PC4D10SNIP0F Series PC4D10SNIP0F High Speed 10Mb/s, High CMR Mini-fl at 2-channel Package Series ∗OPIC Photocoupler ■Description ■Agency approvals/Compliance PC4D10SNIP0F Series contains a LED optically cou- 1. Recognized by UL1577 (Double protection isolation), pled to an OPIC. fi le No. E64380 (as model No. PC4D10S) It is packaged in a 8 pin mini-fl at (2-ch output). 2. Approved by VDE, DIN EN60747-5-2(∗) (as an op- Input-output isolation voltage(rms) is 3.75 kV. tion), fi le No. 40009162 (as model No. PC4D10S) High speed response (TYP. 10Mb/s) and CMR is 3. Package resin : UL fl ammability grade (94V-0)) MIN. 10kV/μs. (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884. ■Features ■Applications 1. 2-ch output, 8 pin Mini-fl at package 1. Programmable controller 2. Double transfer mold package 2. Inverter (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous com- mon mode rejection voltage (CM : MIN. 10kV/μs, CM H L : MIN. −10kV/μs) 4. High speed response (t : TYP. 50ns, t : TYP. 48ns) PHL PLH 5. Isolation voltage between input and output (V : iso(rms) 3.75kV) 6. Lead-free and RoHS driective compliant * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-pro- cessing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. Sheet No.: D2-A09201EN 1 Date Sep. 1. 2006 © SHARP Corporation

PC4D10SNIP0F Series ■Internal Connection Diagram 1 Amp. 8 1 Anode 1 5 GND 2 7 2 Cathode 1 6 VO2 3 Cathode 2 7 VO1 3 6 4 Anode 2 8 VCC 4 5 Amp. ■Truth table Channel Input LED Output H ON L 1 L OFF H H ON L 2 L OFF H ■Outline Dimensions (Unit : mm) 1. Mini-fl at Package [ex. PC4D10SNIP0F] 2. Mini-fl at Package (VDE option) [ex. PC4D10SYIP0F] 8 7 6 5 8 7 6 5 SHARP SHARP mark mark "S" "S" Primary side 4D10S 0.127±3.937 0.203±5.994 Primary side 4D10S4 0.127±3.937 0.203±5.994 mark mark 1 2 3 4 1 2 3 4 VDE Identification mark 1.27±0.05 0.406±0.076 1.27±0.05 0.406±0.076 Rank mark Date code Rank mark Date code 5.08 0±0.127 5.080±0.127 0.127±5 0.025±0 0.127±5 0.025±0 7 0 7 0 1 2 1 2 3. 0. 3. 0. 0.305MIN. 0.102±3 0.305MIN. 0.102±3 0 0 2 2 0. 0. Product mass : approx. 0.15g Product mass : approx. 0.15g Plating material : Pd (Au fl ush) Sheet No.: D2-A09201EN 2

PC4D10SNIP0F Series Date code (2 digit) 1st digit 2nd digit Year of production Month of production A.D. Mark A.D. Mark Month Mark 1990 A 2002 P January 1 1991 B 2003 R February 2 1992 C 2004 S March 3 1993 D 2005 T April 4 1994 E 2006 U May 5 1995 F 2007 V June 6 1996 H 2008 W July 7 1997 J 2009 X August 8 1998 K 2010 A September 9 1999 L 2011 B October O 2000 M 2012 C November N 2001 N : : December D repeats in a 20 year cycle Country of origin Japan Rank mark With or without. Sheet No.: D2-A09201EN 3

PC4D10SNIP0F Series ■Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit *1 Forward current I 20 mA F Input Reverse voltage V 5 V R Power dissipation P 40 mW 1 Supply voltage V 7 V CC Output collector voltage V 7 V Output O Output collector current I 50 mA O *1 Output collector power dissipation P 60 mW C Operating temperature Topr −40 to +85 ̊C Storage temperature Tstg −55 to +125 ̊C *2 Isolation voltage V 3.75 kV iso(rms) *3 Soldering temperature T 270 ̊C sol *1 No delating required up to 85˚C *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■Electro-optical Characteristics (Unless otherwise specifi ed Ta=−40 to 85˚C) Parameter Symbol Condition MIN. TYP.*4 MAX. Unit Forward voltage V Ta=25˚C, IF=10mA 1.4 1.5 1.75 V ut F IF=10mA 1.3 − 1.8 p In Reverse current IR Ta=25̊C, VR=5V − − 10 μA Terminal capacitance Ct Ta=25̊C, V=0, f=1MHz − 60 150 pF Low level output voltage VOL IOL=13mA, VCC=5.5V, VE=2V, IF=5mA − 0.4 0.6 V ut utp High level output current IOH VCC=VO=5.5V, IF=250μA − 0.02 100 μA 5 O Low level supply current ICCL VCC=5.5V, IF=10mA − 13 21 mA * High level supply current ICCH VCC=5.5V, IF=0 − 10 15 mA "High→Low" input threshold current IFHL VCC=5V, VO=0.6V, RL=350Ω − 2.5 5 mA Isolation resistance RISO Ta=25̊C, DC500V, 40 to 60%RH 5×1010 1011 − Ω Floating capacitance Cf Ta=25̊C, V=0, f=1MHz − 0.6 − pF "High→Low" − − 100 ns ristics me p"Lroopwa→gatHioignh d"e lay time tPHL Ta=25˚C 2−5 4−8 17050 nnss racte se ti propagation delay time tPLH VCC=5V, IF=7.5mA, Ta=25˚C 25 50 75 ns cha pon *6 Distortion of pulse width ΔtW RL=350W, CL=15pF − 3.5 35 ns fer Res Rise time tr − 20 − ns s an Fall time tf − 10 − ns 5 Tr Propagation delay skew tPSK − − 40 ns * IvIvnnoossllttttaaaannggtteeaa nn((HLeeoooiguuwhss lccleeoovvmmeellmm oooouunnttp p mmuuttoo))ddee rreejjeeccttiioonn CCMMHL VVIOF(O=M(IM7AF.Xi=n5))0=m=,02 A.V8,,V Ta=V2CR5M̊L=C=13, k5VV0CΩ(CP-=P5), V, −1100 −2200 −− kkVV//μμss *4 All typical values at VCC=5V, Ta=25˚C *5 It shall connect a by-pass capacitor of 0.01μF or more between VCC (pin ➇) and GND (pin ➄) near the device, when it measures the transfer characteristics and the output side characteristics *6 Distortion of pulse width Δtw= | tPHL−tPLH | Sheet No.: D2-A09201EN 4

PC4D10SNIP0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time Input 7.5mA IF IF 3.75mA 1 8 Amp. 350Ω 0mA 2 7 VO tPHL tPLH F 47Ω μ V 3 6 0.1 CL 5=C 90% 5V VC VO 4 5 1.5V Amp. 10% Output V OL *C contains probe and wiring capacity. L tf tr Timing diagram Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 1kV I F 1 8 V Amp. CM 350Ω V GND 5 2 7 = C B A Fμ VO VC 1 3 6 0. CL VO 5V 4 5 Amp. CM V H O(MIN.) SW=at A, IF=0 V + − VO O(MAX.) V CM OL L VCM SW=at B, IF=7.5mA GND *C contains probe and wiring capacity. L Timing diagram Fig.3 Forward Current vs. Fig.4 Output Collector Power Dissipation Ambient Temperature vs. Ambient Temperature 25 100 W) m A) 20 P (C 80 m n urrent I (F 15 dissipatio 60 ward c 10 power 40 For ctor e 5 oll 20 C 0 0 −40−25 0 25 50 75 85 100 125 −40−25 0 25 50 75 85 100 125 Ambient temperature T (C) Ambient temperature T (C) a a Sheet No.: D2-A09201EN 5

PC4D10SNIP0F Series Fig.5 Forward Current vs. Forward Voltage Fig.6 High Level Output Current vs. Ambient Temperature 100 100 000 VCC=VO=5V IF=0 Ta=25˚C nA)10 000 nt I (mA)F 10 Ta=50˚C Ta=0˚C urrent I (OH 1 000 ward curre 1 Ta=100˚C Ta=−40˚C el output c 100 or ev F h l Hig 10 0.1 1 1 1.2 1.4 1.6 1.8 2 −60 −40 −20 0 20 40 60 80 100 Ambient temperature T (C) Forward voltage V (V) a F Fig.7 Low Level Output Voltage vs. Fig.8 Output Voltage vs. Forward Current Ambient Temperature 0.8 6 0.7 VCC=5.5V TVaC=C2=55˚VC V) IF=5mA 5 (L 0.6 w level output voltage VO 0000....2345 IOL=16mA12.8mA9.6mA 6.4mA Output voltage V (V)O 234 RL=350Ω Lo 1 RL=1kΩ 0.1 RL=4kΩ 0 0 −60 −40 −20 0 20 40 60 80 100 0 1 2 3 4 5 Ambient temperature Ta (C) Forward current IF (mA) Fig.9 Input Threshold Current vs. Fig.10 Propagation Delay Time vs. Ambient Temperature Forward Current 5 100 VCC=5V CVLC=C=155pVF d current I (mA)FHL 34 VO=0.6VRL=350Ω RL=1kΩ RL=4kΩ ay time t, t (ns)PLHPHL 6800 RL=350Ω tPLH nput threshol 12 opagation del 2400 tPHL I Pr 0 0 −60 −40 −20 0 20 40 60 80 100 5 7 9 11 13 15 Ambient temperature Ta (C) Forward current IF (mA) Sheet No.: D2-A09201EN 6

PC4D10SNIP0F Series Fig.11-a Propagation Delay Time vs. Fig.11-b Propagation Delay Time vs. Ambient Temperature Ambient Temperature 100 100 , t (ns)HPHL 80 VICFL=C=C7=1.555mpVFA RL=350Ω , t (ns)HPHL 80 IVCFL=C=C7=1.555mpVFA RL=1kΩ L L me tP 60 t me tP 60 tPLH y ti PHL y ti a a del 40 del 40 n n atio t atio tPHL g PLH g a a op 20 op 20 Pr Pr 0 0 −60 −40 −20 0 20 40 60 80 100 −60 −40 −20 0 20 40 60 80 100 Ambient temperature T (C) Ambient temperature T (C) a a Fig.11-c Propagation Delay Time vs. Fig.12 Pulse width Distortion vs. Ambient Temperature Ambient Temperature 140 80 VCC=5V VCC=5V RL=4kΩ IF=7.5mA , t (ns)LHPHL 112000 ICFL==71.55mpFA tPLH tw (ns)Δ 60 CL=15pF on delay time tP 6800 width distrrion 2400 RL=4kΩ RL=1kΩ Propagati 40 Pulse 0 t PHL RL=350Ω 20 −20 −60 −40 −20 0 20 40 60 80 100 −60 −40 −20 0 20 40 60 80 100 Ambient temperature T (C) Ambient temperature T (C) a a Fig.13 Rise Time / Fall Time vs. Ambient Temperature 50 VCC=5V IF=7.5mA 40 s) CL=15pF e t (nf RL=350Ω m 30 all ti F e t, r 20 tr m e ti s Ri 10 t f 0 Remarks : Please be aware that all data in the graph −60 −40 −20 0 20 40 60 80 100 are just for reference and anot for guarantee. Ambient temperature T (C) a Sheet No.: D2-A09201EN 7

PC4D10SNIP0F Series ■Design Considerations ●Recommended operating conditions Parameter Symbol MIN. TYP. MAX. Unit Low level input current IFL 0 − 250 μA High level input current IFH 8 − 15 mA Supply voltage VCC 4.5 − 5.5 V Fan out (TTL load) N − − 5 − Output pull-up resitor RL 330 − 4 000 Ω Operating temperature Topr −40 − +85 ˚C ●Notes about static electricity Transistor of detector side in bipolar confi guration may be damaged by static electricity due to its minute de- sign. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ●Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01μF or more between V and GND near the device. CC In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is fl oating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ●Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. I . FHL ●Recommended foot print (reference) 7.49 7 2 1. 27 1. 7 2 1. 1.9 64 (Unit : mm) 0. Sheet No.: D2-A09201EN 8

PC4D10SNIP0F Series ■Manufacturing Guidelines ●Soldering Method Refl ow Soldering: Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak (package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 100 150 to 180˚C, 120s or less 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in fl ow solder bath is allowed under the be- low listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fi ne, since the im- pact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A09201EN 9

PC4D10SNIP0F Series ●Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fi ne in ac- tual using conditions since some materials may erode the packaging resin. ●Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A09201EN 10

PC4D10SNIP0F Series ●Tape and Reel package SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D J G I C B A H H .X A K M˚5 Dimensions List (Unit : mm) A B C D E F G 12.0±0.3 5.50±0.05 1.75±0.10 8.0±0.1 2.00±0.05 4.0±0.1 φ1.55±0.05 H I J K 5.4±0.1 0.30±0.05 3.7±0.1 6.3±0.1 Reel structure and Dimensions e d Dimensions List (Unit : mm) g a b c d c φ330 13.5±1.5 φ100±1 φ13.0±0.2 e f g φ21.0±0.8 2.0TYP. 2.0±0.5 f a b Direction of product insertion Pull-out direction [Packing : 1 500pcs/reel] Sheet No.: D2-A09201EN 11

PC4D10SNIP0F Series ■Important Notices · The circuit application examples in this publication with equipment that requires higher reliability such as: are provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffi c signals SHARP takes no responsibility for any problems related --- Gas leakage sensor breakers to any intellectual property right of a third party resulting --- Alarm equipment from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- · Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high specification sheets before using any SHARP device. level of reliability and safety such as: SHARP reserves the right to make changes in the spec- --- Space applications ifi cations, characteristics, data, materials, structure, and --- Telecommunication equipment [trunk lines] other contents described herein at any time without no- --- Nuclear power control equipment tice in order to improve design or reliability. Manufactur- --- Medical and other life support equipment (e.g., ing locations are also subject to change without notice. scuba). · Observe the following points when using any devices · If the SHARP devices listed in this publication fall in this publication. SHARP takes no responsibility for within the scope of strategic products described in the damage caused by improper use of the devices which Foreign Exchange and Foreign Trade Law of Japan, it does not meet the conditions and absolute maximum is necessary to obtain approval to export such SHARP ratings to be used specifi ed in the relevant specifi cation devices. sheet nor meet the following conditions: (i) The devices in this publication are designed for use · This publication is the proprietary product of SHARP in general electronic equipment designs such as: and is copyrighted, with all rights reserved. Under the --- Personal computers copyright laws, no part of this publication may be re- --- Offi ce automation equipment produced or transmitted in any form or by any means, --- Telecommunication equipment [terminal] electronic or mechanical, for any purpose, in whole or in --- Test and measurement equipment part, without the express written permission of SHARP. --- Industrial control Express written permission is also required before any --- Audio visual equipment use of this publication may be made by a third party. --- Consumer electronics (ii) Measures such as fail-safe function and redundant · Contact and consult with a SHARP representative if design should be taken to ensure reliability and safety there are any questions about the contents of this publi- when SHARP devices are used for or in connection cation. [E256] Sheet No.: D2-A09201EN 12