Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

PESD16VX1UL Ultra low capacitance unidirectional ESD protection diode Rev. 01 — 16 December 2009 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. The combination of extremely low capacitance, high ESD maximum rating and ultra small package makes the device ideal for high-speed data line protection and antenna protection applications. 1.2 Features (cid:132) Unidirectional ESD protection of one line (cid:132) ESD protection up to 8 kV (cid:132) Ultra low diode capacitance: (cid:132) IEC 61000-4-2; level 4 (ESD) C = 0.83 pF d (cid:132) Low ESD clamping voltage: (cid:132) AEC-Q101 qualified 40 V at 30 ns and ±8 kV (cid:132) Very low leakage current: I < 10 nA RM 1.3 Applications (cid:132) 10/100/1000 Mbit/s Ethernet (cid:132) Portable electronics (cid:132) FireWire (cid:132) Communication systems (cid:132) High-speed data lines (cid:132) Computers and peripherals (cid:132) Subscriber Identity Module (SIM) card (cid:132) Audio and video equipment protection (cid:132) Cellular handsets and accessories (cid:132) Antenna protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V reverse standoff voltage - - 16 V RWM C diode capacitance f = 1 MHz; V = 0 V - 0.83 0.98 pF d R

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode 1 2 1 2 006aaa152 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PESD16VX1UL - leadless ultra small plastic package; 2 terminals; SOD882 body 1.0 × 0.6 × 0.5 mm 4. Marking Table 4. Marking codes Type number Marking code PESD16VX1UL Z1 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit I peak pulse current t = 8/20 μs [1][2] - 0.9 A PP p T junction temperature - 85 °C j T ambient temperature −40 +85 °C amb T storage temperature −55 +125 °C stg [1] Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin 1 to 2. PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 2 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode Table 6. ESD maximum ratings T = 25 °C unless otherwise specified. amb Symbol Parameter Conditions Min Max Unit V electrostatic discharge voltage IEC 61000-4-2 [1][2] - 8 kV ESD (contact discharge) MIL-STD-883 (human - 10 kV body model) [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin 1 to 2. Table 7. ESD standards compliance Standard Conditions IEC 61000-4-2; level 4 (ESD) > 8 kV (contact) MIL-STD-883; class 3 (human body model) > 4 kV 001aaa631 001aaa630 IPP 120 100 % IPP 100 % IPP; 8 μs 90 % (%) 80 e−t 50 % IPP; 20 μs 40 10 % tr = 0.7 ns to 1 ns t 0 0 10 20 30 40 30 ns t (μs) 60 ns Fig 1. 8/20 μs pulse waveform according to Fig 2. ESD pulse waveform according to IEC 61000-4-5 IEC 61000-4-2 PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 3 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 6. Characteristics Table 8. Characteristics T = 25 °C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V reverse standoff - - 16 V RWM voltage I reverse leakage current V = 16 V - 10 100 nA RM RWM V breakdown voltage I = 10 mA 17.5 22 30 V BR R C diode capacitance f = 1 MHz; V = 0 V - 0.83 0.98 pF d R V clamping voltage I = 0.9 A [1][2] - 34 - V CL PP r dynamic resistance I = 10 A [3] - 2.4 - Ω dyn R [1] Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin 1 to 2. [3] Non-repetitive current pulse, Transmission Line Pulse (TLP) t = 100 ns; square pulse; p ANS/IESD STM5.1-2008. I 006aab951 1.0 Cd (pF) 0.9 0.8 −VCL−VBR −VRWM V −IRM −IR 0.7 − + P-N 0.6 0.5 −IPP 0 4 8 12 16 VR (V) 006aaa407 f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse Fig 4. V-I characteristics for a unidirectional voltage; typical values ESD protection diode PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 4 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode ESD TESTER 4 GHz DIGITAL RG 223/U OSCILLOSCOPE RZ 450 Ω 50 Ω coax 10× ATTENUATOR CZ 50 Ω DUT (DEVICE IEC 61000-4-2 network UNDER CZ = 150 pF; RZ = 330 Ω TEST) vertical scale = 2 kV/div vertical scale = 50 V/div horizontal scale = 15 ns/div horizontal scale = 15 ns/div GND GND unclamped +8 kV ESD pulse waveform clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin1 to 2 vertical scale = 2 kV/div vertical scale = 50 V/div horizontal scale = 15 ns/div horizontal scale = 15 ns/div GND GND unclamped −8 kV ESD pulse waveform clamped −8 kV ESD pulse waveform (IEC 61000-4-2 network) (IEC 61000-4-2 network) pin 1 to 2 006aab952 Fig 5. ESD clamping test setup and waveforms PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 5 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 7. Application information PESD16VX1UL is designed for the protection of one unidirectional data or signal line from the damage caused by ESD and surge pulses. The device may be used on lines where the signal polarities are either positive or negative with respect to ground. Figure 6 shows a typical application for the bidirectional protection of one line using two PESD16VX1UL diodes in a back-to-back configuration, e.g. Near Field Communication (NFC) antenna protection. line to be protected GND 006aab953 Fig 6. Typical application Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. The path length between the device and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 6 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 9. Package outline 0.62 0.50 0.55 0.46 0.30 2 0.22 1.02 0.65 0.95 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm 03-04-17 Fig 7. Package outline PESD16VX1UL (SOD882) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10 000 PESD16VX1UL SOD882 2 mm pitch, 8 mm tape and reel -315 [1] For further information and the availability of packing methods, see Section 14. 11. Soldering 1.3 0.7 R0.05 (8×) solder lands 0.6 0.7 solder resist 0.9 (2×) (2×) solder paste occupied area 0.3 (2×) Dimensions in mm 0.4 (2×) sod882_fr Reflow soldering is the only recommended soldering method. Fig 8. Reflow soldering footprint PESD16VX1UL (SOD882) PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 7 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD16VX1UL_1 20091216 Product data sheet - - PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 8 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the information included herein and shall have no liability for the consequences of specified use without further testing or modification. use of such information. Limiting values — Stress above one or more limiting values (as defined in Short data sheet — A short data sheet is an extract from a full data sheet the Absolute Maximum Ratings System of IEC 60134) may cause permanent with the same product type number(s) and title. A short data sheet is intended damage to the device. Limiting values are stress ratings only and operation of for quick reference only and should not be relied upon to contain detailed and the device at these or any other conditions above those given in the full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability. office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale — NXP Semiconductors products are sold full data sheet shall prevail. subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, 13.3 Disclaimers intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such General — Information in this document is believed to be accurate and terms and conditions, the latter will prevail. reliable. However, NXP Semiconductors does not give any representations or No offer to sell or license — Nothing in this document may be interpreted or warranties, expressed or implied, as to the accuracy or completeness of such construed as an offer to sell products that is open for acceptance or the grant, information and shall have no liability for the consequences of use of such conveyance or implication of any license under any copyrights, patents or information. other industrial or intellectual property rights. Right to make changes — NXP Semiconductors reserves the right to make Export control — This document as well as the item(s) described herein changes to information published in this document, including without may be subject to export control regulations. Export might require a prior limitation specifications and product descriptions, at any time and without authorization from national authorities. notice. This document supersedes and replaces all information supplied prior to the publication hereof. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this Suitability for use — NXP Semiconductors products are not designed, document, and as such is not complete, exhaustive or legally binding. authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected 13.4 Trademarks to result in personal injury, death or severe property or environmental Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PESD16VX1UL_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 16 December 2009 9 of 10

PESD16VX1UL NXP Semiconductors Ultra low capacitance unidirectional ESD protection diode 15. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 6 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 December 2009 Document identifier: PESD16VX1UL_1