Product Order Technical Tools & Support & Folder Now Documents Software Community OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 OPAx363, OPAx364 1.8-V, 7-MHz, 90-dB CMRR, Single-Supply, Rail-to-Rail I/O Operational Amplifier 1 Features The single version is available in the MicroSize 5-pin SOT-23 (6-pin SOT-23 for shutdown) and 8-pin • 1.8-VOperation 1 SOIC. The dual version is available in 8-pin VSSOP, • MicroSIZEPackages 10-pin VSSOP, 16-pin UQFN, and 8-pin SOIC • Bandwidth:7MHz packages. Quad packages are available in 14-pin TSSOP and 14-pin SOIC packages. All versions are • CMRR:90dB(Typical) specifiedforoperationfrom –40°Cto+125°C. • SlewRate:5V/µs • LowOffset:500µV(Maximum) DeviceInformation(1) • QuiescentCurrent:750 µA/Channel(Maximum) PARTNUMBER PACKAGE BODYSIZE(NOM) • ShutdownMode:LessThan1 µA/Channel SOT-23(6) 2.60mm×1.60mm OPA363 SOIC(8) 4.90mm×3.91mm 2 Applications SOT-23(5) 2.60mm×1.60mm OPA364 • SignalConditioning SOIC(8) 4.90mm×3.91mm • DataAcquisition VSSOP(10) 3.00mm×3.00mm OPA2363 UQFN(16) 2.60mm×1.80mm • ProcessControl SOIC(8) 4.90mm×3.91mm • ActiveFilters OPA2364 VSSOP(8) 3.00mm×3.00mm • TestEquipment SOIC(14) 8.65mm×3.91mm OPA4364 3 Description TSSOP(14) 5.00mm×4.40mm The OPA363 and OPA364 families are high- (1) For all available packages, see the orderable addendum at performance, CMOS operational amplifiers optimized theendofthedatasheet. for very low voltage, single-supply operation. These Single-SupplyMicrophonePreamplifier miniature, low-cost amplifiers are designed to operate on single supplies from 1.8 V (±0.9 V) to 5.5 V CFB (±2.75 V). Applications include sensor amplification 5 V andsignalconditioninginbattery-poweredsystems. 130 pF RFB The OPA363 and OPA364 families offer excellent RBIAS 5.9 k(cid:13)(cid:3) 61.9 k(cid:13) CMRR without the crossover associated with traditional complimentary input stages. This feature CIN 5 V results in excellent performance for driving analog-to- 0.1 (cid:29)F 1.5 (cid:29)F digital (A/D) converters without degradation of differential linearity and THD. The input common- Electret 5 V RDIV – VS+ mode range includes both the negative and positive Microphone 100 k(cid:13) Output + OPA364 supplies. The output voltage swing is within 10 mV of VS– therails. RDIV CDIV 100 k(cid:13) 160 nF The OPA363 family includes a shutdown mode. Under logic control, the amplifiers can be switched from normal operation to a standby current that is Copyright © 2017, Texas Instruments Incorporated lessthan1 µA. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Table of Contents 1 Features.................................................................. 1 8.2 FunctionalBlockDiagram.......................................17 2 Applications........................................................... 1 8.3 FeatureDescription.................................................18 3 Description............................................................. 1 8.4 DeviceFunctionalModes........................................19 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation........................ 20 9.1 ApplicationInformation............................................20 5 DeviceComparisonTable..................................... 4 9.2 TypicalApplication..................................................23 5.1 DeviceComparisonTable.........................................4 10 PowerSupplyRecommendations..................... 26 6 PinConfigurationandFunctions......................... 4 11 Layout................................................................... 26 7 Specifications......................................................... 8 11.1 LayoutGuidelines.................................................26 7.1 AbsoluteMaximumRatings......................................8 11.2 LayoutExample....................................................26 7.2 ESDRatings..............................................................8 12 DeviceandDocumentationSupport................. 28 7.3 RecommendedOperatingConditions.......................8 7.4 ThermalInformation:OPA363..................................9 12.1 DeviceSupport......................................................28 7.5 ThermalInformation:OPA364..................................9 12.2 DocumentationSupport........................................29 7.6 ThermalInformation:OPA2363..............................10 12.3 RelatedLinks........................................................29 7.7 ThermalInformation:OPA2364..............................10 12.4 ReceivingNotificationofDocumentationUpdates29 7.8 ThermalInformation:OPA4364..............................10 12.5 CommunityResource............................................29 7.9 ElectricalCharacteristics.........................................11 12.6 Trademarks...........................................................29 7.10 TypicalCharacteristics..........................................13 12.7 ElectrostaticDischargeCaution............................29 12.8 Glossary................................................................30 8 DetailedDescription............................................ 17 13 Mechanical,Packaging,andOrderable 8.1 Overview.................................................................17 Information........................................................... 30 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(January2018)toRevisionF Page • ChangedOPA363SOT-23(5)toSOT-23(6)inDeviceInformationtable ........................................................................... 1 • AddedOPA363SOIC(8)packagetoDeviceInformationtable............................................................................................ 1 • ChangedOPA364SOT-23(6)toSOT-23(5)inDeviceInformationtable ........................................................................... 1 • DeletedOPA2364VSSOP(10)andUQFN(16)packagesfromDeviceInformationtable................................................... 1 • DeletedOPA2363SOIC(8)andVSSOP(8)packagesfromDeviceInformationtable......................................................... 1 ChangesfromRevisionD(September2016)toRevisionE Page • ChangedOPA36xandOPA236xpartnumberstoOPA364andOPA2363inDeviceInformationtable.............................. 1 • AddedOPA2364devicetoDeviceInformationtable ............................................................................................................ 1 • CorrectedformattingofpinoutdrawingsinPinConfigurationandFunctionssection............................................................ 4 • CorrectedformattingofpinouttablesinPinConfigurationandFunctionssection................................................................ 4 • Addedaminimumvalueof0VtosupplyvoltageparameterinAbsoluteMaximumRatingstable ...................................... 8 • Added"([V+]–[V–])"tosupplyvoltageparameterinAbsoluteMaximumRatingstable ...................................................... 8 • DeletedoperatingtemperaturerangefromAbsoluteMaximumRatingstable...................................................................... 8 • Addedtheword"temperature"tojunctionandstoragetemperaturerangesinAbsoluteMaximumRatingstable............... 8 • Added"([V+]–[V–])"tosupplyvoltageparameterinRecommendedOperatingConditionstable ...................................... 8 • ChangedoutputvoltageswingparameterunitsfromVtomV............................................................................................. 11 • DeletedtemperaturerangesectionofElectricalCharacteristicstable................................................................................. 11 • ChangedPSRRtestconditionfromV =0toV =(V–)inElectricalCharacteristicstable............................................ 11 CM CM • DeletedBufferedReferenceVoltagesubsectioninApplicationInformationsection .......................................................... 20 • ChangedFigure33 .............................................................................................................................................................. 26 • AddedFigure34 .................................................................................................................................................................. 27 2 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 • Changed"IC"to"device"throughoutdatasheet.................................................................................................................. 28 ChangesfromRevisionC(May2013)toRevisionD Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection ................................................................................................. 1 • DeletedPackageandOrderingInformationsection,seePOAattheendofthedatasheet.................................................. 1 ChangesfromRevisionB(February2003)toRevisionC Page • Converteddatasheettocurrentformat.................................................................................................................................. 1 • AddedRSVpackage(UQFN-16)todatasheet..................................................................................................................... 1 • AddedtexttolastbulletofLayoutGuidelinessection.......................................................................................................... 26 Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 5 Device Comparison Table 5.1 Device Comparison Table OPA363 OPA364 OPA2363 OPA2364 OPA4364 SOT-23-5 X SOT-23-6(shutdown) X MSOP-8 X MSOP-10 X SO-8 X X X TSSOP-14 X SO-14 X UQFN-16 X 6 Pin Configuration and Functions OPA363:DBVPackage OPA363:DPackage 6-PinSOT-23 8-PinSOIC TopView TopView V OUT 1 6 V+ NC 1 8 Enable A V (cid:16) 2 4 5 Enable (cid:16)IN 2 7 V+ 0 +IN 3 4 (cid:16)IN +IN 3 6 V OUT V (cid:16) 4 5 NC (1) Orientaccordingtomarking. NC-nointernalconnection PinFunctions:OPA363 PIN I/O DESCRIPTION NAME SOIC SOT-23 Enable 8 5 I Enable –IN 2 4 I Negative(inverting)input +IN 3 3 I Positive(noninverting)input NC 1,5 — — Nointernalconnection(canbeleftfloating) V 6 1 O Output OUT V– 4 2 — Negative(lowest)powersupply V+ 7 6 — Positive(highest)powersupply 4 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 OPA2363:DGSPackage OPA2363:RSVPackage 10-PinMSOP 16-PinUQFN TopView TopView B VOUT A 1 10 +V V+ OUT -IN B +IN B (cid:16)IN A 2 9 V B 16 15 14 13 A OUT +IN A 3 8 (cid:16)IN B B NC 1 12 NC (cid:16)V 4 7 +IN B NC 2 11 Enable B Enable A 5 6 Enable B NC 3 10 EnableA NC 4 9 NC 5 6 7 8 A A A - T N N V OU -I +I NC-nointernalconnection PinFunctions:OPA2363 PIN I/O DESCRIPTION NAME MSOP UQFN EnableA 5 10 I EnableAamplifier EnableB 6 11 I EnableBamplifier –INA 2 6 I Invertinginput,channelA +INA 3 7 I Noninvertinginput,channelA –INB 8 14 I Invertinginput,channelB +INB 7 13 I Noninvertinginput,channelB 1,2,3, NC — — Nointernalconnection(canbeleftfloating) 4,9,12 OUTA — 5 O Output,channelA OUTB — 15 O Output,channelB V A 1 — O Output,channelA OUT V B 9 — O Output,channelB OUT –V,V– 4 8 — Negative(lowest)powersupply +V,V+ 10 16 — Positive(highest)powersupply Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com OPA364:DBVPackage OPA364:DPackage 5-PinSOT-23 8-PinSOIC TopView TopView V 1 5 V+ NC 1 8 NC OUT A V(cid:16) 2 4 (cid:16)IN 2 7 V+ 1 +IN 3 4 (cid:16)IN +IN 3 6 V OUT V(cid:16) 4 5 NC (1) Orientaccordingtomarking. NC-nointernalconnection PinFunctions:OPA364 PIN I/O DESCRIPTION NAME SOIC SOT-23 –IN 2 4 I Negative(inverting)input +IN 3 3 I Positive(noninverting)input NC 1,5,8 — — Nointernalconnection(canbeleftfloating) V 6 1 O Output OUT V– 4 2 — Negative(lowest)powersupply V+ 7 5 — Positive(highest)powersupply OPA2364:DGKandDPackages 8-PinMSOPandSOIC TopView OUT A 1 8 V+ (cid:16)IN A 2 7 OUT B +IN A 3 6 (cid:16)IN B V(cid:16) 4 5 +IN B PinFunctions:OPA2364 PIN I/O DESCRIPTION NAME NO. –INA 2 I Invertinginput,channelA +INA 3 I Noninvertinginput,channelA –INB 6 I Invertinginput,channelB +INB 5 I Noninvertinginput,channelB OUTA 1 O Output,channelA OUTB 7 O Output,channelB V– 4 — Negative(lowest)powersupply V+ 8 — Positive(highest)powersupply 6 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 OPA4364:DandPWPackages 14-PinSOICandTSSOP TopView V A 1 14 V D OUT OUT (cid:16)IN A 2 13 (cid:16)IN D A D +IN A 3 12 +IN D V+ 4 11 V(cid:16) +IN B 5 10 +IN C B C (cid:16)IN B 6 9 (cid:16)IN C V B 7 8 V C OUT OUT NC-nointernalconnection. PinFunctions:OPA4364 PIN I/O DESCRIPTION NAME NO. –INA 2 I Invertinginput,channelA +INA 3 I Noninvertinginput,channelA –INB 6 I Invertinginput,channelB +INB 5 I Noninvertinginput,channelB –INC 9 I Invertinginput,channelC +INC 10 I Noninvertinginput,channelC –IND 13 I Invertinginput,channelD +IND 12 I Noninvertinginput,channelD V A 1 O Output,channelA OUT V B 7 O Output,channelB OUT V C 8 O Output,channelC OUT V D 14 O Output,channelD OUT V– 11 — Negative(lowest)powersupply V+ 4 — Positive(highest)powersupply Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT Supply([V+]–[V–]) 0 5.5 Voltage V Signalinputpin(2) −0.5 (V+)+0.5 Signalinputpin(2) –10 10 mA Current Outputshort-circuit(3) Continuous mA Junctiontemperature,T 150 J °C Storagetemperature,T –65 150 stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Inputterminalsarediode-clampedtothepower-supplyrails.Inputsignalsthatcanswingmorethan0.5Vbeyondthesupplyrailsmust becurrentlimitedto10mAorless. (3) Short-circuittoground,oneamplifierperpackage. 7.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±750 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT Supplyvoltage([V+]–[V–]) 1.8 5.5 V T Operatingtemperature –40 125 °C A 8 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 7.4 Thermal Information: OPA363 OPA363 THERMALMETRIC(1) DBV(SOT-23) UNIT 5PINS R Junction-to-ambientthermalresistance 211.4 °C/W θJA R Junction-to-case(top)thermalresistance 137 °C/W θJC(top) R Junction-to-boardthermalresistance 39.8 °C/W θJB ψ Junction-to-topcharacterizationparameter 20.6 °C/W JT ψ Junction-to-boardcharacterizationparameter 38.9 °C/W JB R Junction-to-case(bottom)thermalresistance — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 7.5 Thermal Information: OPA364 OPA364 THERMALMETRIC(1) DBV(SOT-23) D(SOIC) UNIT 6PINS 8PINS R Junction-to-ambientthermalresistance 182.7 125.3 °C/W θJA R Junction-to-case(top)thermalresistance 130.7 73.7 °C/W θJC(top) R Junction-to-boardthermalresistance 34.1 65.7 °C/W θJB ψ Junction-to-topcharacterizationparameter 24.8 25.4 °C/W JT ψ Junction-to-boardcharacterizationparameter 33.5 65.2 °C/W JB R Junction-to-case(bottom)thermalresistance — — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 7.6 Thermal Information: OPA2363 OPA2363 THERMALMETRIC(1) D(SOIC) DGK(VSSOP) DGS(VSSOP) UQFN(RSV) UNIT 8PINS 8PINS 10PINS 16PINS R Junction-to-ambientthermalresistance 125.3 171.8 166.4 112.4 °C/W θJA R θJC(to Junction-to-case(top)thermalresistance 73.7 63.2 55.9 44 °C/W p) R Junction-to-boardthermalresistance 65.7 92.4 86.6 41.2 °C/W θJB ψ Junction-to-topcharacterizationparameter 25.4 9.5 6.8 0.8 °C/W JT ψ Junction-to-boardcharacterizationparameter 65.2 91 85.2 41.2 °C/W JB R θJC(b Junction-to-case(bottom)thermalresistance — — — — °C/W ot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 7.7 Thermal Information: OPA2364 OPA2364 THERMALMETRIC(1) D(SOIC) DGK(VSSOP) DGS(VSSOP) UQFN(RSV) UNIT 8PINS 8PINS 10PINS 16PINS R Junction-to-ambientthermalresistance 125.3 171.8 166.4 112.4 °C/W θJA R θJC(to Junction-to-case(top)thermalresistance 73.7 63.2 55.9 44 °C/W p) R Junction-to-boardthermalresistance 65.7 92.4 86.6 41.2 °C/W θJB ψ Junction-to-topcharacterizationparameter 25.4 9.5 6.8 0.8 °C/W JT ψ Junction-to-boardcharacterizationparameter 65.2 91 85.2 41.2 °C/W JB R θJC(b Junction-to-case(bottom)thermalresistance — — — — °C/W ot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 7.8 Thermal Information: OPA4364 OPA4364 THERMALMETRIC(1) D(SOIC) PW(TSSOP) UNIT 14PINS 14PINS R Junction-to-ambientthermalresistance 82.6 107.5 °C/W θJA R Junction-to-case(top)thermalresistance 41.1 31.9 °C/W θJC(top) R Junction-to-boardthermalresistance 37.1 50.6 °C/W θJB ψ Junction-to-topcharacterizationparameter 9.4 1.9 °C/W JT ψ Junction-to-boardcharacterizationparameter 36.8 49.9 °C/W JB R Junction-to-case(bottom)thermalresistance — — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 10 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 7.9 Electrical Characteristics atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,V =1.8Vto5.5V,(unlessotherwisenoted) A L S OUT S CM S S PARAMETER TESTCONDITIONS MIN TYP MAX UNIT OFFSETVOLTAGE VS=5V(OPA363I,OPA364I) 500 µV VOS Inputoffsetvoltage OPA2363I,OPA2364I 900 µV OPA363AI,OPA364AI,OPA2363AI,OPA2364AI,OPA4364AI 1 2.5 mV dVOS/dT Drift TA=–40°Cto+125°C 3 µV/°C Inputoffsetvoltagevspower VS=1.8Vto5.5V PSRR supply VCM=(V–) 80 330 µV/V TA=–40°Cto+125°C Channelseparation,DC 1 µV/V INPUTBIASCURRENT TA=25°C ±1 ±10 pA IB Inputbiascurrent TA=–40°Cto+125°C SeeTypicalCharacteristics IOS Inputoffsetcurrent ±1 ±10 pA NOISE en Inputvoltagenoise, f=0.1Hzto10Hz 10 µVPP en Inputvoltagenoisedensity f=10kHz 17 nV/√Hz in Inputcurrentnoisedensity f=10kHz 0.6 fA/√Hz INPUTVOLTAGERANGE VCM Common-modevoltagerange (V–)–0.1 (V+)+0.1 V CMRR Common-moderejectionratio (V−)–0.1V<VCM<(V+)+0.1V 74 90 dB TA=–40°Cto+125°C INPUTCAPACITANCE Differential 2 pF Common-mode 3 pF OPEN-LOOPGAIN RL=10kΩ TA=25°C 94 100 dB AOL Open-loopvoltagegain 100mV<VO<(V+)–100mV TA=25°C(OPA4364) 90 dB RL=10kΩ VS=1.8Vto5.5V 86 dB 100mV<VO<(V+)–100mV TA=–40°Cto+125°C FREQUENCYRESPONSE GBW Gain-bandwidthproduct CL=100pF 7 MHz SR Slewrate CL=100pF,G=1 5 V/µs 0.1%,CL=100pF,VS=5V,4-Vstep,G=1 1 µs tS Settlingtime 0.01%,CL=100pF,VS=5V,4-Vstep,G=1 1.5 µs Overloadrecoverytime CL=100pF 0.8 µs VIN×Gain>VS THD+N Totalharmonicdistortion+noise CL=100pF,VS=5V,G=1,f=20Hzto20kHz 0.002% OUTPUT RL=10kΩ,TA=25°C 10 20 mV Voltageoutputswing RL=10kΩ 20 mV TA=–40°Cto+125°C ISC Short-circuitcurrent SeeTypicalCharacteristics CLOAD Capacitiveloaddrive SeeTypicalCharacteristics SHUTDOWN(OPA363) tOFF Turnofftime 1 µs tON Turnontime(1) 20 µs VL Logiclowthreshold Shutdown (V–)+0.8 V VH Logichighthreshold Amplifierisactive 0.75(V+) 5.5 V Quiescentcurrentat IQ(sd) shutdown(peramplifier) 0.9 µA (1) Partisconsideredenabledwheninputoffsetvoltagereturnstospecifiedrange. Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Electrical Characteristics (continued) atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,V =1.8Vto5.5V,(unlessotherwisenoted) A L S OUT S CM S S PARAMETER TESTCONDITIONS MIN TYP MAX UNIT POWERSUPPLY VS Specifiedvoltagerange 1.8 5.5 V VS=1.8V 650 750 µA TA=–40°Cto+125°C IQ Quiescentcurrent(peramplifier) VTAS==–34.60°VCto+125°C 850 1000 µA VS=5.5V 1.1 1.4 mA TA=–40°Cto+125°C 12 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 7.10 Typical Characteristics atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,(unlessotherwisenoted) A L S OUT S CM S 120 0 100 90 100 -30 80 Gain (dB) 8600 --6900 °Phase () R (dB) 765000 Voltage 4200 --115200 CMR 4300 20 0 -180 10 -20 0 10 100 1k 10k 100k 1M 10M 100M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) Figure1.Open-LoopGainandPhasevsFrequency Figure2.Common-ModeRejectionRatiovsFrequency 100 1.4 PerAmplifier 80 1.2 A) m B) 60 ent ( 1.0 R (d Curr PSR 40 cent 0.8 s e ui Q 20 0.6 0 0.4 1 10 100 1k 10k 100k 1M 10M 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (Hz) Supply Voltage (V) Figure3.Power-SupplyRejectionRatiovsFrequency Figure4.QuiescentCurrentvsSupplyVoltage 1 1 VOUT=-10dBv G = 10, RL= 2kW (VS= 5V, VOUT= 1Vrms) V = 5V G = 10, R = 2kW S L 0.1 VS= 1.8V 0.1 G = 10, R = 2kW L %) %) +N ( 0.01 G = 10, RL= 10kW +N ( 0.01 D V = 1.8V, 5V D TH S TH G = 10, RL= 10kW 0.001 G = 1, 0.001 G =V 1S, =R 1L.=8 V2kW RGL= = 2 1k,W VSRL= =1 .180Vk, W5V G = 1, RL= 2kW G = 1, RL= 10kW V = 5V 0.0001 S 0.0001 10 100 1k 10k 100k 10 100 1k 10k 100k Frequency (Hz) Frequency (Hz) Figure5.TotalHarmonicDistortion+NoiseRatiovs Figure6.TotalHarmonicDistortion+NoiseRatiovs Frequency Frequency Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Typical Characteristics (continued) atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,(unlessotherwisenoted) A L S OUT S CM S 1000 120 )Hz A) 100 ÖNoise (nV/ 100 Current (m 8600 +ISC nput Voltage Short-Circuit 4200 -ISC I 10 0 10 100 1k 10k 100k 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency (Hz) Supply Voltage (V) Figure7.InputVoltageNoiseSpectralDensityvsFrequency Figure8.Short-CircuitCurrentvsSupplyVoltage 3 4 VS=±2.5V V =±1.65V S 2 2 A) Output Voltage (V) -101 VS=±0.9V T =-40°C nput Bias Current (p ---0246 VCM= +5.1V A I -2 TA= +25°C -8 -3 VS=±2.5V VS=±1.65V TA= +125°C -10 VCM=-0.1V 0 ±10 ±20 ±30 ±40 ±50 ±60 ±70 ±80 ±90 ±100 -0.5 0.5 1.5 2.5 3.5 4.5 5.5 Output Current (mA) Common-Mode Voltage (V) Figure9.OutputVoltageSwingvsOutputCurrent Figure10.InputBiasCurrentvsInputCommon-Mode Voltage 10k 10k et Current (pA) 1010k s Current (pA)1010k s a Off Bi Input 10 Input 10 1 1 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) Figure11.InputOffsetCurrentvsTemperature Figure12.InputBiasCurrentvsTemperature 14 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 Typical Characteristics (continued) atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,(unlessotherwisenoted) A L S OUT S CM S 60 100 50 0.01% ot (%) 40 me (s)m 10 ho 30 Ti s g Over 20 ettlin 1 0.1% G = +1 S 10 G = +10 0 0.1 100 1k 1 10 100 Load Capacitance (pF) Closed-Loop Gain (V/V) Figure13.Small-SignalOvershootvsLoadCapacitance Figure14.SettlingTimevsClosed-LoopGain 20 16 Typical Production OPA36xAI 14 Distribution of %) 15 %) 12 Packaged Units plifiers ( plifiers ( 10 Am 10 Am 8 of of nt nt 6 e e erc 5 erc 4 P P 2 0 0 0 1 2 3 4 5 6 7 8 9 > 10 -2.5 -2.0 -1.0 0 1.0 2.0 2.5 Offset Voltage Drift (mV/°C) Offset Voltage (mV) Figure15.OffsetDriftDistribution Figure16.OffsetVoltageProductionDistribution 130 120 T U VO B) 110 d n ( 100 o arati 90 p Se 80 el NABLE Chann 7600 E V 50 40 50ms/div 10 100 1k 10k 100k 1M 10M Frequency (Hz) Figure17.OutputEnableCharacteristic(VS=5V, Figure18.ChannelSeparationvsFrequency V =20-kHzSinusoid) OUT Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Typical Characteristics (continued) atT =25°C,R =10kΩconnectedtoV /2,V =V /2,andV =V /2,(unlessotherwisenoted) A L S OUT S CM S v di v V/ di m V/ 0 1 5 250ns/div 1ms/div CL=100pF CL=100pF Figure19.Small-SignalStepResponse Figure20.Large-SignalStepResponse 16 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 8 Detailed Description 8.1 Overview The OPA363 and OPA364 series op amps are rail-to-rail operational amplifiers with excellent CMRR, low noise, lowoffset,andwidebandwidthonsupplyvoltagesaslowas ±0.9V.TheOPA363featuresanadditionalpinfora shutdown and enable function. These families do not exhibit phase reversal and are unity-gain stable. Specified over the industrial temperature range of –40°C to +125°C, the OPA363 and OPA364 families offer precision performanceforawiderangeofapplications. 8.2 Functional Block Diagram V S Regulated Charge Pump V = V +1.8 V OUT CC V + 1.8 V CC Patent Pending Very Low Ripple I Topology BIAS I BIAS I V BIAS OUT V - V + IN IN I BIAS Copyright © 2017,Texas Instruments Incorporated Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 8.3 Feature Description 8.3.1 Rail-to-RailInput The OPA363 and OPA364 feature excellent rail-to-rail operation, with supply voltages as low as ±0.9 V. The input common-mode voltage range of the OPA363 and OPA364 family extends 100 mV beyond supply rails. The uniqueinputtopologyoftheOPA363andOPA364eliminatestheinputoffsettransitionregiontypicalofmostrail- to-rail, complementary stage operational amplifiers, allowing the OPA363 and OPA364 to provide superior common-mode performance over the entire common-mode input range, as seen in Figure 21. This feature prevents degradation of the differential linearity error and THD when driving A/D converters. A simplified schematicoftheOPA363andOPA364isshownintheFunctionalBlockDiagram. 1.0 OPA363 and OPA364 0.5 0 -0.5 mV) -1.0 ( OS -1.5 V -2.0 Competitors -2.5 -3.0 -3.5 -0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Common-Mode Voltage (V) Figure21. OPA363andOPA364HaveLinearOffsetOverEntireCommon-ModeRange 8.3.2 OperatingVoltage The OPA363 and OPA364 series op amp parameters are fully specified from 1.8 V to 5.5 V. Single 0.1-µF bypass capacitors must be placed across supply pins and as close to the part as possible. Supply voltages higher than 5.5 V (absolute maximum) may cause permanent damage to the amplifier. Many specifications apply from –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in theTypicalCharacteristics. 8.3.3 CapacitiveLoad The OPAx363 and OPAx364 series op amps can drive a wide range of capacitive loads. However, all op amps under certain conditions may become unstable. Op amp configuration, gain, and load value are a few of the factors to consider when determining stability. An op amp in unity-gain configuration is the most susceptible to the effects of capacitive load. The capacitive load reacts with the output resistance of the op amp to create a poleinthesmall-signalresponse,whichdegradesthephasemargin. In unity gain, the OPAx363 and OPAx364 series op amps perform well with a pure capacitive load up to approximately 1000 pF. The equivalent series resistance (ESR) of the loading capacitor may be sufficient to allow the OPA363 and OPA364 to directly drive very large capacitive loads ( greater than 1 µF). Increasing gain enhancestheabilityoftheamplifiertodrivemorecapacitance;seeFigure13. One method of improving capacitive load drive in the unity-gain configuration is to insert a 10-Ω to 20-Ω resistor in series with the output, as shown in Figure 22. This resistor significantly reduces ringing with large capacitive loads. However, if there is a resistive load in parallel with the capacitive load, the load creates a voltage divider, introduces a DC error at the output, and slightly reduces output swing. This error may be insignificant. For example,withR =10kΩandR =20 Ω,thereisanapproximate0.2%errorattheoutput. L S 18 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 Feature Description (continued) V+ R S OPAx363 V OPAx364 OUT V 10Ωto IN 20Ω RL CL Copyright © 2017,Texas Instruments Incorporated Figure22. ImprovingCapacitiveLoadDrive 8.3.4 InputandESDProtection All OPAx363 and OPAx364 pins are static-protected with internal ESD protection diodes tied to the supplies. These diodes provide overdrive protection if the current is externally limited to 10 mA, as shown in the Absolute MaximumRatingsandshowninFigure23. V+ I OVERLOAD 10-mAmaximum OPAx363 V OUT V IN 5 kΩ Copyright © 2017,Texas Instruments Incorporated Figure23. InputCurrentProtection 8.4 Device Functional Modes 8.4.1 EnableFunction The shutdown (enable) function of the OPAx363 is referenced to the negative supply voltage of the operational amplifier. A logic level HIGH enables the op amp. A valid logic HIGH is defined as voltage greater than 75% of the positive supply applied to the enable pin. The valid logic HIGH signal can be as much as 5.5 V above the negative supply, independent of the positive supply voltage. A valid logic LOW is defined as less than 0.8 V above the negative supply pin. If dual or split power supplies are used, take care to ensure that logic input signals are properly referred to the negative supply voltage. This pin must be connected to a valid high or low voltageordriven,notleftopen-circuit. The logic input is a high-impedance CMOS input. Dual op amps are provided separate logic inputs. For battery- operated applications, this feature reduces the average current and extend battery life. The enable time is 20 μs; disable time is 1 μs. When disabled, the output assumes a high-impedance state. This configuration allows the OPAx363tooperateasagatedamplifier,ortohavetheoutputmultiplexedontoacommonanalogoutputbus. Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information 9.1.1 AchievingOutputSwingtotheOpAmpNegativeRail Some applications require an accurate output voltage swing from 0 V to a positive full-scale voltage. A good single-supply op amp may be able to swing within a few millivolts of single-supply ground, but as the output is driven toward 0 V, the output stage of the amplifier prevents the output from reaching the negative supply rail of theamplifier. The output of the OPAx363 or OPAx364 can be made to swing to ground, or slightly below, on a single-supply power source. To do so requires use of another resistor and an additional, more negative power supply than the op amp negative supply. A pulldown resistor may be connected between the output and the additional negative supplytopulltheoutputdownbelowthevaluethattheoutputwouldotherwiseachieve,asshowninFigure24. V+ = +5 V OPA363 OPA364 VOUT V IN 500 µA R = 10 kΩ P OpAmp Negative -V =-5 V Supply (Additional Grounded Negative Supply) Copyright © 2017,Texas Instruments Incorporated Figure24. OPA363andOPA364SwingtoGround This technique does not work with all op amps. The output stage of the OPAx363 and OPA3x64 allows the outputvoltagetobepulledbelowthatofmostopamps,ifapproximately500 µAismaintainedthroughtheoutput stage.Tocalculatetheappropriatevalueloadresistorandnegativesupply,R =–V/500µA.TheOPAx363and L OPAx364 are characterized to perform well under the described conditions, maintaining excellent accuracy down to0Vandaslowas–10mV.Limitingandnonlinearityoccurbelow –10mV,withlinearityreturningastheoutput isagaindrivenabove–10mV. 9.1.2 DirectlyDrivingtheADS8324andtheMSP430 The OPAx363 and OPAx364 series op amps are optimized for driving medium speed (up to 100-kHz) sampling A/D converters. However, they also offer excellent performance for higher speed converters. The no-crossover input stage of the OPAx363 and OPAx364 directly drive A/D converters without degradation of differential linearity and THD. They provide an effective means of buffering the A/D converter input capacitance and resulting charge injection while providing signal gain. Figure 25 and Figure 26 show the OPAx363 and OPAx364 configuredtodrivetheADS8324andthe12-bitA/DconverterontheMSP430. 20 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 Application Information (continued) V+ = 1.8 V V+ = 1.8 V 100Ω OPA363 ADS8324 OPA364 VIN 1 nF Copyright © 2017,Texas Instruments Incorporated Figure25. OPAx363andOPAx364DirectlyDrivetheADS8324 V+ V+ 100Ω OPA363 MSP430 OPA364 VIN 1 nF Copyright © 2017,Texas Instruments Incorporated Figure26. Drivingthe12-BitA/DConverterontheMSP430 9.1.3 AudioApplications The OPAx363 and OPAx364 op amp family has linear offset voltage over the entire input common-mode range. Combined with low noise, this feature makes the OPAx363 and OPAx364 suitable for audio applications. Single- supply, 1.8-V operation allows the OPA2363 and OPA2364 to be optimal candidates for dual stereo-headphone driversandmicrophonepreamplifiersinportablestereoequipment;seeFigure27andFigure28. 20 kΩ V+ 1 µF 20 kΩ One of Right or Left Channel 20 kΩ 20 kΩ 1/2 OPA2363 V+ One of Right or Left 10 kΩ Headphone Out V- 1/2 47 pF TPS6100 Internally 10 kΩ V- Biased V- Copyright © 2017,Texas Instruments Incorporated Figure27. OPA2363ConfiguredasHalfofaDualStereo-HeadphoneDriver Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Application Information (continued) Clean 3.3-V Supply 49 kΩ 3.3 V 4 kΩ OPAx363 OPAx364 VOUT Electret 6 kΩ 5 kΩ Microphone 1 µF Copyright © 2017,Texas Instruments Incorporated Figure28. MicrophonePreamplifier 9.1.4 ActiveFiltering Low harmonic distortion and noise specifications plus high gain and slew rate make the OPAx363 and OPAx364 optimal candidates for active filtering. Figure 29 shows the OPA2363 configured as a low-distortion, third-order general immittance converter (GIC) filter. Figure 30 shows the implementation of a Sallen-Key, 3-pole, low-pass Besselfilter. 2 R R 1 3 6 VIN 3.92 kΩ 1.33 kΩ 3 OPA363 VOUT R 11 3.92 kΩ C 4 3 1000 pF R12 1/2 1 3.92 kΩ OPA2363 6 2 1/2 7 OPA2363 C13 5 1000 pF R 14 3.48 kΩ C 15 1000 pF Copyright © 2017,Texas Instruments Incorporated Figure29. OPA2363asaThird-Order,40-kHz,Low-PassGICFilter 220 pF 1.8 kΩ 19.5 kΩ 150 kΩ V =1 Vrms IN 3.3 nF 47 pF OPA363 VOUT Copyright © 2017,Texas Instruments Incorporated Figure30. OPAx363orOPAx364Configuredasa3-Pole,20-kHz,Sallen-KeyFilter 22 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 9.2 Typical Application 9.2.1 Single-SupplyElectretMicrophonePreamplifier Electret microphones are commonly used in portable electronics because of their small size, low cost, and relatively good signal-to-noise ratio (SNR). The small package size and excellent AC performance of the OPA364 make it an excellent choice for preamplifier circuits for electret microphones. The circuit shown in Figure31isasingle-supplypreamplifiercircuitforelectretmicrophones. CFB 5 V 130 pF RFB RBIAS 5.9 k(cid:13)(cid:3) 61.9 k(cid:13) CIN 5 V 0.1 (cid:29)F 1.5 (cid:29)F Electret 5 V RDIV – VS+ Microphone 100 k(cid:13) Output + OPA364 VS– RDIV CDIV 100 k(cid:13) 160 nF Copyright © 2017, Texas Instruments Incorporated Figure31. PreamplifierCircuitforElectretMicrophonesUsingaSingle-SupplyVoltage 9.2.1.1 DesignRequirements • 5-Vsinglesupply • 1-V outputfor100-dB input RMS SPL • 20-Hzto20-kHz,–3-dBbandwidth • Microphonesensitivity:8 µA/Pa • Microphoneoperatingvoltage:2Vto10V • Microphonebiascurrent:500µA 9.2.1.2 DetailedDesignProcedure In this circuit, the op amp is configured as a transimpedance amplifier which converts the signal current of the microphone into an output voltage. The gain of the circuit is determined by the feedback resistor R , which must FB be calculated according to the microphone sensitivity. For this design, a microphone output current of 8 µA per Pascal (Pa) of air pressure was chosen. Using this value, the output current for a sound pressure level of 100 dB ,or2Paairpressure,iscalculatedinEquation1. SPL 8 PA i u2 Pa = 16 PA mic 1 Pa (1) R isthencalculatedfromthiscurrenttoproduce1-V outputfora100-dB inputsignalinEquation2. FB RMS SPL V 1 V R O RMS 62500o61.9 k: FB i 16 PA mic (2) Thefeedbackcapacitor(C )iscalculatedtolimitthebandwidthoftheamplifierto20kHzinEquation3. FB C 1 1 128.5u10(cid:16)12 o130 pF FB 2(cid:152)S(cid:152)R (cid:152)f 2(cid:152)S(cid:152)(61.9 k:)(cid:152)(20 kHz) FB H (3) Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com Typical Application (continued) R is required to divert the microphone signal current through capacitor C rather than flowing from the power BIAS IN supply, V . Larger values of R allow for a smaller capacitor to be used for C and reduce the overall noise CC BIAS IN of the circuit. However, the maximum value for R is limited by the microphone bias current and minimum BIAS operatingvoltage. ThevalueofR iscalculatedinEquation4. BIAS V (cid:16)V 5 V(cid:16)2 V R CC MIC 6000o5.9 k: BIAS I 500 PA BIAS (4) Input capacitor C forms a high-pass filter in combination with resistor R . The filter corner frequency IN BIAS calculationisshowninEquation5toplacethehigh-passcornerfrequencyat20Hz. 1 1 C 1.349u10(cid:16)6 o1.5 PF IN 2(cid:152)S(cid:152)R (cid:152)f 2(cid:152)S(cid:152)(5.9 k:)(cid:152)(20 Hz) BIAS L (5) The voltage divider network at the op amp noninverting input is used to bias the op amp output to the mid-supply point (V / 2) to maximize the output voltage range of the circuit. This result is easily achieved by selecting the CC same value for both resistors in the divider. The absolute value of those resistors is limited by the acceptable power-supply current drawn by the voltage divider. Selecting 25 µA as an acceptable limit of supply current gives avalueof100kΩ fortheresistorsinthedivider,asEquation6 shows. V 5 V R CC 100 k: DIV 2(cid:152)I 2(cid:152)25 PA DIV (6) Finally, to minimize the additional noise contribution from the voltage divider, a capacitor is placed at the op amp noninverting input. This capacitor forms a low-pass filter with the parallel combination of the voltage divider resistors. Selecting a filter corner frequency of 20 Hz minimizes the noise contribution of the voltage divider insidetheamplifierpassband;seeEquation7. C 1 1 1.592u10(cid:16)7 o160 nF DIV §R • §100 k:• 2(cid:152)S(cid:152)¤ DIV ‚(cid:152)f 2(cid:152)S(cid:152)¤ ‚(cid:152)(20 Hz) ' 2 „ L ' 2 „ (7) 9.2.1.3 ApplicationCurve The transfer function of the microphone preamplifier circuit is shown in Figure 32. The nominal gain of the circuit is 95.82 dB, or 61,800 V per amp of input current. The –3-dB bandwidth limits of the circuit are 17.99 Hz and 19.23kHz. 24 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 Typical Application (continued) 98 96 94 92 A) V/90 B, d n (88 ai G 86 84 82 80 10 100 1k 10k 100k Frequency (Hz) C001 Figure32. MicrophonePreamplifierTransferFunction Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 10 Power Supply Recommendations The OPAx363 and OPAx364 are specified for operation from 2.7 V to 5.5 V (±1.35 V to ±2.75 V). Parameters that can exhibit significant variance with regard to operating voltage are presented in the Electrical Characteristics. 11 Layout 11.1 Layout Guidelines Forbestoperationalperformanceofthedevice,usegoodprinted-circuitboard(PCB)layoutpractices,including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and of op amp itself. Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analogcircuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supplyapplications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital andanaloggrounds,payingattentiontotheflowofthegroundcurrent. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If thesetracescannotbekeptseparate,crossingthesensitivetraceperpendicularismuchbetterasopposedto inparallelwiththenoisytrace. • Placetheexternalcomponentsasclosetothedeviceaspossible.AsshowninFigure33,keepingR andR F G closetotheinvertinginputminimizesparasiticcapacitance. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitivepartofthecircuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakagecurrentsfromnearbytracesthatareatdifferentpotentials. • CleaningthePCBfollowingboardassemblyisrecommendedforbestperformance. • Any precision integrated circuit can experience performance shifts resulting from moisture ingress into the plasticpackage.FollowinganyaqueousPCBcleaningprocess,bakingthePCBassemblyisrecommendedto remove moisture introduced into the device packaging during the cleaning process. A low temperature, post- cleaningbakeat85°Cfor30minutesissufficientformostcircumstances. 11.2 Layout Example GND V+ GND INPUT OUTPUT GND V- GND Figure33. OperationalAmplifierBoardLayoutforNoninvertingConfiguration 26 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 Layout Example (continued) V- C3 INPUT GND OUTPUT 4 3 U1 6 R3 2 7 C4 C2 V+ GND GND R1 C1 R2 GND Figure34. LayoutExampleSchematic Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 DevelopmentSupport 12.1.1.1 TINA-TI™(FreeSoftwareDownload) TINA™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI™ is a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a range of both passive and active models. TINA-TI provides all the conventional dc, transient, and frequency domainanalysisofSPICE,aswellasadditionaldesigncapabilities. Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select inputwaveformsandprobecircuitnodes,voltages,andwaveforms,creatingadynamicquick-starttool. NOTE These files require that either the TINA software (from DesignSoft™) or TINA-TI software beinstalled.DownloadthefreeTINA-TIsoftwarefromtheTINA-TIfolder. 12.1.1.2 DIPAdapterEVM The DIP Adapter EVM tool provides an easy, low-cost way to prototype small surface mount devices. The evaluation tool these TI packages: D or U (8-pin SOIC), PW (8-pin TSSOP), DGK (8-pin MSOP), DBV (6-pin SOT-23, 5-pin SOT-23, and 3-pin SOT-23), DCK (6-pin SC-70 and 5-pin SC-70), and DRL (6-pin SOT-563). The DIPAdapterEVMmayalsobeusedwithterminalstripsormaybewireddirectlytoexistingcircuits. 12.1.1.3 UniversalOpAmpEVM The Universal Op Amp EVM is a series of general-purpose, blank circuit boards that simplify prototyping circuits for a variety of device package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered, with each model intended for a specific package type. PDIP,SOIC,MSOP,TSSOPandSOT-23packagesareallsupported. NOTE These boards are unpopulated, so users must provide their own devices. TI recommends requestingseveralopampdevicesampleswhenorderingtheUniversalOpAmpEVM. 12.1.1.4 TIPrecisionDesigns TI Precision Designs are analog solutions created by TI’s precision analog applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits. TI Precision Designs are available online at http://www.ti.com/ww/en/analog/precision-designs/. 12.1.1.5 WEBENCH®FilterDesigner WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH Filter Designer allows the user to create optimized filter designs using a selection of TI operational amplifiers and passivecomponentsfromTI'svendorpartners. Available as a web-based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows the usertodesign,optimize,andsimulatecompletemultistageactivefiltersolutionswithinminutes. 28 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 www.ti.com SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 12.2 Documentation Support 12.2.1 RelatedDocumentation ThefollowingdocumentsarerelevanttousingtheOPAx363andOPAx364,andarerecommendedforreference. Allareavailablefordownloadatwww.ti.com (unlessotherwisenoted): • AB-045OpAmpPerformanceAnalysis • AB-067Single-SupplyOperationofOperationalAmplifiers • AB-105TuninginAmplifiers • QFN/SONPCBAttachment • QuadFlatpackNo-LeadLogicPackages 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table1.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER ORDERNOW DOCUMENTS SOFTWARE COMMUNITY OPA363 Clickhere Clickhere Clickhere Clickhere Clickhere OPA2363 Clickhere Clickhere Clickhere Clickhere Clickhere OPA364 Clickhere Clickhere Clickhere Clickhere Clickhere OPA2364 Clickhere Clickhere Clickhere Clickhere Clickhere OPA4364 Clickhere Clickhere Clickhere Clickhere Clickhere 12.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.5 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.6 Trademarks TINA-TI,E2EaretrademarksofTexasInstruments. WEBENCHisaregisteredtrademarkofTexasInstruments. TINA,DesignSoftaretrademarksofDesignSoft,Inc. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.7 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Copyright©2002–2018,TexasInstrumentsIncorporated SubmitDocumentationFeedback 29 ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

OPA363,OPA2363,OPA364,OPA2364,OPA4364 SBOS259F–SEPTEMBER2002–REVISEDJUNE2018 www.ti.com 12.8 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 30 SubmitDocumentationFeedback Copyright©2002–2018,TexasInstrumentsIncorporated ProductFolderLinks:OPA363 OPA2363 OPA364 OPA2364 OPA4364

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) OPA2363AIDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHK & no Sb/Br) OPA2363AIDGST ACTIVE VSSOP DGS 10 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHK & no Sb/Br) OPA2363AIDGSTG4 ACTIVE VSSOP DGS 10 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHK & no Sb/Br) OPA2363AIRSVR ACTIVE UQFN RSV 16 3000 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SIN & no Sb/Br) OPA2363IDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHK & no Sb/Br) OPA2363IDGST ACTIVE VSSOP DGS 10 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHK & no Sb/Br) OPA2364AID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 A OPA2364AIDG4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 A OPA2364AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364AIDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 A OPA2364AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 A OPA2364ID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) OPA2364IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364IDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS NIPDAUAG Level-2-260C-1 YEAR -40 to 125 BHL & no Sb/Br) OPA2364IDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 OPA2364IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 2364 OPA363AID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 363 A OPA363AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA363AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA363AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA363ID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 363 OPA363IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA363IDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA363IDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A40 & no Sb/Br) OPA364AID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 364 A OPA364AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) OPA364AIDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 364 A OPA364ID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 364 OPA364IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 A41 & no Sb/Br) OPA364IDG4 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 364 OPA364IDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 364 OPA4364AID ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4364A & no Sb/Br) OPA4364AIDR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4364A & no Sb/Br) OPA4364AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4364A & no Sb/Br) OPA4364AIPWR ACTIVE TSSOP PW 14 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 4364A OPA4364AIPWT ACTIVE TSSOP PW 14 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 4364A OPA4364AIPWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA & no Sb/Br) 4364A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA4364 : •Automotive: OPA4364-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 21-May-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) OPA2363AIDGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2363AIDGST VSSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2363AIRSVR UQFN RSV 16 3000 177.8 12.4 2.0 2.8 0.7 4.0 12.0 Q1 OPA2363IDGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2363IDGST VSSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2364AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2364AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2364AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2364IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2364IDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2364IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA363AIDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA363AIDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA363IDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA363IDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA364AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA364IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4364AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 21-May-2018 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) OPA4364AIPWR TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 OPA4364AIPWT TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) OPA2363AIDGSR VSSOP DGS 10 2500 367.0 367.0 35.0 OPA2363AIDGST VSSOP DGS 10 250 210.0 185.0 35.0 OPA2363AIRSVR UQFN RSV 16 3000 223.0 270.0 35.0 OPA2363IDGSR VSSOP DGS 10 2500 367.0 367.0 35.0 OPA2363IDGST VSSOP DGS 10 250 210.0 185.0 35.0 OPA2364AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2364AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0 OPA2364AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA2364IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2364IDGKT VSSOP DGK 8 250 210.0 185.0 35.0 OPA2364IDR SOIC D 8 2500 367.0 367.0 35.0 OPA363AIDBVR SOT-23 DBV 6 3000 565.0 140.0 75.0 OPA363AIDBVT SOT-23 DBV 6 250 565.0 140.0 75.0 OPA363IDBVR SOT-23 DBV 6 3000 565.0 140.0 75.0 OPA363IDBVT SOT-23 DBV 6 250 565.0 140.0 75.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 21-May-2018 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) OPA364AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA364IDR SOIC D 8 2500 367.0 367.0 35.0 OPA4364AIDR SOIC D 14 2500 367.0 367.0 38.0 OPA4364AIPWR TSSOP PW 14 2500 367.0 367.0 35.0 OPA4364AIPWT TSSOP PW 14 250 210.0 185.0 35.0 PackMaterials-Page3

PACKAGE OUTLINE RSV0016A UQFN - 0.55 mm max height SCALE 5.000 ULTRA THIN QUAD FLATPACK - NO LEAD 1.85 B A 1.75 PIN 1 INDEX AREA 2.65 2.55 0.55 C 0.45 SEATING PLANE 0.05 0.05 C 0.00 2X 1.2 SYMM (0.13) TYP 5 ℄ 8 0.45 15X 0.35 4 9 SYMM 2X 1.2 ℄ 12X 0.4 1 0.25 12 16X 0.15 0.07 C A B 0.05 16 13 0.55 0.45 PIN 1 ID (45 X 0.1) ° 4220314/C 02/2020 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT RSV0016A UQFN - 0.55 mm max height ULTRA THIN QUAD FLATPACK - NO LEAD SYMM (0.7) ℄ 16 13 SEE SOLDER MASK DETAIL 16X (0.2) 1 12 SYMM 12X (0.4) (2.4) ℄ (R0.05) TYP 4 9 15X (0.6) 5 8 (1.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 25X 0.05 MIN 0.05 MAX ALL AROUND ALL AROUND METAL UNDER METAL EDGE SOLDER MASK EXPOSED METAL SOLDER MASK EXPOSED SOLDER MASK OPENING METAL OPENING NON SOLDER MASK DEFINED SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS 4220314/C 02/2020 NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN RSV0016A UQFN - 0.55 mm max height ULTRA THIN QUAD FLATPACK - NO LEAD (0.7) 16 13 16X (0.2) 1 12 SYMM 12X (0.4) (2.4) ℄ (R0.05) TYP 4 9 15X (0.6) 5 8 SYMM ℄ (1.6) SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 25X 4220314/C 02/2020 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE DGS0010A VSSOP - 1.1 mm max height SCALE 3.200 SMALL OUTLINE PACKAGE C 5.05 4.75 TYP SEATING PLANE A PIN 1 ID 0.1 C AREA 8X 0.5 10 1 3.1 2X 2.9 NOTE 3 2 5 6 0.27 10X 0.17 B 3.1 0.1 C A B 1.1 MAX 2.9 NOTE 4 0.23 TYP SEE DETAIL A 0.13 0.25 GAGE PLANE 0.15 0.7 0 - 8 0.05 0.4 DETAIL A TYPICAL 4221984/A 05/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187, variation BA. www.ti.com

EXAMPLE BOARD LAYOUT DGS0010A VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE 10X (1.45) 10X (0.3) SYMM (R0.05) TYP 1 10 SYMM 8X (0.5) 5 6 (4.4) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221984/A 05/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DGS0010A VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE 10X (1.45) SYMM (R0.05) TYP 10X (0.3) 1 10 SYMM 8X (0.5) 5 6 (4.4) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221984/A 05/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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