PCA82C250 CAN controller interface Rev. 06 — 25 August 2011 Product data sheet 1. General description The PCA82C250 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. 2. Features and benefits  Fully compatible with the “ISO11898” standard  High speed (up to 1MBd)  Bus lines protected against transients in an automotive environment  Slope control to reduce Radio Frequency Interference (RFI)  Differential receiver with wide common-mode range for high immunity against ElectroMagnetic Interference (EMI)  Thermally protected  Short-circuit proof to battery and ground  Low-current Standby mode  An unpowered node does not disturb the bus lines  At least 110nodes can be connected 3. Applications  High-speed automotive applications (up to 1MBd). 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Max Unit V supply voltage 4.5 5.5 V CC I supply current Standby mode - 170 A CC 1/t maximum transmission speed non-return-to-zero 1 - MBd bit V CANH, CANL input/output voltage 8 +18 V CAN V differential bus voltage 1.5 3.0 V diff t propagation delay High-speed mode - 50 ns PD T ambient temperature 40 +125 C amb

PCA82C250 NXP Semiconductors CAN controller interface 5. Ordering information Table 2. Ordering info rmation Type number Package Name Description Version PCA82C250T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 6. Block diagram VCC 3 1 PROTECTION TXD DRIVER 8 SLOPE/ Rs STANDBY HS 7 CANH 4 RXD RECEIVER 6 CANL 5 REFERENCE Vref VOLTAGE PCA82C250 2 GND mka669 Fig 1. Block diagram 7. Pinning information 7.1 Pinning TXD 1 8 Rs GND 2 7 CANH PCA82C250 VCC 3 6 CANL RXD 4 5 Vref mka670 Fig 2. Pin configuration PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 2 of 18

PCA82C250 NXP Semiconductors CAN controller interface 7.2 Pin description Table 3. Pin description Symbol Pin Description TXD 1 transmit data input GND 2 ground V 3 supply voltage CC RXD 4 receive data output V 5 reference voltage output ref CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input 8. Functional description The PCA82C250 is the interface between a CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications (up to 1MBd). The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO11898” standard. A current limiting circuit protects the transmitter output stage against short-circuit to positive and negative battery voltage. Although the power dissipation is increased during this fault condition, this feature will prevent destruction of the transmitter output stage. If the junction temperature exceeds a value of approximately 160C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for the major part of the power dissipation, this will result in reduced power dissipation and hence a lower chip temperature. All other parts of the PCA82C250 will remain in operation. The thermal protection is needed, in particular, when a bus line is short-circuited. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Pin8 (Rs) allows three different modes of operation to be selected: High-speed, Slope control and Standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The High-speed mode is selected by connecting pin8 to ground. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin8 to ground. The slope is proportional to the current output at pin8. If a HIGH level is applied to pin8, the circuit enters a low-current Standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9V), RXD will be switched to a PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 3 of 18

PCA82C250 NXP Semiconductors CAN controller interface LOW level. Themicrocontroller should react to this condition by switching the transceiver back to normal operation (via pin8). Because the receiver is slow in Standby mode, the first message will be lost. Table 4. Truth table of the CAN transceiver Supply TXD CANH CANL Bus state RXD 4.5Vto5.5V 0 HIGH LOW dominant 0 4.5Vto5.5V 1 (or floating) floating floating recessive 1 <2V (not powered) X[1] floating floating recessive X[1] 2V<V <4.5V >0.75V floating floating recessive X[1] CC CC 2V<V <4.5V X[1] floating if floating if recessive X[1] CC V >0.75V V >0.75V Rs CC Rs CC [1] X=don’t care. Table 5. PinRs summary Condition forced at pinRs Mode Resulting voltage or current at pinRs V >0.75V Standby I <10A Rs CC Rs 10A<I <200A Slope control 0.4V <V <0.6V Rs CC Rs CC V <0.3V High-speed I <500A Rs CC Rs 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin2; positiveinput current. Symbol Parameter Conditions Min Max Unit V supply voltage 0.3 +9.0 V CC V DC voltage at pins1,4,5 and8 0.3 V +0.3 V n CC V DC voltage at pins6 and7 0V<V <5.5V; 8.0 +18.0 V 6,7 CC notimelimit V transient voltage at pins6 and7 see Figure8 150 +100 V trt T storage temperature 55 +150 C stg T ambient temperature 40 +125 C amb T virtual junction temperature [1] 40 +150 C vj V electrostatic discharge voltage [2] 2000 +2000 V esd [3] 200 +200 V [1] In accordance with “IEC60747-1”. An alternative definition of virtual junction temperature is: Tvj=Tamb+PdRth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P ) and ambient temperature (T ). d amb [2] ClassificationA: human body model; C=100pF; R=1500; V=2000V. [3] ClassificationB: machine model; C=200pF; R=25; V=200V. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 4 of 18

PCA82C250 NXP Semiconductors CAN controller interface 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to ambient in free air 160 K/W th(j-a) 11. Characteristics Table 8. Characterist ics V =4.5to5.5V; T =40to+125C; R =60; I >10A; unless otherwise specified; all voltages referenced to CC amb L 8 ground (pin2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25C. Symbol Parameter Conditions Min Typ Max Unit Supply I supply current dominant; V =1V - - 70 mA 3 1 recessive; V =4V; R =47k - - 14 mA 1 8 recessive; V =4V; V =1V - - 18 mA 1 8 Standby; T <90C [1] - 100 170 A amb DC bus transmitter V HIGH-level input voltage output recessive 0.7V - V +0.3 V IH CC CC V LOW-level input voltage output dominant 0.3 - 0.3V V IL CC I HIGH-level input current V =4V 200 - +30 A IH 1 I LOW-level input current V =1V 100 - 600 A IL 1 V recessive bus voltage V =4V; no load 2.0 - 3.0 V 6,7 1 I off-state output leakage current 2V<(V V )<7V 2 - +1 mA LO 6, 7 5V<(V V )<18V 5 - +12 mA 6, 7 V CANH output voltage V =1V 2.75 - 4.5 V 7 1 V CANL output voltage V =1V 0.5 - 2.25 V 6 1 V difference between output V =1V 1.5 - 3.0 V 6,7 1 voltage at pins6 and7 V =1V; R =45; V 4.9V 1.5 - - V 1 L CC V =4V; no load 500 - +50 mV 1 I short-circuit CANH current V =5V; V 5V - - 105 mA sc7 7 CC V =5V; V =5.5V - - 120 mA 7 CC I short-circuit CANL current V =18V - - 160 mA sc6 6 DC bus receiver: V =4V; pins6 and7 externally driven; 2V<(V V )<7V; unless otherwise specified 1 6, 7 V differential input voltage 1.0 - +0.5 V diff(r) (recessive) 7V<(V V )<12V; 1.0 - +0.4 V 6, 7 notStandbymode V differential input voltage 0.9 - 5.0 V diff(d) (dominant) 7V<(V V )<12V; 1.0 - 5.0 V 6, 7 notStandbymode V differential input hysteresis see Figure5 - 150 - mV diff(hys) V HIGH-level output voltage pin4; I =100A 0.8V - V V OH 4 CC CC PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 5 of 18

PCA82C250 NXP Semiconductors CAN controller interface Table 8. Characteristics …continued V =4.5to5.5V; T =40to+125C; R =60; I >10A; unless otherwise specified; all voltages referenced to CC amb L 8 ground (pin2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25C. Symbol Parameter Conditions Min Typ Max Unit V LOW-level output voltage pin4; I =1mA 0 - 0.2V V OL 4 CC I =10mA 0 - 1.5 V 4 R input resistance CANH, CANL 5 - 25 k i R differential input resistance 20 - 100 k diff C input capacitance CANH, CANL - - 20 pF i C differential input capacitance - - 10 pF diff Reference output V reference output voltage V =1V; 50A<I <50A 0.45V - 0.55V V ref 8 5 CC CC V =4V; 5A<I <5A 0.4V - 0.6V V 8 5 CC CC Timing (C =100 pF; see Figure3, Figure4, Figure6 and Figure7) L t minimum bit time R =0 - - 1 s bit ext t delay TXD to bus active R =0 - - 50 ns onTXD ext t delay TXD to bus inactive R =0 - 40 80 ns offTXD ext t delay TXD to receiver active R =0 - 55 120 ns onRXD ext t delay TXD to receiver inactive R =0; V <5.1V; T <+85C - 82 150 ns offRXD ext CC amb R =0; V <5.1V; T <+125C - 82 170 ns ext CC amb R =0; V <5.5V; T <+85C - 90 170 ns ext CC amb R =0; V <5.5V; T <+125C - 90 190 ns ext CC amb t delay TXD to receiver active R =47k - 390 520 ns onRXD ext R =24k - 260 320 ns ext t delay TXD to receiver inactive R =47k - 260 450 ns offRXD ext R =24k - 210 320 ns ext SR differential output voltage R =47k - 14 - V/s ext slewrate t wake-up time from Standby viapin8 - - 20 s WAKE t bus dominant to RXD LOW V =4V; Standby mode - - 3 s dRXDL 8 Standby/Slope Control (pin8) V input voltage for high-speed - - 0.3V V 8 CC I input current for high-speed V =0V - - 500 A 8 8 V input voltage for Standby mode 0.75V - - V stb CC I slope control mode current 10 - 200 A slope V slope control mode voltage 0.4V - 0.6V V slope CC CC [1] I =I =I =0mA; 0V<V <V ; 0V<V <V ; V =V . 1 4 5 6 CC 7 CC 8 CC PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 6 of 18

PCA82C250 NXP Semiconductors CAN controller interface +5 V 100 nF VCC TXD CANH PCA82C250 Vref 60 Ω 100 pF CANL RXD GND Rs 30 pF Rext 015aaa208 Fig 3. Test circuit for dynamic characteristics. VCC VTXD 0 V 0.9 V Vdiff 0.5 V 0.7VCC VRXD 0.3VCC tonTXD toffTXD tonRXD toffRXD mka672 Fig 4. Timing diagram for dynamic characteristics. VRXD HIGH LOW hysteresis 0.5 V 0.9 V Vdiff mka673 Fig 5. Hysteresis. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 7 of 18

PCA82C250 NXP Semiconductors CAN controller interface VCC VRs 0 V VRXD tWAKE mka674 V =1V. 1 Fig 6. Timing diagram for wake-up from Standby. 1.5 V Vdiff 0 V VRXD tdRXDL mka675 V =4V; V =4V. 1 8 Fig 7. Timing diagram for bus dominant to RXD LOW. +5 V VCC 1 nF TXD CANH PCA82C250 SCHAFFNER RXD 60 Ω GENERATOR 1 nF CANL Vref GND Rs Rext 015aaa246 The waveforms of the applied transients shall be in accordance with “ISO7637 part1”, test pulses 1,2,3aand3b. Fig 8. Test circuit for automotive transients. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 8 of 18

PCA82C250 NXP Semiconductors CAN controller interface 12. Application information P8xC592/P8xCE598 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y Rext +5 V TXD RXD Vref Rs VCC PCA82C250T CAN-TRANSCEIVER 100 nF GND CANH CANL 124 Ω CAN BUS 124 Ω LINE mka677 Fig 9. Application of the CAN transceiver. SJA1000 CAN-CONTROLLER TX0 TX1 RX0 RX1 6.8 kΩ 3.6 kΩ +5 V 390 Ω VDD 390 Ω 100 nF VSS 6N137 0 V 6N137 100 nF +5 V 390 Ω 390 Ω +5 V +5 V TXD RXD Vref Rs VCC PCA82C250 CAN-TRANSCEIVER 100 nF Rext GND CANH CANL 124 Ω CAN BUS LINE 124 Ω mka678 Fig 10. Application with galvanic isolation. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 9 of 18

PCA82C250 NXP Semiconductors CAN controller interface VCC 3 1 TXD 8 Rs 4 RXD 7 CANH PCA82C250 CANL 5 6 Vref 2 GND mka679 Fig 11. Internal pin configuration. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 10 of 18

PCA82C250 NXP Semiconductors CAN controller interface 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 8 5 Q A2 A1 (A 3 ) A pin 1 index θ Lp 1 4 L e w M detail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ 0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7 mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8o 0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0o inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004 0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-27 SOT96-1 076E03 MS-012 03-02-18 Fig 12. Package outline SOT96-1 (SO8) PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 11 of 18

PCA82C250 NXP Semiconductors CAN controller interface 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 12 of 18

PCA82C250 NXP Semiconductors CAN controller interface 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure13) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table9 and10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure13. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 13 of 18

PCA82C250 NXP Semiconductors CAN controller interface maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 14 of 18

PCA82C250 NXP Semiconductors CAN controller interface 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA82C250_6 20110825 Product data sheet - PCA82C250_5 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP8 package discontinued; bare die no longer available. • Typing errors corrected in Table8, Figure3 and Figure8. PCA82C250 v.5 20000113 Product specification - PCA82C250 v.3 PCA82C250 v.3 19971021 Preliminary specification PCA82C250 v.2 PCA82C250 v.2 19940915 - PCA82C250 v.1 PCA82C250 v.1 19940408 - - PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 15 of 18

PCA82C250 NXP Semiconductors CAN controller interface 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. 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This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or Suitability for use in automotive applications — This NXP other industrial or intellectual property rights. Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 16 of 18

PCA82C250 NXP Semiconductors CAN controller interface Export control — This document as well as the item(s) described herein 16.4 Trademarks may be subject to export control regulations. Export might require a prior authorization from national authorities. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA89C250 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 06 — 25 August 2011 17 of 18

PCA82C250 NXP Semiconductors CAN controller interface 18. Contents 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Application information. . . . . . . . . . . . . . . . . . . 9 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 11 14 Soldering of SMD packages . . . . . . . . . . . . . . 12 14.1 Introduction to soldering. . . . . . . . . . . . . . . . . 12 14.2 Wave and reflow soldering. . . . . . . . . . . . . . . 12 14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 12 14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 13 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 August 2011 Document identifier: PCA89C250

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: PCA82C250T/N4,112 PCA82C250T/N4,115 PCA82C250T/N4,118 PCA82C250T/YM,112 PCA82C250T/YM,115 PCA82C250T/YM,118