7 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays ESD TESTER 4 GHz DIGITAL RG 223/U OSCILLOSCOPE RZ 450 W 50 W coax 10· ATTENUATOR CZ 50 W DUT Device Under Test IEC 61000-4-2 network CZ = 150 pF; RZ = 330 W vertical scale = 200 V/div vertical scale = 5 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div PESD3V3V4UF/G/W GND PESD5V0V4UF/G/W GND GND unclamped +1 kV ESD voltage waveform clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) GND GND vertical scale = 200 V/div vertical scale = 5 V/div horizontal scale = 50 ns/div horizontal scale = 50 ns/div unclamped - 1 kV ESD voltage waveform clamped - 1 kV ESD voltage waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) 006aab125 Fig 8. ESD clamping test setup and waveforms PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 8 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 7. Application information Thedevicesaredesignedfortheprotectionofuptofourunidirectionaldataorsignallines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground. The devices provide a surge capability of 16W per line for an 8/20ms waveform each. data- or transmission lines DUT DUT 1 5 1 5 2 2 n.c. 3 4 3 4 unidirectional protection of 4 lines bidirectional protection of 3 lines 006aab126 Fig 9. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 9 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 8. Package outline 1.05 0.50 2.2 1.1 0.95 max 1.8 0.8 0.04 0.6 max 5 4 0.45 0.15 0.25 3 4 0.17 0.5 2.2 1.35 1.5 2.0 1.15 2 5 1.4 0.5 1 6 1 2 3 0.3 0.25 0.65 0.40 0.35 0.2 0.10 0.32 0.27 1.3 Dimensions in mm 04-07-22 Dimensions in mm 04-11-16 Fig 10. Package outline PESDxV4UF(SOT886) Fig 11. Package outline PESDxV4UG(SOT353) 1.7 0.6 1.5 0.5 5 4 0.3 0.1 1.7 1.3 1.5 1.1 1 2 3 0.27 0.18 0.5 0.17 0.08 1 Dimensions in mm 04-11-08 Fig 12. Package outline PESDxV4UW(SOT665) PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 10 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 4000 5000 8000 10000 PESD3V3V4UF SOT886 4mm pitch, 8mm tape and reel; T1 [2] - - -115 - - 4mm pitch, 8mm tape and reel; T4 [3] - - -132 - - PESD5V0V4UF SOT886 4mm pitch, 8mm tape and reel; T1 [2] - - -115 - - 4mm pitch, 8mm tape and reel; T4 [3] - - -132 - - PESD3V3V4UG SOT353 4mm pitch, 8mm tape and reel; T1 [2] -115 - - - -135 4mm pitch, 8mm tape and reel; T2 [4] -125 - - - -165 PESD5V0V4UG SOT353 4mm pitch, 8mm tape and reel; T1 [2] -115 - - - -135 4mm pitch, 8mm tape and reel; T2 [4] -125 - - - -165 PESD3V3V4UW SOT665 2mm pitch, 8mm tape and reel - - - -315 - 4mm pitch, 8mm tape and reel - -115 - - - PESD5V0V4UW SOT665 2mm pitch, 8mm tape and reel - - - -315 - 4mm pitch, 8mm tape and reel - -115 - - - [1] For further information and the availability of packing methods, seeSection13. [2] T1: normal taping [3] T4: 90(cid:176) rotated reverse taping [4] T2: reverse taping 10. Soldering 1.250 0.675 0.370 (6· ) 0.500 1.700 solder lands 0.500 solder paste 0.270 (6· ) occupied area Dimensions in mm 0.325 0.425 (6· ) (6·) sot886_fr Reflow soldering is the only recommended soldering method. Fig 13. Reflow soldering footprint PESDxV4UF(SOT886) PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 11 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 2.65 0.60 (1· ) 2.35 0.40 0.90 2.10 0.50 (4· ) 0.50 solder lands (4· ) solder paste 1.20 solder resist 2.40 occupied area Dimensions in mm sot353_fr Fig 14. Reflow soldering footprint PESDxV4UG(SOT353/SC-88A) 2.25 2.65 4.50 2.70 0.70 0.30 1.00 4.00 1.15 solder lands 3.75 solder resist transport direction during soldering occupied area Dimensions in mm Fig 15. Wave soldering footprint PESDxV4UG(SOT353/SC-88A) PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 12 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 2.45 2.10 1.60 0.15 (2x) 0.70 0.45 0.40 (2· ) (2· ) (5· ) 2.00 1.70 1.00 0.30 0.55 0.375 (2· ) 1.25 1.375 1.20 2.20 solder lands placement area 0.075 solder resist occupied area Dimensions in mm Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint PESDxV4UW(SOT665) PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 13 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PESDXV4UF_G_W_3 20080128 Product data sheet - PESDXV4UG_SER_2 PESDXV4UW_SER_1 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type numbers PESD3V3V4UF and PESD5V0V4UF added • Table 1 “Product overview”: added • Figure7: added • Section 9 “Packing information”: added • Section 10 “Soldering”: added • Section 12 “Legal information”: updated PESDXV4UG_SER_2 20050407 Product data sheet - PESDXV4UG_SER_1 PESDXV4UW_SER_1 20050422 Product data sheet - - PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 14 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatus information is available on the Internet at URLhttp://www.nexperia.com. 12.2 Definitions malfunction of a Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia accepts no liability for inclusion and/or use of Draft —The document is a draft version only. The content is still under Nexperia products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. Nexperia does not give any representations or warranties as to the accuracy or completeness of Applications —Applications that are described herein for any of these informationincludedhereinandshallhavenoliabilityfortheconsequencesof products are for illustrative purposes only. Nexperia makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet —A short data sheet is an extract from a full data sheet withthesameproducttypenumber(s)andtitle.Ashortdatasheetisintended Limiting values —Stress above one or more limiting values (as defined in forquickreferenceonlyandshouldnotbereliedupontocontaindetailedand theAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanent full information. For detailed and full information see the relevant full data damagetothedevice.Limitingvaluesarestressratingsonlyandoperationof sheet, which is available on request via the local Nexperia sales the device at these or any other conditions above those given in the office. In case of any inconsistency or conflict with the short data sheet, the Characteristics sections of this document is not implied. Exposure to limiting full data sheet shall prevail. values for extended periods may affect device reliability. Terms and conditions of sale —Nexperia products are sold 12.3 Disclaimers subjecttothegeneraltermsandconditionsofcommercialsale,aspublished athttp://www.nexperia.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless General —Information in this document is believed to be accurate and explicitly otherwise agreed to in writing by Nexperia. In case of reliable.However,Nexperiadoesnotgiveanyrepresentationsor any inconsistency or conflict between information in this document and such warranties,expressedorimplied,astotheaccuracyorcompletenessofsuch terms and conditions, the latter will prevail. information and shall have no liability for the consequences of use of such No offer to sell or license —Nothing in this document may be interpreted information. or construed as an offer to sell products that is open for acceptance or the Right to make changes —Nexperiareservestherighttomake grant,conveyanceorimplicationofanylicenseunderanycopyrights,patents changes to information published in this document, including without or other industrial or intellectual property rights. limitation specifications and product descriptions, at any time and without notice.Thisdocumentsupersedesandreplacesallinformationsuppliedprior to the publication hereof. 12.4 Trademarks Suitability for use —Nexperia products are not designed, Notice:Allreferencedbrands,productnames,servicenamesandtrademarks authorized or warranted to be suitable for use in medical, military, aircraft, are the property of their respective owners. space or life support equipment, nor in applications where failure or 13. Contact information For additional information, please visit:http://www.nexperia.com For sales office addresses, send an email to:salesaddresses@nexperia.com PESDXV4UF_G_W_3 © Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 03 — 28 January 2008 15 of 16

PESDxV4UF/G/W Nexperia Very low capacitance quadruple ESD protection diode arrays 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Application information. . . . . . . . . . . . . . . . . . . 9 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Packing information. . . . . . . . . . . . . . . . . . . . . 11 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13 Contact information. . . . . . . . . . . . . . . . . . . . . 15 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 © Nexperia B.V. 2017. All rights reserved For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com Date of release: 28 January 2008