PC900V0NSZXF Series PC900V0NSZXF Digital Output, Normal OFF Operation DIP 6 pin ∗OPIC Series Photocoupler ■ Description ■ Agency approvals/Compliance PC900V0NSZXF Series contains an IRED optically 1.Recognized by UL1577 (Double protection isolation), coupled to an OPIC chip. file No. E64380 (as model No. PC900V) It is packaged in a 6 pin DIP, available in SMT 2. Approved by VDE, DIN EN60747-5-2(∗) (as an gullwing lead-form and Wide SMT gullwing lead-form option), file No. 40008189 (as model No. PC900V) option. 3. Package resin : UL flammability grade (94V-0) Input-output isolation voltage(rms) is 5.0kV. (∗)DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features ■ Applications 1. 6 pin DIP package 2. Double transfer mold package 1. Programmable controllers (Ideal for Flow Soldering) 2. PC peripherals 3. Normal OFF operation, open collector output 3. Electronic musical instruments 4. TTL and LSTTL compatible output 5. Operating supply voltage (V : 3 to 15 V) CC 6. Isolation voltage (V : 5.0 kV) iso(rms) 7. Lead-free and RoHS directive compliant ∗"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. NoticeThe content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D2-A05302EN 1 Date Jun. 30. 2005 © SHARP Corporation

PC900V0NSZXF Series ■ Internal Connection Diagram 6 5 4 1 Anode 2 Cathode Voltage 3 NC regulator Amp 4 V O 5 GND 6 V 1 2 3 CC ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC900V0NSZXF] 2. Through-Hole (VDE option) [ex. PC900V0YSZXF] 1.2±0.3 1.2±0.3 0.6±0.2 0.6±0.2 SHARP 6 5 4 SHARP 6 5 4 VDE Identification mark mark mark "S" PC900V "S" PC900V 5 Anode 0.±6.5 4 0.5±5 mark 6. Anode 1 2 3 Date code mark 1 2 3 Date code 7.12±0.5 7.12±0.5 7.62±0.3 7.62±0.3 0.5±9 0.5±3.5 TYP.0.5 0.5±9 0.5±3.5 TYP.0.5 2. 2. Epoxy resin Epoxy resin 2.54±0.25 0.5±0.10.5±25 θ θ 2.54±0.25 0.5±0.10.5±25 θ θ 3. θ : 0 to 13˚ 3. θ : 0 to 13˚ Product mass : approx. 0.36g Product mass : approx. 0.36g 3. SMT Gullwing Lead-Form [ex. PC900V0NIPXF] 4. SMT Gullwing Lead-Form (VDE option) [ex. PC900V0YIPXF] 0.6±0.2 1.2±0.3 0.6±0.2 1.2±0.3 6 5 4 6 5 4 SHARP SHARP VDE Identification mark mark mark "S" "S" PC900V PC900V 5 5 0. 0. ± ± Anode 6.5 4 6.5 mark Anode Date code mark Date code 1 2 3 1 2 3 7.12±0.5 7.12±0.5 7.62±0.3 7.62±0.3 5 5 2 2 0.5±3.5 0.1±0.26 0.±0.35 0.5±3.5 0.1±0.26 0.±0.35 2.54±0.25 1.0+−00.4 Epoxy resin 1.0+−00 . 4 2.54±0.25 1.0+−00.4 Epoxy resin 1.0+−00. 4 10.0+−00.5 10.0+−00.5 Product mass : approx. 0.35g Product mass : approx. 0.35g Sheet No.: D2-A05302EN 2

PC900V0NSZXF Series (Unit : mm) 5. Wide SMT Gullwing Lead-Form 6. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC900V0NUPXF] [ex. PC900V0YUPXF] 0.6±0.2 1.2±0.3 0.6±0.2 1.2±0.3 SHARP SHARP mark mark "S" "S" PC900V PC900V 5 5 0. 0. ± ± Anode 6.5 4 6.5 mark Anode Date code mark Date code VDE Identification mark 7.12±0.5 7.62±0.3 7.12±0.5 7.62±0.3 5 5 2 2 0.5±3.5 0.1±0.26 0.±0.25 0.5±3.5 0.1±0.26 0.±0.25 Epoxy resin Epoxy resin 2.54±0.25 0.75±0.25 10.16±0.5 0.75±0.25 2.54±0.25 0.75±0.25 10.16±0.5 0.75±0.25 12.0MAX. 12.0MAX. Product mass : approx. 0.35g Product mass : approx. 0.35g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A05302EN 3

PC900V0NSZXF Series Date code (2 digit) 1st digit 2nd digit Year of production Month of production A.D. Mark A.D Mark Month Mark 1990 A 2002 P January 1 1991 B 2003 R February 2 1992 C 2004 S March 3 1993 D 2005 T April 4 1994 E 2006 U May 5 1995 F 2007 V June 6 1996 H 2008 W July 7 1997 J 2009 X August 8 1998 K 2010 A September 9 1999 L 2011 B October O 2000 M 2012 C November N · · 2001 N ·· ·· December D repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator. Sheet No.: D2-A05302EN 4

PC900V0NSZXF Series ■ Absolute Maximum Ratings (T=25˚C) a Parameter Symbol Rating Unit Forward current I 50 mA F *1Peak forward current I 1 A Input FM Reverse voltage V 6 V R Power dissipation P 70 mW Supply voltage V 16 V CC High level output voltage V 16 V Output OH Low level output current I 50 mA OL Power dissipation P 150 mW O Total power dissipation P 170 mW tot Operating temperature T −25 to +85 ˚C opr Storage temperature T −40 to +125 ˚C stg *2Isolation voltage V 5.0 kV iso (rms) *3Soldering temperature T 260 ˚C sol *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics (Unless otherwise specified T=0 to +70˚C) a Parameter Symbol Conditions MIN. TYP. MAX. Unit I =4mA − 1.1 1.4 Forward voltage V F V ut F IF=0.3mA 0.7 1.0 − p n Reverse current I T=25˚C, V =3V − − 10 µA I R a R Terminal capacitance C T=25˚C, V=0, f=1kHz − 30 250 pF t a Operating Supply voltage V − 3 − 15 V CC Low level output voltage V I =16mA, V =5V, I =4mA − 0.2 0.4 V OL OL CC F High level output current I V =V =15V, I =0 − − 100 µA OH O CC F Low level supply current I V =5V, I =4mA − 2.5 5.0 mA CCL CC F High level supply current I V =5V, I =0 − 1.0 5.0 mA ut CCH CC F utp *4"High→Low" input I Ta=25˚C, VCC=5V, RL=280Ω − 1.1 2.0 mA O threshold current FHL V =5V, R =280Ω − − 4.0 CC L *5"Low→High" input T=25˚C, V =5V, R =280Ω 0.4 0.8 − I a CC L mA threshold current FLH V =5V, R =280Ω 0.3 − − CC L *6Hysteresis I /I V =5V, R =280Ω 0.5 0.7 0.9 − FLH FHL CC L Isolation voltage R T=25˚C, DC500V, 40 to 60%RH 5×1010 1×1011 − Ω ISO a Transfer characteristics Response time ""RFLHaioislgwleh →→ ttiHimLmiogewhe"" pprrooppaaggaattiioonn ddeellaayy ttiimmee ttPPttHLfrHL Ta=25˚C, R VL=C2C=805ΩV, IF=4mA −−−− 00.120.15 0036..55 µs *4 I represents forward current when output goes from high to low. FHL *5 I represents forward current when output goes from low to high. FLH *6 Hysteresis stands for I /I . FLH FHL Sheet No.: D2-A05302EN 5

PC900V0NSZXF Series ■ Model Line-up Lead Form Through-Hole SMT Gullwing Wide SMT Gullwing Sleeve Taping Package 50pcs/sleeve 50pcs/sleeve DIN −−−−−− Approved −−−−−− Approved −−−−−− Approved −−−−−− Approved EN60747-5-2 Model No. PC900V0NSZXF PC900V0YSZXF PC900V0NIZXF PC900V0YIZXF PC900V0NIPXF PC900V0YIPXF PC900V0NUPXF PC900V0YUPXF Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A05302EN 6

PC900V0NSZXF Series Fig.1 Test Circuit for Response Time Voltage regulator 50% VIN 5V tPHL tPLH tr=tf=0.01µs 280Ω ZO=50Ω VIN Amp VO VOH 47Ω 0.1µF VO 90%1.5V 10% tf tr VOL Fig.2 Forward Current vs. Ambient Fig.3 Power Dissipation vs. Ambient Temperature Temperature 60 200 Ptot 50 170 current I (mA)F 4300 ation P, P (mW)Otot 110500 PO ward 20 dissip For wer 50 o P 10 0 0 −25 0 25 50 75 85 100 −25 0 25 50 75 85 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.4 Forward Current vs. Forward Voltage Fig.5 Relative Input Threshold Current vs. Supply Voltage 1.4 Ta=25˚C Ta=75˚C LH IFHL=1 at VCC=5V (mA)F 100 50˚C −22550˚˚˚CCC urrent I, IFHLF 11..20 IFHL d current I hreshold c 0.8 IFLH war 10 ut t 0.6 or np F e i v ati 0.4 el R 1 0.2 0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 Forward voltage VF (V) Supply voltage VCC (V) Sheet No.: D2-A05302EN 7

PC900V0NSZXF Series Fig.6 Relative Input Threshold Current vs. Fig.7 Low Level Output Voltage vs. Low Ambient Temperature Level Output Current 1.6 1 H VCC=5V VCC=5V , ILFL 1.4 V) Ta=25˚C nt IFH 1.2 V (OL hreshold curre 0.18 IFHL utput voltage 0.1 ative input t 0.6 IFLH Low level o el 0.4 R IFHL=1 at Ta=25˚C 0.2 0.01 −25 0 25 50 75 100 1 10 100 Ambient temperature Ta (˚C) Low level output current IOL (mA) Fig.8 Low Level Output Voltage vs. Ambient Fig.9 Supply Current vs. Supply Voltage Temperature 0.5 9 Ta= −25˚C VCC=5V IOL=30mA 8 (V)OL 0.4 A) 7 25˚C V m 6 voltage 0.3 nt I(CC 5 output 0.2 16mA y curre 4 85˚C Ta= −25˚C w level 5mA Suppl 23 25˚C Lo 0.1 ICCL{ 85˚C 1 ICCH{ 0 0 −25 0 25 50 75 100 1 3 5 7 9 11 13 15 17 Ambient temperature Ta (˚C) Supply voltage VCC (V) Fig.10 Propagation Delay Time vs. Forward Fig.11 Rise Time, Fall Time vs. Load Current Resistance 5 0.5 VCC=5V VCC=5V RL=280Ω IF=4mA s)µ Ta=25˚C Ta=25˚C (PLH 4 tPLH s)µ 0.4 me t, tPHL 3 me t, t (rf 0.3 ation delay ti 2 se time, fall ti 0.2 tr pag 1 Ri 0.1 o Pr tPHL tf 0 0 0 10 20 30 40 50 60 0.1 1 10 Forward current IF (mA) Load resistance RL (kΩ) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A05302EN 8

PC900V0NSZXF Series ■ Design Considerations ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. I . FHL Sheet No.: D2-A05302EN 9

PC900V0NSZXF Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form Wide SMT Gullwing Lead-form 8.5 10.5 4 4 5 5 2. 2. 4 4 5 5 2. 2. 7 7 1. 1. 2.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A05302EN 10

PC900V0NSZXF Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 100 150 to 180˚C, 120s or less 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A05302EN 11

PC900V0NSZXF Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A05302EN 12

PC900V0NSZXF Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 520±2 8 0. 1 8 5. 6.7 (Unit : mm) Sheet No.: D2-A05302EN 13

PC900V0NSZXF Series ● Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G E I C B A H H .X A K M˚5 Dimensions List (Unit:mm) A B C D E F G 16.0±0.3 7.5±0.1 1.75±0.1 12.0±0.1 2.0±0.1 4.0±0.1 φ1.5+0.1 −0 H I J K 10.4±0.1 0.4±0.05 4.2±0.1 7.8±0.1 Reel structure and Dimensions e d g c Dimensions List (Unit : mm) a b c d 330 17.5±1.5 100±1.0 13±0.5 f e f g a b 23±1.0 2.0±0.5 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A05302EN 14

PC900V0NSZXF Series 2. Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G J I E C B A H H .X K AM˚5 Dimensions List (Unit : mm) A B C D E F G 24.0±0.3 11.5±0.1 1.75±0.1 12.0±0.1 2.0±0.1 4.0±0.1 φ1.5+0.1 −0 H I J K 12.2±0.1 0.4±0.05 4.1±0.1 7.6±0.1 Reel structure and Dimensions e d g c Dimensions List (Unit : mm) a b c d 330 25.5±1.5 100±1.0 13±0.5 e f g f a b 23±1.0 2.0±0.5 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A05302EN 15

PC900V0NSZXF Series ■ Important Notices · The circuit application examples in this publication are with equipment that requires higher reliability such as: provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffic signals SHARP takes no responsibility for any problems rela- --- Gas leakage sensor breakers ted to any intellectual property right of a third party re- --- Alarm equipment sulting from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- · Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high lev- specification sheets before using any SHARP device. el of reliability and safety such as: SHARP reserves the right to make changes in the spec- --- Space applications ifications, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines] and other contents described herein at any time without --- Nuclear power control equipment notice in order to improve design or reliability. Manufac- --- Medical and other life support equipment (e.g., turing locations are also subject to change without no- scuba). tice. · If the SHARP devices listed in this publication fall with- · Observe the following points when using any devices in the scope of strategic products described in the For- in this publication. SHARP takes no responsibility for eign Exchange and Foreign Trade Law of Japan, it is damage caused by improper use of the devices which necessary to obtain approval to export such SHARP de- does not meet the conditions and absolute maximum vices. ratings to be used specified in the relevant specification sheet nor meet the following conditions: · This publication is the proprietary product of SHARP (i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the in general electronic equipment designs such as: copyright laws, no part of this publication may be repro- --- Personal computers duced or transmitted in any form or by any means, elec- --- Office automation equipment tronic or mechanical, for any purpose, in whole or in --- Telecommunication equipment [terminal] part, without the express written permission of SHARP. --- Test and measurement equipment Express written permission is also required before any --- Industrial control use of this publication may be made by a third party. --- Audio visual equipment --- Consumer electronics · Contact and consult with a SHARP representative if (ii) Measures such as fail-safe function and redundant there are any questions about the contents of this pub- design should be taken to ensure reliability and safety lication. when SHARP devices are used for or in connection [E225] Sheet No.: D2-A05302EN 16